CN109576642A - A kind of production method that vapor deposition uses metal mask plate - Google Patents
A kind of production method that vapor deposition uses metal mask plate Download PDFInfo
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- CN109576642A CN109576642A CN201811613059.2A CN201811613059A CN109576642A CN 109576642 A CN109576642 A CN 109576642A CN 201811613059 A CN201811613059 A CN 201811613059A CN 109576642 A CN109576642 A CN 109576642A
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- Prior art keywords
- electroforming
- substrate
- layer
- vapor deposition
- mask plate
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Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/10—Moulds; Masks; Masterforms
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/562—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of iron or nickel or cobalt
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electrochemistry (AREA)
- Mechanical Engineering (AREA)
- Physical Vapour Deposition (AREA)
Abstract
The present invention provides a kind of production method of vapor deposition metal mask plate, production method is the following steps are included: S5, S1, substrate preparation, S2, first time electroforming, S3, drying, second of electroforming of S4 take off film layering；It is characterized in that, the first time electroforming step preparation is nickel metal layer, second of electroforming step preparation is dilval layer, and the dilval layer is formed on the nickel metal layer.This method can effectively eliminate the internal stress of evaporation mask plate, while avoid the drawbacks of increasing amount organic solvent can be mingled with impurity in mask plate in electroforming solution.
Description
Technical field
The invention belongs to display panel industries, are related to a kind of mask plate applied in OLED display panel manufacturing process,
More particularly to a kind of production method of vapor deposition metal mask plate.
Background technique
In recent years, OLED had been widely used in the multiple fields such as smart phone, smartwatch, tablet computer, TV.And
The size of graphics resolution (PixelsPerInch-PPI) be evaluate one piece of OLED performance height main prerequisite it
One.Because of higher PPI numerical value, then it represents that display screen can show image with higher density, and the details of picture is abundanter,
It is higher to intend genuine degree.Therefore, the OLED display of high PPI is the main flow direction of follow-up developments.
Currently, its pixel of OLED display mainly uses high desnity metal mask plate (FMM) as barrier bed, by covering
Figure opening in template is steamed respectively by the different location of the luminous organic material vapor deposition of reddish yellow blue three-color to screen
The quality of the high desnity metal mask plate of plating directly affects the quality of monitor resolution.Electroforming is as high desnity metal mask
A kind of production method of plate has many advantages, such as that open surfaces are deposited and side wall is smooth, precision is high, but due to Ni-Fe alloy material
Biggish internal stress can be generated in electrodeposition process, therefore uses the Ni-Fe alloying metal mask plate of electroforming process production easily
It crimps on substrate, can directly be separated with substrate when serious, cause scrapping for product, previous answering for reduction mask plate
A large amount of organic additive can be added in power in electroforming solution, and this additive can be mingled with plating in mask plate manufacturing process
In layer, the brittleness of mask plate is caused to increase, toughness reduction, easily goes wrong to be welded on aluminium frame, reduce making for mask plate
Use the service life.
Summary of the invention
In view of this, the present invention provides a kind of new vapor deposition metal mask plate manufacture craft, in production dilval
Before mask plate, one layer of nickel metal layer of first electroforming on substrate, then one layer of ferronickel of electroforming is closed again on the basis of nickel metal layer
Layer gold, because can generate tensile stress inside dilval layer during electroforming, and nickel metal layer can generate compression, use nickel
Metal layer generates compression to offset the tensile stress of dilval layer, subsequent again two separate, so that surface light can be obtained
Bright, smooth dilval mask plate.This method can effectively eliminate the internal stress of evaporation mask plate, while avoid in electricity
The drawbacks of increasing amount organic solvent can be mingled with impurity in mask plate in casting liquid.
Specific technical solution is as follows.
It is a kind of vapor deposition use metal mask plate production method, production method the following steps are included:
S1, substrate prepare, S2, first time electroforming, S3, drying, second of electroforming of S4, S5, take off film layering；It is characterized in that, institute
State the preparation of first time electroforming step is nickel metal layer, and second of electroforming step preparation is dilval layer, the nickel
Iron alloy layer is formed on the nickel metal layer.
Further, the substrate of step S1 prepares to include selecting substrate, pad pasting, exposure, development.
Further, the substrate of selecting is selection stainless steel substrate as substrate, and substrate surface is polished, is removed
Oil, is dried cleaning；
The pad pasting is to paste one layer of dry film in substrate surface；
The exposure is open to expose vapor deposition out on the dry film surface；
The development is the dry film that opening portion is deposited after retaining the step of exposure, and development is got rid of the vapor deposition on substrate and opened
Remaining dry film outside mouthful.
Further, the first time electroforming in step S2 is that the substrate after development is put into electroforming solution, electroforming solution herein
Main component is nickel sulfamic acid, so as to not have one layer of uniform nickel metal layer of part electroforming of dry film in substrate surface.
Further, the drying in step S3 is to take out the substrate for completing first time electroforming from electroforming solution, is rinsed with water
After dried, drying number be 1-4 time, each drying time be 2-8 minute, every time dry after to cool down once again into
Row is dried next time.
Further, second of electroforming in step S4 is that the substrate after drying is placed again into electroforming solution, electricity herein
Casting liquid main component is nickel sulfamic acid and ferrous sulfamate, so as to close in one layer of the electroforming of nickel metal layer surface uniform ferronickel
Layer gold.
The film stratification step that takes off in further step S5 includes taking off film and layering, it is described take off film i.e. second of electroforming after remove
Fall the dry film of the vapor deposition opening portion on substrate.
Further, the nickel metal layer is stripped down from substrate after taking off film step, is walked followed by the layering
Suddenly, i.e., the dilval layer is removed from the nickel metal layer, separates the two.
The additional aspect of the present invention and advantage will be set forth in part in the description, and will partially become from the following description
Obviously, or practice through the invention is recognized.
Detailed description of the invention
Above-mentioned and/or additional aspect of the invention and advantage will become from the following description of the accompanying drawings of embodiments
Obviously and it is readily appreciated that, in which:
Fig. 1 show the mask plate schematic diagram made of the method for the present invention；
Fig. 2 show the schematic diagram after development step of the present invention；
Fig. 3 show the schematic diagram after first time electroforming of the invention；
Fig. 4 show the schematic diagram after second of electroforming of the invention；
Fig. 5 show the present invention and takes off the schematic diagram after film；
Fig. 6 show the schematic diagram after nickel metal layer of the present invention is removed from substrate；
Fig. 7 show dilval layer of the present invention from the schematic diagram after nickel metal layer removing；
Wherein, 1 is substrate, and 2 be dry film, and 3 be vapor deposition opening, and 4 be nickel metal layer, and 5 be dilval layer, and 6 be aluminium frame.
Specific embodiment
The embodiment of the present invention is described below in detail, examples of the embodiments are shown in the accompanying drawings, wherein from beginning to end
Same or similar label indicates same or similar.Element or element with the same or similar functions.Below with reference to
The embodiment of attached drawing description is exemplary, and for explaining only the invention, and is not construed as limiting the claims.
In the description of the present invention, it is to be understood that, term " on ", "lower", "bottom", "top", "front", "rear",
The orientation or positional relationship of the instructions such as "inner", "outside", " cross ", " perpendicular " is to be based on the orientation or positional relationship shown in the drawings, and is only
For the convenience of describing the present invention and simplifying the description, rather than the device or element of indication or suggestion meaning must have specific side
Position is constructed and operated in a specific orientation, therefore is not considered as limiting the invention.
The production method that vapor deposition of the invention uses metal mask plate, production method the following steps are included:
S1, substrate prepare, S2, first time electroforming, S3, drying, second of electroforming of S4, S5, take off film layering；Wherein first time electroforming
Step preparation is nickel metal layer 4, and second of electroforming step preparation is dilval layer 5, and dilval layer 5 is formed in nickel gold
Belong on layer 4.Below with reference to accompanying drawings come the production method for describing vapor deposition metal mask plate of the present invention, the substrate of step S1 prepares
Including selecting substrate, pad pasting, exposure, development step, substrate is selected to choose stainless steel substrate as substrate 1, and by 1 table of substrate
Face polished, oil removing, cleaning, drying process, guarantees the cleaning on 1 surface of substrate and smooth.One is pasted on the surface of substrate 1 later
Layer dry film 2, and the opening figure that needs are deposited out is exposed on dry film 2, then carry out development step, i.e., the vapor deposition that will have been exposed
The dry film 2 of 3 parts of being open leaves, and the dry film removal of rest part is exactly the substrate 1 and dry film 2 after developing as shown in Figure 2
Structural schematic diagram.
Substrate 1 is put into electroforming solution after development, electroforming solution main component at this time is nickel sulfamic acid, applies 54A
Electric current, the control electroforming time on 1 surface of substrate so as to not have the part of dry film 2 to form one layer of uniform nickel metal layer 4, such as Fig. 3
It is shown.Nickel metal layer 4 with a thickness of 0.5-10 μm in the present embodiment.First time electroforming terminate after by substrate 1 from electroforming solution
Taking-up is dried after being rinsed with water, and drying number is 1-4 times, and each drying time is 2-8 minutes, drying temperature 40-80
Degree, preferably number are 3 to 4 times, to cool down after drying once dried next time again every time, cooling effect is to prevent
The temperature of the too long nickel metal layer 4 of each drying time can be excessively high, is slightly variable so as to cause shape generation.The effect of drying is to allow
4 surface of nickel metal layer forms uniform alumina film, thus the more conducively subsequent separation with dilval layer 5.
Substrate 1 after drying is placed again into electroforming solution, and electroforming solution main component herein is nickel sulfamic acid and amino
Sulfonic acid is ferrous, applies 54A electric current, and the control electroforming time is so as to form one layer of uniform dilval layer on 4 surface of nickel metal layer
5, as shown in Figure 4.Dilval layer 4 with a thickness of 5-15 μm in the present embodiment.It carries out taking off film after second of electroforming, that is, gets rid of
The dry film 2 of 3 parts of vapor deposition opening on substrate 1, as shown in Figure 5.Nickel metal layer 4 is stripped down from substrate 1 after taking off film step,
As shown in Figure 6 removes dilval layer 5 followed by layering from nickel metal layer 4, be exactly as shown in Figure 7 and nickel gold
Belong to the dilval layer 5 after layer 4 separates, dilval layer 5 is exactly required metal mask plate, finally as shown in Figure 1 by ferronickel
Alloy-layer 5 is smooth to be welded on aluminium frame 6.
By above-mentioned before making dilval mask plate, then first one layer of nickel metal layer 4 of electroforming on substrate 1 exists
The method of one layer of dilval layer 5 of electroforming again on the basis of nickel metal layer 4, counteracts nickel by the compression that nickel metal layer 4 generates
The tensile stress of iron alloy layer 5, so eliminating 5 any surface finish of dilval layer, the flatness of stress after by two separate
It is good, it will not be separated there is a phenomenon where curling or directly with substrate 1, so that required high-quality metal mask plate is obtained, yields
It greatly improves.
In addition method of the invention does not need in addition to dose a large amount of organic solvents in electroforming solution covers to weaken dilval
The internal stress of template, so being avoided that in mask plate the drawbacks of being mingled with impurity.
Although a specific embodiment of the invention is described in detail referring to illustrative examples of the invention,
It is it must be understood that those skilled in the art can be designed that various other improvement and embodiment, these are improved and embodiment will
It falls within spirit and scope.Specifically, aforementioned disclosure, attached drawing and the scope of the claims it
It is interior, reasonable variations and modifications can be made in terms of the arrangement that components and/or sub-combination are laid out, without departing from this
The spirit of invention.In addition to components and/or the variations and modifications of layout aspect, range is by the following claims and their equivalents
It limits.
Claims (8)
1. it is a kind of vapor deposition use metal mask plate production method, production method the following steps are included:
S1, substrate prepare, S2, first time electroforming, S3, drying, second of electroforming of S4, S5, take off film layering；It is characterized in that, institute
State the preparation of first time electroforming step is nickel metal layer, and second of electroforming step preparation is dilval layer, the nickel
Iron alloy layer is formed on the nickel metal layer.
2. the production method that vapor deposition according to claim 1 uses metal mask plate, which is characterized in that the substrate of step S1 is quasi-
Standby includes selecting substrate, pad pasting, exposure, development.
3. the production method that vapor deposition according to claim 2 uses metal mask plate, which is characterized in that the substrate of selecting is
Stainless steel substrate is chosen as substrate, and substrate surface is polished, oil removing, cleaning, drying process；
The pad pasting is to paste one layer of dry film in substrate surface；
The exposure is open to expose vapor deposition out on the dry film surface；
The development is the dry film that opening portion is deposited after retaining the step of exposure, and development is got rid of the vapor deposition on substrate and opened
Remaining dry film outside mouthful.
4. the production method that vapor deposition according to claim 3 uses metal mask plate, which is characterized in that first in step S2
Secondary electroforming is that the substrate after development is put into electroforming solution, and electroforming solution main component herein is nickel sulfamic acid, so that in base
Plate surface does not have one layer of uniform nickel metal layer of part electroforming of dry film.
5. the production method that vapor deposition according to claim 4 uses metal mask plate, which is characterized in that the drying in step S3
It is to take out the substrate for completing first time electroforming from electroforming solution, is dried after being rinsed with water, drying number is 1-4 times, often
Secondary drying time is 2-8 minutes, to cool down after drying once dried next time again every time.
6. the production method that vapor deposition according to claim 5 uses metal mask plate, which is characterized in that second in step S4
Secondary electroforming is that the substrate after drying is placed again into electroforming solution, and electroforming solution main component herein is nickel sulfamic acid and amino
Sulfonic acid is ferrous, so that in one layer of the electroforming of nickel metal layer surface uniform dilval layer.
7. the production method that vapor deposition according to claim 2 uses metal mask plate, which is characterized in that
The film stratification step that takes off in step S5 includes taking off film and layering, it is described take off film i.e. second of electroforming after get rid of institute on substrate
State the dry film of vapor deposition opening portion.
8. it is according to claim 7 vapor deposition use metal mask plate production method, which is characterized in that it is described take off film step after
The nickel metal layer is stripped down from substrate, followed by the stratification step, i.e., by the dilval layer from institute
It states and is removed on nickel metal layer, separate the two.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811613059.2A CN109576642A (en) | 2018-12-27 | 2018-12-27 | A kind of production method that vapor deposition uses metal mask plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811613059.2A CN109576642A (en) | 2018-12-27 | 2018-12-27 | A kind of production method that vapor deposition uses metal mask plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109576642A true CN109576642A (en) | 2019-04-05 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811613059.2A Pending CN109576642A (en) | 2018-12-27 | 2018-12-27 | A kind of production method that vapor deposition uses metal mask plate |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022149350A1 (en) * | 2021-01-08 | 2022-07-14 | 株式会社ジャパンディスプレイ | Device for manufacturing vapor deposition mask and method for manufacturing vapor deposition mask |
-
2018
- 2018-12-27 CN CN201811613059.2A patent/CN109576642A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022149350A1 (en) * | 2021-01-08 | 2022-07-14 | 株式会社ジャパンディスプレイ | Device for manufacturing vapor deposition mask and method for manufacturing vapor deposition mask |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20190405 |
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| WD01 | Invention patent application deemed withdrawn after publication |