CN109560008B - System and method for applying material to a component - Google Patents
System and method for applying material to a component Download PDFInfo
- Publication number
- CN109560008B CN109560008B CN201810017618.7A CN201810017618A CN109560008B CN 109560008 B CN109560008 B CN 109560008B CN 201810017618 A CN201810017618 A CN 201810017618A CN 109560008 B CN109560008 B CN 109560008B
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- Prior art keywords
- supply
- component
- transfer
- carrier liner
- tool
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Shaping Of Tube Ends By Bending Or Straightening (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
Systems and methods for applying material to a component. The system comprises: a supply of material, the supply including a carrier liner along a surface of the material; and a tool operable to transfer a portion of the material from the carrier liner of the supply to the component. The carrier liner may be configured to texturize a surface of the material as the tool is pressed against the carrier liner to transfer portions of the material from the carrier liner to the component. The carrier liner may include one or more protrusions that imprint into and/or texture a surface of a portion of material as the portion of material is transferred from the carrier liner to the component. The material may be applied to a wide range of substrates and components, such as covers for Integrated Circuit (IC) packages or integrated heat spreaders, board-level shields, heat sources (e.g., central Processing Units (CPUs), etc.), heat removal/dissipation structures or components (e.g., heat spreaders, heat sinks, heat pipes, vapor chambers, device housings or casings, etc.), and the like.
Description
Technical Field
The present disclosure relates to systems and methods of applying material to a component.
Background
This section provides background information related to the present disclosure, which is not necessarily prior art.
Electrical components such as semiconductors, integrated circuit packages, transistors, etc. typically have pre-designed temperatures at which the electrical components operate optimally. Ideally, the pre-set temperature is close to the temperature of the surrounding air. But the operation of the electrical components generates heat. If heat is not removed, it may result in the electrical components operating at temperatures significantly higher than their normal or expected operating temperatures. Such excessive temperatures can adversely affect the operating characteristics of the electrical components and the operation of the associated devices.
To avoid or at least reduce adverse operating characteristics from heat generation, heat should be removed, for example, by conducting heat from the operating electrical components to the heat sink. The heat sink is then cooled by conventional convection and/or radiation techniques. During conduction, heat may be transferred from the operating electrical component to the heat sink by direct surface contact between the electrical component and the heat sink and/or by contact of the electrical component and the heat sink surface via an intermediate medium or thermal interface material. To improve heat transfer efficiency, the gap may be filled with a thermal interface material, as compared to filling the gap between heat transfer surfaces with air that utilizes a poor thermal conductor.
Heat spreaders are commonly used to spread heat from one or more heat generating components so that the heat is not concentrated in a small area when transferred to a heat sink. An integrated heat spreader (INTEGRATED HEAT SPREADER, IHS) is a type of heat spreader that may be used to spread heat generated by the operation of a Central Processing Unit (CPU) or processor die. An integrated heat spreader or lid (e.g., a lid of an Integrated Circuit (IC) package, etc.) is typically a thermally conductive metal (e.g., copper, etc.) plate that sits atop the CPU or processor die.
Heat spreaders are also popular (e.g., as covers, etc.) for protecting electronic components mounted on chips or boards, often in conjunction with hermetic packaging. Thus, the heat spreader may also be referred to herein as a cover, and vice versa.
A first thermal interface material or layer (referred to as TIM 1) may be used between the integrated heat spreader or cover and the heat source to reduce hot spots and generally reduce the temperature of the heat generating component or device. A second thermal interface material or layer (known as TIM 2) may be used between the cover or integrated heat spreader and the heat sink to improve the heat transfer efficiency from the heat spreader to the heat sink.
For example, fig. 1 illustrates an exemplary electronic device 11 having a TIM1 or first thermal interface material 15. As shown in fig. 1, a TIM1 or thermal interface material 15 is positioned between a heat spreader or lid 19 and a heat source 21, which may include one or more heat generating components or devices (e.g., CPU, mold in underfill, semiconductor device, flip chip device, graphics Processing Unit (GPU), digital Signal Processor (DSP), multiprocessor system, integrated circuit, multi-core processor, etc.), battery, solar panel, etc. The TIM2 or second thermal interface material 25 is positioned between the heat sink 29 and the heat spreader or cover 19.
For example, the heat source 21 may include a Central Processing Unit (CPU) or a processor die mounted on a Printed Circuit Board (PCB) 33. PCB33 may be made of FR4 (flame retardant fiberglass reinforced epoxy laminate) or other suitable material. Also in this example, the heat spreader or cover 19 is an Integrated Heat Spreader (IHS) that may include metal or other thermally conductive structures. The heat spreader or cover 19 includes a peripheral ridge, flange or sidewall portion 37. An adhesive 41 is applied to and along the peripheral ridge 37 to attach the heat spreader or cover 19 to the PCB 33. Thus, the peripheral ridge 37 may protrude downward enough to extend around the silicon mold on the PCB33, allowing contact between the adhesive 41 on the peripheral ridge 37 and the PCB 33. Advantageously, adhesively attaching the heat spreader or cover 19 to the PCB33 may also help strengthen the package attached to the base PCB. Also shown in fig. 1 is a pin connector 45. The heat sink 29 may generally include a base from which a series of fins project outwardly.
As another example, an exemplary electronic device may include a thermal interface material positioned between a heat source and a heat sink without any intervening heat spreader. In this example, the thermal interface material may thus be positioned directly between and/or against a heat sink and a heat source, which may include one or more heat generating components or devices (e.g., CPU, die within underfill, semiconductor device, flip chip device, graphics Processing Unit (GPU), digital Signal Processor (DSP), multiprocessor system, integrated circuit, multi-core processor, etc.), battery, solar panel, etc.
Disclosure of Invention
This section provides a general summary of the disclosure, and is not a comprehensive disclosure of its full scope or all of its features.
In a first aspect of the invention, a system for applying a thermal interface material to a component, the system comprising: a supply of material, the supply including a carrier liner along a surface of the material; and a tool operable to transfer a portion of the material from the carrier liner of the supply to the component. The carrier liner is configured to texturize a surface of the material as the tool is pressed against the carrier liner to transfer portions of the material from the carrier liner to the component. The carrier liner includes one or more protrusions that imprint into and/or texturize a surface of a portion of material as the portion of material is transferred from the carrier liner to the component.
In a second aspect of the invention, in the system according to the first aspect of the invention, the one or more protrusions of the carrier liner comprise a thick layer of one or more of ink, logo, stamp and/or identification mark along the carrier liner, which thick layer is embossed into and textured to the surface of the portion of the material.
In a third aspect of the present invention, in the system according to the first aspect of the present invention, the one or more protrusions of the carrier liner are configured to be embossed into and textured the surface of the portion of the material such that the textured surface improves air removal, reduces contact resistance, increases compliance or softness, improves EMI shielding, and/or improves EMI absorption.
In a fourth aspect of the invention, in the system according to the first aspect of the invention, the carrier liner is configured such that the textured surface of the portion of material comprises a frequency selective surface and/or an EMI shielding surface.
In a fifth aspect of the invention, a system for applying material to a component, the system comprising: a supply of material comprising a carrier liner having a surface comprising an electrically conductive material in contact with the surface of the material; and means operable to transfer a portion of said material from said carrier liner of said supply to a component, whereby at least a portion of said electrically conductive material is transferred from said carrier liner to said surface of said portion of said material.
In a sixth aspect of the present invention, in the system according to the fifth aspect of the present invention, the conductive material includes a conductive ink; and the tool is operable to transfer the portion of the material from the carrier liner of the supply to the component, whereby at least a portion of the conductive ink is transferred from the carrier liner to the surface of the portion of the material.
In a seventh aspect of the present invention, in the system according to any one of the first to sixth aspects of the present invention, the material includes a nonmetal; and the portion of the material is coupled to the component without any diffusion bonding or weld joint between the portion and the component.
In an eighth aspect of the invention, in the system according to any one of the first to sixth aspects of the invention, the system is configured such that the portion of the material remains on the component and such that at least a portion of the carrier liner remains on the portion of the material when the tool is removed and moved relatively away from the portion of the material, and wherein the at least a portion of the carrier liner remaining on the portion of the material is operable as a protective cover to provide a label and/or to provide a tab; and/or the tool is configured to provide a high pressure and/or cutting edge for cutting through the carrier liner.
According to a ninth aspect of the invention, in the system according to any one of the first to sixth aspects of the invention, the tool comprises an elastic material which is operable to compress the portion of the material onto the component and/or to imprint the portion of the material for release and transfer from the supply body, and/or which is shaped to allow for relief of air entrapment and de-bubbling.
According to a tenth aspect of the present invention, in the system according to any one of the first to sixth aspects of the present invention, the tool comprises a mould comprising a portion configured to imprint, sever, tear and/or cut the portion of the material for release and transfer from the supply.
According to an eleventh aspect of the invention, in the system according to any one of the first to sixth aspects of the invention, the component comprises an integrated circuit die comprising one or more blades configured to imprint the portion of the material for release and transfer from the supply; and the tool is operable to complete the release and transfer of the imprinted portion of the material from the supply to the integrated circuit die.
According to a twelfth aspect of the present invention, in the system according to any one of the first to sixth aspects of the present invention, the component includes an integrated circuit die; and the tool is operable to press the portion of the material from the supply onto the integrated circuit die such that one or more edges of the integrated circuit die imprint the portion of the material for release and transfer from the supply.
According to a thirteenth aspect of the present invention, in the system according to any one of the first to sixth aspects of the present invention, the tool includes: a first tool operable to compact the portion of the material from the supply onto the component; and a second tool for separating the portion of the material from the supply body; or the tool comprises a multiple-up mold operable for simultaneously transferring portions of the material from the supply to a plurality of different parts or a plurality of different regions of the same single part in a single action.
According to a fourteenth aspect of the present invention, in the system according to any one of the first to sixth aspects of the present invention, the system is configured to transfer a single portion of the material from the supply body to a single component in a single action; or the system is configured to simultaneously transfer portions of the material from the supply to different regions of the same single component in a single action; or the system is configured to simultaneously transfer portions of different materials from different supplies to different regions of the same single component in a single action; or the system is configured to simultaneously transfer portions of the material from the supply to a plurality of different components in a single action; or the system is configured to transfer multiple portions of different materials to multiple components simultaneously from different supplies in a single action.
According to a fifteenth aspect of the present invention, in the system according to any one of the first to sixth aspects of the present invention, the system is configured such that compaction and/or adhesion of the portion of the material from the supply body onto the member is performed in a first action, and such that embossing of the portion of the material to release from the supply body is performed in a second action; and/or wherein: the system is configured to transfer portions of the material from the supply and stack to the component on top of each other; or the system is configured to transfer multiple portions of different materials from different supplies and stack the components on top of each other.
According to a sixteenth aspect of the present invention, in the system according to any one of the first to sixth aspects of the present invention, the system is configured with a multidirectional function, allowing a portion of the material to be transferred from the supply body to the component in a plurality of directions, including upward, downward, lateral, diagonal, rotational and/or reverse; and/or the system is configured such that portions of the same material from the supply can be transferred to both sides of the component simultaneously, or such that portions of different materials from different supplies can be transferred to both sides of the component simultaneously.
According to a seventeenth aspect of the present invention, in the system according to any one of the first to sixth aspects of the present invention, the supply of material comprises a supply body disc or roll; the system further comprises a take-up disc or reel; the tool includes a rotary die located between the supply disc or reel and the take-up disc or reel, the rotary die being operable to transfer the portion of the material from the supply disc or reel to the component in rotation.
According to an eighteenth aspect of the present invention, in the system according to any one of the first to sixth aspects of the present invention, the supply of material comprises a single layer of the supply of material and/or a plurality of layers of the supply of material; and/or the supply of material comprises one or more supplies of one or more thermal interface materials, electrically conductive elastomers, electromagnetic interference absorbers, electromagnetic interference shielding materials, dielectric materials, and/or thermally conductive materials; and/or the component comprises one or more of a cover, an integrated heat spreader of an integrated circuit package, a cover of a board level shield, a heat source, a heat removal/dissipation structure, and/or a substrate.
According to a nineteenth aspect of the present invention, a method for applying a material to a component, the method comprising the steps of: transferring a portion of material from a supply of the material to a component, the transferring comprising embossing and/or texturing a surface of the portion of the material, whereby the portion of material is capable of being transferred from the supply to the component without diffusion bonding of the portion of the material to the component.
According to a twentieth aspect of the present invention, in the method according to the nineteenth aspect of the present invention, the material comprises a nonmetal; and the portion of the material is coupled to the component without any diffusion bonding or weld joint between the portion and the component.
According to a twenty-first aspect of the present invention, in the method according to the nineteenth aspect of the present invention, the surface of the portion of the material is embossed and/or textured to improve air removal, reduce contact resistance, improve compliance or softness, improve EMI shielding, and/or improve EMI absorption.
According to a twenty-second aspect of the present invention, in the method according to the nineteenth aspect of the present invention, the step of embossing and/or texturing the surface of the portion of the material comprises embossing and/or texturing a frequency selective surface and/or an EMI shielding surface located on the surface of the portion of the material.
According to a twenty-third aspect of the present invention, in the method according to the nineteenth aspect of the present invention, the supply of material includes a carrier liner along a surface of the material; and the method includes transferring the portion of the material from the carrier liner to the component.
According to a twenty-fourth aspect of the present invention, in the method according to the twenty-third aspect of the present invention, the step of embossing and/or texturing the surface of the portion of the material comprises pressing one or more protrusions along the carrier liner against the surface of the portion of the material, thereby embossing into and/or texturing the surface of the portion of the material.
According to a twenty-fifth aspect of the present invention, in the method according to the twenty-fourth aspect of the present invention, the one or more protrusions of the carrier liner comprise a thick layer of one or more of ink, logo, stamp and/or identification mark along the carrier liner, which thick layer is embossed into and textured to the surface of the portion of the material.
According to a twenty-sixth aspect of the present invention, in the method according to any one of the twenty-third to twenty-fifth aspects of the present invention, the carrier liner includes a conductive material; and the step of embossing and/or texturing the surface of the portion of the material includes transferring at least a portion of the electrically conductive material from the carrier liner to the surface of the portion of the material.
According to a twenty-seventh aspect of the present invention, in the method according to any one of the twenty-third to twenty-fifth aspects of the present invention, the carrier liner includes a conductive ink; and the step of embossing and/or texturing the surface of the portion of the material includes transferring at least a portion of the conductive ink from the carrier liner to the surface of the portion of the material.
According to a twenty-eighth aspect of the present invention, in the method according to any one of the twenty-third to twenty-fifth aspects of the present invention, the method comprises the steps of: using a tool to push the carrier liner through the portion of the material to sever the portion of the material from the supply without piercing the carrier liner; and/or removing the carrier liner from the portion of the material after transferring the portion of the material to the component; and/or leaving at least a portion of the carrier liner on the portion of the material after transferring the portion of the material to the component, whereby the at least a portion of the carrier liner left on the portion of the material can be used as a protective cover to provide a label and/or to provide a tab; and/or using high pressure and/or cutting edges to cut through the carrier liner.
According to a twenty-ninth aspect of the present invention, in the method according to any one of the nineteenth to twenty-fifth aspects of the present invention, the method comprises the steps of: an elastic material is used to press the portion of the material onto the component and/or to imprint the portion of the material for release and transfer from the supply.
According to a thirty-fifth aspect of the present invention, in the method according to any one of the nineteenth to twenty-fifth aspects of the present invention, the method comprises the steps of: using a die to imprint, sever, tear and/or cut the portion of the material for release and transfer from the supply; and/or transferring portions of the material from the supply to the component in a plurality of directions including upward, downward, lateral, diagonal, rotational, and/or reverse.
According to a thirty-first aspect of the present invention, in the method according to any one of the nineteenth to twenty-fifth aspects of the present invention, the component comprises an integrated circuit die; and the method includes imprinting the portion of the material using one or more edges of the integrated circuit die to release and transfer from the supply.
According to a thirty-second aspect of the present invention, in the method according to any one of the nineteenth to twenty-fifth aspects of the present invention, the component comprises an integrated circuit die; and the method includes embossing the portion of the material from the supply to release and transfer from the supply using a tool that presses the portion of the material onto the integrated circuit die such that one or more edges of the integrated circuit die emboss the portion of the material.
According to a thirty-third aspect of the present invention, in the method according to any one of the nineteenth to twenty-fifth aspects of the present invention, the supply of material comprises a supply tray or roll; and the method includes transferring the portion of the material from the supply disc or roll to the component using a rotating die between the supply disc or roll and a take-up disc or roll.
According to a thirty-fourth aspect of the present invention, in the method according to any one of the nineteenth to twenty-fifth aspects of the present invention, the supply of material comprises a single layer of the supply of material and/or a plurality of layers of the supply of material; and/or the supply of material comprises one or more supplies of one or more thermal interface materials, electrically conductive elastomers, electromagnetic interference absorbers, electromagnetic interference shielding materials, dielectric materials, and/or thermally conductive materials; and/or the component comprises one or more of a cover, an integrated heat spreader of an integrated circuit package, a cover of a board level shield, a heat source, a heat removal/dissipation structure, and/or a substrate.
Further areas of applicability will become apparent from the description provided herein. The description and specific examples in this summary are intended for purposes of illustration only and are not intended to limit the scope of the present disclosure.
Drawings
The drawings described herein are for illustration purposes only of selected embodiments and not all possible embodiments and are not intended to limit the scope of the present disclosure.
Fig. 1 is a cross-sectional view of an exemplary electronic device showing a thermal interface material (TIM 1), the TIM1 being positioned between a cover (e.g., an Integrated Heat Spreader (IHS), etc.) and a heat source (e.g., one or more heat generating components, a Central Processing Unit (CPU), a mold, a semiconductor device, etc.).
FIG. 2 illustrates an exemplary system for applying a thermal interface material to a cover in accordance with an exemplary embodiment; and
Fig. 3 illustrates example shapes (e.g., star, arrow, square, rectangle, oval, etc.) that are possible for a thermal interface material using a system according to the example embodiment shown in fig. 2.
Detailed Description
Example embodiments will now be described more fully with reference to the accompanying drawings.
Conventional Phase Change Material (PCM) coating processes often include PCB elements with tabs (tabs) and are costly. There may be problems with the end user or customer properly coating the tab-coated component and/or with liner release. With conventional coating processes, the element configuration, shape, and size of TIMs are limited. Also, it may be difficult to keep the PCM material clean during any additional steps after formation in the clean room. It may also be difficult to transport the tab-bearing element without twisting.
Having recognized the foregoing, the inventors herein have developed and disclose herein exemplary embodiments of systems and processes for applying (e.g., pushing, pressing, compacting, removing, severing, tearing, cutting, blowing, stamping, transferring, etc.) a wide range of materials (e.g., thermal Interface Materials (TIMs), conductive elastomers, electromagnetic interference (EMI) absorbers, EMI shielding materials, dielectric materials, thermally conductive materials, other interface materials, combinations thereof, stand-alone layers, stacked layers thereof, etc.) to a wide range of elements, substrates, and components (e.g., covers or integrated heat spreaders of Integrated Circuit (IC) packages, board level shields (e.g., removable covers or covers of Board Level Shields (BLS), etc.), heat sources (e.g., central Processing Units (CPUs), etc.), heat removal/dissipation structures or components (e.g., heat spreaders, heat sinks, heat pipes, vapor chambers, device housings or casings, etc.), films, and other substrates, etc.).
In an exemplary embodiment, a tool is used to transfer TIM or other material from a delivery liner (broadly, a supply) to a target element, component, or substrate. The tool may include a die that is cut or customized (e.g., shaped and sized, etc.) for use according to the size and shape desired by the customer (e.g., one or more of the shapes shown in fig. 3, etc.). In operation, the mold may be moved relative to (e.g., downward, upward, laterally, diagonally, rotationally, etc.) a liner (e.g., a polyethylene terephthalate (PET) carrier and/or release liner, etc.) disposed along (e.g., a top or upper surface of) a surface (e.g., a roll, tray, etc.) of a supply of thermal interface material (e.g., phase Change Material (PCM), other TIM, etc.) or other material (e.g., a conductive elastomer, electromagnetic interference (EMI) absorber, EMI shielding material, dielectric material, combinations thereof, independent or stacked layers thereof, etc.), and pressed by the liner. In some embodiments, the mold may be moved relative to and pressed against the liner along with pressure, dwell (dwell), heat and cool, temperature control, etc., that may assist in cutting, adhering, releasing TIM or other material from the liner.
Movement of the mold relative to the liner also moves portions of the TIM or other material to be transferred or applied from the supply to the substrate or component. The liner is also removed from portions of the TIM or other material as the mold is removed and moved relatively away (e.g., lifted upward away) from the TIM or other material. The portion of TIM or other material of the size and shape desired by a particular customer remains, for example, on the lid, heat source, heat removal/diffusion structure, etc. During removal of the TIM or other material from the supply, the mold may be configured to reduce the material thickness, create adhesion, and tear the TIM or other material from the supply.
Machines or presses for pressing the die (e.g., downwardly, upwardly, laterally, diagonally, rotationally, etc.) with the aid of the liner may range from manually operated presses to highly automated machines. In some embodiments, at least a portion of the liner may remain on the portion of the TIM or other material applied to the substrate or component, where the remaining liner portion may be useful for protection, providing a label, providing a tab, and/or other reasons.
In an exemplary embodiment, the supply of material includes a supply (e.g., a roll, a disc, a tape, etc.) of a thermal interface material such as a Phase Change Material (PCM) or other non-metallic TIM (e.g., plastic TIM, silicon elastomer TIM, etc.). In other exemplary embodiments, the supply of material may include a wide range of other materials (such as other TIMs, non-thermal reinforcement materials, thermal insulators, dielectric insulators, electrical insulators, conductive elastomers, EMI absorbers, EMI shielding materials, polymeric materials, adhesive materials, other interface materials, combinations thereof, individual layers thereof, stacked layers thereof, and the like).
In an exemplary embodiment, a compaction tool is used to compact a TIM or other material to a substrate or component (e.g., a lid, BLS, heat source, heat removal/dissipation structure, etc.). The compaction tool can include a cavity and an elastic material within the cavity (e.g., cotton, cork, gel pack, rubber, elastomer, elastic plastic, resilient or sponge material, fibrous material, insulating material, other elastic material, etc.). For example, the compaction tool may include a central foam core or foam filled core. Alternatively, the compaction tool may include another elastomeric material within the cavity or no cavity at all.
A mold may be used to remove (e.g., cut, tear, sever, etc.) the TIM or other material with the liner without having to puncture the liner. The mold may be integral with the compaction tool or separate from the compaction tool. In an exemplary embodiment, the TIM or other material is non-metallic such that there is no diffusion bond or solder joint between the non-metal and the substrate or component (e.g., lid, BLS, heat source, heat removal/dissipation structure, etc.). In contrast, the non-metal may be naturally tacky and self-adhere to the liner or component without the need for any additional adhesive (although an adhesive may also be used).
The mold may include one or more blades and/or at least one edge configured (e.g., flat, sharpened, etc.) for cutting, tearing, or severing the TIM or other material from the supply. In exemplary embodiments, the mold may include a blade mold (e.g., a steel blade mold, etc.), a knife mold (e.g., a rounded knife mold, etc.), a steel straight line mold with a knife, a rounded or blunt edge, a rotating mold, etc. In alternative embodiments, the mold comprises an integrated circuit mold (e.g., a block of semiconductor material) having one or more edges for cutting, severing, or ripping a TIM or other material compacted onto the integrated circuit mold by a compaction tool. In yet another embodiment, the compaction tool may be operable to cut, tear, or sever a TIM or other material without the use of a separate die (e.g., without the use of a blade of a knife die, etc.). In this latter example, the compaction tool may include an elastic material (e.g., foam filled cavity, central foam core, etc.) that may be used to compact and transfer (e.g., cut, tear, sever, etc.) TIM or other material from a supply (e.g., roll, disc, tape, etc.) onto a substrate or component.
In an exemplary embodiment, a rolling rotary die may be used to apply or transfer TIM or other material from a supply onto a component or substrate. For example, a rolling rotary die may be used to apply or transfer TIM or other material from a disc or roll onto the surface of a component or substrate. This example may be a roll-to-roll or disc-to-disc process of rotating the die between a supply disc or roll and a take-up or waste disc or roll. The system components may be run at a given speed such that portions of material are transferred from the supply roll or disc to the rotation of the substrate or component surface.
For example, TIMs and other materials may be provided with textured and/or modeled surfaces during coating or transfer from a supply onto a component or substrate. Accordingly, exemplary embodiments disclosed herein include methods for texturing surfaces and/or creating textured or modeled surfaces on TIMs and other materials. The TIM or other material may be transferred from a carrier or delivery liner or other supply to a heat sink, lid, other element, substrate or component, etc. It has been found that the slightest flaw in the liner is also transferred into the TIM or other material during the coating/transfer process. For example, a thick layer of ink for marking on a liner may be stamped to a TIM or other material that is applied or transferred from the liner to a component or substrate. As another example, a textured portion of the tool (e.g., a textured foam core of a mold, a textured elastomeric material within a mold cavity, etc.) may be used to provide texturing to a surface of a TIM or other material when the textured portion of the tool is used to compact, press against, or otherwise apply the TIM or other material from a carrier liner to a component or substrate. As a further example, a separate stencil may also be used between the carrier liner and the tool (e.g., between foam cores of the mold, etc.) during the transfer process to create and leave a texture on the TIM or other material transferred from the carrier liner to the component or substrate. As yet another example, one or more indicia from an article may also be transferred from the article between the back side of the foam core (or another resilient material) and the tool to provide texturing to the surface of the TIM or other material transferred to the component or substrate. This discovery allows micro-texturing of TIMs and other materials during the coating/transfer process. Texturing of the surface may improve or assist in air removal and depressurization during assembly. Texturing of the surface may reduce the contact assembly and make the TIM or other material softer and more compliant. Texturing may also be used to create identification marks on TIMs or other materials transferred or coated from liners or other supplies. Micro-textured surfaces on TIMs or other materials may also provide EMI shielding and/or absorption benefits. Conductive ink or other conductive substance on the liner may transfer from the liner to the TIM or other material, creating a textured surface (e.g., frequency Selective Surface (FSS), mesh, etc.) for EMI shielding purposes.
In an exemplary embodiment, the liner may be removed entirely and not left behind, as only portions of the TIM or other material may be transferred from the liner and left on the component or substrate. In alternative embodiments, at least a portion of the carrier liner may remain on the portion of the TIM or other material transferred from the carrier liner to the substrate or component. This may be accomplished, for example, by cutting through the carrier liner with high pressure and/or sharp dies. The remaining portion of the carrier liner from the carrier liner that is transferred along with the TIM or other material may be useful for protection as a protective cover, providing a label, providing a tab, and/or other reasons. In other embodiments, downstream assistance may be employed to subsequently add a cap, tab, or substrate to the portion of the TIM or other material that was previously applied to the substrate or component. The subsequently added cover, tab, or liner may be useful for protection as a protective cover during shipping, to provide a label, to provide a tab, and/or for other reasons. For example, if the components are not assembled in a timely manner, the TIM or other material may be susceptible to contamination or other imperfections such that the protective cover may be beneficial, for example, during shipping, during installation and assembly, and the like.
In an exemplary embodiment, a tool (e.g., a mold, etc.) is used to compact the TIM or other material from the supply to the substrate or component (e.g., lid, BLS, heat source, heat removal/dissipation structure, etc.). The tool may include a cavity and an elastomeric material within the cavity. The resilient material may include specially shaped foam pieces that allow for reduced air entrapment and removal of air pockets. The foam shape may be configured to apply air/bubble free material over a larger element size (e.g., about 20 millimeters (mm), etc.). The foam may be shaped as a cylindrical shape or as a cylindrical, hemispherical, chamfered, or flat piece inserted into a mold in a surface curved (e.g., oversized or bracketed, etc.) manner.
Due to the nature of the materials involved, the application of irregular and/or complex geometric elements is not possible by conventional peel-and-stick methods. In contrast, conventional peel-and-paste method elements are generally limited to squares or rectangles. The exemplary embodiments disclosed herein may be used to coat or transfer elements or portions of TIMs or other materials having complex geometries and/or irregular shapes, such as circles, letters, elements with negative spaces, other shapes, such as the shapes shown in fig. 3 (e.g., star, arrow, square, oval, etc.), etc.
In some example embodiments, a single element or portion of a Thermal Interface Material (TIM) or other material may be applied or transferred to a single component or substrate in a single action (e.g., a single stroke, a single press of a mold, etc.). In other exemplary embodiments, multiple elements or portions of the same or different TIMs and/or other materials may be applied or transferred simultaneously to different areas of the same single component or substrate, for example, in a single action or multiple upward mold strokes. In further exemplary embodiments, multiple elements or portions of the same or different TIMs and/or other materials may be applied or transferred to multiple parts or substrates simultaneously, for example, by using multiple upward dies (e.g., in a single press of the die).
In some example embodiments, a single action (e.g., a single stroke, a single press of a mold, etc.) is performed that includes adhering a TIM or other material to a component or substrate using a foam core (or other resilient material) and embossing the TIM or other material for release using a mold edge (e.g., an edge of a steel ruled mold, a knife mold, an integrated circuit mold, etc.). The adhering and embossing may be accomplished in a single pass. In other exemplary embodiments, multiple actions (e.g., multiple strokes, etc.) may be performed to adhere and imprint a TIM or other material. This may include first adhering or pre-adhering the TIM or other material with a foam or other resilient material, and then using a mold (e.g., a blade mold, a steel embossing mold, a knife mold, an integrated circuit mold, etc.) in a separate action to imprint the TIM or other material for release. The pre-sticking and embossing may be performed on the same machine or on separate machines. Advantageously, the sticking and embossing in a separate action may help to mitigate air entrapment and/or allow for a faster overall process.
In some example embodiments, multiple actions (e.g., multiple strokes, multiple printing actions, etc.) may be performed to stack materials of the same material or different materials (e.g., TIMs on TIMs, etc.). Advantageously, this may allow for fewer SKUs (stock keeping units) by allowing a single thick layer to be built up by multiple actions in the same location (e.g., multiple 25 micron thick layers built up as a final thick layer, etc.). This may also allow different layers to be placed or stacked on top of each other (such as a bottom or first TIM layer, an intermediate or second dielectric layer, and a top or third TIM layer, etc.). This may also allow for easier reworking without adding sufficient material.
In some exemplary embodiments, the mold is used to imprint in the TIM or other material to be transferred. For example, the raised rim of the submount or integrated circuit may be used to perform the imprinting required to release and transfer the TIM or other material from the supply. An oversized resilient material (e.g., foam, etc.) or oversized mold including a core or cavity filled with resilient material (e.g., foam, etc.) may be used to complete the transfer of the imprinted TIM or other material to the lift-off base or integrated circuit. Advantageously, this process may allow the entire surface of the lift-off mount or integrated circuit to be covered with a TIM or other material.
Sometimes, a thermal interface material or other material may be required on both sides of the element, substrate or component. In some exemplary embodiments, a dual head (e.g., a dual print head, etc.) that pushes a target element, component, or substrate in up/down, left/right, rotational, etc. movements may be used to apply thermal interface material or other material on both sides of the target element. The material applied to one side may be the same as or different from the material applied to the other side of the element. By applying the TIM or other material to both sides of the element simultaneously, example embodiments may allow for reduced processing and settling time and/or cost as compared to processing where the TIM may be applied to both sides of the element sequentially and not simultaneously.
Due to the construction or design of the target component, it may sometimes be desirable to print, apply or transfer TIM or other materials in various directions other than up/down. Some example embodiments include multi-directional printing functionality such that a TIM or other material may be printed, applied, or transferred to a target component in various directions (including, but not limited to up/down, lateral, diagonal, rotational, reverse, etc.). This may include printing, coating, or transferring TIM or other materials on multiple sides (e.g., double sided, etc.) or multiple target surfaces.
Referring to the drawings, FIG. 2 illustrates an exemplary system 100 for applying material (e.g., transferring from one or more supplies, etc.) to a component in accordance with an exemplary embodiment embodying one or more aspects of the present disclosure. Although fig. 2 shows the thermal interface material 120 (broadly, material) applied to the cover or integrated heat spreader 124 (broadly, component), the system 100 may also be used to apply the thermal interface material 120 and other materials to a wide range of other components and substrates, such as board level shields (e.g., removable covers or hoods of Board Level Shields (BLSs), etc.), heat sources (e.g., central Processing Units (CPUs), etc.), heat removal/dissipation structures or components (e.g., heat spreaders, heat sinks, heat pipes, vapor chambers, device housings or shells, etc.), uneven surfaces or ridges (e.g., heat pipes along a series of connections, etc.), and the like. Thus, aspects of the present disclosure should not be limited to use with any single type of material, substrate, element, component, or to the application of a thermal interface material to any particular location or portion of a substrate, element, or component.
As shown in fig. 2, the system 100 includes an extruder 104 coupled to a die 108. In operation, the extruder 104 and die 108 may be operated to compact and cut, sever, tear, etc., a portion of the strip or ribbon 112 including the liner 116 and Thermal Interface Material (TIM) 120 beneath the die 108. Alternative embodiments may include tools of different configurations than extruder 104 and die 108, as disclosed herein.
For example, the die 104 may include a radius tool die (rounded knife die). The radius tool mold may include a foam filled core. In alternative embodiments, the mold 108 may include a cavity or core filled with a different elastic material (such as cotton, cork, gel pack, rubber, elastomer, resilient plastic, resilient or sponge material, fibrous material, insulating material, etc.). In still other embodiments, the mold 108 may be dependent on the particular type of material being applied or transferred by the system 100 without the need for a core filled with an elastomeric material.
For this example, the foam filled core of the mold 108 may compress the TIM120 down onto a corresponding one of the caps 124 located below the mold 108. The doctor blade mold may then remove (e.g., cut, tear, sever, etc.) the TIM120 with the liner 116, for example, without having to pierce the liner 116. During this removal operation, the TIM120 is forced downwardly and the liner 116 is pushed through the TIM120 with the die 108, which causes the TIM120 to sever, tear or cut from itself without cutting the liner 116. While a very thin portion of the TIM120 may remain between the lid 124 and the liner 116, the portion is so thin that it breaks away from the remainder of the TIM120 when the TIM120 is substantially cut. For example, the TIM120 may begin at an initial thickness of approximately 125 microns. The mold 108 may force the liner 116 downward into the TIM120 until the TIM thickness is reduced to about 25 microns or pushed away. Thus, the TIM120 may thus have beveled edges on all four sides as a result of this approach.
As shown in fig. 2, when the mold 108 is removed, the TIM 120 may remain on the lid 124 and the next portion of the strip 112 and the next lid 124 are moved into position under the mold 108. For example, the cover 124 may be advanced or moved relative to the mold 108 via a conveyor belt or other feed/conveyor mechanism.
In the illustrated embodiment, the strip 112 of material including the liner 116 and the TIM 120 is a roll of material from a supply or roll 128. Rollers 132, 136, 140 are used to unwind the strip of material 112 from the supply 124 of web material and travel to a position below the die 108 for compaction and cutting. After the TIM 120 has been compacted and removed from the strip 112 and applied and transferred to the lid 124, the remaining strip of material 144 may be collected, e.g., wound onto a scrap roll 148. The waste roll 148 is allowed to fall into a trash can or the like. In other embodiments, more or fewer rollers may be used, and/or strips of material that do not start on the roll may be used. In this case the material strip may be placed by hand, with a clamp or by an automated device.
In an exemplary embodiment, the system 100 preferably utilizes strips of material as much as possible to minimize or at least reduce waste during the coating process (e.g., minimize the amount of TIM material remaining on the liner, etc.). As shown in fig. 2, the caps 124 are spaced apart a distance greater than the distance that the strip 112 is advanced after each compaction and cutting (broadly, removal) operation. After each compaction and cutting operation, only the strip 112 is advanced sufficiently to allow compaction and cutting, severing, tearing, etc. of the next portion of the strip 112 to apply the TIM 120 to the next cap 124 (e.g., a minimum distance). For example, the width of the TIM 120 along the liner 116 may be equal to the width of the sheet that the TIM 120 is compacted and applied/transferred to the lid 124. For another example embodiment, the width of the TIM 120 along the liner 116 (e.g., 1 inch, etc.) may be greater than the width of the sheet (e.g., 3/4 inch, etc.) that the TIM 120 is compacted and applied/transferred to the lid 124.
For example, the strip of material 112 may also include a lower liner disposed along a lower surface or bottom of the TIM 120. In such an embodiment, the release liner may be removed manually by hand (e.g., with a rewind and stripper lever, etc.) or without manual intervention prior to the application of the TIM 120 to the lid 124 by the mold 108.
In an exemplary embodiment, the system 100 may include one or more heaters to apply or increase heat to the top and/or to the base or bottom. The heat may assist in cutting, tearing, severing, etc. the material and/or adhesion of the material to the component. Or, for example, heat may be used to cut or otherwise remove (e.g., without a knife or blade, etc.) portions of material from the supply. Additionally or alternatively, the system 100 may be configured with cooling, for example, added to the top and a die for cutting TIMs and the like. In some exemplary embodiments a mold may be added to the top plate.
The roll 128 (supply) may be provided in a variety of sizes, such as 0.5 inch (12.7 millimeters (mm)), 1 inch (25.4 mm), and the like. The roll width may be selected based on the element size. For example, if the cover 124 (broadly, the element) is 10mm by 5mm, a roll having a width of 0.5 inches (12.7 mm) may be used. The roll 128 is placed on an unwinder and through the applicator or system 100. If the roll 128 includes a lower liner, the lower liner may be removed as the material is rewound with a small roll. The cover 124 and the die 108 may be oriented in the applicator or system 100 to maximize the use of the thermal interface material. The cover 124 may be placed in a jig during the coating step to ensure good or perfect positioning and TIM placement. For small batches, the orientation may be performed manually by hand, but for large batches, the orientation may be performed automatically, for example, by an automated station (e.g., a rotatable or other station, etc.). The system 100 may include a sensor system that advances the roll of TIM material for the next TIM coating. Alternatively, the system 100 may be configured with a set distance advancement process. Heating and cooling may be provided to improve coating robustness.
Exemplary embodiments of systems for applying (e.g., transferring from a supply, etc.) thermal interface materials and other materials to components are disclosed. For example, thermal interface materials or other materials may be applied to a wide range of substrates, components, and elements such as covers for Integrated Circuit (IC) packages or integrated heat spreaders, board-level shields, heat sources (e.g., central Processing Units (CPUs), etc.), heat extraction/dissipation structures or components (e.g., heat spreaders, heat sinks, heat pipes, vapor chambers, device housings or casings, etc.), and so forth.
In an exemplary embodiment, the system may include a supply of material (e.g., a roll, disk, or ribbon of thermal interface material or other material, etc.) and a tool (e.g., a mold, etc.). The tool may be operated to push (e.g., compact, etc.) and remove (e.g., cut, tear, shear, sever, separate, etc.) the portion of material from the supply between the tool and the component.
The material may comprise a non-metal. The portion of material may be coupled to the component without any diffusion bond or weld joint between the portion and the component.
The liner may be along the surface of the supply of material. The tool may be operable to remove portions of material from the supply by means of the liner. For example, the tool may be operable to push the liner through a portion of the material to sever the portion of the material from the supply without having to pierce the liner.
The tool may comprise a die operable to compact and cut a portion of material from the supply between the tool and a corresponding one of the components. For example, the tool may include a radius tool mold having a foam filled core. The foam filled core may be useful for compacting portions of material down onto the component. A radius tool die may be available to cut portions of material from a supply with a liner.
The system may be configured such that portions of material remain on the component and such that the liner is removed from the portions of material as the tool is removed and moved (e.g., lifted up, etc.) away from the portions of material. The system may be configured so as to remain on the component as the tool is removed and the next portion of the supply of material and the next component are moved to a position where the material is applied.
The system may include a sensor system that advances a supply of material for subsequent application to a subsequent component. Or the system may be configured with a set distance advancement process for a supply of material.
The system may include a fixture in which the part is placed and oriented relative to the mold to place the material on the part. The components may include a lid or integrated heat spreader of an Integrated Circuit (IC) package, a board level shield, a heat source (e.g., a Central Processing Unit (CPU), etc.), a heat removal/dissipation structure or component (e.g., a heat spreader, a heat sink, a heat pipe, a vapor chamber, a device housing or shell, etc.), and so forth.
The system may be configured with heating and/or cooling features (e.g., a re-circulation heater/cooling device, etc.) for applying heat and/or cooling during application of the material to the component, which may aid in cutting, adhesion, release of TIM or other material from the liner, temperature control of the component and liner, etc. For example, the heat may assist in cutting of the material and/or adhesion of the material to the component. Or, for example, heat may be used to cut or otherwise remove (e.g., without a knife or blade, etc.) portions of material from the supply.
The system may include a roll of a supply of material. The rollers may be arranged such that the supply of material unwinds from the roll and travels to a position aligned with the tool. Waste collection (e.g., rolls of waste, garbage cans, etc.) may be used to collect unused portions of the supply of thermal interface material remaining after the material is applied to the component. The material may be a thermal phase change material without any tabs. As another example, the system or method may be configured to apply (e.g., transfer from a roll, etc.) a thermal interface material or other material to a substrate (such as a film) to make a tab article, etc.
Exemplary embodiments of methods for applying material to a component are also disclosed. For example, thermal interface materials or other materials may be applied to a wide range of substrates and components, such as covers for Integrated Circuit (IC) packages or integrated heat spreaders, board-level shields, heat sources (e.g., central Processing Units (CPUs), etc.), heat removal/dissipation structures or components (e.g., heat spreaders, heat sinks, heat pipes, vapor chambers, device housings or shells, etc.), and so forth.
In an exemplary embodiment, the method generally includes compacting and removing (e.g., cutting, tearing, shearing, severing, separating, etc.) portions of material from a supply of material aligned with the components such that the portions of material are applied to the components without diffusion bonding of the portions of thermal interface material to a corresponding one of the components.
Compaction and removal may include pressing a tool (e.g., a die, etc.) with the liner disposed along a surface of a supply of material such that portions of the material remain on the component and such that the liner is removed from the portions of material as the tool is removed and moved relatively away from the portions of material. The method may include using a tool to push the liner through a portion of the material to sever the portion of the material from the supply without piercing the liner.
Compaction and removal may include using a tool to compact and remove a portion of material from the supply between the tool and the component.
The tool may include a die, such as a radius tool die having a foam filled core, or the like. In this case, the method may include the steps of: the foam-filled core is used to compact portions of the material onto the component; and cutting portions of the material from the supply of material using a rounded blade die.
The method may include advancing a corresponding one of the components having a portion of material thereon away from the tool; and advancing the supply of material and the next component into a position aligned with the tool for applying material to the next component. Advancing the supply of material may include using rollers to unwind and advance the supply of material from the supply roll to a position aligned with the tool. The method may include collecting unused portions of the supply of material left after the material is applied to the component.
The material may comprise a non-metal. The method may comprise the steps of: the portion of material is coupled to the component without any diffusion bond or weld joint between the portion and the component.
The method may include the step of advancing the supply of material for subsequent application to the component while using the sensor system or the set-distance advancement process. The method may further comprise the steps of: the part is placed in the fixture such that the part is oriented to place material on the part. The components may include a lid or integrated heat spreader of an Integrated Circuit (IC) package, a board level shield, a heat source (e.g., a Central Processing Unit (CPU), etc.), a heat removal/dissipation structure or component (e.g., a heat spreader, a heat sink, a heat pipe, a vapor chamber, a device housing or shell, etc.), and so forth. The method may further comprise heating and/or cooling during compaction and/or removal.
Another exemplary embodiment includes an integrated heat spreader and a thermal interface material or other material thereon that is coated (e.g., compacted and cut, transferred from a supply, etc.) by the systems or methods disclosed herein. The electronic device may include the integrated heat spreader of claim and a central processing unit or processor die. The integrated heat spreader may be operable to spread heat generated by the central processing unit or the processor die.
Another exemplary embodiment includes a plate-level shield (BLS) and a thermal interface material or other material over the plate-level shield (BLS) that is coated (e.g., compacted and cut, transferred from a supply, etc.) by the systems or methods disclosed herein. The BLS may be adapted to provide electromagnetic interference (EMI) shielding for at least one component on a substrate. The BLS may include one or more sidewalls defining an opening and configured to be mounted to the substrate generally about at least one component on the substrate; and a cover configured to cover the opening defined by the one or more sidewalls. A thermal interface material may be applied to the cover. When one or more side walls are mounted to the substrate generally about the at least one component and the cover covers an opening defined by the one or more side walls, the thermal interface material and the cover may cooperate to define a thermally conductive thermal path from the at least one component, and the BLS is operable to provide EMI shielding for the at least one component. The cover may be integral with or removably attached to one or more of the side walls.
Another exemplary embodiment includes an assembly including a heat removal/dissipation structure, a printed circuit board having a heat source, and a board-level shield having a thermal interface material or other material applied (e.g., compacted and cut, transferred from a supply, etc.) thereon by the systems or methods disclosed herein. One or more side walls are mounted to the printed circuit board with the opening over at least one component. The cover is positioned on the one or more sidewalls such that an opening defined by the one or more sidewalls is covered by the cover. The thermal interface material and the cover cooperate to define a thermally conductive thermal path from the heat source to the heat removal/dissipation structure. The board level shield is operable to provide EMI shielding for the heat source. The heat removal/dissipation structure may be a heat spreader. The heat source may be an integrated circuit on a printed circuit board.
A wide range of thermal interface materials and other materials (e.g., non-thermal reinforcement materials, thermal insulators, dielectric insulators, electrical insulators, conductive elastomers, EMI absorbers, EMI shielding materials, polymeric materials, adhesive materials, other interface materials, combinations thereof, separate layers thereof, pairs of laminates thereof, etc.) may be used in the exemplary embodiment of material 120 shown in fig. 2. Advantageously, the exemplary embodiments disclosed herein may allow for the fabrication of TIMs that will have relaxed characteristics over current TIMs. Easy handling and coating are important for TIMs, but softness, shear thinning and modulus that contribute to performance result in more difficult coating materials. The exemplary coating processes disclosed herein may allow for easier coating of materials that are generally difficult to coat but have better properties.
Example thermal interface materials that may be used in the exemplary embodiments include thermal gap fillers, thermal phase change materials, thermally conductive EMI absorbers or hybrid thermal/EMI absorbers, thermal putties, thermal gaskets, and the like. For example, exemplary embodiments may include a thermally conductive EMI absorber or a hybrid thermal/EMI absorber compacted, cut, and applied to a portion of an EMI shield, such as a hood or cover or board level shield.
Exemplary embodiments may include one or more thermal interface materials produced by leird (Laird) (such as Tputty TM series 502 thermal gap filler, tflex TM series gap filler (e.g., tflex TM series 300 thermal gap filler), Tflex TM 600 series 600 thermal gap filler, tflex TM series thermal gap filler, etc.), tpcm TM series thermal phase change material (e.g., tpcm TM series thermal phase change material, Tpcm TM series thermal phase change material, tpcm TM series thermal phase change material, etc.), tpli TM series caulk (e.g., tpli TM series caulk, etc.), a thermal phase change material, etc, IceKap TM series of thermally-interface materials and/or CoolZorb TM series of thermally-conductive microwave absorber materials (e.g., coolZorb TM series 400 thermally-conductive microwave absorber materials, coolZorb TM series 500 thermally-conductive microwave absorber materials), CoolZorb TM 600 series 600 thermally conductive microwave absorber material, etc.). in some exemplary embodiments, the thermal interface material may include a compatible caulk having a high thermal conductivity. For example, the thermal interface material may include a thermal interface material of leird (Laird) (such as one or more of TflexTM 200、TflexTM HR200、TflexTM 300、TflexTM300TG、TflexTM HR400、TflexTM 500、TflexTM 600、TflexTM HR600、TflexTM SF600、TflexTM 700、TflexTM SF800 thermal caulks).
The thermal interface materials disclosed herein may include elastomeric and/or ceramic particles, metal particles, ferromagnetic EMI/RFI absorbing particles, metal or fiberglass mesh in a rubber, gel or wax base, or the like. The thermal interface material may include compatible or conformal silicon pads, non-silicon-based materials (e.g., non-silicon-based caulks, thermoplastic and/or thermoset polymeric elastomer materials, etc.), silk-screening materials, polyurethane foams or gels, thermally conductive additives, and the like. The thermal interface material may be configured to have sufficient conformality, compatibility, and/or softness (e.g., not have to undergo phase changes or reflow, etc.), to adjust resistance or clearance by bending at low temperatures (e.g., room temperature of 20 ℃ to 25 ℃, etc.), and/or to allow the thermal interface material to closely conform (e.g., in a tighter fit and encapsulation manner, etc.) to mating surfaces (including non-planar, curved, or non-uniform mating surfaces) when placed in contact (e.g., compressed against, etc.) with the mating surfaces.
The thermal interface materials disclosed herein may include a soft thermal interface material formed from an elastomer and at least one thermally conductive metal, boron nitride, and/or ceramic filler such that the soft thermal interface material is conformal even without undergoing phase changes or reflow. In some exemplary embodiments, the first and/or second thermal interface material may comprise a ceramic filled silicon elastomer, a boron nitride filled silicon elastomer, or a thermal phase change material comprising a generally non-reinforced film.
Exemplary embodiments may include one or more thermal interface materials having high thermal conductivity (e.g., 1W/mK (watts per meter per kelvin), 1.1W/mK, 1.2W/mK, 2.8W/mK, 3W/mK, 3.1W/mK, 3.8W/mK, 4W/mK, 4.7W/mK, 5W/mK, 5.4W/mK, 6W/mK) depending on the particular materials used to make the thermal interface materials and the loading percentages of the thermally conductive filler, if any. These thermal conductivities are merely examples, as other embodiments may include thermal interface materials having thermal conductivities above 6W/mK, less than 1W/mK, or other values, and ranges between 1 and 6W/mK. Accordingly, aspects of the present disclosure should not be limited to use with any particular thermal interface material, as example embodiments may include a wide range of thermal interface materials and other materials (e.g., non-thermal enhancement materials, thermal insulators, dielectric insulators, electrical insulators, conductive elastomers, EMI absorbers, EMI shielding materials, polymeric materials, adhesive materials, other interface materials, combinations thereof, individual layers thereof, stacked layers thereof, etc.).
The thermal interface materials and/or other materials applied by the systems and methods disclosed herein may include one or more suitable fillers and/or binders added to achieve various desired results. Exemplary fillers include pigments, plasticizers, processing aids, flame retardants, extenders, and the like. For example, adhesion promoters may be added to increase the adhesion of thermal interface materials or other materials, etc. By way of further example, thermal interface materials and/or other materials coated by the systems and methods disclosed herein may include electromagnetic interference (EMI) or microwave absorbers, electrically conductive fillers, and/or magnetic particles to be operable as or to be used as EMI and/or RFI shielding materials. Examples of fillers include carbonyl iron, iron silicide, iron particles, iron chromium compounds, metallic silver, carbonyl iron powder, SENDUST (alloys containing 85% iron, 9.5% silicon, and 5.5% aluminum), permalloy (alloys containing about 20% iron he 80% nickel), ferrite, magnetic alloys, magnetic powders, magnetic flakes, magnetic particles, nickel-based alloys and powders, chromium alloys, and any combination thereof. The thermal interface materials and/or other materials coated by the systems and methods disclosed herein may include one or more EMI absorbers formed from one or more of the above materials, wherein the EMI absorbers include particles, spheres, microspheres, ellipsoids, irregular spheres, strands, flakes, powder, and/or a combination of any or all of these shapes.
A wide range of materials may be used for the cover (broadly, the element) in the exemplary embodiments disclosed herein, including conductive materials such as metals (e.g., aluminum, copper, etc.), alloys, natural graphite, synthetic graphite, or other suitable materials, etc. For example, a non-exhaustive list of exemplary materials from which the EMI shield or portions thereof may be made include cold rolled steel, nickel silver alloy, copper nickel alloy, stainless steel, tin-plated cold rolled steel, tin-plated copper alloy, carbon steel, brass, copper, aluminum, copper beryllium alloy, phosphor bronze, steel, alloys thereof, plastic material coated with a conductive material, or any other suitable conductive and/or magnetic material. The materials disclosed herein are provided for illustrative purposes only, as different materials may be used depending upon, for example, the particular application.
In addition, the thermal interface materials and other materials disclosed herein may be applied to a wide range of elements or components. (including a lid or integrated heat spreader of an Integrated Circuit (IC) package, a board level shield (e.g., a removable lid or cover of a Board Level Shield (BLS), etc.), a heat source (e.g., a Central Processing Unit (CPU), etc.), a heat removal/dissipation structure or component (e.g., a heat spreader, a heat sink, a heat pipe, a vapor chamber, a device housing or shell, etc.), etc. Thus, aspects of the present disclosure should not be limited to use with any single type of element or component or to application to any particular location or portion of an element or component.
In an exemplary embodiment, portions of the thermal interface material or other materials may be removed from the supply and applied to a cover or lid of a Board Level Shield (BLS). The BLS cover or housing may be integrated with or removably attached to a sidewall of the BLS. For example, the BLS may include a sidewall integrally formed with an upper surface, cover, lid, or top of the BLS. For example, the sidewalls and upper surface may be formed by: the same sheet of conductive material is stamped and then the stamped material is folded such that the sidewalls are substantially perpendicular to the upper surface. Alternatively, the sidewalls may be separately fabricated and not integrally formed with the upper surface of the BLS. In some exemplary embodiments, the BLS may include a two-piece shield from which the upper surface, cover, lid, or top may be removed and attached to the sidewall. In some exemplary embodiments, the BLS may include one or more inner walls, dividers, or spacers attached to and/or integrally formed with the BLS. In such exemplary embodiments, the BLS cover, the sidewalls, and the inner wall may cooperatively define a plurality of separate EMI shielding compartments.
In some exemplary embodiments, multiple material portions may be removed (e.g., pushed, pressed, compacted, removed, severed, torn, cut, blown, etc.) from one or more supplies (e.g., one or more rolls, disks, or strips of one or more of the same, different, and/or multiple layers of material) and applied to either or both sides of a component or substrate. For example, portions of the same thermal interface material (or another material) may be removed from a single supply of thermal interface material and applied along the underside or inside of a BLS cap or cover (or other component). The various portions may be removed and applied separately (e.g., sequentially, successively, continuously, etc.) or simultaneously from a single supply. Or, for example, multiple different portions of the same thermal interface material (or another material) may be removed and applied separately or simultaneously from different supplies. As another example, multiple different portions of different materials may be removed and applied separately or simultaneously from different supplies of different materials. The various portions may be adjacent (e.g., abutted, contacted, etc.) or spaced apart from one another along the BLS cap or housing. Additionally or alternatively, multiple different portions may be stacked on top of each other along the lower or inner side of the BLS or cover.
The TIM or other material portions applied along the inside of the BLS cover or lid may have the same thickness or different thicknesses to accommodate devices, components, etc. of varying heights that will be under the BLS. The TIM or other material portions applied along the outside of the BLS cover or housing may also have the same thickness or different thicknesses to accommodate varying thickness heat spreaders, heat sinks, other heat removal/dissipation structures, and the like.
In an exemplary embodiment, the supply of material may comprise a single roll, disk, tape, or other supply of single or multiple layers of material. In other exemplary embodiments, the supply of material may include multiple rolls, discs, strips, or other supplies of a single layer of material, which may be the same or different for the multiple supplies. In further exemplary embodiments, the supply of material may include multiple rolls, discs, strips, or other supplies of multi-layer material, which may be the same or different for the multiple supplies. In still other exemplary embodiments, the supply of material may include at least one roll, disk, tape, or other supply of single layer material or at least one roll, disk, tape, or other supply of multiple layers of material. In some example embodiments, the supply of material may include a supply (e.g., carrier tape, etc.) having a package or cavity in which a portion of material (e.g., a portion of TIM or other material, etc.) to be coated (e.g., blown out of the package, mechanically removed with a pick-and-place device, etc.) is positioned. In exemplary embodiments, portions from one or more supplies of material may be removed and applied separately (e.g., sequentially, continuously, etc.) or simultaneously.
In an exemplary embodiment, the system may be used to remove portions of material (e.g., TIM, etc.) from a supply (e.g., disc, roll, tape, etc.) and to apply or transfer the material portions to the component. For example, the system may cut portions of material from a supply, and the cutting process may also transfer the cut portions of material to the component. Or, for example, the system may shape and/or size the material portion, which shaping and/or sizing process may also transfer the shaped and/or sized material portion to the component. As another example, the system may deform the material portion, and the deforming process may also transfer the deformed material portion to the component. As yet another example, the system may imprint and tear the material portions, and the process may also transfer the material portions to the component.
Example embodiments disclosed herein may be used with a wide range of heat sources, electronic devices, and/or heat removal/dissipation structures or components (e.g., heat spreaders, heat sinks, heat pipes, device housings or casings, etc.). For example, the heat source may include one or more heat generating components or devices (e.g., a CPU, an in-underfill die, a semiconductor device, a flip chip, a Graphics Processing Unit (GPU), a Digital Signal Processor (DSP), a multiprocessor system, an integrated circuit, a multi-core processor, etc.). In general, a heat source may include any component or device that has a higher temperature than a thermal interface material or that otherwise provides or transfers heat to the thermal interface material regardless of whether the heat is generated by the heat source or is solely by or transferred via the heat source. Thus, aspects of the present disclosure should not be limited to any particular use with any single type of heat source, electronic device, heat removal/dissipation structure, etc.
Exemplary embodiments may provide one or more (but not necessarily any or all) of the following features or advantages, such as tab cancellation and reduced cost as compared to some conventional Phase Change Material (PCM) coating processes with tab elements that increase high cost. Exemplary embodiments may help solve problems (such as customer problems when properly coating tab-coated elements, liner release problems, limitations on element construction, shape, and size, difficulty in keeping material clean and/or transporting tab-coated elements without distortion during additional steps after formation in a clean room). The exemplary embodiments disclosed herein may allow for standard materials (e.g., standard width, thickness, and/or length, etc.) to be provided that may then be used with different molds that may be changed as desired for various shapes and sizes. The exemplary embodiments disclosed herein may provide a simpler form design from can (pot) to finished roll, may provide compact handling and smaller clean room requirements (type 2), may require only limited Work In Process (WIP) costs, may allow for a simpler/smaller list of component numbers, PCM thicknesses and widths, may allow for a variety of die shapes and components (e.g., fig. 3, etc.) that are not cost effective in tab format, may allow for the minimum size available to become unproblematic (e.g., fig. 3, etc.), may allow for liner release variation issues to be unimportant, and/or may allow for the elimination of screened "clean" material from remaining between liners until applied to the lid. In some exemplary embodiments, the TIM may be coated quickly and without distortion and trapped air, and the element may be cleaned without pumping out.
Example embodiments are provided so that this disclosure will be thorough, and will fully convey the scope to those skilled in the art. Numerous specific details are set forth, such as examples of specific components, devices, and methods, in order to provide a thorough understanding of embodiments of the present disclosure. It will be apparent to one skilled in the art that the example embodiments may be embodied in many different forms without the use of specific details, and that nothing should be construed as limiting the scope of the disclosure. In some example embodiments, well-known processes, well-known device structures, and well-known techniques have not been described in detail. In addition, advantages and improvements that may be realized with one or more exemplary embodiments of the invention are provided for illustrative purposes only and do not limit the scope of the disclosure (as exemplary embodiments disclosed herein may provide all or none of the above advantages and improvements and still fall within the scope of the disclosure).
The specific dimensions, specific materials, and/or specific shapes disclosed herein are exemplary in nature and do not limit the scope of the present disclosure. The disclosure herein of particular values and ranges of values for a given parameter is not intended to be exhaustive of other values and ranges of values in one or more of the examples disclosed herein. Moreover, it is contemplated that any two particular values for a particular parameter recited herein may define an endpoint of a range of values that may be appropriate for the given parameter (i.e., disclosure of a first value and a second value for the given parameter may be interpreted as disclosing that any value between the first and second values may also be employed for the given parameter). For example, if parameter X is exemplified herein as having a value of a and is also exemplified as having a value of Z, it is envisioned that parameter X may have a range of values from about a to about Z. Similarly, the disclosure of two or more value ranges for a parameter (whether such ranges are nested, overlapping, or different) is contemplated to encompass all possible combinations of value ranges for which endpoints of the disclosed ranges can be used. For example, if parameter X is exemplified herein as having a value within the range 1-10 or 2-9 or 3-8, it is also contemplated that parameter X may have other value ranges including 1-9, 1-8, 1-3, 1-2, 2-10, 2-8, 2-3, 3-10, and 3-9.
The terminology used herein is for the purpose of describing particular example embodiments only and is not intended to be limiting. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. The terms "comprises" and "comprising" are inclusive and therefore specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. The method steps, processes, and operations described herein are not to be construed as necessarily requiring their performance in the particular order discussed or illustrated, unless specifically identified as an order of performance. It is also understood that additional or alternative steps may be employed.
When an element or layer is referred to as being "on," "engaged to," "connected to" or "coupled to" another element or layer, it can be directly on, engaged, connected or coupled to the other element or layer or intervening elements or layers may be present. In contrast, when an element is referred to as being "directly on," "directly engaged to," "directly connected to," or "directly coupled to" another element or layer, there may be no intervening elements or layers present. Other words used to describe the relationship between elements should be interpreted in the same fashion (e.g., "between … …" versus "directly between … …", "adjacent" versus "directly adjacent", etc.). As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
The term "about" when applied to a value indicates that the calculation or measurement allows the value to be somewhat imprecise (with near-exact in value; approximately or reasonably close to the value; almost). If, for some reason, the imprecision provided by "about" is not otherwise understood in the art with this ordinary meaning, then "about" as used herein indicates at least a change that may be caused by ordinary measurement methods or the use of such parameters. For example, the terms "generally," "about," and "approximately" may be used herein to mean within manufacturing tolerances. Or for example, the term "about" as used herein in modifying the invention or the amount of ingredients or reactants employed refers to variations in the amount that may occur due to typical measurement and processing procedures used (e.g., due to occasional errors in such procedures when making concentrates or solutions in the real world; due to differences in the manufacture, source or purity of the ingredients used to make the compositions or perform the methods). The term "about" also encompasses amounts that differ due to different equilibrium conditions for the composition produced from a particular initial mixture. Whether or not modified by the term "about," the claims include equivalents to the number of equivalents.
Although the terms first, second, third, etc. may be used herein to describe various elements, components, regions, layers and/or sections, these elements, components, regions, layers and/or sections should not be limited by these terms. These terms may only be used to distinguish one element, component, region, layer or section from another region, layer or section. Terms such as "first," "second," and other numerical terms, as used herein, do not imply a sequence unless clearly indicated by the context. Thus, a first element, component, region, layer or section discussed below could be termed a second element, component, region, layer or section without departing from the teachings of the example embodiments.
Spatially relative terms (such as "inner," "outer," "lower," "upper," and the like) may be used herein for convenience of description to describe one element or feature's relationship to another element or feature as illustrated in the figures. Spatially relative terms may be intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as "below" or "beneath" other elements or features would then be oriented "above" the other elements or features. Thus, the example term "below" may encompass both an orientation of above and below. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.
The foregoing description of the embodiments has been provided for the purposes of illustration and description. It is not intended to be exhaustive or to limit the disclosure. Individual elements, intended, or recited uses or features of particular embodiments are generally not limited to that particular embodiment, but, where appropriate, are interchangeable and can be used with selected embodiments (even if the embodiment is not specifically shown or described). The same can also be varied in many ways. Such variations are not to be regarded as a departure from the disclosure, and all such modifications are intended to be included within the scope of the disclosure.
Claims (45)
1. A system for applying material to a component, the system comprising:
A supply of material comprising a carrier liner along a surface of the material; and
A tool operable to transfer a portion of the material from the carrier liner of the supply body to a component, the tool comprising an elastic material configured to both compact and imprint the portion of the material onto the component to release and transfer the portion of the material from the supply body as the tool moves downwardly relative to the portion of the material to sever the portion of the material downwardly from the supply body to transfer the portion of the material onto the component;
wherein the carrier liner is configured to texturize the surface of the material when the tool is pressed against the carrier liner to transfer the portion of the material from the carrier liner to the component.
2. The system of claim 1, wherein the carrier liner includes one or more protrusions that imprint into and/or texturize the surface of the portion of the material as the portion of the material is transferred from the carrier liner to the component.
3. The system of claim 2, wherein the one or more protrusions of the carrier liner comprise a thick layer of ink along the carrier liner that is imprinted into and textured to the surface of the portion of the material.
4. The system of claim 2, wherein the one or more protrusions of the carrier liner are pre-existing along the carrier liner and configured to be embossed into and textured the surface of the portion of the material before the portion of the material is transferred from the carrier liner to the component such that the textured surface improves air removal.
5. The system of claim 1, wherein the carrier liner includes at least one portion configured to texturize the surface of the material when the tool is pressed against the carrier liner to transfer the portion of the material from the carrier liner to the component.
6. The system of any one of claims 1 to 5, wherein:
The material comprises a non-metal; and
The portion of the material is coupled to the component without any diffusion bonding between the portion and the component.
7. The system of any of claims 1-5, wherein the system is configured such that the portion of the material remains on the component and such that at least a portion of the carrier liner remains on the portion of the material when the tool is removed and moved relatively away from the portion of the material, and
The tool is configured to provide a cutting edge for cutting through the carrier liner.
8. The system of any one of claims 1 to 5, wherein: the elastic material is shaped to mitigate air entrapment and de-bubbling from the portion of the material.
9. The system of any of claims 1-5, wherein the tool comprises a die comprising a portion configured to cut the portion of the material for release and transfer from the supply, and wherein:
The supply of the material comprises a supply of a thermal interface material having a high thermal conductivity; and
The mould comprises a cavity or core filled with the resilient material, which is operable to compact a pad of the thermal interface material onto the component before the mould cuts the pad of the thermal interface material from the supply of the thermal interface material.
10. The system of any one of claims 1 to 5, wherein:
The tool is operable to complete the release and transfer of the imprinted portion of the material from the supply to an integrated circuit die that includes one or more blades configured to imprint the portion of the material for release and transfer from the supply.
11. The system of any one of claims 1 to 5, wherein:
The tool is operable to compact the portion of the material from the supply onto an integrated circuit die such that one or more edges of the integrated circuit die cut or tear the portion of the material for release and transfer from the supply.
12. The system of any one of claims 1 to 5, wherein:
The tool comprises: a first tool operable to compact the portion of the material from the supply onto the component; and a second tool for separating the portion of the material from the supply body; or alternatively
The tool includes a multiple-up mold operable for simultaneously transferring portions of the material from the supply to a plurality of different parts or a plurality of different regions of the same single part in a single action.
13. The system of any one of claims 1 to 5, wherein:
The system is configured to transfer a single portion of the material from the supply to a single component in a single action; or alternatively
The system is configured to simultaneously transfer portions of the material from the supply to multiple different regions of the same single component in a single action; or alternatively
The system is configured to simultaneously transfer portions of different materials from different supplies to multiple different regions of the same single component in a single action; or alternatively
The system is configured to simultaneously transfer portions of the material from the supply to a plurality of different components in a single action; or the system is configured to transfer multiple portions of different materials to multiple components simultaneously from different supplies in a single action.
14. The system of any one of claims 1 to 5, wherein the system is configured such that compaction and/or adhesion of the portion of the material from the supply onto the component is performed in a first action and such that embossing of the portion of the material to release from the supply is performed in a second action; and/or
Wherein:
The system is configured to transfer portions of the material from the supply and stack to the component on top of each other; or alternatively
The system is configured to transfer multiple portions of different materials from different supplies and stack the components on top of each other.
15. The system of any one of claims 1 to 5, wherein:
The tool is operable to push the carrier liner downwardly through the portion of the material to sever the portion of the material downwardly from the supply without cutting the carrier liner, thereby transferring the portion of the material to the component without piercing the carrier liner; and
The tool is operable to force the carrier liner downwardly into the portion of the material such that the thickness of the portion of the material is reduced or pushed away, whereby the portion of the material has a beveled edge.
16. The system of any one of claims 1 to 5, wherein:
The supply of material comprises a supply disk or roll of thermal interface material having a high thermal conductivity;
the system further comprises a take-up disc or reel;
The tool includes a rotary die located between the supply disc or roll and the take-up disc or roll, the rotary die being operable to transfer a pad of the thermal interface material from the supply disc or roll to the component in rotation without air entrapment in the pad.
17. The system of any one of claims 1 to 5, wherein:
The supply of material comprises a single layer of the supply of material and/or a multiple layer of the supply of material; and/or
The supply of material includes one or more supplies of one or more thermal interface materials, electrically conductive elastomers, electromagnetic interference absorbers, electromagnetic interference shielding materials, dielectric materials, and/or thermally conductive materials; and/or
The components include one or more covers, integrated heat spreaders of integrated circuit packages, covers of board-level shields, heat sources, heat removal/dissipation structures, and/or substrates.
18. A system for applying a material to a component, the system comprising:
A supply of material comprising a carrier liner having a surface comprising an electrically conductive material in contact with the surface of the material; and
A tool operable to transfer a portion of the material from the carrier liner of the supply body to a component, the tool comprising an elastic material configured to both compact the portion of the material onto the component and imprint the portion of the material to release and transfer the portion of the material from the supply body as the tool moves downwardly relative to the portion of the material to sever the portion of the material downwardly from the supply body to transfer the portion of the material onto the component, whereby at least a portion of the conductive material is transferred from the carrier liner to the surface of the portion of the material.
19. The system of claim 18, wherein,
The conductive material comprises a conductive ink; and
The tool is operable to transfer the portion of the material from the carrier liner of the supply to the component such that at least a portion of the conductive ink is transferred from the carrier liner to the surface of the portion of the material.
20. The system of claim 18 or 19, wherein:
The material comprises a non-metal; and
The portion of the material is coupled to the component without any diffusion bonding between the portion and the component.
21. The system of claim 18 or 19, wherein the system is configured such that the portion of the material remains on the component and such that at least a portion of the carrier liner remains on the portion of the material when the tool is removed and moved relatively away from the portion of the material, and
Wherein the tool is configured to provide a cutting edge for cutting through the carrier liner.
22. The system of claim 18 or 19, wherein the resilient material is shaped to mitigate air entrapment and de-bubbling from the portion of the material.
23. The system of claim 18 or 19, wherein the tool comprises a die comprising a portion configured to cut the portion of the material for release and transfer from the supply, and wherein:
The supply of the material comprises a supply of a thermal interface material having a high thermal conductivity; and
The mould comprises a cavity or core filled with the resilient material, which is operable to compact a pad of the thermal interface material onto the component before the mould cuts the pad of the thermal interface material from the supply of the thermal interface material.
24. The system of claim 18 or 19, wherein:
The tool is operable to complete the release and transfer of the imprinted portion of the material from the supply to an integrated circuit die that includes one or more blades configured to imprint the portion of the material for release and transfer from the supply.
25. The system of claim 18 or 19, wherein:
The tool is operable to compact the portion of the material from the supply onto an integrated circuit die such that one or more edges of the integrated circuit die cut or tear the portion of the material for release and transfer from the supply.
26. The system of claim 18 or 19, wherein:
The tool comprises: a first tool operable to compact the portion of the material from the supply onto the component; and a second tool for separating the portion of the material from the supply body; or alternatively
The tool includes a multiple-up mold operable for simultaneously transferring portions of the material from the supply to a plurality of different parts or a plurality of different regions of the same single part in a single action.
27. The system of claim 18 or 19, wherein:
The system is configured to transfer a single portion of the material from the supply to a single component in a single action; or alternatively
The system is configured to simultaneously transfer portions of the material from the supply to multiple different regions of the same single component in a single action; or alternatively
The system is configured to simultaneously transfer portions of different materials from different supplies to multiple different regions of the same single component in a single action; or alternatively
The system is configured to simultaneously transfer portions of the material from the supply to a plurality of different components in a single action; or the system is configured to transfer multiple portions of different materials to multiple components simultaneously from different supplies in a single action.
28. The system according to claim 18 or 19, wherein the system is configured such that in a first action compaction and/or adhesion of the portion of the material from the supply onto the component is performed and such that in a second action embossing of the portion of the material to release from the supply is performed; and/or
Wherein:
The system is configured to transfer portions of the material from the supply and stack to the component on top of each other; or alternatively
The system is configured to transfer multiple portions of different materials from different supplies and stack the components on top of each other.
29. The system of claim 18 or 19, wherein:
The system is configured with multi-directional functionality to allow portions of the material to be transferred from the supply to the component in multiple directions, including up, down, lateral, diagonal, rotational, and/or reverse; and/or
The system is configured such that portions of the same material from the supplies can be transferred to both sides of the component simultaneously, or such that portions of different materials from different supplies can be transferred to both sides of the component simultaneously.
30. The system of claim 18 or 19, wherein:
The supply of material comprises a supply disk or roll of thermal interface material having a high thermal conductivity;
the system further comprises a take-up disc or reel;
The tool includes a rotary die located between the supply disc or roll and the take-up disc or roll, the rotary die being operable to transfer a pad of the thermal interface material from the supply disc or roll to the component in rotation without air entrapment in the pad.
31. The system of claim 18 or 19, wherein:
The supply of material comprises a single layer of the supply of material and/or a multiple layer of the supply of material; and/or
The supply of material includes one or more supplies of one or more thermal interface materials, electrically conductive elastomers, electromagnetic interference absorbers, electromagnetic interference shielding materials, dielectric materials, and/or thermally conductive materials; and/or
The components include one or more covers, integrated heat spreaders of integrated circuit packages, covers of board-level shields, heat sources, heat removal/dissipation structures, and/or substrates.
32. A method for applying a material to a component, the method comprising the steps of: transferring a portion of material from a supply of the material to a component, the transferring comprising embossing and/or texturing a surface of the portion of the material so that the portion of material can be transferred from the supply to the component without diffusion bonding of the portion of material to the component, wherein the method comprises using the elastic material to both compact the portion of material onto the component and emboss the portion of material to release and transfer the portion of material from the supply when a tool comprising elastic material is moved downwardly relative to the portion of material to sever the portion of material downwardly from the supply to transfer the portion of material onto the component.
Wherein the supply of the material comprises a carrier liner along a surface of the material; and
The method comprises the following steps: transferring said portion of said material from said carrier liner to said component; and
Wherein the step of embossing and/or texturing the surface of the portion of the material comprises: pressing one or more protrusions along the carrier liner against the surface of the portion of the material to imprint into and/or texturize the surface of the portion of the material.
33. The method of claim 32, wherein,
The material comprises a non-metal; and
The portion of the material is coupled to the component without any diffusion bonding between the portion and the component.
34. The method of claim 32, wherein embossing and/or texturing the surface of the portion of the material improves air removal.
35. The method of claim 32, wherein the step of embossing and/or texturing the surface of the portion of the material comprises embossing and/or texturing a frequency selective surface and/or an EMI shielding surface located on the surface of the portion of the material.
36. The method of claim 32, wherein the one or more protrusions of the carrier liner comprise a thick layer of ink along the carrier liner that is embossed into and textured to the surface of the portion of the material.
37. The method according to any one of claims 32 to 36, wherein the method comprises the steps of:
Using the tool to push the carrier liner downwardly through the portion of the material to sever the portion of the material from the supply without piercing the carrier liner; and/or
Removing the carrier liner from the portion of the material after transferring the portion of the material to the component; and/or
Leaving at least a portion of the carrier liner on the portion of the material after transferring the portion of the material to the component, such that the at least a portion of the carrier liner left on the portion of the material can be used as a protective cover to provide a label and/or to provide a tab; and/or
High pressure and/or cutting edges are used to cut through the carrier liner.
38. The method according to any one of claims 32 to 36, wherein the method comprises the steps of: the elastomeric material is used to mitigate air entrapment and de-bubbling from the portion of the material.
39. A method according to any one of claims 32 to 36, wherein the method comprises cutting the portion of the material using a die to release and transfer from the supply, and wherein:
The supply of the material comprises a supply of a thermal interface material having a high thermal conductivity; and
The mould comprises a cavity or core filled with the resilient material, which is operable to press a portion of the thermal interface material onto the component before the mould cuts the portion of the thermal interface material from the supply of thermal interface material.
40. The method of any one of claims 32 to 36, wherein:
the method includes cutting or tearing the portion of the material using one or more edges of an integrated circuit die to release and transfer from the supply.
41. The method of any one of claims 32 to 36, wherein:
The method includes using a tool that compacts the portion of the material from the supply onto an integrated circuit die such that one or more edges of the integrated circuit die imprint the portion of the material for release and transfer from the supply.
42. The method of any one of claims 32 to 36, wherein:
the supply of material comprises a supply disk or roll of thermal interface material having a high thermal conductivity; and
The method includes using a rotary die between the supply disc or roll and a take-up disc or roll to transfer a pad of the thermal interface material from the supply disc or roll to the component without air entrapment in the pad.
43. The method of any one of claims 32 to 36, wherein:
The supply of material comprises a single layer of the supply of material and/or a multiple layer of the supply of material; and/or
The supply of material includes one or more supplies of one or more thermal interface materials, electrically conductive elastomers, electromagnetic interference absorbers, electromagnetic interference shielding materials, dielectric materials, and/or thermally conductive materials; and/or
The components include one or more covers, integrated heat spreaders of integrated circuit packages, covers of board-level shields, heat sources, heat removal/dissipation structures, and/or substrates.
44. A method for applying a material to a component, the method comprising the steps of: transferring a portion of material from a supply of the material to a component, the transferring comprising embossing and/or texturing a surface of the portion of the material so that the portion of material can be transferred from the supply to the component without diffusion bonding of the portion of material to the component, wherein the method comprises using the elastic material to both compact the portion of material onto the component and emboss the portion of material to release and transfer the portion of material from the supply when a tool comprising elastic material is moved downwardly relative to the portion of material to sever the portion of material downwardly from the supply to transfer the portion of material onto the component.
Wherein the supply of the material comprises a carrier liner along a surface of the material; and
The method comprises the following steps: transferring said portion of said material from said carrier liner to said component; and
The carrier liner includes a conductive material; and
The step of embossing and/or texturing the surface of the portion of the material includes transferring at least a portion of the electrically conductive material from the carrier liner to the surface of the portion of the material.
45. A method for applying a material to a component, the method comprising the steps of: transferring a portion of material from a supply of the material to a component, the transferring comprising embossing and/or texturing a surface of the portion of the material so that the portion of material can be transferred from the supply to the component without diffusion bonding of the portion of material to the component, wherein the method comprises using the elastic material to both compact the portion of material onto the component and emboss the portion of material to release and transfer the portion of material from the supply when a tool comprising elastic material is moved downwardly relative to the portion of material to sever the portion of material downwardly from the supply to transfer the portion of material onto the component.
Wherein the supply of the material comprises a carrier liner along a surface of the material; and
The method comprises the following steps: transferring said portion of said material from said carrier liner to said component; and
The carrier liner includes a conductive ink; and
The step of embossing and/or texturing the surface of the portion of the material includes transferring at least a portion of the conductive ink from the carrier liner to the surface of the portion of the material.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201762562721P | 2017-09-25 | 2017-09-25 | |
| US62/562,721 | 2017-09-25 |
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| CN109560008A CN109560008A (en) | 2019-04-02 |
| CN109560008B true CN109560008B (en) | 2024-09-10 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820037299.1U Active CN207676889U (en) | 2017-09-25 | 2018-01-09 | The system for applying material to component |
| CN201821115858.2U Active CN209133466U (en) | 2017-09-25 | 2018-01-09 | System for applying material to component |
| CN201810017618.7A Active CN109560008B (en) | 2017-09-25 | 2018-01-09 | System and method for applying material to a component |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201820037299.1U Active CN207676889U (en) | 2017-09-25 | 2018-01-09 | The system for applying material to component |
| CN201821115858.2U Active CN209133466U (en) | 2017-09-25 | 2018-01-09 | System for applying material to component |
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| CN207676889U (en) * | 2017-09-25 | 2018-07-31 | 天津莱尔德电子材料有限公司 | The system for applying material to component |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107611037A (en) * | 2016-07-11 | 2018-01-19 | 天津莱尔德电子材料有限公司 | The system and method for applying thermal interfacial material |
| CN207676889U (en) * | 2017-09-25 | 2018-07-31 | 天津莱尔德电子材料有限公司 | The system for applying material to component |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3925602B2 (en) * | 1999-06-14 | 2007-06-06 | セイコーエプソン株式会社 | Adhesive material attaching method and semiconductor device manufacturing method |
| US20160315030A1 (en) * | 2015-04-24 | 2016-10-27 | Laird Technologies, Inc. | Reusable thermoplastic thermal interface materials and methods for establishing thermal joints between heat sources and heat dissipating/removal structures |
-
2018
- 2018-01-09 CN CN201820037299.1U patent/CN207676889U/en active Active
- 2018-01-09 CN CN201821115858.2U patent/CN209133466U/en active Active
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107611037A (en) * | 2016-07-11 | 2018-01-19 | 天津莱尔德电子材料有限公司 | The system and method for applying thermal interfacial material |
| CN207676889U (en) * | 2017-09-25 | 2018-07-31 | 天津莱尔德电子材料有限公司 | The system for applying material to component |
Also Published As
| Publication number | Publication date |
|---|---|
| CN209133466U (en) | 2019-07-19 |
| CN109560008A (en) | 2019-04-02 |
| CN207676889U (en) | 2018-07-31 |
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