CN109507229B - Device and method for measuring heat conductivity coefficient of thin plate film material - Google Patents
Device and method for measuring heat conductivity coefficient of thin plate film material Download PDFInfo
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- CN109507229B CN109507229B CN201811520164.1A CN201811520164A CN109507229B CN 109507229 B CN109507229 B CN 109507229B CN 201811520164 A CN201811520164 A CN 201811520164A CN 109507229 B CN109507229 B CN 109507229B
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- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N25/00—Investigating or analyzing materials by the use of thermal means
- G01N25/20—Investigating or analyzing materials by the use of thermal means by investigating the development of heat, i.e. calorimetry, e.g. by measuring specific heat, by measuring thermal conductivity
Abstract
The invention provides a device and a method for measuring the heat conductivity coefficient of a thin plate and thin film material, which are suitable for conveniently measuring the heat conductivity coefficient of thin plates and thin film materials with the thickness ranging from 0.2mm to 3.0 mm. When the method is used for measuring the heat conductivity coefficient, a material to be measured and a measuring plate with known heat conductivity coefficient are completely attached and bonded to form a combined test piece, the temperature difference of a sample measuring point under certain heat flux density is measured in the test, the equivalent heat conductivity coefficient of the combined sample is calculated according to the Fourier heat conduction law, and then the heat conductivity coefficient of the material to be measured is obtained through inversion analysis according to the heat conduction law. The defect that the heat conductivity coefficient of thin materials, particularly thin-film materials, is inconvenient to measure is overcome, and the method has the advantages of high efficiency and high accuracy of measurement results.
Description
Technical Field
The invention relates to the technical field of thermal measurement, in particular to a device and a method for measuring the heat conductivity coefficient of a thin plate film material.
Background
In the field of material research and development and application, the thermal conductivity is an important physical parameter in engineering. The heat conductivity of newly researched and to-be-applied thin film thin plate materials is often measured, but the thin film materials are thin, easy to deform and small in heat capacity, and the common simple measurement method has extremely large error and is not suitable for measuring the heat conductivity coefficient of the materials. As the thin film and the thin film material, unstable methods such as a laser method and a hot-wire method can be adopted,
for example, patent document CN207020108U discloses a device for measuring thermal conductivity of a thin film, which includes a substrate, a thin film to be measured, a displacement stage, a photodiode, a visible light source, an infrared camera, a through hole, and a computer, wherein the substrate is made of copper and is located on a sample holder, the thin film to be measured is located on the substrate, the photodiode is connected to the lower side of the displacement stage, the infrared camera is fixed right above the substrate and higher than the displacement stage, the visible light source irradiates from below the substrate, the thin film to be measured and the substrate generate heat flow after absorbing light energy, and the thermal conductivity of the thin film can be obtained by calculating parameters such as temperature increment of the thin film, illumination energy density, light absorption rate of the thin film.
The method has high requirements on equipment, high cost and complicated analysis. The invention adopts the method of measuring the material to be measured and the material with known heat conductivity coefficient in order to measure the thin-plate thin-film material more accurately, thereby reducing the influence of the error in the measuring process on the measuring result and obtaining the more accurate heat conductivity coefficient data of the thin-plate thin-film material.
Disclosure of Invention
Aiming at the defects in the prior art, the invention aims to provide a device and a method for measuring the thermal conductivity of a thin plate film material.
The invention provides a device for measuring the heat conductivity coefficient of a thin plate film material, which comprises a combined test piece, a data processing module and a power supply module; the combined test piece comprises a temperature sensor; the data processing module can process and calculate the temperature data acquired by the temperature sensor; the power module is capable of providing energy.
Preferably, the combined test piece further comprises a heating module, a material to be measured and a measuring plate; the material to be measured is in heat conduction connection with the measuring plate; the heating module is arranged at one end of the material to be measured and the measuring plate which are connected in a heat conduction manner; the end of the combined test piece, which is provided with the heating module, is marked as a heating area, and the end far away from the heating module is marked as a heat dissipation area.
Preferably, the thin plate film material thermal conductivity measuring device provided by the invention further comprises a suspension module and/or a heat dissipation module;
the suspension module is connected with the combined test piece and can suspend the combined test piece;
the heat dissipation module is in thermal contact with the heat dissipation area.
Preferably, the measuring plate is made of a rigid material with a known thermal conductivity; the temperature sensors are arranged at the position of the center line in the measuring plate and are arranged at intervals along the extending direction of the center line.
Preferably, the material to be measured is in heat conduction connection with the measuring plate through heat conducting glue and/or double-sided pressure-sensitive glue, and the ratio of the thickness of the heat conducting glue and/or the double-sided pressure-sensitive glue to the material to be measured is not more than 0.1.
Preferably, the other parts of the combined test piece are integrally coated with a heat insulation material except for the heat dissipation area.
Preferably:
the temperature sensor comprises a thermocouple and/or a thermistor;
the data processing module comprises a computer and/or a data acquisition instrument;
the heating module comprises an electric heating sheet and/or a ceramic heater.
The invention provides a method for measuring the thermal conductivity of a thin plate film material, which comprises the following steps:
manufacturing a combined test piece: selecting a measuring plate which is closest to the thickness of a material to be measured and has the largest heat conductivity coefficient difference, wherein a temperature sensor is additionally arranged in the measuring plate, and a heating module is additionally arranged at one end of the measuring plate; selecting 2 pieces of materials to be detected, bonding the 2 pieces of materials to be detected to the two sides of the measuring plate through adhesives respectively according to the first size of the 2 pieces of materials to be detected, and waiting for the adhesives to be cured; coating the other parts except the heat dissipation area with an insulating layer to prepare a combined test piece;
a measurement system establishing step: the combined test piece is suspended and placed through the suspension module and is connected with the temperature sensor, the heating module, the power supply module, the heat dissipation module and the data processing module;
a measurement step: adjusting the power of the heating module until the set measurement condition is met, and recording the temperature distribution in the combined test piece after the environment to be measured is stable;
repeating the steps: repeatedly executing the measuring step until all the set measuring conditions acquire temperature distribution data;
calculating the heat conductivity coefficient: the data processing module calculates the heat conductivity coefficient of the material to be measured through a first formula according to the data obtained in the measuring step and/or the repeating step;
wherein the first dimension is a measurement plate dimension; the adhesive comprises heat-conducting adhesive and/or double-sided pressure-sensitive adhesive; the measurement environment is stable, namely the temperature of each point is changed by no more than 0.1 ℃ within 1 hour under the condition that the power of the heating module is stable; the first formula is:
wherein, delta1For measuring thickness, λ, of boards1To measure the thermal conductivity of the plate, delta2Is the thickness, lambda, of the material to be measured2Is the thermal conductivity, lambda, of the material to be measured0The fitting value of the heat conductivity coefficient of the combined test piece can be obtained by arranging the relation between the power density of the cross section of the fitted combined test piece and the temperature difference of the measuring point through test data and calculating.
Preferably, the material to be tested is a shaped material with the thickness ranging from 0.2mm to 3.0mm, and the shaped material refers to a material which does not deform in the test process.
Preferably, the data used for calculation is derived from at least 3 stations, the data used for calculation is data obtained by the measuring step and/or the repeating step, and the 1 station is 1 temperature sensor.
Compared with the prior art, the invention has the following beneficial effects:
1. the device for measuring the heat conductivity coefficient of the thin plate film material has the advantages of simple equipment requirement and low cost;
2. the method for measuring the heat conductivity coefficient of the thin plate film material has the advantages of clear and direct analysis process, low calculation complexity and good accuracy;
3. according to the method for measuring the thermal conductivity of the thin plate film material, the influence of errors in the measurement process on the measurement result is effectively reduced by a method for measuring the combination of the material to be measured and the material with the known thermal conductivity.
Drawings
Other features, objects and advantages of the invention will become more apparent upon reading of the detailed description of non-limiting embodiments with reference to the following drawings:
FIG. 1 is a schematic structural diagram of a combined test piece in a thin-plate film material thermal conductivity measurement device provided by the present invention;
fig. 2 is a schematic view of a thermal conductivity measurement device for a thin film material according to the present invention.
The figures show that:
Combined test piece 2
Material to be tested 22
Measuring plate 23
Detailed Description
The present invention will be described in detail with reference to specific examples. The following examples will assist those skilled in the art in further understanding the invention, but are not intended to limit the invention in any way. It should be noted that it would be obvious to those skilled in the art that various changes and modifications can be made without departing from the spirit of the invention. All falling within the scope of the present invention.
The invention provides a device for measuring the heat conductivity coefficient of a thin plate film material, which comprises a combined test piece 2, a data processing module 3 and a power supply module 4; the composite test piece 2 includes a temperature sensor 24; the data processing module 3 can process and calculate the temperature data acquired by the temperature sensor 24; the power module 4 is capable of providing energy.
Preferably, the combined test piece 2 further comprises a heating module 21, a material to be measured 22 and a measuring plate 23; the material to be measured 22 is in heat conduction connection with the measurement plate 23; the heating module 21 is arranged at one end of the material to be measured 22 and the measuring plate 23 which are connected in a heat conduction mode; one end of the combination test piece 2 provided with the heater module 21 is referred to as a heating region 201, and one end thereof distant from the heater module 21 is referred to as a heat radiation region 202. The device for measuring the heat conductivity coefficient of the thin plate film material further comprises a suspension module 1 and/or a heat dissipation module 5; the suspension module 1 is connected with the combined test piece 2 and can suspend the combined test piece 2; the thermal module 5 is in thermal contact with a thermal dissipation area 202. The measuring plate 23 is made of a rigid material with a known thermal conductivity; the temperature sensors 24 are disposed at the center line inside the measuring plate 23 and are arranged at intervals along the extending direction of the center line. The material 22 to be measured is in heat conduction connection with the measurement plate 23 through heat conducting glue and/or double-sided pressure-sensitive glue, and the ratio of the thickness of the heat conducting glue and/or the double-sided pressure-sensitive glue to the material 22 to be measured is not more than 0.1. Except the heat dissipation area 202, the other parts of the combined test piece 2 are all integrally coated with heat insulation materials. The temperature sensor 24 comprises a thermocouple and/or a thermistor; the data processing module 3 comprises a computer and/or a data acquisition instrument; the heating module 21 includes an electric heating sheet and/or a ceramic heater.
According to the invention, the device for measuring the thermal conductivity of the thin plate film material comprises:
manufacturing a combined test piece: selecting a measuring plate 23 which is closest to the thickness of the material 22 to be measured and has the largest difference of heat conductivity coefficients, wherein a temperature sensor 24 is additionally arranged in the measuring plate 23, and a heating module 21 is additionally arranged at one end of the measuring plate 23; selecting 2 pieces of materials to be detected 22, bonding the 2 pieces of materials to be detected 22 to the two sides of the measuring plate 23 through adhesives respectively according to the first size of the 2 pieces of materials to be detected 22, and waiting for the adhesives to be cured; coating the other parts except the heat dissipation area with an insulating layer to prepare a combined test piece 2;
a measurement system establishing step: the combined test piece 2 is suspended and placed through the suspension module 1 and is connected with the temperature sensor 24, the heating module 21, the power supply module 4, the heat dissipation module 5 and the data processing module 3;
a measurement step: adjusting the power of the heating module 21 until the set measurement condition is met, and recording the temperature distribution in the combined test piece 2 after the environment to be measured is stable;
repeating the steps: repeatedly executing the measuring step until all the set measuring conditions acquire temperature distribution data;
calculating the heat conductivity coefficient: the data processing module 3 calculates the heat conductivity coefficient of the material 22 to be measured according to the data obtained in the measuring step and/or the repeating step by a first formula;
wherein the first dimension is the measurement plate 23 dimension; the adhesive comprises heat-conducting adhesive and/or double-sided pressure-sensitive adhesive; the measurement environment is stable, namely the temperature of each point is changed by no more than 0.1 ℃ within 1 hour under the condition that the power of the heating module 21 is stable; the first formula is:
wherein, delta1For measuring the thickness, λ, of the plate 231To measure the thermal conductivity, delta, of the plate 232Is the thickness, λ, of the material 22 to be measured2Is the thermal conductivity, λ, of the material 22 to be measured0The fitting value of the heat conductivity coefficient of the combined test piece 2 can be obtained by arranging the relation between the power density of the cross section of the combined test piece 2 and the temperature difference q-delta t of the measuring point through test data and calculating.
Specifically, the material to be tested 22 is a shaped material with a thickness ranging from 0.2mm to 3.0mm, and the shaped material is a material which does not deform during the test. The data for calculation, which means the data obtained by the measurement step and/or the repetition step, are derived from at least 3 measurement points, and the 1 measurement point means 1 temperature sensor 24.
More particularly, the invention is suitable for conveniently measuring the heat conductivity coefficient of thin plates and thin films with the thickness ranging from 0.2mm to 3.0 mm. When measuring the heat conductivity coefficient, the material to be measured and a measuring plate with known heat conductivity coefficient are completely attached and bonded to form a combined test piece 2, the temperature difference of a sample measuring point under a certain heat flux density is measured in the test, the equivalent heat conductivity coefficient of the combined sample is calculated according to the Fourier heat conduction law, and then the heat conductivity coefficient of the material to be measured is obtained through inversion analysis according to the heat conduction law. The defect that the heat conductivity coefficient of thin materials, particularly thin-film materials, is inconvenient to measure is overcome, and the method has the advantages of high efficiency and high accuracy of measurement results.
The preferred embodiment of the present invention includes a measurement plate 23 with a built-in temperature sensor 24. The material of the measuring plate 23 is a rigid material, and can be a good thermal conductor material of metals such as aluminum, copper and the like, and can also be a poor thermal conductor material of polyimide, ceramic and the like, and the thermal conductivity coefficient data of the material for manufacturing the measuring plate 23 at each temperature is known; during measurement, a material with a larger difference in heat conductivity with the film of the material 22 to be measured is selected as the measurement plate 23. The measurement plate 23 preferably has dimensions of 420mm × 80mm, a thickness of 1mm, 2mm, 3mm, a surface flatness of 200mm × 200 mm: 0.1mm, strictly controlling deformation; during measurement, the measuring plate 23 with the thickness similar to that of the material 22 to be measured is selected as much as possible. A plurality of temperature sensors 24 are arranged in the measuring plate 23 along the central line, the interval is 20 mm-100 mm, preferably 50mm, the temperature sensors 24 are thermocouples, thermistors and the like, the size of the head of each temperature sensor 24 is less than 2mm, and the diameter of an outgoing line is not more than 0.5 mm; the internally-arranged temperature sensor 24 is calibrated, and the deviation of the temperature conversion result and the standard thermometer of the second class is not more than 0.1 ℃. One end part of the measuring plate 23 is a heating area 201, the preferable range is 20mm multiplied by 80mm, and the heating power is applied to the area by means of a film heating sheet and the like; the other end portion of the measurement plate 23 is defined as a heat dissipation area 202, and preferably ranges from 100mm × 80 mm. And the heat is dissipated by adopting the modes of natural convection, connection with a cold plate and the like. The material to be tested 22 is a shaping material, does not deform in the test process, and has the thickness of 0.2 mm-3.0 mm;
further, during the test, the thin film of the material 22 to be measured is cut into two pieces of 400mm × 80mm, and the two pieces of 400mm × 80mm are adhered to the two sides of the measurement plate 23, and the two ends of the material 22 to be measured are flush with the two ends of the measurement plate 23 in the width direction; during measurement, the material to be measured 22 and the two side surfaces of the measurement plate 23 are completely adhered and bonded through heat-conducting glue or double-sided pressure-sensitive glue, and the ratio of the thickness of the glue layer to the thickness of the material to be measured is not more than 1/10. The measurement plate 23 bonded and combined with the material to be measured 22 is integrally coated with a heat insulating material, except for the heat dissipation area 202, and the thickness of the heat insulating material is not less than 10 mm. Acquiring test data by using equipment such as a data acquisition instrument and drawing a temperature distribution real-time curve; when the power is stable, the working condition is considered to be stable when the temperature of each point does not change more than 0.1 ℃ within 1 hour. The positions of the temperature measuring points for calculating the heat conductivity coefficient are within a range of 100 mm-200 mm away from the edge of the heating area 201, the data for analyzing and calculating come from at least 3 measuring points, and the heat conductivity coefficient is analyzed and solved by fitting a temperature distribution rule.
The heat conductivity coefficient measuring method of the preferred scheme comprises the following steps:
s1, manufacturing a combined test piece 2.
Selecting a measuring plate 23 which has the thickness similar to that of a thin plate film of a material 22 to be measured and has larger heat-conducting property difference, and well completing a heating module 21 and a built-in temperature sensor 24 on the plate;
cutting the material 22 to be measured into two pieces of 400mm × 80mm, adhering the two pieces of material to be measured to the two sides of the measuring plate 23 by using heat-conducting adhesive or pressure-sensitive adhesive, and waiting for curing when the adhesive needs to be cured;
except that the 100mm length range of the tail end radiating surface of the combined test piece 2 is used as a radiating surface, the rest of the combined test piece is coated with a heat-insulating layer.
S2, establishing a measurement system
The combined test piece 2 is placed stably in a hanging mode, and the temperature sensor 24, the heating module 21, the voltage-stabilizing direct-current power supply, the data acquisition instrument, the computer, the water chiller and the like are connected.
S3, applying different powers and recording temperature data
Applying different powers to the heating device, and recording the temperature distribution in the test piece at the moment after each working condition is stable.
S4, analyzing and calculating the heat conductivity coefficient
According to the Fourier one-dimensional heat conduction law, the heat conduction coefficient of the combined test piece 2 meets the following requirements:
wherein lambda is the heat conductivity coefficient of the combined test piece 2, d is the distance between the measuring points, delta t is the interval time difference, q is the heat, the relation between the cross section power density of the combined test piece and the temperature difference q-delta t of the measuring points is collated and fitted according to the test data, and the heat conductivity coefficient value lambda is obtained by calculation0。
Calculating the thermal conductivity of the material to be measured according to the following formula:
wherein, delta1For measuring the thickness, λ, of the plate 231To measure the thermal conductivity, delta, of the plate 232Is the thickness, λ, of the material 22 to be measured2Is the thermal conductivity of the material 22 to be measured.
Further, the measurement method of the preferred embodiment of the present invention is as follows:
s1, manufacturing a combined test piece.
The material 22 to be measured is a carbon film material with the thickness of 0.3mm, the heat conductivity coefficient is estimated to be about 1000, a ceramic plate with the thickness of 1mm is selected as the measuring plate 23, the heat conductivity coefficient of the measuring plate 23 is known and is 1.03W/m.K-1The heating module 21 and the built-in temperature sensor 24 on the plate are intact;
cutting the material 22 to be measured into two pieces of 400mm multiplied by 80mm, and adhering and bonding the two pieces of material to be measured on two sides of a measuring plate 23 by using a 16 mu m thick double-sided acrylic pressure-sensitive adhesive;
except that the 100mm length range of the tail end radiating surface of the combined test piece 2 is used as a radiating surface, the rest of the combined test piece is coated with a heat-insulating layer.
S2, establishing a measurement system
The combined test piece 2 is placed stably in a hanging mode, and the temperature sensor 24, the heating module 21, the voltage-stabilizing direct-current power supply, the data acquisition instrument, the computer, the water chiller and the like are connected.
S3, applying different powers and recording temperature data
The heating module 21 applies power of 1W, 3W, 5W, 6W and 7W in sequence, and after each working condition is stable, the temperature distribution in the test piece at the moment is recorded. When the temperature of the measuring point is overhigh, the test working condition of larger power is cancelled.
S4, analyzing and calculating the heat conductivity coefficient
Taking three points 100mm, 150mm and 200mm away from the heating area as calculation points, and combining the heat conductivity coefficients of the test piece according to the Fourier one-dimensional heat conduction law
The thermal conductivity coefficient of the assembly is 284.2W/m.K through data fitting-1
Calculating the thermal conductivity of the material to be measured according to the following formula:
in the description of the present application, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience in describing the present application and simplifying the description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present application.
The foregoing description of specific embodiments of the present invention has been presented. It is to be understood that the present invention is not limited to the specific embodiments described above, and that various changes or modifications may be made by one skilled in the art within the scope of the appended claims without departing from the spirit of the invention. The embodiments and features of the embodiments of the present application may be combined with each other arbitrarily without conflict.
Claims (7)
1. The device for measuring the heat conductivity coefficient of the thin plate film material is characterized by comprising a combined test piece (2), a data processing module (3) and a power supply module (4); the composite test piece (2) comprises a temperature sensor (24); the data processing module (3) can process and calculate temperature data acquired by the temperature sensor (24); the power supply module (4) can provide energy;
the combined test piece (2) further comprises a heating module (21), a material to be tested (22) and a measuring plate (23); the material (22) to be measured is in heat conduction connection with the measuring plate (23); the heating module (21) is arranged at one end of the material to be measured (22) and the measuring plate (23) which are connected in a heat conduction manner; one end, provided with the heating module (21), of the combined test piece (2) is marked as a heating area (201), and one end, far away from the heating module (21), of the combined test piece is marked as a heat dissipation area (202);
the heat dissipation device also comprises a suspension module (1) and/or a heat dissipation module (5);
the suspension module (1) is connected with the combined test piece (2) and can suspend the combined test piece (2);
the heat dissipation module (5) is in thermal contact with a heat dissipation area (202);
the measuring plate (23) is made of a rigid material with a known thermal conductivity coefficient; the temperature sensors (24) are arranged at the position of the center line in the measuring plate (23) and are arranged at intervals along the extending direction of the center line.
2. The thin-plate film material thermal conductivity measurement device according to claim 1, wherein the material to be measured (22) is connected with the measurement plate (23) in a heat conduction mode through heat-conducting glue and/or double-sided pressure-sensitive glue, and the ratio of the thickness of the heat-conducting glue and/or the double-sided pressure-sensitive glue to the material to be measured (22) is not more than 0.1.
3. The thin-plate film material thermal conductivity measuring device according to claim 1, wherein the other portions of the combined test piece (2) except the heat dissipating region (202) are entirely covered with a heat insulating material.
4. The thin-plate film material thermal conductivity measurement device of claim 1, wherein:
the temperature sensor (24) comprises a thermocouple and/or a thermistor;
the data processing module (3) comprises a computer and/or a data acquisition instrument;
the heating module (21) comprises an electric heating sheet and/or a ceramic heater.
5. A method for measuring the thermal conductivity of a thin plate film material is characterized by comprising the following steps:
manufacturing a combined test piece: selecting a measuring plate (23) which is closest to the thickness of a material to be measured (22) and has the largest difference of heat conductivity coefficients, wherein a temperature sensor (24) is additionally arranged in the measuring plate (23), and a heating module (21) is additionally arranged at one end of the measuring plate (23); selecting 2 pieces of materials to be detected (22), bonding the 2 pieces of materials to be detected (22) to the two sides of the measuring plate (23) through adhesives respectively according to the first size of the 2 pieces of materials to be detected (22), and waiting for the adhesives to be cured; coating other parts except the heat dissipation area with a heat insulation layer to prepare a combined test piece (2);
a measurement system establishing step: the combined test piece (2) is suspended and placed through the suspension module (1) and is connected with the temperature sensor (24), the heating module (21), the power supply module (4), the heat dissipation module (5) and the data processing module (3);
a measurement step: adjusting the power of the heating module (21) until a set measurement condition is met, and recording the temperature distribution in the combined test piece (2) after the environment to be measured is stable;
repeating the steps: repeatedly executing the measuring step until all the set measuring conditions acquire temperature distribution data;
calculating the heat conductivity coefficient: the data processing module (3) calculates the heat conductivity coefficient of the material to be measured (22) through a first formula according to the data obtained in the measuring step and/or the repeating step;
wherein the first dimension is a measurement plate (23) dimension; the adhesive comprises heat-conducting adhesive and/or double-sided pressure-sensitive adhesive; the measurement environment is stable, namely the temperature of each point is changed by no more than 0.1 ℃ within 1 hour under the condition that the power of the heating module (21) is stable; the first formula is:
wherein, delta1For measuring the thickness of the plate (23), lambda1To measure the thermal conductivity, delta, of the plate (23)2Is the thickness, lambda, of the material (22) to be measured2Is the thermal conductivity, lambda, of the material (22) to be measured0The fitting value of the heat conductivity coefficient of the combined test piece (2) can be obtained by arranging the relation between the power density of the cross section of the combined test piece (2) and the temperature difference of the measuring points through test data and calculating.
6. The method of claim 5, wherein the material (22) is a shaped material having a thickness in the range of 0.2mm to 3.0mm, wherein the shaped material is a material that does not deform during the test.
7. Method for measuring the thermal conductivity of thin-plate film material according to claim 5 or 6, characterized in that the data used for calculation is derived from at least 3 measuring points, the data used for calculation is the data obtained by the measuring step and/or the repeating step, and 1 measuring point is 1 temperature sensor (24).
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| CN206990483U (en) * | 2017-04-28 | 2018-02-09 | 江门市蓬江区鸿得科技有限公司 | A kind of heat conduction coefficient tester |
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