CN109588005A - Heat pipe with non-condensable gas - Google Patents
Heat pipe with non-condensable gas Download PDFInfo
- Publication number
- CN109588005A CN109588005A CN201710909160.1A CN201710909160A CN109588005A CN 109588005 A CN109588005 A CN 109588005A CN 201710909160 A CN201710909160 A CN 201710909160A CN 109588005 A CN109588005 A CN 109588005A
- Authority
- CN
- China
- Prior art keywords
- condensable gas
- heat pipe
- heat
- heat carrier
- protrusion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
- F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
- F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a kind of heat pipe with non-condensable gas, including heat carrier and working fluid and non-condensable gas inside the hollow chamber of heat carrier are filled in；The cold side that there is heat carrier the heat absorbing side for amplexiforming heating electronic package and thermal conductivity to connect radiator, cold side form an at least protrusion, and cold side can reduce the area of contact radiator by the setting of protrusion；Heat pipe with non-condensable gas reduces conduction efficiency by the setting of non-condensable gas and protrusion and operates under an operating temperature section, so that heating electronic package reaches task performance.
Description
Technical field
The invention relates to a kind of technologies of heat pipe, refer in particular to a kind of heat pipe with non-condensable gas.
Background technique
The working principle of general heat pipe (Heat Pipe) is the environment by inner vacuum, provides injection its internal work
Make the transmitting that fluid generates phase change after heated and carries out heat, then because working fluid reverts back to liquid afterwards to the cold it is reflowable after
Circulation reuses, and embodiments thereof are that the evaporation ends face paste of heat pipe is connected to the surface of electronic heating component, makes electronic building brick institute
The thermal energy of generation is absorbed via the evaporation end face of heat pipe, then by heat pipe is transferred to radiator, the effect of to reach heat dissipation.
The inner vacuum state of conventional heat pipe structure is the non-condensable gas removed in pipe, promotes the heat transfer effect of heat pipe whereby
Rate is promoted and is achieved the purpose that in a short time that heat generating component is cooling.However, (such as the extremely cold ring under special use environment
In border), the good heat transfer efficiency of heat pipe, which will lead to electronic building brick and can not be successfully, reaches operating temperature appropriate, make electronic building brick without
Method plays maximum task performance.In this regard, how to make heat pipe inoperative when the heating temperature of electronic building brick is low, and in electronics group
The heating temperature of part starts operation compared with Gao Shicai, achievees the purpose that heat pipe is allowed to operate under certain operating temperature section.
Summary of the invention
A purpose of the present invention is that a kind of heat pipe with non-condensable gas is provided, in the heating temperature of electronic building brick
It is inoperative when low, and start operation in the heating temperature of electronic building brick compared with Gao Shicai, the heat with non-condensable gas is reduced with this
The conduction efficiency of pipe and operated under certain operating temperature section so that heating electronic package reaches task performance.
In order to reach above-mentioned purpose, the present invention provides a kind of heat pipe with non-condensable gas, including heat carrier and fills out
Infuse the working fluid and non-condensable gas inside the hollow chamber of heat carrier.Heat carrier has the suction for amplexiforming heating electronic package
Hot side and thermal conductivity connect the cold side of radiator, and cold side forms an at least protrusion, and cold side can by the setting of protrusion
Reduce the area of contact radiator；Heat pipe with non-condensable gas reduces conduction effect by the setting of non-condensable gas and protrusion
Rate and operated under an operating temperature section so that heating electronic package reaches task performance.
Compared to known technology, the heat pipe with non-condensable gas of the invention is to be filled with non-condensable gas, and putting
Hot side forms an at least protrusion, and can reduce the face to contact with each other with radiator by the setting of an at least protrusion
Product；Accordingly, when electronic building brick is in the operating condition that operating temperature is low, task performance is low, the heat pipe with non-condensable gas
Heat transfer efficiency is reduced due to being filled with non-condensable gas and the area contacted with radiator is reduced, therefore with non-condensable gas
Heat pipe is in heating electronic package initial operation and inoperative, so that heating electronic package is kept generated heat, to improve its work
Make efficiency；In addition, the heat pipe with non-condensable gas is in the shape that operating temperature is higher, task performance is high in heating electronic package
State starts operation, to radiate to heat caused by heating electronic package.The biography of heat pipe with non-condensable gas as a result,
Leading efficiency reduces to operate under certain operating temperature section, so that heating electronic package is reached task performance, increases
Practicability of the invention.
Detailed description of the invention
Fig. 1 is the three-dimensional appearance schematic diagram of the heat pipe with non-condensable gas of the invention.
Fig. 2 uses schematic diagram for the heat pipe with non-condensable gas of the invention.
Fig. 3 is the diagrammatic cross-section of the heat pipe with non-condensable gas of the invention.
Fig. 4 is another implementation form schematic diagram in gear tug portion of the heat pipe with non-condensable gas of the invention.
Fig. 5 is its temperature change and electronic heating component power percentage when there is the present invention heat pipe of non-condensable gas to use
The curve graph of ratio.
Symbol description in attached drawing:
1,1a has the heat pipe of non-condensable gas；2 heating electronic packages；3 radiators；10,10a heat carrier；100 is hollow
Chamber；11,11a heat absorbing side；12,12a cold side；13, the protrusion 13a；20,20a working fluid；30,30a not condensated gas
Body；40,40a keeps off tug portion.
Specific embodiment
Detailed description for the present invention and technology contents, cooperation schema is described as follows, however institute's accompanying drawings only provide ginseng
It examines and illustrates to use, be not intended to limit the present invention.
Referring to figs. 1 to shown in Fig. 3, the three-dimensional appearance schematic diagram of the heat pipe with non-condensable gas respectively of the invention,
Use schematic diagram and diagrammatic cross-section.As shown in Fig. 1 and 2, the heat pipe 1 with non-condensable gas of the invention is to send out one
Thermoelectricity sub-component 2 radiates；Preferably, there is the heat pipe 1 of non-condensable gas to also incorporate a radiator 3 for this.In the present invention
An embodiment in, the radiator 3 be a radiating fin group.
Referring to shown in Fig. 2 and Fig. 3, in the present embodiment, this have the heat pipe 1 of non-condensable gas include a heat carrier 10,
One working fluid 20 and a non-condensable gas 30, and the working fluid 20 and the non-condensable gas 30 are filled in the heat carrier 10
It is interior.The structure more detailed description of the heat pipe 1 with non-condensable gas is as follows.
The heat carrier 10 has a closed hollow chamber 100, is made of the good metal of thermal conductivity such as copper etc..?
In the present embodiment, which, which is that but not limited to this in a flat cuboid, is made.The heat carrier 10, which has, amplexiforms one
A heat absorbing side 11 and thermal conductivity for heating electronic package 2 connects a cold side 12 of a radiator 3.The cold side 12 forms at least one
Protrusion 13, and the cold side 12 is that the area for contacting the radiator 3 can be reduced by the setting of an at least protrusion 13.
The working fluid 20 is filled in the hollow chamber 100, be with liquid, vaporous state between heat absorbing side and cold side
Round-trip convection current, and be continuously circulated and carry out liquid, two phase change of vapour, so that the heat carrier 10 is presented the characteristic of quick samming and reaches biography
The purpose of heat.It is noted that the visual use demand of the type of the working fluid 20 and selected.
Furthermore the non-condensable gas 30 (Non-Condensable Gas) is filled in the hollow chamber 100；Preferably
Ground, the non-condensable gas 30 are air.The non-condensable gas 30 is in the heat carrier 10 and is not involved in liquid, vapour cycle, therefore should
The start-up temperature that the presence of non-condensable gas 30 will cause the heat pipe 1 with non-condensable gas increases.In addition, this have can not
When the heat pipe 1 of solidifying gas operates, which can be compressed to condensation end by vapour phase working fluid and occupy certain chamber
Body space makes the heat carrier 10 influence heat conduction efficiency there are the significant temperature difference between effective actuation section and incondensable gas section.
Accordingly, there is the heat pipe 1 of non-condensable gas to pass through the non-condensable gas 30 and an at least protrusion 13 setting drop for this
Low conduction efficiency and operated under an operating temperature section, so that heating electronic package 2 is reached task performance.
Specifically, an at least protrusion 13 is to be located at the cold side 12 close to one end of the heating electronic package 2.Preferably
Ground, the quantity of the protrusion 13 be it is several, those protrusions 13 are to be set in distance and wave-shaped.
In one embodiment of this invention, which is from the inner wall of the heat carrier 10 towards the heat carrier 10
Lateral direction protrusion, and it is uneven that 12 surface of cold side of the heat carrier 10 is presented, and is dissipated with reducing the cold side 12 with this
The area that hot body 3 contacts with each other, and then reduce radiating efficiency.The starting temperature of the heat pipe 1 with non-condensable gas is improved accordingly
Degree enables the heat pipe 1 with non-condensable gas to rerun when the temperature of the heating electronic package 2 improves.
When the heating electronic package 2 is in the initial operation state that operating temperature is low, task performance is low, this has can not
The heat pipe 1 of solidifying gas is inoperative and the heating electronic package 2 is made to keep generated heat, to improve its task performance.Illustrate
, the temperature spread of the heat absorbing side 11 and the cold side 12 is big at this time.
It on the other hand, can be in operating temperature is higher, task performance after operating a period of time when the heating electronic package 2
High state.At this point, this have the heat pipe 1 of non-condensable gas start operation and to heat caused by the heating electronic package 2 into
Row heat dissipation.It is noted that the equal temperature state of presentation of the heat absorbing side 11 and the cold side 12 is without temperature spread at this time.Change sentence
It talks about, the present invention is by reducing the conduction efficiency of the heat pipe 1 with non-condensable gas and the heat with non-condensable gas that makes this
Pipe 1 is inoperative in low temperature, and starts operation and conduct heat after reaching certain temperature.
As shown in figure 3, in one embodiment of this invention, it further includes several gear tugs that this, which has the heat pipe 1 of non-condensable gas,
Portion 40.Those gear tug portions 40 are to be staggered in the hollow chamber 100, and then be able to extend after the working fluid 20 vaporizes
Flow path in the hollow chamber 100 reduces thermal conversion efficiency to increase the condensation time of the working fluid 20.
In one embodiment of this invention, those gear tug portions 40 are to be arranged in the hollow chamber 100, and it is thermally conductive to be located at this
The one end of body 10 far from the heating electronic package 2；In addition, those gear tug portions 40 are to be respectively set to a plate and to connect this thermally conductive
The inner wall of body 10.Specifically, those gear tug portions 40 are to be staggered in interconnected several U-shaped circuits, but reality is real
It is limitation not in the form of this when applying.
Referring additionally to shown in Fig. 4, another implementation form in gear tug portion of the heat pipe with non-condensable gas respectively of the invention.
As shown, the present embodiment is roughly the same with previous embodiment, the heat pipe 1a with non-condensable gas include a heat carrier 10a,
One working fluid 20a, a non-condensable gas 30a and several gear tug portion 40a.Heat carrier 10a have a heat absorbing side 11a and one
Cold side 12a.Cold side 12a forms an at least protrusion 13a.Working fluid 20a and non-condensable gas 30a are filled in
In heat carrier 10a.Those gears tug portion 40a is staggered in heat carrier 10a in interconnected several U-shaped circuits.
The different place of the present embodiment is the set-up mode of those gears tug portion 40a.In the present embodiment, those gear tug portions
40a is that the internal direction respectively from inner wall towards the heat carrier 10a of heat carrier 10a is recessed and extend, to extend the workflow
Flow path after body 20a vaporization in heat carrier 10a, and increase the condensation time of working fluid 20a, turned with reducing heat
Change efficiency.
As shown in fig.5, its temperature change and electronic heating when being used for the heat pipe with non-condensable gas of the invention
The curve graph of component power percentage.It is seen that in one embodiment of this invention, when the function of electronic heating component 2
Rate percentage is relatively low, not yet completely play operating efficiency when, this have the heat pipe 1 of non-condensable gas, 1a because non-condensable gas 30,
The presence of 30a is without will start cooling mechanism.On the other hand, when the temperature of electronic heating component 2 has been increased to certain temperature, such as
At 30 degrees Celsius, the power percentage of the electronic heating component 2 reach close to 100% and play operating efficiency completely.At this point, should
Heat pipe 1,1a with non-condensable gas start to start cooling mechanism, make the temperature of the heat pipe 1 with non-condensable gas, 1a
Certain temperature is gradually decreased down, such as 5 degrees Celsius.Accordingly, the heat pipe 1 with non-condensable gas of the invention, 1a are i.e. in a job
It is operated under temperature range, so that the heating electronic package 2 reaches task performance.
The foregoing is merely presently preferred embodiments of the present invention, the scope of the patents being not intended to limit the invention, other utilizations
The equivalence changes of patent spirit of the invention, should belong to the scope of the patents of the invention.
Claims (10)
1. a kind of heat pipe with non-condensable gas characterized by comprising
One heat carrier, has a hollow chamber, and the heat carrier has the heat absorbing side and thermal conductivity for amplexiforming a heating electronic package
A cold side of a radiator is connect, the cold side forms an at least protrusion, and the cold side is convex by described at least one
The setting in portion and the area for contacting the radiator can be reduced；
One working fluid is filled in the hollow chamber；And
One for reducing the heat pipe with non-condensable gas conduction efficiency and operated under an operating temperature section so that
The heating electronic package reaches the non-condensable gas of task performance, and the non-condensable gas is filled in the hollow chamber.
2. as described in claim 1 with the heat pipe of non-condensable gas, which is characterized in that wherein an at least protrusion is position
In the cold side close to one end of the heating electronic package.
3. as described in claim 1 with the heat pipe of non-condensable gas, which is characterized in that wherein the protrusion is several, institute
Stating several protrusions is to be set in distance.
4. as claimed in claim 3 with the heat pipe of non-condensable gas, which is characterized in that wherein several protrusions are in wave
Wave-like.
5. as described in claim 1 with the heat pipe of non-condensable gas, which is characterized in that wherein an at least protrusion is certainly
The lateral direction of the inner wall of the heat carrier towards the heat carrier is protruded.
6. as described in claim 1 with the heat pipe of non-condensable gas, which is characterized in that wherein the non-condensable gas is sky
Gas.
7. as described in claim 1 with the heat pipe of non-condensable gas, which is characterized in that it further include several gear tug portions, it is described
Several gear tug portions are the flow paths for being staggered in the hollow chamber and being able to extend the working fluid.
8. as claimed in claim 7 with the heat pipe of non-condensable gas, which is characterized in that wherein several gear tug portions are point
The inner wall of the heat carrier is not connected.
9. as claimed in claim 7 with the heat pipe of non-condensable gas, which is characterized in that wherein several gear tug portions are point
Internal direction not from inner wall towards the heat carrier of the heat carrier is recessed and extends.
10. as claimed in claim 7 with the heat pipe of non-condensable gas, which is characterized in that wherein several gear tug portions are
One end positioned at the heat carrier far from the heating electronic package.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710909160.1A CN109588005B (en) | 2017-09-29 | 2017-09-29 | Heat pipe with non-condensable gas |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710909160.1A CN109588005B (en) | 2017-09-29 | 2017-09-29 | Heat pipe with non-condensable gas |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109588005A true CN109588005A (en) | 2019-04-05 |
| CN109588005B CN109588005B (en) | 2020-08-25 |
Family
ID=65919052
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710909160.1A Active CN109588005B (en) | 2017-09-29 | 2017-09-29 | Heat pipe with non-condensable gas |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109588005B (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105045311A (en) * | 2015-08-03 | 2015-11-11 | 华中科技大学 | Temperature control system based on controllable heat pipe |
| CN205031016U (en) * | 2015-10-15 | 2016-02-17 | 广东美的厨房电器制造有限公司 | Back plate and cooking utensil |
| WO2016032759A1 (en) * | 2014-08-25 | 2016-03-03 | J R Thermal LLC | Temperature glide thermosyphon and heat pipe |
| CN207369503U (en) * | 2017-09-29 | 2018-05-15 | 索士亚科技股份有限公司 | Heat pipe with non-condensable gas |
-
2017
- 2017-09-29 CN CN201710909160.1A patent/CN109588005B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016032759A1 (en) * | 2014-08-25 | 2016-03-03 | J R Thermal LLC | Temperature glide thermosyphon and heat pipe |
| CN105045311A (en) * | 2015-08-03 | 2015-11-11 | 华中科技大学 | Temperature control system based on controllable heat pipe |
| CN205031016U (en) * | 2015-10-15 | 2016-02-17 | 广东美的厨房电器制造有限公司 | Back plate and cooking utensil |
| CN207369503U (en) * | 2017-09-29 | 2018-05-15 | 索士亚科技股份有限公司 | Heat pipe with non-condensable gas |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109588005B (en) | 2020-08-25 |
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