CN109599355A - A kind of wafer closes frame and tears adhesive dispenser - Google Patents
A kind of wafer closes frame and tears adhesive dispenser Download PDFInfo
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- CN109599355A CN109599355A CN201910022233.4A CN201910022233A CN109599355A CN 109599355 A CN109599355 A CN 109599355A CN 201910022233 A CN201910022233 A CN 201910022233A CN 109599355 A CN109599355 A CN 109599355A
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- cabinet
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- 239000000853 adhesive Substances 0.000 title claims abstract description 16
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 16
- 230000007246 mechanism Effects 0.000 claims abstract description 83
- 239000003292 glue Substances 0.000 claims abstract description 36
- 238000012546 transfer Methods 0.000 claims abstract description 22
- 238000004026 adhesive bonding Methods 0.000 claims abstract description 16
- 238000007363 ring formation reaction Methods 0.000 claims abstract description 14
- 230000005540 biological transmission Effects 0.000 claims description 24
- 238000005520 cutting process Methods 0.000 claims description 14
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 12
- 239000002390 adhesive tape Substances 0.000 claims description 10
- 230000006835 compression Effects 0.000 claims description 9
- 238000007906 compression Methods 0.000 claims description 9
- 238000006073 displacement reaction Methods 0.000 claims description 9
- 238000005086 pumping Methods 0.000 claims description 2
- 239000007787 solid Substances 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 abstract description 3
- 238000012545 processing Methods 0.000 abstract description 2
- 235000012431 wafers Nutrition 0.000 description 105
- 238000000034 method Methods 0.000 description 13
- 239000013078 crystal Substances 0.000 description 7
- 229910052710 silicon Inorganic materials 0.000 description 7
- 239000010703 silicon Substances 0.000 description 7
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 6
- 238000010586 diagram Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 238000001514 detection method Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000002224 dissection Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 230000008450 motivation Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Frame, which is closed, the invention discloses a kind of wafer in field of semiconductor processing tears adhesive dispenser, including cabinet, wafer feed inlet is provided on the left of cabinet, wafer feed inlet is corresponded in cabinet equipped with transfer robot, transfer robot is corresponded in the cabinet equipped with the circumferentially positioned mechanism of wafer, positioning ring feed inlet is equipped on the right side of the cabinet, positioning ring feed inlet is corresponded in cabinet is equipped with positioning cyclization frame mechanism, with positioning cyclization frame mechanism, transfer robot is correspondingly equipped with wafer He Kuang mechanism, it is correspondingly equipped with wafer He Kuang mechanism and tears gluing mechanism, the corresponding gluing mechanism that tears is equipped with finished product discharge port on rear side of the cabinet.The present invention, which can be realized, is bonded fixation with counterdie for wafer automatically, the stationary positioned ring around counterdie, and tears protection glue film, realizes from dynamic circuit connector frame and tears glue.
Description
Technical field
The invention belongs to field of semiconductor processing, in particular to a kind of wafer closes frame and tears adhesive dispenser.
Background technique
In the prior art, wafer refers to silicon wafer used in silicon semiconductor production of integrated circuits, since its shape is circle,
Therefore referred to as wafer；It can be processed on silicon and is fabricated to various circuit component structures, and becoming has the integrated of specific electrical functionality
Circuit product.Wafer fabrication melts these polysilicons, then is planted in liquid melting into seed crystal, then slowly pulls out it, with shape
At columned monocrystalline silicon crystal bar, due to silicon crystal bar be the seed crystal that is determined by a high preferred orientation in the silicon raw material of molten state by
Gradually generate.Silicon crystal bar polishes, laser incising using dissection, barreling, slice, chamfering, after packaging, becomes IC works
Base stock-silicon wafer, here it is " wafers ".
It can integrate on wafer and several IC be installed, and the manufacturing process of chip can be divided into wafer-process process, wafer
Survey several steps such as process, structure dress process, test step.Wherein wafer-process process and wafer probing process are front-end-of-line,
And structure dress process, test step are back segment process.Wafer in process, need to wafer carry out film, exposure, development,
Several processes such as etching, ion implantation, metal sputtering and cutting, generally use and wafer are attached on counterdie, cover in crystal column surface
One layer of protection glue film of lid, fixes a positioning ring around counterdie upper surface, supporter of the positioning ring as wafer, convenient for pair
Wafer is processed, and positioning is convenient, prevents from destroying wafer, lacks fix wafer and counterdie, positioning ring currently on the market
Equipment cannot achieve and carry out closing frame to wafer automatically and tear protection glue film off.
Summary of the invention
Frame is closed the object of the present invention is to provide a kind of wafer and tears adhesive dispenser, be can be realized and is automatically bonded wafer with counterdie admittedly
It is fixed, the stationary positioned ring around counterdie, and tear protection glue film, realize from dynamic circuit connector frame and tear glue.
The object of the present invention is achieved like this: a kind of wafer closes frame and tears adhesive dispenser, including cabinet, is provided on the left of cabinet
Wafer feed inlet corresponds to wafer feed inlet in cabinet equipped with transfer robot, correspond in the cabinet transfer robot be equipped with it is brilliant
Circumference is equipped with positioning ring feed inlet, positioning ring feed inlet is corresponded in cabinet equipped with positioning ring to positioning mechanism, the cabinet right side
He Kuang mechanism is correspondingly equipped with wafer He Kuang mechanism with positioning cyclization frame mechanism, transfer robot, closes with the wafer
Frame mechanism, which is correspondingly equipped with, tears gluing mechanism, and the corresponding gluing mechanism that tears is equipped with finished product discharge port on rear side of the cabinet.
When the invention works, it is placed with wafer cassette outside wafer feed inlet, vertical spacing is placed with several platelets in wafer cassette
Circle, transfer robot protrudes into the gap between adjacent wafers, and the wafer in wafer cassette is taken out one by one, and transfer robot again will
Wafer is sent in the circumferentially positioned mechanism of wafer, the circumferential position of wafer is adjusted, then wafer is sent to crystalline substance by transfer robot
In Yuan He frame mechanism；At the same time, the located ring feed inlet of positioning ring enters cabinet, positions cyclization frame mechanism for positioning ring and bottom
Film is mutually fixed, and positioning ring is sent in wafer He Kuang mechanism, and wafer He Kuang mechanism mutually fixes wafer with counterdie, finally will be brilliant
Circle, which is sent to, to be torn on gluing mechanism, the protection glue film of crystal column surface is torn, wafer is finally gone out from finished product discharge port.With the prior art
It compares, the beneficial effects of the present invention are: the present invention, which can be realized, is bonded fixation with counterdie for wafer automatically, around counterdie
Stationary positioned ring, and tear protection glue film, realize from dynamic circuit connector frame and tear glue.
As a further improvement of the present invention, the transfer robot includes pedestal one, is rotatably coupled on pedestal one
There is swing arm one, swing arm one end has been rotatably coupled swing arm two, and two end of swing arm has been rotatably coupled swing arm three, swing arm three
End is fixedly connected with Y shape vacuum attraction hand, and vacuum attraction subordinate side offers the vacuum attraction being connected with vacuum evacuation device
Hole.Swing arm three is rotated around two end axis of swing arm, and swing arm two is rotated around swing arm one end axis, and swing arm one is around pedestal one
Rotation, transfer robot is mobile flexibly, and vacuum attraction hole can be by wafer adsorption in vacuum attraction subordinate side, vacuum by negative pressure
Side can be used for putting wafer on hand for attraction, more easily carry wafer.
As a further improvement of the present invention, the circumferentially positioned mechanism of the wafer includes pedestal two, through transverse direction on pedestal two
Guide rail slidably connects mobile work platform, and mobile work platform includes shell, is rotatably connected to turntable on the upside of mobile work platform, revolves
It is correspondingly provided with fixed disk above turntable, fixed disk lower edge is equipped with circumferential angular displacement sensor, right in mobile work platform shell
Rotary drive mechanism and traversing driving device should be equipped with.Rotary drive mechanism drives turntable rotation, and traversing driving device drives
Mobile work platform is moved along cross slide way, after wafer is put on a spinstand, the circumferential direction of circumferential angular displacement sensor detection wafer
Position, turntable rotation are adjusted the circumferential position of wafer；After wafer is circumferentially positioned, vacuum attraction hand is by wafer adsorption
Firmly, it and is moved on wafer suction disc.
As a further improvement of the present invention, the traversing driving device includes the traversing motor being vertically arranged, traversing electricity
The output shaft of machine is passed down through mobile work platform housing bottom and is sequentially connected with gear, and edge is axially arranged on the cross slide way
Rack gear, rack and pinion are meshed；The rotary drive mechanism includes the rotating electric machine being vertically arranged, and rotating electric machine side passes through
Several fixed strips being arranged radially mutually are fixed with mobile work platform housing side, and the output end of rotating electric machine is through retarder and shaft
Transmission connection, shaft periphery are equipped with bearing, and the upper end of shaft is mutually fixed with turntable.Traversing motor driven gear turns along rack gear
Dynamic, pedestal two is moved along cross slide way；Rotating electric machine drives turntable to rotate after retarder slows down.
As a further improvement of the present invention, the positioning cyclization frame mechanism includes round locating platform, locating platform
Front and rear sides are correspondingly provided with rotation roller group, and rotation roller group includes several rotating rollers being spaced apart, and rotation roll axis is laterally set
It sets, flush on the upside of each rotating roller, is equipped between two rotation roller groups and has sticking transmission counterdie, transmission counterdie is covered on positioning
On platform；Moveable suction ring is correspondingly provided with above locating platform, positioning ring is adsorbed below ring, and the internal diameter of positioning ring is less than
The outer diameter of locating platform, the outer diameter of positioning ring are greater than the outer diameter of locating platform, annular cutting groove are equipped on the downside of positioning ring；It is described fixed
Rotating disk is coaxially arranged with below bit platform, the shaft of rotating disk is sequentially connected through retarder and rotating electric machine, rotating disk periphery
It is evenly spaced on and is equipped with several rotating arms, rotating arm end is equipped with rotating seat, and turning seat is on the outside of locating platform, rotating seat
On be rotatably coupled pinch roller, pinch roller axis is arranged radially along locating platform, on the upside of pinch roller with locating platform flush, rotation
Arcuate cutting blade is also fixedly connected on seat, the blade correspondence of cutter protrudes into cutting groove, and the both ends of the surface of pinch roller are located at
The left and right sides of cutter.The rotation roller group of two sides drives transmission counterdie mobile, inhales ring and positioning ring is sucked, inhale the mobile bar of ring
With can laterally, longitudinal movement and the mobile mechanism that can go up and down be sequentially connected, inhale general who has surrendered's positioning ring under ring and be pressed on locating platform,
Positioning ring medial support is on locating platform, and positioning ring outside-supporting is on pinch roller, cutter setting corresponding with cutting groove, rotation
Rotating motor drives rotating disk to rotate after retarder slows down, and rotating arm drives rotating seat rotation, and arcuate cutting blade protrudes into cutting groove
Interior that transmission counterdie is cut into circle, pinch roller will have sticking counterdie edge and be pressed on the downside of positioning ring, positioning ring and counterdie
It realizes and closes frame；It inhales ring positioning ring is sent in wafer He Kuang mechanism.
As a further improvement of the present invention, it is circumferentially evenly spaced on the upside of the suction ring and is connected equipped with several three
Head, bypass is equipped at left and right sides of three-way connection, and the downside of three-way connection is equipped with underpass, the bypass of adjacent three-way connection
It is connected between road by connecting tube, the bypass positioned at the three-way connection of avris is connected with vacuum evacuation device, inhales corresponding each on ring
The underpass of three-way connection offers several ventholes, and venthole is connected with the underpass of corresponding three-way connection, the suction ring
Avris be equipped with mobile bar vertically, mobile bar upper end is connected with displacement drive mechanism driving.Each three-way connection interconnects, and takes out
Vacuum plant vacuumizes the underpass of three-way connection, and positioning ring is sucked by vacuum for venthole；Displacement drive mechanism drives
Ring is inhaled to move freely.
As a further improvement of the present invention, wafer He Kuang mechanism includes two groups of roller machines being symmetrical set
Structure, the idler wheel mechanism include the rotation roller of two correspondences setting, are equipped with transmission belt between two rotation rollers, and two
Pressure roller is provided between transmission belt, the upside of pressure roller left and right ends is fixedly connected with corresponding transmission belt respectively；Above idler wheel mechanism
It is correspondingly arranged on fixed longitudinal beam, fixed longitudinal direction beam sides is equipped with longitudinal rail, slidably connects L shape vertical shift on longitudinal rail
Seat, vertical shift seat includes vertical part and the horizontal part, fixes longitudinal direction at the top of longitudinal beam and is equipped with rack gear, erects on the upside of the vertical shift seat horizontal part
It is directly equipped with vertical shift motor, the output shaft of vertical shift motor is passed down through vertical shift seat and is sequentially connected with gear, and wheel and rack is mutually nibbled
It closes, the two sides of vertical shift seat vertical portion are equipped with guide rail vertically, slidably connect lifting seat, vertical shift seat through connection frame on guide rail
Upper to have lifting cylinder by the way that bracket is vertically-mounted, the piston rod extension end of lifting cylinder is sequentially connected downward and with lifting seat, rises
Drop seat bottom corresponds to pressure roller equipped with wafer suction disc, and wafer suction disc bottom offers several vacuum being connected with vacuum evacuation device and inhales
Pilot hole.It inhales ring positioning ring is moved to below wafer suction disc, wafer suction disc drives wafer to move down, and wafer passes through suction ring and protrudes into
The interstitial hole of positioning ring, wafer are moved on counterdie, and idler wheel mechanism moves synchronously, former and later two rotation rollers drive transmission belt to pass
Dynamic, two transmission belts move synchronously band dynamic pressure roller movement, and pressure roller is bonding by counterdie upper surface and bottom, and then inhaling ring will
Wafer after closing frame, which is sent to, to be torn on gluing mechanism；When next wafer and positioning ring carry out conjunction frame, rotation roller is rotated backward, pressure roller
Reverse movement, will be bonding with wafer on the upside of counterdie.
As a further improvement of the present invention, it is described tear gluing mechanism include laterally be arranged tear front rail, tear on front rail
Traversing seat is slidably connected, traversing seat is sequentially connected with the piston rod extension end for tearing glue cylinder, and traversing seat is equipped with liftable
Glue workbench is torn, tears and is correspondingly provided with fixation adhesive tape bracket above glue workbench, is rotationally equipped with forward pass on fixation adhesive tape bracket
Dynamic roller, middle live-roller and rear live-roller, middle live-roller are located at the lower section of driving front roller, rear live-roller, and the axis of each live-roller is vertical
To setting, fixed lower compression roller is equipped on the downside of fixed bracket, fixed lower compression roller is arranged in parallel with driving front roller, close to fixed lower compression roller
Place is provided tiltedly with guide plate, and drive belt is along process on the upside of driving front roller, before behind middle live-roller downside along guide plate
Side extends, and successively bypasses the upside of middle live-roller and rear live-roller and extends back；It tears and is also corresponded to above the discharge end of front rail
Equipped with suction ring.Wafer, which is moved to, to be torn on glue workbench, is torn the drive of glue cylinder and is torn below glue movable workbench to fixation adhesive tape bracket,
The protective glue film edge of wafer front side is located at below guide plate, tears glue workbench and rises so that adhesive tape is mutually glued with protective glue film edge
It closing, then tears the drive of glue cylinder and tear glue workbench continuation slowly forward movement, drive belt is slowly driven under live-roller drive,
Drive belt slowly tears protection glue film, and glue is torn in realization.
As a further improvement of the present invention, described tear is correspondingly provided with position sensor, position above front rail feed end
Sensor setting corresponding with wafer.After position sensor detects the wafer movement in place torn on glue workbench, glue cylinder is torn
Start to drive and tears glue movable workbench.
Detailed description of the invention
Fig. 1 is the structural diagram of the present invention.
Fig. 2 is the structural schematic diagram of transfer robot.
Fig. 3 is the cross-sectional view of the circumferentially positioned mechanism of wafer.
Fig. 4 is the top view for positioning cyclization frame mechanism.
Fig. 5 is the top view of rotating disk.
Fig. 6 is the sectional view along AA in Fig. 4.
Fig. 7 is the partial enlarged view of Fig. 6.
Fig. 8 is the B direction view of Fig. 5.
Fig. 9 is the top view of wafer, positioning ring and counterdie.
Figure 10 is the top view for inhaling ring.
Figure 11 is the side view for inhaling ring.
Figure 12 is the top view of idler wheel mechanism and transmission belt.
Figure 13 is the main view of wafer He Kuang mechanism.
Figure 14 is the top view of vertical shift seat.
Figure 15 is the structural schematic diagram for tearing gluing mechanism.
Figure 16 is the top view of fixation adhesive tape bracket.
Wherein, 1 cabinet, 1a wafer feed inlet, 1b positioning ring feed inlet, 1c finished product discharge port, 2 transfer robots, 3 wafers
Circumferentially positioned mechanism, 4 positioning cyclization frame mechanisms, 5 wafer He Kuang mechanisms, 6 tear gluing mechanism, 7 pedestals one, 7a swing arm one, 7b swing arm
Two, 7c swing arm three, 8 vacuum attraction hands, 9 pedestals two, 10 cross slide ways, 11 mobile work platforms, 12 turntables, 13 fixed disks, 13a
Circumferential angular displacement sensor, 14 traversing motors, 15 gears, 16 rack gears, 17 rotating electric machines, 17a fixed strip, 18 retarders, 19 turns
Axis, 19a bearing, 20 rotation roller groups, 21 counterdies, 22 locating platforms, 23 suction rings, 24 positioning rings, 24a cutting groove, 25 rotating disks,
25a rotating arm, 26 rotating seats, 26a pinch roller, 26b cutter, 27 three-way connections, 28 connecting tubes, 29 ventholes, 30 mobile bars, 31
Rotation roller, 32 transmission belts, 33 pressure rollers, 34 fixed longitudinal beams, 35 longitudinal rails, 36 vertical shift seats, 36a vertical shift motor, 37 connections
Frame, 38 lifting seats, 39 lifting cylinders, 40 wafer suction discs, 41 tear front rail, and 42 traversing seats, 43 tear glue workbench, 44 fixation adhesive tapes
Bracket, 44a driving front roller, live-roller in 44b, live-roller after 44c, the fixed lower compression roller of 44d, 45 guide plates, 46 drive belts, 47
Tear glue cylinder, 48 wafers, 49 position sensors.
Specific embodiment
As illustrated in figs. 1-16, frame being closed for a kind of wafer and tearing adhesive dispenser, including cabinet 1, wafer charging is provided on the left of cabinet 1
Mouthful 1a correspond to wafer feed inlet 1a in cabinet 1 equipped with transfer robot 2, and transfer robot 2 correspond in cabinet 1, and to be equipped with wafer all
To positioning mechanism 3, it is equipped with positioning ring feed inlet 1b on the right side of cabinet 1, positioning ring feed inlet 1b is corresponded in cabinet 1 and is equipped with positioning cyclization
Frame mechanism 4 is correspondingly equipped with wafer He Kuang mechanism 5 with positioning cyclization frame mechanism 4, transfer robot 2, with wafer He Kuang mechanism
5 correspondingly equipped with gluing mechanism 6 is torn, and the corresponding gluing mechanism 6 that tears is equipped with finished product discharge port 1c on rear side of cabinet 1.Transfer robot 2 includes
Pedestal 1 has been rotatably coupled one 7a of swing arm on pedestal 1, and one end 7a of swing arm has been rotatably coupled two 7b of swing arm, pendulum
Two end 7b of arm has been rotatably coupled three 7c of swing arm, and three end 7c of swing arm is fixedly connected with Y shape vacuum attraction hand 8, and vacuum is inhaled
Draw the vacuum attraction hole for offering on the downside of hand 8 and being connected with vacuum evacuation device.The circumferentially positioned mechanism 3 of wafer includes pedestal 29, bottom
Mobile work platform 11 is slidably connected through cross slide way 10 on seat 29, and mobile work platform 11 includes shell, in mobile work platform 11
Side is rotatably connected to turntable 12, and fixed disk 13 is correspondingly provided with above turntable 12, and 13 lower edge of fixed disk is equipped with circumferential angle
Displacement sensor 13a is correspondingly provided with rotary drive mechanism and traversing driving device in 11 shell of mobile work platform.The traversing drive
Motivation structure includes the traversing motor 14 being vertically arranged, and the output shaft of traversing motor 14 is passed down through 11 housing bottom of mobile work platform
And it is sequentially connected with gear 15, along rack gear 16 is axially arranged on cross slide way 10, rack gear 16 is meshed with gear 15；The rotation
Driving mechanism includes the rotating electric machine 17 being vertically arranged, 17 side of rotating electric machine by several fixed strip 17a being arranged radially with
11 housing side of mobile work platform is mutually fixed, and the output end of rotating electric machine 17 is sequentially connected through retarder 18 and shaft 19, shaft
19 peripheries are equipped with bearing 19a, and upper end and 12 phase of turntable of shaft 19 are fixed.Positioning cyclization frame mechanism 4 includes that round positioning is flat
Platform 22, the front and rear sides of locating platform 22 are correspondingly provided with rotation roller group 20, and rotation roller group 20 includes several turn being spaced apart
Dynamic roller, rotation roll axis are laterally arranged, flush on the upside of each rotating roller, are equipped between two rotation roller groups 20 and have sticking transmission
Counterdie 21, transmission counterdie 21 are covered on locating platform 22；Moveable suction ring 23, positioning are correspondingly provided with above locating platform 22
Ring 24 is adsorbed on 23 lower section of ring, and the internal diameter of positioning ring 24 is less than the outer diameter of locating platform 22, and it is fixed that the outer diameter of positioning ring 24 is greater than
The outer diameter of bit platform 22 is equipped with annular cutting groove 24a on the downside of positioning ring 24；Rotating disk is coaxially arranged with below locating platform 22
25, the shaft 19 of rotating disk 25 is sequentially connected through retarder 18 and rotating electric machine 17, and 25 periphery of rotating disk, which is evenly spaced on, to be set
There are several rotating arm 25a, the end rotating arm 25a is equipped with rotating seat 26, and rotating seat 26 is located at 22 outside of locating platform, rotating seat 26
On be rotatably coupled pinch roller 26a, pinch roller 26a axis is arranged radially along locating platform 22, on the upside of pinch roller 26a and locating platform
22 flushes, arcuate cutting blade 26b is also fixedly connected on rotating seat 26, and the blade correspondence of cutter 26b protrudes into cutting groove 24a
Interior, the both ends of the surface of pinch roller 26a are located at the left and right sides of cutter 26b.It inhales circumferentially to be evenly spaced on the upside of ring 23 and set
There are several three-way connections 27, the left and right sides of three-way connection 27 is equipped with bypass, and the downside of three-way connection 27 is equipped with underpass,
It is connected between the bypass of adjacent three-way connection 27 by connecting tube 28, the bypass and pumping positioned at the three-way connection 27 of avris are true
Empty device is connected, and inhales and corresponds to the underpass of each three-way connection 27 on ring 23 and offer several ventholes 29, venthole 29 with it is corresponding
The underpass of three-way connection 27 is connected, and the avris for inhaling ring 23 is equipped with mobile bar 30,30 upper end of mobile bar and displacement drive vertically
Mechanism driving is connected.Wafer He Kuang mechanism 5 includes two groups of idler wheel mechanisms being symmetrical set, and the idler wheel mechanism includes two
The rotation roller 31 of correspondence setting is equipped with transmission belt 32 between two rotation rollers 31, is arranged between two transmission belts 32
There is pressure roller 33, the upside of 33 left and right ends of pressure roller is fixedly connected with corresponding transmission belt 32 respectively；It is correspondingly arranged above idler wheel mechanism
There is fixed longitudinal beam 34, fixed 34 side of longitudinal beam is equipped with longitudinal rail 35, slidably connects L shape vertical shift seat on longitudinal rail 35
36, vertical shift seat 36 includes vertical part and the horizontal part, and fixed 34 top of longitudinal beam is longitudinal to be equipped with rack gear 16, on 36 horizontal part of vertical shift seat
Side is equipped with vertical shift motor 36a vertically, and the output shaft of vertical shift motor 36a is passed down through vertical shift seat 36 and is sequentially connected with gear 15,
Gear 15 is meshed with rack gear 16, and the two sides of 36 vertical portion of vertical shift seat are equipped with guide rail vertically, slides on guide rail through connection frame 37
It is connected with lifting seat 38, has lifting cylinder 39 by the way that bracket is vertically-mounted on vertical shift seat 36, the piston rod of lifting cylinder 39 stretches out
End is sequentially connected downward and with lifting seat 38, and 38 bottom of lifting seat corresponds to pressure roller 33 equipped with wafer suction disc 40,40 bottom of wafer suction disc
Portion offers several vacuum attraction holes being connected with vacuum evacuation device.It tears gluing mechanism 6 and tears front rail 41 including what is be laterally arranged,
It tears and slidably connects traversing seat 42 on front rail 41, traversing seat 42 is sequentially connected with the piston rod extension end for tearing glue cylinder 47, horizontal
It moves seat 42 and tears glue workbench 43 equipped with liftable, tear and be correspondingly provided with fixation adhesive tape bracket 44 above glue workbench 43, it is fixed
Driving front roller 44a, middle live-roller 44b and rear live-roller 44c are rotationally equipped on adhesive tape support 44, middle live-roller 44b is located at
The lower section of driving front roller 44a, rear live-roller 44c, the axis of each live-roller is longitudinally disposed, and fixed push is equipped on the downside of fixed bracket
Roller 44d, fixed lower compression roller 44d and driving front roller 44a are arranged in parallel, and are provided tiltedly with guide plate 45 at fixed lower compression roller 44d,
Drive belt 46 on the upside of driving front roller 44a along passing through, around extending on front side of guide plate 45 behind the middle downside live-roller 44b,
It successively bypasses the upside of middle live-roller 44b and rear live-roller 44c and extends back；It tears and is also corresponded to above the discharge end of front rail 41
Equipped with suction ring 23.It tears and is correspondingly provided with position sensor 49 above 41 feed end of front rail, position sensor 49 and wafer 48 are opposite
It should be arranged.
When the invention works, it is placed with wafer cassette outside wafer feed inlet 1a, if vertical spacing is placed with dry plate in wafer cassette
Wafer 48, transfer robot 2 protrudes into the gap between adjacent wafers 48, and the wafer 48 in wafer cassette is taken out one by one, carries
Wafer 48 is sent in the circumferentially positioned mechanism 3 of wafer by robot 2 again, the circumferential position of wafer 48 is adjusted, then carrying implement
Wafer 48 is sent in wafer He Kuang mechanism 5 by device people 2；At the same time, the located ring feed inlet 1b of positioning ring 24 enters cabinet 1,
Positioning ring 24 and 21 phase of counterdie are fixed by positioning cyclization frame mechanism 4, and positioning ring 24 are sent in wafer He Kuang mechanism 5, wafer
Wafer 48 and 21 phase of counterdie are fixed by He Kuang mechanism 5, are finally sent to wafer 48 and tear on gluing mechanism 6, by the guarantor on 48 surface of wafer
Shield glue film is torn, and wafer 48 is finally gone out from finished product discharge port 1c.Compared with prior art, the beneficial effects of the present invention are:
The present invention, which can be realized, is bonded fixation with counterdie 21 for wafer automatically, the stationary positioned ring 24 around counterdie 21, and tears protection
Glue film is realized from dynamic circuit connector frame and tears glue.
The present invention is not limited to the above embodiments, on the basis of technical solution disclosed by the invention, the skill of this field
For art personnel according to disclosed technology contents, one can be made to some of which technical characteristic by not needing creative labor
A little replacements and deformation, these replacements and deformation are within the scope of the invention.
Claims (9)
1. a kind of wafer closes frame and tears adhesive dispenser, which is characterized in that including cabinet, be provided with wafer feed inlet, cabinet on the left of cabinet
Interior corresponding wafer feed inlet is equipped with transfer robot, and transfer robot is corresponded in the cabinet and is equipped with the circumferentially positioned mechanism of wafer,
It is equipped with positioning ring feed inlet on the right side of the cabinet, positioning ring feed inlet correspond in cabinet is equipped with and position cyclization frame mechanism, and it is described
Positioning cyclization frame mechanism, transfer robot are correspondingly equipped with wafer He Kuang mechanism, with wafer He Kuang mechanism correspondingly
Equipped with gluing mechanism is torn, the corresponding gluing mechanism that tears is equipped with finished product discharge port on rear side of the cabinet.
2. a kind of wafer according to claim 1 closes frame and tears adhesive dispenser, which is characterized in that the transfer robot includes bottom
Seat one has been rotatably coupled swing arm one on pedestal one, and swing arm one end has been rotatably coupled swing arm two, and two end of swing arm can
It is rotationally connected with swing arm three, three end of swing arm is fixedly connected with Y shape vacuum attraction hand, and vacuum attraction subordinate side offers and takes out
The vacuum attraction hole that vacuum plant is connected.
3. a kind of wafer according to claim 1 or 2 closes frame and tears adhesive dispenser, which is characterized in that the wafer is circumferentially positioned
Mechanism includes pedestal two, slidably connects mobile work platform through cross slide way on pedestal two, and mobile work platform includes shell, mobile
It is rotatably connected to turntable on the upside of workbench, fixed disk is correspondingly provided with above turntable, fixed disk lower edge is equipped with circumferential angle
Displacement sensor is correspondingly provided with rotary drive mechanism and traversing driving device in mobile work platform shell.
4. a kind of wafer according to claim 3 closes frame and tears adhesive dispenser, which is characterized in that the traversing driving device includes
The traversing motor being vertically arranged, the output shaft of traversing motor are passed down through mobile work platform housing bottom and are sequentially connected with teeth
It takes turns, along rack gear is axially arranged on the cross slide way, rack and pinion is meshed；The rotary drive mechanism includes being vertically arranged
Rotating electric machine, rotating electric machine side mutually fixed by several fixed strips being arranged radially with mobile work platform housing side, is revolved
The output end of rotating motor is connect through retarder with rotating shaft transmission, and shaft periphery is equipped with bearing, and the upper end of shaft and turntable are mutually solid
It is fixed.
5. a kind of wafer according to claim 1 or 2 closes frame and tears adhesive dispenser, which is characterized in that the positioning cyclization frame machine
Structure includes round locating platform, and the front and rear sides of locating platform are correspondingly provided with rotation roller group, and rotation roller group includes several intervals
The rotating roller of distribution, rotation roll axis are laterally arranged, flush on the upside of each rotating roller, and being equipped between two rotation roller groups has viscosity
Transmission counterdie, transmission counterdie be covered on locating platform；Moveable suction ring is correspondingly provided with above locating platform, positioning ring is inhaled
It is attached to and inhales below ring, the internal diameter of positioning ring is less than the outer diameter of locating platform, and the outer diameter of positioning ring is greater than the outer diameter of locating platform, fixed
Annular cutting groove is equipped on the downside of the ring of position；It is coaxially arranged with rotating disk below the locating platform, the shaft of rotating disk is through retarder
It being sequentially connected with rotating electric machine, rotating disk periphery is evenly spaced on equipped with several rotating arms, and rotating arm end is equipped with rotating seat,
Turning seat has been rotatably coupled pinch roller on rotating seat on the outside of locating platform, and pinch roller axis is arranged radially along locating platform,
With locating platform flush on the upside of pinch roller, arcuate cutting blade is also fixedly connected on rotating seat, the blade correspondence of cutter protrudes into
In cutting groove, the both ends of the surface of pinch roller are located at the left and right sides of cutter.
6. a kind of wafer according to claim 5 closes frame and tears adhesive dispenser, which is characterized in that circumferentially equal on the upside of the suction ring
It is even to be spaced apart equipped with several three-way connections, it is equipped with bypass at left and right sides of three-way connection, the downside of three-way connection is equipped with
Underpass is connected between the bypass of adjacent three-way connection, positioned at the bypass and pumping of the three-way connection of avris by connecting tube
Vacuum plant is connected, and the underpass that each three-way connection is corresponded on suction ring offers several ventholes, and venthole is connected with corresponding three
The underpass of head is connected, and the avris for inhaling ring is equipped with mobile bar, mobile bar upper end and displacement drive mechanism driving phase vertically
Even.
7. a kind of wafer according to claim 1 or 2 closes frame and tears adhesive dispenser, which is characterized in that wafer He Kuang mechanism
The idler wheel mechanism being symmetrical set including two groups, the idler wheel mechanism include two correspondences setting rotation roller, two
Be equipped with transmission belt between a rotation roller, be provided with pressure roller between two transmission belts, the upside of pressure roller left and right ends respectively with it is right
Transmission belt is answered to be fixedly connected；Fixed longitudinal beam is correspondingly arranged on above idler wheel mechanism, fixed longitudinal direction beam sides is equipped with longitudinal rail,
L shape vertical shift seat is slidably connected on longitudinal rail, vertical shift seat includes vertical part and the horizontal part, longitudinal at the top of fixed longitudinal beam to be equipped with
Rack gear, the vertical shift seat horizontal part upside are equipped with vertical shift motor vertically, and the output shaft of vertical shift motor is passed down through vertical shift seat and passes
Dynamic to be connected with gear, wheel and rack is meshed, and the two sides of vertical shift seat vertical portion are equipped with guide rail vertically, through even on guide rail
It connects frame and slidably connects lifting seat, have lifting cylinder by the way that bracket is vertically-mounted on vertical shift seat, the piston rod of lifting cylinder stretches out
End is sequentially connected downward and with lifting seat, and lifting seat bottom corresponds to pressure roller equipped with wafer suction disc, if wafer suction disc bottom offers
The dry vacuum attraction hole being connected with vacuum evacuation device.
8. a kind of wafer according to claim 1 or 2 closes frame and tears adhesive dispenser, which is characterized in that the gluing mechanism that tears includes
What is be laterally arranged tears front rail, tears and slidably connects traversing seat on front rail, traversing seat and the piston rod extension end for tearing glue cylinder
Transmission connection, traversing seat tear glue workbench equipped with liftable, tear and are correspondingly provided with fixation adhesive tape bracket above glue workbench, Gu
Determine rotationally to be equipped with driving front roller, middle live-roller and rear live-roller on adhesive tape support, middle live-roller is located at driving front roller, rear biography
The lower section of dynamic roller, the axis of each live-roller is longitudinally disposed, and fixed lower compression roller, fixed lower compression roller and forward pass are equipped on the downside of fixed bracket
Dynamic roller is arranged in parallel, and guide plate is provided tiltedly at fixed lower compression roller, and drive belt is bypassed along passing through on the upside of driving front roller
Extend after on the downside of middle live-roller along on front side of guide plate, successively bypass the upside of middle live-roller and rear live-roller and extends back；
It tears and is also correspondingly provided with suction ring above the discharge end of front rail.
9. a kind of wafer according to claim 8 closes frame and tears adhesive dispenser, which is characterized in that described to tear on front rail feed end
Side is correspondingly provided with position sensor, position sensor setting corresponding with wafer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910022233.4A CN109599355B (en) | 2019-01-10 | 2019-01-10 | Wafer closes frame and tears mucilage binding and put |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910022233.4A CN109599355B (en) | 2019-01-10 | 2019-01-10 | Wafer closes frame and tears mucilage binding and put |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109599355A true CN109599355A (en) | 2019-04-09 |
| CN109599355B CN109599355B (en) | 2024-05-03 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910022233.4A Active CN109599355B (en) | 2019-01-10 | 2019-01-10 | Wafer closes frame and tears mucilage binding and put |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109599355B (en) |
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| CN112635366A (en) * | 2020-12-24 | 2021-04-09 | 江苏汇成光电有限公司 | UV machine wafer chase positioner |
| CN114335240A (en) * | 2021-12-15 | 2022-04-12 | 江苏汇成光电有限公司 | Sliding cover fixing device of frame closing machine |
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| Publication number | Publication date |
|---|---|
| CN109599355B (en) | 2024-05-03 |
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