CN109594035A - A kind of shell and the preparation method and application thereof - Google Patents
A kind of shell and the preparation method and application thereof Download PDFInfo
- Publication number
- CN109594035A CN109594035A CN201811557274.5A CN201811557274A CN109594035A CN 109594035 A CN109594035 A CN 109594035A CN 201811557274 A CN201811557274 A CN 201811557274A CN 109594035 A CN109594035 A CN 109594035A
- Authority
- CN
- China
- Prior art keywords
- metal
- area
- metal substrate
- shell
- liquid metal
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C8/00—Solid state diffusion of only non-metal elements into metallic material surfaces; Chemical surface treatment of metallic material by reaction of the surface with a reactive gas, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
- C23C8/06—Solid state diffusion of only non-metal elements into metallic material surfaces; Chemical surface treatment of metallic material by reaction of the surface with a reactive gas, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using gases
- C23C8/08—Solid state diffusion of only non-metal elements into metallic material surfaces; Chemical surface treatment of metallic material by reaction of the surface with a reactive gas, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using gases only one element being applied
- C23C8/10—Oxidising
- C23C8/12—Oxidising using elemental oxygen or ozone
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C8/00—Solid state diffusion of only non-metal elements into metallic material surfaces; Chemical surface treatment of metallic material by reaction of the surface with a reactive gas, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
- C23C8/04—Treatment of selected surface areas, e.g. using masks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/04—Metal casings
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The present invention provides a kind of shell and the preparation method and application thereof, wherein the preparation method of the shell includes that the shell includes metal substrate, wherein is aoxidized the first area of metal substrate, so that the first area can penetrate electromagnetic wave.The problem of preparation method of shell provided by the present invention can make metal be integrally formed or combine closely, the electronic equipment with metal shell is made no longer to face metal and nonmetallic combination with the region that can pass through electromagnetic wave.
Description
Technical field
The invention belongs to electronic equipment communication technique fields, and in particular to a kind of shell and the preparation method and application thereof.
Background technique
In the prior art, if the electronic equipment with metal shell wants transmitting or receives electromagnetic wave, not due to electromagnetic wave
Metal can be passed through to be transmitted, therefore need the partial region of metal shell carrying out holes, then used holes region non-
Metal material is replaced, and the module for emitting or receiving electromagnetic wave is moved to the corresponding region of nonmetallic materials, could be completed
The transmitting and reception of the electromagnetic wave of electronic equipment with metal shell.But nonmetallic materials used in holes region and surrounding
Metal material the case where being not easy to combine, electronic equipment casing easy fracture can be faced, unsightly, user experience effect is poor.
Summary of the invention
The present invention provides a kind of shells and the preparation method and application thereof.The preparation method energy of shell provided by the present invention
Enough make metal and the region of electromagnetic wave can be passed through to be integrally formed or combine closely, makes to have the electronic equipment of metal shell no longer
The problem of facing metal and nonmetallic combination.
In order to solve the above-mentioned technical problem, the embodiment of the invention provides the following technical solutions:
First aspect present invention provides a kind of preparation method of shell, and the shell includes metal substrate, by metal substrate
First area aoxidized so that the first area can penetrate electromagnetic wave.
Preferably, described aoxidize the first area of metal substrate, including, by the way of laser heating or height
The mode of frequency induction heating aoxidizes the first area of metal substrate.
Preferably, to the first area of metal substrate by the way of laser heating or the mode of high-frequency induction heating into
When row oxidation, it is passed through oxygen.
Preferably, to the first area of metal substrate by the way of laser heating or the mode of high-frequency induction heating into
When row oxidation, it is also passed through inert gas.
Preferably, the first area to metal substrate using laser heating by the way of or high-frequency induction heating mode
Before being aoxidized, precoated shet is printed to the first area of metal substrate, the precoated shet includes hyperoxic material.
Preferably, described aoxidize the first area of metal substrate, including, metal oxide and metal are distinguished
It is heated to fusing point liquid metal oxide formed above and liquid metal, liquid metal oxide is filled into first of mold
It sets, liquid metal is perfused in the other positions of mold；
Wherein, the shape of the mold is the shell shape of metal substrate, the first position and the metal substrate
First area is corresponding.
Preferably, after liquid metal oxide to be filled into the first position of mold, to the liquid metal oxide
When being cooled to the first temperature, then liquid metal is perfused in the other positions of mold.
Preferably, after liquid metal oxide to be filled into the first position of mold, to the liquid metal oxide
After solidification, groove is opened up on the metal oxide of solidification, liquid metal then is perfused in the other positions of mold again, so that liquid
State metal is able to enter the groove, after the liquid metal also solidifies, the metal oxide of the solidification and the gold of solidification
Category, which is capable of forming, to be fixedly connected.
Second aspect of the present invention provides a kind of shell, any one above-mentioned method is used to be prepared.
Third aspect present invention provides a kind of electronic equipment comprising above-mentioned shell.
Disclosure based on the above embodiment can know, the embodiment of the present invention have it is following the utility model has the advantages that
The preparation method of shell provided by the present invention can either allow electromagnetic wave effectively to pass through the shell of electronic equipment, also
It can make metal and the region of electromagnetic wave can be passed through to be integrally formed or combine closely, make to have the electronic equipment of metal shell not
The problem of facing metal and nonmetallic combination again.
Detailed description of the invention
Fig. 1 is the efficiency schematic diagram that the material of the unlike material of the embodiment of the present invention penetrates the electromagnetic wave of different frequency range；
Fig. 2 is the knot of the embodiment of the present invention aoxidized by the way of laser heating to the first area of metal substrate
Structure schematic diagram.
Specific embodiment
In the following, specific embodiments of the present invention are described in detail in conjunction with attached drawing, but not as the limitation of the invention.
It should be understood that various modifications can be made to disclosed embodiments.Therefore, description above should not regard
To limit, and only as the example of embodiment.Those skilled in the art will expect within the scope and spirit of this
Other modifications.
The attached drawing being included in the description and forms part of the description shows embodiment of the disclosure, and with it is upper
What face provided is used to explain the disclosure together to substantially description and the detailed description given below to embodiment of the disclosure
Principle.
It is of the invention by the description of the preferred form with reference to the accompanying drawings to the embodiment for being given as non-limiting example
These and other characteristic will become apparent.
Although being also understood that invention has been described referring to some specific examples, those skilled in the art
Member realizes many other equivalents of the invention in which can determine, they have feature as claimed in claim and therefore all
In the protection scope defined by whereby.
When read in conjunction with the accompanying drawings, in view of following detailed description, above and other aspect, the feature and advantage of the disclosure will become
It is more readily apparent.
The specific embodiment of the disclosure is described hereinafter with reference to attached drawing；It will be appreciated, however, that the disclosed embodiments are only
Various ways implementation can be used in the example of the disclosure.Known and/or duplicate function and structure and be not described in detail to avoid
Unnecessary or extra details makes the disclosure smudgy.Therefore, specific structural and functionality disclosed herein is thin
Section is not intended to restrictions, but as just the basis of claim and representative basis be used to instructing those skilled in the art with
Substantially any appropriate detailed construction diversely uses the disclosure.
This specification can be used phrase " in one embodiment ", " in another embodiment ", " in another embodiment
In " or " in other embodiments ", it can be referred to one or more of the identical or different embodiment according to the disclosure.
In the following, the embodiment of the present invention is described in detail in conjunction with attached drawing,
The embodiment of the present invention provides a kind of preparation method of shell, and the shell includes metal substrate, by metal substrate
First area is aoxidized, so that the first area can penetrate electromagnetic wave.In an embodiment of the present invention, it needs metal
The first area of substrate is aoxidized, and first area is made to be capable of forming metal oxide, and electromagnetic wave could pass through metal substrate
First area penetrates, and is which kind of metal does not have any restrictions for metal substrate in the present invention, can be according to the specific of user
It is selected, such as can be metallic aluminium, magnesium or zinc, can also be magnesium alloy or the alloy of magnalium zinc.In the present invention
Illustratively illustrated using metal substrate as aluminium, as shown in Figure 1, penetrating the electromagnetic wave of different frequency range for the material of unlike material
Efficiency schematic diagram；Wherein, for the left side 2GHz frequency range range, according to the standard of association, the only transmission of LNV spec
When efficiency is -4 or more, it could be detected；For the range of the 5GHz frequency range on the right side, according to the standard of association, only LNV
When the transmission efficiency of spec is -5 or more, it could be detected.It can be seen from the figure that either the range of 2GHz frequency range still
In the range of 5GHz frequency range, the transmission efficiency of aluminium illustrates that aluminium cannot penetrate electromagnetic wave under its standard value；And review aluminium
Oxide-aluminium oxide, the transmission efficiency under different-thickness (thickness is, for example, 0.4mm, 0.65mm or 1mm) is in standard
On value, and it is suitable with the transmission efficiency of the plastic cement of different frequency range respectively through efficiency, and explanation can be well through electricity
Magnetic wave.Wherein, the plastic cement used in the present embodiment is PC/ABS/Talc.It can be seen that although metal cannot penetrate electromagnetism
Wave, but when metal is oxidized to its corresponding metal oxide, it just can effectively penetrate electromagnetic wave.Further, when this shell
When body is applied to electronic equipment, the transmitting in electronic equipment or the module for receiving electromagnetic wave are moved into the corresponding position in first area
Place, may be implemented the transmitting and reception of the electromagnetic wave of the electronic equipment with metal shell.Preparation method provided by the present invention
Electromagnetic wave can either be allowed effectively to pass through the shell of electronic equipment, additionally it is possible to make metal and the region of electromagnetic wave can be passed through (i.e. originally
First area in inventive embodiments) it is integrally formed or combines closely, so that the electronic equipment with metal shell is no longer faced gold
The problem of belonging to nonmetallic combination.It is nonmetallic involved in the present invention, such as can be plastic cement.
In one embodiment, first area is not particularly limited in the present invention, is located on metal substrate, it can be with
Selection setting according to the needs of users, for example, user wishes to make the edge of metal substrate through electromagnetic wave, then it can be by Metal Substrate
The edge of plate is aoxidized as first area, is enabled through electromagnetic wave.
In another embodiment of the present invention, described to aoxidize the first area of metal substrate, including, using sharp
The mode of light heating or the mode of high-frequency induction heating aoxidize the first area of metal substrate.In the present embodiment, may be used
To be aoxidized using two ways to the first area of metal substrate, the first is the mode of laser heating, as shown in Fig. 2,
Laser is projected to the first area of metal substrate, for example, throwing power density is 5x104~106W/cm2Laser come to
One region is aoxidized；Further, if the area of first area is relatively large, laser cannot be disposably by first area
All areas when being all irradiated to, first area can be all irradiated to by using the mode of mobile metal substrate,
For example, carrying out mobile Metal Substrate when laser is when a certain position of first area stops 1/10th and arrives signa
Plate.Meanwhile this partial region can be referred to as in molten in the metal substrate of the lower section in the region for forming metal oxide
For melting zone, wherein the thickness of melting zone can be 0.1~0.3mm.
Second is the mode of high-frequency induction heating to aoxidize to first area.Using above two method system
Standby shell can be such that metal is integrally formed with the region (first area i.e. in the embodiment of the present invention) that can pass through electromagnetic wave,
The problem of making the electronic equipment with metal shell no longer face metal and nonmetallic combination.
In a specific embodiment, using laser heating by the way of or high-frequency induction heating mode to first area into
When row oxidation, it can be carried out in a relatively closed environment.
Further, in order to increase the oxidation effectiveness of first area, it is easier to carry out oxidation, for example, making metal substrate
First area when aoxidizing identical depth, using the shorter time, in the first area to metal substrate using laser heating
Mode or the mode of high-frequency induction heating when being aoxidized, oxygen can be passed through, so that the oxygen content in oxidation process
Increase, is effectively aoxidized.
In one embodiment, in order to make oxidation reaction strong caused by the addition of excessive oxygen not to Metal Substrate
Plate generates destruction, even burns metal substrate, therefore, by the way of being heated to the first area of metal substrate using laser
Or the mode of high-frequency induction heating is also passed through inert gas when being aoxidized, to be used to protect the progress of oxidation process.
In one embodiment, in order to increase the oxidation effectiveness of first area, it is easier to carry out oxidation, for example, making gold
It,, can be to metal continuing with shown in Fig. 2 using the shorter time when belonging to the first area of substrate and aoxidizing identical depth
The first area of substrate using laser heating by the way of or high-frequency induction heating mode aoxidized before, to metal substrate
First area print precoated shet, the precoated shet includes hyperoxic material so that when using laser heat by the way of or height
When the mode of frequency induction heating is aoxidized, melting layer is precoated, contained hyperoxic material can increase oxygen in precoated shet
Oxygen content during change can help oxidation reaction effectively to carry out.In the present invention, for hyperoxic material without spy
It does not limit, for example, in other embodiments, the hyperoxic material can be Al (OH)3, Al2O3, Mg (OH)2Or MgO
One of or it is a variety of.
In another embodiment, the present invention also provides a kind of preparation method of shell, be different from it is recited above
The mode directly aoxidized on metal, the present embodiment provides a kind of to prepare shell by the way of perfusion, can make gold
Belong to and combining closely with the region that can pass through electromagnetic wave, specifically, described to aoxidize the first area of metal substrate, packet
It includes, metal oxide and metal is heated separately to fusing point liquid metal oxide formed above and liquid metal, by liquid gold
Belong to the first position that oxide is filled into mold, liquid metal is perfused in the other positions of mold；
Wherein, the shape of the mold is the shell shape of metal substrate, the first position and the metal substrate
First area is corresponding.The present embodiment is substantially just to provide the mold of a shell shape with metal substrate, in correspondence
Liquid metal oxide is perfused in (first position of the i.e. described mold) at the first area position of metal substrate, in its of mold
Liquid metal is perfused in position in he.
The temperature of liquid metals oxide is higher than the temperature of liquid metals, therefore, liquid gold to be first perfused in a mold
Belong to oxide, subsequent Reperfu- sion liquid metals, specifically, can until liquid metal oxide is cooled to the first temperature,
Liquid metal is perfused in the other positions of mold again.Or after liquid metal oxide solidification, Reperfu- sion liquid metal.
In one embodiment, after liquid metal oxide to be filled into the first position of mold, to the liquid metal
When oxide is cooled to the first temperature, then liquid metal is perfused in the other positions of mold.The case for this embodiment is to be not to wait for
Liquid metal is just perfused after solidifying completely in liquid metals oxide, so that the two is during solidification, the part of contact
Liquid can phase counterdiffusion, for example, liquid metals oxide can diffuse into liquid metals, liquid metals in contact portion
Liquid metals oxide can be diffused into, therefore, after solidification, the part of the two contact is capable of forming stable be fixedly connected.
Wherein, the first temperature is not particularly limited in the present invention, as long as substantially with the temperature of the liquid metals for just pouring into mold
It is equal, for example, first temperature can be the melting temperature of metal.
In another embodiment, after liquid metal oxide to be filled into the first position of mold, to the liquid gold
After belonging to oxide solidification, groove is opened up on the metal oxide of solidification, then again by the other positions perfusion liquid gold of mold
Belong to so that liquid metal is able to enter the groove, after the liquid metal also solidify, the metal oxide of the solidification with
The metal of solidification, which is capable of forming, to be fixedly connected.The case for this embodiment is, after liquid metal oxide solidification, Reperfu- sion liquid
The case where metal, specifically opens up groove, then Reperfu- sion liquid metal on the metal oxide of solidification, and liquid metals can
To enter groove, after liquid metals also solidifies, the part that the metal oxide of solidification and the metal of solidification are in contact being capable of shape
At fixed connection structure.Wherein, the shape of the groove in the present invention for being opened up is not particularly limited, as long as to liquid metal
It is not easy after solidification from wherein falling off.
The embodiment of the present invention also provides a kind of shell, any one above-mentioned method is used to be prepared.
The embodiment of the present invention also provides a kind of electronic equipment comprising above-mentioned shell.
Above embodiments are only exemplary embodiment of the present invention, are not used in the limitation present invention, protection scope of the present invention
It is defined by the claims.Those skilled in the art can within the spirit and scope of the present invention make respectively the present invention
Kind modification or equivalent replacement, this modification or equivalent replacement also should be regarded as being within the scope of the present invention.
Claims (10)
1. a kind of preparation method of shell, the shell include metal substrate, wherein the first area of metal substrate is carried out oxygen
Change, so that the first area can penetrate electromagnetic wave.
2. it is described to aoxidize the first area of metal substrate according to the method described in claim 1, wherein, including, it uses
The mode of laser heating or the mode of high-frequency induction heating aoxidize the first area of metal substrate.
3. according to the method described in claim 2, wherein, to the first area of metal substrate by the way of laser heating or height
When the mode of frequency induction heating is aoxidized, it is passed through oxygen.
4. according to the method described in claim 3, wherein, to the first area of metal substrate by the way of laser heating or height
When the mode of frequency induction heating is aoxidized, it is also passed through inert gas.
5. according to the method described in claim 2, wherein, the first area to metal substrate by the way of laser heating or
Before the mode of high-frequency induction heating is aoxidized, precoated shet is printed to the first area of metal substrate, the precoated shet includes
Hyperoxic material.
6. it is described to aoxidize the first area of metal substrate according to the method described in claim 1, wherein, including, it will be golden
Belong to oxide and metal is heated separately to fusing point liquid metal oxide formed above and liquid metal, by liquid metal oxide
It is filled into the first position of mold, liquid metal is perfused in the other positions of mold；
Wherein, the shape of the mold is the shell shape of metal substrate, the first position and the first of the metal substrate
Region is corresponding.
7. according to the method described in claim 6, wherein, after liquid metal oxide to be filled into the first position of mold, to
When the liquid metal oxide is cooled to the first temperature, then liquid metal is perfused in the other positions of mold.
8. according to the method described in claim 6, wherein, after liquid metal oxide to be filled into the first position of mold, to
After the liquid metal oxide solidification, groove is opened up on the metal oxide of solidification, then again by the other positions of mold
Liquid metal is perfused, so that liquid metal is able to enter the groove, after the liquid metal also solidifies, the gold of the solidification
Category oxide is capable of forming with the metal of solidification to be fixedly connected.
9. a kind of shell uses any one method in claim 1-8 to be such as prepared.
10. a kind of electronic equipment comprising shell as claimed in claim 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811557274.5A CN109594035A (en) | 2018-12-19 | 2018-12-19 | A kind of shell and the preparation method and application thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811557274.5A CN109594035A (en) | 2018-12-19 | 2018-12-19 | A kind of shell and the preparation method and application thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109594035A true CN109594035A (en) | 2019-04-09 |
Family
ID=65964051
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811557274.5A Pending CN109594035A (en) | 2018-12-19 | 2018-12-19 | A kind of shell and the preparation method and application thereof |
Country Status (1)
| Country | Link |
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| CN (1) | CN109594035A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110650603A (en) * | 2019-09-10 | 2020-01-03 | Oppo广东移动通信有限公司 | Housing assembly and electronic device |
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| CN110650603B (en) * | 2019-09-10 | 2021-06-08 | Oppo广东移动通信有限公司 | Housing assembly and electronic device |
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