CN109592177A - Semiconductor integrated circuit components pallet with strap notch - Google Patents
Semiconductor integrated circuit components pallet with strap notch Download PDFInfo
- Publication number
- CN109592177A CN109592177A CN201711423616.XA CN201711423616A CN109592177A CN 109592177 A CN109592177 A CN 109592177A CN 201711423616 A CN201711423616 A CN 201711423616A CN 109592177 A CN109592177 A CN 109592177A
- Authority
- CN
- China
- Prior art keywords
- integrated circuit
- circuit components
- semiconductor integrated
- pallet
- strap
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D19/00—Pallets or like platforms, with or without side walls, for supporting loads to be lifted or lowered
- B65D19/38—Details or accessories
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D21/00—Nestable, stackable or joinable containers; Containers of variable capacity
- B65D21/02—Containers specially shaped, or provided with fittings or attachments, to facilitate nesting, stacking, or joining together
- B65D21/0209—Containers specially shaped, or provided with fittings or attachments, to facilitate nesting, stacking, or joining together stackable or joined together one-upon-the-other in the upright or upside-down position
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D2519/00—Pallets or like platforms, with or without side walls, for supporting loads to be lifted or lowered
- B65D2519/00004—Details relating to pallets
- B65D2519/00736—Details
- B65D2519/00935—Details with special means for nesting or stacking
- B65D2519/00955—Details with special means for nesting or stacking stackable
- B65D2519/00965—Details with special means for nesting or stacking stackable when loaded
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D2585/00—Containers, packaging elements or packages specially adapted for particular articles or materials
- B65D2585/68—Containers, packaging elements or packages specially adapted for particular articles or materials for machines, engines, or vehicles in assembled or dismantled form
- B65D2585/86—Containers, packaging elements or packages specially adapted for particular articles or materials for machines, engines, or vehicles in assembled or dismantled form for electrical components
Abstract
The present invention provides a kind of semiconductor integrated circuit components pallet.Along when being formed as overlook view in the peripheral part on the surface of the semiconductor integrated circuit components pallet (1) of substantially quadrangle form, the periphery wall (12) with specified altitude is being formed with slightly by the position of inside than the peripheral part, in the case where making multiple semiconductor integrated circuit components stackable pallets, the peripheral part on surface (4) is abutted with the peripheral part at the back side (5) for another semiconductor integrated circuit components pallet for being located at upper layer, along the notch being formed with below for tying up strap at least one position in 4 positions, wherein: strap ties up multiple semiconductor integrated circuit components pallets；4 positions refer to the semiconductor integrated circuit components pallet along longitudinal direction extend two side surfaces or along short side direction extend two side surfaces away from the position within each ora terminalis 3.4cm.Accordingly, multiple semiconductor integrated circuit components pallets can seamlessly be tied up.
Description
Technical field
The present invention relates to a kind of for receiving the pallet (tray) of the semiconductor integrated circuit components such as dress IC package (PKG),
Specifically, it is related to a kind of pallet as follows:, will be with strength strap when carrying out bale packing operation to multiple pallets
(strapping) when being banded on the pallet of stacking the deformation of issuable pallet inhibit to prevent from holding in the palm accordingly in minimum limit
Gap is generated between disk or generates the dislocation in horizontal direction.
Background technique
The manufacture of the electronic components such as IC, measurement, delivery each process used in semiconductor integrated circuit components
Pallet must be by the various quality tests including fall-down test implemented by recipient.As fall-down test an example, carry out with
Lower test: using strap to the integrated electricity of the multiple semiconductors for being placed with multiple semiconductor integrated circuit components (IC package etc.)
Road components pallet is tied up, and after its sack for being put into togerther aluminum with desiccant is vacuum-packed, is put into carton
It is packed, so that it is fallen 20 times to the ground of concrete from the height of about 1m (will make all 6 of pallet to apply impact
Face, 3 sides, total totally 10 positions of 1 angle (vertex) fall 10 times downward as 1 group of fall-down test, carry out two altogether
Group fall-down test).If the IC components after fall-down test on pallet, being capable of partly leading as standard without breakage
Body integrated circuit components pallet is delivered to recipient.
[existing technical literature]
[patent document]
Patent document 1: Japanese invention patent Publication special open 2010-189048
Patent document 2: Japanese invention patent Publication special open 2011-238660
Patent document 3: Japanese invention patent Publication special open 2001-261089
Summary of the invention
[technical problems to be solved by the inivention]
When tying up semiconductor integrated circuit components pallet in the prior art using strap 3, have the following problems:
Near the central portion of the semiconductor integrated circuit pallet exceedingly applied force and pallet is bent, partly leading in stacking accordingly
Gap 10 is generated between body integrated circuit components pallet (referring to (b) of Fig. 6).As disclosed in Patent Document 1 each
In the case where being formed with interlock portion 11 (inhibiting to stack the function part of dislocation being made of convex body and concave volume) on pallet, falling
When falling in test by big impact, the gap enlargement between semiconductor integrated circuit components pallet, the pallet is to each other
Dislocation in horizontal direction becomes larger.Then, there are following situations: placing is upward in the semiconductor integrated circuit of the pallet of lower layer
The surface guide portion 6a of another pallet of layer is pushed, damaged (referring to Fig. 7 by surface guide portion 6a and back side guide portion 6b clamping
(a)).
[for solving the technical solution of technical problem]
A kind of semiconductor integrated circuit components support with strap notch is provided in one embodiment of this invention
Disk consists of: in substantially quadrangle form when being formed as overlook view along the semiconductor integrated circuit components
The peripheral part on the surface of pallet and it is formed with the periphery wall with specified altitude on the position of inside than the peripheral part, makes
In the case where multiple semiconductor integrated circuit components stackable pallets, the peripheral part on the surface be located at upper layer it is another
(remove arm grip part in the peripheral part at the back side (back surface: back surface) of the semiconductor integrated circuit components pallet
Deng outer) it abuts, which is characterized in that along being formed with below for tying up strap at least one position in 4 positions
Notch, in which: 4 positions refer to two extended along longitudinal direction of the semiconductor integrated circuit components pallet
Side surface or along short side direction extend two side surfaces away from the position within each ora terminalis 3.4cm；The strap is tied up
Multiple semiconductor integrated circuit components pallets.
And, which is characterized in that the depth dimensions of the notch are shorter than the defined height dimension of the periphery wall.
In other embodiments, a kind of semiconductor integrated circuit components pallet is provided, it is scarce which there is strap to use
Mouthful, and consist of: in substantially quadrangle form along the semiconductor integrated circuit components when being formed as overlook view
The peripheral part on the surface of pallet and be formed with the periphery wall with specified altitude slightly by the position of inside than the peripheral part, make it is more
In the case where a semiconductor integrated circuit components stackable pallet, the peripheral part on the surface and another institute for being located at upper layer
The peripheral part (in addition to arm grip part etc.) for stating the back side of semiconductor integrated circuit components pallet abuts, which is characterized in that edge
The periphery wall of the part of the top at least one position in 4 positions be formed with for tying up lacking for strap
Mouthful, in which: 4 positions refer to two sides of the semiconductor integrated circuit components pallet extended along longitudinal direction
Surface or along short side direction extend two side surfaces away from the position within each ora terminalis 3.4cm；The strap is tied up more
A semiconductor integrated circuit components pallet.
And, which is characterized in that the depth dimensions of the notch are shorter than the defined height dimension of the periphery wall.
[invention effect]
Semiconductor integrated circuit components pallet according to the present invention with strap notch, is used for due to being formed with
The notch for the strap tied up to multiple semiconductor integrated circuit components pallets is tied up, therefore, is packaged being tied up
When band, semiconductor integrated circuit components pallet will not be bent.Therefore, when in fall-down test by big impact, Bu Hui
Gap is generated between semiconductor integrated circuit components pallet, will not be generated between the semiconductor integrated circuit components pallet
Dislocation.As subsidiary effect, in the semiconductor integrated circuit components pallet with strap notch of the invention, energy
Enough prevent from being incorporated in the semiconductor integrated circuit such as the IC of bag portion of each semiconductor integrated circuit components pallet by robbed or burgled
Loss.The reason for this is that being formed in lacking for semiconductor integrated circuit components pallet of the invention if strap is bundled in
On mouth, then gap is not generated between semiconductor integrated circuit components pallet, therefore, even very thin and small current IC
Encapsulate (PKG), will not there is a situation where between semiconductor integrated circuit components pallet gap landing.
Detailed description of the invention
Fig. 1 is the figure for indicating the semiconductor integrated circuit components pallet with strap notch of the invention.
Fig. 2 is the side view for indicating to be bundled with multiple semiconductor integrated circuit components pallets of strap.
Fig. 3 is the side view for indicating to be formed in the notch of 4 kinds of forms of semiconductor integrated circuit components pallet.
Fig. 4 is the figure for indicating the notch amplification of 4 kinds of forms.
Fig. 5 is the perspective view for indicating one embodiment of semiconductor integrated circuit components pallet of the invention.
Fig. 6 is the figure that outlined the bale packing process of semiconductor integrated circuit components pallet.
(a) of Fig. 7 is the figure for indicating to stack the pallet of the big existing product of dislocation (tacked deviation), and (b) of Fig. 7 is
Indicate the figure of the semiconductor integrated circuit components pallet of the invention without stacking dislocation.
[description of symbols]
1: semiconductor integrated circuit components pallet；1a: arm grip part；2: notch；2a: slot；3: strap；4: surface；5:
The back side；6: bag portion；6a: surface guide portion；6b: back side guide portion；7: semiconductor integrated circuit components (IC package etc.)；8: slow
Sheet material is used in punching；9: carton；10: gap；11: interlock portion；12: periphery wall；The surface 13:() peripheral part.
Specific embodiment
In the following, referring to attached drawing and according to concrete example come to the semiconductor integrated circuit with strap notch of the invention
Components pallet 1 (hereinafter simply also referred to as " pallet 1 ") is illustrated.
Fig. 1 is the six face figures for indicating the pallet 1 with strap notch of the invention.In the embodiment shown in fig. 1,
On two side surfaces of pallet 1 extended along longitudinal direction, only along away from 4 within each ora terminalis (i.e. corner) 3.4cm
The formation below jagged 2 at position.
As shown in Fig. 2, packing operating personnel for strap 3 when strap 3 to be wound on multiple pallets 1 of stacking
The notch 2 of these pallets 1 is tied up and be wound in, accordingly, gap will not be generated between the multiple pallets 1 for being tied (banding)
10。
Fig. 3 is the embodiment for indicating to have the pallet 1 of various notches 2.Implement shown in (c) of (a)~Fig. 3 of Fig. 3
In example, prolong along the substantially semiconductor integrated circuit components pallet 1 of quadrangle form when looking down along longitudinal direction
At least one party in the bottom and upper segment of the ora terminalis (corner) of two side surfaces nearby is stretched, is formed with for tying up strap 3
Notch 2.
In addition, in the embodiment shown in (d) of Fig. 3, along substantially the two of the pallet 1 of quadrangle form when looking down
At least one party in the bottom and upper segment of the ora terminalis attachment of a side surface is formed with the notch 2 for tying up strap 3, wherein
Two side surfaces are the side surfaces extended along longitudinal direction, also, in the position of the notch 2, the side surface of the pallet 1 from
Top is recessed to following, and is formed with the slot 2a with the width roughly the same with the width of notch 2.
(a) of Fig. 4~(d) is the figure that the notch of 4 kinds of forms shown in Fig. 3 (a)~(d) is amplified to expression respectively.?
In embodiment shown in (a) of Fig. 4, along the notch 2 being formed with below for tying up strap at 4 positions, wherein this 4
A position is the position within each ora terminalis 3.4cm of distance for two side surfaces of pallet 1 extended along longitudinal direction.In Fig. 4
(b) shown in embodiment, be formed with along the periphery wall 12 on the surface 4 being located above 4 positions for tying up strap
Notch 2, wherein 4 positions be pallet 1 along longitudinal direction extend two side surfaces each ora terminalis 3.4cm of distance
Within position.In addition, being formed with along the bottom and upper segment at 4 positions for tying in the embodiment shown in (c) of Fig. 4
The notch 2 of upper strap 3, wherein 4 positions are that the distance for two side surfaces of pallet 1 extended along longitudinal direction is each
Position within ora terminalis 3.4cm.
In addition, being formed with and being used for along the both sides of the bottom and upper segment at 4 positions in the embodiment shown in (d) of Fig. 4
Tie up the notch 2 of strap, wherein 4 positions are that the distance for two side surfaces of pallet 1 extended along longitudinal direction is each
Position within ora terminalis 3.4cm, also, the side surface of pallet 1 in the position of notch 2 from top to following recessed, be formed with
The slot 2a of the roughly the same width of the width of notch 2.In this way, the slot 2a in the side surface of pallet 1 is formed in the various notches 2
In the case where position, strap can be tied up in a manner of making strap be installed in these slots 2a, therefore, can tied securely
Prick multiple pallets 1.
In one embodiment, it is extended with along the peripheral part on the surface 4 of pallet 1 in the position than the peripheral part in the inner part
Periphery wall 12 with specified altitude.Moreover, being formed when stacking multiple pallets 1 on the surface 4 of the pallet 1 of the lower layer of coincidence
Periphery wall 12 and the recess portion that is formed at the back side for being located at upper one layer of pallet 1 it is chimeric, carry out described two pallets 1 accordingly
Aligned in position.
In the other embodiment of the present invention shown in Fig. 5, in two sides extended along longitudinal direction along pallet 1
The bottom and upper segment at 4 positions within each ora terminalis 3.4cm of the distance on surface formed it is jagged, in addition to this, also along pallet 1
Two side surfaces extended along short side direction each ora terminalis 3.4cm of distance within the bottom and upper segment at two positions formed
It is jagged, alternatively, instead of distance each ora terminalis 3.4cm in two side surfaces extended along pallet 1 along longitudinal direction with
The bottom and upper segment at 4 interior positions forms jagged, and two side surfaces extending along pallet 1 along short side direction
The bottom and upper segment at two positions within each ora terminalis 3.4cm forms jagged.In another embodiment, there is also holding in the palm
The central portion of the side surface of disk 1 nearby forms jagged situation also along bottom and upper segment.In the center of the side surface of pallet 1
In the case that portion is nearby also formed with notch, 4 straps are tied up by the position in these notches, multiple pallets 1 can be made
Seamlessly close connection.
In one embodiment, the defined height dimension for being formed in the periphery wall 12 on the surface 4 of pallet 1 is about 1.5mm
[0.15cm], the depth dimensions of the notch 2 of pallet 1 are about 1.0mm [0.1cm].In addition, the lateral length of the notch 2 of pallet 1 is about
For 1.5cm.In other embodiments, it is suitably sized that other are formed to have.
It is illustrated referring to bale packing process of the Fig. 6 to multiple pallets 1.In addition, Fig. 6 focuses on explanation, it may be with practical ruler
Very little difference.(a) of Fig. 6 is to indicate to be formed with multiple bag portions for receiving the semiconductor integrated circuit components 7 such as dress IC
(pocket) top view of 5 semiconductor integrated circuit components pallet in the prior art.(b) of Fig. 6 is to outlined
The figure of bale packing process in the prior art.
Operating personnel is packed first as shown in (a) of Fig. 6, semiconductor integrated circuit components 7 are accommodated in be formed
In the bag portion 5 on semiconductor integrated circuit components pallet, hereafter, as shown in (b) of Fig. 6, semiconductor will be placed with
The stackable pallet of the regulation number (being in most cases 5 or 10) of integrated circuit components 7, using machine by strap
3 are bundled on multiple pallets.Then, bale packing operating personnel is as shown in (c) of Fig. 6, in the week for the multiple pallets being tied
The buffering sheet material 8 that one circle of winding is made of bubble padded coaming etc. is enclosed, hereafter, is put into carton 9 to complete bale packing operation.
As shown in (b) of Fig. 6, the arm grip part 1a being also formed on the pallet of existing product is (shown in Fig. 1
In the semiconductor integrated circuit components pallet of JEDEC specification, width be 1 inch [about 2.54cm], depth be 0.1 inch [about
0.254cm] recess portion) be semiconductor integrated circuit components manufacture and check product sequence in mechanical arm (robot
Arm handle part when) (carrying being equivalent in patent document 3 pawl 3) catches pallet.Recess portion as arm grip part 1a
In the concave shape for making one to want to tie up strap 3 herein, but in current slim semiconductor integrated circuit components pallet
In, thickness of the pallet 1 on the position of arm grip part 1a is very thin and fragile (referring to Fig. 9 of patent document 3), therefore cannot
Strap 3 is bundled on arm grip part 1a.The reason for this is that strap is wound in polyphenylene oxide
When pallet made of (polyphenylene ether:PPE), when one side applies the power one that size is about 23kg weight using machine
When side winds strap, the meeting that exceedingly exerts a force near the central portion of the pallet of stacking is so that pallet 1 deforms, the support of stacking
The gap 10 of the end of disk expands (referring to (b), (c) of Fig. 6).
In contrast, in pallet 1 of the invention, extend along the pallet 1 along longitudinal direction or short side direction
Be at least formed on one side for tying in the bottom and upper segment at 4 positions within each ora terminalis 3.4cm of the distance of two side surfaces
The notch of upper strap, wherein the strap ties up multiple pallets 1, hereby it is possible to which the curved of pallet 1 that band is tied up will be packaged
Bent (deformation) inhibits in minimum limit.Therefore, even if by big impact in fall-down test, also can by multiple pallets 1 it
Between the gap that generates inhibit in minimum limit, therefore, with the not cracky (referring to (b) of Fig. 7) such as IC package on pallet 1
Advantage.
In another embodiment of the present invention, the depth dimensions of notch 2 formed than periphery wall 12 defined height gauge
Very little short, accordingly, when multiple pallets 1 are stacked, pallet 1 engages as follows each other: the position on the surface 4 of the pallet 1 of lower layer
It is abutted in the peripheral part at the back side 5 of the pallet 1 of the peripheral part 13 and upper layer in 12 outside of periphery wall, the periphery frame of the pallet 1 on upper layer
The receipts of periphery wall 12 of the pallet 1 of lower layer are dressed up into the state being nested together.In addition, by forming the depth of notch 2 shallower,
Even if pallet 1 is on the position of notch 2, thickness is also sufficiently thick, therefore, has and is not easy tying up pallet 1 of strap 3
Damaged advantage.
Claims (2)
1. a kind of semiconductor integrated circuit components pallet with strap notch is formed as when overlook view being in substantially
Quadrangle form,
It consists of:
The surface along the semiconductor integrated circuit components pallet peripheral part and than the peripheral part slightly by the position of inside
It sets and is formed with the periphery wall with specified altitude,
In the case where making multiple semiconductor integrated circuit components stackable pallets, the peripheral part on the surface be located at it is upper
The peripheral part at the back side of another semiconductor integrated circuit components pallet of layer abuts,
It is characterized in that,
Along the notch being formed with below for tying up strap at least one position in 4 positions, in which: described 4
Position refers to two side surfaces of the semiconductor integrated circuit components pallet extended along longitudinal direction or along short side
Direction extend two side surfaces away from the position within each ora terminalis 3.4cm；The strap ties up multiple semiconductor collection
At circuit components pallet.
2. a kind of semiconductor integrated circuit components pallet with strap notch is formed as when overlook view being in substantially
Quadrangle form,
It consists of:
The surface along the semiconductor integrated circuit components pallet peripheral part and than the peripheral part slightly by the position of inside
It sets and is formed with the periphery wall with specified altitude,
In the case where making multiple semiconductor integrated circuit components stackable pallets, the peripheral part on the surface be located at it is upper
The peripheral part at the back side of another semiconductor integrated circuit components pallet of layer abuts,
It is characterized in that,
It is formed with along the periphery wall of the part of the top at least one position being located in 4 positions and is packaged for tying up
The notch of band, in which: 4 positions refer to the semiconductor integrated circuit components pallet along longitudinal direction extend
Two side surfaces or along short side direction extend two side surfaces away from the position within each ora terminalis 3.4cm；The strap
Tie up multiple semiconductor integrated circuit components pallets.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017193156A JP6500068B1 (en) | 2017-10-03 | 2017-10-03 | Tray for semiconductor integrated circuit having notch for binding band |
| JP2017-193156 | 2017-10-03 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109592177A true CN109592177A (en) | 2019-04-09 |
| CN109592177B CN109592177B (en) | 2020-12-25 |
Family
ID=65956894
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711423616.XA Expired - Fee Related CN109592177B (en) | 2017-10-03 | 2017-12-25 | Semiconductor integrated circuit part tray with gap for packing belt |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP6500068B1 (en) |
| CN (1) | CN109592177B (en) |
| TW (1) | TWI663110B (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5988394A (en) * | 1996-11-28 | 1999-11-23 | Kabushiki Kaisha Toshiba | Tray for containing parts for storage and transportation |
| JP2004017986A (en) * | 2002-06-13 | 2004-01-22 | Denki Kagaku Kogyo Kk | Tray for housing semiconductor integrated circuit device |
| CN101293576A (en) * | 2007-04-24 | 2008-10-29 | 必佳塑胶金属制品厂(国际)有限公司 | Enhancement type bracket tray for accurate device |
| CN201447107U (en) * | 2009-08-04 | 2010-05-05 | 薛廷武 | Packing case in which pallet feet can penetrating through strapping band |
| JP2014038947A (en) * | 2012-08-17 | 2014-02-27 | Disco Abrasive Syst Ltd | Conveyance tray |
| CN204250552U (en) * | 2014-07-24 | 2015-04-08 | 三岛光产株式会社 | The pallet for conveying of semiconductor device |
| CN205221402U (en) * | 2015-12-25 | 2016-05-11 | 宁德时代新能源科技股份有限公司 | Packaging box |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0343383A (en) * | 1989-06-28 | 1991-02-25 | Mitsubishi Electric Corp | Tray for semiconductor integrated circuit |
| JPH08307Y2 (en) * | 1989-12-21 | 1996-01-10 | 株式会社イノアックコーポレーション | Tray for integrated circuits |
| JP2554268Y2 (en) * | 1992-01-24 | 1997-11-17 | ヤンマーディーゼル株式会社 | Guide for stacking baskets for transporting live fish |
| JPH11349087A (en) * | 1998-06-09 | 1999-12-21 | Inoac Corporation:Kk | Tray for integrated circuit device |
| TW352710U (en) * | 1998-07-08 | 1999-02-11 | Via Tech Inc | IC tray with improving strength |
| JP2007230633A (en) * | 2006-03-02 | 2007-09-13 | Fujitsu Ltd | Electronic component storage container |
| US20070256958A1 (en) * | 2007-04-30 | 2007-11-08 | Peak Plastic And Metal Products (Int'l) Ltd. | Reinforced tray for delicate devices |
| JP4828574B2 (en) * | 2008-05-26 | 2011-11-30 | ルネサスエレクトロニクス株式会社 | Method of transporting semiconductor device |
| JP3203288U (en) * | 2016-01-08 | 2016-03-24 | 積水化成品工業株式会社 | Packing material and package |
| JP2018002291A (en) * | 2016-07-08 | 2018-01-11 | シノン電気産業株式会社 | Semiconductor integrated circuit tray having notches for binding band |
| JP6236178B1 (en) * | 2017-03-07 | 2017-11-22 | シノン電気産業株式会社 | Tray for semiconductor integrated circuit and a set of trays for semiconductor integrated circuit |
-
2017
- 2017-10-03 JP JP2017193156A patent/JP6500068B1/en not_active Expired - Fee Related
- 2017-10-13 TW TW106135138A patent/TWI663110B/en active
- 2017-12-25 CN CN201711423616.XA patent/CN109592177B/en not_active Expired - Fee Related
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5988394A (en) * | 1996-11-28 | 1999-11-23 | Kabushiki Kaisha Toshiba | Tray for containing parts for storage and transportation |
| JP2004017986A (en) * | 2002-06-13 | 2004-01-22 | Denki Kagaku Kogyo Kk | Tray for housing semiconductor integrated circuit device |
| CN101293576A (en) * | 2007-04-24 | 2008-10-29 | 必佳塑胶金属制品厂(国际)有限公司 | Enhancement type bracket tray for accurate device |
| CN201447107U (en) * | 2009-08-04 | 2010-05-05 | 薛廷武 | Packing case in which pallet feet can penetrating through strapping band |
| JP2014038947A (en) * | 2012-08-17 | 2014-02-27 | Disco Abrasive Syst Ltd | Conveyance tray |
| CN204250552U (en) * | 2014-07-24 | 2015-04-08 | 三岛光产株式会社 | The pallet for conveying of semiconductor device |
| CN205221402U (en) * | 2015-12-25 | 2016-05-11 | 宁德时代新能源科技股份有限公司 | Packaging box |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109592177B (en) | 2020-12-25 |
| TW201914927A (en) | 2019-04-16 |
| TWI663110B (en) | 2019-06-21 |
| JP2019064708A (en) | 2019-04-25 |
| JP6500068B1 (en) | 2019-04-10 |
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