CN109613099B - Sheet type oxygen sensing device, engine exhaust pipe and motor vehicle - Google Patents
Sheet type oxygen sensing device, engine exhaust pipe and motor vehicle Download PDFInfo
- Publication number
- CN109613099B CN109613099B CN201811517939.XA CN201811517939A CN109613099B CN 109613099 B CN109613099 B CN 109613099B CN 201811517939 A CN201811517939 A CN 201811517939A CN 109613099 B CN109613099 B CN 109613099B
- Authority
- CN
- China
- Prior art keywords
- oxygen
- layer
- pumping
- chip
- oxygen sensor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 title claims abstract description 307
- 239000001301 oxygen Substances 0.000 title claims abstract description 307
- 229910052760 oxygen Inorganic materials 0.000 title claims abstract description 307
- 238000005086 pumping Methods 0.000 claims abstract description 122
- 230000036961 partial effect Effects 0.000 claims abstract description 9
- 239000010410 layer Substances 0.000 claims description 192
- 239000003792 electrolyte Substances 0.000 claims description 64
- 238000010438 heat treatment Methods 0.000 claims description 52
- 230000006698 induction Effects 0.000 claims description 22
- 230000001939 inductive effect Effects 0.000 claims description 22
- 239000011241 protective layer Substances 0.000 claims description 12
- 238000009423 ventilation Methods 0.000 claims description 12
- 239000003054 catalyst Substances 0.000 claims description 10
- 230000000149 penetrating effect Effects 0.000 claims description 7
- 238000004891 communication Methods 0.000 claims description 3
- 238000005259 measurement Methods 0.000 abstract description 12
- 239000000463 material Substances 0.000 description 29
- 239000000446 fuel Substances 0.000 description 13
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 12
- 239000007789 gas Substances 0.000 description 10
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 8
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 7
- 239000000919 ceramic Substances 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 238000004080 punching Methods 0.000 description 7
- 230000000670 limiting effect Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 229910052697 platinum Inorganic materials 0.000 description 4
- 238000007650 screen-printing Methods 0.000 description 4
- 238000012937 correction Methods 0.000 description 3
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 238000005266 casting Methods 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000009776 industrial production Methods 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000000462 isostatic pressing Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002829 reductive effect Effects 0.000 description 1
- 239000007784 solid electrolyte Substances 0.000 description 1
- 238000010345 tape casting Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
- G01N27/26—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating electrochemical variables; by using electrolysis or electrophoresis
- G01N27/403—Cells and electrode assemblies
- G01N27/406—Cells and probes with solid electrolytes
- G01N27/407—Cells and probes with solid electrolytes for investigating or analysing gases
- G01N27/4071—Cells and probes with solid electrolytes for investigating or analysing gases using sensor elements of laminated structure
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
- G01N27/26—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating electrochemical variables; by using electrolysis or electrophoresis
- G01N27/403—Cells and electrode assemblies
- G01N27/406—Cells and probes with solid electrolytes
- G01N27/4067—Means for heating or controlling the temperature of the solid electrolyte
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
- G01N27/26—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating electrochemical variables; by using electrolysis or electrophoresis
- G01N27/403—Cells and electrode assemblies
- G01N27/406—Cells and probes with solid electrolytes
- G01N27/407—Cells and probes with solid electrolytes for investigating or analysing gases
- G01N27/41—Oxygen pumping cells
Landscapes
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Health & Medical Sciences (AREA)
- Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Molecular Biology (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Measuring Oxygen Concentration In Cells (AREA)
Abstract
The invention provides a chip oxygen sensing device, an engine exhaust pipe and a motor vehicle. The sheet type oxygen sensor includes: a chip oxygen sensor; and the oxygen pumping component is electrically connected with a heater lead in the sheet oxygen sensor, the partial pressure on the heater lead is used for applying oxygen pumping current to the oxygen pumping component, and the oxygen pumping component is used for conveying fresh oxygen into a reference airway of the sheet oxygen sensor. The sheet type oxygen sensing device has the advantages of simple structure, low cost and low requirement on tightness, and can ensure that oxygen in a reference air passage is fresh without additionally configuring an additional circuit auxiliary element, thereby realizing more accurate measurement of the concentration of the oxygen.
Description
Technical Field
The invention relates to the technical field of sensors for vehicles, in particular to a chip oxygen sensing device, an engine exhaust pipe and a motor vehicle.
Background
The chip oxygen sensor is a sensing part near the three-way catalyst applied to the exhaust pipe of engine, it uses the solid electrolyte element of electrochemical principle to convert the oxygen concentration in the tail gas of motor vehicle into electric signal and inputs it into the control unit (ECU), the engine can reach ideal air-fuel ratio by controlling the correction compensation of closed-loop fuel injection, and it can improve the emission of motor vehicle and fuel economy. The working principle of the chip oxygen sensing device is that a working electrode is contacted with tail gas in a tail gas side by utilizing a Nernst equation, a reference electrode is contacted with reference gas in a reference side, and potential difference is generated on two sides of an electrolyte layer due to oxygen concentration difference under high temperature. Thus, the freshness of the oxygen concentration in the reference gas plays a decisive role in the operation of the oxygen sensor. However, the current chip oxygen sensor has low fresh efficiency of realizing the oxygen concentration in the reference gas, complex structure and high cost, and can also cause the deterioration of the mechanical strength of the chip oxygen sensor.
Thus, the related art of the existing chip oxygen sensor device has yet to be improved.
Disclosure of Invention
The present invention aims to solve at least one of the technical problems in the related art to some extent. Therefore, an object of the present invention is to provide a sheet oxygen sensor device that has a simple structure, low cost, low sealing requirements, and can make oxygen in a reference airway fresh or can better realize accurate measurement of oxygen concentration without additional circuit auxiliary elements.
In one aspect of the invention, a chip oxygen sensing device is provided. According to an embodiment of the present invention, the sheet type oxygen sensing device includes: a chip oxygen sensor; and the oxygen pumping component is electrically connected with a heater lead in the sheet oxygen sensor, the partial pressure on the heater lead is used for applying oxygen pumping current to the oxygen pumping component, and the oxygen pumping component is used for conveying fresh oxygen into a reference airway of the sheet oxygen sensor. The inventor finds that the sheet type oxygen sensing device has simple structure and low cost, has low requirement on tightness, can ensure that the oxygen in the reference airway is fresh without additionally configuring an additional circuit auxiliary element, and further realizes more accurate measurement of the concentration of the oxygen.
According to an embodiment of the invention, the oxygen pumping assembly comprises: an oxygen pumping electrolyte layer disposed on a lower surface of the sheet oxygen sensor; an oxygen pumping internal electrode disposed on an upper surface of the oxygen pumping electrolyte layer; and a pumping oxygen external electrode disposed on a lower surface of the pumping oxygen electrolyte layer.
According to an embodiment of the invention, the oxygen pumping assembly further comprises: the first ventilation protective layer is arranged on the lower surface of the oxygen pumping external electrode; and the first insulating layer is arranged on the lower surface of the oxygen pumping electrolyte layer, which is not covered by the first ventilation protective layer, and covers an oxygen pumping external electrode lead electrically connected with the oxygen pumping external electrode.
According to the embodiment of the invention, the chip oxygen sensor comprises an inductive electrolyte layer, at least one air passage layer and a heating layer which are arranged in a stacked manner from top to bottom, wherein the upper surface and the lower surface of the inductive electrolyte layer are respectively provided with an inductive outer electrode and an inductive inner electrode, the air passage layer is provided with a reference air passage, the upper surface of the heating layer is provided with a heater and a heater lead, the heater lead is electrically connected with the heater and extends along the length direction of the heating layer, the heating layer is further provided with a first through hole, and the oxygen pumping assembly is used for conveying fresh oxygen into the reference air passage through the first through hole.
According to an embodiment of the present invention, there is a gap between the orthographic projection of the first through hole on the heating layer and the orthographic projection of the heater lead on the heating layer in the length direction of the heating layer.
According to an embodiment of the invention, there is a gap between the orthographic projection of the reference air channel in the air channel layer adjacent to the heating layer on the heating layer and the orthographic projection of the heater lead on the heating layer in the length direction of the heating layer.
According to the embodiment of the invention, the sensing electrolyte layer is provided with the air passage opening, and the reference air passage in the air passage layer at the uppermost layer is communicated with the air passage opening.
According to the embodiment of the invention, the number of the heaters is a plurality, and the plurality of the heaters are symmetrically distributed on two sides of the reference air passage in the width direction of the heating layer.
According to an embodiment of the present invention, the chip oxygen sensor further includes: the second breathable protective layer is arranged on the upper surface of the induction outer electrode; and the second insulating layer is arranged on the upper surface of the induction electrolyte layer, which is not covered by the second ventilation protective layer, and covers an induction outer electrode lead electrically connected with the induction outer electrode.
According to an embodiment of the present invention, further comprising: the second through hole penetrates through the heating layer and the oxygen pumping electrolyte layer and is used for leading out an oxygen pumping external electrode lead; the third through hole penetrates through the oxygen pumping electrolyte layer and the first insulating layer and is used for leading out an oxygen pumping inner electrode lead; a fourth through hole penetrating the heating layer, the pumped oxygen electrolyte layer and the first insulating layer for leading out the heater lead; a fifth through hole penetrating the second insulating layer for leading out an induction external electrode lead; and the sixth through hole penetrates through the second insulating layer and the inductive electrolyte layer and is used for leading out an inductive inner electrode lead.
In another aspect of the invention, an engine exhaust pipe is provided. According to an embodiment of the present invention, at least one of the foregoing sheet type oxygen sensing devices is provided near the three-way catalyst of the engine exhaust pipe. The inventor finds that the concentration of oxygen in the exhaust gas exhausted by the engine exhaust pipe can be accurately measured, so that a user can control correction and compensation of closed-loop fuel injection to enable the engine to reach a more ideal air-fuel ratio, and further improve the emission of a motor vehicle and the fuel economy.
In yet another aspect of the invention, the invention provides a motor vehicle. According to an embodiment of the invention, the motor vehicle comprises an engine exhaust pipe as described above. The inventor finds that the engine of the motor vehicle can achieve a more ideal air-fuel ratio, thereby improving the fuel economy of the motor vehicle.
Drawings
Fig. 1 is a schematic cross-sectional view showing a chip oxygen sensor device according to an embodiment of the present invention.
Fig. 2a is a schematic circuit diagram showing the operation principle of the oxygen pumping assembly in the chip oxygen sensor device of the present invention.
Fig. 2b is a schematic circuit diagram showing the operation principle of the chip oxygen sensor in the chip oxygen sensor device of the present invention.
Fig. 3 is a schematic cross-sectional view showing a chip oxygen sensor device according to another embodiment of the present invention.
Fig. 4 is a schematic cross-sectional view showing a chip oxygen sensor device according to still another embodiment of the present invention.
Fig. 5 is a schematic cross-sectional view showing a chip oxygen sensor device according to still another embodiment of the present invention.
Fig. 6 is a schematic cross-sectional view showing a chip oxygen sensor device according to still another embodiment of the present invention.
Fig. 7 is a schematic cross-sectional view showing a chip oxygen sensor device according to still another embodiment of the present invention.
Fig. 8 is a schematic exploded view showing the structure of a chip oxygen sensor device according to an embodiment of the present invention.
FIG. 9 is a schematic cross-sectional view of a chip oxygen sensor device according to the embodiment of FIG. 8, taken along line A-A.
Reference numerals:
10: sheet type oxygen sensor device 100: sheet oxygen sensor 110: inductive electrolyte layer 111: air port 120: inductive inner electrode 121: inductive inner electrode lead 130: an induction outer electrode 131: induction outer electrode leads 140, 140a, 140b: airway layers 141, 141a, 141b: reference airway 150: heating layers 151, 151a, 151b, 151c, 151d: heaters 152, 152a, 152b: heater lead 153: first through hole 160: a second breathable protective layer 170: second insulating layer 200: oxygen pumping assembly 210: oxygen pumping electrolyte layer 220: pump oxygen inner electrode 221: oxygen pumping internal electrode lead 230: pump oxygen external electrode 231: pump oxygen outer electrode lead 240: first breathable protective layer 250: first insulating layer 300: second through hole 400: third through hole 500: fourth through hole 600: fifth through hole 700: sixth through hole
Detailed Description
Embodiments of the present invention are described in detail below. The following examples are illustrative only and are not to be construed as limiting the invention. The examples are not to be construed as limiting the specific techniques or conditions described in the literature in this field or as per the specifications of the product. The reagents or apparatus used were conventional products commercially available without the manufacturer's attention.
In one aspect of the invention, a chip oxygen sensing device is provided. Referring to fig. 1, according to an embodiment of the present invention, the chip oxygen sensing device 10 includes: a sheet-type oxygen sensor 100; the oxygen pumping assembly 200 is electrically connected to the heater lead of the sheet oxygen sensor 100 (it should be noted that the heater lead is not shown in fig. 1; in addition, the straight line between the sheet oxygen sensor 100 and the oxygen pumping assembly 200 in fig. 1 indicates the electrical connection, only fig. 1 indicates the electrical connection, and other figures only indicate the positional relationship between the structures and components of the sheet oxygen sensor device 10, and the electrical connection is not shown), and the partial pressure on the heater lead is used to supply oxygen current to the oxygen pumping assembly 200 Shi Jiabeng. The oxygen pumping assembly 200 is used to supply fresh oxygen to the reference airway (the reference airway is not shown in fig. 1) of the sheet oxygen sensor 100. The inventor finds that the sheet type oxygen sensing device 10 has simple structure and low cost, has low requirement on tightness, can enable oxygen in a reference air passage to be fresh without additionally configuring an additional circuit auxiliary element, and further realizes more accurate measurement of the concentration of oxygen.
According to an embodiment of the present invention, referring to fig. 2a, in the chip oxygen sensor device, the pumping component is electrically connected to the heater lead in the chip oxygen sensor, so that when the chip oxygen sensor is in operation, the control unit applies a partial voltage to the resistor of the heater U in the chip oxygen sensor (the partial voltage of the resistor acting on the heater is denoted as U 1), and since the pumping component is electrically connected to the heater lead, another partial voltage (denoted as U 2, it should be noted that here U 2＝U-U1, it will be understood by those skilled in the art that the relationship between U 1 and U 2 can be determined according to the relationship between the resistor R 1 of the heater and the resistor R 2 of the pumping component and the heater lead) is applied to the pumping component and the heater lead, so that the pumping component operates normally, and fresh oxygen is delivered to the reference airway of the chip oxygen sensor, so that the additional configuration of the pumping component is not required, the additional configuration of the sensing device is easy to implement, the measurement of the oxygen is easy, the implementation of the additional oxygen is easy, the implementation of the measurement of the additional oxygen is easy, the implementation of the higher quality of the oxygen is required, the implementation of the higher quality of the sealing structure, and the implementation of the sealing of the oxygen is less.
In some embodiments of the present invention, referring to fig. 2a and 8, in the chip oxygen sensing device 10, the pumping assembly is electrically connected to the heater lead 152b in the chip oxygen sensor, so that a portion of the voltage U applied by the control unit to the heater 151 in the chip oxygen sensor 10 is divided by the resistance of the heater 151 when the chip oxygen sensor 10 is in operation, and another portion of the voltage U 2 is applied to the pumping assembly and the heater lead since the pumping assembly is electrically connected to the heater lead 152 b. The partial pressure applied to the pumping oxygen component and the partial pressure applied to the heater lead are determined according to the resistances of the pumping oxygen component and the heater lead, specifically, when the chip oxygen sensing device 10 is used, the current of several microamps to tens of microamps in the pumping oxygen component can pass through by adjusting the resistance, so that the pumping oxygen component can work normally, fresh oxygen is conveyed into a reference air channel of the chip oxygen sensor, and the chip oxygen sensing device can make the oxygen in the reference air channel fresh without additionally configuring an additional circuit auxiliary element, thereby realizing more accurate oxygen concentration measurement.
Referring to fig. 2b, in the chip oxygen sensor device 10, the relationship between the resistor R 0 and the voltage U 0 of the chip oxygen sensor 100 is the relationship between the resistor and the voltage in the conventional chip oxygen sensor, and will not be described herein.
According to an embodiment of the invention, referring to fig. 3, the oxygen pumping assembly may include: an oxygen pumping electrolyte layer 210, the oxygen pumping electrolyte layer 210 being disposed on a lower surface of the sheet type oxygen sensor 100; an oxygen pumping electrode 220, the oxygen pumping electrode 220 being disposed on an upper surface of the oxygen pumping electrolyte layer 210; and a pumping oxygen external electrode 230, the pumping oxygen external electrode 230 being disposed on a lower surface of the pumping oxygen electrolyte layer 210. Therefore, the sheet type oxygen sensing device 10 has a simple structure and low cost, has low requirements on tightness, can enable oxygen in a reference air passage to be fresh without additionally configuring an additional circuit auxiliary element, and further achieves accurate oxygen concentration measurement.
According to the embodiment of the present invention, the materials forming the oxygen pumping electrolyte layer 210, the oxygen pumping internal electrode 220 and the oxygen pumping external electrode 230, and the thicknesses of the oxygen pumping electrolyte layer 210, the oxygen pumping internal electrode 220 and the oxygen pumping external electrode 230, etc. in the oxygen pumping assembly are all materials and thicknesses of a conventional oxygen pumping assembly, for example, the materials forming the oxygen pumping internal electrode 220 and the oxygen pumping external electrode 230 may be platinum, etc., the materials forming the oxygen pumping electrolyte layer 210 may be zirconia electrolyte, etc., and the thicknesses of the oxygen pumping electrolyte layer 210, the oxygen pumping internal electrode 220 and the oxygen pumping external electrode 230 may be flexibly selected according to actual needs by those skilled in the art, and will not be repeated herein.
According to an embodiment of the present invention, referring to fig. 4, the oxygen pumping assembly may further include: a first gas-permeable protection layer 240, the first gas-permeable protection layer 240 being disposed on a lower surface of the oxygen pumping electrode 230; and a first insulating layer 250 provided on a lower surface of the pumping oxygen electrolyte layer 210 not covered by the first gas-permeable protection layer 240 and covering pumping oxygen external electrode leads (pumping oxygen external electrode leads are not shown in fig. 4) electrically connected to the pumping oxygen external electrode 230. Therefore, the first ventilation protection layer 240 can play a good role in protecting the oxygen pumping external electrode 230, and since the first ventilation protection layer 240 is gas-permeable, the oxygen pumping external electrode 230 is well protected, and meanwhile, the normal operation of the oxygen pumping assembly is not influenced; the first insulating layer 250 can play a good role in protecting the pumping oxygen electrolyte layer 210 and the pumping oxygen external electrode lead wire electrically connected with the pumping oxygen external electrode 230, and the first ventilation protective layer 240 and the first insulating layer 250 play a good role in protecting the pumping oxygen component together, so that the normal operation of the pumping oxygen component cannot be influenced, and the pumping oxygen component has a simple structure and low cost, so that the sheet type oxygen sensing device can enable oxygen in a reference airway to be fresh without additionally configuring an additional circuit auxiliary element, and further accurate measurement of the concentration of oxygen is realized.
According to an embodiment of the present invention, the material forming the first gas-permeable protection layer 240 may be any material that can allow gas to pass through and also protect the oxygen pumping external electrode 230, for example, the material forming the first gas-permeable protection layer may be porous alumina; the material forming the first insulating layer 250 may be aluminum oxide or the like. Therefore, the material sources are wide and easy to obtain, and the cost is low, so that the insulating performance of the sheet oxygen sensing device 10 is good.
According to an embodiment of the present invention, referring to fig. 5, the sheet type oxygen sensor 10 includes an inductive electrolyte layer 110, at least one air passage layer 140 and a heating layer 150 which are stacked from top to bottom, the inductive electrolyte layer 110 is provided with an inductive external electrode 130 and an inductive internal electrode 120 on the upper and lower surfaces thereof, the air passage layer 140 is provided with a reference air passage 141, the heating layer 150 is provided with a heater 151 and a heater lead 152 on the upper surface thereof, the heater lead 152 is electrically connected with the heater 151 and extends along the length direction of the heating layer 150, the heating layer 150 is further provided with a first through hole 153, and the oxygen pumping assembly delivers fresh oxygen into the reference air passage 141 through the first through hole 153. Therefore, the structure of the sheet oxygen sensor 10 is simpler and the cost is lower, the first through hole 153 is formed in the heating layer 150, and the oxygen pumping component delivers fresh oxygen to the reference air passage 141, so that the oxygen in the reference air passage 141 is fresh, and the sheet oxygen sensor 10 can accurately measure the concentration of oxygen.
According to the embodiment of the present invention, the materials forming the sensing electrolyte layer 110, the sensing inner electrode 120 and the sensing outer electrode 130, and the thicknesses of the sensing electrolyte layer 110, the sensing inner electrode 120 and the sensing outer electrode 130 in the sheet oxygen sensor are all materials and thicknesses of a conventional sheet oxygen sensor, for example, the materials forming the sensing inner electrode 120 and the sensing outer electrode 130 may be platinum, the materials forming the sensing electrolyte layer 110 may be zirconia electrolyte, and the thicknesses of the sensing electrolyte layer 110, the sensing inner electrode 120 and the sensing outer electrode 130 may be flexibly selected according to practical needs by those skilled in the art, and will not be described herein.
According to an embodiment of the present invention, the material forming the air passage layer 140 and the heating layer may be alumina ceramic. Therefore, the sheet oxygen sensing device 10 has high hardness, good mechanical property, excellent insulating property, wide and easily available material sources and low cost.
The number of the air passage layers may be plural according to the embodiment of the present invention, and the case where the sheet type oxygen sensor device 10 has two air passage layers 140a and 140b will be described with reference to fig. 6. The chip oxygen sensor device 10 shown in fig. 6 has two air channel layers 140a, 140b, and corresponding reference air channels 141a, 141b are provided on the two air channel layers 140a, 140b, respectively. In some embodiments of the present invention, there is a gap between the front projection of the first via 153 on the heating layer 150 and the front projection of the heater lead 152 on the heating layer 150 in the length direction of the heating layer 150. In other embodiments of the present invention, there is a gap between the orthographic projection of the reference air channel 141a on the heating layer 150 and the orthographic projection of the heater lead 152 on the heating layer 150 in the length direction of the heating layer 150 in the air channel layer 140a adjacent to the heating layer 150. Thereby, the heater lead 152 can be prevented from blocking the first through hole 153 or the reference air passage, and the chip oxygen sensor device 10 has good usability, long life and good reliability.
According to an embodiment of the present invention, referring to fig. 6, the sensing electrolyte layer 110 is provided with an air passage opening 111, and a reference air passage 141b in the uppermost air passage layer 140b communicates with the air passage opening 111. Therefore, compared with the related art, the air passage opening is arranged at the side edge of the reference air passage of the chip oxygen sensor device, the air passage opening 110 is arranged on the sensing electrolyte layer 110, the distance that the external air reaches the air passage of the chip oxygen sensor 10 is shorter, the air exchange rate in the chip oxygen sensor device 10 is faster, and the performance of the chip oxygen sensor 10 is better.
Referring to fig. 7, according to an embodiment of the present invention, the chip oxygen sensor 100 further includes: a second air-permeable protection layer 160, the second air-permeable protection layer 160 being disposed on an upper surface of the induction external electrode 130; a second insulating layer 170, the second insulating layer 170 being disposed on an upper surface of the sensing electrolyte layer 110, which is not covered by the second gas-permeable protection layer 160, and covering sensing external electrode leads (the sensing external electrode leads are not shown in fig. 7) electrically connected to the sensing external electrode 130. Therefore, the second air-permeable protection layer 160 can well protect the induction outer electrode 130, and since the second air-permeable protection layer 160 is air-permeable, the second air-permeable protection layer can well protect the induction outer electrode 130 and can not influence the normal operation of the chip oxygen sensor 100; the second insulating layer 170 can play a good role in protecting the sensing electrolyte layer 110 and the sensing external electrode lead wire electrically connected with the sensing external electrode 130, and the second ventilation protective layer 160 and the second insulating layer 170 play a good role in protecting the chip oxygen sensor 100 together, so that the normal operation of the chip oxygen sensor 100 is not affected, the service life of the chip oxygen sensor device is long, and the accurate measurement of the oxygen concentration is further realized.
According to an embodiment of the present invention, the material forming the second gas-permeable protection layer 160 may be any material that can allow gas to pass through and also protect the induction external electrode 130, for example, the material forming the second gas-permeable protection layer 160 may be porous alumina; the material forming the second insulating layer 170 may be aluminum oxide or the like. Therefore, the material sources are wide and easy to obtain, and the cost is low, so that the insulating performance of the sheet oxygen sensing device 10 is good.
According to an embodiment of the present invention, referring to fig. 9, the number of the heaters 151 is plural, and the plurality of heaters 151a, 151b, 151c, 151d are symmetrically distributed at both sides of the reference air paths 141a, 141b in the width direction of the heating layer 150. Therefore, the chip oxygen sensing device 10 is of a symmetrical structure, the sintering stress is reduced, the bending degree and the mechanical property are obviously improved, and the chip oxygen sensing device 10 can meet the severe working condition of a gasoline engine and well overcome the adverse effects of strong vibration on the chip oxygen sensing device 10 and the accuracy of oxygen measurement.
According to an embodiment of the present invention, the chip oxygen sensor device 10 further includes: the second through hole penetrates through the heating layer and the pumped oxygen electrolyte layer and is used for leading out the pumped oxygen external electrode lead; the third through hole penetrates through the oxygen pumping electrolyte layer and the first insulating layer and is used for leading out an oxygen pumping inner electrode lead; a fourth through hole penetrating the heating layer, the pumped oxygen electrolyte layer and the first insulating layer for leading out the heater lead; a fifth through hole penetrating the second insulating layer for leading out the induction external electrode lead; and the sixth through hole penetrates through the second insulating layer and the inductive electrolyte layer and is used for leading out an inductive inner electrode lead. Therefore, a loop can be formed between each structure and component in the oxygen pumping assembly 200 in the chip oxygen sensor device 10, and a current loop can also be formed in the chip oxygen sensor 100, so that fresh oxygen is conveyed into the reference air passage in the chip oxygen sensor 100, the oxygen in the reference air passage can be fresh without additionally configuring additional circuit auxiliary elements, and the oxygen concentration can be accurately measured. In the embodiment of the present invention, how the second through hole, the third through hole, the fourth through hole, the fifth through hole and the sixth through hole in the sheet oxygen sensor device 10 form a current loop in the sheet oxygen sensor 100 and the oxygen pumping assembly 200 will be described in detail with reference to one embodiment of the present invention and fig. 8 and 9.
In a specific embodiment of the present invention, referring to fig. 8 and 9, the sheet type oxygen sensor device 10 includes a sheet type oxygen sensor and an oxygen pumping assembly from top to bottom, in which the materials forming the sensing electrolyte layer 110 and the oxygen pumping electrolyte layer 210 are zirconia materials, the materials forming the oxygen pumping external electrode 230, the oxygen pumping external electrode lead 231, the oxygen pumping internal electrode 220, the oxygen pumping internal electrode lead 221, the heater 151, the heater leads 152a, 152b, the sensing internal electrode 120, the sensing internal electrode lead 121, the sensing external electrode 130, and the sensing external electrode lead 131 are platinum, and the materials forming other structures may be alumina materials. In addition, a second gas-permeable protection layer 160 and a first gas-permeable protection layer 240 are respectively provided on the outer surfaces of the induction outer electrode 130 and the oxygen pumping outer electrode 230. Reference airways 141a and 141b are provided on the airway layers 140a and 140b, respectively. The heating layer 150 is provided with a first through hole 153, and the first through hole 153 and the orthographic projection of the heater 151 on the heating layer 150 are not overlapped. The sensing electrolyte layer 110 is provided with an air passage opening 110, and a reference air passage 141b in the air passage layer 140b at the uppermost layer is communicated with the air passage opening 110, so that the communication between the outside and the reference air passage is realized. A second through hole 300 penetrates through the heating layer 150 and the pumping oxygen electrolyte layer 210, and is used for leading out a lead of the pumping oxygen external electrode 230; a third through hole 400 penetrates the pumping oxygen electrolyte layer 210 and the first insulating layer 250, and is used for leading out the pumping oxygen internal electrode lead 221; a fourth through hole 500 penetrating the heating layer 150, the oxygen pumping electrolyte layer 210 and the first insulating layer 250 for drawing out the heater lead 152b; a fifth through hole 600 penetrates the second insulating layer 170 for leading out the induction external electrode lead 131; the sixth through hole 700 penetrates through the second insulating layer 170 and the sensing electrolyte layer 110, and is used for leading out the sensing inner electrode lead 121, so that a loop can be formed between each structure and each component in the oxygen pumping assembly 200 in the chip oxygen sensor device 10, and a current loop can also be formed in the chip oxygen sensor 100, thereby realizing fresh oxygen transportation in the reference air channel in the chip oxygen sensor 100, and further realizing that the oxygen in the reference air channel is fresh without additional configuration of additional circuit auxiliary elements, and further realizing accurate oxygen concentration measurement.
According to an embodiment of the present invention, the method for manufacturing a chip oxygen sensor device according to the present invention may include: casting, punching, silk screen printing, stamping and laminating. Therefore, the method is simple and convenient to operate, easy to realize and easy for industrial production.
According to the embodiment of the invention, the purpose of casting is to manufacture zirconia ceramic green ceramic chips and alumina ceramic green ceramic chips as materials of structures and components in the chip oxygen sensor device, specifically, the zirconia ceramic green ceramic chips and the alumina ceramic green ceramic chips can be manufactured by adopting a film tape casting forming technology, and the thickness range can be 0.1 mm-0.25 mm. In some embodiments of the present invention, the thickness of the zirconia ceramic green tile, the alumina ceramic green tile, as a material of the structure and components in the chip oxygen sensor device may be 0.1mm, 0.15mm, 0.2mm, 0.25mm, etc. Therefore, the manufactured chip oxygen sensor device has proper thickness and simple structure, is particularly suitable for being assembled near a three-way catalyst of an engine exhaust pipe, and is convenient for accurately measuring the concentration of oxygen.
According to an embodiment of the present invention, the purpose of the punching is to form the second, third, fourth, fifth and sixth through holes above the inductive electrolyte layer, the first insulating layer, the second insulating layer, the heating layer and the oxygen pumping electrolyte layer, and in some embodiments of the present invention, the first through hole may also be formed by punching, specifically, the punching may be performed by mechanical punching. In some embodiments of the present invention, to ensure the communication of the leads, each through hole may be 1 to 4 circular small holes having a diameter of 0.15 to 0.3 mm. Specifically, the number of each through hole may be 2, and the diameter may be 0.15mm, 0.2mm, 0.25mm, 0.3mm, or the like. Therefore, the method is simple and convenient to operate, easy to realize and easy for industrial production.
According to an embodiment of the present invention, the silk screen printing is to use a silk screen printing technology to print platinum paste on the sheet type oxygen sensing device 10. For example, the induction external electrode 130 and the induction internal electrode 120 may be screen-printed on the upper and lower surfaces of the induction electrolyte layer 110, the heater 151 and the heater lead 152 may be screen-printed on the upper and lower surfaces of the heating layer 150, and the pump oxygen internal electrode 220 and the pump oxygen external electrode 230 may be screen-printed on the upper and lower surfaces of the pump oxygen electrolyte layer 210, respectively, for example, referring to fig. 8, the pump oxygen internal electrode 220 and the pump oxygen external electrode 230 may be in contact with both ends of the pump oxygen external electrode lead 231 and the heater lead 152b via the pump oxygen internal electrode lead 221, respectively. In addition, hole filling can be realized by silk screen printing at the position of each through hole. Thus, a current loop can be formed in the chip oxygen sensor device 10, and the operation is simple and convenient, and easy to realize.
According to the embodiment of the present invention, the punching sheet is manufactured by punching or cutting square holes on the first insulating layer 250 and the second insulating layer 170, so as to inlay the first ventilation protection layer 240 and the second ventilation protection layer 160 for subsequent manufacturing. In addition, the reference air passage may be punched in the air passage layer, or the first through hole may be punched in the heating layer 150.
According to the embodiment of the invention, the laminated layers are formed by sequentially laminating the structures and the components for manufacturing the chip oxygen sensing device 10, and the chip oxygen sensing device 10 is manufactured through isostatic pressing, cutting, glue discharging and sintering processes. The process conditions, parameters and the like of the above steps are conventional process conditions and parameters, and are not repeated here.
In another aspect of the invention, an engine exhaust pipe is provided. According to an embodiment of the present invention, at least one of the foregoing sheet type oxygen sensing devices is provided near the three-way catalyst of the engine exhaust pipe. The inventor finds that the concentration of oxygen in the exhaust gas exhausted by the engine exhaust pipe can be accurately measured, so that a user can control correction and compensation of closed-loop fuel injection to enable the engine to reach a more ideal air-fuel ratio, and further improve the emission of a motor vehicle and the fuel economy.
According to the embodiment of the invention, the structure, the components, the connection relation among the structures and the components, the arrangement positions, the number, the distribution and the like of the three-way catalyst on the engine exhaust pipe are all the arrangement of the conventional three-way catalyst in the related art, and can be flexibly selected according to actual needs by a person skilled in the art, so that redundant description is omitted.
According to the embodiment of the invention, the sheet type oxygen sensor is not particularly limited as long as the sheet type oxygen sensor is positioned near the three-way catalyst of the engine exhaust pipe, and the specific number and distribution of the sheet type oxygen sensor are not particularly limited, and a person skilled in the art can flexibly select the sheet type oxygen sensor according to actual needs.
According to the embodiment of the invention, it can be understood by those skilled in the art that the engine exhaust pipe may include other structures and components of a conventional engine exhaust pipe besides the three-way catalyst and the sheet oxygen sensing device disposed near the three-way catalyst, which are not described herein again.
According to the embodiment of the invention, the chip oxygen sensing device is electrically connected with an external circuit through an electrode pin. Therefore, the chip oxygen sensing device is electrified through the external circuit, so that the chip oxygen sensing device can work normally.
In yet another aspect of the invention, the invention provides a motor vehicle. According to an embodiment of the invention, the motor vehicle comprises an engine exhaust pipe as described above. The inventor finds that the engine of the motor vehicle can achieve a more ideal air-fuel ratio, thereby improving the fuel economy of the motor vehicle.
It will be appreciated by those skilled in the art that, in addition to the engine exhaust pipe described above, other structures and components of a conventional motor vehicle may be included in the motor vehicle according to the embodiments of the present invention, and will not be described herein.
In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the device or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present invention.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present invention, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.
In the present invention, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art according to the specific circumstances.
In the present invention, unless expressly stated or limited otherwise, a first feature "up" or "down" a second feature may be the first and second features in direct contact, or the first and second features in indirect contact via an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.
In the description of the present specification, a description referring to terms "one embodiment," "some embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present invention. In this specification, schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, the different embodiments or examples described in this specification and the features of the different embodiments or examples may be combined and combined by those skilled in the art without contradiction.
While embodiments of the present invention have been shown and described above, it will be understood that the above embodiments are illustrative and not to be construed as limiting the invention, and that variations, modifications, alternatives and variations may be made to the above embodiments by one of ordinary skill in the art within the scope of the invention.
Claims (9)
1. A sheet oxygen sensing device, comprising:
A chip oxygen sensor;
the oxygen pumping component is electrically connected with a heater lead in the chip oxygen sensor, the partial pressure on the heater lead is used for applying oxygen pumping current to the oxygen pumping component, and the oxygen pumping component is used for delivering fresh oxygen into a reference airway of the chip oxygen sensor;
The sheet type oxygen sensor comprises an inductive electrolyte layer, at least one air passage layer and a heating layer which are arranged from top to bottom in a stacking way,
The upper and lower surfaces of the inductive electrolyte layer are respectively provided with an inductive outer electrode and an inductive inner electrode,
The airway layer is provided with a reference airway,
A heater and a heater lead are arranged on the upper surface of the heating layer, the heater lead is electrically connected with the heater and extends along the length direction of the heating layer,
The heating layer is also provided with a first through hole, and the oxygen pumping component conveys fresh oxygen into the reference air passage through the first through hole;
In the length direction of the heating layer, a gap exists between the orthographic projection of the first through hole on the heating layer and the orthographic projection of the heater lead on the heating layer;
the number of the heaters is multiple, and in the width direction of the heating layer, the heaters are symmetrically distributed on two sides of the reference air passage.
2. The chip oxygen sensing device of claim 1, wherein the oxygen pumping assembly comprises:
an oxygen pumping electrolyte layer disposed on a lower surface of the sheet oxygen sensor;
An oxygen pumping internal electrode disposed on an upper surface of the oxygen pumping electrolyte layer;
and a pumping oxygen external electrode disposed on a lower surface of the pumping oxygen electrolyte layer.
3. The chip oxygen sensing device of claim 2, wherein the oxygen pumping assembly further comprises:
The first ventilation protective layer is arranged on the lower surface of the oxygen pumping external electrode;
and the first insulating layer is arranged on the lower surface of the oxygen pumping electrolyte layer, which is not covered by the first ventilation protective layer, and covers an oxygen pumping external electrode lead electrically connected with the oxygen pumping external electrode.
4. A chip oxygen sensor apparatus according to claim 3, wherein there is a gap between the orthographic projection of the reference air passage in the air passage layer adjacent to the heating layer on the heating layer and the orthographic projection of the heater lead on the heating layer in the length direction of the heating layer.
5. The chip oxygen sensor of claim 4, wherein the sensing electrolyte layer is provided with an air passage port, and a reference air passage in the uppermost air passage layer is in communication with the air passage port.
6. The chip oxygen sensor device according to claim 3, wherein the chip oxygen sensor further comprises:
the second breathable protective layer is arranged on the upper surface of the induction outer electrode;
And the second insulating layer is arranged on the upper surface of the induction electrolyte layer, which is not covered by the second ventilation protective layer, and covers an induction outer electrode lead electrically connected with the induction outer electrode.
7. The chip oxygen sensor apparatus according to claim 6, further comprising:
the second through hole penetrates through the heating layer and the pumped oxygen electrolyte layer and is used for leading out the pumped oxygen external electrode lead;
The third through hole penetrates through the oxygen pumping electrolyte layer and the first insulating layer and is used for leading out an oxygen pumping inner electrode lead;
A fourth through hole penetrating the heating layer, the pumped oxygen electrolyte layer and the first insulating layer for leading out the heater lead;
a fifth through hole penetrating the second insulating layer for leading out the induction external electrode lead;
and the sixth through hole penetrates through the second insulating layer and the inductive electrolyte layer and is used for leading out an inductive inner electrode lead.
8. An engine exhaust pipe, characterized in that at least one sheet type oxygen sensing device according to any one of claims 1 to 7 is provided in the vicinity of a three-way catalyst of the engine exhaust pipe.
9. A motor vehicle comprising the engine exhaust pipe of claim 8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811517939.XA CN109613099B (en) | 2018-12-12 | 2018-12-12 | Sheet type oxygen sensing device, engine exhaust pipe and motor vehicle |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811517939.XA CN109613099B (en) | 2018-12-12 | 2018-12-12 | Sheet type oxygen sensing device, engine exhaust pipe and motor vehicle |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109613099A CN109613099A (en) | 2019-04-12 |
| CN109613099B true CN109613099B (en) | 2024-07-23 |
Family
ID=66008166
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811517939.XA Active CN109613099B (en) | 2018-12-12 | 2018-12-12 | Sheet type oxygen sensing device, engine exhaust pipe and motor vehicle |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109613099B (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001029546A2 (en) * | 1999-10-20 | 2001-04-26 | Delphi Technologies, Inc. | Method and device for pumping oxygen into a gas sensor |
| CN209745869U (en) * | 2018-12-12 | 2019-12-06 | 厦门海赛米克新材料科技有限公司 | sheet type oxygen sensing device, engine exhaust pipe and motor vehicle |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3583301B2 (en) * | 1998-10-13 | 2004-11-04 | 日本特殊陶業株式会社 | Gas sensor |
| US6723217B1 (en) * | 1999-10-20 | 2004-04-20 | Delphi Technologies, Inc. | Method and device for pumping oxygen into a gas sensor |
| JP4050593B2 (en) * | 2002-11-01 | 2008-02-20 | 日本特殊陶業株式会社 | Gas sensor element and gas sensor using the same |
| CN106370712A (en) * | 2016-09-28 | 2017-02-01 | 成都凯天电子股份有限公司 | Zirconium sheet type chip oxygen sensor and preparation method thereof |
| CN106706727B (en) * | 2016-12-30 | 2023-03-14 | 莱鼎电子材料科技有限公司 | Chip type wide-area automobile oxygen sensor and preparation method thereof |
| CN107741447A (en) * | 2017-11-13 | 2018-02-27 | 嘉兴佳利电子有限公司 | The chip oxygen sensor ceramic chip that a kind of zirconia ceramics burns altogether with aluminium oxide ceramics |
| CN108318563A (en) * | 2018-01-29 | 2018-07-24 | 上海艾瓷传感科技有限公司 | A kind of oxygenerator oxygen concentration detection sensor |
| CN108120756B (en) * | 2018-01-29 | 2024-03-08 | 上海艾瓷传感科技有限公司 | Sensitive element of trace oxygen sensor |
| CN108956741B (en) * | 2018-06-06 | 2020-05-01 | 成都科锐传感技术有限公司 | Preparation method of double-battery type chip oxygen sensor for motorcycle |
| CN108732224B (en) * | 2018-06-06 | 2020-07-28 | 成都科锐传感技术有限公司 | Preparation method of double-battery sheet type wide-area oxygen sensor |
| CN108872349B (en) * | 2018-06-21 | 2020-08-11 | 西安创研电子科技有限公司 | Method and device for testing gas sensitivity of nitrogen-oxygen sensor ceramic chip |
-
2018
- 2018-12-12 CN CN201811517939.XA patent/CN109613099B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001029546A2 (en) * | 1999-10-20 | 2001-04-26 | Delphi Technologies, Inc. | Method and device for pumping oxygen into a gas sensor |
| CN209745869U (en) * | 2018-12-12 | 2019-12-06 | 厦门海赛米克新材料科技有限公司 | sheet type oxygen sensing device, engine exhaust pipe and motor vehicle |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109613099A (en) | 2019-04-12 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US10955376B2 (en) | Gas sensor | |
| JP4911910B2 (en) | NOx measuring electrode part structure, method for forming the same, and NOx sensor element | |
| US11237129B2 (en) | Sensor element and gas sensor | |
| US10845327B2 (en) | Gas sensor | |
| US10908118B2 (en) | Gas sensor | |
| US20110147214A1 (en) | Gas sensor and method for manufacturing sensor element | |
| US20230057032A1 (en) | Gas sensor | |
| US6338782B1 (en) | Gas sensor | |
| US7501604B2 (en) | Sensor element for determining gas components in gas mixtures, and method for manufacturing it | |
| JP2009236868A (en) | Gas sensor, nox sensor and method of manufacturing gas sensor | |
| US10969363B2 (en) | Gas sensor | |
| JP6934511B2 (en) | Sensor element and gas sensor | |
| CN109613099B (en) | Sheet type oxygen sensing device, engine exhaust pipe and motor vehicle | |
| EP1605256A1 (en) | Solid electrolytic oxygen sensor and method of producing same | |
| CN209745869U (en) | sheet type oxygen sensing device, engine exhaust pipe and motor vehicle | |
| CN113439209B (en) | Sensor element and gas sensor | |
| US11067533B2 (en) | Manufacturing method for sensor element | |
| JP6734062B2 (en) | Ceramic heater, sensor element and gas sensor | |
| US20230071139A1 (en) | Sensor element and gas sensor | |
| US11226240B2 (en) | Temperature sensor and temperature measuring device | |
| US10914706B2 (en) | Gas sensor | |
| US20210389270A1 (en) | Sensor element of gas sensor | |
| US20210389268A1 (en) | Sensor element of gas sensor | |
| KR102228244B1 (en) | Sensor element having a contact surface | |
| JP4693304B2 (en) | Oxygen sensor |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |