CN109514354A - The processing method of semiconductor chip table top - Google Patents
The processing method of semiconductor chip table top Download PDFInfo
- Publication number
- CN109514354A CN109514354A CN201710852669.7A CN201710852669A CN109514354A CN 109514354 A CN109514354 A CN 109514354A CN 201710852669 A CN201710852669 A CN 201710852669A CN 109514354 A CN109514354 A CN 109514354A
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- CN
- China
- Prior art keywords
- chip
- emery wheel
- grinding
- processing method
- table top
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
Abstract
The invention discloses a kind of processing methods of semiconductor chip table top, comprising: the maximum grinding speed x of emery wheel is determined according to the hardness and granular size of emery wheel revolving speed and abrasive material；According to formula 1) v1 2+v2 2≤x2, wherein v2For the closing speed of chip and the emery wheel, v1For chip rotation linear velocity, so that chip is ground with spiral curve track.Using the table top processing method of semiconductor chip disclosed by the invention, it the radial grinding of chip and tangential grinding while carrying out, so that chip is ground with spiral curve track, stress suffered by chip is controlled, to generate serious grinding damage during avoiding chip and emery wheel close or chip spinning, guarantee the high pressure blocking characteristics of chip.
Description
Technical field
The present invention relates to chip manufacture technical fields, more specifically to a kind of processing side of semiconductor chip table top
Method.
Background technique
Existing semiconductor chip table top moulding, by the moulding simultaneously of more oblique angles, mesa width control is accurate, does not easily cause
Chipping, sliver, and can double positive angle moulding semiconductor chip table top formative method.Chip is localized contact emery wheel under which,
The entire table top of chip is gradually ground by way of chip rotation.Which has the following problems:
When chip and emery wheel closing speed are too fast, stock removal that grinding speed does not reach requirement, it will chip is squeezed, to core
Piece causes to damage；
When chip spinning is too fast, stock removal that grinding speed does not reach requirement, it will squeeze chip, chip is caused to damage
Wound；
When chip is in spinning, but carry out simultaneously it is close with emery wheel, if the stock removal that grinding speed does not reach requirement,
Chip will be squeezed, chip is caused to damage.
In conclusion it is more etc. how to efficiently solve between semiconductor chip and emery wheel chip grinding damage in grinding process
Problem is current those skilled in the art's urgent problem.
Summary of the invention
In view of this, the purpose of the present invention is to provide a kind of processing method of semiconductor chip table top, to solve partly to lead
The problems such as chip grinding damage is more in grinding process between body chip and emery wheel.
In order to achieve the above object, the invention provides the following technical scheme:
A kind of processing method of semiconductor chip table top, comprising:
The maximum grinding speed x of emery wheel is determined according to the hardness and granular size of emery wheel revolving speed and abrasive material；
According to formula 1) v1 2+v2 2≤x2,
Wherein, v2For the closing speed of chip and the emery wheel, v1For chip rotation linear velocity, so that chip is with helical curve
Line tracking is ground.
Preferably, the closing speed v of the chip and the emery wheel2:
According to formula 2)
Wherein, ω1For the chip spin velocity, Δ r is the chip and the every circle of emery wheel close to distance.
Preferably, the method also includes:
When the grinding diameter r of the chip reaches preset value, the chip rotation is not less than stopping grinding after a week.
Preferably, the chip rotation linear velocity v1:
According to formula 3) v1=ω1R,
Wherein, ω1For the chip spin velocity, r is the grinding diameter of the chip.
The table top processing method of semiconductor chip provided by the invention, the maximum of emery wheel is determined by emery wheel revolving speed and abrasive material
The closing speed of grinding speed, chip and emery wheel and the quadratic sum of chip rotation linear velocity are not more than the maximum grinding speed of emery wheel
Square.Using the table top processing method of semiconductor chip provided by the invention, the radial grinding of chip and tangential grinding are simultaneously
It carries out, so that chip is ground with spiral curve track, stress suffered by chip is controlled, to avoid chip and emery wheel close or chip
Serious grinding damage is generated during spinning, guarantees the high pressure blocking characteristics of chip.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention for those of ordinary skill in the art without creative efforts, can be with
Other attached drawings are obtained according to these attached drawings.
Fig. 1 is the Working position structural schematic diagram of the processing method of semiconductor chip table top provided in an embodiment of the present invention；
Fig. 2 is the schematic diagram that chip provided in an embodiment of the present invention is ground track.
It is marked in attached drawing as follows:
Chip 1, emery wheel 2.
Specific embodiment
The embodiment of the invention discloses a kind of processing methods of semiconductor chip table top, to solve semiconductor chip and emery wheel
Between the problems such as chip grinding damage is more in grinding process.
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts all other
Embodiment shall fall within the protection scope of the present invention.
Fig. 1-Fig. 2 is please referred to, Fig. 1 is the machining position of the processing method of semiconductor chip table top provided in an embodiment of the present invention
Set structural schematic diagram；Fig. 2 is the schematic diagram that chip provided in an embodiment of the present invention is ground track.
In a kind of specific embodiment, a kind of processing method of semiconductor chip table top provided by the invention, comprising:
S1: the maximum grinding speed x of emery wheel is determined according to the hardness and granular size of emery wheel revolving speed and abrasive material；
S2: according to formula v1 2+v2 2≤x21),
Wherein, v1For chip rotation linear velocity, v2For the closing speed of chip and emery wheel, as shown in Figure 2, wherein A is mill
Track initial point is cut, B is grinding trail termination point, so that chip is ground with spiral curve track.
As shown in Figure 1, the edge of emery wheel is generally groove type, high-hardness grinding material is contained on surface, according to different abrasive materials
Hardness and the size of particle and the revolving speed of emery wheel determine the maximum grinding speed of emery wheel, using semiconductor provided by the invention
It the table top processing method of chip, the radial grinding of chip and tangential grinding while carrying out, so that chip is ground with spiral curve track
It cuts, stress suffered by chip is controlled, to generate serious grinding damage during avoiding chip and emery wheel close or chip spinning
Wound, guarantees the high pressure blocking characteristics of chip.
Specifically, the closing speed v of chip and emery wheel2:
According to formula
Wherein, ω1For chip spin velocity, Δ r is chip and the every circle of emery wheel close to distance.Know chip angle of rotation speed
Degree is fixed value, and chip and the close distance of the every circle of emery wheel are fixed value, and the closing speed of chip and emery wheel can be obtained.
Further, method further include:
When the grinding diameter r of chip reaches preset value r, chip rotation is not less than stopping grinding after a week.
When r reaches preset value, chip reach in advance when rotation is one week less than setting chip and emery wheel close to away from
From v at this time2It is zero, remaining period chip keeps constant with emery wheel distance, and chip will be combined along helix with circular arc line at this time
Trajectory line is ground, which may include roughly grinding and refining combined mode to carry out, i.e., Δ r may be present in grinding process
Different values, Δ r value is smaller in lapping process or Δ r is preferably fixed value, specifically, can be according to actual processing side
Method carries out value.
In one embodiment, it is to be understood that chip rotation linear velocity v1:
According to formula v1=ω1R 3),
Wherein, ω1For chip spin velocity, r is the grinding diameter of chip.In chip grinding process, chip angle of rotation
Speed is constant, the grinding diameter real-time change of chip, it is known that chip rotation linear velocity real-time change, certainly, in other embodiments
In, the linear velocity of chip can also be known according to other way, be within the scope of the invention.
Each embodiment in this specification is described in a progressive manner, the highlights of each of the examples are with it is other
The difference of embodiment, the same or similar parts in each embodiment may refer to each other.
The foregoing description of the disclosed embodiments enables those skilled in the art to implement or use the present invention.
Various modifications to these embodiments will be readily apparent to those skilled in the art, as defined herein
General Principle can be realized in other embodiments without departing from the spirit or scope of the present invention.Therefore, of the invention
It is not intended to be limited to the embodiments shown herein, and is to fit to and the principles and novel features disclosed herein phase one
The widest scope of cause.
Claims (4)
1. a kind of processing method of semiconductor chip table top characterized by comprising
The maximum grinding speed x of emery wheel is determined according to the hardness and granular size of emery wheel revolving speed and abrasive material；
According to formula 1) v1 2+v2 2≤x2,
Wherein, v2For the closing speed of chip and the emery wheel, v1For chip rotation linear velocity, so that chip is with helical curve rail
Mark is ground.
2. processing method according to claim 1, which is characterized in that the closing speed v of the chip and the emery wheel2:
According to formula 2)
Wherein, ω1For the chip spin velocity, Δ r is the chip and the every circle of emery wheel close to distance.
3. processing method according to claim 2, which is characterized in that the method also includes:
When the grinding diameter r of the chip reaches preset value, the chip rotation is not less than stopping grinding after a week.
4. processing method according to claim 3, which is characterized in that the chip rotation linear velocity v1:
According to formula 3) v1=ω1R,
Wherein, ω1For the chip spin velocity, r is the grinding diameter of the chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710852669.7A CN109514354A (en) | 2017-09-19 | 2017-09-19 | The processing method of semiconductor chip table top |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710852669.7A CN109514354A (en) | 2017-09-19 | 2017-09-19 | The processing method of semiconductor chip table top |
Publications (1)
| Publication Number | Publication Date |
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| CN109514354A true CN109514354A (en) | 2019-03-26 |
Family
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| CN201710852669.7A Pending CN109514354A (en) | 2017-09-19 | 2017-09-19 | The processing method of semiconductor chip table top |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1412830A (en) * | 2001-10-19 | 2003-04-23 | 富士通株式会社 | Semiconductor substrate jig and method for manufacturing semiconductor device |
| CN102201340A (en) * | 2011-05-13 | 2011-09-28 | 润奥电子(扬州)制造有限公司 | Double-positive angle mesa forming method for thyristor chip |
| CN102528646A (en) * | 2010-12-31 | 2012-07-04 | 中芯国际集成电路制造(上海)有限公司 | Semiconductor grinding method |
| CN202656028U (en) * | 2012-07-26 | 2013-01-09 | 黄山市七七七电子有限公司 | Conical angle grinder |
| JP5379500B2 (en) * | 2009-01-29 | 2013-12-25 | 株式会社エム・エー・ティ | Semiconductor chip thinning processing apparatus and processing method thereof |
| CN104952719A (en) * | 2014-03-25 | 2015-09-30 | 株洲南车时代电气股份有限公司 | Method for shaping table surface of semiconductor chip |
-
2017
- 2017-09-19 CN CN201710852669.7A patent/CN109514354A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1412830A (en) * | 2001-10-19 | 2003-04-23 | 富士通株式会社 | Semiconductor substrate jig and method for manufacturing semiconductor device |
| JP5379500B2 (en) * | 2009-01-29 | 2013-12-25 | 株式会社エム・エー・ティ | Semiconductor chip thinning processing apparatus and processing method thereof |
| CN102528646A (en) * | 2010-12-31 | 2012-07-04 | 中芯国际集成电路制造(上海)有限公司 | Semiconductor grinding method |
| CN102201340A (en) * | 2011-05-13 | 2011-09-28 | 润奥电子(扬州)制造有限公司 | Double-positive angle mesa forming method for thyristor chip |
| CN202656028U (en) * | 2012-07-26 | 2013-01-09 | 黄山市七七七电子有限公司 | Conical angle grinder |
| CN104952719A (en) * | 2014-03-25 | 2015-09-30 | 株洲南车时代电气股份有限公司 | Method for shaping table surface of semiconductor chip |
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| SE01 | Entry into force of request for substantive examination | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20200928 Address after: 412005 Room 309, floor 3, semiconductor third line office building, Tianxin hi tech park, Shifeng District, Zhuzhou City, Hunan Province Applicant after: Zhuzhou CRRC times Semiconductor Co.,Ltd. Address before: The age of 412001 in Hunan Province, Zhuzhou Shifeng District Road No. 169 Applicant before: ZHUZHOU CRRC TIMES ELECTRIC Co.,Ltd. |
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20190326 |
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