CN109531406B - Grinding tool and grinding method for self-sharpening grinding and polishing of fixed abrasive - Google Patents
Grinding tool and grinding method for self-sharpening grinding and polishing of fixed abrasive Download PDFInfo
- Publication number
- CN109531406B CN109531406B CN201811497065.6A CN201811497065A CN109531406B CN 109531406 B CN109531406 B CN 109531406B CN 201811497065 A CN201811497065 A CN 201811497065A CN 109531406 B CN109531406 B CN 109531406B
- Authority
- CN
- China
- Prior art keywords
- grinding
- abrasive
- pad
- workpiece
- tool
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000005498 polishing Methods 0.000 title claims abstract description 71
- 238000000034 method Methods 0.000 title claims abstract description 39
- 239000007788 liquid Substances 0.000 claims abstract description 68
- 239000002245 particle Substances 0.000 claims abstract description 67
- 238000012545 processing Methods 0.000 claims abstract description 31
- 239000002105 nanoparticle Substances 0.000 claims abstract description 27
- 239000012530 fluid Substances 0.000 claims description 34
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 15
- 239000011229 interlayer Substances 0.000 claims description 11
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 10
- 239000008367 deionised water Substances 0.000 claims description 10
- 229910021641 deionized water Inorganic materials 0.000 claims description 10
- 229910000420 cerium oxide Inorganic materials 0.000 claims description 9
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 claims description 9
- 239000011159 matrix material Substances 0.000 claims description 8
- 239000007779 soft material Substances 0.000 claims description 7
- 238000005299 abrasion Methods 0.000 claims description 5
- 230000009471 action Effects 0.000 claims description 5
- 230000008878 coupling Effects 0.000 claims description 5
- 238000010168 coupling process Methods 0.000 claims description 5
- 238000005859 coupling reaction Methods 0.000 claims description 5
- 235000012239 silicon dioxide Nutrition 0.000 claims description 5
- 239000000377 silicon dioxide Substances 0.000 claims description 5
- 239000007767 bonding agent Substances 0.000 claims description 4
- 230000007246 mechanism Effects 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 238000005507 spraying Methods 0.000 claims description 2
- 230000001050 lubricating effect Effects 0.000 abstract description 3
- 238000007517 polishing process Methods 0.000 abstract description 3
- 239000000463 material Substances 0.000 description 18
- 238000002474 experimental method Methods 0.000 description 16
- 230000008569 process Effects 0.000 description 13
- 239000006061 abrasive grain Substances 0.000 description 9
- 239000010410 layer Substances 0.000 description 6
- 239000002002 slurry Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 5
- 238000007789 sealing Methods 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 3
- 229910003460 diamond Inorganic materials 0.000 description 3
- 239000010432 diamond Substances 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 238000003672 processing method Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 238000005054 agglomeration Methods 0.000 description 2
- 230000002776 aggregation Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 239000003153 chemical reaction reagent Substances 0.000 description 2
- 238000005461 lubrication Methods 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 238000010008 shearing Methods 0.000 description 2
- 239000002344 surface layer Substances 0.000 description 2
- 238000012876 topography Methods 0.000 description 2
- 238000009966 trimming Methods 0.000 description 2
- 239000003082 abrasive agent Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000008139 complexing agent Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000001066 destructive effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 239000012634 fragment Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000007800 oxidant agent Substances 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 230000008092 positive effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
- B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1454—Abrasive powders, suspensions and pastes for polishing
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The invention discloses a grinding tool for self-sharpening grinding and polishing of a fixed abrasive, which comprises a connecting rod and a grinding chassis which are connected with each other, wherein the connecting rod is connected with a device for driving the connecting rod to rotate; the centers of the connecting rod, the grinding chassis and the grinding pad are respectively provided with a pipeline for circulating grinding liquid; the grinding liquid is rotationally sprayed to the surface of the workpiece from a pipeline opening on the end face of the grinding pad through the pipeline. The invention also discloses a grinding method of the self-sharpening grinding and polishing of the fixed abrasive. According to the invention, the lubricating effect is improved by adding the nano particles into the grinding liquid, the falling speed of abrasive particles on the surface of the grinding pad is reduced, the removal efficiency is stabilized, the controllability of the grinding and polishing process is improved, and a novel efficient and stable method is provided for actual grinding and polishing processing.
Description
Technical Field
The invention belongs to the field of optical processing, relates to a grinding tool and a grinding method, and in particular relates to a grinding tool and a grinding method for self-sharpening grinding and polishing of a fixed abrasive.
Background
At present, the traditional grinding is a contact processing method using free abrasive materials, a soft grinding chassis is used as a polishing tool, and the rotation of the tool drives abrasive particles to scratch the surface of a workpiece to remove materials. In order to obtain higher surface quality and lower subsurface damage, soft abrasive particles such as cerium oxide, silicon dioxide and the like are generally adopted to process the surface of a material, and the abrasive particles are free in grinding liquid due to lower hardness of the abrasive, so that larger shearing force cannot be provided, and the material removal efficiency is lower. Meanwhile, the free abrasive polishing technique is a contact type processing mode, and stability of removal efficiency is affected by various factors such as abrasion of a polishing pad, insufficient supply of polishing liquid, and the like. The traditional liquid supply mode adopts the nozzle to spray the grinding liquid around the workpiece, but when the rotating speed of the grinding tool is continuously increased, the grinding liquid is difficult to enter the central area of the grinding pad or the workpiece due to the action of centrifugal force, so that the liquid supply in the central area is insufficient, the lubrication condition is deteriorated, the grinding pad is high in wear speed, abrasive particles are gathered into clusters, the processing heat and removed fragments cannot be discharged in time, and the surface quality is deteriorated. In summary, the removal efficiency and the processing quality of the free abrasive grinding processing method are limited, and the requirements of the rapid development of the semiconductor and optical industries on the rapid processing of hard and brittle materials cannot be met.
In recent years, chemical mechanical polishing technology has been developed, which is to improve the material removal efficiency of polishing by changing the composition of polishing liquid based on the free abrasive polishing method. By adding chemical reagents such as an oxidant and a complexing agent into the grinding fluid, the oxidability of the grinding fluid is improved, the complex reaction between abrasive particles in the grinding fluid and the surface of a workpiece is promoted, the chemical erosion of the abrasive particles to the workpiece is increased, a chemical reaction metamorphic layer is formed, the metamorphic layer is of a loose and porous structure, and the mechanical property is far smaller than that of a workpiece matrix material, so that the abrasive particles are easier to remove materials, and the grinding removal efficiency is improved. However, chemical mechanical polishing mainly relies on the action of chemical reagents, increases the pressure on the environment, has poor process stability, high cost and serious environmental pollution, runs counter to the clean and efficient processing concept, and can form a chemical reaction metamorphic layer on the surface of a workpiece after processing, thereby influencing the service performance of the workpiece.
The fixed abrasive grinding technology is characterized in that abrasive particles are fixed in a matrix material of a grinding pad, deionized water is adopted as grinding liquid, on one hand, the fixed abrasive grinding technology is a clean processing method, on the other hand, because the abrasive particles are inlaid on the matrix of the grinding pad, the shearing force provided by the abrasive particles is large, the removal efficiency is high, the phenomenon of agglomeration of the abrasive particles can not occur, and the obtained subsurface damage is small. However, the fixed abrasive technology is still a contact processing mode, the removal stability is greatly influenced by the number and distribution of abrasive particles on the surface of the grinding pad, the self-sharpening property of the grinding pad is very important, if the matrix material cannot be removed after the surface abrasive particles fall off, the next abrasive particles cannot be exposed in time, the surface material of the workpiece cannot be removed continuously, and the fixed grinding pad cannot be used continuously. Therefore, the polishing pad needs to be continuously trimmed for continuous use, so that the processing period of the workpiece and the labor intensity of operators are increased.
In summary, aiming at the problems that the polishing pad has poor self-sharpening property and low service life in the fixed abrasive polishing technology, needs to be continuously trimmed in the processing process, and cannot enter the processing center area due to the adoption of a medium-four-periphery liquid supply mode in the high-speed processing process, a new technological measure is urgently needed to overcome the existing defects.
Disclosure of Invention
The invention provides a grinding tool and a grinding method for self-sharpening grinding of a fixed abrasive, which are used for improving the self-sharpening property and prolonging the service life of the grinding tool, in order to solve the technical problems in the prior art.
The invention adopts the technical proposal for solving the technical problems in the prior art that: the grinding tool comprises a connecting rod and a grinding chassis which are connected with each other, wherein the connecting rod is connected with a device for driving the connecting rod to rotate, a grinding pad is arranged on the grinding chassis, the grinding pad is made of a fixed abrasive, and the grinding pad rotates along with the grinding chassis to grind the surface of a workpiece; the centers of the connecting rod, the grinding chassis and the grinding pad are respectively provided with a pipeline for circulating grinding liquid; the grinding liquid is rotationally sprayed to the surface of the workpiece from a pipeline opening on the end face of the grinding pad through the pipeline.
Further, the connecting rod and the grinding chassis are connected through a flexible coupling.
Further, a soft material interlayer is arranged between the grinding chassis and the grinding pad.
Further, the soft material interlayer is a sponge interlayer.
The invention also provides a grinding method of self-sharpening grinding and polishing of the fixed abrasive, which comprises the steps of mounting a grinding pad on a grinding tool, wherein the grinding pad is made of the fixed abrasive, and rotates along with the grinding tool to grind the surface of a workpiece; the grinding fluid is rotationally sprayed out from a pipeline opening on the end face of the grinding pad to the surface of the workpiece through the pipeline.
Further, nano particles are added into the grinding fluid, and the concentration of the nano particles in the grinding fluid is 0.01-15%.
Further, the nano particles of the grinding fluid are one or a combination of a plurality of cerium oxide nano particles, aluminum oxide nano particles and silicon dioxide nano particles.
Further, the pressure of the grinding fluid in the pipeline is 0.1-1.0 MPa.
Further, the grinding tool is matched with an electric spindle provided with a central water outlet mechanism.
Further, the grinding tool is connected with the electric spindle by an ER chuck.
The invention has the advantages and positive effects that:
1. the center of the grinding tool is provided with a pipeline for circulating grinding fluid; the grinding fluid is rotationally sprayed to the surface of the workpiece from the pipeline opening on the end face of the grinding pad through the pipeline, and in the central fluid supply mode, the grinding fluid is supplied from the center of the grinding tool to the periphery, compared with the traditional grinding fluid supply mode, the abrasive particle supply in the whole processing area is more sufficient and uniform, the lubricating effect of the grinding and polishing tool is improved, the peeling speed of the surface abrasive particles of the grinding pad is reduced, and meanwhile, the self-sharpening performance of the grinding pad of the fixed abrasive is improved, so that the abrasive particles can be updated in time. Therefore, the material removal efficiency is higher and the removal is more stable.
2. According to the self-sharpening grinding and polishing method of the central liquid-supply fixed abrasive, nano particles are added into the grinding liquid, the nano particles are helpful for removing the base material of the grinding pad in the grinding process, so that the next layer of abrasive particles are exposed in time, the self-sharpening property of the grinding pad of the fixed abrasive is improved, the stability of the removal rate is maintained, the trimming times of the grinding pad in the processing process are reduced, the processing period of a workpiece is shortened, and the like.
3. Meanwhile, the lubricating property between the grinding tool and the processing surface can be improved due to the existence of the nano particles, the agglomeration phenomenon of the fixed abrasive can be effectively avoided due to the small-size effect and the surface specific effect of the nano particles, and the distribution of the dispersed grinding particles on the processing surface, so that the material removal rate of the processed surface is more uniform, and the destructive scratches are less.
Therefore, nano particles are added into the fixed abrasive grinding fluid, the self-sharpening property of the grinding pad and the lubricity of the grinding and polishing tool and the surface of the workpiece are improved, and the dressing times of the grinding pad can be reduced. The grinding tool improves the supply mode of the grinding liquid through the liquid supply of the central pipeline, overcomes the problem of insufficient liquid supply of the central area, reduces the falling speed of abrasive particles on the surface of the grinding pad through improving the lubrication effect, stabilizes the removal efficiency, improves the controllability of the grinding and polishing process, and provides a novel efficient and stable method for actual grinding and polishing processing.
Drawings
FIG. 1 is a schematic view of the abrasive tool of the present invention.
Fig. 2 is a schematic diagram of the working principle of a grinding tool of the prior art.
Figure 3 is a profile of a single point spot removal after grinding experiments for the first set of experiments.
Figure 4 is a profile of a second set of experiments with a single point of spot removal after the grinding experiment.
Figure 5 is a profile of a third set of experiments with a single point of spot removal after the grinding experiment.
Fig. 6 is a graph comparing the maximum removal depths of the first, second, and third sets of experimental results.
FIG. 7 is a photograph of the morphology of the polishing pad of the fixed abrasive prior to the experiment;
FIG. 8 is a photograph of the surface topography of the polishing pad after a first set of experiments;
fig. 9 is a photograph of the surface topography of the polishing pad after a third set of experiments.
In the figure: 1. a connecting rod; 2. a liquid supply inlet; 3. an electric spindle; 4. a flexible coupling; 5. a hose; 6. grinding the chassis; 7. an interlayer of soft material; 8. a polishing pad; 9. a workpiece; 10. grinding fluid; 11. a work table; 12. and (3) a nozzle.
Detailed Description
For a further understanding of the invention, its features and advantages, reference is now made to the following examples, which are illustrated in the accompanying drawings in which:
Referring to fig. 1, a grinding tool for self-sharpening a fixed abrasive comprises a connecting rod 1 and a grinding chassis 6 which are connected with each other, wherein the connecting rod 1 is connected with a device for driving the connecting rod to rotate, a grinding pad 8 is arranged on the grinding chassis 6, the grinding pad 8 is made of the fixed abrasive, and the grinding pad 8 rotates along with the grinding chassis 6 to grind the surface of a workpiece 9; the centers of the connecting rod 1, the grinding chassis 6 and the grinding pad 8 are respectively provided with a pipeline for circulating grinding fluid 10; the polishing liquid 10 is rotatably discharged from a pipe orifice on the end face of the polishing pad 8 to the surface of the workpiece 9 via the pipe. As shown in fig. 1, the polishing liquid 10 is finally discharged through the liquid supply port 2 along the pipe and rotated toward the surface of the workpiece 9 from the pipe opening on the end surface of the polishing pad 8.
Further, the connecting rod 1 and the grinding pan 6 may be connected by a flexible coupling 4. The connecting rod 1 the grinding chassis 6 and the grinding pad 8 can be provided with a through hole in the center, a pipeline for circulating the grinding fluid 10 is arranged in the hole, the connecting rod 1 and the grinding chassis 6 are hollow structures, the hose 5 can be embedded in the pipeline connected with the connecting rod 1 and the grinding chassis 6, and the grinding fluid 10 can circulate through the hose 5 due to the hollow structures of the connecting rod 1 and the grinding chassis 6. The sealing requirements at both ends of the hose 5 will increase with increasing hydraulic pressure supply. Secondly, in order to compensate for clamping errors, to improve tool vibration resistance, to improve the uniformity of contact pressure and the fit with the workpiece 9, the flexible coupling 4 may be used to connect the connecting rod 1 and the grinding pan 6.
Further, a soft material interlayer 7 may be provided between the grinding table 6 and the grinding pad 8. The soft material interlayer 7 may be a sponge interlayer. To further improve the fit of the tool to the surface of the workpiece 9, a soft sponge interlayer is added between the grinding base plate 6 and the grinding pad 8.
The invention also provides an embodiment of a grinding method of self-sharpening grinding and polishing of the fixed abrasive, which adopts a grinding tool to install a grinding pad 8, wherein the grinding pad 8 is made of the fixed abrasive, the grinding pad 8 rotates along with the grinding tool to grind the surface of a workpiece 9, a grinding liquid 10 is used for spraying a processing area when the workpiece 9 is ground, and a pipeline for circulating the grinding liquid 10 is arranged in the center of the grinding tool; the polishing liquid 10 is rotatably discharged from a pipe orifice on the end face of the polishing pad 8 to the surface of the workpiece 9 via the pipe.
Further, nanoparticles may be added to the polishing liquid 10, and the concentration of the nanoparticles in the polishing liquid 10 may be 0.01 to 15%. Further, the nanoparticles of the polishing liquid 10 may be one or a combination of several of cerium oxide nanoparticles, aluminum oxide nanoparticles, and silicon dioxide nanoparticles. The combination ratio can be arbitrary. The center liquid-supply fixed abrasive self-sharpening grinding and polishing method adds nano particles in the grinding liquid 10, the nano particles are helpful for removing the base material of the grinding pad 8 in the grinding process, so that the next layer of abrasive particles are exposed in time, the self-sharpening property of the grinding pad 8 of the fixed abrasive is improved, the stability of the removal rate is maintained, the trimming times of the grinding pad 8 in the processing process are reduced, the processing period of the workpiece 9 is shortened, and the like.
Further, the pressure of the polishing liquid 10 in the pipe may be 0.1 to 1.0MPa.
Further, the grinding tool can be matched with the electric spindle 3 provided with a central water outlet mechanism.
Further, the grinding tool and the electric spindle 3 may be connected by using an ER chuck. The central liquid supply mode provides strict requirements for sealing, and in order to ensure the positioning and sealing functions of the device, the grinding tool and the connecting devices of the driving devices such as the electric spindle 3 and the like, such as the connecting rod 1 and the like, the connecting rod 1 can be connected with the electric spindle 3 by adopting an ER chuck and locked by an ER nut, so that the positioning and sealing purposes are achieved.
The working principle of the invention is as follows:
Compared with the traditional fixed abrasive grinding, the invention uses deionized water as the grinding fluid 10, the grinding fluid 10 is improved, the nano abrasive particles such as cerium oxide or silicon dioxide with a certain concentration are added into the grinding fluid 10, the self-sharpening property of the grinding pad 8 of the fixed abrasive is increased, after the surface abrasive particles fall off, the matrix material can be continuously eroded and worn, further the next layer of abrasive particles are exposed in time, the removal efficiency is kept stable, and the dressing times of the grinding pad 8 are reduced.
Conventional fixed abrasive grinding uses deionized water as the grinding fluid 10, which, although relatively clean, can carry away the machining chips and the machining heat, has no direct effect on improving the removal efficiency and maintaining the stability of the removal efficiency. In the grinding process, the roughness of the machined surface is often in the micron or submicron level, the surface quality is higher, after the abrasive particles on the surface layer of the grinding pad 8 of the fixed abrasive are removed by cutting processing for a long time, the abrasive particles are loosened and fall off from the surface of the substrate of the grinding pad 8, at the moment, the substrate of the grinding pad 8 is directly contacted with the surface of the workpiece 9, however, even if the hardness of the workpiece 9 is large due to the flat surface and higher surface quality of the workpiece 9, the substrate of the grinding pad 8 cannot be trimmed, so that the substrate is peeled off in time, and only a small amount of abrasive particles on the surface layer are exposed after grinding for a certain time, and the surface material is almost impossible to continuously remove. And through adding the abrasive particles of a certain concentration in the grinding liquid 10, when the grinding process, the abrasive particles are between the base material of the grinding pad 8 and the workpiece 9, and are directly contacted with the base material of the grinding pad 8 after being extruded, and generally, the base material of the grinding pad 8 is a resin bonding agent or a metal bonding agent, the hardness or the abrasion resistance is smaller than that of the abrasive particles and the workpiece 9, and the abrasive particles are easy to abrade, break and peel under the action of the abrasive particles, so that the abrasive particles can be exposed on the surface in time, and the surface of the workpiece 9 is continuously processed and removed.
The method of the present invention improves the manner in which the slurry 10 is supplied based on conventional fixed abrasive grinding, as shown in fig. 1, in which the slurry 10 is supplied from the center to the periphery.
In the present invention, unlike the conventional polishing process slurry 10 supply mode, the present invention is innovative in that the slurry 10 is supplied from the center of the tool by changing the slurry supply mode, and the distribution and utilization efficiency of the slurry 10 are greatly improved. In the present invention, the polishing liquid 10 can be smoothly and stably supplied from the tool center area at a certain pressure during normal operation of the polishing tool.
In the conventional grinding process, as shown in fig. 2, the workpiece 9 is placed on a table 11, and deionized water is sprayed to the periphery of the rotating workpiece 9 through a nozzle 12. As shown in figure 1, the grinding tool with the central water outlet is provided with the electric spindle 3 with the central water outlet function. Experiments show that the structure is enough to meet the sealing requirement when the hydraulic pressure is less than or equal to 1.0 Mpa. The small flow supply of the grinding liquid 10 can be kept in the experiment, and the material removal mechanism is basically the same as that of the traditional fixed abrasive grinding.
Comparative experiment of grinding removal rate and removal stability of the invention:
The grinding fluid 10 is supplied from the center of the tool, and the fluid supply mode is called central fluid supply for short, and the conventional fixed abrasive grinding mode adopts deionized water to be sprayed to the periphery of the rotating workpiece 9 through the nozzle 12, and the fluid supply mode is called peripheral fluid supply for short. And analyzing the processing effect conditions generated by the grinding method aiming at two different liquid supply modes and different grinding liquid 10, and carrying out fixed-point grinding processing experiments.
The experiments were divided into three groups:
In the first group, a fixed abrasive polishing pad 8 (diamond abrasive grains, particle size of 10 μm) was used, deionized water was used as the polishing liquid 10, the liquid supply was performed at a peripheral liquid supply speed of 800rpm, and three points were sequentially polished while each point remained for 30 seconds, without dressing the polishing pad 8.
In the second group, a fixed abrasive polishing pad 8 (diamond abrasive grains, particle diameter of 10 μm) was used, and a nano cerium oxide polishing liquid 10 (abrasive grains, particle diameter of 30nm, concentration of 12%) was used, and the liquid supply was four-side liquid supply at a rotation speed of 800rpm, and three points were sequentially polished, each point remained for 30s, without dressing the polishing pad 8.
And in the third group, a fixed abrasive is adopted to grind the pad 8 (diamond abrasive particles, the particle size is 10 mu m), a nano cerium oxide removing grinding liquid 10 (the particle size of the abrasive particles is 30nm, the concentration is 12%) is adopted, the liquid supply mode is the central liquid supply mode, the rotating speed is 800rpm, three points are ground in sequence, each point stays for 30s, and the pad 8 is not trimmed during the period.
The experimental results are shown in fig. 3 to fig. 9, wherein fig. 3 to fig. 5 show the profile of single-point removal after each set of experimental point polishing experiments, fig. 6 shows the comparison of the maximum removal depths of each set of experimental results, fig. 7 shows the morphology of the polishing pad 8 of the fixed abrasive before the experiment, fig. 8 shows the morphology of the surface of the first set of polishing pad 8 after polishing three points, and fig. 9 shows the morphology of the surface of the third set of polishing pad 8 after polishing three points.
As a result of observing the removal profiles and the maximum removal depths of the groups shown in fig. 3 to 5, on one hand, the maximum removal depths are sequentially reduced along with the sequence of processing points, which indicates that in the three grinding methods, the grinding pad 8 of the fixed abrasive has a certain degree of abrasion, the surface abrasive particles of the grinding pad 8 are peeled off, so that the removal rate is reduced, however, when the grinding particles are added by the four-side liquid supply grinding liquid 10, the maximum removal depth change probability is basically consistent with that of deionized water, however, when the mode of adopting the central liquid supply and adding the grinding particles into the grinding liquid 10 is adopted, the change trend of the maximum removal depth is obviously improved, the maximum removal depth of the third point is quite close to the second point, which indicates that the grinding particles can be more uniformly distributed between the grinding pad 8 and the workpiece 9 in a mode of adopting the central liquid supply, so that the matrix material on the surface of the grinding pad 8 is peeled off in time, the grinding particles are updated in time, the removal efficiency is kept stable, and the finishing times of the fixed abrasive pad 8 are reduced. On the other hand, as a result of comparing the maximum removal depth of each set of experimental results in fig. 6, it was found that, in the four-week liquid supply method, after a certain concentration of cerium oxide abrasive particles were added to the polishing liquid 10, the maximum removal depth was greater than in the polishing method using deionized water, and since the polishing time was very short, the soft abrasive particles were not substantially removed from the surface of the workpiece 9, thus indicating that the abrasive particles of the polishing pad 8 could be updated in time by adding cerium oxide abrasive particles, and the removal efficiency of polishing was improved. When the grinding liquid 10 with the abrasive particles is adopted, the removal efficiency is further improved by adopting a central liquid supply mode, and the stability of the removal rate is improved, so that the grinding liquid 10 is sufficiently supplied by adopting the central liquid supply mode, the problem that the grinding liquid 10 is difficult to enter a processing area during high-speed grinding in the traditional peripheral liquid supply mode is solved, and the self-sharpening property of the grinding pad 8 of the fixed abrasive in the processing process is improved.
Meanwhile, when the grinding mode of supplying liquid around without adding abrasive grains is adopted, the shape of the removing profile is greatly changed along with the sequence of processing points, and when the grinding pad 8 is used for 60s-90s, the central area of the single-point removing spot profile is basically not removed, so that a large amount of abrasive grains on the surface are removed, and meanwhile, the grinding liquid 10 cannot enter the central area, so that the abrasive grains in the central area are removed at a higher speed than the abrasive grains in the periphery. While observing the conditions of fig. 4 and 5 shows that the consistency of the removal profile is higher, which indicates that the abrasive particles of the fixed abrasive polishing pad 8 are updated greatly after the abrasive particles are added, and the self-sharpening property of the fixed abrasive polishing pad 8 is increased.
The observation result of the scanning electron microscope for the initial morphology of the polishing pad 8 in fig. 7 shows that the initial surface abrasive particle density is large, the abrasive particle exposure condition is good, and the observation result of fig. 8 shows that after the polishing by the four-week liquid-supply abrasive particle-free polishing mode, obvious abrasive particles can not be seen on the surface of the polishing pad 8, which indicates that after the surface abrasive particles fall off, the substrate material of the polishing pad 8 can not be worn off due to the high surface quality, and the next abrasive particles can not be exposed in time. In contrast, as a result of examining fig. 9, it was found that the surface of the fixed abrasive polishing pad 8 was observed to have a significantly new exposed surface of abrasive grains after polishing by the polishing method in which the nano abrasive grains were added to the center liquid supply. The method of feeding the liquid through the center and adding nano abrasive particles to the polishing liquid 10 is shown to be beneficial to improving the self-sharpening property of the polishing pad 8 of the fixed abrasive.
In summary, the self-sharpening grinding method for the central liquid supply fixed abrasive provided by the invention can enable the supply of the grinding liquid 10 to be more sufficient, improve the self-sharpening property of the fixed abrasive grinding, improve the material removal efficiency of the grinding process, improve the stability of the removal profile, and be beneficial to improving the processing efficiency and shortening the processing period.
The above-described embodiments are only for illustrating the technical spirit and features of the present invention, and it is intended to enable those skilled in the art to understand the content of the present invention and to implement it accordingly, and the scope of the present invention is not limited to the embodiments, i.e. equivalent changes or modifications to the spirit of the present invention are still within the scope of the present invention.
Claims (8)
1. The method adopts a grinding tool to mount a grinding pad, wherein the grinding pad is made of a fixed abrasive, a matrix material in the grinding pad is a resin bond or a metal bond, the hardness or the abrasion resistance is smaller than that of abrasive particles and a workpiece, and the abrasive particles are worn, broken and peeled off under the action of the abrasive particles, so that the abrasive particles can be exposed out of the surface in time, and the surface of the workpiece is continuously processed and removed; the grinding pad rotates along with the grinding tool to grind the surface of the workpiece, and the grinding liquid is used for spraying a processing area when grinding the workpiece, and the grinding pad is characterized in that a pipeline for circulating the grinding liquid is arranged in the center of the grinding tool; the grinding fluid is rotationally sprayed out from a pipeline opening on the end face of the grinding pad to the surface of the workpiece through the pipeline; the grinding fluid consists of deionized water and nano particles, wherein the concentration of the nano particles in the grinding fluid is 12% -15%;
The nano particles of the grinding fluid are one or a combination of a plurality of cerium oxide nano particles, aluminum oxide nano particles and silicon dioxide nano particles.
2. The method for self-sharpening a fixed abrasive according to claim 1, wherein the pressure of the grinding fluid in the pipeline is 0.1-1.0 mpa.
3. The method of claim 1, wherein the abrasive tool is used in combination with an electric spindle having a central water outlet mechanism.
4. A method of grinding a self-sharpening fixed abrasive according to claim 3, wherein the grinding tool is connected to the electric spindle using an ER collet.
5. The grinding tool for self-sharpening grinding and polishing of the fixed abrasive is characterized by comprising a connecting rod and a grinding chassis which are connected with each other, wherein the connecting rod is connected with a device for driving the connecting rod to rotate, a grinding pad is arranged on the grinding chassis, the grinding pad is made of the fixed abrasive, a matrix material in the grinding pad is a resin bonding agent or a metal bonding agent, the hardness or the abrasion resistance is smaller than that of abrasive particles and a workpiece, and the abrasive particles are worn, broken and peeled off under the action of the abrasive particles, so that the abrasive particles can be timely exposed out of the surface of the workpiece, and the surface of the workpiece is continuously processed and removed; the grinding pad rotates along with the grinding chassis to grind the surface of the workpiece; the centers of the connecting rod, the grinding chassis and the grinding pad are respectively provided with a pipeline for circulating grinding liquid; the grinding fluid is rotationally sprayed out from a pipeline opening on the end face of the grinding pad to the surface of the workpiece through the pipeline; the grinding fluid consists of deionized water and nano particles.
6. The fixed abrasive self-sharpening abrasive tool of claim 5, wherein the connecting rod and the abrasive chassis are connected by a flexible coupling.
7. The fixed abrasive self-sharpening abrasive tool according to claim 5, wherein a soft material interlayer is provided between the abrasive chassis and the abrasive pad.
8. The fixed abrasive self-sharpening abrasive tool according to claim 7, wherein the soft material interlayer is a sponge interlayer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811497065.6A CN109531406B (en) | 2018-12-07 | 2018-12-07 | Grinding tool and grinding method for self-sharpening grinding and polishing of fixed abrasive |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811497065.6A CN109531406B (en) | 2018-12-07 | 2018-12-07 | Grinding tool and grinding method for self-sharpening grinding and polishing of fixed abrasive |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109531406A CN109531406A (en) | 2019-03-29 |
| CN109531406B true CN109531406B (en) | 2024-04-26 |
Family
ID=65853224
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811497065.6A Active CN109531406B (en) | 2018-12-07 | 2018-12-07 | Grinding tool and grinding method for self-sharpening grinding and polishing of fixed abrasive |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109531406B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113172483B (en) * | 2021-04-28 | 2024-10-01 | 天津大学 | Processing method and device for center liquid supply chemical mechanical polishing semiconductor material |
Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102267105A (en) * | 2011-08-05 | 2011-12-07 | 南京航空航天大学 | Grinding polishing pad of iron-containing consolidation grinding material |
| CN102275141A (en) * | 2011-09-01 | 2011-12-14 | 南京航空航天大学 | Graphite-containing fixed abrasive grinding and polishing pad |
| CN102337084A (en) * | 2011-07-25 | 2012-02-01 | 郑州磨料磨具磨削研究所 | Grinding fluid for processing LED (light-emitting diode) substrate and preparation method thereof |
| CN103086417A (en) * | 2013-01-25 | 2013-05-08 | 吴江创源新材料科技有限公司 | Shape controlled cerium oxide particle, as well as preparation method and application thereof |
| CN106425825A (en) * | 2016-09-28 | 2017-02-22 | 南京航空航天大学 | New grinding and polishing method for super hard and brittle workpiece |
| CN106944939A (en) * | 2017-03-17 | 2017-07-14 | 衢州学院 | It is a kind of add soluble resin material from superhard fine grinding tool pellet of dressing and preparation method thereof |
| CN107344329A (en) * | 2017-06-29 | 2017-11-14 | 天津大学 | Center feed flow small abrasive nose polishing tool |
| WO2017211143A1 (en) * | 2016-06-06 | 2017-12-14 | 郑州磨料磨具磨削研究所有限公司 | Additive raw material composition and additive for superhard material product and preparation method therefor, composite binder and superhard material product, self-sharpening diamond wheel and preparation method therefor |
| CN107756252A (en) * | 2017-10-18 | 2018-03-06 | 郑州磨料磨具磨削研究所有限公司 | A kind of grinding wheel dressing method and device based on hydrodynamic driving |
| CN108192506A (en) * | 2018-02-09 | 2018-06-22 | 东莞华拓研磨材料有限公司 | A kind of metal surface grinding with polishing agent and preparation method |
| CN108555780A (en) * | 2018-05-31 | 2018-09-21 | 华辰精密装备（昆山）股份有限公司 | Grinding wheel laser reconditioning system |
| CN209754880U (en) * | 2018-12-07 | 2019-12-10 | 天津大学 | Grinding tool for self-sharpening grinding and polishing of fixed abrasive |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7153191B2 (en) * | 2004-08-20 | 2006-12-26 | Micron Technology, Inc. | Polishing liquids for activating and/or conditioning fixed abrasive polishing pads, and associated systems and methods |
-
2018
- 2018-12-07 CN CN201811497065.6A patent/CN109531406B/en active Active
Patent Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102337084A (en) * | 2011-07-25 | 2012-02-01 | 郑州磨料磨具磨削研究所 | Grinding fluid for processing LED (light-emitting diode) substrate and preparation method thereof |
| CN102267105A (en) * | 2011-08-05 | 2011-12-07 | 南京航空航天大学 | Grinding polishing pad of iron-containing consolidation grinding material |
| CN102275141A (en) * | 2011-09-01 | 2011-12-14 | 南京航空航天大学 | Graphite-containing fixed abrasive grinding and polishing pad |
| CN103086417A (en) * | 2013-01-25 | 2013-05-08 | 吴江创源新材料科技有限公司 | Shape controlled cerium oxide particle, as well as preparation method and application thereof |
| WO2017211143A1 (en) * | 2016-06-06 | 2017-12-14 | 郑州磨料磨具磨削研究所有限公司 | Additive raw material composition and additive for superhard material product and preparation method therefor, composite binder and superhard material product, self-sharpening diamond wheel and preparation method therefor |
| CN106425825A (en) * | 2016-09-28 | 2017-02-22 | 南京航空航天大学 | New grinding and polishing method for super hard and brittle workpiece |
| CN106944939A (en) * | 2017-03-17 | 2017-07-14 | 衢州学院 | It is a kind of add soluble resin material from superhard fine grinding tool pellet of dressing and preparation method thereof |
| CN107344329A (en) * | 2017-06-29 | 2017-11-14 | 天津大学 | Center feed flow small abrasive nose polishing tool |
| CN107756252A (en) * | 2017-10-18 | 2018-03-06 | 郑州磨料磨具磨削研究所有限公司 | A kind of grinding wheel dressing method and device based on hydrodynamic driving |
| CN108192506A (en) * | 2018-02-09 | 2018-06-22 | 东莞华拓研磨材料有限公司 | A kind of metal surface grinding with polishing agent and preparation method |
| CN108555780A (en) * | 2018-05-31 | 2018-09-21 | 华辰精密装备（昆山）股份有限公司 | Grinding wheel laser reconditioning system |
| CN209754880U (en) * | 2018-12-07 | 2019-12-10 | 天津大学 | Grinding tool for self-sharpening grinding and polishing of fixed abrasive |
Non-Patent Citations (1)
| Title |
|---|
| 三乙醇胺浓度对固结磨料研磨垫自锐性能的影响;李军等;;光学精密工程;20141215(12);全文 * |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109531406A (en) | 2019-03-29 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7234224B1 (en) | Curved grooving of polishing pads | |
| KR100293863B1 (en) | Super abrasive tool and its manufacturing method | |
| EP2879164A1 (en) | Dicing device and dicing method | |
| JPH08264627A (en) | Support body for grinding wafer and chemicl-mechanical grinding device and method | |
| CN100425405C (en) | Freezing nanometer abrasive polishing pad and its prepn. method | |
| Chen et al. | Relationship between mechanical properties and processing performance of agglomerated diamond abrasive compared with single diamond abrasive | |
| US6102784A (en) | Method and apparatus for improved gear cleaning assembly in polishing machines | |
| Chen et al. | Influence of agglomerated diamond abrasive wear on sapphire material removal behavior | |
| WO2000063963A1 (en) | Non-abrasive conditioning for polishing pads | |
| WO2006075527A1 (en) | METHOD FOR ABRASING GaN SUBSTRATE | |
| JP5620300B2 (en) | Polishing machine for polishing an object to be polished made of a crystal material, a manufacturing method thereof, and a polishing method | |
| CN101468448A (en) | Chemical mechanical polishing technological process | |
| CN101774160B (en) | Grainofice-type concretion abrasive polishing pad as well as rapid preparation method and device | |
| CN209754880U (en) | Grinding tool for self-sharpening grinding and polishing of fixed abrasive | |
| CN109531406B (en) | Grinding tool and grinding method for self-sharpening grinding and polishing of fixed abrasive | |
| CN105234823B (en) | Lapping liquid is supplied and grinding pad collating unit, grinder station | |
| CN106002663B (en) | A kind of laminated freezing concretion abrasive polishing pad and preparation method | |
| CN108237467B (en) | Method for processing grinding pad | |
| CN101116953A (en) | Chemical mechanism grinding and finishing device | |
| JP7385985B2 (en) | Blade processing equipment and blade processing method | |
| CN114932500B (en) | Grinding and polishing integrated device and operation method thereof | |
| CN105729297A (en) | Ice particle type fixed abrasive polishing pad with integration of grinding and polishing and preparation method thereof | |
| CN211841524U (en) | Numerical control polishing device for liquid supply of inner flow channel | |
| JP2015207658A (en) | Method and device of polishing disc-like semiconductor wafer edge part | |
| CN1197687C (en) | Work-table of chemicomechanical grinding mill |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |