CN109609070A - Display adhesive, optical component, touch panel, liquid crystal sealing agent or encapsulant and liquid crystal display - Google Patents
Display adhesive, optical component, touch panel, liquid crystal sealing agent or encapsulant and liquid crystal display Download PDFInfo
- Publication number
- CN109609070A CN109609070A CN201811094247.9A CN201811094247A CN109609070A CN 109609070 A CN109609070 A CN 109609070A CN 201811094247 A CN201811094247 A CN 201811094247A CN 109609070 A CN109609070 A CN 109609070A
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- Prior art keywords
- display
- methyl
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- group
- ingredient
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- 239000000853 adhesive Substances 0.000 title claims abstract description 140
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 140
- 230000003287 optical effect Effects 0.000 title claims abstract description 90
- 239000004973 liquid crystal related substance Substances 0.000 title claims description 76
- 239000003795 chemical substances by application Substances 0.000 title claims description 23
- 239000008393 encapsulating agent Substances 0.000 title claims description 18
- 238000007789 sealing Methods 0.000 title claims description 17
- 239000004615 ingredient Substances 0.000 claims abstract description 80
- 229910052799 carbon Inorganic materials 0.000 claims abstract description 74
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 73
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims abstract description 71
- 150000001875 compounds Chemical class 0.000 claims abstract description 67
- 125000000217 alkyl group Chemical group 0.000 claims abstract description 53
- 125000001424 substituent group Chemical group 0.000 claims abstract description 35
- 229930195734 saturated hydrocarbon Natural products 0.000 claims abstract description 28
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical group [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 claims abstract description 25
- 125000001118 alkylidene group Chemical group 0.000 claims abstract description 13
- 125000004430 oxygen atom Chemical group O* 0.000 claims abstract description 5
- -1 phosphino- Chemical class 0.000 claims description 118
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 claims description 78
- 125000000962 organic group Chemical group 0.000 claims description 63
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 38
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 25
- 125000003545 alkoxy group Chemical group 0.000 claims description 22
- 229910052717 sulfur Inorganic materials 0.000 claims description 18
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 17
- 150000002118 epoxides Chemical class 0.000 claims description 17
- 239000011593 sulfur Substances 0.000 claims description 17
- 125000005843 halogen group Chemical group 0.000 claims description 15
- 239000005062 Polybutadiene Substances 0.000 claims description 14
- 229920002857 polybutadiene Polymers 0.000 claims description 14
- 125000003368 amide group Chemical group 0.000 claims description 13
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 13
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims description 12
- 150000001260 acyclic compounds Chemical class 0.000 claims description 11
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 claims description 10
- 229920001195 polyisoprene Polymers 0.000 claims description 10
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 9
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 claims description 9
- 239000012766 organic filler Substances 0.000 claims description 9
- 125000005328 phosphinyl group Chemical group [PH2](=O)* 0.000 claims description 9
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims description 9
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 claims description 8
- 239000011256 inorganic filler Substances 0.000 claims description 8
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 8
- 239000002245 particle Substances 0.000 claims description 8
- 125000005372 silanol group Chemical group 0.000 claims description 8
- 238000006884 silylation reaction Methods 0.000 claims description 8
- 150000001412 amines Chemical class 0.000 claims description 7
- TVZISJTYELEYPI-UHFFFAOYSA-N hypodiphosphoric acid Chemical class OP(O)(=O)P(O)(O)=O TVZISJTYELEYPI-UHFFFAOYSA-N 0.000 claims description 7
- 239000000178 monomer Substances 0.000 claims description 7
- AMPLEZFETMHNCR-UHFFFAOYSA-N [N+](=O)([O-])S(=O)(O)(C#N)N=O Chemical compound [N+](=O)([O-])S(=O)(O)(C#N)N=O AMPLEZFETMHNCR-UHFFFAOYSA-N 0.000 claims description 6
- 125000004429 atom Chemical group 0.000 claims description 6
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 5
- 239000006087 Silane Coupling Agent Substances 0.000 claims description 5
- 239000001257 hydrogen Substances 0.000 claims description 5
- 229910052739 hydrogen Inorganic materials 0.000 claims description 5
- XYFCBTPGUUZFHI-UHFFFAOYSA-N Phosphine Chemical compound P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 claims description 3
- 239000002552 dosage form Substances 0.000 claims description 2
- 229910000073 phosphorus hydride Inorganic materials 0.000 claims description 2
- SCPYDCQAZCOKTP-UHFFFAOYSA-N silanol Chemical compound [SiH3]O SCPYDCQAZCOKTP-UHFFFAOYSA-N 0.000 claims 1
- 238000006116 polymerization reaction Methods 0.000 abstract description 8
- 230000035945 sensitivity Effects 0.000 abstract description 3
- 239000000758 substrate Substances 0.000 description 116
- 239000002585 base Substances 0.000 description 75
- CERQOIWHTDAKMF-UHFFFAOYSA-N alpha-methacrylic acid Natural products CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 39
- 239000011521 glass Substances 0.000 description 26
- 150000002148 esters Chemical class 0.000 description 25
- 239000010410 layer Substances 0.000 description 23
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 20
- 238000004519 manufacturing process Methods 0.000 description 20
- 238000000034 method Methods 0.000 description 19
- 230000015572 biosynthetic process Effects 0.000 description 18
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 18
- 229920005989 resin Polymers 0.000 description 18
- 239000011347 resin Substances 0.000 description 18
- 210000004027 cell Anatomy 0.000 description 17
- 238000006243 chemical reaction Methods 0.000 description 17
- 239000000203 mixture Substances 0.000 description 17
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 16
- 150000004767 nitrides Chemical class 0.000 description 16
- 238000003786 synthesis reaction Methods 0.000 description 16
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 15
- 150000002430 hydrocarbons Chemical group 0.000 description 15
- 238000005286 illumination Methods 0.000 description 15
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 14
- 230000000694 effects Effects 0.000 description 14
- 239000003822 epoxy resin Substances 0.000 description 14
- 229920000647 polyepoxide Polymers 0.000 description 14
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 13
- 239000011247 coating layer Substances 0.000 description 13
- 125000003118 aryl group Chemical group 0.000 description 12
- 235000019441 ethanol Nutrition 0.000 description 12
- 239000004215 Carbon black (E152) Substances 0.000 description 11
- 125000002252 acyl group Chemical group 0.000 description 11
- 229930195733 hydrocarbon Natural products 0.000 description 11
- 239000001301 oxygen Substances 0.000 description 11
- 229910052760 oxygen Inorganic materials 0.000 description 11
- 239000000243 solution Substances 0.000 description 11
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 10
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 10
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 10
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 9
- 150000001336 alkenes Chemical group 0.000 description 9
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 9
- 230000000052 comparative effect Effects 0.000 description 9
- 239000000463 material Substances 0.000 description 9
- 150000003254 radicals Chemical class 0.000 description 9
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 8
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 8
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical group CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 8
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 8
- 239000002253 acid Substances 0.000 description 8
- 125000004414 alkyl thio group Chemical group 0.000 description 8
- 229940106691 bisphenol a Drugs 0.000 description 8
- 125000004185 ester group Chemical group 0.000 description 8
- 238000002156 mixing Methods 0.000 description 8
- 229920003986 novolac Polymers 0.000 description 8
- 239000004417 polycarbonate Substances 0.000 description 8
- 229920000515 polycarbonate Polymers 0.000 description 8
- 238000003756 stirring Methods 0.000 description 8
- 239000004593 Epoxy Substances 0.000 description 7
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 7
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 7
- 239000007870 radical polymerization initiator Substances 0.000 description 7
- 239000007787 solid Substances 0.000 description 7
- 239000002904 solvent Substances 0.000 description 7
- 239000000126 substance Substances 0.000 description 7
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 7
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 6
- 150000001335 aliphatic alkanes Chemical class 0.000 description 6
- MWPLVEDNUUSJAV-UHFFFAOYSA-N anthracene Chemical compound C1=CC=CC2=CC3=CC=CC=C3C=C21 MWPLVEDNUUSJAV-UHFFFAOYSA-N 0.000 description 6
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 6
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 6
- 125000004122 cyclic group Chemical group 0.000 description 6
- 125000000623 heterocyclic group Chemical group 0.000 description 6
- 239000012948 isocyanate Substances 0.000 description 6
- 229920002521 macromolecule Polymers 0.000 description 6
- 150000002927 oxygen compounds Chemical class 0.000 description 6
- YNPNZTXNASCQKK-UHFFFAOYSA-N phenanthrene Chemical compound C1=CC=C2C3=CC=CC=C3C=CC2=C1 YNPNZTXNASCQKK-UHFFFAOYSA-N 0.000 description 6
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 6
- 239000004926 polymethyl methacrylate Substances 0.000 description 6
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 6
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 5
- 208000019901 Anxiety disease Diseases 0.000 description 5
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 5
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 5
- 239000000654 additive Substances 0.000 description 5
- 239000003513 alkali Chemical class 0.000 description 5
- 125000002947 alkylene group Chemical group 0.000 description 5
- 230000036506 anxiety Effects 0.000 description 5
- 239000012298 atmosphere Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 238000002425 crystallisation Methods 0.000 description 5
- 230000008025 crystallization Effects 0.000 description 5
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 5
- 239000003365 glass fiber Substances 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 5
- 150000002513 isocyanates Chemical class 0.000 description 5
- 230000004048 modification Effects 0.000 description 5
- 238000012986 modification Methods 0.000 description 5
- 125000001820 oxy group Chemical group [*:1]O[*:2] 0.000 description 5
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 5
- 229920001451 polypropylene glycol Polymers 0.000 description 5
- 239000000843 powder Substances 0.000 description 5
- 239000001294 propane Substances 0.000 description 5
- 239000000565 sealant Substances 0.000 description 5
- 150000005846 sugar alcohols Polymers 0.000 description 5
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 4
- WPYCRFCQABTEKC-UHFFFAOYSA-N Diglycidyl resorcinol ether Chemical class C1OC1COC(C=1)=CC=CC=1OCC1CO1 WPYCRFCQABTEKC-UHFFFAOYSA-N 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 4
- 239000007983 Tris buffer Substances 0.000 description 4
- 230000000996 additive effect Effects 0.000 description 4
- 125000005907 alkyl ester group Chemical group 0.000 description 4
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 4
- LLEMOWNGBBNAJR-UHFFFAOYSA-N biphenyl-2-ol Chemical compound OC1=CC=CC=C1C1=CC=CC=C1 LLEMOWNGBBNAJR-UHFFFAOYSA-N 0.000 description 4
- IAQRGUVFOMOMEM-UHFFFAOYSA-N but-2-ene Chemical group CC=CC IAQRGUVFOMOMEM-UHFFFAOYSA-N 0.000 description 4
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 125000004093 cyano group Chemical group *C#N 0.000 description 4
- 150000002009 diols Chemical class 0.000 description 4
- 125000003700 epoxy group Chemical group 0.000 description 4
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 4
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 4
- 230000006870 function Effects 0.000 description 4
- 238000005984 hydrogenation reaction Methods 0.000 description 4
- 230000001678 irradiating effect Effects 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 4
- 229910052757 nitrogen Inorganic materials 0.000 description 4
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 4
- 229920001228 polyisocyanate Polymers 0.000 description 4
- 239000005056 polyisocyanate Substances 0.000 description 4
- 239000011342 resin composition Substances 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 125000004646 sulfenyl group Chemical group S(*)* 0.000 description 4
- 238000010792 warming Methods 0.000 description 4
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 3
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- 239000005864 Sulphur Substances 0.000 description 3
- OBNDGIHQAIXEAO-UHFFFAOYSA-N [O].[Si] Chemical compound [O].[Si] OBNDGIHQAIXEAO-UHFFFAOYSA-N 0.000 description 3
- 125000004423 acyloxy group Chemical group 0.000 description 3
- 125000003342 alkenyl group Chemical group 0.000 description 3
- 125000004453 alkoxycarbonyl group Chemical group 0.000 description 3
- 150000007942 carboxylates Chemical class 0.000 description 3
- 125000001995 cyclobutyl group Chemical group [H]C1([H])C([H])([H])C([H])(*)C1([H])[H] 0.000 description 3
- 238000006356 dehydrogenation reaction Methods 0.000 description 3
- 229960001760 dimethyl sulfoxide Drugs 0.000 description 3
- 239000006185 dispersion Substances 0.000 description 3
- 238000001914 filtration Methods 0.000 description 3
- 125000000524 functional group Chemical group 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 229910052736 halogen Inorganic materials 0.000 description 3
- 150000002367 halogens Chemical class 0.000 description 3
- 239000003999 initiator Substances 0.000 description 3
- 125000002462 isocyano group Chemical group *[N+]#[C-] 0.000 description 3
- 239000002346 layers by function Substances 0.000 description 3
- 239000008204 material by function Substances 0.000 description 3
- 239000011159 matrix material Substances 0.000 description 3
- 230000007246 mechanism Effects 0.000 description 3
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- 229920005862 polyol Polymers 0.000 description 3
- 150000003077 polyols Chemical class 0.000 description 3
- 229920006324 polyoxymethylene Chemical class 0.000 description 3
- 238000010526 radical polymerization reaction Methods 0.000 description 3
- 239000000376 reactant Substances 0.000 description 3
- 230000009257 reactivity Effects 0.000 description 3
- 229920006395 saturated elastomer Polymers 0.000 description 3
- 238000012216 screening Methods 0.000 description 3
- 239000000377 silicon dioxide Substances 0.000 description 3
- 229920002379 silicone rubber Polymers 0.000 description 3
- 239000004945 silicone rubber Substances 0.000 description 3
- 238000006467 substitution reaction Methods 0.000 description 3
- 239000000454 talc Substances 0.000 description 3
- 235000012222 talc Nutrition 0.000 description 3
- 229910052623 talc Inorganic materials 0.000 description 3
- 125000005031 thiocyano group Chemical group S(C#N)* 0.000 description 3
- PAPBSGBWRJIAAV-UHFFFAOYSA-N ε-Caprolactone Chemical compound O=C1CCCCCO1 PAPBSGBWRJIAAV-UHFFFAOYSA-N 0.000 description 3
- XLPJNCYCZORXHG-UHFFFAOYSA-N 1-morpholin-4-ylprop-2-en-1-one Chemical compound C=CC(=O)N1CCOCC1 XLPJNCYCZORXHG-UHFFFAOYSA-N 0.000 description 2
- PTJWCLYPVFJWMP-UHFFFAOYSA-N 2-[[3-hydroxy-2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)COCC(CO)(CO)CO PTJWCLYPVFJWMP-UHFFFAOYSA-N 0.000 description 2
- DOEGFDSNCZCRTI-UHFFFAOYSA-N 2-isocyanatoethyl 2-methylprop-2-enoate;2-methylprop-2-enoic acid Chemical compound CC(=C)C(O)=O.CC(=C)C(=O)OCCN=C=O DOEGFDSNCZCRTI-UHFFFAOYSA-N 0.000 description 2
- RIWRBSMFKVOJMN-UHFFFAOYSA-N 2-methyl-1-phenylpropan-2-ol Chemical compound CC(C)(O)CC1=CC=CC=C1 RIWRBSMFKVOJMN-UHFFFAOYSA-N 0.000 description 2
- BKOOMYPCSUNDGP-UHFFFAOYSA-N 2-methylbut-2-ene Chemical compound CC=C(C)C BKOOMYPCSUNDGP-UHFFFAOYSA-N 0.000 description 2
- 241000208340 Araliaceae Species 0.000 description 2
- 229910052582 BN Inorganic materials 0.000 description 2
- 229930185605 Bisphenol Natural products 0.000 description 2
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 2
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical class C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- RWSOTUBLDIXVET-UHFFFAOYSA-N Dihydrogen sulfide Chemical compound S RWSOTUBLDIXVET-UHFFFAOYSA-N 0.000 description 2
- SNRUBQQJIBEYMU-UHFFFAOYSA-N Dodecane Natural products CCCCCCCCCCCC SNRUBQQJIBEYMU-UHFFFAOYSA-N 0.000 description 2
- XETQTCAMTVHYPO-UHFFFAOYSA-N Isocamphan von ungewisser Konfiguration Natural products C1CC2C(C)(C)C(C)C1C2 XETQTCAMTVHYPO-UHFFFAOYSA-N 0.000 description 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 2
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 2
- 235000005035 Panax pseudoginseng ssp. pseudoginseng Nutrition 0.000 description 2
- 235000003140 Panax quinquefolius Nutrition 0.000 description 2
- 239000002202 Polyethylene glycol Substances 0.000 description 2
- YDQCKWDAEAJVAJ-UHFFFAOYSA-N [C].OC(=O)C=C Chemical compound [C].OC(=O)C=C YDQCKWDAEAJVAJ-UHFFFAOYSA-N 0.000 description 2
- 125000002777 acetyl group Chemical group [H]C([H])([H])C(*)=O 0.000 description 2
- 229920000800 acrylic rubber Polymers 0.000 description 2
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 150000001298 alcohols Chemical class 0.000 description 2
- 125000001931 aliphatic group Chemical group 0.000 description 2
- 125000000304 alkynyl group Chemical group 0.000 description 2
- XLJMAIOERFSOGZ-UHFFFAOYSA-N anhydrous cyanic acid Natural products OC#N XLJMAIOERFSOGZ-UHFFFAOYSA-N 0.000 description 2
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 2
- 125000003435 aroyl group Chemical group 0.000 description 2
- 125000003710 aryl alkyl group Chemical group 0.000 description 2
- 150000008378 aryl ethers Chemical class 0.000 description 2
- 239000011324 bead Substances 0.000 description 2
- HUMNYLRZRPPJDN-UHFFFAOYSA-N benzaldehyde Chemical compound O=CC1=CC=CC=C1 HUMNYLRZRPPJDN-UHFFFAOYSA-N 0.000 description 2
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 2
- 229930006742 bornane Natural products 0.000 description 2
- 229910000019 calcium carbonate Inorganic materials 0.000 description 2
- 235000012241 calcium silicate Nutrition 0.000 description 2
- OSGAYBCDTDRGGQ-UHFFFAOYSA-L calcium sulfate Chemical compound [Ca+2].[O-]S([O-])(=O)=O OSGAYBCDTDRGGQ-UHFFFAOYSA-L 0.000 description 2
- BEWYHVAWEKZDPP-UHFFFAOYSA-N camphane Natural products C1CC2(C)CCC1C2(C)C BEWYHVAWEKZDPP-UHFFFAOYSA-N 0.000 description 2
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 description 2
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 239000000460 chlorine Substances 0.000 description 2
- 229910052801 chlorine Inorganic materials 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 239000004927 clay Substances 0.000 description 2
- 229910052570 clay Inorganic materials 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 125000006841 cyclic skeleton Chemical group 0.000 description 2
- 125000001559 cyclopropyl group Chemical group [H]C1([H])C([H])([H])C1([H])* 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 2
- 238000004090 dissolution Methods 0.000 description 2
- VFNGKCDDZUSWLR-UHFFFAOYSA-N disulfuric acid Chemical compound OS(=O)(=O)OS(O)(=O)=O VFNGKCDDZUSWLR-UHFFFAOYSA-N 0.000 description 2
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- 235000013399 edible fruits Nutrition 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 125000006575 electron-withdrawing group Chemical group 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- JBFHTYHTHYHCDJ-UHFFFAOYSA-N gamma-caprolactone Chemical compound CCC1CCC(=O)O1 JBFHTYHTHYHCDJ-UHFFFAOYSA-N 0.000 description 2
- 235000008434 ginseng Nutrition 0.000 description 2
- 238000000227 grinding Methods 0.000 description 2
- 150000004820 halides Chemical class 0.000 description 2
- 150000001469 hydantoins Chemical class 0.000 description 2
- 150000004678 hydrides Chemical class 0.000 description 2
- 125000003454 indenyl group Chemical class C1(C=CC2=CC=CC=C12)* 0.000 description 2
- 239000003112 inhibitor Substances 0.000 description 2
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 2
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Natural products OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 2
- 229910052753 mercury Inorganic materials 0.000 description 2
- RBQRWNWVPQDTJJ-UHFFFAOYSA-N methacryloyloxyethyl isocyanate Chemical compound CC(=C)C(=O)OCCN=C=O RBQRWNWVPQDTJJ-UHFFFAOYSA-N 0.000 description 2
- 125000000325 methylidene group Chemical group [H]C([H])=* 0.000 description 2
- 239000010445 mica Substances 0.000 description 2
- 229910052618 mica group Inorganic materials 0.000 description 2
- IJDNQMDRQITEOD-UHFFFAOYSA-N n-butane Chemical compound CCCC IJDNQMDRQITEOD-UHFFFAOYSA-N 0.000 description 2
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 2
- 238000010943 off-gassing Methods 0.000 description 2
- 235000010292 orthophenyl phenol Nutrition 0.000 description 2
- JMANVNJQNLATNU-UHFFFAOYSA-N oxalonitrile Chemical compound N#CC#N JMANVNJQNLATNU-UHFFFAOYSA-N 0.000 description 2
- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical compound NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 125000004817 pentamethylene group Chemical group [H]C([H])([*:2])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[*:1] 0.000 description 2
- 150000002989 phenols Chemical class 0.000 description 2
- 150000003009 phosphonic acids Chemical class 0.000 description 2
- 125000001476 phosphono group Chemical group [H]OP(*)(=O)O[H] 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- XKJCHHZQLQNZHY-UHFFFAOYSA-N phthalimide Chemical compound C1=CC=C2C(=O)NC(=O)C2=C1 XKJCHHZQLQNZHY-UHFFFAOYSA-N 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920002587 poly(1,3-butadiene) polymer Polymers 0.000 description 2
- 229920000058 polyacrylate Polymers 0.000 description 2
- 229920001223 polyethylene glycol Polymers 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 230000001737 promoting effect Effects 0.000 description 2
- BBEAQIROQSPTKN-UHFFFAOYSA-N pyrene Chemical compound C1=CC=C2C=CC3=CC=CC4=CC=C1C2=C43 BBEAQIROQSPTKN-UHFFFAOYSA-N 0.000 description 2
- 239000005060 rubber Substances 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 125000006850 spacer group Chemical group 0.000 description 2
- BUUPQKDIAURBJP-UHFFFAOYSA-N sulfinic acid Chemical compound OS=O BUUPQKDIAURBJP-UHFFFAOYSA-N 0.000 description 2
- 125000003944 tolyl group Chemical group 0.000 description 2
- DUXYWXYOBMKGIN-UHFFFAOYSA-N trimyristin Chemical compound CCCCCCCCCCCCCC(=O)OCC(OC(=O)CCCCCCCCCCCCC)COC(=O)CCCCCCCCCCCCC DUXYWXYOBMKGIN-UHFFFAOYSA-N 0.000 description 2
- 125000004417 unsaturated alkyl group Chemical group 0.000 description 2
- 229910052724 xenon Inorganic materials 0.000 description 2
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 2
- QNODIIQQMGDSEF-UHFFFAOYSA-N (1-hydroxycyclohexyl)-phenylmethanone Chemical compound C=1C=CC=CC=1C(=O)C1(O)CCCCC1 QNODIIQQMGDSEF-UHFFFAOYSA-N 0.000 description 1
- MUTGBJKUEZFXGO-OLQVQODUSA-N (3as,7ar)-3a,4,5,6,7,7a-hexahydro-2-benzofuran-1,3-dione Chemical compound C1CCC[C@@H]2C(=O)OC(=O)[C@@H]21 MUTGBJKUEZFXGO-OLQVQODUSA-N 0.000 description 1
- FKTHNVSLHLHISI-UHFFFAOYSA-N 1,2-bis(isocyanatomethyl)benzene Chemical compound O=C=NCC1=CC=CC=C1CN=C=O FKTHNVSLHLHISI-UHFFFAOYSA-N 0.000 description 1
- 125000005838 1,3-cyclopentylene group Chemical group [H]C1([H])C([H])([H])C([H])([*:2])C([H])([H])C1([H])[*:1] 0.000 description 1
- SRSFAZYVBGMKDG-UHFFFAOYSA-N 1-(2,2-dimethylpropylperoxy)-3-methylbutane Chemical compound C(CC(C)C)OOCC(C)(C)C SRSFAZYVBGMKDG-UHFFFAOYSA-N 0.000 description 1
- 125000004972 1-butynyl group Chemical group [H]C([H])([H])C([H])([H])C#C* 0.000 description 1
- 125000006023 1-pentenyl group Chemical group 0.000 description 1
- BTJPUDCSZVCXFQ-UHFFFAOYSA-N 2,4-diethylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(CC)=CC(CC)=C3SC2=C1 BTJPUDCSZVCXFQ-UHFFFAOYSA-N 0.000 description 1
- GJKGAPPUXSSCFI-UHFFFAOYSA-N 2-Hydroxy-4'-(2-hydroxyethoxy)-2-methylpropiophenone Chemical compound CC(C)(O)C(=O)C1=CC=C(OCCO)C=C1 GJKGAPPUXSSCFI-UHFFFAOYSA-N 0.000 description 1
- NKANYVMWDXJHLE-UHFFFAOYSA-N 2-[[2-(oxiran-2-ylmethoxy)phenoxy]methyl]oxirane Chemical class C1OC1COC1=CC=CC=C1OCC1CO1 NKANYVMWDXJHLE-UHFFFAOYSA-N 0.000 description 1
- HDMIWIXLPFMCFC-UHFFFAOYSA-N 2-chloro-2h-thiopyrano[3,2-b]chromen-10-one Chemical compound O1C2=CC=CC=C2C(=O)C2=C1C=CC(Cl)S2 HDMIWIXLPFMCFC-UHFFFAOYSA-N 0.000 description 1
- RAURIJBUROUQRJ-UHFFFAOYSA-N 2-cyanatoethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCOC#N RAURIJBUROUQRJ-UHFFFAOYSA-N 0.000 description 1
- 125000004680 2-methylbutylcarbonyl group Chemical group CC(CC(=O)*)CC 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- VALXVSHDOMUUIC-UHFFFAOYSA-N 2-methylprop-2-enoic acid;phosphoric acid Chemical compound OP(O)(O)=O.CC(=C)C(O)=O VALXVSHDOMUUIC-UHFFFAOYSA-N 0.000 description 1
- JEHFRMABGJJCPF-UHFFFAOYSA-N 2-methylprop-2-enoyl isocyanate Chemical compound CC(=C)C(=O)N=C=O JEHFRMABGJJCPF-UHFFFAOYSA-N 0.000 description 1
- 125000006024 2-pentenyl group Chemical group 0.000 description 1
- BQUNPXRABCSKJZ-UHFFFAOYSA-N 2-propan-2-ylanthracene-9,10-dione Chemical compound C1=CC=C2C(=O)C3=CC(C(C)C)=CC=C3C(=O)C2=C1 BQUNPXRABCSKJZ-UHFFFAOYSA-N 0.000 description 1
- KNTKCYKJRSMRMZ-UHFFFAOYSA-N 3-chloropropyl-dimethoxy-methylsilane Chemical compound CO[Si](C)(OC)CCCCl KNTKCYKJRSMRMZ-UHFFFAOYSA-N 0.000 description 1
- YHQXBTXEYZIYOV-UHFFFAOYSA-N 3-methylbut-1-ene Chemical compound CC(C)C=C YHQXBTXEYZIYOV-UHFFFAOYSA-N 0.000 description 1
- SXFJDZNJHVPHPH-UHFFFAOYSA-N 3-methylpentane-1,5-diol Chemical compound OCCC(C)CCO SXFJDZNJHVPHPH-UHFFFAOYSA-N 0.000 description 1
- 125000006201 3-phenylpropyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 1
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 1
- JNRLEMMIVRBKJE-UHFFFAOYSA-N 4,4'-Methylenebis(N,N-dimethylaniline) Chemical compound C1=CC(N(C)C)=CC=C1CC1=CC=C(N(C)C)C=C1 JNRLEMMIVRBKJE-UHFFFAOYSA-N 0.000 description 1
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 1
- PGCBRGRKKOCPAN-UHFFFAOYSA-N 4-triethoxysilylbutanamide Chemical compound CCO[Si](OCC)(OCC)CCCC(N)=O PGCBRGRKKOCPAN-UHFFFAOYSA-N 0.000 description 1
- ZYUVGYBAPZYKSA-UHFFFAOYSA-N 5-(3-hydroxybutan-2-yl)-4-methylbenzene-1,3-diol Chemical compound CC(O)C(C)C1=CC(O)=CC(O)=C1C ZYUVGYBAPZYKSA-UHFFFAOYSA-N 0.000 description 1
- DVNYTAVYBRSTGK-UHFFFAOYSA-N 5-aminoimidazole-4-carboxamide Chemical compound NC(=O)C=1N=CNC=1N DVNYTAVYBRSTGK-UHFFFAOYSA-N 0.000 description 1
- DXPPIEDUBFUSEZ-UHFFFAOYSA-N 6-methylheptyl prop-2-enoate Chemical group CC(C)CCCCCOC(=O)C=C DXPPIEDUBFUSEZ-UHFFFAOYSA-N 0.000 description 1
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical group [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 description 1
- LVGFPWDANALGOY-UHFFFAOYSA-N 8-methylnonyl prop-2-enoate Chemical compound CC(C)CCCCCCCOC(=O)C=C LVGFPWDANALGOY-UHFFFAOYSA-N 0.000 description 1
- GDALETGZDYOOGB-UHFFFAOYSA-N Acridone Natural products C1=C(O)C=C2N(C)C3=CC=CC=C3C(=O)C2=C1O GDALETGZDYOOGB-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 229920002799 BoPET Polymers 0.000 description 1
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical group [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 1
- LBZPYVNZRHHQMI-UHFFFAOYSA-N C(C(=C)C)(=O)O.C(C)C(COP(=O)(OCC(CCCC)CC)O)CCCC Chemical compound C(C(=C)C)(=O)O.C(C)C(COP(=O)(OCC(CCCC)CC)O)CCCC LBZPYVNZRHHQMI-UHFFFAOYSA-N 0.000 description 1
- CVFUQRNRRLUERQ-UHFFFAOYSA-N C1(=CC=CC=C1)NC(=O)CCC[Si](OC)(OC)OC Chemical compound C1(=CC=CC=C1)NC(=O)CCC[Si](OC)(OC)OC CVFUQRNRRLUERQ-UHFFFAOYSA-N 0.000 description 1
- HCXQNFKGWDJHSQ-UHFFFAOYSA-N CC=CC.P(O)(O)(O)=O Chemical group CC=CC.P(O)(O)(O)=O HCXQNFKGWDJHSQ-UHFFFAOYSA-N 0.000 description 1
- KBFJRBHDXWPHHF-UHFFFAOYSA-N CO[Si](C)(OC)OCCCCC(=O)N Chemical compound CO[Si](C)(OC)OCCCCC(=O)N KBFJRBHDXWPHHF-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 1
- 239000004713 Cyclic olefin copolymer Substances 0.000 description 1
- OTMSDBZUPAUEDD-UHFFFAOYSA-N Ethane Chemical compound CC OTMSDBZUPAUEDD-UHFFFAOYSA-N 0.000 description 1
- UXMQORVHJMUQFD-UHFFFAOYSA-N Heptanophenone Chemical compound CCCCCCC(=O)C1=CC=CC=C1 UXMQORVHJMUQFD-UHFFFAOYSA-N 0.000 description 1
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 1
- OWIKHYCFFJSOEH-UHFFFAOYSA-N Isocyanic acid Chemical compound N=C=O OWIKHYCFFJSOEH-UHFFFAOYSA-N 0.000 description 1
- 239000005058 Isophorone diisocyanate Substances 0.000 description 1
- 229910000502 Li-aluminosilicate Inorganic materials 0.000 description 1
- LSDPWZHWYPCBBB-UHFFFAOYSA-N Methanethiol Chemical compound SC LSDPWZHWYPCBBB-UHFFFAOYSA-N 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- JCXJVPUVTGWSNB-UHFFFAOYSA-N Nitrogen dioxide Chemical class O=[N]=O JCXJVPUVTGWSNB-UHFFFAOYSA-N 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 1
- 229910006074 SO2NH2 Inorganic materials 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- RAHZWNYVWXNFOC-UHFFFAOYSA-N Sulphur dioxide Chemical group O=S=O RAHZWNYVWXNFOC-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- BIHBQDOKGWROSG-UHFFFAOYSA-N [N+](=O)([O-])S(=O)(O)N=O Chemical compound [N+](=O)([O-])S(=O)(O)N=O BIHBQDOKGWROSG-UHFFFAOYSA-N 0.000 description 1
- 125000000738 acetamido group Chemical group [H]C([H])([H])C(=O)N([H])[*] 0.000 description 1
- FZEYVTFCMJSGMP-UHFFFAOYSA-N acridone Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3NC2=C1 FZEYVTFCMJSGMP-UHFFFAOYSA-N 0.000 description 1
- ORILYTVJVMAKLC-UHFFFAOYSA-N adamantane Chemical group C1C(C2)CC3CC1CC2C3 ORILYTVJVMAKLC-UHFFFAOYSA-N 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 150000001338 aliphatic hydrocarbons Chemical class 0.000 description 1
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- 229910021502 aluminium hydroxide Inorganic materials 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 210000005097 arteria cerebelosa anteroinferior Anatomy 0.000 description 1
- 210000001367 artery Anatomy 0.000 description 1
- 125000005160 aryl oxy alkyl group Chemical group 0.000 description 1
- 125000005110 aryl thio group Chemical group 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- 125000003236 benzoyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C(*)=O 0.000 description 1
- 239000007767 bonding agent Substances 0.000 description 1
- 210000000988 bone and bone Anatomy 0.000 description 1
- 239000001273 butane Substances 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 1
- 210000004899 c-terminal region Anatomy 0.000 description 1
- GJYLKIZKRHDRER-UHFFFAOYSA-N calcium;sulfuric acid Chemical compound [Ca].OS(O)(=O)=O GJYLKIZKRHDRER-UHFFFAOYSA-N 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 238000006555 catalytic reaction Methods 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 238000005660 chlorination reaction Methods 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 238000003776 cleavage reaction Methods 0.000 description 1
- 238000004040 coloring Methods 0.000 description 1
- 238000012790 confirmation Methods 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 239000011258 core-shell material Substances 0.000 description 1
- 239000002537 cosmetic Substances 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 229910002026 crystalline silica Inorganic materials 0.000 description 1
- 125000001651 cyanato group Chemical group [*]OC#N 0.000 description 1
- 125000000392 cycloalkenyl group Chemical group 0.000 description 1
- 125000002993 cycloalkylene group Chemical group 0.000 description 1
- 125000000596 cyclohexenyl group Chemical group C1(=CCCCC1)* 0.000 description 1
- FNIATMYXUPOJRW-UHFFFAOYSA-N cyclohexylidene Chemical group [C]1CCCCC1 FNIATMYXUPOJRW-UHFFFAOYSA-N 0.000 description 1
- WJTCGQSWYFHTAC-UHFFFAOYSA-N cyclooctane Chemical group C1CCCCCCC1 WJTCGQSWYFHTAC-UHFFFAOYSA-N 0.000 description 1
- 125000002433 cyclopentenyl group Chemical group C1(=CCCC1)* 0.000 description 1
- MAWOHFOSAIXURX-UHFFFAOYSA-N cyclopentylcyclopentane Chemical compound C1CCCC1C1CCCC1 MAWOHFOSAIXURX-UHFFFAOYSA-N 0.000 description 1
- NHADDZMCASKINP-HTRCEHHLSA-N decarboxydihydrocitrinin Natural products C1=C(O)C(C)=C2[C@H](C)[C@@H](C)OCC2=C1O NHADDZMCASKINP-HTRCEHHLSA-N 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 238000007872 degassing Methods 0.000 description 1
- 125000004386 diacrylate group Chemical group 0.000 description 1
- VLWUKSRKUMIQAX-UHFFFAOYSA-N diethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[SiH](OCC)CCCOCC1CO1 VLWUKSRKUMIQAX-UHFFFAOYSA-N 0.000 description 1
- XXJWXESWEXIICW-UHFFFAOYSA-N diethylene glycol monoethyl ether Chemical compound CCOCCOCCO XXJWXESWEXIICW-UHFFFAOYSA-N 0.000 description 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 1
- YQGOWXYZDLJBFL-UHFFFAOYSA-N dimethoxysilane Chemical compound CO[SiH2]OC YQGOWXYZDLJBFL-UHFFFAOYSA-N 0.000 description 1
- 239000004205 dimethyl polysiloxane Substances 0.000 description 1
- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 1
- 150000002012 dioxanes Chemical class 0.000 description 1
- ROORDVPLFPIABK-UHFFFAOYSA-N diphenyl carbonate Chemical compound C=1C=CC=CC=1OC(=O)OC1=CC=CC=C1 ROORDVPLFPIABK-UHFFFAOYSA-N 0.000 description 1
- 238000004821 distillation Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 150000002083 enediols Chemical class 0.000 description 1
- 238000012407 engineering method Methods 0.000 description 1
- 238000006735 epoxidation reaction Methods 0.000 description 1
- 230000032050 esterification Effects 0.000 description 1
- 238000005886 esterification reaction Methods 0.000 description 1
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 1
- 125000005677 ethinylene group Chemical group [*:2]C#C[*:1] 0.000 description 1
- 125000004494 ethyl ester group Chemical group 0.000 description 1
- 125000004672 ethylcarbonyl group Chemical group [H]C([H])([H])C([H])([H])C(*)=O 0.000 description 1
- WHRIKZCFRVTHJH-UHFFFAOYSA-N ethylhydrazine Chemical compound CCNN WHRIKZCFRVTHJH-UHFFFAOYSA-N 0.000 description 1
- 125000000219 ethylidene group Chemical group [H]C(=[*])C([H])([H])[H] 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- GVEPBJHOBDJJJI-UHFFFAOYSA-N fluoranthrene Natural products C1=CC(C2=CC=CC=C22)=C3C2=CC=CC3=C1 GVEPBJHOBDJJJI-UHFFFAOYSA-N 0.000 description 1
- RMBPEFMHABBEKP-UHFFFAOYSA-N fluorene Chemical compound C1=CC=C2C3=C[CH]C=CC3=CC2=C1 RMBPEFMHABBEKP-UHFFFAOYSA-N 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 125000001153 fluoro group Chemical group F* 0.000 description 1
- 238000009689 gas atomisation Methods 0.000 description 1
- 150000002334 glycols Chemical class 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000026030 halogenation Effects 0.000 description 1
- 238000005658 halogenation reaction Methods 0.000 description 1
- 125000005842 heteroatom Chemical group 0.000 description 1
- 125000004836 hexamethylene group Chemical group [H]C([H])([*:2])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[*:1] 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- 125000003707 hexyloxy group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])O* 0.000 description 1
- 235000003642 hunger Nutrition 0.000 description 1
- 125000001183 hydrocarbyl group Chemical group 0.000 description 1
- 125000004029 hydroxymethyl group Chemical group [H]OC([H])([H])* 0.000 description 1
- 150000002466 imines Chemical class 0.000 description 1
- 230000008676 import Effects 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- 229910052740 iodine Inorganic materials 0.000 description 1
- 235000013847 iso-butane Nutrition 0.000 description 1
- NNPPMTNAJDCUHE-UHFFFAOYSA-N isobutane Chemical compound CC(C)C NNPPMTNAJDCUHE-UHFFFAOYSA-N 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- 125000001261 isocyanato group Chemical group *N=C=O 0.000 description 1
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 239000004611 light stabiliser Substances 0.000 description 1
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 description 1
- 239000001095 magnesium carbonate Substances 0.000 description 1
- 229910000021 magnesium carbonate Inorganic materials 0.000 description 1
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 1
- 239000000347 magnesium hydroxide Substances 0.000 description 1
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- 229910000000 metal hydroxide Inorganic materials 0.000 description 1
- HRDXJKGNWSUIBT-UHFFFAOYSA-N methoxybenzene Chemical group [CH2]OC1=CC=CC=C1 HRDXJKGNWSUIBT-UHFFFAOYSA-N 0.000 description 1
- 125000001160 methoxycarbonyl group Chemical group [H]C([H])([H])OC(*)=O 0.000 description 1
- FLUHOKZCSIYKQX-UHFFFAOYSA-N methyl prop-2-enoate phosphoric acid Chemical compound COC(C=C)=O.P(=O)(O)(O)O FLUHOKZCSIYKQX-UHFFFAOYSA-N 0.000 description 1
- IQSHMXAZFHORGY-UHFFFAOYSA-N methyl prop-2-enoate;2-methylprop-2-enoic acid Chemical compound COC(=O)C=C.CC(=C)C(O)=O IQSHMXAZFHORGY-UHFFFAOYSA-N 0.000 description 1
- 239000011859 microparticle Substances 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 239000010813 municipal solid waste Substances 0.000 description 1
- 125000003136 n-heptyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000001280 n-hexyl group Chemical group C(CCCCC)* 0.000 description 1
- OFBQJSOFQDEBGM-UHFFFAOYSA-N n-pentane Natural products CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 description 1
- 125000000740 n-pentyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000006252 n-propylcarbonyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C(*)=O 0.000 description 1
- 125000001038 naphthoyl group Chemical group C1(=CC=CC2=CC=CC=C12)C(=O)* 0.000 description 1
- 125000000449 nitro group Chemical group [O-][N+](*)=O 0.000 description 1
- LQNUZADURLCDLV-UHFFFAOYSA-N nitrobenzene Substances [O-][N+](=O)C1=CC=CC=C1 LQNUZADURLCDLV-UHFFFAOYSA-N 0.000 description 1
- QPCCFOGFUGARRV-UHFFFAOYSA-N nonane-1,1,1-triol Chemical compound CCCCCCCCC(O)(O)O QPCCFOGFUGARRV-UHFFFAOYSA-N 0.000 description 1
- BKIMMITUMNQMOS-UHFFFAOYSA-N normal nonane Natural products CCCCCCCCC BKIMMITUMNQMOS-UHFFFAOYSA-N 0.000 description 1
- 230000000269 nucleophilic effect Effects 0.000 description 1
- NIHNNTQXNPWCJQ-UHFFFAOYSA-N o-biphenylenemethane Natural products C1=CC=C2CC3=CC=CC=C3C2=C1 NIHNNTQXNPWCJQ-UHFFFAOYSA-N 0.000 description 1
- 230000000414 obstructive effect Effects 0.000 description 1
- OTLDLKLSNZMTTA-UHFFFAOYSA-N octahydro-1h-4,7-methanoindene-1,5-diyldimethanol Chemical compound C1C2C3C(CO)CCC3C1C(CO)C2 OTLDLKLSNZMTTA-UHFFFAOYSA-N 0.000 description 1
- TVMXDCGIABBOFY-UHFFFAOYSA-N octane Chemical compound CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 1
- 150000007530 organic bases Chemical group 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 239000012044 organic layer Substances 0.000 description 1
- 150000001451 organic peroxides Chemical class 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- QNGNSVIICDLXHT-UHFFFAOYSA-N para-ethylbenzaldehyde Natural products CCC1=CC=C(C=O)C=C1 QNGNSVIICDLXHT-UHFFFAOYSA-N 0.000 description 1
- FTDXCHCAMNRNNY-UHFFFAOYSA-N phenol Chemical compound OC1=CC=CC=C1.OC1=CC=CC=C1 FTDXCHCAMNRNNY-UHFFFAOYSA-N 0.000 description 1
- 125000000394 phosphonato group Chemical group [O-]P([O-])(*)=O 0.000 description 1
- 125000001557 phthalyl group Chemical group C(=O)(O)C1=C(C(=O)*)C=CC=C1 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 1
- 150000004291 polyenes Chemical class 0.000 description 1
- 229920005906 polyester polyol Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 239000003505 polymerization initiator Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 238000011417 postcuring Methods 0.000 description 1
- NNFCIKHAZHQZJG-UHFFFAOYSA-N potassium cyanide Chemical compound [K+].N#[C-] NNFCIKHAZHQZJG-UHFFFAOYSA-N 0.000 description 1
- FGIUAXJPYTZDNR-UHFFFAOYSA-N potassium nitrate Chemical compound [K+].[O-][N+]([O-])=O FGIUAXJPYTZDNR-UHFFFAOYSA-N 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 238000007670 refining Methods 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- 239000012266 salt solution Substances 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 238000009738 saturating Methods 0.000 description 1
- 125000002914 sec-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 125000000467 secondary amino group Chemical class [H]N([*:1])[*:2] 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 239000005361 soda-lime glass Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000006058 strengthened glass Substances 0.000 description 1
- 125000001273 sulfonato group Chemical group [O-]S(*)(=O)=O 0.000 description 1
- 125000004434 sulfur atom Chemical group 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 230000002194 synthesizing effect Effects 0.000 description 1
- 238000010189 synthetic method Methods 0.000 description 1
- MUTNCGKQJGXKEM-UHFFFAOYSA-N tamibarotene Chemical compound C=1C=C2C(C)(C)CCC(C)(C)C2=CC=1NC(=O)C1=CC=C(C(O)=O)C=C1 MUTNCGKQJGXKEM-UHFFFAOYSA-N 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 238000009210 therapy by ultrasound Methods 0.000 description 1
- 150000003568 thioethers Chemical class 0.000 description 1
- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 description 1
- KSBAEPSJVUENNK-UHFFFAOYSA-L tin(ii) 2-ethylhexanoate Chemical compound [Sn+2].CCCCC(CC)C([O-])=O.CCCCC(CC)C([O-])=O KSBAEPSJVUENNK-UHFFFAOYSA-L 0.000 description 1
- 125000005425 toluyl group Chemical group 0.000 description 1
- YUYCVXFAYWRXLS-UHFFFAOYSA-N trimethoxysilane Chemical compound CO[SiH](OC)OC YUYCVXFAYWRXLS-UHFFFAOYSA-N 0.000 description 1
- GETQZCLCWQTVFV-UHFFFAOYSA-N trimethylamine Chemical compound CN(C)C GETQZCLCWQTVFV-UHFFFAOYSA-N 0.000 description 1
- 150000004072 triols Chemical class 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
- 210000003462 vein Anatomy 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
- GFQYVLUOOAAOGM-UHFFFAOYSA-N zirconium(iv) silicate Chemical compound [Zr+4].[O-][Si]([O-])([O-])[O-] GFQYVLUOOAAOGM-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
- C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
- C09J163/10—Epoxy resins modified by unsaturated compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/46—Polymerisation initiated by wave energy or particle radiation
- C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1339—Gaskets; Spacers; Sealing of cells
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1341—Filling or closing of cells
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/318—Applications of adhesives in processes or use of adhesives in the form of films or foils for the production of liquid crystal displays
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F2202/00—Materials and properties
- G02F2202/28—Adhesive materials or arrangements
Landscapes
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Nonlinear Science (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- Mathematical Physics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Human Computer Interaction (AREA)
- Polymers & Plastics (AREA)
- Medicinal Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The present invention relates to display adhesive and optical components.The present invention provides a kind of display adhesive, to the high sensitivity of light, remains to be sufficiently hardened even if by low-energy light and high the hardenability of the part of inabundant irradiation.Display adhesive of the invention contains ingredient (A): Photoepolymerizationinitiater initiater shown in following formula (1);And ingredient (B): the display adhesive of photo-polymerization type compound;In formula (1), X indicates to remove substituent group shown in the resulting residue of n hydrogen atom or following formula (1-1) from the saturated hydrocarbons containing circular structure;When X is to remove the resulting residue of n hydrogen atom from the saturated hydrocarbons containing circular structure, n indicates 1 to 6 integer, when X is substituent group shown in formula (1-1), n expression 1.R1To R7Indicate set substituent group;In formula (1-1), R8Indicate alkylidene or arlydene;R9Indicate the alkyl of hydrogen atom or carbon number 1 to 4;Y indicates oxygen atom or sulphur atom.
Description
Technical field
The present invention relates to a kind of display adhesive, in particular to a kind of light containing the compound comprising specific structure
The display adhesive of polymerization initiator and photo-polymerization type compound.Adhesive bonding agent
Background technique
Photocurable resin composition is widely used in display encapsulant, solar cell encapsulant and semiconductor package
Fill the purposes of the electronic components encapsulants such as agent.For the particular use of display encapsulant, it can be mentioned, for example: liquid crystal is used
Sealant or encapsulant, organic el display encapsulant and touch panel adhesive etc., but described on the way, it is desirable that
It is few with outgassing that is excellent indurative while generating, and the common characteristic of damage will not be caused to display component.
Commonly known photocurable resin composition has the advantages that outgassing is few simultaneously with excellent hardenability.However,
Due to not carrying out sclerous reaction in the part that light can not arrive at, therefore use the design of the object part of photocurable resin composition
Freedom degree is limited, this thing is considered as very big disadvantage.
Engineering method liquid crystal sealing agent (hereinafter, being recorded as " liquid crystal sealing agent " or " sealant ") is used on the way under liquid crystal drop,
Can because the wiring part of the multiple substrate of LCD assembly, base plate of color light filter black matrix part due to result from liquid crystal close
Envelope agent does not shine the light shielding part of light, and the bad problem of the display near sealing becomes more deep than in the past also.I.e. because hiding
The presence in light portion and make to be become inadequate by a photogenic underhardening, remained in liquid crystal sealing agent a large amount of unhardened
Ingredient.It is carried out in this case by when post-curing step, will lead to Yin Re caused by heat and promote the unhardened ingredient pair
The dissolution of liquid crystal as a result, and having the bad problem of display caused near sealing.
In addition, display unit and touch sensor are given although motion has in touch panel adhesive applications
Touch panel structure provided made of fitting, wherein the touch sensor is pasted in optical substrates such as the glass plates for being formed with transparent electrode
Made by the transparent protection plate for closing glass system or resin.However, promoting pair of display image in the transparent protection plate
Than and band-like light shielding part is formed in outer most edge, therefore the hardening of the adhesive of light shielding part becomes inadequate, the result is that there is generation aobvious
Show non-uniform problem.
In order to solve this problem, it just improves heat reactivity and carries out various self-criticism.
For example, making the not rapid reaction from low temperature by the adequately hardened liquid crystal sealing agent of light in light shielding part, with suppression
The trial of liquid crystal pollution processed.The open method for using hot radical polymerization initiator of patent document 1 and 2.In addition, patent document 3
Method of the polybasic carboxylic acid as hardening accelerator is used to 5 disclosures.
However, hot radical polymerization initiator efficiency to be made generates free radicals well, molecular weight small must arrive certain
Degree is easy to be dissolved in liquid crystal though the reactivity of low molecular compound is excellent, therefore caused by hot radical polymerization initiator itself
Liquid crystal pollution can become problem.
In addition, also having the situation not being available according to purposes using moisture-proof reliability may be undermined when polybasic carboxylic acid.
Patent document 6 is open to make uv-hardening resin contain organic peroxide, heat after uv irradiation and
Carry out the technology of the hardening of resin of light shielding part part.Damage is caused to liquid crystal display etc. however, having heating stepses
Doubt.In addition, in order to make resin become adequately hardened state, it usually needs 60 minutes or more heating stepses, therefore have production
Property difference problem.
In addition, the outer side surface side of the open forming face from light shielding part of patent document 7 irradiates ultraviolet light and carries out light shielding part
Hardening of resin technology.However, can be difficult to irradiate ultraviolet light from side according to the shape of liquid crystal display, therefore this method
It is restricted.
[existing technical literature]
[patent document]
[patent document 1] Japanese Unexamined Patent Publication 2004-126211 bulletin
[patent document 2] Japanese Unexamined Patent Publication 2009-8754 bulletin
[patent document 3] International Publication 2007/138870
[patent document 4] Japanese Unexamined Patent Publication 2008-15155 bulletin
[patent document 5] Japanese Unexamined Patent Publication 2009-139922 bulletin
[patent document 6] Japanese Patent No. 4711354
[patent document 7] Japanese Unexamined Patent Publication 2009-186954 bulletin.
Summary of the invention
(the invention project to be solved)
The present invention relates to the light by ultraviolet light, luminous ray to irradiate the display adhesive hardened, and the present invention
Even if technical solution remain to adequately hardened display adhesive to the high sensitivity of light, by low-energy light.The bonding
The hardenability of the part of the inabundant irradiation of agent is also high, even and being shone in view of the damage to other components with low-energy light
Penetrating still has sufficient hardenability, therefore can be used for the sealant of liquid crystal display structure cell (Liquid crystal display cell)
Or the displays part purposes such as fitting of encapsulant and touch panel.
(mode for solving project)
It is that the inventors of the present invention attentively examine as a result, discovery by using contain the compound comprising specific structure photopolymerization
The display of initiator and photo-polymerization type compound is able to solve the above problem with adhesive (photocurable resin composition), then
Complete the present invention.
I.e. the present invention relates to following the description:
(1) a kind of display adhesive, contains: ingredient (A): Photoepolymerizationinitiater initiater shown in following formula (1);And ingredient
(B): photo-polymerization type compound;
In formula (1), X indicates to remove the resulting residue of n hydrogen atom or following formula (1- from the saturated hydrocarbons containing circular structure
1) substituent group shown in,
In formula (1-1), R8Indicate alkylidene or arlydene.R9Indicate the alkyl of hydrogen atom or carbon number 1 to 4.Y indicates that oxygen is former
Son, sulphur atom or NR10。R10Indicate the alkyl of hydrogen atom or carbon number 1 to 4.
When X is to remove the resulting residue of n hydrogen atom from the saturated hydrocarbons containing circular structure, the integer of n expression 1 to 6.R1
Indicate hydrogen atom, hydroxyl, alkoxy or other organic groups.R2To R6Separately indicate hydrogen atom, halogen atom, hydroxyl, alkane
Oxygroup, sulfydryl, sulfide base, silylation, silanol group, nitro, nitroso, cyano, sulfinic acid base, sulfonic group, sulfonic acid foundation
(sulfonato), phosphino-, phosphinyl (phosphinyl), phosphono (phosphono), phosphonic acids foundation (phosphonato),
Amido, ammonium or other organic groups, there are multiple each R2To R6Group that can be identical each other or different.In addition, from same
R present on one phenyl ring2To R6In more than the two for selecting can be bonded and form ring structure.R7Indicate hydrogen atom.
When the substituent group shown in X expression (1-1), n indicates 1.R1It indicates hydrogen atom, hydroxyl, alkoxy or other is organic
Group.R2、R3、R5And R6Separately indicate hydrogen atom, halogen atom, hydroxyl, alkoxy, sulfydryl, sulfide base, silylation,
Silanol group, nitro, nitroso, cyano, sulfinic acid base, sulfonic group, sulfonic acid foundation, phosphino-, phosphinyl, phosphono, phosphonic acids foundation,
Amido, ammonium or other organic groups, there are multiple each R2、R3、R5And R6Group that can be identical each other or different.In addition,
In R present on same phenyl ring2With R3It can be bonded and be formed ring structure, in R present on same phenyl ring5With R6Simultaneously shape can be bonded
At ring structure.R4In an expression sulfur-bearing ehter bond organic group, others indicate the organic groups of hydrogen atoms or sulfur-bearing ehter bond.This
Outside, R4The organic group of represented sulfur-bearing ehter bond can be with R3Or R5It is bonded and forms ring structure.R7Indicate hydrogen atom or carbon number 1 to 4
Alkyl.
(2) the display adhesive as described in preceding paragraph (1), wherein X is substituent group shown in formula (1-1).
(3) the display adhesive as described in preceding paragraph (1), wherein X is to remove n from the saturated hydrocarbons containing circular structure
The resulting residue of hydrogen atom.
(4) the display adhesive as described in preceding paragraph (3), wherein compound shown in formula (1) is shown in following formula (2)
Compound,
In formula (2), R1To R6It indicates and the R in preceding paragraph (1) described above-mentioned formula (1)1To R6Identical meaning.A indicates sub- ring
Alkane (cycloalkylene) base.D indicates alkylidene.
(5) the display adhesive as described in any one of preceding paragraph (1) to (4), wherein the ingredient (B) include at
Divide (B-1): acyclic compound and/or (methyl) acyclic compound.
(6) the display adhesive as described in preceding paragraph (5), wherein the ingredient (B-1) includes acrylate monomer
And/or (methyl) acrylate monomer.
(7) the display adhesive as described in preceding paragraph (5), wherein the ingredient (B-1) includes selected from by amine ester (first
Base) acrylate oligomer, (methyl) acrylate oligomer with polyisoprene skeleton and have polybutadiene skeleton
One or more of the group that is constituted of (methyl) acrylate oligomer (methyl) acrylate oligomer.
(8) the display adhesive as described in any one of preceding paragraph (1) to (4), wherein the ingredient (B) include at
Divide (B-2): epoxide.
(9) the display adhesive as described in any one of preceding paragraph (1) to (4) also contains ingredient (C): organic filler
And/or ingredient (D): inorganic filler.
(10) the display adhesive as described in preceding paragraph (9), wherein the ingredient (C) includes selected from by amine ester particle
One of the group that son, acrylic particles, styrene particulate, styrene alkene particulate and poly- silicon oxygen particulate are constituted
Above organic filler.
(11) the display adhesive as described in any one of preceding paragraph (1) to (4) also contains ingredient (E): silane coupling
Agent.
(12) a kind of optical component is formed comprising display described in any one of preceding paragraph (1) to (11) with adhesive
Hardening thing.
(13) a kind of touch panel has optical component described in preceding paragraph (12).
(14) a kind of liquid crystal sealing agent or liquid crystal display structure cell encapsulant use any one of preceding paragraph (1) to (11)
The display adhesive.And
(15) a kind of liquid crystal display structure cell includes liquid crystal sealing agent described in preceding paragraph (14) or the encapsulation of liquid crystal display structure cell
Dosage form at hardening thing.
(The effect of invention)
Even if display of the invention still shows sufficient hardenability by low-energy light with adhesive, therefore has for liquid crystal
The sealant or encapsulant and the fitting of touch panel etc. of display structure cell have the display part purposes of shading light part.
Detailed description of the invention
The signal for the step of Fig. 1 (a), Fig. 1 (b) and Fig. 1 (c) are the embodiments to manufacture optical component of the invention
Figure.
Fig. 2 is the schematic diagram for indicating the constructive embodiment of optical component of the invention.
Fig. 3 (a) is the effect picture that only UV irradiates of embodiment 1 of display adhesive of the invention.
Fig. 3 (b) is the effect picture that only UV irradiates of comparative example 1 of display adhesive of the invention.
Fig. 3 (c) be display adhesive of the invention embodiment 1 UV irradiation after, 120 DEG C thermmohardening 1 hour
Effect picture.
Fig. 3 (d) be display adhesive of the invention comparative example 1 UV irradiation after, 120 DEG C thermmohardening 1 hour
Effect picture.
Fig. 4 (a) be display adhesive of the invention embodiment 2 UV irradiation after, 120 DEG C thermmohardening 1 hour
Effect picture.
Fig. 4 (b) be display adhesive of the invention embodiment 3 UV irradiation after, 120 DEG C thermmohardening 1 hour
Effect picture.
Fig. 4 (c) be display adhesive of the invention embodiment 4 UV irradiation after, 120 DEG C thermmohardening 1 hour
Effect picture.
Fig. 4 (d) be display adhesive of the invention comparative example 2 UV irradiation after, 120 DEG C thermmohardening 1 hour
Effect picture.
Description of symbols
1 liquid crystal display
2 transparent substrates with light shielding part
3 transparent substrates
4 light shielding parts
5 display adhesives
The 6 hardening nitride layer with uncured part
7 hardening of resin nitride layer
8 ultraviolet lights.
Specific embodiment
[Photoepolymerizationinitiater initiater of the ingredient (A) containing compound shown in formula (1)]
Photoepolymerizationinitiater initiater contained by display adhesive of the invention (ingredient (A)) contains following formula (1) shownization
Close object.
In formula (1), X is indicated from the saturated hydrocarbons removal resulting residue of n hydrogen atom containing circular structure (hereinafter, also referred to as
For " saturation hydrocarbon residue ") or following formula (1-1) shown in substituent group.
In formula (1-1), R8Indicate alkylidene or arlydene.R9Indicate the alkyl of hydrogen atom or carbon number 1 to 4.Y indicates that oxygen is former
Son, sulphur atom or NR10。R10Indicate the alkyl of hydrogen atom or carbon number 1 to 4.
In compound shown in formula (1), when X indicates saturation hydrocarbon residue and when expression (1-1), R1To R7And n expression
Meaning is different, hereinafter, being divided into situation (i) with (ii) to illustrate.
(i) X indicates the case where removing n hydrogen atom resulting residue from the saturated hydrocarbons containing circular structure
For being saturated ring structure contained by hydrocarbon residue represented by X, three to ten Yuans ring filling hydrocarbon, the saturation can be enumerated
Ring structure contained by hydrocarbon residue is one or more.It can be enumerated with regard to the concrete example of ring structure contained by saturation hydrocarbon residue: ring
The structures such as propane ring, cyclobutane ring, pentamethylene ring, cyclohexane ring, adamantane ring.The ring structure can have substituent group.
When X indicates to remove n hydrogen atom resulting residue from the saturated hydrocarbons containing circular structure, the integer of n expression 1 to 6.Compared with
Preferably n is 2 (integers).
Illustrate that X indicates R when removing the resulting residue of n hydrogen atom from the saturated hydrocarbons containing circular structure1To R7。
In formula (1), R1Indicate hydrogen atom, hydroxyl, alkoxy or other organic groups.
The R of formula (1)1Represented alkoxy is more preferably the alkoxy of carbon number 1 to 18, for its concrete example, can be arranged
It lifts: methoxyl group, ethyoxyl, positive propoxy, isopropoxy, n-butoxy, isobutoxy, sec-butoxy, tert-butoxy, positive penta oxygen
Base, isoamoxy, neopentyl oxygen, positive hexyloxy and positive dodecyl oxygroup etc..
With regard to the R of formula (1)1For the concrete example of represented organic group, can enumerate: the alkyl of carbon number 1 to 18, carbon number 2 to
18 alkenyl, the alkynyl of carbon number 2 to 18, the aryl of carbon number 6 to 12, the acyl group of carbon number 1 to 18, the aroyl of carbon number 7 to 18, nitre
Base, cyano, the alkylthio group of carbon number 1 to 18 and halogen atom, substituted or unsubstituted amido etc..
With regard to the R as formula (1)1For the alkyl of the carbon number 1 to 18 of the concrete example of represented organic group, it can enumerate: first
It is base, ethyl, n-propyl, isopropyl, normal-butyl, isobutyl group, sec-butyl, tert-butyl, n-pentyl, n-hexyl, n-heptyl, just pungent
The straight-chains such as base, n-nonyl, positive decyl, positive hendecyl and positive dodecyl or branch's chain state alkyl and cyclopropyl, cyclobutyl,
The cyclic alkyls such as cyclopenta and cyclohexyl are more preferably the alkyl of carbon number 2 to 6, more preferably the straight-chain of carbon number 2 to 6 or point
Branched-chain alkyl.
With regard to the R as formula (1)1For the alkenyl of the carbon number 2 to 18 of the concrete example of represented organic group, it can enumerate: second
Alkenyl, acrylic, 1- cyclobutenyl, isobutenyl, 1- pentenyl, 2- pentenyl, 2-methyl-1-butene alkenyl, 3-methyl-1-butene
Base, 2- methyl-2-butene base, 2,2- dicyanoethenyl, 2- cyano -2- methyl carboxy vinyl and 2- cyano -2- methyl sulfone
Vinyl etc..
With regard to the R as formula (1)1For the alkynyl of the carbon number 2 to 18 of the concrete example of represented organic group, acetylene can be enumerated
Base, 1- propinyl and 1- butynyl etc..
With regard to the R as formula (1)1For the aryl of the carbon number 6 to 12 of the concrete example of represented organic group, benzene can be enumerated
Base, naphthalene and tolyl etc. are more preferably the aryl of carbon number 6 to 10.
With regard to the R as formula (1)1For the acyl group of the carbon number 1 to 18 of the concrete example of represented organic group, it can enumerate: first
Acyl group, acetyl group, ethylcarbonyl group, n-propyl carbonyl, Isopropylcarbonyl, n-butylcarbonyl, n-pentylcarbonyl, isopentyl carbonyl,
Neopentyl carbonyl, 2- methylbutylcarbonyl and nitrobenzene methyl carbonyl etc..
With regard to the R as formula (1)1For the aroyl of the carbon number 7 to 18 of the concrete example of represented organic group, benzene can be enumerated
Formoxyl, toluyl groups, naphthoyl and phthalyl etc..
With regard to the R as formula (1)1For the alkylthio group of the carbon number 1 to 18 of the concrete example of represented organic group, it can enumerate:
Methyl mercapto, ethylmercapto group, positive rosickyite base, isopropyisulfanyl, positive butylthio, isobutylthio, secondary butylthio, tertiary butylthio, positive penta sulfenyl,
Isopentylthio, 2- methylbutylthio, 1- methylbutylthio, new penta sulfenyl, 1,2- dimethyl propylene sulfenyl and 1,1- dimethyl rosickyite
Base etc..
With regard to the R as formula (1)1For the halogen atom of the concrete example of represented organic group, it is former that fluorine atom, chlorine can be enumerated
Son, bromine atom and iodine atom.
R in formula (1)1It is more preferably hydroxyl, alkoxy or dialkyl group substituted amido, more preferably hydroxyl, carbon number 1 to 18
Alkoxy or dialkyl group substituted amido (carbon number of a substitution alkyl is 1 to 12), still more preferably from hydroxyl, carbon number 1 to 6
Alkoxy or dialkyl group substituted amido (carbon number of a substitution alkyl is 1 to 6), are particularly preferably hydroxyl, the alcoxyl of carbon number 1 to 4
Base or dialkyl group substituted amido (carbon number of a substitution alkyl is 1 to 4), most preferably hydroxyl.
In formula (1), R2To R6Separately indicate hydrogen atom, halogen atom, hydroxyl, alkoxy, sulfydryl, sulfide base, silicon
Alkyl, silanol group, nitro, nitroso, cyano, sulfinic acid base, sulfonic group, sulfonic acid foundation, phosphino-, phosphinyl, phosphono, phosphonic acids
Foundation, amido, ammonium or other organic groups, there are multiple each R2To R6Group that can be identical each other or different.In addition,
From in R present on same phenyl ring2To R6In more than the two for selecting can be bonded and be formed ring structure, which may include miscellaneous
The bond of atom.
With regard to the R of formula (1)2To R6For represented halogen atom, it can enumerate and the R as formula (1)1Represented organic group
Concrete example the identical halogen atom of halogen atom.
With regard to the R of formula (1)2To R6For represented alkoxy, it can enumerate and the R of formula (1)1Represented alkoxy is identical
Alkoxy.
With regard to the R of formula (1)2To R6It for the concrete example of represented organic group, can enumerate: alkyl, aryl, aralkyl, halogenation
Alkyl, isocyano group, cyanato- (cyanato group), isocyanate group (isocyanato group), thiocyano, isothiocyano,
Alkoxy carbonyl, amine formyl, amine formyl sulfide base, carboxyl, carboxylate, acyl group, acyloxy, hydroxyl imide base etc..
With regard to the R as formula (1)2To R6For the alkyl of the concrete example of represented organic group, aryl and acyl group, it can enumerate
With the R as formula (1)1The alkyl of the concrete example of represented organic group, aryl and the identical alkyl of acyl group, aryl and acyl group.
The organic group can bond containing hetero atom other than hydrocarbon etc. in the organic group, and the organic group can have
Substituent group other than alkyl, the either straight-chain or branch's chain state all may be used.R2To R6In organic group be usually that monovalence is organic
Base, but when forming aftermentioned cyclic structure etc., the above organic group of divalent can be become.
The R of formula (1)2To R6Bond other than the alkyl that represented organic group can contain in its structure, as long as will not damage
And effect of the present invention is not particularly limited, but it can be mentioned, for example: ehter bond, thioether bond, carbonyl key, thion key, ester bond, amido bond, amine
Ester bond, carbonic acid ester bond, sulphonyl key, sulfenyl key, azo bond etc..For an example, when the alkyl for belonging to organic group includes thioether
" organic group containing the bond other than alkyl " when key can enumerate alkylthio group, alkylthio group alkylidene and mercaptan and replace alkyl.Just
For the point of heat resistance, the bond other than alkyl in organic group be more preferably ehter bond, thioether bond, carbonyl key, thion key, ester bond,
Amido bond, amine ester bond, imine linkage (- N=C (- R)-,-C (=NR)-: here, R is hydrogen atom or organic group), carbonic acid ester bond, sulphur
Acyl key, sulfenyl key.
The R of formula (1)2To R6Substituent group other than the alkyl that represented organic group can contain in its structure, as long as will not
Effect of the present invention is undermined to be not particularly limited, it can be mentioned, for example: halogen atom, hydroxyl, sulfydryl, sulfide base, cyano, isocyano group,
Cyanato-, isocyanate group, thiocyano, isothiocyano, silylation, silanol group, alkoxy, alkoxy carbonyl, amine formyl, amine sulphur
Formoxyl, nitro, nitroso, carboxyl, carboxylate, acyl group, acyloxy, sulfinic acid base, sulfonic group, sulfonic acid foundation, phosphino-, oxygen
Phosphino-, phosphono, phosphonic acids foundation, hydroxyl imide base, saturation or unsaturated alkyl ether, saturation or unsaturated alkyl sulfenyl ether
Base, aryl ether and artyl sulfo ether, amido (- NH2,-NHR ,-NRR ': here, R and R ' separately be alkyl),
Ammonium etc..Hydrogen atom contained by substituent group described above can replace through alkyl.In addition, alkyl contained by substituent group described above can
For any one of straight-chain, branch's chain state and ring-type.Wherein, with regard to R2To R6Represented organic group can contain in its structure
Alkyl other than substituent group for, be more preferably halogen atom, hydroxyl, sulfydryl, sulfide base, cyano, isocyano group, cyanato-,
Isocyanate group, thiocyano, isothiocyano, silylation, silanol group, alkoxy, alkoxy carbonyl, amine formyl, amine formyl sulfide base,
Nitro, nitroso, carboxyl, carboxylate, acyl group, acyloxy, sulfinic acid base, sulfonic group, sulfonic acid foundation, phosphino-, phosphinyl, phosphine
Acyl group, phosphonic acids foundation, hydroxyl imide base, saturation or unsaturated alkyl ether, saturation or unsaturated alkyl sulfenyl ether, aryl ether
Base and artyl sulfo ether.
In addition, R2To R6Both of above can be bonded and become cyclic structure.The cyclic structure can be saturation or insatiable hunger
With ester ring type hydrocarbon, heterocycle and condensed ring and two or more group in the group being made of the ester ring type hydrocarbon, heterocycle and condensed ring
Structure made of conjunction.Such as R2To R6Both of above can be bonded and share R2To R6The atom on phenyl ring that is bonded and shape
At condensed ring such as naphthalene, anthracene, phenanthrene, indenes.
The X of formula (1) is when removing the resulting residue of n hydrogen atom from the saturated hydrocarbons containing circular structure, more preferably to take
For base R2To R6Middle importing 1 or more substituent group (for changing, R2To R6And not all is all hydrogen atom).That is R2To R6In at least
1 can have halogen atom, hydroxyl, sulfydryl, sulfide base, silylation, silanol group, nitro, nitroso, sulfinic acid base, sulfonic group,
Sulfonic acid foundation, phosphino-, phosphinyl, phosphono, phosphonic acids foundation, amido, ammonium or other organic groups.By in substituent R2Extremely
R6Middle importing at least one substituent group as described above can adjust the wavelength of the light absorbed, can also be absorbed by importing substituent group
Desired wavelength.In addition, the substituent group of the conjugated chain of aromatic ring can be extended by importing, absorbing wavelength can be converted to length
Wavelength.In particular, for can absorbing and being substantially converted to the point of long wavelength, more preferably for by the sulfydryl of sulfur atom-containing, sulfide
Base, which imports, is used as substituent R2To R6The case where.In addition, dissolubility can be promoted, mix with combined macromolecule predecessor by having
The situation of property.Also there is the absorbing wavelength it is contemplated that combined macromolecule predecessor as a result, while promoting display and using and gluing
The situation of the sensitivity of the composition of mixture.
With regard to the R of formula (1)2To R6It for the more preferably concrete example of represented organic group, can enumerate: methyl, ethyl, propyl
The alkyl of equal carbon numbers 1 to 20;The naphthenic base of the carbon numbers 4 to 23 such as cyclopenta, cyclohexyl;The carbon numbers such as cyclopentenyl, cyclohexenyl group 4 to
23 cycloalkenyl;The aryloxy alkyl (- ROAr of the carbon numbers 7 to 26 such as phenoxymethyl, 2- Phenoxyethyl, 4- phenoxy group butyl
Base);The aralkyl of the carbon numbers 7 to 20 such as benzyl, 3- phenyl propyl;Cyano methyl, beta-cyano ethyl etc. have the carbon number 2 of cyano
To 21 alkyl;Hydroxymethyl etc. has the alkyl of the carbon number 1 to 20 of hydroxyl;The alcoxyl of the carbon numbers 1 to 20 such as methoxyl group, ethyoxyl
Base;Acetamido, benzene sulfonamido (C6H5SO2NH2) etc. carbon numbers 2 to 21 amide groups;The carbon numbers such as methyl mercapto, ethylmercapto group 1 to
20 alkylthio group (- SR base);The acyl group of the carbon numbers 1 to 20 such as acetyl group, benzoyl;The carbon numbers such as methoxycarbonyl, acetoxyl group 2
To 21 ester group (- COOR base and-OCOR base);The aryl of the carbon numbers 6 to 20 such as phenyl, naphthalene, xenyl, tolyl;Through pushing away electricity
The aryl for the carbon number 6 to 20 that subbase and/or electron withdrawing group replace;Pushed away benzyl, cyanogen that electronics base and/or electron withdrawing group replace
Base and methyl mercapto (- SCH3).In addition, the moieties can be straight-chain, branch's chain state or ring-type.
In addition, the X of formula (1) is R when removing the resulting residue of n hydrogen atom from the saturated hydrocarbons containing circular structure2To R6,
For the point of absorbing wavelength meeting long wavelengthization, also it is bonded with above-mentioned 2 or more and shares R2To R6On the phenyl ring being bonded
Atom and for more preferably the case where form the condensed ring such as naphthalene, anthracene, phenanthrene or indenes.
In addition, and R2To R6In the compound of not hydroxyl compare, in R2To R6Middle at least one is the compound of hydroxyl
In the case of, the dissolubility of alkaline aqueous solution etc. is promoted, the absorbing wavelength of compound shown in same up-to-date style (1) can long wavelengthization.
R in formula (1)2To R6More preferably being is all hydrogen atom or R2、R3、R5And R6For hydrogen atom and R4For alkane
The organic group of oxygroup or sulfur-bearing ehter bond.
More specifically, the X of formula (1) is formula when removing n hydrogen atom resulting residue from the saturated hydrocarbons containing circular structure
(1) R in2To R6More preferably being is all hydrogen atom or R2、R3、R5And R6For hydrogen atom and R4For alkoxy.
In addition, the X of formula (1) is when removing the resulting residue of n hydrogen atom from the saturated hydrocarbons containing circular structure, in formula (1)
R7Indicate hydrogen atom.
(ii) the case where substituent group shown in X expression (1-1)
Firstly, illustrating substituent group shown in following formula represented by X (1-1).
In formula (1-1), R8Indicate alkylidene or arlydene.
The R of formula (1-1)8Represented alkylidene, which refers to from saturated hydrocarbons, removes two resulting bivalence linking bases of hydrogen atom,
Other than the saturated hydrocarbons is if ring-type, be then not limited to any of straight-chain or branch's chain state, but more preferably for from carbon number 1 to
6 straight-chain or the saturated hydrocarbons of branch's chain state remove two resulting bivalence linking bases of hydrogen atom, more preferably from carbon number 1 to 4
Straight-chain or branch's chain state saturated hydrocarbyl in remove two resulting bivalence linking bases of hydrogen atom, still more preferably from methylene
Base, ethylidene or sub- n-propyl.
The R of formula (1-1)8Represented arlydene refers to two hydrogen atoms resulting two of removal from aromatic hydrocarbon compound
Valence concatenating group.For the concrete example for the aromatic hydrocarbon compound that arlydene can be become, benzene, naphthalene, anthracene, phenanthrene, pyrene and Fluorene can be enumerated
Deng.
With regard to the R of formula (1-1)9For the alkyl of represented carbon number 1 to 4, it can enumerate in the R as formula (1)1Represented
The alkyl that carbon number is 1 to 4 in the alkyl recorded in the paragraph of the alkyl of the carbon number 1 to 18 of the concrete example of organic group.
With regard to the R in formula (1-1)9For, more preferably to be separately hydrogen atom or methyl.
In formula (1-1), Y indicates oxygen atom, sulphur atom or NR10, R10Indicate the alkyl of hydrogen atom or carbon number 1 to 4.
With regard to R10For the alkyl of represented carbon number 1 to 4, it can enumerate in the R as formula (1)1Represented organic group
The alkyl that carbon number is 1 to 4 in the alkyl recorded in the paragraph of the alkyl of the carbon number 1 to 18 of concrete example.
It is more preferably oxygen atom or sulphur atom, more preferably oxygen atom for the Y in formula (1-1).
Illustrate R when X is substituent group shown in formula (1-1)1To R7。
When X is substituent group shown in formula (1-1), R1Indicate hydrogen atom, hydroxyl, alkoxy or other organic groups.R1It is specific
Example can be enumerated and above-mentioned " (i) X indicates the case where removing n hydrogen atom resulting residue from the saturated hydrocarbons containing circular structure " place
The R of explanation1The identical organic group of the concrete example of represented organic group.
In addition, the R for preferred embodiment, when the X of formula (1) is substituent group shown in formula (1-1), in formula (1)1More preferably
For hydroxyl or alkoxy, the more preferably alkoxy of hydroxyl or carbon number 1 to 6, still more preferably from hydroxyl or the alcoxyl of carbon number 1 to 4
Base is particularly preferably hydroxyl.
When X is substituent group shown in formula (1-1), R2、R3、R5And R6Separately indicate hydrogen atom, halogen atom, hydroxyl, alkane
Oxygroup, sulfydryl, sulfide base, silylation, silanol group, nitro, nitroso, cyano, sulfinic acid base, sulfonic group, sulfonic acid foundation,
Phosphino-, phosphinyl, phosphono, phosphonic acids foundation, amido, ammonium or other organic groups, there are multiple each R2、R3、R5And R6
Group that can be identical each other or different.In R present on same phenyl ring2With R3It can be bonded and be formed ring structure, on same phenyl ring
Existing R5With R6It can be bonded and form ring structure.
R2、R3、R5And R6Concrete example can enumerate with it is above-mentioned " (i) X indicate from containing circular structure saturated hydrocarbons remove n hydrogen
The case where atom resulting residue " R that illustrates of place2To R6The identical example of concrete example.
When the X of formula (1) is substituent group shown in formula (1-1), R4Separately indicate the organic of hydrogen atom or sulfur-bearing ehter bond
Base, but R4In at least one be sulfur-bearing ehter bond organic group.That is R4In one expression sulfur-bearing ehter bond organic group, other tables
Show the organic group of hydrogen atom or sulfur-bearing ehter bond.In addition, R4The organic group of represented sulfur-bearing ehter bond can be with R3Or R5It is bonded and is formed
Ring structure.
For organic group described herein, can enumerate with it is above-mentioned " (i) X indicate from containing circular structure saturated hydrocarbons remove n
The case where a hydrogen atom resulting residue " R that illustrates of place2To R6The identical organic group of organic group, but more preferably for alkyl or
Aryl.R when being substituent group shown in formula (1-1) with regard to the X of formula (1)4For, it is more preferably alkylthio group or fragrant sulphur at least one
Base, more preferably at least one alkylthio group for carbon number 1 to 20.
R4For sulfur-bearing ehter bond organic group when, R4It can be with R3Or R5It is bonded and forms cyclic structure.R4With R3Or R5Bond is simultaneously
The cyclic structure of formation can be saturation or unsaturated ester ring type hydrocarbon, heterocycle and condensed ring, and selected from by the ester ring type hydrocarbon, heterocycle and
Structure made of combined by two or more in the group that condensed ring is constituted.
When X is substituent group shown in formula (1-1), R7Indicate the alkyl of hydrogen atom or carbon number 1 to 4, R7There are it is multiple when, it is each
R7Group that can be identical each other or different.But the X of formula (1) is to remove obtained by n hydrogen atom from the saturated hydrocarbons containing circular structure
Residue when, R7Indicate hydrogen atom.
With regard to the R of formula (1)7For the alkyl of represented carbon number 1 to 4, it can enumerate in the R as formula (1)1Represented has
The alkyl that carbon number is 1 to 4 in the alkyl recorded in the paragraph of the alkyl of the carbon number 1 to 18 of the concrete example of machine base.
With regard to the R in formula (1)7For, more preferably to be separately hydrogen atom or methyl.
When X is substituent group shown in formula (1-1), n indicates 1 (integer).
[preferred embodiment of formula (1)]
For the compound shown in formula (1), more preferably compound shown in following formula (2) or (3).
Formula (2) first.
In formula (2), R1To R6It indicates and above-mentioned " (i) X indicates to remove n hydrogen atom gained from the saturated hydrocarbons containing circular structure
Residue the case where " R in the formula (1) that illustrates of place1To R6Identical meaning, more preferably also with above-mentioned " X is indicated from containing ring
The saturated hydrocarbons of structure removes the case where n hydrogen atom resulting residue " R in the formula (1) that illustrates of place1To R6It is identical.A in formula
Indicate cycloalkylidene.D indicates alkylidene.
Cycloalkylidene represented by the A of formula (2) refers to from cyclopropane ring, cyclobutane ring, pentamethylene ring, cyclohexane ring and gold
The saturated cyclics hydrocarbon such as rigid alkane ring remove 2 resulting bivalence linking bases of hydrogen atom, are more preferably 1,3- cyclopentylene or Isosorbide-5-Nitrae-Asia
Cyclohexyl, more preferably 1 or 4 cyclohexylidene.
Alkylidene represented by the D of formula (2) refers to from saturated aliphatic hydrocarbon (such as methane, ethane, propane, butane, penta
Alkane, hexane, heptane and octane etc.) two resulting bivalence linking bases of hydrogen atom of middle removal are more preferably the alkylene of carbon number 1 to 18
Base, the more preferably alkylidene of carbon number 1 to 12, still more preferably from straight-chain alkylidene (the specifically methylene of carbon number 1 to 8
Base, ethylidene, propylidene, butylidene, pentylidene, hexylidene, heptamethylene and octamethylene), it is particularly preferably the alkylene of carbon number 1 to 4
Base, the most preferably alkylidene (i.e. methylene) of carbon number 1.
I.e. shown in formula (2) for compound, more preferably compound shown in following formula (2-1).
In formula (2-1), R1To R6It indicates and the R in formula (2)1To R6(i.e. above-mentioned " (i) X is indicated from full containing circular structure
The R in formula (1) that the case where removing n hydrogen atom resulting residue with hydrocarbon " place illustrates1To R6) identical meaning, more preferably
Also with the R in formula (2)1To R6(i.e. above-mentioned " (i) X indicates to remove the resulting residue of n hydrogen atom from the saturated hydrocarbons containing circular structure
The case where " R in the formula (1) that illustrates of place1To R6) identical.
Secondly formula (3).Formula (3) is as described below.
In formula (3), R1To R3And R5To R6Indicate with it is above-mentioned " (i) X indicate from containing circular structure saturated hydrocarbons remove n hydrogen
R in the case where atom resulting residue " formula (1) for illustrating of place1To R3And R5To R6Identical meaning, more preferably also with it is upper
State the formula (1) that " (i) X indicates the case where removing n hydrogen atom resulting residue from the saturated hydrocarbons containing circular structure " place illustrates
In R1To R3And R5To R6It is identical.Such as the explanation in above-mentioned " the case where substituent group shown in (ii) X expression (1-1) ", R7Table
Show that the alkyl of hydrogen atom or carbon number 1 to 4, concrete example are also identical.
In formula (3), R4In an expression sulfur-bearing ehter bond organic group, others indicate having for hydrogen atoms or sulfur-bearing ehter bond
Machine base.In addition, R4The organic group of represented sulfur-bearing ehter bond can be with R3Or R5It is bonded and forms ring structure.
For organic group described herein, the R with the formula (1) can be enumerated2To R6Represented organic group is identical to be had
Machine base, but be more preferably alkyl or aryl.I.e. with regard to the R of formula (1)4For, it is more preferably alkylthio group or arylthio, more preferably carbon
The alkylthio group of number 1 to 20.
R4The organic group and R of represented sulfur-bearing ehter bond3Or R5It is bonded and the cyclic structure formed can be saturation or unsaturation
Ester ring type hydrocarbon, heterocycle and condensed ring, and it is two or more in the group formed by the ester ring type hydrocarbon, heterocycle and condensed ring
The structure being composed.
In formula (3), R8、R9And Y (NR represented by Y10In R10) indicate and the R in substituent group shown in formula (1-1)8、R9And
Y (NR represented by Y10In R10) identical meaning, more preferably also with the R in substituent group shown in formula (1-1)8、R9And Y (Y institute table
The NR shown10In R10) identical.
[reaction of compound shown in formula (1)]
Compound shown in formula (1) with cleavage reaction and can be taken off by irradiation active energy ray mode as shown in following formula
Carboxylic reacts and generates free radical and alkali compounds, and starts have radically polymerizable group by the free radical of the generation
The free radical polymerization of macromolecule predecessor, therefore belong to as Photoepolymerizationinitiater initiater and play a role.In addition, being produced simultaneously with free radical
Raw alkali compounds is not merely able to carry out cross-linking reaction with aftermentioned macromolecule predecessor, can also pass through the catalysis of the alkali of the generation
Agent acts on and reduces the hardening initiation temperature of macromolecule predecessor.
In particular, the case where compound shown in formula (3), level-one possessed by the alkali compounds generated together with free radical
Or secondary amine also has the reactivity with macromolecule predecessor, therefore can prevent from being firmly embedded in the cross-linked structure of hardening thing simultaneously
It is dissolved out as unreacted reactant.
Compound shown in formula (1) can be synthesized using known method, such as using J.Photopolym.Sci.Technol
Method documented by 27,2,2014 synthesizes.For example, can be by making benzene shown in following formula (21) in the presence of metal hydroxides
Acyloin Derivatives and polyformaldehyde class react at room temperature 30 minutes and production (22) shown in after midbody compound, in tin, lead
The midbody compound is set to react and obtain with isocyanates in the presence of the catalyst of equal organic compounds, but formula (1) shownization
The synthetic method for closing object is not limited to the method.For the high compound of crystallinity, method for refining is suitably for crystallization.Alternatively,
It can be refined and being cleaned with solvent etc..In addition, X, R in formula (21) and (22)1To R7And n is indicated and X, R in formula (1)1Extremely
R7And the identical meaning of n.
Though the concrete example of compound shown in formula (1) is shown in following formula (A) to (t), the present invention is not limited to the tools
Body example.
It is just workable when the X for synthesizing formula (1) is the compound of substituent group shown in formula (1-1) that more preferably there is alkene
It for the isocyanates of unsaturated group, can enumerate: methacrylic acid 2- isocyanatoethyl methacrylate and acrylic acid 2- isocyanate group second
Ester etc. has the acryloyl groups such as the isocyanatoalkyl ester of the carboxylic acids of alkene unsaturated group, methacryloyl isocyanate different
Other alkene unsaturated isocyanates such as compound documented by cyanate and U.S. Patent No. 5,130,347 (Mitra)
Functional monomer.In the isocyanates with alkene unsaturated group, methacrylic acid 2- isocyanatoethyl methacrylate (IEM) because
Its utilizability and be more preferably.To those skilled in the art, modulation has the isocyanates of alkene unsaturated group
When to be able to use many electrophilicities and nucleophilic functional groups be obvious to a thing.
In display adhesive of the invention, ingredient (A) can be used alone or mix two or more and uses.Mixing
It is two or more and in use, can hybrid (1) two or more compounds for being included and use, if effect of the present invention will not be undermined
The range of fruit, then Photoepolymerizationinitiater initiater other than hybrid (1) and even use.
Can be mixed with compound shown in formula (1) and Photoepolymerizationinitiater initiater for, it can be mentioned, for example 1- hydroxyl rings
Hexyl phenyl ketone (Irgacure 184;BASF system), 2- hydroxy-2-methyl -1- phenyl-propan -1- ketone (Darocur 1173;
BASF system), 1- [4- (2- hydroxyl-oxethyl)-phenyl -] -2- hydroxy-2-methyl -1- propane -1- ketone (Irgacure 2959;
BASF system), phenylglyoxalates methyl ester (Darocur MBF;BASF system) etc..
In addition, compound shown in formula (1) can be mixed with hydrogen-abstraction optical free radical polymerization initiator and used.Hydrogen-abstraction light
Radical polymerization initiator, which refers to, by the irradiation of ultraviolet light, visible light to be seized the hydrogen of other molecules and is generated free radicals
The cracking type optical free radical polymerization initiator of Photoepolymerizationinitiater initiater, the mechanism generated free radicals and the compound as shown in formula (1)
The mechanism generated free radicals is not identical.Made and mixing free radical generation mechanism so different Photoepolymerizationinitiater initiater
With the photoreactivity of display adhesive of the invention can be improved.
For hydrogen-abstraction optical free radical polymerization initiator, it can be mentioned, for example: benzophenone, acridone, 2- ethyl hydrazine,
2- chlorothiaxanthenone, 2- isopropyl anthraquinone, 2,4- diethyl thioxanthone etc..
In addition, intramolecular documented by such as International Publication 2012/011220 has the thioxanthone chemical combination of reactive base
Object can also be mixed with compound shown in formula (1) and be used.
For the content of the ingredient (A) in display adhesive of the invention, in the solid of display adhesive
It is usually 0.1 to 95 quality % in ingredient (ingredient in addition to solvents), is more preferably 0.5 to 60 quality %.Photopolymerization is drawn
When sending out the content of agent not up to 0.1 mass %, the anxiety that the deliquescent comparison of exposure portion and unexposed portion can not be allowed sufficiently large is had,
When more than 95 mass %, the every characteristic for having the hardening thing of sensing optical activity resin combination becomes difficult to the anxiety shown.
In addition, when being combined with aftermentioned epoxide etc., using logical from the ingredient (A) containing compound shown in formula (1)
When crossing light irradiation and the alkali compounds of generation as curing agent, the ingredient (A) in the solid component of display adhesive
Content is usually 0.1 to 95 quality %, is more preferably 0.5 to 60 quality %.
[ingredient (B) photo-polymerization type compound]
Display of the invention use adhesive contain photo-polymerization type compound as ingredient (B) (hereinafter, also referred to as " at
Divide (B) ").
For ingredient (B), if the compound hardened by light, heat etc. i.e. be not particularly limited, but more preferably for containing
There is (B-1): (methyl) acyclic compound.For ingredient (B-1), it can be mentioned, for example: (methyl) acrylate monomer, amine ester
(methyl) acrylate oligomer, has polybutadiene bone at (methyl) acrylate oligomer with polyisoprene skeleton
(methyl) acrylate oligomer, (methyl) acrylate compounds and epoxy group (methyl) acrylate compounds of frame etc..
In addition, " (methyl) acrylic acid " means " acrylic acid and/or methacrylic acid ", " (methyl) propylene in this specification
Acyl group " means " acryloyl group and/or methylacryloyl ".
[ingredient (B-1) (methyl) acyclic compound]
As ingredient (B-1), (methyl) acrylate monomer of (methyl) acyclic compound can be to have 1 in a molecule
With (methyl) propylene of multiple (methyl) acryloyl groups in (methyl) acrylate and a molecule of a (methyl) acryloyl group
Any one of acid esters.
For the concrete example of (methyl) acrylate in a molecule with 1 (methyl) acryloyl group, it can enumerate:
(methyl) Isooctyl acrylate monomer, (methyl) isoamyl acrylate, (methyl) lauryl acrylate, (methyl) isodecyl acrylate,
(methyl) stearyl acrylate, (methyl) acrylic acid cetyl, the different myristin of (methyl) acrylic acid, (methyl) acrylic acid are different hard
Arrcostab, (methyl) benzyl acrylate, (first of (methyl) the acrylic acid carbon numbers 5 to 25 such as rouge ester, (methyl) tridecyl acrylate
Base) tetrahydrofurfuryl acrylate, acryloyl morpholine, (methyl) phenylethyl polyglycidyl, tristane (methyl) acrylic acid
Ester, acrylic acid dicyclopentenyl ester, (methyl) acrylic acid dicyclopentenyl oxygroup ethyl ester, the different camphane ester of (methyl) acrylic acid, (methyl)
Acrylic acid bicyclopentane ester, acrylic acid 1- Buddha's warrior attendant alkyl ester, acrylic acid 2- methyl -2- Buddha's warrior attendant alkyl ester, acrylic acid 2- ethyl -2- Buddha's warrior attendant
Alkyl ester, methacrylic acid 1- Buddha's warrior attendant alkyl ester, polypropylene oxide modify (methyl) nonylphenol acrylate phenyl ester, two ring of (methyl) acrylic acid
(methyl) acrylate with cyclic skeleton such as pentadiene oxygroup ethyl ester, (methyl) the acrylic acid carbon number 5 to 7 with hydroxyl
Arrcostab, ethoxydiglycol (methyl) acrylate, polypropylene glycol (methyl) acrylate, polypropylene oxide modify (first
Base) poly- alkylene glycols (methyl) acrylate such as nonylphenol acrylate phenyl ester, ethylene oxide modifies benzene oxidatoin phosphoric acid (methyl) propylene
Acid esters, ethylene oxide modification fourth oxidation phosphoric acid (methyl) acrylate and ethylene oxide modify pungent oxidation phosphoric acid (methyl) acrylic acid
Ester, caprolactone modification (methyl) tetrahydrofurfuryl acrylate etc..
For the concrete example of (methyl) acrylate in a molecule with multiple (methyl) acryloyl groups, it can enumerate:
Two (methyl) acrylic acid tristane dihydroxy methyl esters, dioxanes glycol two (methyl) acrylate, polypropylene glycol two (methyl) third
Olefin(e) acid ester, polytetramethylene glycol two (methyl) acrylate, alkylene oxide modification bisphenol A-type two (methyl) acrylate, in oneself
Ester modifies hydroxyl trimethylace tonitric neopentyl glycol two (methyl) acrylate and ethylene oxide modifies di(2-ethylhexyl)phosphate (methyl) acrylic acid
The trihydroxy methyls carbon numbers 2 such as ester, trimethylolpropane tris (methyl) acrylate, trihydroxy methyl octane three (methyl) acrylate to
10 alkane three (methyl) acrylate, trimethylolpropane polyethoxy three (methyl) acrylate, trimethylolpropane poly- third
The trihydroxy methyls C2 such as poly- propoxyl group three (methyl) acrylate of oxygroup three (methyl) acrylate, trimethylolpropane polyethoxy
To C10 alkane poly-alkoxyl three (methyl) acrylate, ginseng [(methyl) acryloyl-oxyethyl] isocyanuric acid ester, Ji Wusi
Alcohol three (methyl) acrylate, ethylene oxide modification trimethylolpropane tris (methyl) acrylate, propylene oxide modify three hydroxyls
The alkylene oxides such as methylpropane three (methyl) acrylate modify trimethylolpropane tris (methyl) acrylate, the poly- second of pentaerythrite
Poly- propoxyl group four (methyl) acrylate of oxygroup four (methyl) acrylate, pentaerythrite, pentaerythrite four (methyl) acrylic acid
Ester, two-trimethylolpropane four (methyl) acrylate, dipentaerythritol four (methyl) acrylate, five (first of dipentaerythritol
Base) acrylate, dipentaerythritol six (methyl) acrylate etc..
As ingredient (B-1), amine ester (methyl) acrylate oligomer of (methyl) acyclic compound can be more by making
First alcohol, polyisocyanate and hydroxyl (methyl) acrylate reactions and obtain.
For polyalcohol, it can be mentioned, for example: polybutadiene diol, hydrogenated polybutadiene diol, poly- isoprene, hydrogenation
Poly- isoprene, neopentyl glycol, 3- methyl-1,5- pentane diol, ethylene glycol, propylene glycol, 1,4- butanediol, 1,6- hexane two
The triols such as alkylene glycols, trimethylolpropane, the pentaerythrite of the carbon numbers 1 to 10 such as alcohol, tristane dihydroxymethyl, double-[hydroxyl
Methyl] alcohol etc. with cyclic skeleton such as-hexamethylene;And pass through the polyalcohol and polyacid (such as succinic acid, O-phthalic
Acid, hexahydrophthalic anhydride, terephthalic acid (TPA), adipic acid, azelaic acid, tetrabydrophthalic anhydride etc.) reaction it is resulting
Polyester polyol reacts resulting caprolactone alcohol, polycarbonate polyol (such as 1,6- hexane two by polyalcohol and 6-caprolactone
Alcohol reacts resulting polycarbonate glycol etc. with diphenyl carbonate) or polyether polyol (such as it is polyethylene glycol, polypropylene glycol, poly-
Tetramethylene glycol, ethylene oxide modification bisphenol-A etc.) etc..From the viewpoint of Bonding strength and moisture-proof, with regard to the polyalcohol
For, it is more preferably propylene glycol, polybutadiene diol, hydrogenated polybutadiene diol, poly- isoprene, the poly- isoprene of hydrogenation,
From the transparency and flexibility from the viewpoint of, particularly preferably for weight average molecular weight be 2,000 or more propylene glycol, hydrogenated butadiene polymer
Glycol, the poly- isoprene of hydrogenation.It is more preferably hydrogenation polybutadiene from the viewpoint of the discolourations such as heat-resisting coloring, intermiscibility
Enediol.The upper limit of weight average molecular weight at this time is not particularly limited, but more preferably for 10,000 hereinafter, more preferably 5,000
Below.In addition, can be optionally and and with two or more polyalcohols.
For organic polyisocyanates, it can be mentioned, for example: isophorone diisocyanate, hexa-methylene diisocyanate
Ester, toluene di-isocyanate(TDI), xylylene diisocyanate, diphenyl methane -4,4 '-diisocyanate or bicyclopentane base are different
Cyanate etc..It wherein, is more preferably different Buddhist ketone diisocyanate from the viewpoint of obdurability.
For (methyl) acrylate of hydroxyl, it can be used for example: (methyl) Hydroxyethyl Acrylate, (methyl) third
2 to 4 Arrcostab of (methyl) the dihydroxypropyl carbon number such as olefin(e) acid hydroxy propyl ester, (methyl) hydroxy butyl acrylate, single (methyl) third
Olefin(e) acid dihydroxymethyl cyclohexyl, hydroxyl caprolactone (methyl) acrylate, the poly- alkylene glycols of C-terminal (methyl) acrylate
Deng.
Reaction to obtain amine ester (methyl) acrylate oligomer can be carried out by such as following manner.I.e. relative to more
For every 1 equivalent of the hydroxyl of first alcohol, so that the isocyanate group of organic polyisocyanates is more preferably as 1.1 to 2.0 equivalents
The mode polyols blend and organic polyisocyanates of (more preferably become 1.1 to 1.5 equivalents), reaction temperature be more preferably
70 to 90 DEG C make its reaction, synthesize amine ester oligomer.Secondly, every 1 equivalent of isocyanate group relative to amine ester oligomer, by hydroxyl
Base (methyl) acrylate compounds are mixed in such a way that its hydroxyl is more preferably as 1 to 1.5 equivalent, and 70 to 90
DEG C make its reaction, amine ester (methyl) acrylate oligomer of target can be obtained.
The weight average molecular weight of amine ester (methyl) acrylate oligomer is more preferably 7,000 to 100,000 or so, more
Preferably 10,000 to 60,000.When weight average molecular weight is less than 7,000, contraction becomes larger, when weight average molecular weight is greater than 100,000,
Become to lack hardenability.
As ingredient (B-1), (methyl) acrylate with polyisoprene skeleton of (methyl) acyclic compound
Oligomer has (methyl) acryloyl group in the end of polyisoprene molecule or side chain.(first with polyisoprene skeleton
Base) acrylate oligomer can obtain in the form of " UC-203 " (KURARAY corporation) etc..
Similarly, as ingredient (B-1), (methyl) propylene with polybutadiene skeleton of (methyl) acyclic compound
Acid esters oligomer has (methyl) acryloyl group in the end of polybutadiene molecule or side chain.(first with polybutadiene skeleton
Base) acrylate oligomer can obtain in the form of " BAC-45 " (Osaka Organic Chemical Industry corporation) etc..
(methyl) acrylate oligomer with polyisoprene skeleton and (methyl) third with polybutadiene skeleton
Olefin(e) acid ester oligomer be more preferably polystyrene conversion number-average molecular weight be 1,000 to 50,000, more preferably 25,000 to
45,000 or so.
In addition, also including in the scope of (methyl) acrylate oligomer with polyisoprene skeleton in the present invention
(methyl) acrylate oligomer with hydrogenated polyisoprene skeleton, (methyl) acrylate with polybutadiene skeleton
Also comprising (methyl) acrylate oligomer with hydrogenated butadiene polymer skeleton in the scope of oligomer.
With regard to as ingredient (B-1), for the concrete example of (methyl) acrylate compounds of (methyl) acyclic compound,
It can enumerate: N- acryloyl-oxyethyl hexahydrophthalic phthalimide, acryloyl morpholine, (methyl) acrylic acid 2- hydroxyl third
Ester, (methyl) acrylic acid 4- hydroxybutyl, hexamethylene -1,4- dimethanol list (methyl) acrylate, (methyl) acrylic acid tetrahydro
Chaff ester, (methyl) phenoxyethyl acrylate, phenyl polyethoxy (methyl) acrylate, (methyl) acrylic acid 2- hydroxyl -3-
Phenoxy-propyl, o-phenyl phenol monosubstituted ethoxy (methyl) acrylate, o-phenyl phenol polyethoxy (methyl) acrylate,
(methyl) acrylic acid is to cumenyl phenoxy ethyl, the different camphane ester of (methyl) acrylic acid, (methyl) acrylic acid tribromophenoxy second
Ester, (methyl) acrylic acid bicyclopentane ester, (methyl) acrylic acid dicyclopentenyl ester, (methyl) acrylic acid dicyclopentenyl oxygroup second
Ester, 1,4- butanediol two (methyl) acrylate, 1,6- hexane diol two (methyl) acrylate, 1,9- nonane glycol two
It is (methyl) acrylate, Tricyclodecane Dimethanol (methyl) acrylate, bisphenol-A polyethoxy two (methyl) acrylate, double
Poly- propoxyl group two (methyl) acrylate of phenol A, Bisphenol F polyethoxy two (methyl) acrylate, ethylene glycol two (methyl) propylene
Acid esters, polyethylene glycol two (methyl) acrylate, ginseng (acryloyl-oxyethyl) isocyanuric acid ester, pentaerythrite four (methyl)
Acrylate, dipentaerythritol six (methyl) acrylate, dipentaerythritol five (methyl) acrylate, tripentaerythritol six
(methyl) acrylate, tripentaerythritol five (methyl) acrylate, trimethylolpropane tris (methyl) acrylate, three hydroxyl first
Base propane polyethoxy three (methyl) acrylate, two-trimethylolpropane four (methyl) acrylate, neopentyl glycol and hydroxyl
The two of the 6-caprolactone addition product of the ester of the diacrylate and neopentyl glycol and hydroxyl trimethylace tonitric of the ester of trimethylace tonitric
The monomers class such as acrylate.N- acryloyl-oxyethyl hexahydrophthalic phthalimide, (methyl) acrylic acid can more preferably be enumerated
Phenoxy ethyl, (methyl) acrylic acid dicyclopentenyl oxygroup ethyl ester.
As ingredient (B-1), epoxy group (methyl) acrylate compounds of (methyl) acyclic compound can pass through ring
Oxygen compound is obtained with (methyl) reacting with known method for acrylic acid.For becoming the epoxide of raw material, without especially
It limits, but is more preferably epoxides more than 2 functional groups, it can be mentioned, for example: resorcinol bisglycidyl ethers, bisphenol-A
Type ring oxygen compound, bisphenol F type epoxy compound, bisphenol S type epoxy compound, phenol novolak-type epoxy compound, first
Phenol novolak type epoxy compounds, bisphenol A novolac type ring oxygen compound, bisphenol F phenolic type epoxy compound, rouge
Ring type epoxide, aliphatic chain epoxide, glycidyl ester type epoxide, glycidyl amine type epoxidation
Close object, hydantoins type ring oxygen compound, isocyanuric acid ester type ring oxygen compound, the phenol phenol with tris-phenol skeleton
Novolac type ring oxygen compound, other there are also the bisglycidyl ethers compounds of two function phenols, two such as catechol, resorcinol
The bisglycidyl ethers compound of function alcohols and halide, the hydride of the epoxide etc..The epoxide it
In, it is more preferably bisphenol A type epoxy compound, resorcinol bisglycidyl ethers from the viewpoint of liquid crystal pollution.This
Outside, epoxy group and the ratio of (methyl) acryloyl group do not limit, and from the viewpoint of step adaptability, properly select i.e.
Can, but work as and display of the invention is used for liquid crystal sealing agent purposes or liquid crystal display structure cell encapsulant purposes with adhesive
When, it is suitble to using a part of epoxy group through PART EPOXY base (methyl) acrylate of acroleic acid esterification.Acrylic acid at this time
The ratio of change is more preferably 30 to 70% or so.
[ingredient (B-2) epoxide]
In addition, for ingredient (B), more preferably to contain ingredient (B-2): epoxide.
Epoxide is not particularly limited, but is more preferably epoxides more than 2 functional groups, it can be mentioned, for example:
Benzenediol bisglycidyl ethers, bisphenol A type epoxy resin, bisphenol f type epoxy resin, bisphenol-s epoxy resin, phenol novolac are clear
Paint shaped epoxy resin, cresol novolak type epoxy resin, phenol novolak type epoxy resin, bisphenol A novolac type epoxy resin, bisphenol F phenolic varnish type ring
Oxygen resin, alicyclic epoxy resin, aliphatic chain epoxy resin, glycidyl ester type epoxy resin, glycidyl amine type ring
Oxygen resin, hydantoins type epoxy resin, isocyanuric acid ester type epoxy resin, the phenol novolac with tris-phenol skeleton
Type epoxy resin, other there are also bisglycidyl ethers compound, two functions of the two function phenols such as catechol, resorcinol
The bisglycidyl ethers compound of alcohols and halide, the hydride of the epoxide etc..Among the epoxide,
It is more preferably bisphenol A type epoxy resin, resorcinol bisglycidyl ethers from the viewpoint of liquid crystal pollution.
Ingredient (B) can be used alone or mix two or more and be used in display adhesive of the invention, but more excellent
It is selected as using selected from one or more of group being made of the ingredient (B-1) and ingredient (B-2) as ingredient (B), it is more excellent
Being selected as will be selected from by amine ester (methyl) acrylate oligomer, (methyl) acrylate oligomers with polyisoprene skeleton
One or more of group that object, (methyl) acrylate oligomer with polybutadiene skeleton and epoxide are constituted with
(methyl) acrylate oligomer is mixed and is used.
The content of ingredient (B) in display adhesive of the invention (is removed in the solid component of display adhesive
Ingredient other than solvent) in be usually 5 to 80 quality %, be more preferably 5 to 70 quality %, more preferably 5 to 50 quality %.
[ingredient (C) organic filler]
When display of the invention is used for the purposes such as liquid crystal sealing agent with adhesive, ingredient (C) can be contained according to need:
Organic filler (hereinafter, also referred to as " ingredient (C) ").For organic filler, it can be mentioned, for example: amine ester particulate (or
Microparticle), acrylic particles, styrene particulate, styrene alkene particulate and poly- silicon oxygen particulate.In addition, poly- silicon oxygen
Particulate is more preferably KMP-594, KMP-597, KMP-598 (SHIN-ETSU HANTOTAI's chemical industry system), TORAYFILRTME-5500、9701、
EP-2001 (Dow Corning Toray corporation), amine ester particulate are more preferably JB-800T, HB-800BK (industrial on root
Joint-stock company), styrene particulate be more preferably RABALONRTMT320C、T331C、SJ4400、SJ5400、SJ6400、
SJ4300C, SJ5300C, SJ6300C (Mitsubishi Chemical's system), styrene alkene particulate is more preferably SEPTONRTMSEPS2004、
SEPS2063。
The organic filler can be used alone or be used in combination of two or more.Furthermore, it is possible to use two or more and become nucleocapsid
Construction.It is more preferably acrylic particles, poly- silicon oxygen particulate among the organic filler.
Acrylic rubber using the acrylic particles period of the day from 11 p.m. to 1 a.m, more preferably for the core-shell construction as made of 2 kinds of acrylic rubbers
The case where, particularly preferably for stratum nucleare be n-butyl acrylate and shell is methyl methacrylate.It is as ZEFIACRTMF-351 and
It is sold by AICA Industry Stock Company.
In addition, the poly- silicon of dimethyl of organic silicone cross powder, straight chain can be enumerated for poly- silicon oxygen particulate
Oxygen alkane is crosslinked powder etc..In addition, can enumerate and be coated on the surface of the poly- silicone rubber for compound poly- silicone rubber
Polysilicone (such as Polyorganosilsesquioande resin).It is particularly preferably the poly- silicon oxygen of the dimethyl of straight chain in the particulate
The compound poly- silicon oxygen of poly- silicone rubber or polysilicone the cladding straight chain dimethyl polysiloxane cross-linked powder of alkane cross-linked powder
Rubber particle.The particulate can be used alone or be used in combination of two or more.In addition, the shape of rubber powder is more preferably addition
Few spherical of the increasing stick of viscosity afterwards.
The content of ingredient (C) in display adhesive of the invention (is removed in the solid component of display adhesive
Ingredient other than solvent) in be usually 50 mass % hereinafter, being more preferably 5 to 40 quality %.
[ingredient (D) inorganic filler]
When display of the invention is used for the purposes such as liquid crystal sealing agent with adhesive, ingredient (D) can be contained according to need:
Inorganic filler (hereinafter, also referred to as " ingredient (D) ").It for inorganic filler, can enumerate: silica, silicon carbide, nitridation
Silicon, boron nitride, calcium carbonate, magnesium carbonate, barium sulfate, calcium sulfate, mica, talcum, clay, aluminium oxide, magnesia, zirconium oxide, hydrogen
Aluminium oxide, magnesium hydroxide, calcium silicates, alumina silicate, lithium aluminium silicate, zirconium silicate, barium titanate, glass fibre, carbon fiber, curing
Molybdenum, asbestos etc. can more preferably be enumerated: dissolve silica, crystalline silica, silicon nitride, boron nitride, calcium carbonate, barium sulfate, sulfuric acid
Calcium, mica, talcum, clay, aluminium oxide, aluminium hydroxide, calcium silicates, alumina silicate are more preferably silica, aluminium oxide, talcum.Institute
Two or more can be mixed and use by stating inorganic filler.
When inorganic filler is excessive, the glass base above and below the border fitting of the liquid crystal display structure cell of manufacture narrow gap can be become
Can not be successfully to form the main reason for gap etc. is bad when plate, thus its average grain diameter with 2,000nm the following are appropriate, more preferably for
1,000nm hereinafter, more preferably 300nm or less.In addition, the more preferably lower limit value of average grain diameter is 10nm or so, more preferably
100nm or so.Partial size can pass through laser diffraction/scattering formula size distribution analyzer (dry type) (SEISHIN enterprise stock company
System;LMS-30 it) measures.
The content of ingredient (D) in display adhesive of the invention (is removed in the solid component of display adhesive
Ingredient other than solvent) in be usually 50 mass % hereinafter, being more preferably 5 to 40 quality %.The content of inorganic filler is super
When crossing 50 mass %, there is the anxiety that can not form desired cell gap because filling agent content excessively.Ingredient (D) can also at
(C) is divided to be used in combination.
[ingredient (E) silane coupling agent]
Display of the invention uses adhesive that can add silane coupling agent as ingredient (E), to seek adhesive strength, moisture-proof
Property promotion (hereinafter, also referred to as " ingredient (E) ").
It for ingredient (E), can enumerate: 3- glycidoxypropyltrime,hoxysilane, 3- glycidoxypropyl group first
Base dimethoxysilane, 3- glycidoxypropyl diethoxy silane, 2- (3,4- expoxycyclohexyl) ethyl front three
Oxysilane, N- phenyl-γ-aminocarbonyl propyl trimethoxy silane, N- (2- amido ethyl) 3- aminocarbonyl propyl methyl dimethoxy oxygroup
Silane, N- (2- amido ethyl) 3- aminocarbonyl propyl methyltrimethoxysilane, 3- aminocarbonyl propyl triethoxysilane, 3- sulfydryl third
Base trimethoxy silane, vinyltrimethoxysilane, N- (2- (vinyl benzene methylamino) ethyl) 3- aminocarbonyl propyl front three
Oxysilane hydrochloride, 3- methacryloxypropyl trimethoxy silane, 3- chloropropylmethyldimethoxysilane, 3- chlorine
Propyl trimethoxy silicane etc..The silane coupling agent is public by SHIN-ETSU HANTOTAI's chemical industry share with KBM series, KBE series etc.
Department etc. is sold, therefore can easily be obtained from market.
The content of the ingredient (E) of display adhesive of the invention display adhesive solid component (in addition to
Ingredient other than solvent) in be usually 5 mass % hereinafter, more preferably be 0.05 to 3 quality %.
Display adhesive of the invention can contain thermoinitiators, hardening accelerator, hot radical polymerization according to need
Initiator, photopolymerization initiator, coupling agent, organic solvent, antioxidant, radical polymerization inhibitor, light stabilizer and soft
Various additives such as softening ingredient etc. are as any other component.The additive can use with no particular limitation in response to purpose
Existing additive.
If the content of the additive in display adhesive of the invention is in the model that will not undermine effect of the present invention
It encloses, is not limited, but in the solid component of display adhesive (ingredient in addition to solvents), the additive contains
Amount is usually 75 mass % hereinafter, being more preferably 0.1 to 75 quality % or so.
Any ingredient that display adhesive of the invention can add and by the essential component and according to need exists
Room temperature is mixed to 80 DEG C, and according to need obtains field trash the operations removal such as to filter.When mixing, three rollers can be used according to need
Mixing arrangement well known to grinding machine, sand mixer, ball mill etc., filter method are then in the composition in view of display adhesive
Under the premise of appearance, properly selected from known method.In addition, when mixing, more preferably in view of display adhesive
Particular use, the operation etc. when using and suitably adjust the blending amount of each ingredient.
Secondly explanation has used the manufacturing step of the optical component of display adhesive of the invention.
In the manufacturing method of optical component of the invention, more preferably for pass through following step 1 to 3, be bonded at least two optics
Substrate.In addition, when the stage in step 2 be judged as can ensure that sufficient Bonding strength when, step 3 can also be omitted.
(step 1) step 1 is to form coating by being coated with the display adhesive at least one optical substrate
Layer, and ultraviolet light is irradiated to the coating layer and obtains having the step of optical substrate of hardening nitride layer, wherein hardening nitride layer tool
Have: the cured section for being present in the optical substrate side (lower side of coating layer) of the coating layer (hereinafter referred to as " hardens nitride layer
Cured section " or referred to as " cured section ") and be present in the side opposite with optical substrate side (upper side of coating layer, usually
For atmospheric side) uncured part (hereinafter referred to as the uncured part of nitride layer " hardening " or referred to as " uncured part ").This
Outside, in step 1, the hardening ratio of the coating layer after ultraviolet light irradiation is not particularly limited, as long as in the side opposite with optical substrate side
(upper side of coating layer, usually atmospheric side) there are uncured parts on surface.After ultraviolet light irradiation, touched with finger
The side opposite with optical substrate side (upper side of coating layer, usually atmospheric side), when liquid-like constituents are attached to finger, can sentence
Break as with uncured part.
(step 2) step 2 is the other optics of uncured part fitting in the hardening nitride layer of the resulting optical substrate of step 1
The step of uncured part of the hardening nitride layer of substrate or fitting other optical substrates as obtained from step 1.
(step 3) step 3 is via the optical substrate with light shielding part, to the optical substrate being bonded with unhardened
The step of partial hardening nitride layer irradiates ultraviolet light, hardens the hardening nitride layer.
Hereinafter, by liquid crystal display for being bonded of transparent substrate with light shielding part, and be explained with reference to
Via the specific implementation form of the manufacturing method of the optical component of the invention of step 1 to 3.
Here, display adhesive of the invention is coated at least when being bonded 2 or more substrates with liquid
One substrate, and for another substrate with liquid or with uncured part state (semi-hardened state) fitting after, pass through purple
In the case that outside line hardens it, especially excellent then effect is played, and can prevent air from intervening, therefore particularly preferably for such
In the case of use.
Fig. 1 (a), Fig. 1 (b) and Fig. 1 (c) are to manufacture the optical component using display adhesive of the invention
The schematic diagram of the step of one embodiment.
This method is the method for obtaining optical component by fitting liquid crystal display 1 and transparent substrate 2.
Liquid crystal display 1 refers to that envelope has liquid crystal material between a pair of of the substrate for being formed with electrode, and has polarizer, drives
Employ the liquid crystal display of circuit, signal input cable, back light unit.
Transparent substrate 2 is glass plate, polymethyl methacrylate (PMMA) plate, polycarbonate (PC) plate, ester ring type polyene
The transparent substrates such as hydrocarbon polymer (COP) plate.
Here, transparent substrate 2 can be adapted for use with the transparent base on the surface of transparent substrate with black frame-shaped light shielding part 4
Plate, light shielding part 4 are formed by the attaching of adhesive tape, the coating of coating or printing etc..In addition, for the present invention, can also answer
For not having the transparent substrate of light shielding part 4, but in the explanation of implementation form below, to have the case where light shielding part 4 work
It is illustrated for concrete example.In the case where not having light shielding part 4, " transparent substrate with light shielding part " is changed into referred to as
" transparent substrate " can be directly as the example for not having the case where light shielding part.
(step 1)
Firstly, display is coated on the display surface of liquid crystal display 1 with adhesive and there is screening as shown in Fig. 1 (a)
The formation of the transparent substrate 2 in light portion 4 has the surface in the face of light shielding part 4, forms display following layer 5.It, can for coating method
Enumerate slot coated device, roller spreader, spin coater, screen printing etc..Here, being coated on liquid crystal display 1 and tool
The display adhesive for having the surface of the transparent substrate 2 of light shielding part 4 can be identical, it is possible to use different display bondings
Agent.Usually by same display adhesive of the two for more preferably.
The film thickness of the hardening thing of each display adhesive is so that the hardening of resin nitride layer 7 after fitting becomes 50 to 500 μm
The mode of (being more preferably 50 to 350 μm, still more preferably from 100 to 350 μm) adjusts.Here, being present in the saturating of light shielding part 4
Although the film thickness of the hardening nitride layer of the display adhesive on the surface of bright substrate 2 is depending on its film thickness, usually more preferably
For be present in liquid crystal display 1 surface on display adhesive hardening nitride layer film thickness be same degree or compared with
Its thick one.In later-mentioned step 3, in order to make still to keep unhardened and remaining part minimum limit after irradiating ultraviolet light, with
It avoids hardening bad.
Ultraviolet light 8 is irradiated to the display adhesive phase 5 after coating and obtains hardening nitride layer 6, which has
It is present in the hardening of the lower side (liquid crystal display side or transparent substrate side are seen as with adhesive from display) of coating layer
Partially (be not depicted in attached drawing) and be present in coating layer upper side (side opposite with liquid crystal display side or with it is transparent
The opposite side of substrate-side) while carrying out (in an atmosphere be atmospheric side) uncured part (being not depicted in attached drawing).Exposure compared with
Preferably 5 to 2,000mJ/cm2, it is particularly preferably 10 to 1,000mJ/cm2.When exposure is very few, the optical component of fitting is had
The anxiety that hardening of resin degree finally becomes inadequate, when exposure is excessive, have unhardened ingredient tail off and liquid crystal display 1 with
The fitting of transparent substrate 2 with light shielding part becomes bad anxiety.
In the present invention, " unhardened " refers to state of the display with mobility under 25 DEG C of environment.In addition, ultraviolet light irradiates
Being touched afterwards with finger, there is the hardening nitride layer 6 of uncured part to be judged as when liquid-like constituents are attached to finger with unhardened
Part.
Hardening caused by ultraviolet light irradiation of the ultraviolet light to black light, if the light of meeting irradiating ultraviolet light to black light
The lamp of line then unlimited light source.It can be mentioned, for example Cooper-Hewitt lamp, high-pressure mercury-vapor lamp, extra-high-pressure mercury vapour lamp, metal halid lamp, (arteries and veins
Punching) xenon lamp or electrodeless lamp etc..
In step 1 of the invention, the wavelength for the ultraviolet light that display is irradiated with adhesive is not particularly limited, but when will be
When the maximal illumination of 320 to 450nm range is set as 100, more preferably in the ratio (illumination of 200 to 320nm maximal illumination
Than) it is 30 hereinafter, being particularly preferably 10 or less for the illumination 200 to 320nm.When will 320 to 450nm range maximum shine
When degree is set as 100, if the ratio (illumination ratio) of the maximal illumination 200 to 320nm is higher than 30, finally obtained optical component
Bonding strength it is poor.Think the hard of display adhesive when this is the hardening because when the illumination of low wavelength is high, in step 1
Change can be carried out excessively, and the reducing when hardening of the ultraviolet light irradiation in step 3 to the help of adherence is caused.
Here, being full by using such as application for the mode for becoming the illumination ratio irradiates the method for ultraviolet light
Foot the illumination than condition lamp as irradiating ultraviolet light to black light light lamp method, or even if lamp itself not
Meet in the case where the illumination conditions that (such as shortwave is purple using the substrate that can end short wavelength ultraviolet in the irradiation of step 1
Outside line cut-off filter, glass plate, film etc.), and can be irradiated with illumination ratio so.Adjust the base of the illumination ratio of ultraviolet light
Material is not particularly limited, and can be for for example: applying glass plate, soda-lime glass, the PET film etc. of short wave ultraviolet cut-off processing.
In addition, the attenuating plate etc. that concave-convex processing is applied on the surface of quartz glass etc. is less effective fruit.Described attenuating plate etc. can be such that light scatters
And illumination is reduced, therefore be not suitable for selectively making the illumination of 320nm short wavelength below small.
In step 1, ultraviolet irradiation is more preferably top side surface in common atmosphere from coated side (by showing
Device is seen as the side opposite with 1 side of liquid crystal display or the side opposite with 2 side of transparent substrate with adhesive) (usually
Atmosphere face) it is irradiated.In addition, obstructive gas atomization can also will hardened in the upper surface of coating layer table after being set as vacuum
Ultraviolet irradiation is carried out while face.It is opposite with 1 side of liquid crystal display when hardening display with adhesive in an atmosphere
Side or the side opposite with 2 side of transparent substrate can become atmospheric side.In addition, step 1 to be made is formed by painting layer surface
It, can also under vacuum conditions or nitrogen etc. will not cause to hinder to irradiate ultraviolet light in the environment of the gas hardened when stickiness is promoted.
On the other hand, in the case where omitting step 3, it is suitble in a vacuum or in the gas (such as nitrogen) that can promote hardening
It is hardened while spraying.Even if omitting step 3 as a result, can still carry out adequately then.
When ultraviolet light irradiates, it can be adjusted by making oxygen or ozone brush display with (coating layer) surface of adhesive phase 5
The film thickness of the state of uncured part, uncured part.I.e. by making oxygen or ozone brush the surface of coating layer, and in the surface
The oxygen that the hardening of display adhesive 5 can be generated hinders, therefore can control the hardenability on the surface or make the film of uncured part
Thickness thickens.
(step 2)
Then, the form with uncured part toward each other by liquid crystal display 1 and has screening as shown in Fig. 1 (b)
The transparent substrate 2 in light portion 4 is bonded.Fitting can be in atmosphere and any one of vacuum.Gas is generated when here, being bonded in order to prevent
Bubble is suitble to be bonded in a vacuum.In this way, respectively at liquid crystal display 1 and the setting of transparent substrate 2 with cured section and not
It is bonded after the display of the cured section layer of adhesive 5, and it can be expected that the promotion of adhesion.Fitting can pass through pressurization, press
Deng progress.
(step 3)
Then, as shown in Fig. 1 (c), for optical component obtained by fitting transparent substrate 2 and liquid crystal display 1, from tool
There is 2 side of the transparent substrate irradiation ultraviolet light 8 of light shielding part 4, hardens display adhesive phase 5 (coating layer).The photograph of ultraviolet light
The amount of penetrating is calculated with accumulated light, is more preferably about 100 to 4,000mJ/cm2, it is particularly preferably 200 to 3,000mJ/cm2Left and right.Just
For light source used in hardening caused by light irradiation of the ultraviolet light to black light, if irradiating ultraviolet light to black light
Light lamp, that is, unlimited light source.It can be mentioned, for example: Cooper-Hewitt lamp, high-pressure mercury-vapor lamp, extra-high-pressure mercury vapour lamp, metal halogen
Lamp, (pulse) xenon lamp or electrodeless lamp etc..In this way, optical component as shown in Figure 2 can be obtained.
Though the manufacturing step is to be related to " being formed in both liquid crystal display 1 and the transparent substrate 3 with light shielding part 4
After display adhesive phase 5, the manufacturing method for the optical component that the two is bonded " but it is also possible to be " by only in
Liquid crystal display 1 is formed after display adhesive phase 5, and the method with the transparent substrate 3 of light shielding part 4 is bonded " or
" only after the transparent substrate 3 with light shielding part 4 forms display adhesive phase 5, the method for fitting liquid crystal display 1 "
Optical component is obtained Deng well known manufacturing method.Furthermore, it is possible to use aftermentioned various components come replace liquid crystal display 1 make
Use aftermentioned various components as transparent substrate 2 for optical substrate, in optical substrate.
For the optical substrates such as liquid crystal display 1 and transparent substrate 2, it can also be further used in the various components
Other optical substrate layers (such as display adhesive the film that is bonded of hardening nitride layer or be laminated with other optical substrates
Layer).
In addition, the film of the forming method for the display adhesive phase 5 recorded at the paragraph of implementation form, hardening of resin object
Exposure and light source when thick, ultraviolet light irradiation and brush oxygen or nitrogen or ozone caused by display adhesive layer surface
The film thickness method of adjustment of uncured part etc., not can be only applied to the implementation form, moreover it is possible to apply and be wrapped in the present invention
Any manufacturing method contained.
Indicate to include the liquid crystal display in lower, with the specific reality for the optical component that the implementation form can manufacture
Apply example.
(i) optical substrate with light shielding part is the transparent glass substrate being selected from by with light shielding part, with light shielding part
At least one of the group that transparent resin substrate and the glass substrate for being formed with light shielding part and transparent electrode are constituted optics base
Material, and the optical substrate being bonded with it liquid crystal display, plasma-based display unit and organic EL units selected from being made of
At least one of group display unit, resulting optical component have the reality of the display unit of the optical substrate with light shielding part
Apply example.
(ii) wherein an optical substrate is the protection substrate with light shielding part, and the other optical substrates being bonded with it are touchings
Panel or the display unit with touch panel are controlled, optical component made of the fitting of at least two optical substrate is that have to have to hide
The touch panel of the protection substrate in light portion or the embodiment of the display unit with the touch panel.
At this point, in step 1, more preferably in face equipped with light shielding part of protection substrate with light shielding part or touch-control
Any surface or the two in the touch surface of panel are coated with the display adhesive.
(iii) wherein an optical substrate is that have the optical substrate of light shielding part, and the other optical substrates being bonded with it are
Display unit, optical component made of the fitting of at least two optical substrate is the display list for having the optical substrate with light shielding part
The embodiment of member.
At this point, in step 1, more preferably in face of the optical substrate with light shielding part equipped with light shielding part side or aobvious
Show that any of display surface of unit or the two are coated with the display adhesive.
For the concrete example of the optical substrate with light shielding part, it can be mentioned, for example: the display picture use with light shielding part
Protection board or equipped with light shielding part protection substrate touch panel etc..
When the optical substrate for example with light shielding part is the display picture protection board with light shielding part, there is light shielding part
Optical substrate the face equipped with light shielding part side be the protection board the face equipped with light shielding part side.In addition, the light with light shielding part
Learning substrate is when having the touch panel of the protection substrate with light shielding part, and the protection substrate with light shielding part is with light shielding part
Face paste together in the touch surface of touch panel, therefore the face equipped with light shielding part side of optical substrate with light shielding part means the " touching
The substrate surface with touch surface is opposite side touch panel that is controlling panel ".
In the present invention, " optical substrate " means that surface does not have the optical substrate of light shielding part and surface and has light shielding part
Both optical substrates, optical substrate can be enumerated: transparent panel, thin slice, touch panel and display unit etc..
For the material of optical substrate, a variety of materials can be used.Specifically, can enumerate: PET, PC, PMMA, PC with
The resins such as complex, glass, COC, COP, the plastics (acrylic resin etc.) of PMMA.For example with regard to optical substrate used in the present invention
For transparent panel or thin slice, polarizer etc. can be used to be laminated with thin slice made of multiple films or thin slice or transparent panel, be not laminated
Thin slice or transparent panel and the transparent panel being made by unorganic glass (unorganic glass plate and its processed goods, for example, lens, prism,
Ito glass) etc..
In addition, optical substrate used in the present invention other than described polarizer etc., also includes touch panel (touch panel
Input pickup) or the laminated body as formed by multiple feature boards or thin slice such as following display units (hereinafter also referred to as " functional
Laminated body ").
With regard to can be used as optical substrate used in the present invention come using thin slice for, icon piece (icon can be enumerated
Sheet), cosmetic sheet, screening glass.Plate (transparent panel) in the manufacturing method of optical component for use in the present invention can enumerate decoration
Plate, protection board.It, can be using the material being listed as transparent panel for the material of the thin slice and plate.
With regard to can be used as optical substrate used in the present invention come using touch panel surface material for, can enumerate: glass
Glass, the complex of PET, PC, PMMA, PC and PMMA, COC, COP.
For the resulting more preferably optical component of the manufacturing method of the present invention, can enumerate: with light shielding part plate or
Laminar transparent optical substrate is bonded with the functional layer stack through the hardening thing of display of the invention adhesive
Optical component.
In addition, in the manufacturing method of the present invention, by using the display units such as liquid crystal display as optical substrate it
One, and use optical functional materials as other optical substrates, can manufacture attached optical functional materials display unit (hereinafter,
Referred to as display panel).For the display unit, it can be mentioned, for example: LCD, EL display, the EL of polarizer are attached in glass
Illumination, Electronic Paper, plasma display panel etc. show equipment.In addition, can be enumerated for optical functional materials: acrylic panel, PC
The transparent plastic sheets such as plate, PET sheet, PEN plate, strengthened glass, contact panel input pickup.
For the more preferably embodiment of the resulting optical component of the manufacturing method of the present invention, following (i) can be enumerated extremely
(vii)。
(i) a kind of optical component is the hardening thing using display adhesive of the invention by the light with light shielding part
Substrate is learned to be bonded with the functional layer stack.
(ii) optical component as described in (i), wherein the optical substrate with light shielding part is selected from by with shading
The transparent glass substrate in portion, the transparent resin substrate with light shielding part and the glass substrate for being formed with shade and transparent electrode
The optical substrate in group constituted, functional layer stack are display unit or touch panel.
(iii) optical component as described in (ii), wherein display unit is liquid crystal display, plasma-based display list
Any one of first and organic EL display unit.
(iv) a kind of touch panel (or contact panel input pickup) is using display adhesive of the invention
Hardening thing forms the surface of plate or the laminar optical substrate touch-control surface side that fits in touch panel with light shielding part.
(v) a kind of display panel is the hardening thing using display adhesive of the invention by the plate with light shielding part
Shape or laminar optical substrate are fitted on the display picture of display unit and are formed.
(vi) display panel as described in (v), wherein plate or laminar optical substrate with light shielding part are to use
To protect the protection substrate or touch panel of the display picture of display unit.
(vii) optical component, touch panel or the display panel as described in any one of described (i) to (vi), wherein aobvious
Show device with adhesive be any one of (1) to (18) described in display adhesive.
By the resulting optical component comprising display unit and the optical substrate with light shielding part of the manufacturing method of the present invention
It can be installed in the e-machine such as TV, mini game machine, mobile phone, personal computer.
Display of the invention use adhesive just as flexible printed circuit adhesive, TAB adhesive, partly lead
The electronic components encapsulant such as body adhesive and various display adhesives, liquid crystal display structure cell encapsulant, especially
It is highly useful for liquid crystal sealing agent.Explanation uses display of the invention to use adhesive close as liquid crystal below
Seal the liquid crystal display structure cell of agent.
It is that will be formed with set electricity in substrate using liquid crystal display structure cell manufactured by display adhesive of the invention
A pair of of substrate of pole is configured in opposite directions with predetermined distance, and by surrounding with the display adhesive seal, therebetween gap encloses liquid
Crystalline substance forms.The type of enclosed liquid crystal is not particularly limited.Here, substrate refers to by forming from glass, quartz, plastics, silicon etc.
At least one combined substrate with light peneration constituted.It for its preparation method, is added in the display adhesive
Add glass fibre at equal intervals after object (spacer) (gap control material), uses distributor (dispenser) or screen printing apparatus
It is coated on one of a pair of substrate substrate with adhesive Deng by the display, optionally and at 80 to 120 DEG C is carried out later temporary
Hardening.Then, drip liquid crystal on the inside of the weir wall of display adhesive, overlaps another glass substrate in a vacuum, production
Gap out.After gap is formed, hardened 1 to 2 hour at 90 to 130 DEG C, this makes it possible to obtain liquid crystal display structure cells of the invention.This
Outside, as photo-thermal and with type and in use, being to irradiate ultraviolet light to display adhesive portion by ultraviolet irradiation machine to make
Its photo-hardening.Ultraviolet irradiation amount is more preferably 500 to 6,000mJ/cm2, more preferably 1,000 to 4,000mJ/cm2Irradiation
Amount.Then, it optionally and at 90 to 130 DEG C hardens 1 to 2 hour, this makes it possible to obtain liquid crystal display structure cells of the invention.Such institute
The liquid crystal display structure cell of the invention obtained does not have display caused by liquid crystal pollution bad, and followability, moisture-proof are excellent in reliability.Just
For spacer, it can be mentioned, for example: glass fibre, oxidation silicon beads, polymer beads etc..Though its diameter is different because of purpose,
Usually 2 to 8 μm, be more preferably 4 to 7 μm.For display of the invention 100 mass parts of adhesive, use
Amount is usually 0.1 to 4 mass parts, is more preferably 0.5 to 2 mass parts, more preferably 0.9 to 1.5 mass parts or so.
Display of the invention be very suitable to be used in adhesive the design with light shielding part electronic component, must be with such as
The encapsulant purposes that the low-energy light of visible light is hardened.Such as liquid crystal sealing agent, the organic EL under wiring light shielding part
With encapsulant, touch panel adhesive.
[embodiment]
Hereinafter, the present invention is described in more detail with embodiment, but the present invention is not limited to the embodiment.In addition, if without special note
It carries, then " part " and " % " herein is quality criteria.
Synthesis example 1 (synthesis of compound shown in formula (1) (ingredient (A)))
The record of embodiment 6 according to Japanese Unexamined Patent Publication 2017-105749 bulletin, obtains compound (A- shown in formula (1)
1)。
Synthesis example 2 (compares the synthesis with compound (A-2))
According to the record of International Publication No. 2006/027982 synthesis example 1, isocyanic acid 2- methacryloxy is obtained
The reactant of ethyl ester and 1- [4- (2- hydroxyl-oxethyl)-phenyl] -2- hydroxy-2-methyl -1- propane -1- ketone.
Synthesis example 3 (synthesis of photo-polymerization type compound (ingredient (B)))
160 parts of toluene are dissolved in by 140 parts of resorcinol bisglycidyl ethers resin, in butylated hydroxy-a is wherein added
0.48 part of benzene is used as polymerization inhibitor, is warming up to 60 DEG C.Then, 100 parts of acrylic acid is added (to be equivalent to and glycidyl ether resin
In epoxy group be equivalent), further heat up to 80 DEG C, in wherein chlorination trimethyl ammonium of the addition as catalysts
0.96 part, 98 DEG C stir about 50 hours.Resulting reaction solution is washed, distillation toluene, to obtain the epoxy group of resorcinol
241 parts of acrylate (B-1).
Embodiment 1 (modulation of display adhesive of the invention)
(A-1), (B-1) and (B-2) is mixed according to ratio shown in following table 1, after being warming up to 90 DEG C, dissolves (C-1).By institute
The mixture obtained is cooled to room temperature, and after adding (D-1) and (E-1) and stirring, further makes its dispersion with three-roll mill.By gained
Composition with metallic screen (635 mesh) filtering obtain display adhesive of the invention.
Comparative example 1 (modulation of the display adhesive compared)
In addition to (A-1) is changed to the resulting isocyanic acid 2- methacryloxyethyl ester of synthesis example 2 and 1- [4- (2-
Hydroxyl-oxethyl)-phenyl] -2- hydroxy-2-methyl -1- propane -1- ketone reactant (A-2), and be set as other than the composition of table 1,
It is to obtain the adhesive compared according to embodiment 1.
[assessment of light shielding part hardenability]
4 μm of glass fibre (Japan Electric Glass share is added in embodiment 1 and the resulting each adhesive of comparative example 1
Corporation) 1 mass %, it is mixed, and be coated on and be alternatively equipped with 50 μm of lines as formed by the etching-film of chromium and 10 μm of intervals
Glass substrate after, fitting black matrix substrate assessment sample is obtained as counter substrate.To the resulting sample from setting
The glass substrate side at wired/interval is with metal halogen light irradiation 3,000mJ/cm2(100mW/cm2, 30 seconds) ultraviolet light after, with
The cured section of micro- each sample of sem observation.In addition, further being imposed at 120 DEG C to the resulting each sample for having irradiated ultraviolet light
After heat treatment in 1 hour, with the cured section of each sample of micro- sem observation.Show the result in table 1.
The assessment of table 1 composition and assessment result
As shown in table 1, compared with the adhesive of comparative example 1, display adhesive of the invention is even if with visible light
There is the hardenability same with ultraviolet light, and the hardenability in the deep of light shielding part (low energy irradiation part) is also good.Confirm
There is excellent hardenability in low energy.
Synthesis example 4 (synthesis of compound shown in formula (1) (ingredient (A)))
The synthesis of midbody compound shown in (step 1) formula (31)
By in 10 parts of water and 53 parts of ethyl alcohol, 1.9 parts of potassium cyanide of addition and after dissolving, pass through ultrasonic treatment under nitrogen environment
And carry out the degassing of reaction solution.It instills in the solution shown in following formula (30) 10 parts of benzaldehyde of 4- (methylsulfany), at 80 DEG C
Heating starts reaction.After stirring 30 minutes, reaction solution is cooled to 3 DEG C and attracts the crystallization of precipitation and filters and recycles.It is logical
It crosses and the crystallization of recycling is recrystallized using a large amount of ethyl alcohol and is refined, obtain shown in following formula (31) 7.6 parts of midbody compound.
The synthesis of midbody compound shown in (step 2) formula (32)
In the flask for having blender, reflux cooling tube and agitating device, 9.0 parts of polyformaldehyde and dimethyl sulfoxide is added
170 parts and stir after, will make 1.4 parts of potassium hydroxide be dissolved in 5 parts of ethyl alcohol made of solution instill, it is completely molten to be stirred to polyformaldehyde
Until solution.In resulting dimethyl sulphoxide solution, 50 parts of midbody compound dissolutions shown in the resulting formula of step 1 (31) will be made
The solution made of 30 parts of dimethyl sulfoxide spends 30 minutes and instills, and is stirred at room temperature 2 hours.Then 35% hydrochloric acid 2.6 is instilled
Part and neutralizes, make react terminate.Toluene and saturated salt solution is added in the reaction solution and has been extracted to reaction product
After machine layer, the organic layer partial crystallization of separation and concentration is obtained shown in following formula (32) 40 parts of midbody compound.
The synthesis of compound (A-3) shown in (step 3) following formula (A-3)
10.0 parts of midbody compound, 28 parts of toluene shown in the resulting formula of step 2 (32) and 0.08 part of tin octoate are put into
In flask, return stirring is carried out until uniformly.Then, isocyanic acid 2- methacryloxyethyl is added at 60 DEG C of liquid temperature
5.6 parts of ester (Showa electrician joint-stock company, Karenz MOI), after persistently stirring 3 hours, by cooling down reaction solution partial crystallization,
Obtain 10.7 parts of compound (A-3) shown in following formula (A-3).
(the synthesis of compound shown in formula (1) (ingredient (A)) of synthesis example 5
The synthesis of compound (A-4) shown in (step 4) following formula (A-4)
It is different in addition to using isocyanic acid 2- acryloyloxyethyl isocyanate (Showa electrician joint-stock company, Karenz AOI) to replace
Other than cyanic acid 2- methacryloxyethyl ester, remaining with step 3 the same manner, obtain chemical combination shown in following formula (A-4)
6.4 parts of object (A-4).
Embodiment 2 to 4 (modulation of display adhesive of the invention)
According to the mixing of ratio shown in following table 2 or 3 (A-1), (A-3) or (A-4) and (B-1) and (B-2), it is warming up to 90 DEG C
Afterwards, (C-1) is dissolved.Resulting mixture is cooled to room temperature, after adding (D-1) and (E-1) and stirring, further with three rollers
Grinding machine makes its dispersion.Resulting composition is obtained into display adhesive of the invention with metallic screen (635 mesh) filtering.
Comparative example 2 (modulation of the adhesive compared)
According to the mixing of ratio shown in following Table 3 (A-2) and (B-1) and (B-2), after being warming up to 90 DEG C, dissolve (C-1).It will
Resulting mixture is cooled to room temperature, and after adding (D-1) and (E-1) and stirring, further makes its dispersion with three-roll mill.By institute
The composition obtained obtains the display adhesive compared with metallic screen (635 mesh) filtering.
[assessment of light shielding part hardenability]
4 μm of glass fibre (Japan Electric Glass stock is added in embodiment 2 to 4 and the resulting each adhesive of comparative example 2
Part corporation) 1 mass %, it is mixed, and be coated on and be alternatively equipped between 50 μm of lines and 10 μm as formed by the etching-film of chromium
Every glass substrate after, be bonded black matrix substrate as counter substrate, and obtain assessment sample.To resulting sample from being equipped with
Line/interval glass substrate side is with metal halogen light irradiation 3,000mJ/cm2(100mW/cm2, 30 seconds) ultraviolet light after, with aobvious
Micro mirror observes the cured section of each sample.In addition, further imposing 1 at 120 DEG C to the resulting each sample for having irradiated ultraviolet light
After the heat treatment of hour, with the cured section of each sample of micro- sem observation.Show the result in table 2 and 3.
The assessment of table 2 composition and assessment result
The assessment of table 3 composition and assessment result
As shown in table 2 and 3, compared with the adhesive of comparative example 2, even if display adhesive of the invention is with visible light
Also there is the hardenability same with ultraviolet light, and the hardenability in the deep of light shielding part (low energy irradiation part) is also good.I.e.
Confirmation has excellent hardenability in low energy.
[industrial availability]
Even if display of the invention still shows sufficient hardenability by low-energy light with adhesive, therefore can be used for liquid crystal
Show the display part purposes with shading light part such as fitting of sealant or encapsulant and touch panel of structure cell.
Claims (15)
1. a kind of display adhesive contains ingredient (A): Photoepolymerizationinitiater initiater shown in following formula (1);And ingredient (B): light is poly-
Mould assembly compound;
In formula (1), X indicates to remove the resulting residue of n hydrogen atom or following formula (1-1) institute from the saturated hydrocarbons containing circular structure
Show substituent group,
When X is to remove the resulting residue of n hydrogen atom from the saturated hydrocarbons containing circular structure, the integer of n expression 1 to 6;R1It indicates
Hydrogen atom, hydroxyl, alkoxy or other organic groups;R2To R6Separately indicate hydrogen atom, halogen atom, hydroxyl, alcoxyl
Base, sulfydryl, sulfide base, silylation, silanol group, nitro, nitroso, cyano, sulfinic acid base, sulfonic group, sulfonic acid foundation, phosphine
Base, phosphinyl, phosphono, phosphonic acids foundation, amido, ammonium or other organic groups, there are multiple each R2To R6It can phase each other
Same or different group;In addition, from R present on same phenyl ring2To R6In more than the two for selecting can be bonded and form ring knot
Structure;R7Indicate hydrogen atom;
When the substituent group shown in X expression (1-1), n indicates 1;R1Indicate hydrogen atom, hydroxyl, alkoxy or other organic groups;
R2、R3、R5And R6Separately indicate hydrogen atom, halogen atom, hydroxyl, alkoxy, sulfydryl, sulfide base, silylation, silanol
Base, nitro, nitroso, cyano, sulfinic acid base, sulfonic group, sulfonic acid foundation, phosphino-, phosphinyl, phosphono, phosphonic acids foundation, amine
Base, ammonium or other organic groups, there are multiple each R2、R3、R5And R6Group that can be identical each other or different;In addition,
R present on same phenyl ring2With R3It can be bonded and be formed ring structure, in R present on same phenyl ring5With R6It can be bonded and be formed
Ring structure;R4In an expression sulfur-bearing ehter bond organic group, another indicates the organic group of hydrogen atom or sulfur-bearing ehter bond;This
Outside, R4The organic group of represented sulfur-bearing ehter bond can be with R3Or R5It is bonded and forms ring structure;R7Indicate hydrogen atom or carbon number 1 to 4
Alkyl;
In formula (1-1), R8Indicate alkylidene or arlydene, R9Indicate that the alkyl of hydrogen atom or carbon number 1 to 4, Y indicate oxygen atom, sulphur
Atom or NR10, R10Indicate the alkyl of hydrogen atom or carbon number 1 to 4.
2. display adhesive according to claim 1, wherein X is substituent group shown in formula (1-1).
3. display adhesive according to claim 1, wherein X is to remove n hydrogen from the saturated hydrocarbons containing circular structure
The resulting residue of atom.
4. display adhesive according to claim 3, wherein compound shown in formula (1) is following formula (2) shownization
Object is closed,
In formula (2), R1To R6It indicates and the R in formula (1) described in claim 11To R6Identical meaning, A indicate cycloalkylidene,
D indicates alkylidene.
5. display adhesive according to any one of claim 1 to 4, wherein the ingredient (B) includes ingredient
(B-1): (methyl) acyclic compound.
6. display adhesive according to claim 5, wherein the ingredient (B-1) includes (methyl) acrylate
Monomer.
7. display adhesive according to claim 5, wherein the ingredient (B-1) includes selected from by amine ester (first
Base) acrylate oligomer, (methyl) acrylate oligomer with polyisoprene skeleton and have polybutadiene skeleton
One or more of the group that is constituted of (methyl) acrylate oligomer (methyl) acrylate oligomer.
8. display adhesive according to any one of claim 1 to 4, wherein the ingredient (B) includes ingredient
(B-2): epoxide.
9. display adhesive according to any one of claim 1 to 4 also contains ingredient (C): organic filler,
And/or ingredient (D): inorganic filler.
10. display adhesive according to claim 9, wherein the ingredient (C) includes selected from by amine ester particle
One of the group that son, acrylic particles, styrene particulate, styrene alkene particulate and poly- silicon oxygen particulate are constituted
Above organic filler.
11. display adhesive according to any one of claim 1 to 4 also contains ingredient (E): silane coupling agent.
12. a kind of optical component is formed hard comprising the adhesive of the display as described in any one of claims 1 to 11
Compound.
13. a kind of touch panel has optical component described in claim 12.
14. a kind of liquid crystal sealing agent or liquid crystal display structure cell encapsulant, using described in any one of any one of claims 1 to 11 11
Display adhesive.
15. a kind of liquid crystal display structure cell is encapsulated comprising the liquid crystal sealing agent as described in claim 14 or liquid crystal display structure cell
Dosage form at hardening thing.
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017178569A JP6906860B2 (en) | 2017-09-19 | 2017-09-19 | Display adhesive |
JP2017-178569 | 2017-09-19 | ||
JP2018-049143 | 2018-03-16 | ||
JP2018049143A JP6893486B2 (en) | 2018-03-16 | 2018-03-16 | Display adhesive |
Publications (1)
Publication Number | Publication Date |
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CN109609070A true CN109609070A (en) | 2019-04-12 |
Family
ID=65906631
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201811094247.9A Pending CN109609070A (en) | 2017-09-19 | 2018-09-19 | Display adhesive, optical component, touch panel, liquid crystal sealing agent or encapsulant and liquid crystal display |
Country Status (3)
Country | Link |
---|---|
KR (1) | KR20190032222A (en) |
CN (1) | CN109609070A (en) |
TW (1) | TW201915129A (en) |
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CN103080181A (en) * | 2010-06-28 | 2013-05-01 | 陶氏环球技术有限责任公司 | Curable resin compositions |
KR20130066483A (en) * | 2011-12-12 | 2013-06-20 | 동우 화인켐 주식회사 | New photopolymerization initiator, acrylic copolymer and adhesive composition containing the same |
CN105764930A (en) * | 2013-11-27 | 2016-07-13 | 电化株式会社 | Composition |
JP2017105749A (en) * | 2015-12-09 | 2017-06-15 | 日本化薬株式会社 | Novel compound, photopolymerization initiator comprising compound and photosensitive resin composition comprising photopolymerization initiator |
CN111448183A (en) * | 2018-03-01 | 2020-07-24 | 日本化药株式会社 | Novel compound, photopolymerization initiator containing the compound, and photosensitive resin composition containing the photopolymerization initiator |
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JP2004126211A (en) | 2002-10-02 | 2004-04-22 | Mitsui Chemicals Inc | Resin composition for sealing liquid crystal, and method of manufacturing liquid crystal display panel |
JP4852992B2 (en) | 2005-11-21 | 2012-01-11 | トヨタ自動車株式会社 | Control device for internal combustion engine |
JP5268235B2 (en) | 2006-07-05 | 2013-08-21 | 日本化薬株式会社 | Liquid crystal sealant and liquid crystal display cell using the same |
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JP5139735B2 (en) | 2007-06-26 | 2013-02-06 | 積水化学工業株式会社 | Sealant for liquid crystal dropping method, vertical conduction material, and liquid crystal display element |
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JP5388091B2 (en) | 2007-11-16 | 2014-01-15 | 日本化薬株式会社 | Liquid crystal sealant and liquid crystal display cell using the same |
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2018
- 2018-09-17 KR KR1020180110921A patent/KR20190032222A/en not_active Application Discontinuation
- 2018-09-19 CN CN201811094247.9A patent/CN109609070A/en active Pending
- 2018-09-19 TW TW107132965A patent/TW201915129A/en unknown
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CN105764930A (en) * | 2013-11-27 | 2016-07-13 | 电化株式会社 | Composition |
JP2017105749A (en) * | 2015-12-09 | 2017-06-15 | 日本化薬株式会社 | Novel compound, photopolymerization initiator comprising compound and photosensitive resin composition comprising photopolymerization initiator |
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TW201915129A (en) | 2019-04-16 |
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