CN109594125A - 六方晶单晶锭和晶片的加工方法 - Google Patents
六方晶单晶锭和晶片的加工方法 Download PDFInfo
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- CN109594125A CN109594125A CN201811140126.3A CN201811140126A CN109594125A CN 109594125 A CN109594125 A CN 109594125A CN 201811140126 A CN201811140126 A CN 201811140126A CN 109594125 A CN109594125 A CN 109594125A
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Classifications
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- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B15/00—Single-crystal growth by pulling from a melt, e.g. Czochralski method
- C30B15/36—Single-crystal growth by pulling from a melt, e.g. Czochralski method characterised by the seed, e.g. its crystallographic orientation
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/60—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape characterised by shape
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
- B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/50—Working by transmitting the laser beam through or within the workpiece
- B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B15/00—Single-crystal growth by pulling from a melt, e.g. Czochralski method
- C30B15/20—Controlling or regulating
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B33/00—After-treatment of single crystals or homogeneous polycrystalline material with defined structure
- C30B33/04—After-treatment of single crystals or homogeneous polycrystalline material with defined structure using electric or magnetic fields or particle radiation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02002—Preparing wafers
- H01L21/02005—Preparing bulk and homogeneous wafers
- H01L21/02008—Multistep processes
- H01L21/0201—Specific process step
- H01L21/02021—Edge treatment, chamfering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
- H01L22/26—Acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection, in-situ thickness measurement
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54433—Marks applied to semiconductor devices or parts containing identification or tracking information
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54473—Marks applied to semiconductor devices or parts for use after dicing
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017-192599 | 2017-10-02 | ||
JP2017192599A JP7096657B2 (ja) | 2017-10-02 | 2017-10-02 | ウェーハの加工方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN109594125A true CN109594125A (zh) | 2019-04-09 |
Family
ID=65957310
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201811140126.3A Pending CN109594125A (zh) | 2017-10-02 | 2018-09-28 | 六方晶单晶锭和晶片的加工方法 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP7096657B2 (ja) |
KR (1) | KR102515299B1 (ja) |
CN (1) | CN109594125A (ja) |
TW (1) | TWI815819B (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111300192A (zh) * | 2020-03-24 | 2020-06-19 | 广州南砂晶圆半导体技术有限公司 | 一种应用于单晶的定向加工方法 |
CN112144103A (zh) * | 2020-09-27 | 2020-12-29 | 宜昌南玻硅材料有限公司 | 铸造单晶籽晶制备方法 |
CN114428444A (zh) * | 2020-10-29 | 2022-05-03 | 中芯国际集成电路制造(上海)有限公司 | 套刻量测系统矫正方法 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113172777B (zh) * | 2021-04-23 | 2022-10-04 | 深圳大学 | 一种探测器级高纯锗单晶籽晶及其制备方法和应用 |
CN114161596B (zh) * | 2021-12-23 | 2024-04-09 | 西安奕斯伟材料科技股份有限公司 | 一种用于生产硅片的系统、方法及单晶硅棒 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1384544A (zh) * | 2001-03-21 | 2002-12-11 | 株式会社东芝 | 具有id标记的半导体晶片,及从中生产半导体器件的方法和设备 |
US6797585B1 (en) * | 2003-10-07 | 2004-09-28 | Lsi Logic Corporation | Nonintrusive wafer marking |
CN101785107A (zh) * | 2007-06-13 | 2010-07-21 | 楷能洁有限公司 | 标记晶片的方法 |
CN103489963A (zh) * | 2013-10-10 | 2014-01-01 | 深圳市大族激光科技股份有限公司 | 太阳能电池硅片的跟踪方法 |
CN106041329A (zh) * | 2015-04-06 | 2016-10-26 | 株式会社迪思科 | 晶片的生成方法 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01192121A (ja) * | 1988-01-27 | 1989-08-02 | Hitachi Cable Ltd | 半導体ウエハ |
TW230262B (ja) * | 1992-12-24 | 1994-09-11 | American Telephone & Telegraph | |
JPH10256105A (ja) * | 1997-03-11 | 1998-09-25 | Super Silicon Kenkyusho:Kk | レーザマークを付けたウェーハ |
DE19730224A1 (de) * | 1997-07-15 | 1999-01-21 | Bayer Ag | Verfahren zur Reinigung Phosphoroxychlorid |
US7007855B1 (en) * | 2000-03-17 | 2006-03-07 | International Business Machines Corporation | Wafer identification mark |
JP2008294365A (ja) * | 2007-05-28 | 2008-12-04 | Sanyo Electric Co Ltd | 太陽電池の製造方法 |
US20090057837A1 (en) * | 2007-09-04 | 2009-03-05 | Leslie Marshall | Wafer with edge notches encoding wafer identification descriptor |
JP2009090387A (ja) | 2007-10-04 | 2009-04-30 | Denso Corp | 炭化珪素基板製造用ワイヤーソー装置 |
JP6395613B2 (ja) * | 2015-01-06 | 2018-09-26 | 株式会社ディスコ | ウエーハの生成方法 |
-
2017
- 2017-10-02 JP JP2017192599A patent/JP7096657B2/ja active Active
-
2018
- 2018-09-05 TW TW107131063A patent/TWI815819B/zh active
- 2018-09-28 CN CN201811140126.3A patent/CN109594125A/zh active Pending
- 2018-10-01 KR KR1020180117049A patent/KR102515299B1/ko active IP Right Grant
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1384544A (zh) * | 2001-03-21 | 2002-12-11 | 株式会社东芝 | 具有id标记的半导体晶片,及从中生产半导体器件的方法和设备 |
US6797585B1 (en) * | 2003-10-07 | 2004-09-28 | Lsi Logic Corporation | Nonintrusive wafer marking |
CN101785107A (zh) * | 2007-06-13 | 2010-07-21 | 楷能洁有限公司 | 标记晶片的方法 |
CN103489963A (zh) * | 2013-10-10 | 2014-01-01 | 深圳市大族激光科技股份有限公司 | 太阳能电池硅片的跟踪方法 |
CN106041329A (zh) * | 2015-04-06 | 2016-10-26 | 株式会社迪思科 | 晶片的生成方法 |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111300192A (zh) * | 2020-03-24 | 2020-06-19 | 广州南砂晶圆半导体技术有限公司 | 一种应用于单晶的定向加工方法 |
CN111300192B (zh) * | 2020-03-24 | 2021-12-24 | 广州南砂晶圆半导体技术有限公司 | 一种应用于单晶的定向加工方法 |
CN112144103A (zh) * | 2020-09-27 | 2020-12-29 | 宜昌南玻硅材料有限公司 | 铸造单晶籽晶制备方法 |
CN112144103B (zh) * | 2020-09-27 | 2022-08-16 | 宜昌南玻硅材料有限公司 | 铸造单晶籽晶制备方法 |
CN114428444A (zh) * | 2020-10-29 | 2022-05-03 | 中芯国际集成电路制造(上海)有限公司 | 套刻量测系统矫正方法 |
CN114428444B (zh) * | 2020-10-29 | 2024-01-26 | 中芯国际集成电路制造(上海)有限公司 | 套刻量测系统矫正方法 |
Also Published As
Publication number | Publication date |
---|---|
JP7096657B2 (ja) | 2022-07-06 |
KR102515299B1 (ko) | 2023-03-28 |
TW201923870A (zh) | 2019-06-16 |
TWI815819B (zh) | 2023-09-21 |
JP2019067944A (ja) | 2019-04-25 |
KR20190039007A (ko) | 2019-04-10 |
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