CN109537031B

CN109537031B - Electroplating apparatus

Info

Publication number: CN109537031B
Application number: CN201810787980.2A
Authority: CN
Inventors: 彭坤增; 苏柏谚; 李春颖; 陈冠宪; 顾伟弘; 杜昱陞
Original assignee: Ming Chi University of Technology
Current assignee: Ming Chi University of Technology
Priority date: 2017-09-22
Filing date: 2018-07-18
Publication date: 2020-10-30
Anticipated expiration: 2038-07-18
Also published as: TW201915223A; TWI658174B; US20190093252A1; CN109537031A

Abstract

The invention discloses electroplating equipment, which is suitable for a workpiece to be electroplated and comprises an electroplating bath, a target material, an adsorption piece and a power supply. The electroplating bath is stored with electroplating solution, the workpiece to be electroplated and the target material are placed in the electroplating bath, at least one part of the workpiece to be electroplated and the target material is contacted with the electroplating solution, the adsorption piece is placed in the electroplating bath, and at least one part of the adsorption piece is contacted with the electroplating solution. The anode of the power supply is electrically connected with the target material, and the cathode of the power supply is electrically connected with the workpiece to be electroplated and the adsorption piece. When the power supply applies an operating current, the target releases metal ions to be dissolved in the electroplating solution, the metal ions are reduced into metal atoms, an electroplated layer is formed on the surface of the workpiece to be electroplated, and the adsorption piece adsorbs carbon ions in the electroplating solution.

Description

Electroplating apparatus

Technical Field

The invention relates to the technical field of electroplating, in particular to electroplating equipment for adsorbing carbon element in electroplating liquid by using an adsorption piece.

Background

In addition to the functional requirements, the appearance of the consumer electronic devices is also one of the considerations for purchasing consumer electronic devices. Most of the current consumer electronic products are made of aluminum alloy or aluminum-magnesium alloy, and the housing of the electronic device such as mobile phone, computer, digital camera, etc. is usually surface-treated to obtain a decorative effect. Wherein, the appearance of the product obtained by the electroplating process has good metal texture and better wear resistance.

Electroplating is one of the common surface treatment methods in the modern world, in which a product to be electroplated is placed in an electroplating tank containing an electroless plating solution, and the electrolysis principle is utilized to electrify the product to form an electroplated layer on the surface of the product, thereby achieving the effect of preventing metal oxidation (such as corrosion) and producing visual and aesthetic effects on the metal product.

However, various additives such as a gloss agent, a stabilizer, a softening agent, a wetting agent, a low-level dislocation agent, etc. are added to the plating solution in order to stabilize the quality of the plated product in the plating process. However, these additives contain carbon elements, which are deposited on the plated workpiece in an ionic form due to electrochemical reaction during the plating process, resulting in a poor surface brightness of the plated workpiece, and thus the appearance of the plated product is impaired.

Furthermore, if the electroplating solution is an organic solution, the carbon content in the electroplating solution will be higher, and a greater amount of carbon ions will be dissociated and deposited on the surface of the electroplated workpiece during the electroplating process, resulting in the appearance of the electroplated product appearing black rather than the desired metallic surface gloss, which will not meet the appearance quality requirements of the current market for the electroplated product.

In view of the above, the present invention provides an electroplating apparatus to solve the above-mentioned disadvantages and limitations of the prior art.

Disclosure of Invention

In view of the above-mentioned defects or limitations of the prior art that carbon is deposited and attached to the surface of the electroplated workpiece during electroplating, resulting in poor appearance of the electroplated workpiece, the inventors of the present invention have made great thought and finally developed the present invention.

In order to achieve the above and other objects, the present invention provides an electroplating apparatus, which is suitable for an electroplating process with an anode to perform an electroplating process on a workpiece to be electroplated. The electroplating equipment comprises an electroplating bath, a target material, an absorbing part and a power supply. The electroplating bath is stored with electroplating solution, the workpiece to be electroplated and the target material of the conductor material are placed in the electroplating bath, at least one part of the workpiece to be electroplated and the target material are contacted with the electroplating solution, the adsorption piece is placed in the electroplating bath, and at least one part of the adsorption piece is contacted with the electroplating solution. The anode of the power supply is electrically connected with the target material, and the cathode of the power supply is electrically connected with the workpiece to be electroplated and the adsorption piece. When the power supply applies an operating current, the target releases metal ions to be dissolved in the electroplating solution, the metal ions are reduced into metal atoms, an electroplated layer is formed on the surface of the workpiece to be electroplated, and the adsorption piece adsorbs carbon ions in the electroplating solution.

Furthermore, in the electroplating apparatus of the present invention, the material of the adsorption member may be a metal material, a ceramic material, or a cloth.

Furthermore, in the electroplating apparatus of the present invention, the target material is copper alloy or nickel alloy, and the adsorbing member is foamed nickel.

Furthermore, in the electroplating apparatus of the present invention, the target material is gold or platinum, and the adsorbing member is made of non-woven fabric.

Further, the plating apparatus of the invention, wherein the operating current has a current density in the range of 0.001 to 0.005 ampere per square centimeter (A/cm)²) In the meantime.

Further, the electroplating apparatus of the present invention, wherein the electroplating solution comprises choline chloride, nitrogen-containing compounds, metal chloride, biological bacteria and inorganic acid agents.

Further, the electroplating apparatus of the present invention, wherein the electroplating solution further comprises saccharin.

Further, the electroplating apparatus of the present invention, wherein the nitrogen-containing compound is selected from ammonia, urea or uric acid.

Further, the plating apparatus of the present invention, wherein the metal chloride is selected from the group consisting of nickel chloride, copper chloride, cobalt chloride, zinc chloride, gold chloride and silver chloride.

Further, the plating apparatus of the present invention, wherein the inorganic acid agent is selected from nitric acid (HNO)₃) Boric acid (H)₃BO₃) Hydrobromic acid (HBr) or perchloric acid (HClO)₄)。

Further, the plating apparatus of the present invention further comprises glycerol (C)₃H₈O₃) Is added into inorganic acid agent, and the glycerol and the inorganic acid agent form composite lipid.

Further, the electroplating apparatus of the present invention, wherein the volume ratio of the inorganic acid agent to the glycerol ranges from 4:1 to 3: 1.

Further, the electroplating apparatus of the present invention, wherein the biological bacteria is yeast, field-growing bacteria, photosynthetic bacteria, lactobacillus, bacillus, or a composition thereof, or fermented dairy products.

Further, the electroplating apparatus of the present invention, wherein the electroplating solution further comprises chitin ((C)₈H₁₃O₅N)_n) Is added to the inorganic acid agent.

Furthermore, the electroplating equipment of the invention also comprises a magnet which is placed in the electroplating bath and can rotate and stir the electroplating solution.

Compared with the prior art, the electroplating finished product produced by the electroplating equipment has the advantages that an electroplated layer is deposited on the surface of the finished product to prevent the surface from being rusted, so that the material protection effect is achieved, and meanwhile, carbon elements in the electroplating solution are adsorbed on the adsorbing piece through the electrostatic action after the adsorbing piece is electrified, so that excessive unnecessary carbon elements are not deposited on the surface of a workpiece to be electroplated, the good metal texture and luster of the surface of the workpiece are kept, and the electroplating finished product meets the appearance quality requirement of the market for the electroplated finished product.

Drawings

The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the invention and not to limit the invention. In the drawings:

FIG. 1 is a schematic view of an electroplating apparatus according to an embodiment of the present invention.

Fig. 2A to 2F are diagrams of experimental products of the electroplated workpiece and the adsorbing member before and after the electroplating process of various materials according to an embodiment of the present invention.

Fig. 3A to 3E are surface elemental analysis charts of a plated workpiece after performing a plating process of various materials according to an embodiment of the present invention.

Description of the main component symbols:

Detailed Description

For a fuller understanding of the objects, features and advantages of the present invention, reference should be made to the following detailed description taken in conjunction with the accompanying drawings.

Referring to fig. 1, a plating apparatus 100 according to an embodiment of the invention is adapted for use in an anodic plating process to plate a workpiece 110 to be plated. The electroplating apparatus 100 of the present embodiment includes an electroplating tank 120, a target 130, a suction device 140 and a power supply 150, wherein the electroplating solution 121 is stored in the electroplating tank 120 of the electroplating apparatus 100, and the workpiece 110 to be electroplated and the target 130 are both placed in the electroplating tank 120, so that at least a portion of the workpiece 110 to be electroplated and the target 130 are immersed in the electroplating solution 121. The material of the adsorbing member 140 may be a metal material, a ceramic material or a cloth, and the adsorbing member 140 is also placed in the plating tank 120, and at least a portion of the adsorbing member 140 is immersed in the plating solution 121.

The target 130 is electrically connected to the positive electrode of the power supply 150, the material of the target 130 must be a conductive material, and the workpiece to be plated 110 and the adsorbing member 140 are electrically connected to the negative electrode of the power supply 150. When the power supply 150 is turned on, it provides a dc power to the workpiece 110 to be plated, the target 130 and the adsorbing member 140 for performing the plating process. In the electroplating process, the positive electrode has a half-reaction formula of M → Mⁿ⁺+ne^－The semi-reaction formula of the negative electrode is Mⁿ⁺+ne^－→ M. Specifically, the target 130 emits electrons ne^－To become metal ion Mⁿ⁺Dissolved in the plating solution 121, and the metal ions M to be plated in the plating solution 121ⁿ⁺Receives electron ne^－And the metal atoms M are reduced and deposited on the surface of the workpiece to be plated 110 of the negative electrode to form a plating layer. Meanwhile, the adsorbing member 140 generates electrostatic adsorption due to the current supplied by the power supply 150, and adsorbs carbon ions contained in the plating solution 121 (e.g., carbon elements contained in additives added to the plating solution 121) thereon, so that the carbon ions are not dissociated and deposited on the surface of the workpiece 110 to be plated.

The following description specifically describes the examples of the materials used for the workpiece 110 to be plated and the adsorbing member 140: in the present invention, if the material of the target 130 is copper alloy or nickel alloy, the material of the adsorption element 140 may be foamed nickel; if the material of the target 130 is gold or platinum, the material of the adsorbing member 140 may be a non-woven fabric.

The materials of the workpiece to be plated 110 and the adsorbing member 140 are selected and matched, so that a potential difference is generated between the adjacent workpieces to be plated 110 and the adsorbing member 140, and the metal ions are attracted and only dissociated to the workpiece to be plated 110 and deposited on the surface of the workpiece to be plated, and the metal ions are not adsorbed by the adsorbing member 140. When approaching the workpiece 110 to be plated, the inverse carbon ions are attracted by the adsorbing member 140 and attached thereto due to the electrostatic adsorption, and will not deposit on the surface of the workpiece 110 to be plated along with the metal ions. Those skilled in the art can correspondingly select the materials of the workpiece 110 to be electroplated and the adsorbing member 140 according to the actual operation requirements, as long as a certain potential difference exists between the workpiece 110 to be electroplated and the adsorbing member 140, and the material used in the present invention is not limited thereto.

In addition, the current density used in the electroplating process is very small, and the range of the current density is 0.001-0.005A/cm²) Under such operating current conditions, the deposition rate of the electroplated film was 4 micrometers per hour (μm/hour). However, those skilled in the art of the electroplating process with the anode can adjust the working current density according to the actual operation requirement to achieve the most suitable deposition rate, and is not limited to the current density value disclosed in the present invention.

Before the electroplating process is performed, the workpiece 110 to be electroplated may be polished with sand paper or washed with diluted hydrochloric acid to remove the rust on the surface of the workpiece 110 to be electroplated; then, cleaning the workpiece to be electroplated 110 with the surface rusts removed by sodium hydroxide to remove surface oil stains; finally, the workpiece 110 to be electroplated is cleaned by distilled water, and the pre-treatment work of electroplating is finished. After the electroplating process is completed, the workpiece 110 to be electroplated is taken out of the electroplating tank 120, washed with distilled water to remove the electroplating solution 121, and washed with acetone to remove the distilled water, so as to obtain the metal workpiece deposited with the electroplated layer.

In addition, the electroplating process can be performed in a normal temperature environment, the electroplating solution 121 does not need to be heated, and the magnet 160 can be placed in the electroplating tank 120, so that the magnet 160 can continuously rotate to uniformly stir the electroplating solution 121. The rotation frequency of the magnet 160 is related to the internal stress of the electroplated layer deposited on the surface of the workpiece 110 to be electroplated, so that the electroplated layer is brighter as the magnet 160 rotates faster, and the rotation speed is preferably in the range of 300rpm (reduction PerMinute) to 1,000 rpm.

Referring to fig. 1, the electroplating solution 121 used in the electroplating apparatus 100 of the present invention may be an existing inorganic electroplating solution, wherein the electroplating solution may be added with additives such as a gloss agent, a stabilizer, a softening agent, a wetting agent, a low-region displacement agent, etc. according to the electroplating requirements; or using an organic non-polluting plating solution as described below: the components of the non-polluted electroplating solution provided by the embodiment of the invention comprise choline chloride, nitrogen-containing compounds, metal chloride, biological bacteria and inorganic acid agents.

The nitrogen-containing compound of this embodiment is selected from ammonia, urea or uric acid. For example, in the present embodiment, the ratio of choline chloride used is 560 g/L (g/L) and converted to a mohr concentration of 4M, and the ratio of urea used is 480 g/L (g/L) and converted to a mohr concentration of 8M, and the ratio of the mohr concentrations of choline chloride and urea is 1: 2. in addition, the choline chloride of this embodiment may be used in a ratio ranging from 460 g/l to 660 g/l, the urea may be used in a ratio ranging from 380 g/l to 580 g/l, and the preferred ionic liquid is a mixture of 560 g/l choline chloride and 480 g/l urea.

The molar concentration of the metal chloride ranges between 0.005M and 0.5M. Specifically, the metal chloride of this embodiment may be selected from nickel chloride (NiCl)₂) Copper chloride (CuCl)₂) Cobalt chloride (CoCl)₂) Zinc chloride (ZnCl)₂) Gold chloride (AuCl)₃) Or silver chloride (AgCl), as the purpose of the metal chloride is to provide a source of metal ions for the plating layer deposited on the workpiece 110 to be plated, so long as it is selectedThe metal ion material of the metal chloride used may be the same as the material of the target 130 used in the electroplating apparatus 100, and is not limited to the kind of the metal chloride disclosed in the present invention. By way of illustration of nickel chloride, nickel chloride hexahydrate (NiCl) added with ionic liquid₂·6H₂O) was 120 g/liter (g/L) and the molar concentration was 0.5M, and the ionic liquid containing nickel chloride was uniformly stirred with a magnet at room temperature. The adding proportion of nickel chloride in this embodiment can be in the range of 90 g/L to 150 g/L, and the preferred adding proportion of nickel chloride is in the range of 120 g/L.

If the material selected for the metal chloride is zinc chloride, the proportion of the zinc chloride added into the ionic liquid is 27 g/L (g/L), and the Mohr concentration is 0.2M in a conversion manner; if the metal chloride is selected from copper chloride, copper chloride dihydrate (CuCl)₂·2H₂O) was added to the ionic liquid at a ratio of 1 g/liter (g/L) in terms of a Moire concentration of 0.006M; if gold chloride is selected as the material of the metal chloride, the proportion of the gold chloride added into the ionic liquid is 500 mg/300 ml, and the calculated Moore concentration is 0.005M.

The weight percentage of the biological bacteria is between 7 wt% and 11 wt%, and the Moire concentration of the inorganic acid agent added to the ionic liquid is between 0.7M and 2M. The purpose of the inorganic acid added to the plating solution 121 is to stabilize the pH (or pH, hydrogen ion concentration index) of the plating solution 121, but the plating solution 121 of the present invention is weakly acidic after adding the biological bacteria and the inorganic acid, and the pH is controlled to about 4.

The biological bacteria of this embodiment are yeast, field bacteria, photosynthetic bacteria, lactobacillus, bacillus and combinations thereof. Alternatively, the biological bacteria may be a fermented dairy product, such as yoghurt. The inorganic acid agent of the present embodiment is selected from nitric acid (HNO)₃) Boric acid (H)₃BO₃) Hydrobromic acid (HBr) or perchloric acid (HClO)₄) And weakly acidic acid agents, but not limited thereto. As an example, the ratio of the biological bacteria used in this example was 20 ml/200 ml, which is about 9 wt% converted to weight percent, and the ratio of the boric acid used was 20 g/200 ml, which is about 1 converted to Mohr concentration.62M. Furthermore, the ratio of the biological bacteria of the present embodiment may be in a range of 15 ml/200 ml to 25 ml/200 ml, the ratio of the boric acid may be in a range of 15 g/200 ml to 25 g/200 ml, and the preferable ratio is 20 ml/200 ml of the biological bacteria and 20 g/200 ml of the boric acid, and the ionic liquid containing the biological bacteria and the inorganic acid agent is uniformly stirred and added by using a magnet at room temperature.

If the inorganic acid agent is selected from nitric acid, the adding proportion range is 15 g/200 ml to 25 g/200 ml, and the converted Moire concentration range is 1.2M to 1.98M; if the inorganic acid agent is hydrobromic acid, the adding proportion range is 15 g/200 ml to 25 g/200 ml, and the converted Moore concentration range is 0.9M to 1.54M; if the inorganic acid agent is selected from perchloric acid, the addition ratio is in the range of 15 g/200 ml to 25 g/200 ml, and the converted Mohr concentration is in the range of 0.7M to 1.24M.

In this embodiment, when the plating solution 121 cannot act on the workpiece 110 to be plated, an inorganic acid agent may be further added to dilute the amount of the metal ions, so that the plating solution 121 can act on the workpiece 110 to be plated continuously and effectively. Therefore, the plating liquid 121 of this embodiment clearly solves the problem that the plating liquid of the prior art can be discarded and cannot be used.

Saccharin may also be added to the electroplating solution 121, wherein the molar concentration of saccharin is in the range of 0.05M to 0.2M. The saccharin is added to the plating solution 121 in this embodiment to add particles to the plating solution 121, so as to increase the internal stress of the plating solution 121 in this embodiment, and during the plating process, the internal stress can be released to the workpiece to be plated 110 soaked in the plating solution 121, so as to generate a polishing effect on the plating layer deposited on the surface of the workpiece to be plated 110.

For example, saccharin is added in a ratio of 2 g/200 ml in terms of a molar concentration of 0.05M, and the ionic liquid containing saccharin is added with stirring uniformly with a magnet at room temperature. The range of saccharin addition ratio in this embodiment may be 2 g/200 ml to 7 g/200 ml (converted to a mohr concentration of 0.2M), and a preferable range of saccharin addition ratio is 2 g/200 ml.

The plating liquid 121 may contain an inorganic acid agent and biological bacteria, and may further contain glycerol (C)₃H₈O₃) (also known as glycerol) is added to the plating solution 121 to form a complex lipid of glycerol and inorganic acid agent. Wherein, the volume ratio of the inorganic acid agent to the glycerol is in the range of 4:1 to 3:1, but not limited thereto. It is noted that glycerol may not participate in the electroplating process, and the purpose of glycerol may be to dilute the amount of metal ions.

The plating solution 121 of the present invention may further contain chitin ((C)₈H₁₃O₅N)_n) To inorganic acid agents to further modify the surface characteristics of the workpiece 110 to be electroplated. In general, the present invention delays the deterioration rate of the plating solution 121 of the present invention because the entire temperature of the plating solution does not rise much after a certain period of time of the plating process due to the anhydrous reaction.

Fig. 2A to 2F are diagrams of experimental finished products of the electroplated workpiece and the adsorption member before and after performing electroplating processes of various materials according to an embodiment of the present invention, and fig. 2A to 2F sequentially illustrate nickel electroplating, gold electroplating, copper electroplating, tin electroplating, platinum electroplating, and cobalt electroplating. From these several actual experimental photographs, it is clear that the surface of the plated workpiece, which is not using the adsorbing member (e.g., foamed nickel or non-woven fabric), appears dark black or reddish brown and does not appear bright metallic color, as observed with naked eyes; the surface of the electroplating workpiece using the adsorption piece (such as foamed nickel or non-woven fabric) of the invention presents bright metallic luster, which meets the quality requirement of the electroplating workpiece in the market at present. And the difference of appearance can be clearly seen between the adsorption piece before the electroplating process and the adsorption piece after the electroplating process, the adsorption piece after the electroplating process has two-stage color difference, and the part of the adsorption piece soaked in the electroplating solution has carbon black. Therefore, the adsorption piece really achieves the effect of adsorbing the carbon ions in the electroplating solution, and avoids excessive carbon ions from being deposited on the surface of the electroplating workpiece.

Fig. 3A to 3E are surface elemental analysis charts of a plated workpiece after performing a plating process of various materials according to an embodiment of the present invention, and fig. 3A to 3E sequentially illustrate silver plating, nickel plating, gold plating, copper plating, and platinum plating. Fig. 2A to 2F are macro-structures of the electroplated workpiece and the adsorbing member observed by naked eyes, and fig. 3A to 3E are micro-structures to confirm that the adsorbing member of the present invention has a carbon adsorbing effect.

As can be clearly seen from the data in the weight percent (norm.c [ wt.%) or atomic percent (atom.c [ at.%) fields carried by the surface elemental analysis data in fig. 3A to 3E, the plating metal (silver, nickel, gold, copper, platinum, etc.) on the surface of the plated workpiece after the plating process is completed is much higher than the percentage of carbon, and it is obvious that the carbon ions in the plating solution are adsorbed by the adsorbing member during the plating process, so that the carbon content on the surface of the plated workpiece is controlled to the minimum.

In summary, the electroplating finished product produced by the electroplating apparatus of the present invention not only achieves the material protection effect by depositing an electroplating layer on the surface of the finished product, but also adsorbs the carbon element in the electroplating solution on the adsorbing member through the electrostatic action of the adsorbing member after the electrification, so that excessive carbon element is not deposited on the surface of the workpiece to be electroplated, and the surface of the workpiece after electroplating has good metal texture and luster, thereby meeting the appearance quality requirements of the market for the electroplating finished product.

In addition, the components of the electroplating solution provided by the embodiment of the invention are all environment-friendly and nontoxic components, and the inorganic acid agent is also selected from a weak-acid agent, so that the electroplating solution does not pollute the working environment and the ecological environment and accords with the current green environment-friendly concept. The plating solution of the above embodiment uses biological bacteria to determine the characteristics of the plating solution, and the electrical characteristics of the plating solution can be reset by adding biological bacteria or using different species and adjusting the number of species, so as to achieve the purpose of repeated use. That is, the plating liquid having lost activity is not replaced again, and the function of the plating liquid can be restored by merely increasing the concentration of the biological bacteria.

The foregoing description shows and describes several preferred embodiments of the invention, but as aforementioned, it is to be understood that the invention is not limited to the forms disclosed herein, but is not to be construed as excluding other embodiments and is capable of use in various other combinations, modifications, and environments and is capable of changes within the scope of the inventive concept as expressed herein, commensurate with the above teachings, or the skill or knowledge of the relevant art. And that modifications and variations may be effected by those skilled in the art without departing from the spirit and scope of the invention as defined by the appended claims.

Claims

1. An electroplating apparatus adapted for a workpiece to be electroplated, said electroplating apparatus comprising:

the electroplating bath is used for storing electroplating solution, the workpiece to be electroplated is placed in the electroplating bath, and at least one part of the workpiece to be electroplated is contacted with the electroplating solution;

the target material is a conductor material, the target material is placed in the electroplating bath, and at least one part of the target material is in contact with the electroplating solution;

a suction member disposed in the plating tank and at least a part of which is in contact with the plating solution; the adsorption piece is made of a material which can generate a potential difference with the workpiece to be electroplated; and

the power supply is provided with a positive electrode and a negative electrode, the positive electrode is electrically connected with the target material, and the negative electrode is electrically connected with the workpiece to be electroplated and the adsorption part;

when the power supply applies an operating current, the target releases metal ions to be dissolved in the electroplating solution, the metal ions are reduced into metal atoms, an electroplated layer is formed on the surface of the workpiece to be electroplated, and the adsorption piece adsorbs carbon ions in the electroplating solution;

when the target material is copper alloy or nickel alloy, the adsorption piece is foamed nickel; when the target material is gold or platinum, the adsorption piece is made of non-woven fabric.

2. The plating apparatus of claim 1, wherein the operating current has a current density in the range of 0.001 to 0.005 amperes per square centimeter (a/cm)²) In the meantime.

3. The plating apparatus as recited in claim 1, wherein said plating solution comprises choline chloride, a nitrogen-containing compound, a metal chloride, a biological bacterium, and an inorganic acid agent.

4. The plating apparatus as recited in claim 3, wherein said plating solution further comprises saccharin.

5. The plating apparatus as recited in claim 3, wherein said nitrogen-containing compound is selected from ammonia, urea, or uric acid.

6. The plating apparatus as recited in claim 3, wherein said metal chloride is selected from the group consisting of nickel chloride, copper chloride, cobalt chloride, zinc chloride, gold chloride, and silver chloride.

7. The plating apparatus of claim 3, wherein said inorganic acid agent is selected from nitric acid (HNO)₃) Boric acid (H)₃BO₃) Hydrobromic acid (HBr) or perchloric acid (HClO)₄)。

8. The plating apparatus as recited in claim 3, further comprising glycerol (C)₃H₈O₃) Is added to the inorganic acid agent, and the glycerol and the inorganic acid agent form a composite lipid.

9. The plating apparatus as recited in claim 8, wherein a volume ratio of the inorganic acid agent to the glycerol is in a range from 4:1 to 3: 1.

10. The plating apparatus as recited in claim 3, wherein the biological bacteria is yeast, farmer's bacteria, photosynthetic bacteria, lactobacillus, or a combination thereof, or fermented dairy products.

11. Such asThe plating apparatus as recited in claim 3, wherein said plating solution further comprises chitin ((C)₈H₁₃O₅N)_n) Is added to the inorganic acid agent.

12. The plating apparatus as recited in claim 1, further comprising a magnet disposed in said plating tank, said magnet being capable of rotating and stirring said plating solution.