CN109486455A - A kind of novel nano fungus and mildew resistance water-base epoxy joint trimming agent - Google Patents
A kind of novel nano fungus and mildew resistance water-base epoxy joint trimming agent Download PDFInfo
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- CN109486455A CN109486455A CN201710858028.2A CN201710858028A CN109486455A CN 109486455 A CN109486455 A CN 109486455A CN 201710858028 A CN201710858028 A CN 201710858028A CN 109486455 A CN109486455 A CN 109486455A
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- China
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- agent
- component
- fungus
- joint trimming
- mildew resistance
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/0806—Silver
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Agricultural Chemicals And Associated Chemicals (AREA)
Abstract
The present invention relates to the technical fields of building decoration materials, particularly relate to a kind of novel nano fungus and mildew resistance water-base epoxy joint trimming agent, it is made of by volume 1: 1 component A and B component, wherein, weight percentage of each component in the component A are as follows: aqueous epoxy resins 80~90%, diluent 3~5%, anti-yellowing agent 0.01~0.1%, thixotropic agent 2~10% and defoaming agent 0.01~0.05%；The weight percent of each component in B component are as follows: aqueous epoxy curing agent 70~90%, coupling agent 0.01~0.2%, thixotropic agent 2~10%, nano silver 0.1~1.0% and pearlescent pigment 5~20%, water-base epoxy joint trimming agent of the invention has good toughness, adhesive strength height and good surface gloss, especially the addition of nano silver has strong inhibition and killing effect to the tens of kinds of pathogenic microorganisms such as Escherichia coli, gonococcus, chlamydia trachomatis so that the joint trimming agent has excellent antimildew and antibacterial bactericidal effect.
Description
Technical field
The present invention relates to the technical fields of building decoration materials, and in particular to be that a kind of novel nano fungus and mildew resistance is aqueous
Epoxy joint trimming agent.
Background technique
Because ceramic tile is beautiful, is convenient for cleaning, is durable, ceramic tile has become the necessary article of finishing.Traditional tile grout is all
It is cement base, occurs many problems, such as dust deposit in use, cracking picking, dirty black, mould growth etc. is now
As being difficult to clean up, mould growth being easier especially under the wet environments such as kitchen and toilet, this not only affects ceramic tile
Aesthetic effect, mouldy ceramic tile seam the inside also conceal a large amount of pathogenic bacteria for influencing health of people, including Escherichia coli, gold
Staphylococcus aureus, Candida albicans, nail cryptococcus etc..For this phenomenon, occur in the market it is bright such as porcelain, it is not dirty
Black, easy to clean oiliness two-component epoxy joint trimming agent, and color multiplicity, can show difference with the collocation of different ceramic tiles
Beautiful effect！But although to solve ceramic tile gap dirty black for the epoxy joint trimming agent of existing this two-component at present, is not easy
The problem of cleaning.But do not solve the problems, such as that mould breeds fundamentally, while there is also constructions for oiliness two-component epoxy joint trimming agent
It is not easily cleaned in the process, has corrosion to skin, the problems such as to environment not environmentally.
Summary of the invention
The purpose of the present invention is to overcome the above shortcomings and to provide a kind of novel nano fungus and mildew resistance water-base epoxy joint trimming agent,
Decoration space can not only be played the role of using a kind of novel nano fungus and mildew resistance joint trimming agent of the invention, can also be had
Mould in effect inhibition, killing ceramic tile gap, while more environmentally-friendly, simpler convenience of constructing, can clean wiping with water, save
Saving working hour.
The technical scheme adopted by the invention is that such: a kind of novel nano fungus and mildew resistance water-base epoxy joint trimming agent, by
1: 1 component A and B component composition by volume, wherein weight percentage of each component in the component A are as follows: aqueous epoxy resins
80~90%, diluent 3~5%, anti-yellowing agent 0.01~0.1%, thixotropic agent 2~10% and defoaming agent 0.01~0.05%；B
The weight percent of each component in component are as follows: aqueous epoxy curing agent 70~90%, coupling agent 0.01~0.2%, thixotropic agent 2~
10%, nano silver 0.1~1.0% and pearlescent pigment 5~20%.
Further, the aqueous epoxy resins in the component A use low molecular weight hydrophilic epoxy resin, hydrophilic certainly
One or both of emulsion epoxy resin, modified waterborne epoxy lotion.
Further, the diluent in the component A is using one or more of polyalcohol, benzyl alcohol, 692；Institute
The anti-yellowing agent stated is using one or more of in phosphorous acid esters, 1010, UV327, UV326, B75, UV770.
Further, the thixotropic agent in the component A uses organobentonite, fumed silica, polyamide wax, contains
It is one or more of in the oligoamide solution of amine functional group.
Further, the defoaming agent in the component A is using dimethyl silicone polymer, tributyl phosphate or fatty acid gold
Belong to soaps defoaming agent.
Further, the modified amine aqueous epoxy curing agent in the B component is hydrophilic modifying amine, and active hydrogen equivalent weight is
100~200,185~400mgKOH/g of amine value, solid content are 80%~100%；The hydrophilic modifying amine using REX-8648,
One or more of REX-8621, YD1860, YD1850.
Further, coupling agent uses silane coupling agent, titante coupling agent or zirconium class coupling agent in the B component.
Further, thixotropic agent uses organobentonite, fumed silica, polyamide wax, contains amine in the B component
It is one or more of in the oligoamide solution of functional group.
Further, the partial size of the nano silver in the B component is 20nm~100nm.
Further, the preparation method of the fungus and mildew resistance water-base epoxy joint trimming agent, comprising the following steps:
(1) preparation of component A: at room temperature, by aqueous epoxy resins and diluent investment mixing kettle, planet stirring turns
Fast 20-30HZ disperses disk rotating speed 600-800rpm, and defoaming agent and thixotropic agent, planet stirring revolving speed 20- are added after ten minutes
30HZ disperses disk rotating speed 800-1000rpm, addition anti-yellowing agent unlatching vacuum -0.1MPa after 45 minutes, and deaeration 30 minutes, so
Binder packs to obtain component A afterwards；
(2) preparation of B component: at room temperature, aqueous epoxy curing agent, coupling agent are put into mixing kettle, planet stirring
Revolving speed 20-30HZ disperses disk rotating speed 600-800rpm, and nano silver, planet stirring revolving speed 20-30HZ, dispersion are added after ten minutes
Disk rotating speed 300-500rpm, is added pearlescent pigment and thixotropic agent after 15 minutes, planet stirring revolving speed 20-30HZ disperses disk rotating speed
800-1200rpm, unlatching vacuum -0.1MPa after 30 minutes, deaeration 45 minutes；Then the B component of binder packaging；
1: 1 A obtained above, B component are used cooperatively to the water-base epoxy U.S. seam that fungus and mildew resistance can be obtained by volume
Agent.
By using preceding solution, the beneficial effects of the present invention are:
(1) nano mildew-proof of the invention sterilizes water-base epoxy joint trimming agent, due to the antibiotic and sterilizing performance of nano silver, Ke Yiyou
Effect inhibits to kill harmful bacteria, and has spectrum and long-term effect.
(2) nano mildew-proof of the invention sterilizes water-base epoxy joint trimming agent, has better yellowing resistance.
(3) nano mildew-proof of the invention sterilizes water-base epoxy joint trimming agent, more environmentally-friendly compared with oiliness epoxy joint trimming agent,
It to human body and more environment-friendly, operates and constructs and is more convenient, more time saving, construction tool and live more easy to clean are with water
Washable cleaning.
Specific embodiment
The present invention is specifically described with embodiment below, the scope of the present invention should not be limited by the examples.
Embodiment 1-3
The component of the weight fraction of embodiment 1-3 as shown in Table 1 is prepared.
Preparation method the following steps are included:
(1) preparation of component A: at room temperature, by aqueous epoxy resins and diluent investment mixing kettle, planet stirring turns
Fast 20-30HZ disperses disk rotating speed 600-800rpm, and defoaming agent and thixotropic agent, planet stirring revolving speed 20- are added after ten minutes
30HZ disperses disk rotating speed 800-1000rpm, addition anti-yellowing agent unlatching vacuum -0.1MPa after 45 minutes, and deaeration 30 minutes.So
Binder packs to obtain component A afterwards.
(2) preparation of B component: at room temperature, aqueous epoxy curing agent, coupling agent are put into mixing kettle, planet stirring
Revolving speed 20-30HZ disperses disk rotating speed 600-800rpm, and nano silver, planet stirring revolving speed 20-30HZ, dispersion are added after ten minutes
Disk rotating speed 300-500rpm, is added pearlescent pigment and thixotropic agent after 15 minutes, planet stirring revolving speed 20-30HZ disperses disk rotating speed
800-1200rpm, unlatching vacuum -0.1MPa after 30 minutes, deaeration 45 minutes.Then the B component of binder packaging.
1: 1 A obtained above, B component are used cooperatively to the water-base epoxy U.S. seam that fungus and mildew resistance can be obtained by volume
Agent.
The component and mass percent of water-base epoxy joint trimming agent described in 1. embodiment 1-3 of table
Comparative example has only selected at present common oiliness two-component epoxy joint trimming agent on the market, is not added with nanometer silver antimicrobial
Powder.Its concrete composition is shown in Table 2, and preparation step is as follows:
(1) preparation of component A: at room temperature, epoxy resin and diluent are put into mixing kettle, planet stirring revolving speed
20-30HZ disperses disk rotating speed 600-800rpm, after ten minutes addition defoaming agent and thixotropic agent, planet stirring revolving speed 20-30HZ,
Disperse disk rotating speed 800-1000rpm, unlatching vacuum -0.1MPa after 45 minutes, deaeration 30 minutes.Then binder packs to obtain A group
Point.
(2) preparation of B component: at room temperature, modified amine curing agent is put into mixing kettle, planet stirring revolving speed 20-
30HZ disperses disk rotating speed 600-800rpm, and pearlescent pigment and thixotropic agent are added after 15 minutes, and planet stirring revolving speed 20-30HZ divides
Disk rotating speed 800-1200rpm is dissipated, unlatching vacuum -0.1MPa after 30 minutes, deaeration 45 minutes.Then the B component of binder packaging.
By volume 1: 1 by A obtained above, B component with the use of oiliness epoxy joint trimming agent can be obtained.
The component and mass percent of oiliness epoxy joint trimming agent described in 2. comparative example of table
1-3 of the embodiment of the present invention and comparative example the performance test results are shown in Table 3
3. embodiment 1-3 of table and comparative example the performance test results
It can be seen that the present invention by the comparison of embodiment 1-3 and comparative example and be added to nano silver nanometer waterborne epoxy beauty
Stitching agent has sterilization anti-microbial property, and can be wiped and be cleared up with water.
The foregoing is only a preferred embodiment of the present invention, but the scope of the invention is not limited to this.It is any
Within the technical scope of the present disclosure, any changes or substitutions that can be easily thought of should all contain those familiar with the art
Lid is within the scope of the present invention.Therefore, the scope of protection of the invention shall be subject to the scope of protection specified in the patent claim.
Claims (10)
1. a kind of novel nano fungus and mildew resistance water-base epoxy joint trimming agent, it is characterised in that: by by volume 1: 1 component A and B group
Be grouped as, wherein weight percentage of each component in the component A are as follows: aqueous epoxy resins 80~90%, diluent 3~5%,
Anti-yellowing agent 0.01~0.1%, thixotropic agent 2~10% and defoaming agent 0.01~0.05%；The weight percent of each component in B component
Than are as follows: aqueous epoxy curing agent 70~90%, coupling agent 0.01~0.2%, thixotropic agent 2~10%, nano silver 0.1~1.0%
With pearlescent pigment 5~20%.
2. a kind of novel nano fungus and mildew resistance water-base epoxy joint trimming agent according to claim 1, it is characterised in that: the A
Aqueous epoxy resins in component use low molecular weight hydrophilic epoxy resin, hydrophilic self-emulsifying epoxy resin, modified water-soluble
One or both of epoxy emulsion.
3. a kind of novel nano fungus and mildew resistance water-base epoxy joint trimming agent according to claim 1, it is characterised in that: the A
Diluent in component is using one or more of polyalcohol, benzyl alcohol, 692；The anti-yellowing agent uses phosphorous acid
Esters, 1010, it is one or more of in UV327, UV326, B75, UV770.
4. a kind of novel nano fungus and mildew resistance water-base epoxy joint trimming agent according to claim 1, it is characterised in that: the A
Thixotropic agent in component uses organobentonite, fumed silica, polyamide wax, the oligoamide solution containing amine functional group
Middle one or more.
5. a kind of novel nano fungus and mildew resistance water-base epoxy joint trimming agent according to claim 1, it is characterised in that: the A
Defoaming agent in component uses dimethyl silicone polymer, tributyl phosphate or fatty acid metal soaps defoaming agent.
6. a kind of novel nano fungus and mildew resistance water-base epoxy joint trimming agent according to claim 1, it is characterised in that: the B
Modified amine aqueous epoxy curing agent in component is hydrophilic modifying amine, and active hydrogen equivalent weight is 100~200, amine value 185~
400mgKOH/g, solid content are 80%~100%；The hydrophilic modifying amine using REX-8648, REX-8621, YD1860,
One or more of YD1850.
7. a kind of novel nano fungus and mildew resistance water-base epoxy joint trimming agent according to claim 1, it is characterised in that: the B
Coupling agent uses silane coupling agent, titante coupling agent or zirconium class coupling agent in component.
8. a kind of novel nano fungus and mildew resistance water-base epoxy joint trimming agent according to claim 1, it is characterised in that: the B
Thixotropic agent is using in organobentonite, fumed silica, polyamide wax, the oligoamide solution containing amine functional group in component
It is one or more of.
9. a kind of novel nano fungus and mildew resistance water-base epoxy joint trimming agent according to claim 1, it is characterised in that: the B
The partial size of nano silver in component is 20nm~100nm.
10. a kind of preparation method of novel nano fungus and mildew resistance water-base epoxy joint trimming agent, it is characterised in that: the following steps are included:
(1) preparation of component A: at room temperature, aqueous epoxy resins and diluent are put into mixing kettle, planet stirring revolving speed
20-30HZ disperses disk rotating speed 600-800rpm, after ten minutes addition defoaming agent and thixotropic agent, planet stirring revolving speed 20-30HZ,
Disperse disk rotating speed 800-1000rpm, anti-yellowing agent is added after 45 minutes and opens vacuum -0.1MPa, deaeration 30 minutes, then binder
Pack to obtain component A；
(2) preparation of B component: at room temperature, aqueous epoxy curing agent, coupling agent are put into mixing kettle, planet stirring revolving speed
20-30HZ disperses disk rotating speed 600-800rpm, and nano silver, planet stirring revolving speed 20-30HZ are added after ten minutes, and dispersion impeller turns
Fast 300-500rpm, is added pearlescent pigment and thixotropic agent after 15 minutes, planet stirring revolving speed 20-30HZ disperses disk rotating speed 800-
1200rpm, unlatching vacuum -0.1MPa after 30 minutes, deaeration 45 minutes；Then the B component of binder packaging；
1: 1 A obtained above, B component are used cooperatively to the water-base epoxy joint trimming agent that fungus and mildew resistance can be obtained by volume.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710858028.2A CN109486455A (en) | 2017-09-12 | 2017-09-12 | A kind of novel nano fungus and mildew resistance water-base epoxy joint trimming agent |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710858028.2A CN109486455A (en) | 2017-09-12 | 2017-09-12 | A kind of novel nano fungus and mildew resistance water-base epoxy joint trimming agent |
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| CN201710858028.2A Pending CN109486455A (en) | 2017-09-12 | 2017-09-12 | A kind of novel nano fungus and mildew resistance water-base epoxy joint trimming agent |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110423588A (en) * | 2019-08-05 | 2019-11-08 | 上海市建筑科学研究院(集团)有限公司 | A kind of antibacterial gap filler of environment protection damp-proof and preparation method thereof |
| CN110437710A (en) * | 2019-08-16 | 2019-11-12 | 荆晓东 | Silicon-modified epoxy color sand material and preparation method thereof |
| CN111334228A (en) * | 2020-03-25 | 2020-06-26 | 上海域金澜优电子商务有限公司 | Air-purifying and antibacterial water-based crack sealer |
| CN112048264A (en) * | 2020-08-05 | 2020-12-08 | 中山市卡施力顿建材有限公司 | Antibacterial joint mixture and preparation method thereof |
| CN116904152A (en) * | 2023-05-08 | 2023-10-20 | 广东靓砂建材科技有限公司 | Environment-friendly joint beautifying composition for ceramic tiles and preparation method thereof |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110423588A (en) * | 2019-08-05 | 2019-11-08 | 上海市建筑科学研究院(集团)有限公司 | A kind of antibacterial gap filler of environment protection damp-proof and preparation method thereof |
| CN110437710A (en) * | 2019-08-16 | 2019-11-12 | 荆晓东 | Silicon-modified epoxy color sand material and preparation method thereof |
| CN111334228A (en) * | 2020-03-25 | 2020-06-26 | 上海域金澜优电子商务有限公司 | Air-purifying and antibacterial water-based crack sealer |
| CN111334228B (en) * | 2020-03-25 | 2021-08-03 | 上海域金澜优实业有限公司 | Air-purifying and antibacterial water-based crack sealer |
| CN112048264A (en) * | 2020-08-05 | 2020-12-08 | 中山市卡施力顿建材有限公司 | Antibacterial joint mixture and preparation method thereof |
| CN116904152A (en) * | 2023-05-08 | 2023-10-20 | 广东靓砂建材科技有限公司 | Environment-friendly joint beautifying composition for ceramic tiles and preparation method thereof |
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Address after: Room 2332, area h, 2 / F, building 1, 3560 waiqingsong Road, Baihe Town, Qingpu District, Shanghai, 201799 Applicant after: Shanghai Yujin Lanyou Industrial Co., Ltd Address before: 201799 Room 221, 2-storey A District, No. 2628 Baishi Road, Qingpu District, Shanghai Applicant before: SHANGHAI YUJIN LANYOU ELECTRONIC COMMERCE Co.,Ltd. |
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Application publication date: 20190319 |
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