TWM388514U - Electroplating device and electroplating machine - Google Patents

Electroplating device and electroplating machine

Info

Publication number
TWM388514U
TWM388514U TW099207463U TW99207463U TWM388514U TW M388514 U TWM388514 U TW M388514U TW 099207463 U TW099207463 U TW 099207463U TW 99207463 U TW99207463 U TW 99207463U TW M388514 U TWM388514 U TW M388514U
Authority
TW
Taiwan
Prior art keywords
electroplating
machine
electroplating device
electroplating machine
Prior art date
Application number
TW099207463U
Other languages
Chinese (zh)
Inventor
de-qing Wu
Original Assignee
Hung-Gi Machiner Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hung-Gi Machiner Co Ltd filed Critical Hung-Gi Machiner Co Ltd
Priority to TW099207463U priority Critical patent/TWM388514U/en
Publication of TWM388514U publication Critical patent/TWM388514U/en

Links

TW099207463U 2010-04-23 2010-04-23 Electroplating device and electroplating machine TWM388514U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW099207463U TWM388514U (en) 2010-04-23 2010-04-23 Electroplating device and electroplating machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW099207463U TWM388514U (en) 2010-04-23 2010-04-23 Electroplating device and electroplating machine

Publications (1)

Publication Number Publication Date
TWM388514U true TWM388514U (en) 2010-09-11

Family

ID=60591318

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099207463U TWM388514U (en) 2010-04-23 2010-04-23 Electroplating device and electroplating machine

Country Status (1)

Country Link
TW (1) TWM388514U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI658174B (en) * 2017-09-22 2019-05-01 明志科技大學 Electroplating equipment

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI658174B (en) * 2017-09-22 2019-05-01 明志科技大學 Electroplating equipment

Similar Documents

Publication Publication Date Title
HK1219410A1 (en) Device
PL2546975T3 (en) Sunlight-tracking device
GB201004106D0 (en) Device
EP2446807A4 (en) Endoscope-holding device
HK1161910A1 (en) Crushing-drying machine and crushing-drying device having the machine
EP2618133A4 (en) Optical-electric-field enhancement device
HK1173855A1 (en) Multi-beamforming device
GB201005963D0 (en) Device
GB201020209D0 (en) Device
EP2623647A4 (en) Cylinder plating method and device
PT2361855T (en) Shelf-serving device
PL2558672T3 (en) Ground-drilling device
GB201015831D0 (en) Device
EP2615328A4 (en) Reduction device
EP2592746A4 (en) Rectifier device
GB201005918D0 (en) Electrolytic process and device
EP2557623A4 (en) Electricity-generation device
TWM388514U (en) Electroplating device and electroplating machine
GB2485381B (en) Device
GB2477090B (en) Securing device
EP2557622A4 (en) Electricity-generation device
GB201020887D0 (en) Device
GB201004880D0 (en) Serving device
TWM388515U (en) Electroplating machine
GB201012558D0 (en) Basting device

Legal Events

Date Code Title Description
MM4K Annulment or lapse of a utility model due to non-payment of fees