KR101682950B1 - The probe pin with overcurrent protection - Google Patents

The probe pin with overcurrent protection Download PDF

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Publication number
KR101682950B1
KR101682950B1 KR1020150064102A KR20150064102A KR101682950B1 KR 101682950 B1 KR101682950 B1 KR 101682950B1 KR 1020150064102 A KR1020150064102 A KR 1020150064102A KR 20150064102 A KR20150064102 A KR 20150064102A KR 101682950 B1 KR101682950 B1 KR 101682950B1
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KR
South Korea
Prior art keywords
contact portion
sleeve
upper contact
probe pin
overcurrent
Prior art date
Application number
KR1020150064102A
Other languages
Korean (ko)
Other versions
KR20160131544A (en
Inventor
유덕수
Original Assignee
(주)씨투와이드
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Publication date
Application filed by (주)씨투와이드 filed Critical (주)씨투와이드
Priority to KR1020150064102A priority Critical patent/KR101682950B1/en
Publication of KR20160131544A publication Critical patent/KR20160131544A/en
Application granted granted Critical
Publication of KR101682950B1 publication Critical patent/KR101682950B1/en

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02H—EMERGENCY PROTECTIVE CIRCUIT ARRANGEMENTS
    • H02H3/00—Emergency protective circuit arrangements for automatic disconnection directly responsive to an undesired change from normal electric working condition with or without subsequent reconnection ; integrated protection
    • H02H3/08—Emergency protective circuit arrangements for automatic disconnection directly responsive to an undesired change from normal electric working condition with or without subsequent reconnection ; integrated protection responsive to excess current

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Measuring Leads Or Probes (AREA)

Abstract

The present invention has an overcurrent shutoff function that protects expensive inspection equipment and a circuit board for inspection by preventing overcurrent from flowing through the probe pin by incorporating protection means that are short-circuited or absorbed when an overcurrent is applied to the inside of the probe pin To a probe pin.
To this end, the present invention relates to a method for press-punching a sleeve, an upper contact portion, an elastic portion and a lower contact portion into a thin sheet in a multistage manner, bending the sleeve into a cylinder, bending the upper contact portion, the elastic portion and the lower contact portion into a cylinder, A probe pin having a built-in overcurrent cut-off function, wherein the upper contact portion and the elastic portion are provided with connecting pieces on opposite faces in a state where they are separated from each other; Wherein the upper contact portion and the elastic portion are bent into a cylindrical shape after a protective means for blocking or absorbing an overcurrent is coupled to each connecting piece; The upper contact portion and the connecting piece on the upper side of the elastic portion are tightly fixed to the inner circumferential surface of the sleeve, and the lower contact portion is raised and lowered inside the sleeve; And an inner surface of the sleeve is coated with an uncoated portion so that the protective means is placed on the coated portion.

Description

The probe pin with overcurrent protection function

The present invention relates to a probe pin having an overcurrent cutoff function, and more particularly, to a probe pin having an overcurrent cutoff function, and more particularly, And a probe pin having an overcurrent cutoff function capable of protecting a circuit board for inspection.

Generally, probe pins are widely used for semiconductor devices and test sockets for testing semiconductor chip packages. An example in which a probe pin is used in a test socket is disclosed in Patent Application No. 68258 of 1999, Utility Model Registration Application No. 31810 of 2001, and the like. The probe pin is made of a conductive material. The probe pin includes a sleeve having an upper stopping jaw and a lower stopping jaw facing inward, an upper contact portion and a lower contact portion in which a part of the region is mounted inside the sleeve, And a coil spring mounted on the sleeve so as to be interposed between the lower contact portions.

In the conventional probe pin as described above, the sleeve is manufactured by drilling a bar-like rod having a certain width with a tubular pipe. However, since the manufacture of the sleeve is performed by drilling the bar material by a usual drilling machine, it is uneconomical due to a high incidence of defects, and its inner diameter is extremely small as about 0.4 mm, which makes the work inconvenient and difficult to automate. There is an inefficient problem that the unit price increases.

In view of this, domestic patents 1031634 and 948571 press-punch a thin sheet in multiple steps to cut the upper contact portion, the lower contact portion and the elastic portion integrally, and then the cut portions are bent in a circular shape so that one probe A processing method has been proposed. This makes it possible to manufacture a large number of probe pins within a short time by reducing the number of parts constituting the probe pin and automating the manufacture of the sleeve which is difficult to automate.

However, in recent years, there has been a need for a technique for blocking the overcurrent as well as the shape of the probe pin. Probes for inspecting a high output product such as a battery chip of an electric vehicle or a high-resolution graphic board are not short-circuited when an over-current is applied, so that an overcurrent flows to the inspection board having the probes.

SUMMARY OF THE INVENTION The present invention has been developed in view of the problems of the prior art, and it is an object of the present invention to provide a probe pin that prevents short-circuiting or absorption when an overcurrent is applied to the probe pin, And a probe pin having an overcurrent cutoff function that can protect a circuit board for inspection.

Another object of the present invention is to provide a probe pin having an overcurrent cutoff function in which the manufacturing process is simplified by press-fitting the protective means in a process of press-punching a thin sheet in a multistage manner or by combining with a surface mounting technique (SMT) .

To this end, the present invention relates to a method for press-punching a sleeve, an upper contact portion, an elastic portion and a lower contact portion into a thin sheet in a multistage manner, bending the sleeve into a cylinder, bending the upper contact portion, the elastic portion and the lower contact portion into a cylinder, A probe pin having a built-in overcurrent cut-off function, wherein the upper contact portion and the elastic portion are provided with connecting pieces on opposite faces in a state where they are separated from each other; Wherein the upper contact portion and the elastic portion are bent into a cylindrical shape after a protective means for blocking or absorbing an overcurrent is coupled to each connecting piece; The upper contact portion and the connecting piece on the upper side of the elastic portion are tightly fixed to the inner circumferential surface of the sleeve, and the lower contact portion is raised and lowered inside the sleeve; And an inner surface of the sleeve is coated with an uncoated portion so that the protective means is placed on the coated portion.

According to the present invention, a sheet is pressed and punched in a plurality of steps to form an upper contact portion, an elastic portion and a lower contact portion, and also a sleeve is formed, and protective means for blocking or absorbing an overcurrent is formed between the upper contact portion and the elastic portion, The sleeve is coated with a nonconductive material on the inner circumferential surface, and the upper contact portion, the elastic portion, and the lower contact portion are bent into a cylinder, and the sleeve is also bent by a cylinder to form a probe pin.

At this time, since the protection means is formed when the upper and lower contact portions and the elastic portion are formed together, there is no need to construct a separate additional assembling process, so that the manufacturing process is simple. In particular, since the protection means is formed between the upper contact portion and the elastic portion by press-fitting or surface mounting technology, it is easy to carry out. In addition, when the overcurrent flows, the protection means blocks or accommodates and absorbs the probes. Therefore, there is an advantage that the reliability of the product is improved since the probe pins do not affect a plurality of test circuit boards and inspection objects.
Further, the upper contact portion and the connecting piece on the upper end of the elastic portion are closely fixed to the inner circumferential surface of the sleeve, and the inner circumferential surface of the sleeve has a nonconductive coating portion so that the protective means is wrapped in the coating portion. Therefore, since the protection means does not move in the sleeve and only the lower contact portion moves due to elasticity, there is no fear that the protection means is short-circuited to the short circuit, thereby improving the reliability of the product.

Fig. 1 is a view showing a manufacturing process of a probe pin according to an embodiment of the present invention
Fig. 2 is a sectional view of the manufacturing process of the protection means of the embodiment of the present invention
3 is a cross-sectional view of the probe pin of the embodiment of the present invention
4 is a view showing a process of manufacturing a probe pin according to another embodiment of the present invention

1 to 3, the probe pin of the embodiment of the present invention includes a sleeve 2, an upper contact portion 3, an elastic portion 4, and a lower contact portion 5 in a process of press-punching a thin sheet in a multi- As shown in FIG. At this time, the upper contact portion 3 is provided on the upper side of the seat 1, and the elastic portion 4 and the lower contact portion 5 are hanged on the lower side of the seat 1.

In this state, the connecting pieces 6 are provided on the opposite surfaces of the upper contact portion 3 and the elastic portion 4. A thin-walled plate is press-fitted into these connecting pieces 6, or the capacitor parts are soldered by surface mounting technique. These lead plates and capacitor parts are protective means 7 for blocking or receiving an overcurrent. And a coated portion 8 coated with an insulator is provided on the inner side surface of the sleeve 2 in the unfolded state.

In this state, the above-described respective components are separated from the seat 1 and then bent into a cylindrical shape to be housed inside the sleeve 2. The upper contact portion 3 is located on the upper side and the lower contact portion 5 is provided on the lower side. Between which an elastic portion 4 and a protective means 7 are provided. The upper contact portion 3 and the connecting piece 6 on the upper side of the elastic portion 4 are tightly fixed to the inner circumferential surface of the sleeve 2 and the lower contact portion 5 is raised and lowered inside the sleeve 2.

At this time, the protective means 7 is located in the coating portion 8 formed on the inner surface of the sleeve 2 and does not move between the fixed upper contact portion 3 and the connecting piece 6 of the elastic portion 4, There is no possibility of short circuit. The current applied through the upper contact portion 3 is first supplied to the protection means 7 and flows through the inner wall of the elastic portion 4 and the sleeve 2 to the lower contact portion 5 below. Therefore, when the overcurrent is applied, the protection means 7 can cut off or absorb the current.

In the embodiment of the present invention configured as described above, when the protection means 7 is constituted by a lead plate, the fuse serves to cut the lead plate when an overcurrent flows. A fuse is a device that automatically cuts off excessive currents exceeding a specified value in a wire. When an overcurrent flows, the fuse melts due to the heat generated by the current. Fuses are mainly made of low melting point lead and tin or alloys of zinc and tin. However, in the case of tungsten, which has a very high melting point, it produces a thread-like tungsten wire through precision machining, and is used as a fuse for microcurrent.

When the protection means 7 is a capacitor component, it is soldered to both sides of the connection piece 6 by a surface mounting technique. When the overcurrent flows, the capacitor is absorbed by the capacitor.

A plurality of probe pins are disposed on the inspection board. The upper contact portion 3 and the lower contact portion 5 circuitly connect the inspection object and the inspection equipment. In recent years, it has become increasingly necessary to inspect high-output products such as battery chips of a vehicle or a graphic card of a computer as well as semiconductor components. These high-power products may damage the inspection board or damage the inspection equipment if overvoltage flows through the probe pins. Therefore, when the overvoltage is generated, the protection means 7 blocks or absorbs the overvoltage at the corresponding probe pin, so that there is no problem in the circuit board or the inspection equipment. Since the probe pin is a consumable part, when the protection unit 7 is short-circuited by interrupting the overcurrent, it may be replaced with a new probe pin.

4 shows another embodiment of the present invention in which a sleeve 2, a lower contact portion 5, an elastic portion 4 and an upper contact portion 3 are formed in a thin sheet 1 in a multistage manner. At this time, the sleeve (2) and the lower contact portion (5) are integrally formed, and the elastic portion (4) is connected to the lower end of the sleeve (2).

A connection piece 6 is formed on the opposite surface of the elastic portion 4 and the upper contact portion 3. The connection plate 6 is press-fitted or surface-mounted on a lead plate or a capacitor component of the protection means 7 .

In this state, the upper contact portion 3 and the elastic portion 4 are bent into a cylinder, and the elastic portion 4 and the upper contact portion 3 are embedded in the sleeve 2 which is bent into a cylinder. And if the protective means 7 is a thin plate, it is preferably bent in a cylindrical manner together with the upper contact portion 3.

According to another embodiment of the present invention constructed as described above, the elastic part 4 and the lower contact part 5 are integrally provided at the lower part of the sleeve 2, which simplifies the manufacturing process compared to the embodiment of the present invention.

1: Sheet 2: Sleeve
3: upper contact portion 4: elastic portion
5: lower contact portion 6: connecting piece
7: Protection means 8:

Claims (4)

The sleeve, the upper contact portion, the elastic portion, and the lower contact portion are press-punched in a multistage manner on the thin sheet, the sleeve is bent into a cylinder, and the upper contact portion, the elastic portion and the lower contact portion are bent into a cylinder, The probe pin comprising:
Wherein the upper contact portion and the elastic portion are provided with connecting pieces on opposite surfaces in a state of being separated from each other;
Wherein the upper contact portion and the elastic portion are bent into a cylindrical shape after a protective means for blocking or absorbing an overcurrent is coupled to each connecting piece;
The upper contact portion and the connecting piece on the upper side of the elastic portion are tightly fixed to the inner circumferential surface of the sleeve, and the lower contact portion is raised and lowered inside the sleeve;
Wherein a non-conductive coating portion is formed on the inner circumferential surface of the sleeve so that the protective means is placed on the coating portion. The method according to claim 1,
The protection means is composed of a thin board or a capacitor part,
The lead plate is connected to the connecting pieces by press-fitting,
Wherein the capacitor component is soldered to the connecting pieces by a surface mounting technique. delete delete
KR1020150064102A 2015-05-07 2015-05-07 The probe pin with overcurrent protection KR101682950B1 (en)

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Application Number Priority Date Filing Date Title
KR1020150064102A KR101682950B1 (en) 2015-05-07 2015-05-07 The probe pin with overcurrent protection

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Application Number Priority Date Filing Date Title
KR1020150064102A KR101682950B1 (en) 2015-05-07 2015-05-07 The probe pin with overcurrent protection

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KR20160131544A KR20160131544A (en) 2016-11-16
KR101682950B1 true KR101682950B1 (en) 2016-12-06

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101835762B1 (en) * 2017-09-29 2018-03-07 (주)위드멤스 Contact film preventing short circuit due to overcurrent and method for manufacturing the same

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002031648A (en) * 2000-07-14 2002-01-31 Yamaichi Electronics Co Ltd Contact probe and its manufacturing method
KR101031634B1 (en) 2008-06-11 2011-04-27 주식회사 휴먼라이트 The Probe Pin and The Mathode

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0477674A (en) * 1990-07-19 1992-03-11 Nec Corp Probe
KR100901515B1 (en) * 2007-06-26 2009-06-08 (주)마이크로컨텍솔루션 Memory module test socket for preventing over-current

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002031648A (en) * 2000-07-14 2002-01-31 Yamaichi Electronics Co Ltd Contact probe and its manufacturing method
KR101031634B1 (en) 2008-06-11 2011-04-27 주식회사 휴먼라이트 The Probe Pin and The Mathode

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101835762B1 (en) * 2017-09-29 2018-03-07 (주)위드멤스 Contact film preventing short circuit due to overcurrent and method for manufacturing the same

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