CN109507229A - Thin plate thin-film material heat conductivity measuring device and measurement method - Google Patents
Thin plate thin-film material heat conductivity measuring device and measurement method Download PDFInfo
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- G01N25/00—Investigating or analyzing materials by the use of thermal means
- G01N25/20—Investigating or analyzing materials by the use of thermal means by investigating the development of heat, i.e. calorimetry, e.g. by measuring specific heat, by measuring thermal conductivity
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Abstract
The present invention provides a kind of thin plate thin-film material heat conductivity measuring device and measurement methods, suitable for more easily measurement thickness in the thin plate of 0.2mm~3.0mm range, the thermal coefficient of film-like materials.When this method heat conducting coefficient measuring, detected materials and measurement plate known to one piece of thermal coefficient are bonded completely and Nian Jie composite test part is made, the sample measuring point temperature difference under certain heat flow density is measured in test, the equivalent heat conductivity that combined sample is calculated according to Fourier Heat Conduction law obtains the thermal coefficient of detected materials by back analysis further according to heat conducting law.Overcome the shortcomings that relatively thin material especially film-like materials thermal coefficient is not easy to measurement, and efficient high, the higher advantage of measurement result accuracy.
Description
Technical field
The present invention relates to thermal measurement technical fields, and in particular, to a kind of thin plate thin-film material thermal conductivity measurement dress
It sets and measurement method.
Background technique
In material development and application field, thermal coefficient is physical parameter important in engineering.It often will be to newly grinding and i.e.
The film light sheet material heating conduction of application is measured, and thin plate thin-film material because of its thinner thickness, be easily deformed, thermal capacitance
Small, common simple measurement method misses by a mile, and is not suitable for the measurement of this kind of material thermal conductivity.For film and film material
Material, what can be taken is the unsteady methods such as laser method, heat-pole method,
A kind of device for measuring film coefficient of heat transfer as disclosed in patent document CN207020108U, including it is substrate, to be measured
Film, displacement platform, photodiode, visible light source, thermal camera, open-work, computer, substrate are made of copper and are located at sample
Frame, film to be measured are located above substrate, and photodiode connects on the downside of displacement platform, thermal camera be fixed on right above substrate and
Higher than displacement platform, it is seen that light source irradiation upwards below substrate, film and substrate to be measured generate hot-fluid after absorbing luminous energy, by right
The calculating of the parameters such as film temperature increment, light energy density, film absorptivity, film thickness can obtain the thermally conductive system of film
Number.
Requirement of the such methods to equipment is very high, and cost is larger, analyzes also more complex.The present invention is to thin plate film class material
Material carries out accurate measurement, using the method for measuring the combination of materials of detected materials and known thermal coefficient, can drop
Influence of the low measurement process error to measurement result obtains the accurate thermal coefficient data of thin plate thin-film material.
Summary of the invention
For the defects in the prior art, the object of the present invention is to provide a kind of thin plate thin-film material thermal conductivity measurement dresses
It sets and measurement method.
A kind of thin plate thin-film material heat conductivity measuring device provided according to the present invention, including composite test part, data
Processing module and power module；The composite test part includes temperature sensor；The data processing module can be to temperature
The temperature data that sensor collects carries out processing calculating；The power module is capable of providing the energy.
Preferably, the composite test part further includes heating module, detected materials and measurement plate；The detected materials with
The thermally conductive connection of measurement plate；One end of thermally conductive connected detected materials and measurement plate is arranged in heating module；The setting of composite test part
There is one end of heating module to be denoted as heating region, one end far from heating module is denoted as heat dissipation region.
Preferably, thin plate thin-film material heat conductivity measuring device provided by the invention further includes suspension module and/or dissipates
Thermal modules；
The suspension module is connected with composite test part, and can suspend composite test part in midair；
The radiating module is thermally contacted with heat dissipation region.
Preferably, measurement plate rigid material as known to thermal coefficient makes；The temperature sensor setting is being surveyed
At where template inside center line, and along center line extending direction arranged for interval.
Preferably, the detected materials pass through heat-conducting glue and/or double-sided pressure-sensitive and the thermally conductive connection of measurement plate, and thermally conductive
The ratio of the thickness and detected materials of glue and/or double-sided pressure-sensitive is not more than 0.1.
Preferably, in addition to heat dissipation region, the equal integral coating of composite test part other parts is by thermal insulation material.
Preferably:
The temperature sensor includes thermocouple and/or thermistor；
The data processing module includes computer and/or data collecting instrument；
The heating module includes electric heating sheets and/or ceramic heater.
A kind of thin plate thin-film material thermal conductivity measurement method provided according to the present invention, comprising:
Composite test part making step: selection is closest with detected materials thickness, and the maximum survey of thermal coefficient difference
Template, wherein reload temperature sensor, measurement plate one end have installed heating module additional in the measurement plate；2 are chosen wait measure and monitor the growth of standing timber
Material, and by the first size of this 2 detected materials, 2 detected materials are then bonded in by measurement plate two by adhesive respectively
Side waits adhesive solidification；Other parts in addition to heat dissipation region are coated with insulating layer, composite test part is made；
Measuring system establishment step: being suspended in midair composite test part by suspension module and placed, connection temperature sensor, heating
Module, power module, radiating module and data processing module；
Measuring process: adjusting the power of heating module until meet the measuring condition of setting, after ambient stable to be measured, note
Record the Temperature Distribution in composite test part；
It repeats step: repeating measuring process, until the measuring condition of all settings achieves temperature profile data；
Thermal coefficient calculates step: the data that data processing module is obtained according to measuring process and/or repetition step pass through
The thermal coefficient of first formula calculating detected materials；
Wherein the first size is measurement board size；The adhesive includes heat-conducting glue and/or double-sided pressure-sensitive；It is described
In the case that measurement ambient stable refers to heating module power stability, each point temperature meets variation in 1 hour and is no more than 0.1 DEG C；
First formula are as follows:
Wherein, δ1For the thickness of measurement plate, λ1For the thermal coefficient of measurement plate, δ2For the thickness of detected materials, λ2It is to be measured
The thermal coefficient of material, λ0For the thermal coefficient match value of composite test part, fitting combination examination can be arranged by test data
It tests the transversal surface power density of part and the relationship of the measuring point temperature difference is calculated.
Preferably, the detected materials are setting material of the thickness range in 0.2mm~3.0mm, and the setting material refers to
The material that deformation occurs during the test.
Preferably, for the data source of calculating at least three measuring point, the data for calculating refer to measuring process
And/or the data that step obtains are repeated, 1 measuring point refers to 1 temperature sensor.
Compared with prior art, the present invention have it is following the utility model has the advantages that
1, thin plate thin-film material heat conductivity measuring device provided by the invention has equipment requirement simple, at low cost
Advantage；
2, thin plate thin-film material thermal conductivity measurement method provided by the invention, analytic process is clearly direct, calculates complicated
Degree is low, and accuracy is good；
3, thin plate thin-film material thermal conductivity measurement method provided by the invention, by by detected materials and known thermally conductive system
The method of several combination of materials measurements, effectively reduces influence of the measurement process error to measurement result.
Detailed description of the invention
Upon reading the detailed description of non-limiting embodiments with reference to the following drawings, other feature of the invention,
Objects and advantages will become more apparent upon:
Fig. 1 is the structural representation of composite test part in thin plate thin-film material heat conductivity measuring device provided by the invention
Figure；
Fig. 2 is thin plate thin-film material heat conductivity measuring device schematic diagram provided by the invention.
It is shown in figure:
Suspension module 1
Composite test part 2
Heating module 21
Detected materials 22
Measurement plate 23
Temperature sensor 24
Heating region 201
Heat dissipation region 202
Data processing module 3
Power module 4
Radiating module 5
Specific embodiment
The present invention is described in detail combined with specific embodiments below.Following embodiment will be helpful to the technology of this field
Personnel further understand the present invention, but the invention is not limited in any way.It should be pointed out that the ordinary skill of this field
For personnel, without departing from the inventive concept of the premise, several changes and improvements can also be made.These belong to the present invention
Protection scope.
A kind of thin plate thin-film material heat conductivity measuring device provided according to the present invention, including composite test part 2, data
Processing module 3 and power module 4；The composite test part 2 includes temperature sensor 24；The data processing module 3 can
Processing calculating is carried out to the temperature data that temperature sensor 24 collects；The power module 4 is capable of providing the energy.
Preferably, the composite test part 2 further includes heating module 21, detected materials 22 and measurement plate 23；It is described to
It measures and monitor the growth of standing timber and expects 22 and the thermally conductive connection of measurement plate 23；The one of thermally conductive connected detected materials 22 and measurement plate 23 is arranged in heating module 21
End；One end that composite test part 2 is provided with heating module 21 is denoted as heating region 201, and one end far from heating module 21 is denoted as
Heat dissipation region 202.Thin plate thin-film material heat conductivity measuring device provided by the invention further includes suspension module 1 and/or heat dissipation
Module 5；The suspension module 1 is connected with composite test part 2, and can suspend composite test part 2 in midair；The radiating module 5 and heat dissipation
Region 202 thermally contacts.The rigid material as known to thermal coefficient of measurement plate 23 production；The setting of temperature sensor 24 exists
At where 23 inside center line of measurement plate, and along center line extending direction arranged for interval.The detected materials 22 pass through heat-conducting glue
And/or double-sided pressure-sensitive and the thermally conductive connection of measurement plate 23, and the thickness of heat-conducting glue and/or double-sided pressure-sensitive and detected materials 22
Ratio be not more than 0.1.In addition to heat dissipation region 202, the equal integral coating of 2 other parts of composite test part is by thermal insulation material.It is described
Temperature sensor 24 includes thermocouple and/or thermistor；The data processing module 3 includes that computer and/or data acquire
Instrument；The heating module 21 includes electric heating sheets and/or ceramic heater.
A kind of thin plate thin-film material thermal conductivity measurement method provided according to the present invention, utilizes above-mentioned thin plate film material
Expect heat conductivity measuring device, comprising:
Composite test part making step: selection is closest with 22 thickness of detected materials, and thermal coefficient difference is maximum
Measurement plate 23, wherein reload temperature sensor 24,23 one end of measurement plate have installed heating module 21 additional in the measurement plate 23；
2 detected materials 22 are chosen, and by the first size of this 2 detected materials 22, then passes through adhesive respectively for 2 wait measure and monitor the growth of standing timber
Material 22 is bonded in 23 two sides of measurement plate, waits adhesive solidification；Other parts in addition to heat dissipation region are coated with insulating layer, are made
At combination testpieces 2；
Measuring system establishment step: being suspended in midair composite test part 2 by suspension module 1 and placed, connection temperature sensor 24,
Heating module 21, power module 4, radiating module 5 and data processing module 3；
Measuring process: the power of adjustment heating module 21 is until meet the measuring condition of setting, after ambient stable to be measured,
Temperature Distribution in record combination testpieces 2；
It repeats step: repeating measuring process, until the measuring condition of all settings achieves temperature profile data；
Thermal coefficient calculates step: the data that data processing module 3 is obtained according to measuring process and/or repetition step are led to
Cross the thermal coefficient that the first formula calculates detected materials 22；
Wherein the first size is 23 size of measurement plate；The adhesive includes heat-conducting glue and/or double-sided pressure-sensitive；Institute
State measurement ambient stable refer to 21 power stability of heating module in the case where, each point temperature meet 1 hour in variation be no more than 0.1
℃；First formula are as follows:
Wherein, δ1For the thickness of measurement plate 23, λ1For the thermal coefficient of measurement plate 23, δ2For the thickness of detected materials 22, λ2
For the thermal coefficient of detected materials 22, λ0For the thermal coefficient match value of composite test part 2, can be arranged by test data quasi-
It is combined the transversal surface power density of testpieces 2 and the relationship of measuring point temperature difference q- Δ t is calculated.
Specifically, the detected materials 22 are setting material of the thickness range in 0.2mm~3.0mm, the setting material
Refer to the material that deformation occurs during the test.Data source for calculating is described for calculating at least three measuring point
Data refer to measuring process and/or repeat the data that step obtains, and 1 measuring point refers to 1 temperature sensor 24.
More specifically, the present invention is suitable for more easily thin plate of the measurement thickness in 0.2mm~3.0mm range, film class
The thermal coefficient of material.When heat conducting coefficient measuring, detected materials are bonded completely with measurement plate known to one piece of thermal coefficient and are glued
It connects and composite test part 2 is made, the sample measuring point temperature difference under certain heat flow density is measured in test, according to Fourier Heat Conduction law meter
The equivalent heat conductivity for calculating combined sample obtains the thermal coefficient of detected materials by back analysis further according to heat conducting law.Gram
The shortcomings that relatively thin material especially film-like materials thermal coefficient is not easy to measurement, and efficient high, measurement result standard are taken
The higher advantage of exactness.
Preference technical solution of the invention includes the measurement plate 23 of one piece of built-in temperature sensor 24.23 material of measurement plate
It can be the metal fevers good conductor materials such as aluminium, copper for rigid material, can also be the hot non-conductor materials such as polyimides, ceramics,
The material of production measurement plate 23 is at each temperature known to thermal coefficient data；When measurement, select and 22 film thermal conductivity of detected materials
The material that can be differed greatly is as measurement plate 23.23 preferred size 420mm × 80mm of measurement plate, with a thickness of 1mm, 2mm, 3mm, table
Facial plane degree 200mm × 200mm:0.1mm, strict control deformation；When measurement, as far as possible similar in selection and 22 thickness of detected materials
Measurement plate 23.If being disposed with dry temperature sensor 24 along center line in the measurement plate 23, it is divided into 20mm~100mm, preferably
50mm, temperature sensor 24 are thermocouple, thermistor etc., and 24 head sizes of temperature sensor are less than 2mm, draw linear diameter not
Greater than 0.5mm；The biography temperature sensor 24 of inside merging is by calibration calibration, temperature transition result and secondary standard thermometer
Deviation is no more than 0.1 DEG C.23 one end partial region of measurement plate is heating region 201, and preferred scope is 20mm × 80mm, and use is thin
The means such as film heating sheet apply thermal power to the region；23 the other end subregion of measurement plate is as heat dissipation region 202, preferably model
It encloses for 100mm × 80mm.It is radiated using modes such as free convection, connection cold plates.The detected materials 22 are setting material,
Deformation occurs during the test, with a thickness of 0.2mm~3.0mm；
Further, when test, the thin plate film of detected materials 22 is cut into two pieces 400mm × 80mm, is pasted onto measurement
23 two sides of plate, detected materials 22 are flushed with 23 width direction both ends of measurement plate；When measurement, detected materials 22 and 23 two sides of measurement plate
Bonding is bonded by heat-conducting glue or double-sided pressure-sensitive completely between face, bondline thickness and detected materials thickness ratio are no more than 1/10.
The measurement plate 23 after combining is bonded in addition to heat dissipation region 202 with detected materials 22, integral coating thermal insulation material, thermal insulation material thickness
Not less than 10mm.The acquisition of test data adopts the equipment such as instrument using number, and draws Temperature Distribution real-time curve；Work as power stability
When, when each point temperature satisfaction changes in 1 hour no more than 0.1 DEG C, it is believed that the operating condition reaches stable.For calculation of thermal conductivity
Temperature point position should be at from the data source within the scope of 201 edge 100mm~200mm of heating region, for analytical calculation
In at least three measuring point, by being fitted temperature distributing rule analysis and solution thermal coefficient.
The thermal conductivity measurement method of this preferred embodiment the following steps are included:
S1. composite test part 2 is made.
, measurement plate 23 that heating conduction differ greatly close with 22 thin plate film thickness of detected materials is chosen, is heated on plate
Module 21 and built-in temperature sensor 24 are intact；
Detected materials 22 are cut into two pieces 400mm × 80mm, is bonded using heat-conducting glue or pressure sensitive adhesive and is bonded in survey
23 two sides of template, adhesive need cured etc. to be solidified；
Composite test part 2 is in addition to end radiating surface 100mm length range is as radiating surface, remaining cladding insulating layer.
S2. measuring system is established
By composite test part 2 take suspention mode place it is safe, temperature sensor 24, heating module 21, pressure stabilizing is straight
The connections such as galvanic electricity source, data collecting instrument, computer, cooling-water machine finish.
S3. apply different capacity, record temperature data
Different capacity is applied to heating device, after each operating condition reaches and stablizes, records Temperature Distribution in testpieces at this time.
S4. analytical calculation thermal coefficient
By Fourier's one-dimensional heat conduction law, the thermal coefficient of composite test part 2 meets:
Wherein λ is the thermal coefficient of composite test part 2, and distance of the d between measuring point, Δ t is that interval time is poor, and q is heat,
The relationship that the fitting transversal surface power density of composite test part and measuring point temperature difference q- Δ t is arranged according to test data, is calculated and leads
Hot coefficient value λ0。
Detected materials thermal coefficient is calculated as follows:
Wherein, δ1For the thickness of measurement plate 23, λ1For the thermal coefficient of measurement plate 23, δ2For the thickness of detected materials 22, λ2
For the thermal coefficient of detected materials 22.
Further, the measurement method of preference of the present invention is as follows:
S1. composite test part is made.
Detected materials 22 are the charcoal membrane material of thickness 0.3mm, and thermal coefficient is estimated 1000 or so, are chosen with a thickness of 1mm
Ceramic wafer as measurement plate 23,23 thermal coefficient of measurement plate it is known that be 1.03W/mK-1, heating module 21 and built-in on plate
Temperature sensor 24 is intact；
Detected materials 22 are cut into two pieces 400mm × 80mm, use the two-sided painting acrylate pressure sensitive adhesive with a thickness of 16 μm
It is bonded and is bonded in 23 two sides of measurement plate；
Composite test part 2 is in addition to end radiating surface 100mm length range is as radiating surface, remaining cladding insulating layer.
S2. measuring system is established
By composite test part 2 take suspention mode place it is safe, temperature sensor 24, heating module 21, pressure stabilizing is straight
The connections such as galvanic electricity source, data collecting instrument, computer, cooling-water machine finish.
S3. apply different capacity, record temperature data
Heating module 21 successively applies the power of 1W, 3W, 5W, 6W, 7W, and after each operating condition reaches and stablizes, record is at this time
Temperature Distribution in testpieces.Pay attention to measuring point when the temperature is excessively high, more powerful operating condition of test is cancelled.
S4. analytical calculation thermal coefficient
Take three points away from heating region 100mm, 150mm, 200mm as calculating point, by Fourier's one-dimensional heat conduction law,
Composite test part thermal coefficient
It is fitted through data, sub-assembly thermal coefficient is 284.2W/mK-1
Detected materials thermal coefficient is calculated as follows:
In the description of the present application, it is to be understood that term " on ", "front", "rear", "left", "right", " is erected at "lower"
Directly ", the orientation or positional relationship of the instructions such as "horizontal", "top", "bottom", "inner", "outside" is orientation based on the figure or position
Relationship is set, description the application is merely for convenience of and simplifies description, rather than the device or element of indication or suggestion meaning are necessary
It with specific orientation, is constructed and operated in a specific orientation, therefore should not be understood as the limitation to the application.
Specific embodiments of the present invention are described above.It is to be appreciated that the invention is not limited to above-mentioned
Particular implementation, those skilled in the art can make a variety of changes or modify within the scope of the claims, this not shadow
Ring substantive content of the invention.In the absence of conflict, the feature in embodiments herein and embodiment can any phase
Mutually combination.
Claims (10)
1. a kind of thin plate thin-film material heat conductivity measuring device, which is characterized in that including composite test part (2), data processing
Module (3) and power module (4)；The composite test part (2) includes temperature sensor (24)；The data processing module
(3) processing calculating can be carried out to the temperature data that temperature sensor (24) collect；The power module (4) is capable of providing
The energy.
2. thin plate thin-film material heat conductivity measuring device according to claim 1, which is characterized in that the composite test
Part (2) further includes heating module (21), detected materials (22) and measurement plate (23)；The detected materials (22) and measurement plate
(23) thermally conductive connection；One end of thermally conductive connected detected materials (22) and measurement plate (23) is arranged in heating module (21)；Combination
One end that testpieces (2) is provided with heating module (21) is denoted as heating region (201), and one end far from heating module (21) is denoted as
Heat dissipation region (202).
3. thin plate thin-film material heat conductivity measuring device according to claim 2, which is characterized in that further include suspension mould
Block (1) and/or radiating module (5)；
The suspension module (1) is connected with composite test part (2), and can suspend composite test part (2) in midair；
The radiating module (5) thermally contacts with heat dissipation region (202).
4. thin plate thin-film material heat conductivity measuring device according to claim 3, which is characterized in that the measurement plate
(23) rigid material as known to thermal coefficient makes；The temperature sensor (24) is arranged in measurement plate (23) inside center line
At place, and along center line extending direction arranged for interval.
5. thin plate thin-film material heat conductivity measuring device according to any one of claim 2 to 4, which is characterized in that
The detected materials (22) by heat-conducting glue and/or double-sided pressure-sensitive and measurement plate (23) thermally conductive connection, and heat-conducting glue and/or
The thickness of double-sided pressure-sensitive and the ratio of detected materials (22) are not more than 0.1.
6. thin plate thin-film material heat conductivity measuring device according to any one of claim 2 to 4, which is characterized in that
In addition to heat dissipation region (202), the equal integral coating of composite test part (2) other parts is by thermal insulation material.
7. thin plate thin-film material heat conductivity measuring device according to any one of claim 2 to 4, it is characterised in that:
The temperature sensor (24) includes thermocouple and/or thermistor；
The data processing module (3) includes computer and/or data collecting instrument；
The heating module (21) includes electric heating sheets and/or ceramic heater.
8. a kind of thin plate thin-film material thermal conductivity measurement method characterized by comprising
Composite test part making step: selection is closest with detected materials (22) thickness, and the maximum survey of thermal coefficient difference
Template (23), wherein reload temperature sensor (24), measurement plate (23) one end have installed heated mould additional in the measurement plate (23)
Block (21)；2 detected materials (22) are chosen, and by the first size of this 2 detected materials (22), then pass through adhesive respectively
2 detected materials (22) are bonded in measurement plate (23) two sides, wait adhesive solidification；By the other parts in addition to heat dissipation region
It is coated with insulating layer, composite test part (2) is made；
Measuring system establishment step: being suspended in midair composite test part (2) by suspension module (1) and placed, and temperature sensor is connected
(24), heating module (21), power module (4), radiating module (5) and data processing module (3)；
Measuring process: the power of adjustment heating module (21) is until meet the measuring condition of setting, after ambient stable to be measured, note
Record the Temperature Distribution in composite test part (2)；
It repeats step: repeating measuring process, until the measuring condition of all settings achieves temperature profile data；
Thermal coefficient calculates step: the data that data processing module (3) is obtained according to measuring process and/or repetition step pass through
First formula calculates the thermal coefficient of detected materials (22)；
Wherein the first size is measurement plate (23) size；The adhesive includes heat-conducting glue and/or double-sided pressure-sensitive；It is described
In the case that measurement ambient stable refers to heating module (21) power stability, each point temperature meets variation in 1 hour and is no more than 0.1
℃；First formula are as follows:
Wherein, δ1For the thickness of measurement plate (23), λ1For the thermal coefficient of measurement plate (23), δ2For the thickness of detected materials (22),
λ2For the thermal coefficient of detected materials (22), λ0For the thermal coefficient match value of composite test part (2), test data can be passed through
It arranges fitting composite test part (2) transversal surface power density and the relationship of the measuring point temperature difference is calculated.
9. thin plate thin-film material thermal conductivity measurement method according to claim 8, which is characterized in that the detected materials
It (22) is setting material of the thickness range in 0.2mm~3.0mm, the setting material refers to what deformation occurs during the test
Material.
10. thin plate thin-film material thermal conductivity measurement method according to claim 8 or claim 9, which is characterized in that for calculating
Data source at least three measuring point, the data for calculating refer to measuring process and/or repeat the number that step obtains
According to 1 measuring point refers to 1 temperature sensor (24).
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| CN201811520164.1A CN109507229B (en) | 2018-12-12 | 2018-12-12 | Device and method for measuring heat conductivity coefficient of thin plate film material |
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| CN201811520164.1A CN109507229B (en) | 2018-12-12 | 2018-12-12 | Device and method for measuring heat conductivity coefficient of thin plate film material |
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| CN110887862A (en) * | 2019-12-29 | 2020-03-17 | 上海锦湖日丽塑料有限公司 | Rapid heat-conducting performance testing device and testing method thereof |
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| CN111879811A (en) * | 2020-06-22 | 2020-11-03 | 国联汽车动力电池研究院有限责任公司 | Battery parameter measuring equipment and method |
| CN113092523A (en) * | 2021-04-07 | 2021-07-09 | 宁波石墨烯创新中心有限公司 | Device and method for testing heat-conducting property of thin-film material |
| CN113125495A (en) * | 2021-03-17 | 2021-07-16 | 北京理工大学 | Method for measuring and correcting thermal conductivity of stacked energetic material |
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