CN109518171A - A kind of chemical nickel-plating liquid - Google Patents
A kind of chemical nickel-plating liquid Download PDFInfo
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- CN109518171A CN109518171A CN201811578552.5A CN201811578552A CN109518171A CN 109518171 A CN109518171 A CN 109518171A CN 201811578552 A CN201811578552 A CN 201811578552A CN 109518171 A CN109518171 A CN 109518171A
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
- C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
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Abstract
The present invention provides a kind of chemical nickel-plating liquid, remember by weight, including 10-50 parts of nickel salt, 10-50 parts of reducing agent, 0.05-5 parts of brightener, 1-20 parts of complexing agent, 0.5-10 parts of stabilizer, 0.1-10 parts of promotor, 5-50 parts of buffer and 0.05-1 parts of surfactant, the brightener is molybdenum trichloride.Chemical nickel-plating liquid provided by the invention is more environmentally-friendly and coating performance is preferable.
Description
Technical field
The invention belongs to electroplating chemical technical fields, and in particular to a kind of chemical nickel-plating liquid.
Background technique
Chemical nickel plating is a kind of without extraneous electricity, deposits one layer on the surface of metal product by oxidation-reduction
The method of nickel, compared with plating, electroless plating technology has that coating is uniform, pin hole is small, be not required to DC power supply device, can be in non-conductor
It is upper to deposit and have the characteristics that certain properties.In addition, since electroless plating technology discharging of waste liquid is few, environmental pollution it is small and
Cost is relatively low, gradually replaces plating in many fields, becomes a kind of process of surface treatment of environment-friendly type.Currently, chemical plating skill
Art is widely used in the industry such as electronics, valve manufacture, machinery, petrochemical industry, automobile, aerospace.
Nickel plating brightener is one kind of nickel-plating additive, is that one of chemical nickel-plating solution commonly uses efficient additive.Add
The brightness and binding force of cladding material of coating can be significantly improved after adding, while can greatly improve the stability of nickel-plating liquid, improved
Plating solution service life reduces production cost, improves the quality of product.It is widely used in chemical nickel-plating solution for various purposes,
It increases significantly to the performance of chemical nickel-plating liquid.But nickel-plating liquid generallys use the harmful substances such as leaded, cadmium as light at present
Bright dose.Although finally obtaining the better performances of nickel coating, because all having containing harmful substances such as lead, cadmiums to human and environment
Harmful, do not meet European Union's RoHS standard.Accordingly, it is desirable to provide one kind meets environmental requirement, and obtained coating still effect
Preferable chemical nickel-plating liquid.
Summary of the invention
In view of the deficiencies of the prior art, the present invention provides a kind of more environmentally-friendly and coating performance preferable chemical nickel plating
Liquid.
The present invention provides a kind of chemical nickel-plating liquid, remembers by weight, including 10-50 parts of nickel salt, 10-50 parts of reducing agent, light
Bright dose 0.05-5 parts, 1-20 parts of complexing agent, 0.5-10 parts of stabilizer, 0.1-10 parts of promotor, 5-50 parts of buffer and surface are living
Property 0.05-1 parts of agent, the brightener be molybdenum trichloride.
Preferably, described nickel salt 15-40 parts, 15-40 parts of reducing agent, 0.1-2 parts of brightener, 5-10 parts of complexing agent, stabilization
2-3 parts of agent, 2-5 parts of promotor, 12-18 parts of buffer and 0.1-0.5 parts of surfactant.
Preferably, described brightener 0.5-1 parts.
Preferably, the nickel salt includes one of nickel sulfate, nickel chloride, nickel acetate, nickelous carbonate, nickel sulfamic acid or more
Kind.
Preferably, the reducing agent includes sodium hypophosphite, potassium hypophosphite, formaldehyde, sodium formaldehydebisulfite, hydroboration
One of sodium, thiocarbamide, hydroquinone, ascorbic acid and dimethyamine borane.
Preferably, the complexing agent includes succinic acid, sodium succinate, citric acid, sodium citrate, lactic acid, malic acid, sweet ammonia
Acid, thio chitosan, tetrasodium salt of EDTA, ethylenediamine tetra-acetic acid, N-hydroxyethyl-ethylenediamine triacetic acid, four hydroxypropyl second
It is one or more in diamines and triethanolamine.
Preferably, the surfactant includes dodecyl sodium sulfate, lauryl sodium sulfate, sulfosuccinic acid monoesters
It is one or more in disodium and fatty acid methyl ester ethoxylate sulfonate.
Preferably, the stabilizer includes sodium thiosulfate, potassium thiosulfate, thiocarbamide, xanthate, the thio contracting of 2,4- bis-
It is one or more in two ureas, semicarbazides, thiosemicarbazide and Isosorbide-5-Nitrae-phenylene bis- (thiocarbamides).
Preferably, the promotor is propionic acid；The buffer is sodium acetate.
The present invention also provides a kind of chemical nickel-plating liquids, remember by weight, by 15-40 parts of nickel sulfate, 15-40 parts of reducing agent,
0.1-2 parts of molybdenum trichloride, 5-10 parts of complexing agent, 2-3 parts of stabilizer, 2-5 parts of propionic acid, 12-18 parts of sodium acetate and surfactant
0.1-0.5 parts of compositions.
Preferably, described molybdenum trichloride 0.5-1 parts.
Chemical nickel-plating liquid provided by the invention is more environmentally-friendly and coating performance is preferable.
Specific embodiment
Technical solution of the present invention is described in further detail combined with specific embodiments below, so that the technology of this field
Personnel can better understand the present invention and can be practiced, but illustrated embodiment is not as a limitation of the invention.
The embodiment of the present invention provides a kind of chemical nickel-plating liquid, remembers by weight, including 10-50 parts of nickel salt, reducing agent 10-50
Part, 0.05-5 parts of brightener, 1-20 parts of complexing agent, 0.5-10 parts of stabilizer, 0.1-10 parts of promotor, 5-50 parts of buffer and table
Activating agent 0.05-1 parts of face, brightener is molybdenum trichloride.
Replace the harmful substances such as traditional leaded, cadmium as brightener using molybdenum trichloride in the present embodiment, and cooperates
The chemical nickel-plating liquid that other components of the invention obtain has the better feature of environmental protection.Also, obtained coating still has preferably
Performance.
In a preferred embodiment, nickel salt 15-40 parts, 15-40 parts of reducing agent, 0.1-2 parts of brightener, 5-10 parts of complexing agent,
2-3 parts of stabilizer, 2-5 parts of promotor, 12-18 parts of buffer and 0.1-0.5 parts of surfactant.
In a preferred embodiment, brightener 0.5-1 parts.
In a preferred embodiment, nickel salt includes one of nickel sulfate, nickel chloride, nickel acetate, nickelous carbonate, nickel sulfamic acid
Or it is a variety of.In further preferred embodiments, nickel salt is nickel sulfate.
In a preferred embodiment, reducing agent includes sodium hypophosphite, potassium hypophosphite, formaldehyde, sodium formaldehydebisulfite, boron hydrogen
Change one of sodium, thiocarbamide, hydroquinone, ascorbic acid and dimethyamine borane.
In a preferred embodiment, complexing agent include succinic acid, sodium succinate, citric acid, sodium citrate, lactic acid, malic acid,
Glycine, thio chitosan, tetrasodium salt of EDTA, ethylenediamine tetra-acetic acid, N-hydroxyethyl-ethylenediamine triacetic acid, four hydroxypropyls
It is one or more in base ethylenediamine and triethanolamine.
In a preferred embodiment, surfactant includes dodecyl sodium sulfate, lauryl sodium sulfate, sulfosuccinic acid
It is one or more in monoesters disodium and fatty acid methyl ester ethoxylate sulfonate.
In a preferred embodiment, stabilizer includes sodium thiosulfate, potassium thiosulfate, thiocarbamide, xanthate, 2,4-, bis- sulphur
For one or more in biuret, semicarbazides, thiosemicarbazide and Isosorbide-5-Nitrae-phenylene bis- (thiocarbamides).
In a preferred embodiment, promotor is propionic acid；Buffer is sodium acetate.
The present invention also provides a kind of chemical nickel-plating liquids, remember by weight, by 15-40 parts of nickel sulfate, 15-40 parts of reducing agent,
0.1-2 parts of molybdenum trichloride, 5-10 parts of complexing agent, 2-3 parts of stabilizer, 2-5 parts of propionic acid, 12-18 parts of sodium acetate and surfactant
0.1-0.5 parts of compositions.
In a preferred embodiment, molybdenum trichloride 0.5-1 parts.
In a preferred embodiment, nickel salt includes one of nickel sulfate, nickel chloride, nickel acetate, nickelous carbonate, nickel sulfamic acid
Or it is a variety of.In further preferred embodiments, nickel salt is nickel sulfate.
In a preferred embodiment, reducing agent includes sodium hypophosphite, potassium hypophosphite, formaldehyde, sodium formaldehydebisulfite, boron hydrogen
Change one of sodium, thiocarbamide, hydroquinone, ascorbic acid and dimethyamine borane.
In a preferred embodiment, complexing agent include succinic acid, sodium succinate, citric acid, sodium citrate, lactic acid, malic acid,
Glycine, thio chitosan, tetrasodium salt of EDTA, ethylenediamine tetra-acetic acid, N-hydroxyethyl-ethylenediamine triacetic acid, four hydroxypropyls
It is one or more in base ethylenediamine and triethanolamine.
In a preferred embodiment, surfactant includes dodecyl sodium sulfate, lauryl sodium sulfate, sulfosuccinic acid
It is one or more in monoesters disodium and fatty acid methyl ester ethoxylate sulfonate.
In a preferred embodiment, stabilizer includes sodium thiosulfate, potassium thiosulfate, thiocarbamide, xanthate, 2,4-, bis- sulphur
For one or more in biuret, semicarbazides, thiosemicarbazide and Isosorbide-5-Nitrae-phenylene bis- (thiocarbamides).
The present embodiment further includes a kind of application method of chemical nickel-plating liquid, and nickel plating temperature is 80 DEG C -95 DEG C, the pH of nickel-plating liquid
Value is 4-5.
The present embodiment further includes a kind of chemical nickel plating method, and workpiece ultrasound oil removing 5-15 minutes after washing, uses
The activation of 20%-30% hydrochloride derusting, then through washing, nickel plating is then carried out, plating time is 5-20 minutes, nickel plating temperature 80
DEG C -95 DEG C, the pH value of nickel-plating liquid is 4-5.
In order to have further understanding and understanding to technical solution of the present invention, several preferred embodiments pair are now enumerated
It is described in further details.
Embodiment 1
Formula: nickel sulfate 22.5g/L, reducing agent (sodium formaldehydebisulfite) 24g/L, molybdenum trichloride 0.5g/L, complexing agent
(succinic acid) 10g/L, stabilizer (sodium thiosulfate) 2g/L, propionic acid 5g/L, sodium acetate 12g/L and surfactant (dodecane
Base sodium sulfonate) 0.3g/L.
Chemical nickel plating method: being mixed into chemical nickel-plating liquid for above-mentioned formula, spare.
By ironware ultrasound oil removing 10 minutes, through 3 washings, then 20-30% hydrochloride derusting was activated, then through 3 washings, was used
Chemical nickel-plating liquid plates 10 minutes, and nickel plating temperature is 90 degree, and p H value is 4.5.
Embodiment 2
Formula: nickel sulfate 22.5g/L, reducing agent (potassium hypophosphite) 24g/L, molybdenum trichloride 0.7g/L, complexing agent (lemon
Acid) 10g/L, stabilizer (potassium thiosulfate) 2g/L, propionic acid 5g/L, sodium acetate 12g/L and surfactant (dodecyl sulphate
Sodium) 0.3g/L.
Chemical nickel plating method: being mixed into chemical nickel-plating liquid for above-mentioned formula, spare.
By ironware ultrasound oil removing 10 minutes, through 3 washings, then 20-30% hydrochloride derusting was activated, then through 3 washings, was used
Chemical nickel-plating liquid plates 10 minutes, and nickel plating temperature is 90 degree, and p H value is 4.5.
Embodiment 3
Formula: nickel sulfate 22.5g/L, reducing agent (sodium borohydride) 24g/L, molybdenum trichloride 1g/L, complexing agent (citric acid
Sodium) 10g/L, stabilizer (sodium thiosulfate) 2g/L, propionic acid 5g/L, sodium acetate 12g/L and surfactant (dodecyl sulphate
Sodium) 0.3g/L.
Chemical nickel plating method: being mixed into chemical nickel-plating liquid for above-mentioned formula, spare.
By ironware ultrasound oil removing 10 minutes, through 3 washings, then 20-30% hydrochloride derusting was activated, then through 3 washings, was used
Chemical nickel-plating liquid plates 10 minutes, and nickel plating temperature is 90 degree, and p H value is 4.5.
Comparative example 1
Nickel sulfate 22.5g/L, reducing agent (sodium formaldehydebisulfite) 24g/L, plumbi nitras 0.5g/L, complexing agent (succinic acid)
10g/L, stabilizer (sodium thiosulfate) 2g/L, propionic acid 5g/L, sodium acetate 12g/L and surfactant (dodecyl sodium sulfate)
0.3g/L。
Chemical nickel plating method: being mixed into chemical nickel-plating liquid for above-mentioned formula, spare.
By ironware ultrasound oil removing 10 minutes, through 3 washings, then 20-30% hydrochloride derusting was activated, then is washed through 3, on
Chemical nickel-plating liquid plates 10 minutes, and nickel plating temperature is 90 degree, and p H value is 4.5.
Effect example
Embodiment 1, embodiment 2, embodiment 3 are formulated obtained chemical nickel-plating liquid and comparative example 1 is formulated obtained chemical plating
Nickel liquid carries out decomposition temperature test.Specific test result is as shown in table 1.
Embodiment 1, embodiment 2, the chemical nickel-plating liquid of embodiment 3 and comparative example 1 chemical nickel-plating liquid when carrying out nickel plating
Its plating speed is measured, the workpiece after nickel plating observes its appearance, measures its brightness using photometer, and the coating after nickel plating carries out hundred lattice
Test.Specific test result is as shown in table 1.
Decomposition temperature test method: temperature-raising method is titrated using palladium chloride to measure the stability of chemical nickel-plating solution.Specifically
Steps are as follows: under the conditions of 60 DEG C, instilled in the chemical nickel-plating solution that is prepared to embodiment 1-3 and comparative example 1 concentration be 100 ×
10-6Palladium chloride 1mL, and heat up to solution, heating temperature is 1.5 DEG C/min, chemical as measuring using decomposition temperature
The parameter of nickel plating solution stability.
Hundred lattice test (D3359): drawing 10*10 on test sample surface with sharp blade (knife edge angle is 15-30 °)
The small grid of 1mm*1mm, each scribing line answer deep and paint bottom, are cleaned down the fragment of test zone with hairbrush；With viscous
Attached power 350-400g/cm2Adhesive tape (3M61 adhesive tape or other equivalent) tested small grid of firmly stopping, and exerted oneself with erasing rubber
Adhesive tape is wiped, to increase the contact area and dynamics of adhesive tape Yu tested region；Adhesive tape one end is held, it is fast in vertical direction
Speed shuts down gummed paper, and same position carries out 2 same tests.Then it is observed.
Table 1
It can be seen that the higher decomposition temperature of chemical nickel-plating liquid prepared by embodiment 1-3, higher plating from the data of table 1
Speed, higher decomposition temperature illustrate more preferable for stability relative contrast example 1.Fast speed, phase are plated in higher plating speed explanation
For comparative example 1, chemical nickel-plating liquid is enabled to promote working efficiency during upper plating, further such that cost reduces,
More interests are provided for enterprise.
For workpiece relative contrast example 1 after the chemical nickel-plating liquid plating of the present embodiment 1-3 preparation, there is preferable bright effect
Fruit is illustrated that the solution of the present invention does not use heavy metal as brightener, but is still had using molybdenum trichloride as brightener
Preferable brightness effect.Hundred lattice test result relative contrast of workpiece after the chemical nickel-plating liquid plating of the present embodiment 1-3 preparation simultaneously
Example 1 will be got well.
To sum up, the brightness of workpiece, hundred after the stability of the chemical nickel-plating liquid of the present embodiment 1-3 preparation, plating speed and nickel plating
Lattice test result is got well than the chemical nickel-plating liquid in comparative example 1 using heavy metal as brightener.Illustrate change of the invention
The formula for learning nickel-plating liquid is reasonable, cooperates other compositions as brightener using molybdenum trichloride, obtained coating performance is preferable, can
Replace completely and uses other chemical nickel-plating liquids of heavy metal as brightener.
The above description is only a preferred embodiment of the present invention, is not intended to limit the scope of the invention, all utilizations
Equivalent structure or equivalent flow shift made by present specification is applied directly or indirectly in other relevant technologies
Field is included within the scope of the present invention.
Claims (10)
1. a kind of chemical nickel-plating liquid, which is characterized in that remember by weight, including 10-50 parts of nickel salt, 10-50 parts of reducing agent, light
0.05-5 parts of agent, 1-20 parts of complexing agent, 0.5-10 parts of stabilizer, 0.1-10 parts of promotor, 5-50 parts of buffer and surface-active
0.05-1 parts of agent, the brightener is molybdenum trichloride.
2. chemical nickel-plating liquid as described in claim 1, which is characterized in that described nickel salt 15-40 parts, 15-40 parts of reducing agent, light
Bright dose 0.1-2 parts, 5-10 parts of complexing agent, 2-3 parts of stabilizer, 2-5 parts of promotor, 12-18 parts of buffer and surfactant
0.1-0.5 parts.
3. chemical nickel-plating liquid as described in claim 1, which is characterized in that described brightener 0.5-1 parts.
4. chemical nickel-plating liquid as described in claim 1, which is characterized in that the nickel salt includes nickel sulfate, nickel chloride, acetic acid
One of nickel, nickelous carbonate, nickel sulfamic acid are a variety of.
5. chemical nickel-plating liquid as described in claim 1, which is characterized in that the reducing agent includes sodium hypophosphite, hypophosphorous acid
One of potassium, formaldehyde, sodium formaldehydebisulfite, sodium borohydride, thiocarbamide, hydroquinone, ascorbic acid and dimethyamine borane.
6. chemical nickel-plating liquid as described in claim 1, which is characterized in that the complexing agent includes succinic acid, sodium succinate, lemon
Lemon acid, sodium citrate, lactic acid, malic acid, glycine, thio chitosan, tetrasodium salt of EDTA, ethylenediamine tetra-acetic acid,
It is one or more in N-hydroxyethyl-ethylenediamine triacetic acid, tetrahydroxypropyl ethylenediamine and triethanolamine.
7. chemical nickel-plating liquid as described in claim 1, which is characterized in that the surfactant includes dodecyl sodium sulfonate
It is one or more in sodium, lauryl sodium sulfate, sulfosuccinic acid monoesters disodium and fatty acid methyl ester ethoxylate sulfonate；
The stabilizer includes sodium thiosulfate, potassium thiosulfate, thiocarbamide, xanthate, 2,4- dithiobiuret, semicarbazides, sulphur
For one or more in semicarbazides and Isosorbide-5-Nitrae-phenylene bis- (thiocarbamides).
8. chemical nickel-plating liquid as described in claim 1, which is characterized in that the promotor is propionic acid；The buffer is vinegar
Sour sodium.
9. a kind of chemical nickel-plating liquid, which is characterized in that remember by weight, by 15-40 parts of nickel sulfate, 15-40 parts of reducing agent, trichlorine
Molybdenum 0.1-2 parts of change, 5-10 parts of complexing agent, 2-3 parts of stabilizer, 2-5 parts of propionic acid, 12-18 parts of sodium acetate and surfactant 0.1-
0.5 part of composition.
10. chemical nickel-plating liquid as claimed in claim 9, which is characterized in that described molybdenum trichloride 0.5-1 parts.
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| CN201811578552.5A CN109518171B (en) | 2018-12-24 | 2018-12-24 | Chemical nickel plating solution |
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| CN110318046A (en) * | 2019-06-20 | 2019-10-11 | 深圳市宏达秋科技有限公司 | A kind of high corrosion-resistant chemical nickel-plating liquid and preparation method thereof |
| CN111074248A (en) * | 2019-12-27 | 2020-04-28 | 娄底市安地亚斯电子陶瓷有限公司 | Chemical nickel plating solution and ceramic secondary metallization method |
| CN111118480A (en) * | 2020-01-14 | 2020-05-08 | 常州大学 | Chemical plating solution for low-temperature chemical plating of Ni-B binary alloy layer and chemical plating method |
| CN111733404A (en) * | 2020-08-10 | 2020-10-02 | 广州皓悦新材料科技有限公司 | Chemical nickel plating solution and preparation method thereof |
| CN113957422A (en) * | 2021-09-16 | 2022-01-21 | 深圳市大正瑞地科技有限公司 | Lead-free environment-friendly chemical nickel liquid medicine and preparation process thereof |
| CN114808048A (en) * | 2021-05-31 | 2022-07-29 | 上海亿尚金属有限公司 | Chemical nickel electroplating solution and electroplating process thereof |
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| CN114808048B (en) * | 2021-05-31 | 2024-04-30 | 上海亿尚金属有限公司 | Electroless nickel plating solution and plating process thereof |
| CN113957422A (en) * | 2021-09-16 | 2022-01-21 | 深圳市大正瑞地科技有限公司 | Lead-free environment-friendly chemical nickel liquid medicine and preparation process thereof |
| CN115519133A (en) * | 2022-10-21 | 2022-12-27 | 雅安百图高新材料股份有限公司 | Preparation method of nickel-coated graphite powder |
| CN115519133B (en) * | 2022-10-21 | 2023-08-25 | 雅安百图高新材料股份有限公司 | Preparation method of nickel-coated graphite powder |
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