CN109554716A - A kind of solder aqueous cleaning agent and cleaning method - Google Patents
A kind of solder aqueous cleaning agent and cleaning method Download PDFInfo
- Publication number
- CN109554716A CN109554716A CN201811554375.7A CN201811554375A CN109554716A CN 109554716 A CN109554716 A CN 109554716A CN 201811554375 A CN201811554375 A CN 201811554375A CN 109554716 A CN109554716 A CN 109554716A
- Authority
- CN
- China
- Prior art keywords
- cleaning agent
- solder
- agent
- cleaning
- surfactant
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
- C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
- C23G1/24—Cleaning or pickling metallic material with solutions or molten salts with neutral solutions
- C23G1/26—Cleaning or pickling metallic material with solutions or molten salts with neutral solutions using inhibitors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
- B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
Abstract
The present invention provides a kind of solder aqueous cleaning agent and cleaning methods, are made of the raw material of following mass percent: surfactant 6% ~ 12%；Corrosion inhibiter 0% ~ 0.1%；Defoaming agent 0% ~ 0.05%；Surplus is deionized water；Surfactant is that nonionic surfactant is compounded with cationic surfactant, and wherein nonionic surfactant accounts for the 40% ~ 70% of total weight；Cationic surfactant accounts for the 30% ~ 60% of total weight.Cleaning agent matching purge technique of the present invention can strongly remove the surface residue of colophony type scaling powder postwelding, and solder joint keeps bright, and surface insulation performance is good；Compared with conventional clean agent, cleaning agent stability of the present invention is good, low volatility, and safety and environmental protection will not generate public hazards substance.Its is at low cost, and preparation method is simple, almost without foam generation in cleaning process, is suitable for full-automatic cleaning and ultrasonic cleaning, cleaning process are easy to operate.
Description
Technical field
The invention belongs to cleaning agent for electronic industry manufacturing field, it is related to a kind of solder aqueous cleaning agent and scavenger
Process.
Background technique
With the development of electronic industry, higher and higher to the requirement of Quality of electronic products.After the completion of welding, brazing flux residual
Object or other external contaminants not only influence product appearance, but also product reliability can be made to be deteriorated, and cause short circuit, corrosion etc.
Cause electric fault.
The cleaning agent of traditional ODS substance containing freon one kind has grease rosin and other resins clear well
Wash effect.But such cleaning agent contains the substance for destroying ozone layer, the in process of production improper use of halogen and its compound
Harm can be brought to staff's body and environment, with the raising of safety and environmental consciousness, ODS is gradually disabled.
Currently used halogen-free cleaning agent is mainly by alcohols, ketone, alkanes, and the low lightning such as lipid is low-boiling
Solvent composition, residue is less after cleaning but its higher cost for such cleaning agent, and toxic, inflammable and explosive, volatility is big, this
Outside, the alcohol of low-carbon class blushing can occur because of the surface that water imbibition is strong and occurs cleaning.
The domestic cleaning agent used is various in style at present, can be divided into semi-aqueous cleaning agent and aqueous-base cleaning according to the content of water
Agent, wherein aqueous cleaning agent can also can be divided into alkaline cleaner, neutral cleaners, alkaline cleaner according to acid-base property.Although base
Cleaning requirement can be met on this, but on the one hand, most of cleaning agents are strong to the type dependence of solder and scaling powder, clean model
It is with limit, stability is poor, volatile and to human health.On the other hand, most of cleaning agent preparation methods are cumbersome, have
Need to introduce other ancillary equipments, and the complicated component of cleaning agent, butt welding point can generate corrosion, can generate in the process of cleaning big
Bubble is measured, full-automatic cleaning and ultrasonic cleaning are not used to.
In the prior art, a kind of colophony type solder(ing) paste aqueous-base cleaning is disclosed in Chinese patent CN102051286B patent
Agent, 1,2-PD ether, the 1wt% of the ethylene glycol monobutyl ether of diethylene glycol monomethyl ether, 15wt% containing 5wt%, 20wt%
Monoethanolamine, the nona oxy benzene sulfonic acid sodium salt of perfluoro of 0.1wt%, the cyclohexylamine of 0.01wt%, surplus water.The solvent of the cleaning agent
Containing alcohol ether type organic, diethylene glycol monomethyl ether therein, ethylene glycol monobutyl ether, propylene-glycol ethyl ether easy firing cause fire,
And in cleaning agent preparation process, especially ethylene glycol monobutyl ether can inhibit nervous centralis, and high concentration may cause dizziness,
Phenomena such as nauseous, it is even dead that high concentration is likely to result in the loss of consciousness.Other two kinds of ether materials also have toxicity, harm
Human health.
Summary of the invention
The present invention is directed to the above-mentioned deficiency of the prior art, and the purpose of the present invention is to provide a kind of solder aqueous-base cleanings
Agent and cleaning process；The aqueous cleaning agent preparation method is simple, low volatility in cleaning process, it is highly-safe, quilt will not be corroded
Cleaning part etc..
To achieve the above object, the invention provides the following technical scheme: solder aqueous cleaning agent it is characterized by: by
The raw material of following mass percent is made:
Surfactant: 6% ~ 12%；
Corrosion inhibiter: 0% ~ 0. 1%;
Defoaming agent: 0% ~ 0.05%；
Surplus is deionized water；The sum of each Ingredients Weight is 100%.
Further feature is: the surfactant is that nonionic surfactant is compounded with cationic surfactant
It forms, wherein nonionic surfactant accounts for the 40% ~ 70% of total weight；Cationic surfactant accounts for the 30% ~ 60% of total weight.
The nonionic surfactant be fatty alcohol polyoxyethylene ether, polysorbas20, coconut oil fat acyl diethanol amine,
9 ether of alkylphenol-polyethenoxy, any one of triethanolamine or any two mixed with the mass ratio for being each greater than 0%, or wantonly three
Kind be each greater than 0% mass ratio mixing, wantonly four kinds be each greater than 0% mass ratio mixing or five kinds be each greater than
0% mass ratio mixing；
The cationic surfactant is by hexadecyltrimethylammonium chloride, tetradecyl trimethyl ammonium chloride, dodecyl
Any one of trimethyl ammonium chloride or any two be each greater than 0% mass ratio mixing or three kinds to be each greater than 0%
Mass ratio mixing.
The corrosion inhibiter is isopropylamine.
The defoaming agent is polyether modified silicon oil.
The aqueous cleaning agent is alkaline species cleaning agent, and Ph value range is 8.5-10.5.
A kind of preparation method of solder aqueous cleaning agent, which comprises the following steps:
According to ingredient and content ratio contained by any aqueous cleaning agent of claim 1-6, it is former that each ingredient is measured respectively
Material is added deionized water in the reaction kettle with blender and starts to stir, then be separately added into surface-active at normal temperatures and pressures
Agent, corrosion inhibiter and defoaming agent continue stirring until and stop stirring and standing after being thoroughly mixed.
A kind of solder aqueous cleaning agent cleaning method, which comprises the steps of:
1) part to be cleaned impregnates 35 ~ 50min in 80 DEG C ± 2 DEG C of water；
2) configured cleaning agent and part to be cleaned are placed in supersonic wave cleaning machine, adjustment is initially 60 DEG C -65 DEG C, ultrasound
25 ~ 40min is cleaned, selected ultrasonic drilling machine power is adjusted between 100 ~ 800W according to the size and number of cleaning part；
3) after completing step 2, part to be cleaned is placed in 5 ~ 8min of rinsing in 55 DEG C -65 DEG C of deionized water；
4) taking out after dry 2 h of 0.5h-of drying box that the cleaning part that rinsing is completed is placed in 75 DEG C -85 DEG C, cleaning is completed.
Compared with the existing technology, solder aqueous cleaning agent of the invention and cleaning process, have the following beneficial effects:
1, the aqueous cleaning agent preparation method that the present invention obtains is simple, at low cost；
2, the aqueous cleaning agent that obtains of the present invention in the process of cleaning low bubble, low volatility, it is highly-safe, will not corrode it is cleaned
Part；
3, aqueous cleaning agent of the invention washes rear surface noresidue, and solder joint is bright, and surface insulation performance is good；
4, aqueous cleaning agent of the invention is suitable for automation cleaning and ultrasonic cleaning, cleaning effect are significant.
Aqueous cleaning agent in the present invention is for a large amount of residues generated in current surface-assembled technique welding process
And external contaminant, corrosivity is big, influences appearance.Cleaning agent matching purge technique of the present invention can strongly remove colophony type and help weldering
The surface residue of agent postwelding, solder joint keep bright, and surface insulation performance is good；Compared with conventional clean agent, cleaning agent of the present invention
Stability is good, low volatility, and safety and environmental protection will not generate public hazards substance.Its is at low cost, and preparation method is simple, cleaning process
In almost without foam generation, be suitable for full-automatic cleaning and ultrasonic cleaning, cleaning process be easy to operate.
Specific embodiment
Below with reference to specific embodiment, the present invention is described in detail.
A kind of solder aqueous cleaning agent, which is characterized in that be made of the raw material of following mass percent:
Surfactant 6% ~ 12%；
Corrosion inhibiter, 0% ~ 0. 1%；
Defoaming agent, 0% ~ 0.05%；
Surplus is deionized water；
The sum of each Ingredients Weight is 100%.
The surfactant be nonionic surfactant compounded with cationic surface active agent, wherein it is non-from
Sub- surfactant accounts for the 40% ~ 70% of total weight；Cationic surfactant accounts for the 30% ~ 60% of total weight.
The nonionic surfactant is fatty alcohol polyoxyethylene ether, polysorbas20, coconut oil fat acyl diethanol amine, alkane
9 ether of base phenol polyethenoxy, any one of triethanolamine or any two mixed with the mass ratio for being each greater than 0%, or wantonly three kinds
Mass ratio to be each greater than 0% mixes or four kinds are mixed with the mass ratio for being each greater than 0%；Its main function is to clean
Metal surface can be protected in journey, prevent metalwork surface oxidation；
The cationic surface active agent belongs to quaternary ammonium salt；Hexadecyltrimethylammonium chloride, tetradecyltrimethylammonium chlorination
Any one of ammonium, dodecyl trimethyl ammonium chloride or any two be each greater than 0% mass ratio mixing or three kinds with each
It is mixed from the mass ratio greater than 0%, with excellent infiltration, emulsification；
The corrosion inhibiter is isopropylamine；
The defoaming agent is polyether modified silicon oil.
The aqueous cleaning agent is alkaline species cleaning agent, and Ph value range is 8.5-10.5.
Surfactant of the invention, selectable specific mass percent are as follows: 6%, 6.5%, 7%, 7.5%, 8%,
8.5%, 9%, 9.5%, 10%, 10.5%, 11%, 11.5%, 12% etc., needs of the invention can be met；Corrosion inhibiter of the invention,
Selectable specific mass percent are as follows: 0%, 0.001%, 0.002%, 0.005%, 0.01%, 0.02%, 0.03%, 0.04%,
0.05%, 0.06%, 0.07%, 0.08%, 0.09%, 0. 1% etc., needs of the invention can be met;Defoaming agent of the invention,
Selectable specific mass percent are as follows: 0%, 0.001%, 0.002%, 0.005%, 0.008%, 0.01%, 0.015%,
0.018%, 0.02%, 0.025%, 0.03%, 0.035%, 0.04%, 0.045%, 0.05% etc., needs of the invention can be met.Certain
When containing measurement zero of component, then it represents that do not use this component in this single proportion.
Nonionic surfactant and cationic surface active agent of the invention, selectable non-ionic surface active
Agent: the specific weight proportion of cationic surfactant are as follows: 40%:60%, 45%:55%, 50%:50%, 55%:45%, 60%:
40%, 65%:35%, 70%:30% etc. can meet needs of the invention.
A kind of preparation method of solder aqueous cleaning agent, according to contained by any aqueous cleaning agent in front at
Divide and content ratio measures each component materials respectively, at normal temperatures and pressures, deionization is added in the reaction kettle with blender
Water starts to stir, then is separately added into surfactant, corrosion inhibiter and defoaming agent, continues stirring until and stops stirring simultaneously after being thoroughly mixed
It stands.
A kind of solder aqueous cleaning agent cleaning method, which comprises the steps of:
1) part to be cleaned impregnates 35 ~ 50min in 80 DEG C ± 2 DEG C of water；
2) configured cleaning agent and part to be cleaned are placed in supersonic wave cleaning machine, adjustment is initially 60 DEG C -65 DEG C, ultrasound
25 ~ 40min is cleaned, selected ultrasonic drilling machine power is adjusted between 100 ~ 800W according to the size and number of cleaning part；
3) after completing step 2, part to be cleaned is placed in 5 ~ 8min of rinsing in 55 DEG C -65 DEG C of deionized water.
4) it being taken out after dry 2 h of 0.5h-of drying box that the cleaning part that rinsing is completed is placed in 75 DEG C -85 DEG C, has cleaned
At.
Embodiment 1
Solder aqueous cleaning agent is as follows at being grouped as: its weight accounting 6% of surfactant, wherein aliphatic alcohol polyethenoxy
Ether: hexadecyltrimethylammonium chloride=2:3, corrosion inhibiter 0.01% are isopropylamine, and defoaming agent 0.01% is polyether modified silicon oil,
Surplus is deionized water.
Embodiment 2
Solder aqueous cleaning agent is as follows at being grouped as: its weight accounting 7% of surfactant, wherein coconut oil fat acyl two
Ethanol amine: fatty alcohol polyoxyethylene ether: tetradecyl trimethyl ammonium chloride=1:1:3, corrosion inhibiter 0.02% are isopropylamine, defoaming
Agent 0.02% is polyether modified silicon oil, and surplus is deionized water.
Embodiment 3
Solder aqueous cleaning agent is as follows at being grouped as: its weight accounting 9% of surfactant, wherein alkylphenol-polyethenoxy 9
Ether: triethanolamine: hexadecyltrimethylammonium chloride=2:3:5, corrosion inhibiter 0.05% are isopropylamine, and defoaming agent 0.04% is poly-
Ether modified silicon oil, surplus are deionized water.
Embodiment 4
Solder aqueous cleaning agent is as follows at being grouped as: its weight accounting 8% of surfactant, wherein triethanolamine: 16
Alkyl trimethyl ammonium chloride=2:3, corrosion inhibiter 0.02% are isopropylamine, and defoaming agent 0.025% is polyether modified silicon oil, and surplus is
Deionized water.
Embodiment 5
Solder aqueous cleaning agent is as follows at being grouped as: its weight accounting 6.5% of surfactant, wherein fatty alcohol polyoxy second
Alkene ether: polysorbas20: tetradecyl trimethyl ammonium chloride=1:1.5:3, corrosion inhibiter 0.03%, are isopropylamine, and defoaming agent 0.035% is
Polyether modified silicon oil, surplus are deionized water.
Embodiment 6
Solder aqueous cleaning agent is as follows at being grouped as: its weight accounting 9.5% of surfactant, wherein alkyl phenol polyoxy second
9 ether of alkene: triethanolamine: dodecyl trimethyl ammonium chloride=3:1:2, corrosion inhibiter 0.06%, are isopropylamine, and defoaming agent 0.04% is
Polyether modified silicon oil, surplus are deionized water.
Embodiment 7
Solder aqueous cleaning agent is as follows at being grouped as: its weight accounting 10.5% of surfactant, wherein polysorbas20: 14
Alkyl trimethyl ammonium chloride=2:3, corrosion inhibiter 0.08% are isopropylamine, and defoaming agent 0.04% is polyether modified silicon oil, and surplus is to go
Ionized water.
Embodiment 8
Solder aqueous cleaning agent is as follows at being grouped as: its weight accounting 10% of surfactant, wherein aliphatic alcohol polyethenoxy
Ether: polysorbas20: triethanolamine: dodecyl trimethyl ammonium chloride=1:2:2:5, corrosion inhibiter 0.09% are isopropylamine, defoaming agent
0.04%, it is polyether modified silicon oil, surplus is deionized water.
The cleaning agent being configured to using above embodiments, the basic noresidue in surface after cleaning, solder joint is bright, beautiful, table
Face good insulation preformance, and manufacturing cost is low；The postwelding surface residue that solder can strongly be removed, washing rear waste liquid can be recycled, no
Harm can be generated to human health and the Nature, be a kind of aqueous cleaning agent of safety and environmental protection.
Finally, it should be noted that technical side the above examples are only used to illustrate the technical scheme of the present invention and are not limiting
Case, although applicant describes the invention in detail referring to preferred embodiment, those skilled in the art should be managed
Solution, modification or equivalent replacement of the technical solution of the present invention are made for those, without departing from the objective and range of the technical program,
It is intended to be within the scope of the claims of the invention.
Claims (8)
1. a kind of solder aqueous cleaning agent, it is characterised in that: be made of the raw material of following mass percent:
Surfactant: 6% ~ 12%；
Corrosion inhibiter: 0% ~ 0. 1%;
Defoaming agent: 0% ~ 0.05%；
Surplus is deionized water；The sum of each Ingredients Weight is 100%.
2. solder aqueous cleaning agent according to claim 1, it is characterised in that: the surfactant is nonionic
Surfactant is compounded with cationic surfactant, and wherein nonionic surfactant accounts for the 40% ~ 70% of total weight；Sun
Ionic surface active agent accounts for the 30% ~ 60% of total weight.
3. solder aqueous cleaning agent according to claim 2, it is characterised in that: the nonionic surfactant is
Fatty alcohol polyoxyethylene ether, polysorbas20, coconut oil fat acyl diethanol amine, 9 ether of alkylphenol-polyethenoxy, in triethanolamine
It is any or any two be each greater than 0% mass ratio mix, or wantonly three kinds be each greater than 0% mass ratio mixing, or times
Four kinds to be each greater than, 0% mass ratio is mixed or five kinds are mixed with the mass ratio for being each greater than 0%；
The cationic surfactant is by hexadecyltrimethylammonium chloride, tetradecyl trimethyl ammonium chloride, dodecyl
Any one of trimethyl ammonium chloride or any two be each greater than 0% mass ratio mixing or three kinds to be each greater than 0%
Mass ratio mixing.
4. solder aqueous cleaning agent according to claim 1, it is characterised in that: the corrosion inhibiter is isopropylamine.
5. solder aqueous cleaning agent according to claim 1, it is characterised in that: the defoaming agent is polyether-modified silicon
Oil.
6. solder aqueous cleaning agent ccording to any one of claims 1 to 5, it is characterised in that: the aqueous cleaning agent
For alkaline species cleaning agent, Ph value range is 8.5-10.5.
7. a kind of preparation method of solder aqueous cleaning agent, which comprises the following steps:
According to ingredient and content ratio contained by any aqueous cleaning agent of claim 1-6, it is former that each ingredient is measured respectively
Material is added deionized water in the reaction kettle with blender and starts to stir, then be separately added into surface-active at normal temperatures and pressures
Agent, corrosion inhibiter and defoaming agent continue stirring until and stop stirring and standing after being thoroughly mixed.
8. a kind of solder aqueous cleaning agent cleaning method, which comprises the steps of:
1) part to be cleaned impregnates 35 ~ 50min in 80 DEG C ± 2 DEG C of water；
2) configured cleaning agent and part to be cleaned are placed in supersonic wave cleaning machine, adjustment is initially 60 DEG C -65 DEG C, ultrasound
25 ~ 40min is cleaned, selected ultrasonic drilling machine power is adjusted between 100 ~ 800W according to the size and number of cleaning part；
3) after completing step 2, part to be cleaned is placed in 5 ~ 8min of rinsing in 55 DEG C -65 DEG C of deionized water；
4) taking out after dry 2 h of 0.5h-of drying box that the cleaning part that rinsing is completed is placed in 75 DEG C -85 DEG C, cleaning is completed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811554375.7A CN109554716A (en) | 2018-12-18 | 2018-12-18 | A kind of solder aqueous cleaning agent and cleaning method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811554375.7A CN109554716A (en) | 2018-12-18 | 2018-12-18 | A kind of solder aqueous cleaning agent and cleaning method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109554716A true CN109554716A (en) | 2019-04-02 |
Family
ID=65870450
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811554375.7A Pending CN109554716A (en) | 2018-12-18 | 2018-12-18 | A kind of solder aqueous cleaning agent and cleaning method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109554716A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111040893A (en) * | 2020-01-17 | 2020-04-21 | 重庆理工大学 | Water-based cleaning agent for complex environment and cleaning method |
| CN111180312A (en) * | 2019-12-31 | 2020-05-19 | 贵州振华风光半导体有限公司 | Reflow soldering cleaning method suitable for integrated circuit |
| CN111254452A (en) * | 2019-12-20 | 2020-06-09 | 深圳市朝日电子材料有限公司 | Special cleaning agent for printing steel mesh and preparation method thereof |
| CN114150327A (en) * | 2021-12-15 | 2022-03-08 | 安徽燕恩环保科技有限公司 | Copper cleaning agent and preparation method thereof |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101921672A (en) * | 2009-06-10 | 2010-12-22 | 陆平 | Wool detergent |
| CN102796625A (en) * | 2012-07-13 | 2012-11-28 | 湖北海力化工科技有限公司 | Water-based cleaning agent used before coating of optical glass |
| CN102816660A (en) * | 2012-09-11 | 2012-12-12 | 广东普赛特电子科技股份有限公司 | Nano water-based cleaning agent and preparing method thereof |
| CN106635478A (en) * | 2016-11-30 | 2017-05-10 | 重庆微世特电子材料有限公司 | Electronic industry water-based cleaner and preparation method thereof |
| CN107312662A (en) * | 2017-07-03 | 2017-11-03 | 中山翰华锡业有限公司 | A kind of scolding tin residue environment-friendlywater-based water-based cleaning agent and its preparation and application method |
-
2018
- 2018-12-18 CN CN201811554375.7A patent/CN109554716A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101921672A (en) * | 2009-06-10 | 2010-12-22 | 陆平 | Wool detergent |
| CN102796625A (en) * | 2012-07-13 | 2012-11-28 | 湖北海力化工科技有限公司 | Water-based cleaning agent used before coating of optical glass |
| CN102816660A (en) * | 2012-09-11 | 2012-12-12 | 广东普赛特电子科技股份有限公司 | Nano water-based cleaning agent and preparing method thereof |
| CN106635478A (en) * | 2016-11-30 | 2017-05-10 | 重庆微世特电子材料有限公司 | Electronic industry water-based cleaner and preparation method thereof |
| CN107312662A (en) * | 2017-07-03 | 2017-11-03 | 中山翰华锡业有限公司 | A kind of scolding tin residue environment-friendlywater-based water-based cleaning agent and its preparation and application method |
Non-Patent Citations (1)
| Title |
|---|
| 方亮: "《药剂学》", 31 March 2016, 北京：中国医药科技出版社 * |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111254452A (en) * | 2019-12-20 | 2020-06-09 | 深圳市朝日电子材料有限公司 | Special cleaning agent for printing steel mesh and preparation method thereof |
| CN111180312A (en) * | 2019-12-31 | 2020-05-19 | 贵州振华风光半导体有限公司 | Reflow soldering cleaning method suitable for integrated circuit |
| CN111180312B (en) * | 2019-12-31 | 2023-08-11 | 贵州振华风光半导体股份有限公司 | Reflow soldering cleaning method suitable for integrated circuit |
| CN111040893A (en) * | 2020-01-17 | 2020-04-21 | 重庆理工大学 | Water-based cleaning agent for complex environment and cleaning method |
| CN111040893B (en) * | 2020-01-17 | 2021-09-21 | 重庆理工大学 | Water-based cleaning agent for complex environment and cleaning method |
| CN114150327A (en) * | 2021-12-15 | 2022-03-08 | 安徽燕恩环保科技有限公司 | Copper cleaning agent and preparation method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN109554716A (en) | A kind of solder aqueous cleaning agent and cleaning method | |
| CN105331471B (en) | Environmentally protective neutrality aqueous cleaning agent and preparation method and application | |
| CN102230182B (en) | Water-based cleaning agent | |
| CN109370809A (en) | The low bubble high-efficiency water-base cleaning agent of one kind and cleaning method | |
| CN109370808A (en) | A kind of soft type aqueous cleaning agent and cleaning method | |
| CN109370796A (en) | A kind of high-density packages aqueous cleaning agent and cleaning method | |
| CN106753928A (en) | A kind of aqueous cleaning agent | |
| CN109837145A (en) | A kind of aqueous fluxes in electronic industry cleaning agent and preparation method thereof | |
| CN109929692A (en) | A kind of low-viscosity water-based environment-friendly cleaning agent of neutrality and its preparation and application method | |
| CN105713740A (en) | Cleaning agent for cleaning animal oil and fat in food industry | |
| JP2013129815A (en) | Washing agent composition and washing method using the same | |
| CN109370812A (en) | The low volatilization high-performance water based cleaning agent of one kind and cleaning method | |
| CN109456850A (en) | A kind of alkalescent composite multifunction aqueous cleaning agent and cleaning method | |
| CN109401859A (en) | A kind of colophony type scaling powder aqueous cleaning agent and cleaning method | |
| CN104194971B (en) | A kind of welding fixture microemulsion cleaning agent | |
| CN109370811A (en) | A kind of Electronic Assemblies aqueous cleaning agent and cleaning method | |
| JPH07109493A (en) | Detergent composition | |
| JP2019052277A (en) | Detergent composition stock solution and detergent composition containing the detergent composition stock solution | |
| CN113201409A (en) | Cleaning composition of motor PCB soldering flux, preparation method, use method and application thereof | |
| KR100447429B1 (en) | Detergent composition having excellent anti-corrosive property and powerful cleaning effect | |
| JP5832189B2 (en) | Rinsing accelerator for hard surface cleaner | |
| JPH01149981A (en) | Water soluble degreasing composition | |
| JP6732424B2 (en) | Liquid detergent composition for clothing | |
| JP2005008702A (en) | Detergent composition for bathroom | |
| JP4063344B2 (en) | Metal mask cleaning composition |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20190402 |