CN103757636B - A kind of chemical polishing solution and alloy surface polishing method - Google Patents
A kind of chemical polishing solution and alloy surface polishing method Download PDFInfo
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- CN103757636B CN103757636B CN201410007435.9A CN201410007435A CN103757636B CN 103757636 B CN103757636 B CN 103757636B CN 201410007435 A CN201410007435 A CN 201410007435A CN 103757636 B CN103757636 B CN 103757636B
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Abstract
The invention discloses a kind of chemical polishing solution and alloy surface processing method, in every liter of polishing fluid, each constituent content is: persulfate 30～100g, concentrated sulphuric acid 300～500ml, viscosity modifier 10～40g, brightener 2～14g, and surplus is water。Alloy workpiece is sequentially carried out oil removing, cleaning, acid-wash activation, cleaning；By above-mentioned after pre-treatment alloy workpiece be placed in described chemical polishing solution impregnate；After having polished, alloy workpiece cleaned successively, be passivated, clean, dry。The present invention adopts sodium peroxydisulfate as oxidant, does not produce " tobacco ", environmental protection in polishing process。And this polishing fluid composition is simple, it is easy to management and control。Gained chemically polishing surface is bright, smooth, up to mirror finish effect。The polishing fluid of the present invention can be widely used in the polishing of copper alloy surface。
Description
Technical field
The present invention relates to a kind of chemical polishing soln, especially relate to a kind of alloy surface polishing method and chemical polishing solution。
Background technology
Alloy, as rustless steel, pyrite, aluminium alloy etc. are widely used in ornamental polish goods, machine components and tools production。It is required for polishing in the course of processing of these products and the formation of final products and improves surface roughness and brightness。At present, main alloy polishing technology has: electrochemical polish, chemical polishing and machine glazed finish。Relative to other two kinds, the advantages such as chemical polishing is low with cost, simple to operate, polishing effect is uniform and be subject to extensive use, be particularly well-suited to the polishing of complex-shaped parts。
Producing the chemical polishing solution of upper application now, if classifying by oxidant used, mainly having following three types: (1) nitric acid and salt series thereof, the method can produce substantial amounts of nitrogen oxides in the process of chemical polishing, is commonly called as " tobacco "。Oxides of nitrogen gas toxicity is very big, all can cause serious harm for human body and environment。(2) chromate series, this finishing method is high because of cost, and wastewater treatment costly, and exists Cr6+Pollution problem, therefore apply fewer and feweri in the industrial production。(3) hydrogen peroxide series, there is hydrogen peroxide instability in the method, the polishing agent life-span is generally not long, the problems such as production cost is higher。
Summary of the invention
The technical problem to be solved in the present invention is chemical polishing agent that is a kind of pollution-free and that have good stability and the alloy surface polishing method of providing for existing technological deficiency。
A kind of chemical polishing solution, in every liter of polishing fluid, each constituent content is: persulfate 30～100g, concentrated sulphuric acid 300～500ml, viscosity modifier 10～40g, brightener 2～14g, and surplus is water。
Described persulfate is one or more in potassium peroxydisulfate, sodium peroxydisulfate or Ammonium persulfate.。
The mass concentration of described concentrated sulphuric acid is 98%。
Described viscosity modifier is one or more in gelatin, Polyethylene Glycol, copper sulfate, cellulose ether, polyvinylpyrrolidone。Described regulator makes polishing sluggish uniformly carry out, it is ensured that the surface effect after polishing。
Described brightener is one or more in thiourea, carbamide, sulfanilamide, arginine, glycine, methionine, BTA, sulfosalicylic acid, citric acid, dodecyl sodium sulfate, cetyl trimethylammonium bromide。Described brightener can make the surface of the work after polishing brighter smooth。
A kind of chemically polishing method, mainly includes the following steps that；
A. pre-treatment: metal works is sequentially carried out oil removing, cleaning, activation, cleaning；
B. chemical polishing: alloy workpiece after above-mentioned pre-treatment is placed in the chemical polishing solution described in claim 1～6 any one and impregnates；
C. post processing: after having polished, cleans alloy workpiece successively, is passivated, cleans, dries。
Step (2) described dipping is dipping 3～9min at 30～45 DEG C, is stirred in dipping process。
Step (1) described cleaning includes washing and distilled water ultrasonic waves for cleaning；Described oil removing is in the mixed solution of 40g/L sodium carbonate, 35g/L sodium phosphate and 2ml/LOP emulsifying agent, processes 1min。
Step (3) described passivation is in the mixed solution of 6g/L BTA, 20g/L Polyethylene Glycol and 3g/L sulfosalicylic acid, processes 1min。
The present invention adopts sulphuric acid and persulfate system, coordinates viscosity modifier, brightener, makes chemical polishing solution。This chemical polishing solution avoids the harmful gas such as nitrogen oxides produced in polishing process, decreases the pollution to environment and the injury to producers。The chemical liquids polishing effect of the present invention relatively stable (compared with hydrogen peroxide sequence of chemical polishing fluid), and this polishing fluid composition is simple, it is easy to management and control。Metal surface is carried out chemical polished surface brightness height, surfacing that chemical polishing obtains, mirror finish effect can be reached。The polishing fluid of the present invention can be widely used in the polishing of copper alloy surface。
Accompanying drawing explanation
Fig. 1 is that embodiment 4 processes front metal surface contour scanning figure。
Fig. 2 is metal surface contour scanning figure after embodiment 4 processes。
Detailed description of the invention
The polishing fluid of the present invention is applied to copper alloy the effect of excellence, and embodiments of the invention are illustrated for copper alloy。
Below in conjunction with embodiment, the present invention is described in further detail。
Embodiment 1
1, chemical polishing solution is prepared according to following component:
In every liter of polishing fluid containing: sodium peroxydisulfate 90g, the concentrated sulphuric acid 350ml of 98%, polyethylene glycol 6000 15g, CTAB0.5g, arginine 5g, methionine 5g, sulfosalicylic acid 2g, surplus is water。
2, a kind of chemically polishing method, specifically comprises the following steps that
Copper alloy sample is sequentially carried out oil removing (40g/L sodium carbonate, 35g/L sodium phosphate and 2ml/LOP-10 emulsifying agent, process 1min), flowing water is washed, acid-wash activation (10% sulphuric acid, process 10s), flowing water is washed, then again this sample is placed in the chemical polishing solution of above-mentioned preparation at 40 DEG C and impregnates 8 minutes, solution is carried out agitation as appropriate by chemical polishing process, take out sample clean (flowing water washes+distilled water ultrasonic waves for cleaning), it is sequentially carried out passivation (6g/L BTA again, 20g/L Polyethylene Glycol and 3g/L sulfosalicylic acid, process time 1min), clean (flowing water washes+distilled water ultrasonic waves for cleaning), dry, products obtained therefrom surfacing, light。After chemical polishing, sample roughness is dropped to 0.59 μm by 0.84 μm。
Embodiment 2
1, chemical polishing solution is prepared according to following component:
In every liter of polishing fluid containing: sodium peroxydisulfate 40g, the concentrated sulphuric acid 450ml of 98%, polyethylene glycol 6000 25g, thiourea 3g, cetyl trimethylammonium bromide 0.5g, surplus is water。
2, a kind of chemically polishing method, specifically comprises the following steps that
Copper alloy sample is sequentially carried out oil removing (40g/L sodium carbonate, 35g/L sodium phosphate and 2ml/LOP-10 emulsifying agent, process 1min), flowing water is washed, acid-wash activation (10% sulphuric acid, process 10s), flowing water is washed, then again this sample is placed in the chemical polishing solution of above-mentioned preparation at 40 DEG C and impregnates 6 minutes, solution is carried out agitation as appropriate by chemical polishing process, take out sample clean (flowing water washes+distilled water ultrasonic waves for cleaning), it is sequentially carried out passivation (6g/L BTA again, 20g/L Polyethylene Glycol and 3g/L sulfosalicylic acid, process time 1min), clean (flowing water is washed and distilled water ultrasonic waves for cleaning), dry, products obtained therefrom surfacing, light。After chemical polishing, sample roughness is dropped to 0.07 μm by 0.11 μm。
Embodiment 3
1, chemical polishing solution is prepared according to following component:
Containing sodium peroxydisulfate 60g, the concentrated sulphuric acid 400ml of 98%, polyvinylpyrrolidone 15g/L, CuSO in every liter of polishing fluid45g/L, sulfosalicylic acid 2g/L, arginine 5g/L, CTAB0.5g/L, surplus is water。
2, a kind of chemically polishing method, specifically comprises the following steps that
Copper alloy sample is sequentially carried out oil removing (40g/L sodium carbonate, 35g/L sodium phosphate and 2ml/LOP-10 emulsifying agent, process 1min), flowing water is washed, acid-wash activation (10% sulphuric acid, process 10s), flowing water is washed, then again this sample is placed in the chemical polishing solution of above-mentioned preparation at 40 DEG C and impregnates 9 minutes, solution is carried out agitation as appropriate by chemical polishing process, take out sample clean (flowing water washes+distilled water ultrasonic waves for cleaning), it is sequentially carried out passivation (6g/L BTA again, 20g/L Polyethylene Glycol and 3g/L sulfosalicylic acid, process time 1min), clean (flowing water is washed and distilled water ultrasonic waves for cleaning), dry, products obtained therefrom surfacing, light。After chemical polishing, sample roughness is dropped to 0.48 μm by 0.84 μm。
Embodiment 4
1, chemical polishing solution is prepared according to following component:
In every liter of polishing fluid containing: sodium peroxydisulfate 60g, the concentrated sulphuric acid 400ml of 98%, gelatin 15g, polyethylene glycol 6000 10g, copper sulfate 5g, CTAB0.5g/L, sulfosalicylic acid 3g, surplus is water。
2, a kind of chemically polishing method, specifically comprises the following steps that
Copper alloy sample is sequentially carried out oil removing (40g/L sodium carbonate, 35g/L sodium phosphate and 2ml/LOP-10 emulsifying agent, process 1min), flowing water is washed, acid-wash activation (10% sulphuric acid, process 10s), flowing water is washed, then again this sample is placed in the chemical polishing solution of above-mentioned preparation at 35 DEG C and impregnates 7 minutes, solution is carried out agitation as appropriate by chemical polishing process, take out sample clean (flowing water washes+distilled water ultrasonic waves for cleaning), it is sequentially carried out passivation (6g/L BTA again, 20g/L Polyethylene Glycol and 3g/L sulfosalicylic acid, process time 1min), clean (flowing water is washed and distilled water ultrasonic waves for cleaning), dry, products obtained therefrom surfacing, light。After chemical polishing, sample roughness is dropped to 0.06 μm by 0.11 μm。
Claims (8)
1. a chemical polishing solution, it is characterised in that in every liter of polishing fluid, each constituent content is: persulfate 30～100g, concentrated sulphuric acid 300～500ml, viscosity modifier 10～40g, brightener 2～14g, surplus is water；Described viscosity modifier is one or more in gelatin, Polyethylene Glycol, copper sulfate, cellulose ether, polyvinylpyrrolidone；Described brightener is one or more in thiourea, carbamide, sulfanilamide, arginine, glycine, methionine, BTA, sulfosalicylic acid, citric acid, dodecyl sodium sulfate, cetyl trimethylammonium bromide。
2. chemical polishing solution according to claim 1, it is characterised in that in every liter of polishing fluid, each constituent content is: persulfate 40～90g, concentrated sulphuric acid 350～450ml, viscosity modifier 15～30g, brightener 3.5～10g, surplus is water。
3. chemical polishing solution according to claim 1, it is characterised in that described persulfate is one or more in potassium peroxydisulfate, sodium peroxydisulfate or Ammonium persulfate.。
4. chemical polishing solution according to claim 1, it is characterised in that the mass concentration of described concentrated sulphuric acid is 98%。
5. an alloy surface polishing method, it is characterised in that comprise the following steps:
A. pre-treatment: alloy workpiece is sequentially carried out oil removing, cleaning, acid-wash activation, cleaning；
B. chemical polishing: by above-mentioned after pre-treatment alloy workpiece be placed in the optical polishing liquid described in Claims 1 to 4 any one impregnate；
C. post processing: after having polished, is carried out alloy workpiece according to this, is passivated, cleans, dries。
6. method according to claim 5, it is characterised in that step (2) described dipping is dipping 3～9min at 30～45 DEG C, is stirred in dipping process。
7. the method according to claim 5 or 6, it is characterised in that step (1) described cleaning includes washing and distilled water ultrasonic waves for cleaning；Described oil removing is in the mixed solution of 40g/L sodium carbonate, 35g/L sodium phosphate and 2ml/LOP emulsifying agent, processes 1min。
8. the method according to claim 5 or 6, it is characterised in that step (3) described passivation is in the mixed solution of 6g/L BTA, 20g/L Polyethylene Glycol and 3g/L sulfosalicylic acid, processes 1min。
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| CN111218687B (en) * | 2020-03-30 | 2022-01-21 | 惠州宇盛机械设备有限公司 | Chemical polishing solution for precise copper alloy workpiece |
| CN112458470A (en) * | 2020-11-26 | 2021-03-09 | 佛山市澳璟科技有限公司 | Novel neutral bright cleaning agent and preparation method and use method thereof |
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