CN109556717B - Imaging spectrometer based on scattering effect and hyperspectral imaging method thereof - Google Patents
Imaging spectrometer based on scattering effect and hyperspectral imaging method thereof Download PDFInfo
- Publication number
- CN109556717B CN109556717B CN201811396934.6A CN201811396934A CN109556717B CN 109556717 B CN109556717 B CN 109556717B CN 201811396934 A CN201811396934 A CN 201811396934A CN 109556717 B CN109556717 B CN 109556717B
- Authority
- CN
- China
- Prior art keywords
- light
- frequency
- scattering
- scattering device
- imaging
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000003384 imaging method Methods 0.000 title claims abstract description 72
- 238000000701 chemical imaging Methods 0.000 title claims abstract description 49
- 238000000034 method Methods 0.000 title claims abstract description 38
- 230000000694 effects Effects 0.000 title claims abstract description 16
- 238000001514 detection method Methods 0.000 claims abstract description 105
- 230000003595 spectral effect Effects 0.000 claims abstract description 30
- 238000009826 distribution Methods 0.000 claims abstract description 18
- 238000004458 analytical method Methods 0.000 claims abstract description 10
- 238000004364 calculation method Methods 0.000 claims abstract description 8
- 230000003287 optical effect Effects 0.000 claims description 55
- 238000006243 chemical reaction Methods 0.000 claims description 52
- 238000001228 spectrum Methods 0.000 claims description 42
- 239000000463 material Substances 0.000 claims description 40
- 239000011159 matrix material Substances 0.000 claims description 26
- 239000000758 substrate Substances 0.000 claims description 26
- 239000002245 particle Substances 0.000 claims description 24
- 239000000243 solution Substances 0.000 claims description 16
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 11
- 229910052709 silver Inorganic materials 0.000 claims description 11
- 239000004332 silver Substances 0.000 claims description 11
- GFLJTEHFZZNCTR-UHFFFAOYSA-N 3-prop-2-enoyloxypropyl prop-2-enoate Chemical compound C=CC(=O)OCCCOC(=O)C=C GFLJTEHFZZNCTR-UHFFFAOYSA-N 0.000 claims description 9
- 238000005457 optimization Methods 0.000 claims description 9
- 229920000371 poly(diallyldimethylammonium chloride) polymer Polymers 0.000 claims description 9
- 238000000862 absorption spectrum Methods 0.000 claims description 8
- 239000000084 colloidal system Substances 0.000 claims description 8
- 238000000295 emission spectrum Methods 0.000 claims description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 7
- 238000004140 cleaning Methods 0.000 claims description 6
- 238000001035 drying Methods 0.000 claims description 6
- 230000002068 genetic effect Effects 0.000 claims description 6
- 238000002922 simulated annealing Methods 0.000 claims description 6
- 230000008569 process Effects 0.000 claims description 5
- 238000012545 processing Methods 0.000 claims description 5
- 238000009835 boiling Methods 0.000 claims description 4
- 238000002474 experimental method Methods 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 claims description 4
- 238000002360 preparation method Methods 0.000 claims description 4
- 230000004044 response Effects 0.000 claims description 4
- 238000002791 soaking Methods 0.000 claims description 4
- 238000003756 stirring Methods 0.000 claims description 4
- 239000011259 mixed solution Substances 0.000 claims description 3
- 239000001509 sodium citrate Substances 0.000 claims description 3
- NLJMYIDDQXHKNR-UHFFFAOYSA-K sodium citrate Chemical compound O.O.[Na+].[Na+].[Na+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O NLJMYIDDQXHKNR-UHFFFAOYSA-K 0.000 claims description 3
- 238000001816 cooling Methods 0.000 claims description 2
- 238000001914 filtration Methods 0.000 claims description 2
- 238000002156 mixing Methods 0.000 claims description 2
- 230000031700 light absorption Effects 0.000 claims 1
- 239000000203 mixture Substances 0.000 claims 1
- 238000005259 measurement Methods 0.000 abstract description 7
- 239000011521 glass Substances 0.000 description 7
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- 230000005284 excitation Effects 0.000 description 4
- 238000004020 luminiscence type Methods 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 229910052786 argon Inorganic materials 0.000 description 3
- 239000008367 deionised water Substances 0.000 description 3
- 229910021641 deionized water Inorganic materials 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000011068 loading method Methods 0.000 description 3
- 241000252506 Characiformes Species 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 230000003321 amplification Effects 0.000 description 2
- 238000000149 argon plasma sintering Methods 0.000 description 2
- 238000003199 nucleic acid amplification method Methods 0.000 description 2
- 238000002310 reflectometry Methods 0.000 description 2
- 230000009466 transformation Effects 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- 241000045365 Microporus <basidiomycete fungus> Species 0.000 description 1
- FOIXSVOLVBLSDH-UHFFFAOYSA-N Silver ion Chemical compound [Ag+] FOIXSVOLVBLSDH-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000002238 attenuated effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000007405 data analysis Methods 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 230000009881 electrostatic interaction Effects 0.000 description 1
- XTLNYNMNUCLWEZ-UHFFFAOYSA-N ethanol;propan-2-one Chemical compound CCO.CC(C)=O XTLNYNMNUCLWEZ-UHFFFAOYSA-N 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 201000003704 mandibulofacial dysostosis with alopecia Diseases 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 238000000992 sputter etching Methods 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J3/00—Spectrometry; Spectrophotometry; Monochromators; Measuring colours
- G01J3/28—Investigating the spectrum
- G01J3/2803—Investigating the spectrum using photoelectric array detector
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F9/00—Making metallic powder or suspensions thereof
- B22F9/16—Making metallic powder or suspensions thereof using chemical processes
- B22F9/18—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds
- B22F9/24—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds starting from liquid metal compounds, e.g. solutions
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J3/00—Spectrometry; Spectrophotometry; Monochromators; Measuring colours
- G01J3/12—Generating the spectrum; Monochromators
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J3/00—Spectrometry; Spectrophotometry; Monochromators; Measuring colours
- G01J3/28—Investigating the spectrum
- G01J3/2823—Imaging spectrometer
Landscapes
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Investigating Or Analysing Materials By Optical Means (AREA)
- Spectrometry And Color Measurement (AREA)
Abstract
The invention discloses an imaging spectrometer based on a scattering effect and a hyper-spectral imaging method thereof, wherein the imaging spectrometer comprises a first collimating device, a scattering device, a second collimating device, an array type detection chip and a data calculation and analysis system connected with the array type detection chip; the first collimating device enables one beam of light emitted by each part in the spectral imaging area to be detected to be incident to different parts of the surface of the scattering device at a fixed angle; the scattering device is used for enabling light incident to the scattering device to generate a scattering effect, so that scattered light emitted by incident light with different frequencies and the same intensity after passing through the same part of the scattering device has different scattered light intensity angle distributions, and the light intensity angle distributions of the scattered light emitted by the incident light with the same frequency and the same intensity after passing through the different parts of the scattering device are also different. By dividing the spectral imaging area to be measured into m subunit areas, the imaging spectral measurement can be performed in real time by using different pixel element areas on the array type detection chip respectively.
Description
Technical Field
The invention relates to an imaging spectrometer capable of obtaining rich information of spatial dimension and spectral dimension in real time and a hyper-spectral imaging method thereof, which can be used in the technical field of remote sensing and imaging.
Background
The imaging spectrometer is an imaging reconnaissance device produced by combining an imaging technology and a spectrum technology, is a product of combining a camera and the spectrometer, and is used for aerial imaging reconnaissance. The method can acquire a plurality of target image data with continuous spectrums in ultraviolet, visible light, near infrared and middle infrared regions of an electromagnetic spectrum, and provides a complete and continuous spectrum curve for a subunit region of each spectrum imaging region to be detected. Therefore, by utilizing the properties that the spectral reflectivity of the same substance is different in different spectral bands and the spectral reflectivity of different substances is different in the same spectral band, the detection and the interpretation can be selectively carried out in a certain imaging wave band of the target.
There are many different types of imaging spectrometers, and imaging spectrometers are classified into a multispectral type, a hyperspectral type, and a hyperspectral type according to differences in spectral resolutions. Multispectral versions typically have only tens of spectral bands, with spectral resolution on the order of tenths of a wavelength, and are suitable for zone classification and land use assessment. The hyperspectral spectrum can have hundreds of spectral bands, the spectral resolution is one hundredth of the order of magnitude of the wavelength, and the hyperspectral spectrometer is suitable for the fields of agriculture, forests, mineral products, coastal area analysis, military and the like. The hyperspectral spectrum can have thousands of spectral bands, the spectral resolution is one thousandth of the order of magnitude of wavelength, and the hyperspectral spectrometer is suitable for the component analysis of chemical reagents and substances. Most of foreign hyperspectral imagers adopt a grating light splitting mode to realize spectral light splitting. However, the grating has larger volume and higher cost, so that the research on a spectral imaging instrument and a related detection method which are suitable for the required miniaturization, low cost and real-time measurement has important significance.
Disclosure of Invention
The invention aims to solve the problems in the prior art and provides an imaging spectrometer based on a scattering effect and a hyperspectral imaging method thereof, wherein the imaging spectrometer can obtain abundant information of space dimension and spectral dimension in real time.
The purpose of the invention is realized by the following technical scheme: an imaging spectrometer based on scattering effect comprises a first collimating device, a scattering device, a second collimating device, an array type detection chip and a data calculation and analysis system electrically connected with the array type detection chip; the first collimating device, the scattering device, the second collimating device and the array type detection chip are sequentially arranged along the direction of the light path;
the first collimating device is positioned in front of the scattering device, and the first collimating device enables one beam of light emitted by each part in the spectral imaging region to be detected to be incident to each part on the surface of the scattering device at a fixed angle and filters other light;
the scattering device is used for enabling light incident to the scattering device to generate a scattering effect, so that scattered light emitted by incident light with different frequencies and the same intensity after passing through the same part of the scattering device has different scattered light intensity angle distributions, and the light intensity angle distributions of the scattered light emitted by the incident light with the same frequency and the same intensity after passing through the different parts of the scattering device are also different;
the array type detection chip comprises a series of light detection pixel elements with the same frequency spectrum response; the second collimating device is arranged between the scattering device and the array type detection chip, and is used for enabling light transmitted along the direction from the center of the scattering device to the center of the array type detection chip to pass through, filtering light transmitted along other directions, and enabling light emitted by different parts of the scattering device to be respectively projected onto light detection pixel elements at different positions in the array type detection chip;
and the data calculation and analysis system analyzes and processes the data detected by the light detection pixel elements to obtain the spectral imaging of the spectral imaging area to be detected.
Preferably, the first collimating device comprises a front incident optical assembly, a first convex lens, a first small hole diaphragm and a second convex lens, light emitted by the spectrum imaging area to be measured is emitted to one of the beams of light emitted from the front incident optical assembly and parallel to the main optical axis of the first convex lens and the main optical axis of the second convex lens, and the gap of the first small hole diaphragm is arranged at the common focus between the first convex lens and the second convex lens.
Preferably, the second collimating device includes a third convex lens, a second aperture diaphragm and a fourth convex lens, the second aperture diaphragm gap is disposed at a common focus between the third convex lens and the fourth convex lens, and the main optical axes of the third convex lens and the fourth convex lens coincide.
Preferably, the scattering device comprises a transparent substrate and scattering particles distributed on the surface or in the transparent substrate, and the size, shape or distribution of the scattering particles are unevenly distributed in the scattering device.
Preferably, the scattering particles in the scattering device are silver particles, and the preparation method of the scattering device is as follows:
s1: the volume is 50ml, the concentration is 1.0X 10-2mol·L-1AgNO of3Mixing with water at a ratio of 1: 9, stirring and heating the mixed solution to boiling; then 10ml of 1% strength sodium citrate solution is injected, stirred and heated continuously, so that the solution is kept in a boiling stateObtaining silver colloid after 40 minutes, and cooling to room temperature for later use;
s2: cleaning and drying the substrate, soaking the dried substrate in 1% PDDA solution for 30 minutes, and then cleaning and drying again to obtain the substrate with the surface covered with PDDA;
s3: the substrate with the surface covered with PDDA was immersed in silver colloid for 1 hour, and then taken out, washed and dried.
Preferably, the imaging spectrometer further comprises a light wavelength conversion member disposed before or after the scattering device, the light wavelength conversion member comprising a wavelength conversion layer comprising at least one wavelength conversion optical material therein; the wavelength conversion optical material has partial or all absorption spectrum beyond the detection range of the array detection chip and emission spectrum within the detection range of the array detection chip.
Preferably, the wavelength conversion optical material is any material having the property of absorbing light of one wavelength and emitting light of another different wavelength, or a combination of these materials.
The invention also discloses a hyperspectral imaging method of the imaging spectrometer based on the scattering effect, which comprises the following steps:
s1: dividing a spectrum imaging area to be detected into m subunit areas, wherein m is an integer, because the number of m is generally larger, the light intensity emitted by each subunit area is considered to be uniform, the spectrum curves are also the same, the light emitted by each subunit area sequentially passes through the first collimating device, the scattering device, the second collimating device, or the first collimating device, the scattering device, the light wavelength conversion component and the second collimating device, finally irradiates on n light detection pixel elements of the array detection chip, while the light emitted by different subunit areas is scattered by different scattering parts on the scattering device and finally detected by the pixel elements in different pixel element areas of the array detection chip, wherein the light emitted by the kth subunit area is detected by the light intensity value of n pixel elements after being scattered, is marked as I1，I2，...InM, n and k are integers;
s2: equally dividing the frequency range which can be detected by the imaging spectrometer into n frequency segments with the bandwidth delta f, wherein the center frequency of each frequency segment is f1，f2，...fn(ii) a The frequency range which can be detected by the imaging spectrometer is determined according to the following method: selecting a frequency maximum value and a frequency minimum value from absorption spectra of all wavelength conversion optical materials contained in the optical wavelength conversion component and a frequency range which can be detected by the array type detection chip, wherein the frequency range between the frequency maximum value and the frequency minimum value is the frequency range which can be detected by the imaging spectrometer;
s3: solving the following matrix equation to obtain the center frequency f of the light emitted by the kth subunit region1，f2，...fnIntensity of light component of frequency band of (f)1)，I(f2)，...I(fn)：
s4: to I (f)1)，I(f2)，...I(fn) Performing linear fitting, and performing spectrum calibration to obtain a spectrum of incident light of the kth subunit region;
s5: and respectively taking k as 1 and 2.. m, repeating the steps for multiple times, respectively solving the matrix equation to obtain the spectrum of each subunit region of the spectral imaging region to be detected, and after obtaining the spectral information of the spatial dimension, calculating and processing the obtained result to obtain the image of each frequency light emitted by the spectral imaging region to be detected.
Preferably, the matrix equation in the step S3 may be obtained by a convex optimization algorithm, a Tikhonov regularization algorithm, L1Solving by one of a norm regularization algorithm, a genetic algorithm, a cross direction multiplier method and a simulated annealing algorithm; convex optimization algorithm, Tikhonov regularization algorithm, L1And adding a smooth coefficient term on the basis of a norm regularization algorithm, a genetic algorithm, a cross direction multiplier method and a simulated annealing algorithm, so that the spectral curve obtained by fitting in the step S4 is smoother and smoother.
Compared with the prior art, the invention adopting the technical scheme has the following technical effects: the technical scheme provides a miniaturized imaging spectrometer with low cost and real-time measurement and a hyperspectral imaging method thereof.
By dividing the spectral imaging area to be measured into m subunit areas, the imaging spectral measurement can be performed in real time by using different pixel element areas on the array type detection chip respectively. By controlling the size of the detection subunit region, one of high spectral resolution or high spatial resolution can be achieved.
The device can select a proper wavelength conversion optical material or a proper array detection chip in the using process, so that the spectrum measuring range of the imaging spectrometer is wider.
The device has simple preparation process, does not need precise optical devices such as gratings and the like, and has smaller volume, lower cost and higher performance compared with the traditional hyperspectral imaging system.
Drawings
FIG. 1 is a schematic diagram of the structural principle of the imaging spectrometer using backscattering of the present invention.
FIG. 2 is a schematic diagram of the structural principle of the imaging spectrometer using forward scattering of the present invention.
Fig. 3 is a schematic view of the scattering principle of the present invention.
FIG. 4 shows the emission spectrum of the kth subunit region of the spectral imaging region to be measuredA frequency division schematic diagram within a frequency range that can be detected by the imaging spectrometer; wherein the abscissa represents frequency and the ordinate is spectral intensity; dividing the frequency range detected by the imaging spectrometer into n equal parts by using a calculus method, wherein each part has its center frequency, and the bandwidth of each part is delta f, fjIs the center frequency of any one of the small rectangles, and its amplitude is I (f)j)。
Description of the drawings: 10 is a spectral imaging area to be detected, 1 is a first subunit area of the spectral imaging area to be detected, 2 is a second subunit area of the spectral imaging area to be detected, 3 is a third subunit area of the spectral imaging area to be detected, 4 is a first convex lens, 5 is a second convex lens, 6 is a first aperture diaphragm, 7 is a third convex lens, 8 is a fourth convex lens, 9 is a second aperture diaphragm, 11 is a first scattering part in a scattering device, 12 is a second scattering part in the scattering device, 13 is a third scattering part in the scattering device, 14 is a scattering device, 15 is an optical wavelength conversion part, 16 is incident light emitted by the spectral imaging area to be detected to different parts of the surface of the scattering device, 17 is scattered light after passing through the scattering device, 18 is a first collimating device, 19 is a second collimating device, 20 is scattering particles, 21 is a first pixel area of the array type detection chip, 22 is the second pixel area of the array type detection chip, 23 is the third pixel area of the array type detection chip, 24 is the front-mounted optical component, 50 is the array type detection chip, 99 is the mth scattering position in the scattering device, 999 is the mth subunit area of the spectral imaging area to be detected, and 9999 is the mth pixel area of the array type detection chip.
Detailed Description
Objects, advantages and features of the present invention will be illustrated and explained by the following non-limiting description of preferred embodiments. The embodiments are merely exemplary for applying the technical solutions of the present invention, and any technical solution formed by replacing or converting the equivalent thereof falls within the scope of the present invention claimed.
The invention discloses an imaging spectrometer based on scattering effect and capable of obtaining abundant information of space dimension and spectrum dimension in real time and a hyper-spectral imaging method thereof, as shown in figure 1, the imaging spectrometer comprises a first collimating device 18, a scattering device 14, a second collimating device 19, an array type detection chip 50 and a data calculation and analysis system electrically connected with the array type detection chip 50, the data calculation and analysis system is not shown in figure 1, and the first collimating device 18, the scattering device 14, the second collimating device 19 and the array type detection chip 50 are sequentially arranged along the direction of a light path.
As shown in fig. 1, the first collimating device 18 is located in front of the scattering device 14, and the first collimating device 18 makes one of the beams of light emitted from different portions in the spectral imaging region 10 to be measured enter different portions corresponding to the surface of the scattering device 14 at a fixed angle, and filters out other light, where the fixed angle is in a range of-90 ° to 90 °. The scattering device 14 is configured to generate a scattering effect on light incident on the scattering device 14, and the scattering device 14 may enable scattered light transmitted by incident light with different frequencies and the same intensity to have different scattered light intensity angle distributions after passing through the same portion of the scattering device, and enable the scattered light transmitted by incident light with the same frequency and the same intensity to have different light intensity angle distributions after passing through different portions of the scattering device.
The array detection chip 50 includes a series of light detection pixel elements with the same spectral response, the array detection chip 50 is a CCD or a CMOS, the CCD is a charge coupled device, and a CMOS is complementary metal oxide semiconductor, in the present embodiment, the array detection chip 50 is preferably a CCD.
The second collimating device 19 is disposed between the scattering device 14 and the array detection chip 50, the second collimating device 19 can pass light transmitted along a connecting line from the center of the scattering device 14 to the center of the array detection chip 50, filter light transmitted along other directions, and enable scattered light 17 emitted from different parts of the scattering device 14 to be respectively projected onto the light detection pixel elements at different positions in the array detection chip, the data calculating and analyzing system analyzes and processes data detected by the light detection pixel elements, and finally, a method for solving a plurality of matrix equations is used to obtain spectral imaging of the spectral imaging area to be detected.
Specifically, in this technical solution, the first collimating device 18 includes a front incident optical assembly 24, a first convex lens 4, a first aperture diaphragm 6 and a second convex lens 5, a light-transmitting gap of the first aperture diaphragm 6 is disposed at a common focus point between the first convex lens 4 and the second convex lens 5, and a main optical axis of the first convex lens coincides with a main optical axis of the second convex lens. The front incident optical assembly 24 can adopt all existing or future optical devices or combinations thereof such as a large relative aperture continuous zooming front objective lens, a tunable reflector group, a zooming liquid lens group, a concave lens, an MEMS micro-mirror, an automatic focusing liquid crystal lens group and the like, so that one of the beams of light emitted from each part of the spectral imaging area to be measured is parallel to the main optical axes of the first convex lens 4 and the second convex lens 5 after irradiating the front incident optical assembly 24. If the concave lens is adopted as the front incident optical assembly 24, light emitted to the focal point of the concave lens from each position in the spectral imaging region 10 to be measured is refracted into parallel light after passing through the concave lens, and the parallel light is parallel to the main optical axes of the first convex lens 4 and the second convex lens 5. Preferably, the front-loading optical assembly 24 can also change the field angle of the imaging spectrometer by adjusting the focal length of a lens or a mirror in the front-loading optical assembly 24, so that the imaging spectrometer can adjust and control the spatial range of single imaging by adjusting the front-loading optical assembly.
The second collimating device 19 comprises a third convex lens 7, a second small aperture diaphragm 9 and a fourth convex lens 8, the second small aperture diaphragm 8 is arranged at the common focus between the third convex lens 7 and the fourth convex lens 9 in a clearance mode, and the main optical axes of the third convex lens and the fourth convex lens coincide.
The scattering device 14 comprises a transparent substrate and scattering particles 20 distributed on the surface or inside of the transparent substrate, the transparent substrate is made of transparent materials such as glass or silicon dioxide, the size, shape or distribution of the scattering particles 20 are all unevenly arranged in the scattering device, and the scattering particles of the opaque materials are different in size and irregular in arrangement, so that different scattering light intensity distributions can be formed when light with different frequencies is irradiated on the scattering particles, and after the light with the same frequency is scattered by the scattering particles at the same position, the scattering light intensities of the light are different, so that different scattering light powers can be detected by pixel elements at different positions in the array type detection chip.
In the present technical solution, the scattering device 14 is configured to enable light incident on the scattering device to generate a scattering effect, and the scattering device can enable scattered light emitted by incident light with different frequencies and same intensity after passing through the same portion of the scattering device to have different angular distributions of scattered light intensity, and enable each pixel element in the subsequent CCD of the array-type detection chip to detect different light intensity by different angular distributions of the scattered light emitted by incident light with the same frequency and same intensity after passing through different portions of the scattering device, so that a spectrum of one subunit region in the target region can be restored by substituting data measured by the pixel elements in a certain region (21 or 22 or 23 or.. 99) of the array-type detection chip into an amplification matrix of a matrix equation by coefficient matrix data measured in advance and solving the matrix equation, and then by dividing the spectrum of one subunit region in the target region into different regions (21, 22, 23.. 99) pixel element data are respectively substituted into different matrix equations, and then the series of matrix equations are solved, so that the spectrums of the light emitted by different units in the whole spectrum imaging area to be detected can be respectively obtained.
The scattering that occurs in the scattering device may be rayleigh scattering or mie scattering or a combination thereof. Rayleigh scattering, also called molecular scattering, is a phenomenon in which the intensity of scattered light in various directions is different at a particle scale much smaller than the wavelength of incident light (smaller than one tenth of the wavelength), and the intensity is inversely proportional to the fourth power of the wavelength of incident light, and is called rayleigh scattering. The light intensity of the light scattered by the light scattering meter is asymmetric in all directions, wherein most incident light rays are scattered along the advancing direction, and the intensity of the light scattered by the light scattering meter is inversely proportional to the power of the wavelength of the incident light. In the embodiment, a rayleigh scattering scheme is preferred, in which the relation between the scattering intensity and the scattering angle is I ═ 1+ cos θ, where θ is the scattering angle. The scattering is divided into forward scattering and backward scattering according to different scattering angles. Fig. 1 is an imaging spectrometer utilizing backscatter, while fig. 2 is an imaging spectrometer utilizing forward scatter.
The intensity of the scattered light is related to the wavelength of the light incident on the scattering device. As shown in FIG. 3, assume that a beam of light has an original intensity of I0The scattering particles in the scattering device scatter the light passing through a portion of the scattering device. Rayleigh scattering occurs assuming particle dimensions smaller than the wavelength of the incident light (less than one tenth of the wavelength). So that after passing through the portion of the scattering device, the transmitted light has an intensity of It＝I0exp (- α z), where α is the attenuation coefficient, which is inversely proportional to the fourth power of the wavelength, and z is the distance traveled by the incident light in the diffuser element.
The reason why the intensity of transmitted light is attenuated from the original intensity of incident light is that each scattering particle can emit scattered light as a secondary wave source, and the intensity of scattered light is inversely proportional to the fourth power of the wavelength. Because the scattering particles are not uniform in size or shape or distribution in the scattering device, the scattering device can enable the scattered light transmitted by the incident light with different frequencies (or wavelengths) and the same intensity to have different scattering light intensity angle distributions after the incident light passes through the same part of the scattering device; and the light intensity angle distribution of the scattered light transmitted by the incident light with the same frequency (or wavelength) and the same intensity through different parts of the scattering device is also different, so that different light intensities can be detected by each pixel element in the array type detection chip CCD behind the scattering device.
The scattering device can be prepared by adopting the existing mature chemical corrosion, ion etching or photoetching method, so that a series of unevenly distributed scattering particles with different sizes from nanometer to micro-nanometer scales exist on the surface or inside the material. The scattering particles in the scattering device are silver particles, and the preparation method of the scattering device comprises the following steps:
firstly, preparing silver colloid: the volume is 50ml, the concentration is 1.0X 10-2mol·L-1AgNO of3Adding into a flask containing 450ml water, stirring, heating to boil, adding 10ml 1% sodium citrate solution, and stirringAnd heated to boil for 40 minutes, the final colloid was yellow-green.
Because the prepared silver colloid is negatively charged, the assembly can be carried out by utilizing the electrostatic interaction between the positive electrolyte PDDA and the negatively charged silver particles. The method comprises the following specific steps: firstly, cleaning a glass substrate, ultrasonically cleaning the glass substrate in an ethanol-acetone solution, ethanol and water with the volume ratio of 1: 1 for 20 minutes, then putting the glass substrate into a boiling Piranha solution for soaking for 30 minutes, taking out the glass substrate, washing the glass substrate with deionized water for 3 times, drying the glass substrate with argon, wherein the Piranha solution is prepared by 98 percent of H2SO4And 30% H2O2The volume ratio is 3: 1. The dried substrate was then immersed in 1% PDDA solution for 30 minutes to bring the surface to positive charge, taken out and rinsed 3 times with deionized water, and blown dry with argon. And then soaking the substrate covered with the PDDA in silver colloid for 1 hour, taking out the substrate, washing the substrate with deionized water for 3 times, and drying the substrate with argon to obtain the scattering device finally, wherein the scattering device is provided with silver nano particles as scattering particles.
The imaging spectrometer further comprises a light wavelength conversion member 15 disposed before or after the scattering device, the light wavelength conversion member 15 comprising a wavelength conversion layer comprising at least one wavelength conversion optical material therein; the partial or all absorption spectrum of the wavelength conversion optical material exceeds the detection range of the array type detection chip, and the emission spectrum is all in the detection range of the array type detection chip; the wavelength converting optical material is a material having the property of absorbing light of one wavelength and emitting light of a different wavelength, or a combination of such materials.
The wavelength converting material used in the present invention may be any material having a property of absorbing light of one wavelength and emitting light of another wavelength, such as an up-converting luminescent material, a down-converting luminescent material, etc., or a combination of these materials. Stokes law states that certain materials can be excited by high-energy light to emit light of low energy, in other words, light of high excitation wavelength with short wavelength and light of low excitation wavelength with long wavelength, such as ultraviolet light, and that such materials are down-converting luminescent materials. In contrast, some materials can achieve a luminescence effect exactly opposite to the above-mentioned law, and we call it anti-stokes luminescence, also called up-conversion luminescence, such materials are called up-conversion luminescent materials.
The optical wavelength conversion component 15 adopted by the invention can realize the expansion of the spectrum measurement range before or after being arranged in the scattering device, but considering that the emission spectrum bandwidth of most of the existing wavelength conversion luminescent materials is narrow, the optical wavelength conversion component 15 is preferably arranged behind the light splitting device, namely the optical wavelength conversion component 15 is arranged between the scattering device 14 and the array type detection chip 50, and the arrangement can enable the light intensity distribution difference of the light with different frequencies on the surface of the array type detection chip to be more obvious after the light passes through the scattering device, thereby being beneficial to restoring the spectrum by a method for solving a matrix equation.
The wavelength conversion optical material in the imaging spectrometer can adopt various existing up-conversion or down-conversion materials, and the measurement range of the spectrometer can be effectively expanded as long as part or all of the absorption spectrum exceeds the detection range of the array detection chip and the emission spectrum is all in the detection range of the array detection chip. For example, a down-conversion optical Material (MOF) Eu3(MFDA)4(NO3) (DMF)3(H2MFDA ═ 9, 9-dimethylfluorene-2, 7-dicarboxyic acid) [ Xinhui Zhou et al, a microporus luminescence emission spectrum metal-organic amplification sensing, Dalton trans, 2013, 42, 5718-bellowski 5723] having an absorption spectrum range of about 250nm to 450nm and an emission spectrum range of about 590nm to 640nm, and if the array detection chip is a CCD chip of SONY-ICX285AL whose detection band is about 400nm to 1000nm, the wavelength conversion member made of the down-conversion optical material can extend the wavelength detection range of the imaging spectrometer to about 250nm to 1000nm, which is wider than the wavelength detection range of the array itself.
The light wavelength conversion component can also be made of an up-conversion optical material, for example, a model HCP-IR-1201 mid-infrared display card produced by the dragon color technology (HCP) is made of an up-conversion luminescent material, visible light can be excited by irradiation of 0.3mW infrared light, the effective light excitation wave band is mainly 700 nm-10600 nm, and the luminous intensity and the excitation power are in a direct increase relation. If the array type detection chip adopts a CCD chip with the model number of SONY-ICX285AL, the detection wave band is about 400 nm-1000 nm, so the intermediate infrared display card is adopted as the light wavelength conversion component, the wavelength detection range of the imaging spectrometer can be expanded to about 400 nm-10600 nm, and the detection wavelength range is wider than that of the detection array chip.
The optical wavelength conversion member 15 is not a necessary device in the present invention, and when the optical wavelength conversion member is not used in the imaging spectrometer, the wavelength detection range of the imaging spectrometer is the wavelength response range of the array type detection chip used. The purpose of using the optical wavelength conversion member is only to expand the wavelength detection range of the imaging spectrometer, but hyperspectral imaging can be performed without the optical wavelength conversion member.
The following summarizes the spectral imaging process of the hyperspectral imaging system described in this embodiment: each subunit area in the spectral imaging area to be measured emits light beams, and each subunit area specifically is as follows: the first subunit region 1, the second subunit region 2, and the third subunit region 3 … are the mth subunit region 999, and these light beams pass through the first optical collimator 18 and then are respectively projected to each part on the surface of the scattering device 14, where each part is specifically: the first scattering part 11 in the scattering device, the second scattering part 12 in the scattering device, and the third scattering part 13 … in the scattering device scatter the mth scattering part 99 in the device, the scattering device 14 can make the incident light generate scattering effect, the scattered light 17 emitted from the scattering device 14 passes through an optical wavelength conversion component 15, then passes through the second optical collimating device 19 and respectively reaches the first pixel element region 21, the second pixel element region 22, and the mth pixel element region 9999 of the third pixel element region 23 … of the array type detection chip 50, and then is detected by each pixel element in the pixel element regions, and finally, the data calculation and analysis system performs data analysis and processing on the data detected by each pixel element.
By dividing the spectral imaging area to be measured into m subunit areas, the imaging spectral measurement can be performed in real time by using different pixel element areas on the array type detection chip respectively. By controlling the size of the detection subunit region, one of high spectral resolution or high spatial resolution can be achieved.
The invention also discloses a hyperspectral imaging method of the imaging spectrometer, which comprises the following steps:
s1: dividing a spectrum imaging area to be detected into m subunit areas, wherein m is an integer, because the number of m is generally larger, the light intensity emitted by each subunit area is considered to be uniform, the spectrum curves are also the same, the light emitted by each subunit area sequentially passes through the first collimating device, the scattering device, the second collimating device, or the first collimating device, the scattering device, the light wavelength conversion component and the second collimating device, finally irradiates on n light detection pixel elements of the array detection chip, the light emitted by different subunit areas is scattered through different scattering parts on the scattering device and finally detected by the pixel elements in different pixel element areas of the array detection chip, and the light intensity value detected by the n pixel elements after the light emitted by the kth subunit area is scattered is marked as I1，I2，...InM, n and k are integers;
s2: and equally dividing the frequency range which can be detected by the imaging spectrometer into n frequency segments with the bandwidth delta f. Fig. 4 is a schematic diagram of frequency division of a light-emitting spectrum in a subunit region of a spectral imaging region to be measured. As shown in FIG. 4, each frequency bin has a center frequency f1，f2，...fn。
In fig. 4, the abscissa represents frequency and the ordinate is spectral intensity; dividing the luminous spectrum of the kth subunit area of the spectral imaging area to be detected into n equal parts according to frequency in the frequency range capable of being detected by the imaging spectrometer by a calculus method, wherein the center frequency of each part is taken, and the bandwidth of each part is delta f, fjIs the center frequency of any one of the small rectangles, and its amplitude is I (f)j)。
The frequency range which can be detected by the imaging spectrometer is determined according to the following method: and selecting a frequency maximum value and a frequency minimum value from the absorption spectra of all wavelength conversion optical materials contained in the optical wavelength conversion component and the frequency range which can be detected by the array type detection chip, wherein the frequency range between the frequency maximum value and the frequency minimum value is the frequency range which can be detected by the imaging spectrometer.
S3: by convex optimization algorithm, Tikhonov regularization algorithm, L1Solving the following matrix equation by one of mathematical optimization algorithms such as norm regularization algorithm, genetic algorithm, cross direction multiplier method, simulated annealing algorithm and the like or improvement method thereof to obtain the central frequency f of each light emitted by the kth subunit region1，f2，...fnIntensity of light component of frequency band of (f)1)，I(f2)，...I(fn)：
each cell H in the calibration matrix Hij( i 1, 2.. n) ( j 1, 2.. n) as a center frequency fjAfter the narrow-band calibration light passes through the scattering device, the light intensity and the center frequency of the ith pixel element in the n pixel elements at the corresponding position of the array type detection chip are fjThe ratio of the light intensity of the narrow-band calibration light before passing through the scattering device is measured in advance through experiments;
s4: to I (f)1)，I(f2)，...I(fn) And performing linear fitting and spectral calibration to obtain the spectrum of the incident light of the kth subunit region.
S5: and repeating the steps for multiple times by taking k as 1 and k as 2, and respectively solving the matrix equation to respectively obtain the spectrum of each subunit region of the spectral imaging region to be detected, and after obtaining the spatial dimension spectral information, calculating and processing the obtained result to obtain the image of each frequency light emitted by the spectral imaging region to be detected.
The matrix equation can be obtained through a convex optimization algorithm, a Tikhonov regularization algorithm and L1One of mathematical optimization algorithms such as a norm regularization algorithm, a genetic algorithm, a cross direction multiplier method, a simulated annealing algorithm and the like is solved, and the existing mathematical optimization method can be further improved to be more suitable for the application of the method, for example, optimization terms such as a smooth coefficient and the like are added in the existing algorithm, so that the spectral line obtained by fitting in the step S4 is smoother and smoother
The invention has various embodiments, and all technical solutions formed by adopting equivalent transformation or equivalent transformation are within the protection scope of the invention.
Claims (7)
1. An imaging spectrometer capable of obtaining rich information of space dimension and spectrum dimension in real time based on scattering effect is characterized in that: the system comprises a first collimating device, a scattering device, a second collimating device, an array type detection chip and a data calculation and analysis system electrically connected with the array type detection chip, wherein the first collimating device, the scattering device, the second collimating device and the array type detection chip are sequentially arranged along the direction of a light path;
the first collimation device comprises a preposed incident optical component, a first convex lens, a first small-hole diaphragm and a second convex lens, wherein one of the light emitted by each part in the spectral imaging region to be detected is incident to different parts of the surface of the scattering device at a fixed angle, and other light is filtered;
the scattering device is used for enabling light incident to the scattering device to generate scattering effect, so that light with different frequencies and the same intensity enters
Scattered light emitted from the same part of the scattering device has different angular distributions of scattered light intensity and the same frequency
The light intensity angle distribution of scattered light emitted by incident light with the same intensity through different parts of the scattering device is also different;
the imaging spectrometer further comprises a light wavelength conversion member disposed before or after the scattering device, the light wavelength conversion member comprising a wavelength conversion layer comprising at least one wavelength conversion optical material therein; the partial or all absorption spectrum of the wavelength conversion optical material exceeds the detection range of the array type detection chip, and the emission spectrum is all in the detection range of the array type detection chip;
the array type detection chip comprises a series of light detection pixel elements with the same frequency spectrum response;
the second collimating device is arranged between the scattering device and the array type detection chip, and is used for enabling light transmitted along the direction from the center of the scattering device to the center of the array type detection chip to pass through, filtering light transmitted along other directions, and enabling light emitted by different parts of the scattering device to be respectively projected onto light detection pixel elements at different positions in the array type detection chip;
the data calculation and analysis system analyzes and processes the data detected by the light detection pixel elements to obtain the spectrum to be detected
Spectral imaging of the imaging area;
the hyperspectral imaging method of the imaging spectrometer comprises the following steps:
s1: dividing a spectrum imaging area to be detected into m subunit areas, wherein m is an integer, because the number of m is generally larger, the light intensity emitted by each subunit area is considered to be uniform, the spectrum curves are also the same, the light emitted by each subunit area sequentially passes through the first collimating device, the scattering device and the second collimating device, or sequentially passes through the first collimating device, the scattering device, the light wavelength conversion component and the second collimating device, finally irradiates on n light detection pixel elements of the array detection chip, and finally irradiates on n light detection pixel elements of the array detection chipLight emitted by different subunit regions on the detection pixel element is scattered by different scattering parts on the scattering device and is finally detected by the pixel elements in different pixel element regions of the array detection chip, wherein light intensity values detected by the n pixel elements after the light emitted by the kth subunit region is scattered are recorded as light intensity valuesI 1,I 2,…I nM, n and k are integers;
s2: equally dividing the frequency range which can be detected by the imaging spectrometer into n frequency widthsΔfOf frequency segments, each frequency segment having a center frequency off 1 , f 2 ,…f n (ii) a The frequency range which can be detected by the imaging spectrometer is determined according to the following method: selecting a frequency maximum value and a frequency minimum value from absorption spectra of all wavelength conversion optical materials contained in the optical wavelength conversion component and a frequency range which can be detected by the array type detection chip, wherein the frequency range between the frequency maximum value and the frequency minimum value is the frequency range which can be detected by the imaging spectrometer;
s3: by solving the following matrix equation, the central frequency of the light emitted by the kth subunit region is obtainedf 1 , f 2 ,… f n Intensity of light component of frequency band ofI(f 1), I(f 2), … I(f n):
Calibrating each cell in the matrix HH ij(i＝1,2…n)(j1,2 … n) as a center frequency off j After the narrow-band calibration light passes through the scattering device, the first narrow-band calibration light passes through n pixel elements at the corresponding position of the array type detection chipiThe light intensity and the center frequency detected by each pixel element aref j The ratio of the light intensity of the narrow-band calibration light before passing through the scattering device is measured in advance through experiments;
s4: to pairI(f 1), I(f 2), … I(f n) Performing linear fitting, and performing spectrum calibration to obtain a spectrum of incident light of the kth subunit region;
s5: and respectively taking k as 1 and 2 … m, repeating the steps for multiple times, respectively solving the matrix equation to obtain the spectrum of each subunit region of the spectral imaging region to be measured, and after obtaining the spatial dimension spectral information, calculating and processing the obtained result to obtain the image of each frequency light emitted by the spectral imaging region to be measured.
2. An imaging spectrometer as claimed in claim 1, wherein: the second collimating device comprises a third convex lens, a second small aperture diaphragm and a fourth convex lens, wherein the second small aperture diaphragm is arranged at the common focus between the third convex lens and the fourth convex lens in a clearance mode, and the main optical axes of the third convex lens and the fourth convex lens coincide.
3. The imaging spectrometer of claim 1, wherein: the scattering device comprises a transparent substrate and scattering particles distributed on the surface or inside the transparent substrate, and the size, shape or distribution of the scattering particles in the scattering device are unevenly distributed.
4. An imaging spectrometer as claimed in claim 3, wherein: the scattering particles in the scattering device are silver particles, and the preparation method of the scattering device comprises the following steps:
s1: the volume of 50m 1 was adjusted to a concentration of 1.0X 10-2 mol•L-1AgNO of3According to the following steps of 1: 9, mixing the mixture with water, stirring the mixed solution and heating the mixed solution to boil; then injecting l 0ml sodium citrate solution with the percentage concentration of l%, continuously stirring and heating to keep the solution in a boiling state for 40 minutes to obtain silver colloid, and cooling to room temperature for later use;
s2: cleaning and drying the substrate, soaking the dried substrate in 1% PDDA solution for 30 minutes, and then cleaning and drying again to obtain the substrate with the surface covered with PDDA;
s3: the substrate with the surface covered with PDDA was immersed in silver colloid for 1 hour, and then taken out, washed and dried.
5. An imaging spectrometer as claimed in claim 1, wherein: the wavelength conversion optical material is any material having the property of absorbing light of one wavelength and emitting light of another different wavelength, or a combination of these materials.
6. A hyperspectral imaging method of imaging spectrometer according to any of claims 1-5 wherein: the method comprises the following steps:
s1: dividing a spectrum imaging area to be detected into m subunit areas, wherein m is an integer, because the number of m is generally larger, the light intensity emitted by each subunit area is considered to be uniform, the spectrum curves are also the same, the light emitted by each subunit area sequentially passes through the first collimating device, the scattering device, the second collimating device, or the first collimating device, the scattering device, the light wavelength conversion component and the second collimating device, finally irradiates on n light detection pixel elements of the array detection chip, while the light emitted by different subunit areas is scattered by different scattering parts on the scattering device and finally detected by the pixel elements in different pixel element areas of the array detection chip, wherein the light emitted by the kth subunit area is detected by the light intensity value of n pixel elements after being scattered, is marked asI 1,I 2,…I nM, n and k are integers;
s2: equally dividing the frequency range which can be detected by the imaging spectrometer into n frequency widthsΔfOf frequency segments, each frequency segment having a center frequency off 1 , f 2 ,…f n (ii) a The frequency range which can be detected by the imaging spectrometer is determined according to the following method: absorption of light from all wavelength conversion optical materials contained in the optical wavelength conversion memberSelecting a frequency maximum value and a frequency minimum value from frequency ranges which can be detected by the spectrum and array type detection chips, wherein the frequency range between the frequency maximum value and the frequency minimum value is the frequency range which can be detected by the imaging spectrometer;
s3: by solving the following matrix equation, the central frequency of the light emitted by the kth subunit region is obtainedf 1 , f 2 ,… f n Intensity of light component of frequency band ofI(f 1), I(f 2), … I(f n):
Calibrating each cell in the matrix HH ij(i＝1,2…n)(j1,2 … n) as a center frequency off j After the narrow-band calibration light passes through the scattering device, the first narrow-band calibration light passes through n pixel elements at the corresponding position of the array type detection chipiThe light intensity and the center frequency detected by each pixel element aref j The ratio of the light intensity of the narrow-band calibration light before passing through the scattering device is measured in advance through experiments;
s4: to pairI(f 1), I(f 2), … I(f n) Performing linear fitting, and performing spectrum calibration to obtain a spectrum of incident light of the kth subunit region;
s5: and respectively taking k as 1 and 2 … m, repeating the steps for multiple times, respectively solving the matrix equation to obtain the spectrum of each subunit region of the spectral imaging region to be measured, and after obtaining the spatial dimension spectral information, calculating and processing the obtained result to obtain the image of each frequency light emitted by the spectral imaging region to be measured.
7. The hyperspectral imaging method of imaging spectrometer of claim 6, characterized in that: the matrix equation in the step S3 may be represented by a convex optimizationRegularization algorithm, Tikhonov regularization algorithm, L1Solving by one of a norm regularization algorithm, a genetic algorithm, a cross direction multiplier method and a simulated annealing algorithm; convex optimization algorithm, Tikhonov regularization algorithm, L1And adding a smooth coefficient term on the basis of a norm regularization algorithm, a genetic algorithm, a cross direction multiplier method and a simulated annealing algorithm, so that the spectral curve obtained by fitting in the step S4 is smoother and smoother.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811396934.6A CN109556717B (en) | 2018-11-22 | 2018-11-22 | Imaging spectrometer based on scattering effect and hyperspectral imaging method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811396934.6A CN109556717B (en) | 2018-11-22 | 2018-11-22 | Imaging spectrometer based on scattering effect and hyperspectral imaging method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109556717A CN109556717A (en) | 2019-04-02 |
| CN109556717B true CN109556717B (en) | 2021-12-07 |
Family
ID=65866960
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811396934.6A Active CN109556717B (en) | 2018-11-22 | 2018-11-22 | Imaging spectrometer based on scattering effect and hyperspectral imaging method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109556717B (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN204007868U (en) * | 2014-03-25 | 2014-12-10 | 南京邮电大学 | A kind of spectral measurement device |
| CN104713646A (en) * | 2015-02-09 | 2015-06-17 | 南京邮电大学 | Broadband spectrometer and spectrum reconstruction method thereof |
| CN107192454A (en) * | 2017-01-19 | 2017-09-22 | 中国科学院上海技术物理研究所 | A kind of THz optical spectrum imagers based on three-dimensional phase grating and aperture segmentation technology |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10674067B2 (en) * | 2012-05-23 | 2020-06-02 | Solid State Scientific Corporation | Spectral, polar and spectral-polar imagers for use in space situational awareness |
-
2018
- 2018-11-22 CN CN201811396934.6A patent/CN109556717B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN204007868U (en) * | 2014-03-25 | 2014-12-10 | 南京邮电大学 | A kind of spectral measurement device |
| CN104713646A (en) * | 2015-02-09 | 2015-06-17 | 南京邮电大学 | Broadband spectrometer and spectrum reconstruction method thereof |
| CN107192454A (en) * | 2017-01-19 | 2017-09-22 | 中国科学院上海技术物理研究所 | A kind of THz optical spectrum imagers based on three-dimensional phase grating and aperture segmentation technology |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109556717A (en) | 2019-04-02 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| Kern et al. | Theoretical description of functionality, applications, and limitations of SO 2 cameras for the remote sensing of volcanic plumes | |
| CN109708755B (en) | Imaging spectrometer based on filtering effect and high spatial resolution spectral imaging method | |
| CN105388140B (en) | Measuring instrument for site invisible fingerprint display and contained substance thereof | |
| CN106526228B (en) | The self-calibrating method and system of laser induced fluorescence velocimetry | |
| US9170203B2 (en) | Enhancement of raman scattering | |
| DE112012004100T5 (en) | Programmable full-frame hyperspectral imaging device | |
| JP2017508160A (en) | Optical interference device | |
| JP2004286716A (en) | Target distinguishing method and device by terahertz wave spectroscopic measurement | |
| US9297999B2 (en) | Synthetic focal plane imager | |
| DE102015107148A1 (en) | Microscope for molecular spectroscopic analysis | |
| KR101872240B1 (en) | Imaging measurement method using hyperspectral imaging measurement apparatus | |
| DE102016201572A1 (en) | Miniature spectrometer and method for switching a miniature spectrometer between imaging mode and spectrometer mode | |
| DE112016005450T5 (en) | Non-contact thermal measurements of VUV optics | |
| CN109708756B (en) | Imaging spectrometer based on diffraction effect and high spatial resolution spectral imaging method | |
| CN108458787A (en) | Echelle grating type space heterodyne Raman spectrometer light channel structure | |
| CN109556716B (en) | Imaging spectrometer based on diffraction effect and hyperspectral imaging method thereof | |
| CN109556717B (en) | Imaging spectrometer based on scattering effect and hyperspectral imaging method thereof | |
| CN109708757B (en) | Imaging spectrometer based on scattering effect and high spatial resolution spectral imaging method | |
| CN103913226B (en) | Spectral measurement device and measurement method | |
| EP3543681A1 (en) | Detection system for detecting specific small organic particles on uncoated or coated glass with high throughput | |
| CN109708758B (en) | Imaging spectrometer based on interference effect and high spatial resolution spectral imaging method | |
| CN110926613A (en) | Coma-eliminating broadband high-resolution spectrometer | |
| Batshev et al. | Multispectral video camera optical system | |
| CN109141635B (en) | Imaging spectrometer and hyperspectral imaging method thereof | |
| CN108037078B (en) | Method and system for measuring optical performance of material based on matrix transformation |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |