CN109482997A - A kind of circuit board reflow soldering apparatus and technique - Google Patents
A kind of circuit board reflow soldering apparatus and technique Download PDFInfo
- Publication number
- CN109482997A CN109482997A CN201811568790.8A CN201811568790A CN109482997A CN 109482997 A CN109482997 A CN 109482997A CN 201811568790 A CN201811568790 A CN 201811568790A CN 109482997 A CN109482997 A CN 109482997A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- furnace body
- reflow soldering
- welding
- rotary shaft
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/08—Soldering by means of dipping in molten solder
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
- B23K3/082—Flux dispensers; Apparatus for applying flux
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a kind of circuit board reflow soldering apparatus, including, rotary shaft is arranged in furnace body, the both ends on the furnace body, and the rotary shaft is fixed by the bracket on the furnace body, bearing is provided in the rotary shaft, the rotary shaft is connected with driving motor；Transport mechanism, the transport mechanism include conveyor chain, the bearing fixture being placed on the conveyor chain and the limited post set on the conveyor chain both ends；Zeolite case, the zeolite case are placed in the furnace body and are placed between two rotary shafts；Activated carbon adsorption layer is provided on the zeolite chamber interior wall；Welding gun mechanism, the welding gun mechanism are connected with cylinder；The feature that the present invention has structure simple, easy to use, equipment volume is smaller, and welding gun can quickly process workpiece by cylinder driving, not only at low cost, but also effectively increases processing efficiency, practicability with higher；The scaling powder generated in welding process carries out purification removal.
Description
Technical field
The present invention relates to a kind of circuit board reflow soldering apparatus and techniques, belong to circuit board processing and set technical field.
Background technique
Due to the needs that electron product circuit plate is increasingly miniaturized, there is chip component, traditional welding method is not
It adapts to need.With the development of surface mounting technology, the reflow machine as surface mounting technology a part is also obtained accordingly
Development, application is increasingly extensive, has almost all been applied in all electronics fields.In the welding casing of reflow machine
The welding of formation is intracavitary to have heater, passes through the solder(ing) paste and circuit board of fusing to weld intracavitary elements on circuit board
Weld together.
But there is also some disadvantages in actual use for existing solder reflow device, if equipment volume is larger, structure compared with
For complexity, equipment cost is higher, while in the welding process, and the scaling powder of generation not can be removed completely, influences welding circuit board
Quality.
Summary of the invention
The purpose of the present invention is in view of the deficienciess of the prior art, providing a kind of circuit board reflow soldering apparatus and work
Skill, to solve the problems mentioned in the above background technology.
To achieve the above object, the present invention provides a kind of circuit board reflow soldering apparatus, including, furnace body, the furnace body
On both ends rotary shaft is set, the rotary shaft is fixed by the bracket on the furnace body, be provided with bearing in the rotary shaft,
The rotary shaft is connected with driving motor；Transport mechanism, the transport mechanism include conveyor chain, are placed on the conveyor chain
Bearing fixture and limited post set on the conveyor chain both ends；Zeolite case, the zeolite case be placed in the furnace body and
It is placed between two rotary shafts；Activated carbon adsorption layer is provided on the zeolite chamber interior wall；Welding gun mechanism, the welding gun machine
Structure is connected with cylinder, and the cylinder is fixed on the top of the furnace body by mounting base.
As a further improvement of the foregoing solution, gas access and gas vent, the furnace body are provided on the furnace body
On be provided with nitrogen access tube, be provided with nitrogen adjustment valve on the nitrogen access tube.
As a further improvement of the foregoing solution, the welding gun mechanism is positioned close to the side of the furnace body entrance, institute
State the side that zeolite case is positioned close to the furnace body outlet.
As a further improvement of the foregoing solution, the inlet of the zeolite case is provided with a filter screen.
As a further improvement of the foregoing solution, zeolite bottom portion offer accommodate the bearing fixture pass through it is logical
Slot.
A kind of circuit board reflow soldering process, includes the following steps, S1, welding preparation: by mesh on steel net plate by tin
Cream print is placed on circuit board, is detected by visual detection equipment, after detection is errorless, circuit board is placed on and is sent into chip mounter
Patch detects patch result, judges whether attachment deviates, whether there is short circuit, whether there is or not few part or more than one piece；S2, soldering:
Surface mount elements are placed on bearing fixture with circuit board and are entered in reflow soldering apparatus by transport mechanism, welding gun mechanism is passed through
It is welded, forms alloy welding layer on circuit boards；S3, after welding treatment: welded at circuit board pass through transport mechanism
It is exported from coming out for reflow soldering apparatus, the scaling powder steam generated in welding process is sent in zeolite case and is carried out at adsorption cleaning
Reason, active carbon layer are adsorbed onto the special odor in scaling powder steam, and nitrogen is passed through in reflow soldering apparatus, guarantee flux cleaning
Thoroughly.
As a further improvement of the foregoing solution, the scaling powder include organic solvent, activating agent, rosin, thixotropic agent and
Plasticizer.
As a further improvement of the foregoing solution, the welding temperature is 290 DEG C -320 DEG C, weld interval 20s-30s.
As a further improvement of the foregoing solution, the zeolite case is connected with cooling body, and the circuit board after welding is through cold
But it exports afterwards.
The invention has the benefit that this circuit board reflow soldering apparatus and technique have structure simple, it is easy to use
The characteristics of, equipment volume is smaller, and equipment cost is lower, and welding gun can quickly process workpiece by cylinder driving, not only
It is at low cost, and processing efficiency is effectively increased, practicability with higher；The scaling powder generated in welding process is purified
Removal.
Detailed description of the invention
Fig. 1 is a kind of structural schematic diagram of circuit board reflow soldering apparatus provided in an embodiment of the present invention.
The label of each component of attached drawing is as follows:
Furnace body 10；Rotary shaft 11；Bearing 12；Driving motor 13；Nitrogen access tube 14；Nitrogen adjustment valve 15；
Transport mechanism 20；Conveyor chain 21；Bearing fixture 22；Limited post 23；
Zeolite case 30；Activated carbon adsorption layer 31；Filter screen 32.
Specific embodiment
In order to make the object, technical scheme and advantages of the embodiment of the invention clearer, below in conjunction with the embodiment of the present invention
Attached drawing, the technical solution of the embodiment of the present invention is clearly and completely described.Obviously, described embodiment is this hair
Bright a part of the embodiment, instead of all the embodiments.Based on described the embodiment of the present invention, ordinary skill
Personnel's every other embodiment obtained, shall fall within the protection scope of the present invention.
Embodiment 1
As shown in Figure 1, a kind of circuit board reflow soldering apparatus, comprising: furnace body 10, transport mechanism 20, zeolite case 30 and weldering
Gunlock structure.
Specifically, rotary shaft (11) are arranged in the both ends on the furnace body (10), and the rotary shaft (11) is fixed by the bracket
It on the furnace body (10), is provided with bearing (12) on the rotary shaft (11), the rotary shaft (11) and driving motor (13)
It is connected, the starting of driving motor 13 drives the rotary shaft 11 to rotate, and then drives moving horizontally for the transport mechanism 20,
The transport mechanism (20) includes conveyor chain (21), the bearing fixture (22) being placed on the conveyor chain (21) and is set to
The limited post (23) at conveyor chain (21) both ends, for controlling the active strokes of the bearing fixture 22, when the carrying
When jig 22 is moved to the output end of the furnace body (10), the driving motor 13 is inverted, and the bearing fixture 22 resets, described
Zeolite case (30) is placed in the furnace body (10) and is placed between two rotary shafts (11)；On zeolite case (30) inner wall
It is provided with activated carbon adsorption layer (31), the welding gun mechanism is connected with cylinder, and the cylinder is fixed on the furnace by mounting base
The top of body, due to not shown in the diagram using welding gun and cylinder event common in the market.
In the present embodiment, it is provided with gas access and gas vent on the furnace body (10), is arranged on the furnace body (10)
Have nitrogen access tube (14), is provided with nitrogen adjustment valve (15) on the nitrogen access tube (14), is arranged in the furnace body 10
One sensor detects the oxygen content in furnace, and the input quantity of nitrogen is controlled by the nitrogen adjustment valve 15, controls nitrogen
With the ratio of oxygen, and then guarantee welding effect in the welding process, the welding gun mechanism is positioned close to the furnace body
(10) side of entrance, the zeolite case (30) are positioned close to the side of the furnace body (10) outlet, the zeolite case (30)
Inlet be provided with a filter screen (32), zeolite case (30) bottom, which offers, accommodates what the bearing fixture (22) passed through
Through slot.
Embodiment 2
A kind of circuit board reflow soldering process, includes the following steps, welding preparation: first passing through on steel net plate mesh for tin cream
Print is placed on circuit board, is detected by visual detection equipment, after detection is errorless, circuit board is placed on to be sent into chip mounter and is pasted
Piece detects patch result, judges whether attachment deviates, whether there is short circuit, whether there is or not few part or more than one piece；Soldering: it will paste
Piece element is placed on bearing fixture with circuit board and is entered in reflow soldering apparatus by transport mechanism, is carried out by welding gun mechanism
Welding forms alloy welding layer on circuit boards；After welding treatment: welded at circuit board by transport mechanism from Reflow Soldering
Coming out for device exports, and the scaling powder steam generated in welding process is sent to progress adsorption cleaning processing in zeolite case, activity
Layer of charcoal is adsorbed onto the special odor in scaling powder steam, and nitrogen is passed through in reflow soldering apparatus, guarantees flux cleaning thorough.
In the present embodiment, the scaling powder includes organic solvent, activating agent, rosin, thixotropic agent and plasticizer, the welding
Temperature is 290 DEG C -320 DEG C, preferably 300 DEG C, weld interval 20s-30s, preferably 25s, the zeolite case and cooler
Structure is connected, and the circuit board after welding exports after cooling, and final finished outbound enters next process.
To sum up, a kind of circuit board reflow soldering apparatus and technique according to above-described embodiment have structure letter
Single, easy to use feature, equipment volume is smaller, and equipment cost is lower, welding gun by cylinder drive can quickly to workpiece into
Row processing, it is not only at low cost, but also processing efficiency is effectively increased, practicability with higher；What is generated in welding process helps
Solder flux carries out purification removal.
It is obvious to a person skilled in the art that invention is not limited to the details of the above exemplary embodiments, Er Qie
In the case where without departing substantially from spirit or essential attributes of the invention, the present invention can be realized in other specific forms.Therefore, no matter
From the point of view of which point, the present embodiments are to be considered as illustrative and not restrictive, and the scope of the present invention is by appended power
Benefit requires rather than above description limits, it is intended that all by what is fallen within the meaning and scope of the equivalent elements of the claims
Variation is included within the present invention.Any reference signs in the claims should not be construed as limiting the involved claims.
In addition, it should be understood that although this specification is described in terms of embodiments, but not each embodiment is only wrapped
Containing an independent technical solution, this description of the specification is merely for the sake of clarity, and those skilled in the art should
It considers the specification as a whole, the technical solutions in the various embodiments may also be suitably combined, forms those skilled in the art
The other embodiments being understood that.
Claims (9)
1. a kind of circuit board reflow soldering apparatus, it is characterised in that: including,
Rotary shaft (11) are arranged in furnace body (10), the both ends on the furnace body (10), and the rotary shaft (11) is fixed by the bracket
It on the furnace body (10), is provided with bearing (12) on the rotary shaft (11), the rotary shaft (11) and driving motor (13) phase
Even；Transport mechanism (20), the transport mechanism (20) includes conveyor chain (21), the carrying that is placed on the conveyor chain (21)
Jig (22) and the limited post (23) for being set to the conveyor chain (21) both ends；
Zeolite case (30), the zeolite case (30) are placed in the furnace body (10) and are placed between two rotary shafts (11)；
Activated carbon adsorption layer (31) are provided on zeolite case (30) inner wall；
Welding gun mechanism, the welding gun mechanism are connected with cylinder, and the cylinder is fixed on the top of the furnace body by mounting base.
2. a kind of circuit board reflow soldering apparatus according to claim 1, it is characterised in that: be arranged on the furnace body (10)
There are gas access and gas vent, be provided with nitrogen access tube (14) on the furnace body (10), on the nitrogen access tube (14)
It is provided with nitrogen adjustment valve (15).
3. a kind of circuit board reflow soldering apparatus according to claim 1, it is characterised in that: the welding gun mechanism setting exists
Close to the side of the furnace body (10) entrance, the zeolite case (30) is positioned close to the side of the furnace body (10) outlet.
4. a kind of circuit board reflow soldering apparatus according to claim 1, it is characterised in that: zeolite case (30) enter
A filter screen (32) are provided at mouthful.
5. a kind of circuit board reflow soldering apparatus according to claim 1, it is characterised in that: zeolite case (30) bottom
It offers and accommodates the through slot that the bearing fixture (22) passes through.
6. a kind of circuit board reflow soldering process, it is characterised in that: include the following steps,
S1, welding preparation: tin cream print is placed on circuit board by mesh on steel net plate, is examined by visual detection equipment
It surveys, after detection is errorless, circuit board is placed on and is sent into patch in chip mounter, patch result is detected, judge whether attachment is inclined
It moves, whether there is short circuit, whether there is or not few part or more than one piece；
S2, soldering: it surface mount elements is placed on bearing fixture with circuit board and reflux is entered by transport mechanism is welded
In setting, by welding gun, mechanism is welded, and forms alloy welding layer on circuit boards；
S3, after welding treatment: welded at circuit board by transport mechanism from reflow soldering apparatus come out export, will weld
The scaling powder steam generated in journey, which is sent in zeolite case, carries out adsorption cleaning processing, and active carbon layer is adsorbed onto scaling powder steam
Special odor is passed through nitrogen in reflow soldering apparatus, guarantees flux cleaning thorough.
7. a kind of circuit board reflow soldering process according to claim 6, it is characterised in that: the scaling powder includes organic
Solvent, activating agent, rosin, thixotropic agent and plasticizer.
8. a kind of circuit board reflow soldering process according to claim 6, it is characterised in that: the welding temperature is 290
DEG C -320 DEG C, weld interval 20s-30s.
9. a kind of circuit board reflow soldering process according to claim 6, it is characterised in that: the zeolite case and cooler
Structure is connected, and the circuit board after welding exports after cooling.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811568790.8A CN109482997A (en) | 2018-12-21 | 2018-12-21 | A kind of circuit board reflow soldering apparatus and technique |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811568790.8A CN109482997A (en) | 2018-12-21 | 2018-12-21 | A kind of circuit board reflow soldering apparatus and technique |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109482997A true CN109482997A (en) | 2019-03-19 |
Family
ID=65711331
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811568790.8A Pending CN109482997A (en) | 2018-12-21 | 2018-12-21 | A kind of circuit board reflow soldering apparatus and technique |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109482997A (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6146448A (en) * | 1998-11-02 | 2000-11-14 | Soltec B.V. | Flux management system for a solder reflow oven |
| CN101115357A (en) * | 2006-07-26 | 2008-01-30 | 有限会社横田技术 | Counter-current welding equipment and welding flux reclaiming device |
| CN101522305A (en) * | 2006-10-11 | 2009-09-02 | 日挥通用株式会社 | Purifying catalyst for gas within reflow furnace, method for preventing contamination of reflow furnace, and reflow furnace |
| JP2009260097A (en) * | 2008-04-18 | 2009-11-05 | Tottori Univ | Facility for modifying into nitrogen reflow furnace |
| JP2011121111A (en) * | 2009-12-14 | 2011-06-23 | Tamura Seisakusho Co Ltd | Reflow apparatus |
| CN103801780A (en) * | 2012-11-06 | 2014-05-21 | 尔萨有限公司 | Method and cleaning system for cleaning the process gas in soldering installations |
| CN207289104U (en) * | 2017-08-22 | 2018-05-01 | 伊利诺斯工具制品有限公司 | A kind of reflow soldering |
| CN209716701U (en) * | 2018-12-21 | 2019-12-03 | 淮安尚研电子科技有限公司 | A kind of circuit board reflow soldering apparatus |
-
2018
- 2018-12-21 CN CN201811568790.8A patent/CN109482997A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6146448A (en) * | 1998-11-02 | 2000-11-14 | Soltec B.V. | Flux management system for a solder reflow oven |
| CN101115357A (en) * | 2006-07-26 | 2008-01-30 | 有限会社横田技术 | Counter-current welding equipment and welding flux reclaiming device |
| CN101522305A (en) * | 2006-10-11 | 2009-09-02 | 日挥通用株式会社 | Purifying catalyst for gas within reflow furnace, method for preventing contamination of reflow furnace, and reflow furnace |
| JP2009260097A (en) * | 2008-04-18 | 2009-11-05 | Tottori Univ | Facility for modifying into nitrogen reflow furnace |
| JP2011121111A (en) * | 2009-12-14 | 2011-06-23 | Tamura Seisakusho Co Ltd | Reflow apparatus |
| CN103801780A (en) * | 2012-11-06 | 2014-05-21 | 尔萨有限公司 | Method and cleaning system for cleaning the process gas in soldering installations |
| CN207289104U (en) * | 2017-08-22 | 2018-05-01 | 伊利诺斯工具制品有限公司 | A kind of reflow soldering |
| CN209716701U (en) * | 2018-12-21 | 2019-12-03 | 淮安尚研电子科技有限公司 | A kind of circuit board reflow soldering apparatus |
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