CN109581004A - Prevent contact membranes and its manufacturing method short-circuit caused by overcurrent - Google Patents
Prevent contact membranes and its manufacturing method short-circuit caused by overcurrent Download PDFInfo
- Publication number
- CN109581004A CN109581004A CN201810663255.4A CN201810663255A CN109581004A CN 109581004 A CN109581004 A CN 109581004A CN 201810663255 A CN201810663255 A CN 201810663255A CN 109581004 A CN109581004 A CN 109581004A
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- China
- Prior art keywords
- hole section
- input
- basement membrane
- resistance
- overcurrent
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06733—Geometry aspects
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/0735—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card arranged on a flexible frame or film
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06755—Material aspects
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Geometry (AREA)
- Measuring Leads Or Probes (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The present invention relates to a kind of probe units, more specifically, are related to a kind of contact membranes of structure as probe unit.The contact membranes short-circuit caused by overcurrent that prevent of the invention include: basement membrane, are made of soft material；Export through-hole section, in the hole of one end vertically through the basement membrane fill metal and formed, and be connected to plate contact and transmit check signal contact portion；First input through-hole section, separates with the output through-hole section, and fills metal in the hole vertically through the basement membrane and formed, and input is transferred to the inspection signal of the contact portion；Signal transmssion line is formed in the one side of the basement membrane, and connects the output through-hole section and the first input through-hole section；Spatial portion is disconnected, is that the partial section on the extended line of the signal transmssion line is disconnected and formed；And resistance, it is set to the disconnection spatial portion, and connect the section of the disconnection of the signal transmssion line.
Description
Technical field
The present invention relates to a kind of probe units, more specifically, are related to a kind of contact membranes of structure as probe unit.
Background technique
Probe unit is used to check the driving of display panel.
Probe unit transmits the driving for checking that signal carrys out inspection panel to panel.
At this point, checking that signal is the signal of the driving of inspection panel, the electric current for being commonly used for driving RGB is used as checking
Signal.
As illustrated in fig. 1, probe unit is made of body part 10, contact membranes 20, substrate 30, cable 40.
Body part 10 is the structure for being used to support contact membranes 20, substrate 30, cable 40.
Contact membranes 20 be include the structure that the contact portion 21 of panel is contacted with for inspection panel.
Substrate 30 is the structure for being printed with circuit and being used to connect contact membranes 20 and cable 40.
At this point, substrate 30 is made of PCB, glass etc. and usually plays the intermediary of the spacing for the circuit that extension is spaced
Function.
In addition, the driving chip for being connected to circuit can be set in substrate 30.
Cable 40 is linking probe unit and primary processing unit, and the structure of input checking signal.
In probe unit, if the inspection signal for being input to cable 40 is passed to contact membranes 20 by substrate 30, and contact
Film 20 and plate contact, then from contact membranes 20 to panel, transmitting checks signal.
For such probe unit, between more than two contact portions 21 be situated between have foreign matter or with the contact of panel
In the case that permutation misplaces, contact portion 21 can short circuit.
At this point, since in the contact portion 21 of short circuit high fever occurs for current convergence, thus exists and make contact portion 21 because of high fever
And the problem of being damaged around the panel that is contacted of contact portion 21.
Existing technical literature
Patent document
Patent document 0001: Ebrean Registered Patent 10-1152181
Patent document 0002: Ebrean Registered Patent 10-1241969
Patent document 0003: Ebrean Registered Patent 10-1386122
Summary of the invention
Technical problem
Solving problem point is project of the invention.
Contact membranes and its manufacturing method short-circuit caused by overcurrent are prevented the object of the present invention is to provide a kind of.
Technical solution
The contact membranes short-circuit caused by overcurrent that prevent of the invention include: basement membrane, are made of soft material；Output
Through-hole section, in the hole of one end vertically through the basement membrane fill metal and formed, and be connected to plate contact and pass
Pass the contact portion for checking signal；First input through-hole section, separates with the output through-hole section, and vertically through the basement membrane
Hole in fill metal and formed, and input is transferred to the inspection signal of the contact portion；Signal transmssion line is formed in described
The one side of basement membrane, and connect the output through-hole section and the first input through-hole section；Spatial portion is disconnected, is in the signal
Partial section on the extended line of transmission line is disconnected and is formed；And resistance, it is set to the disconnection spatial portion, and connect
The section of the disconnection of the signal transmssion line.
Of the invention prevents contact membranes short-circuit caused by overcurrent to be characterized in that, the resistance is by film resistor structure
At the resistance is covered by a part above one end and the other end by the signal transmssion line and connected with the signal transmssion line
It connects.
Of the invention prevents contact membranes short-circuit caused by overcurrent to be characterized in that, constitutes the metal of the resistance by leading
Electric rate is constituted lower than the metal for the metal for constituting the signal transmssion line.
Of the invention prevents contact membranes short-circuit caused by overcurrent to be characterized in that, the signal transmssion line include Cu and
It constitutes, the resistance includes any of TaN, Ni-Cr-Si, Ni-Cr, Ti and constitutes.
The contact membranes short-circuit caused by overcurrent that prevent of the invention include: permutation edge part, are formed in the disconnection
The section of the signal transmssion line of spatial portion has the width for the width for being greater than the section for connecting the output through-hole section.
Of the invention prevents contact membranes short-circuit caused by overcurrent to be characterized in that, passes in two adjacent signals
Defeated line formation has the position of the permutation edge part different from each other.
Of the invention prevents contact membranes short-circuit caused by overcurrent to be characterized in that, the disconnection space of the resistance is arranged
The upper surface of portion is ground by CMP engineering, has 10nm roughness value below.
The contact membranes short-circuit caused by overcurrent that prevent of the invention include: signal set line, are formed in the basement membrane
Another side, and side connection be respectively formed in more than two signal transmssion lines it is described first input through-hole section；
And second input through-hole section, fill metal in the hole vertically through the basement membrane in the other side of the signal set line
And it is formed, and input is transferred to the inspection signal of the first input through-hole section.
The manufacturing method for preventing contact membranes short-circuit caused by overcurrent of the invention includes: 1) to prepare by soft material
The step of basement membrane of composition；2) the step of the basement membrane forms output through-hole section and the first input through-hole section；3) in the base
Described first in the one side of film inputs between through-hole section and the output through-hole section the step of forming resistance；And 4) described
The one side of basement membrane formed the connection output through-hole section, the first input through-hole section, the resistance signal transmssion line step
Suddenly.
It include: to be ground by CMP engineering so as to form the institute of the resistance between the step 2) and step 3)
Stating the upper surface of basement membrane has the step of 10nm roughness value below.
The second input through-hole section is formed in the step 2), forms connection the first input through-hole in the step 4)
Portion, it is described second input through-hole section signal set line.
The effect of invention
First, the present invention has current convergence when preventing contact portion short circuit, to prevent contact portion and contact portion from being contacted
Panel around the advantages of being damaged.
Second, the active component dew that the present invention should be capped when preventing the abnormal permutation of resistance and signal transmssion line and being formed
Resistance value is caused to change out.
Third has the advantages that two adjacent signal transmssion lines can be reduced separated by a distance.
4th, having prevents from being formed coarse below resistance, thus the advantages of preventing resistance value from changing.
5th, have and connect contact portion and input pad side by side, the advantages of quantity so as to increase contact portion.
Detailed description of the invention
Fig. 1 is the figure for showing the structure of probe unit.
Fig. 2 is the figure for showing the section of contact membranes.
Fig. 3 is the figure for showing signal transmssion line He its dependency structure.
Fig. 4 to Fig. 5 is the figure for showing the structure of permutation edge part.
Fig. 6 is the figure for showing the structure of contact membranes.
Fig. 7 is the figure for showing the manufacturing method of contact membranes.
Symbol description
10: body part, 20: contact membranes, 21: contact portion, 30: substrate, 40: cable, 100: basement membrane, 200: output through-hole
Portion, 300: the first input through-hole sections, 400: signal transmssion line, 410: disconnection spatial portion, 420: permutation edge part, 500: resistance,
600: signal set line, 610: first set line, 620: second set line, 630: third assembly line, 700: the second input through-holes
Portion, 710: input pad.
Specific embodiment
In the case that the contact permutation there is foreign matter or with panel that is situated between more than two contact portions 21 misplaces, contact
It portion 21 can short circuit.
At this point, thus there are contact portion 21 and contact portions since in the contact portion 21 of short circuit high fever occurs for current convergence
The problem of being damaged around 21 panels contacted.
To solve such problems, as illustrated in Fig. 2 to Fig. 3, contact membranes 20 include basement membrane 100, output through-hole section 200,
First input through-hole section 300, signal transmssion line 400 and resistance 500.
Basement membrane 100 is made of soft material.
At this point, basement membrane 100 can be made of plastic series such as polyimides (polyimide).
Output through-hole section 200 be in the hole of the side vertically through basement membrane 100 fill metal and formed, and be connected to
Plate contact and transmit check signal contact portion 21.
At this point, the horizontal cross-section of output through-hole section can be formed as round, ellipse, quadrangle, the multiplicity such as polygon
Shape.
In addition, contact portion 21 can be independent structure or etching output through-hole section 200 around basement membrane 100 and protrude
Export a part of through-hole section 200.
First input through-hole section 300 is separated with output through-hole section 200, and gold is filled in the hole vertically through basement membrane 100
Belong to and formed, and input be transferred to output through-hole section 200 inspection signal.
At this point, the horizontal cross-section of the first input through-hole section 300 can be formed as circle, ellipse, quadrangle, polygon etc.
The shape of multiplicity.
Signal transmssion line 400 is formed in the one side of basement membrane 100, and connects output through-hole section 200 and the first input through-hole section
300, the inspection signal for being input to the first input through-hole section 300 can be transmitted to output through-hole section 200.
In the disconnection spatial portion 410 that the partial section that signal transmssion line 400 is formed on extended line disconnects.
Resistance 500, which is set to, disconnects spatial portion 410, and the section of the disconnection of connection signal transmission line 400.
That is, configuration resistance 500 is so as to check that signal is input to contact portion 21 by resistance 500, in 21 short circuit of contact portion
In the case where, the electric current for concentrating on contact portion 21 concentrates on contact portion 21 by resistance 500.
At this point, resistance 500 is breaking and blocks and concentrates originally in the case where overcurrent is more than the allowable current of resistance 500
In the electric current of contact portion 21.
Resistance 500 can be the film resistor formed by semiconducter engineering.
Be initially formed after resistance 500 and form signal transmssion line 400 so that one end of resistance 500 and above the other end one
Part is covered and connect with signal transmssion line 400 by signal transmssion line 400.
The metal for constituting resistance 500 is made of the metal that conductivity is lower than the metal for constituting signal transmssion line 400, in electricity
It is swimmingly breaking when in adfluxion.
At this point, signal transmssion line 400 may include Cu and constitute.
In addition, resistance 500 may include any of metal TaN, Ni-Cr-Si, Ni-Cr, Ti that conductivity is lower than Cu
And it constitutes.
A part is not by the length of the width of the upper surface of signal transmssion line 400 covers and exposes resistance 500 and extending direction
Degree ratio can be 1:1 to 1:20.
In this way, the present invention, which has, prevents in the short circuit of contact portion 21 current convergence to prevent 21 institute of contact portion 21 and contact portion
The advantages of being damaged around the panel of contact.
When forming signal transmssion line 400 in a manner of covering a part of resistance 500 after being initially formed resistance 500,
The normal permutation not in such a way that signal transmssion line 400 covers a part of resistance 500 and in the case where being formed, existing should be by signal
The problem of part for the resistance 500 that transmission line 400 covers exposes and resistance value is caused to change.
To solve such problems, as illustrated in figure 4, including permutation edge part 420, it is formed in and disconnects spatial portion 410
Signal transmssion line 400 section have be greater than connection output through-hole section 200 section width width.
For permutation edge part 420, even if the feelings formed in resistance 500 and the abnormal permutation of signal transmssion line 400
Under condition, the part that resistance 500 should be capped will also be covered within the region for being included in permutation edge part 420.
In this way, in the present invention, even if in the case where resistance 500 and the abnormal permutation of signal transmssion line 400 are formed, electricity
The part that resistance 500 should be capped will not expose, to prevent resistance value from changing.
Be formed with permutation edge part 420 signal transmssion line 400 exist two adjacent signal transmssion lines 400 separate away from
From elongated problem.
To solve such problems, as illustrated in fig. 5, it is formed in the permutation edge of two adjacent signal transmssion lines 400
Portion 420 is formed in position different from each other.
That is, the permutation edge part 420 for being formed in two adjacent signal transmssion lines 400 is not located in same horizontal line, and
It is to be located on vertical line in an overlapping manner.
In this way, having the advantages that two adjacent signal transmssion lines 400 can be reduced separated by a distance.
Be arranged the upper surface of the disconnection spatial portion 410 of resistance 500 roughness (surface roughness) value with 50nm with
On roughness value.
If forming resistance 500 in the upper surface of disconnection spatial portion 410 of the roughness value with 50nm or more, there are resistance
The problem of being formed coarse below 500 and resistance value caused to change.
To solve such problems, before forming resistance 500, ground by CMP engineering so as to disconnect space
After the upper surface of portion 410 has 10nm roughness value below, resistance 500 is formed disconnecting the upper surface of spatial portion 410.
In this way, having prevents from being formed coarse below resistance 500, thus the advantages of preventing resistance value from changing.
Due to forming 500 in the case where forming contact portion 21 of 500 contact membranes 20 to panel outgoing inspection signal
A substrate contact is with corresponding with contact portion 21, thus will input weldering to the input pad 710 of 20 input checking signal of contact membranes
The size of disk 710 is restricted when being formed larger, can not increase the quantity of contact portion 21, thus is needed 1000 when checking and connect
In the case where the panel of contact portion 21, there is the problems such as checking in two times.
To solve such problems, as illustrated in FIG. 6, contact membranes 20 further include that signal set line 600, second inputs through-hole
Portion 700.
Signal set line 600 is formed in the another side of basement membrane 100, and connection is respectively formed in more than two letters in side
First input through-hole section 300 of number transmission line 400.
The first defeated of more than two signal transmssion lines 400 is respectively formed in that is, connecting side by side in signal set line 600
Enter through-hole section 300.
Signal set line 600 may include the first set line for driving connection side by side Red (red) signal of RGB
610, the second set line 620 of Green (green) signal is connected side by side, connects the third assembly line of Blue (indigo plant) signal side by side
630。
Second input through-hole section 700 is filled in the hole vertically through basement membrane 100 in the other side of signal set line 600
Metal and formed, and input is transferred to the inspection signal of the first input through-hole section 300.
In the input pad 710 that the one side connecting substrate of the second input through-hole section 700 is contacted.
In the another side connection signal assembly line 600 of the second input through-hole section 700.
In this way, paratactic contact portion 21 and input pad 710, thus have the advantages that the quantity of contact portion 21 can be increased.
As illustrated in figure 7, the manufacturing method of contact membranes 20 is as follows.
Firstly, preparing the basement membrane 100 being made of soft material.
Later, output through-hole section 200, first is formed in basement membrane 100 input the input through-hole section 700 of through-hole section 300, second.
At this point, passing through gold-plated engineering after forming hole in basement membrane 100 by etching engineering or using the processing of utensil first
Metal is filled in hole to form output through-hole section 200, first and input the input through-hole section 700 of through-hole section 300, second.
Later, it is ground by CMP engineering so as to form the upper surface of basement membrane 100 of film resistor with 10nm or less
Roughness value.
Later, resistance is formed between the output through-hole section 200 and the first input through-hole section 300 in the one side of basement membrane 100
500。
At this point, forming exposure mask by photoetching engineering using film resistor, and electricity is formed by vapor deposition engineering or gold-plated engineering
Resistance 500.
Later, connection output through-hole section 200, first is formed in the one side of basement membrane 100 input through-hole section 300, resistance 500
Signal transmssion line 400 and connection the first input through-hole section 300, second input the signal set line 600 of through-hole section 700.
At this point, forming exposure mask by photoetching engineering, and 400 He of signal transmssion line is formed by vapor deposition engineering or gold-plated engineering
Signal set line 600.
In addition, signal transmssion line 400 is formed as covering a part of resistance 500.
The mistake to form input pad 710 and contact portion 21 can also be added in the manufacturing method of contact membranes 20 above-mentioned
Journey.
Exposure mask is formed in the one side of the second input through-hole section 700 by photoetching engineering, and passes through vapor deposition engineering or plating metal working
Journey forms input pad 710.
The a part for exporting the basement membrane 100 around through-hole section 200 is set to expose to form contact portion 21 by etching engineering.
Claims (11)
1. a kind of prevent contact membranes short-circuit caused by overcurrent characterized by comprising
Basement membrane is made of soft material；
Through-hole section is exported, metal is filled in the hole of one end vertically through the basement membrane and is formed, and be connected to and panel
It contacts and transmits the contact portion for checking signal；
First input through-hole section, separates, and fill metal in the hole vertically through the basement membrane with the output through-hole section
And it is formed, and input is transferred to the inspection signal of the contact portion；
Signal transmssion line is formed in the one side of the basement membrane, and connects the output through-hole section and the first input through-hole
Portion；
Spatial portion is disconnected, is that the partial section on the extended line of the signal transmssion line is disconnected and formed；And
Resistance is set to the disconnection spatial portion, and connects the section of the disconnection of the signal transmssion line.
2. according to claim 1 prevent contact membranes short-circuit caused by overcurrent, which is characterized in that
The resistance is made of film resistor,
The resistance by a part above one end and the other end by the signal transmssion line cover and with the signal transmssion line
Connection.
3. according to claim 2 prevent contact membranes short-circuit caused by overcurrent, which is characterized in that
The metal for constituting the resistance is made of the metal that conductivity is lower than the metal for constituting the signal transmssion line.
4. according to claim 3 prevent contact membranes short-circuit caused by overcurrent, which is characterized in that
The signal transmssion line includes Cu and constitutes, the resistance include any of TaN, Ni-Cr-Si, Ni-Cr, Ti and
It constitutes.
5. according to claim 2 prevent contact membranes short-circuit caused by overcurrent characterized by comprising
Permutation edge part, the section for being formed in the signal transmssion line for disconnecting spatial portion have the output described greater than connection logical
The width of the width in the section of hole portion.
6. according to claim 5 prevent contact membranes short-circuit caused by overcurrent, which is characterized in that
It is different from each other in the position that two adjacent signal transmssion lines are formed with the permutation edge part.
7. according to claim 2 prevent contact membranes short-circuit caused by overcurrent, which is characterized in that
The upper surface of the disconnection spatial portion that the resistance is arranged is ground by CMP engineering, has 10nm roughness value below.
8. according to any one of claim 1 to 7 prevent contact membranes short-circuit caused by overcurrent, which is characterized in that
Include:
Signal set line, is formed in the another side of the basement membrane, and is respectively formed in side connection more than two described
The first input through-hole section of signal transmssion line；And
Second input through-hole section, fills metal in the hole vertically through the basement membrane in the other side of the signal set line
And it is formed, and input is transferred to the inspection signal of the first input through-hole section.
9. a kind of manufacturing method for preventing contact membranes short-circuit caused by overcurrent characterized by comprising
1) the step of preparing the basement membrane being made of soft material；
2) the step of the basement membrane forms output through-hole section and the first input through-hole section；
3) step of resistance is formed between the first input through-hole section and the output through-hole section in the one side of the basement membrane
Suddenly；And
4) letter of through-hole section, the resistance is inputted in the one side formation connection output through-hole section of the basement membrane, described first
The step of number transmission line.
10. the manufacturing method according to claim 9 for preventing contact membranes short-circuit caused by overcurrent, which is characterized in that
It include: to be ground by CMP engineering so as to form the base of the resistance between the step 2) and step 3)
The upper surface of film has the step of 10nm roughness value below.
11. the manufacturing method according to claim 9 or 10 for preventing contact membranes short-circuit caused by overcurrent, feature exist
In,
The second input through-hole section is formed in the step 2),
The signal set line of connection the first input through-hole section, the second input through-hole section is formed in the step 4).
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2017-0127174 | 2017-09-29 | ||
| KR1020170127174A KR101835762B1 (en) | 2017-09-29 | 2017-09-29 | Contact film preventing short circuit due to overcurrent and method for manufacturing the same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109581004A true CN109581004A (en) | 2019-04-05 |
Family
ID=61688765
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810663255.4A Pending CN109581004A (en) | 2017-09-29 | 2018-06-25 | Prevent contact membranes and its manufacturing method short-circuit caused by overcurrent |
Country Status (2)
| Country | Link |
|---|---|
| KR (1) | KR101835762B1 (en) |
| CN (1) | CN109581004A (en) |
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2017
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2018
- 2018-06-25 CN CN201810663255.4A patent/CN109581004A/en active Pending
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| JP2002124552A (en) * | 2000-10-13 | 2002-04-26 | Seiko Instruments Inc | Probe card and semiconductor-inspecting equipment |
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| CN103018500A (en) * | 2012-11-29 | 2013-04-03 | 上海华力微电子有限公司 | Device for preventing probe on semi-automatic probe station from being burnt |
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Also Published As
| Publication number | Publication date |
|---|---|
| KR101835762B1 (en) | 2018-03-07 |
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