CN109473373A - A kind of silicon slice rotating device for digging groove - Google Patents
A kind of silicon slice rotating device for digging groove Download PDFInfo
- Publication number
- CN109473373A CN109473373A CN201710805643.7A CN201710805643A CN109473373A CN 109473373 A CN109473373 A CN 109473373A CN 201710805643 A CN201710805643 A CN 201710805643A CN 109473373 A CN109473373 A CN 109473373A
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- fixed frame
- supporting seat
- rotating device
- silicon slice
- via hole
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 52
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 52
- 239000010703 silicon Substances 0.000 title claims abstract description 52
- 230000005540 biological transmission Effects 0.000 claims abstract description 33
- 230000007246 mechanism Effects 0.000 claims abstract description 16
- 238000005096 rolling process Methods 0.000 claims abstract description 12
- 230000008450 motivation Effects 0.000 claims 1
- 239000012530 fluid Substances 0.000 abstract description 13
- 238000005530 etching Methods 0.000 abstract description 10
- 238000005260 corrosion Methods 0.000 abstract description 7
- 230000007797 corrosion Effects 0.000 abstract description 7
- 230000007306 turnover Effects 0.000 abstract description 3
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 8
- 230000000694 effects Effects 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 239000011521 glass Substances 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- 238000001039 wet etching Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 239000003814 drug Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000003628 erosive effect Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 230000033001 locomotion Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 230000004069 differentiation Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000007717 exclusion Effects 0.000 description 1
- GVVPGTZRZFNKDS-JXMROGBWSA-N geranyl diphosphate Chemical compound CC(C)=CCC\C(C)=C\CO[P@](O)(=O)OP(O)(O)=O GVVPGTZRZFNKDS-JXMROGBWSA-N 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 230000009545 invasion Effects 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 238000005191 phase separation Methods 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 230000011218 segmentation Effects 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30604—Chemical etching
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Weting (AREA)
Abstract
A kind of silicon slice rotating device for digging groove, including groove body, the bottom at the groove body both ends are respectively equipped with fixed frame；Turning supporting seat is equipped on the inside of the fixed frame；The fixed frame is equipped with transmission mechanism, and the transmission mechanism is fixedly connected with the corresponding turning supporting seat；Rolling adjustable-speed motor is equipped with outside the side wall of the groove body both ends, the rolling adjustable-speed motor and the transmission mechanism are sequentially connected；The both ends of the turning supporting seat are respectively equipped with retaining mechanism.The beneficial effect of the application is: driving silicon slice rotating by rotating device, the intracorporal medical fluid of digging groove slot can not only be stirred, it is allowed to more evenly, it can also be by silicon wafer turnover, bottom silicon wafer and top silicon wafer carry out position exchange, take out the silicon wafer for being introduced into medical fluid at first, to guarantee the consistency of silicon slice corrosion time；The uniformity coefficient and the consistency of silicon slice corrosion time of medical fluid are all conducive to reduce the very poor of trench etching depth, to improve whole digging groove quality.
Description
Technical field
The application belongs to silicon wafer wet etching technique field, specifically, being related to a kind of silicon slice rotating for digging groove
Device.
Background technique
GPP is the abbreviation of Glassivation passivation parts, is the general designation of glassivation class device.The production
Product are exactly to fire one layer of glass to the tube core P/N junction surrounding of quasi- segmentation on the basis of existing product ordinary silicon rectified diffusion piece
Glass, glass and monocrystalline silicon have good binding characteristic, and P/N knot is made to obtain optimal protection, from the invasion of external environment, improve
The stability of device, reliability are splendid.
And semiconductor silicon dies etching technique is the important process in semiconductor devices manufacturing process.Silicon wafer by photoetching,
Wet etching is carried out after the process flows such as development.To meet product quality needs, it is desirable that the trench depth for etching formation has
Even property, the differential control of trench depth in piece, between piece and between batch is within 7 μm.At present influence etching depth because being known as:
1, the even concentration of etching groove corrosion medical fluid；2, the uniformity of silicon wafer and medical fluid time of contact.To meet semiconductor product pair
The differential requirement of etching depth just needs designer to take into account above 2 factors of consideration.
The semiconductor wet etching apparatus overwhelming majority on the market increases fast mechanical shaking using static cooling bath at present
Mode performs etching technique, has the disadvantage in that
1, lack liquid medicine flow in stationary groove, only be difficult to keep medical fluid uniform with mechanical handshaking stirring medical fluid；
2, traditional groove body equipment, silicon wafer equal movement without spin in dipper, causes silicon wafer bottom first-in last-out, piece bottom
The trench etch depth in portion is deeper than at the top of piece, and it is differential to influence etching depth.
Summary of the invention
In view of this, the technical problem to be solved by the application is to provide a kind of silicon slice rotating device for digging groove,
Silicon wafer can be rotated in digging groove groove body, so that the silicon wafer for being introduced into groove body takes out at first, different positions are guaranteed with this
The consistency for the silicon chip erosion time set, to reduce the very poor of silicon chip erosion depth.
In order to solve the above-mentioned technical problem, this application discloses a kind of silicon slice rotating devices for digging groove, and use
Following technical scheme is realized.
A kind of silicon slice rotating device for digging groove, the bottom at the groove body both ends of the digging groove are respectively equipped with fixation
Frame；Turning supporting seat is equipped on the inside of the fixed frame；The fixed frame be equipped with transmission mechanism, the transmission mechanism with it is corresponding
The turning supporting seat be fixedly connected；Rolling adjustable-speed motor, the rolling adjustable-speed horse are equipped with outside the side wall of the groove body both ends
It is sequentially connected up to the transmission mechanism；The both ends of the turning supporting seat are respectively equipped with retaining mechanism.
Further, the fixed frame includes vertically disposed first fixed frame and the second fixed frame；Described first is fixed
It is set up in the outside of second fixed frame；The groove body side wall is equipped with via hole, and the shaft of the rolling adjustable-speed motor passes through
It is fixedly connected after the via hole with motor side gear；First fixed frame is equipped with the first via hole；Outside first via hole
Side is equipped with the first transmission gear, and inside is equipped with the second transmission gear；First transmission gear and second transmission gear are logical
First via hole is crossed to be fixedly connected；First transmission gear is connect with the motor side gear by driving belt；It is described
Second fixed frame is equipped with the second via hole；The outside of second via hole is equipped with support end tooth wheel, and inside is equipped with connecting plate；It is described
Connecting plate is fixedly connected with the support end tooth wheel by second via hole, the bottom end of the connecting plate and the turning supporting seat
It is fixedly connected；The support end tooth wheel and second transmission gear are intermeshed.
Further, the turning supporting seat is horizontally disposed.
Further, first fixed frame and second fixed frame are vertically fixed at the groove body inner bottom surface
On.
Further, the retaining mechanism includes the sliding bar being slidably arranged in the turning supporting seat, the sliding bar
Lower end be equipped with sliding block；The sliding block is placed in the draw runner being arranged in the turning supporting seat；The sliding block and the draw runner it
Between be the sliding of high frictional force；The upper end of the sliding bar is connect with locking toggle；It is equipped between the sliding bar at the groove body both ends
Several check lock levers.
Further, the specific structure of the high frictional force sliding is that the sliding block is close to set with the inner wall of the draw runner
It sets.
Further, the specific structure of the high frictional force sliding is that the sliding block is close to set with the inner wall of the draw runner
It sets；The contact surface of the sliding block and the draw runner is rough surface.
Compared with prior art, the application can be obtained including following technical effect: drive silicon wafer rotation by rotating device
Turn, can not only stir the intracorporal medical fluid of digging groove slot, be allowed to more evenly, it can also be by silicon wafer turnover, bottom silicon wafer and top
Silicon wafer carries out position exchange, takes out the silicon wafer for being introduced into medical fluid at first, to guarantee the consistency of silicon slice corrosion time；Medical fluid
Uniformity coefficient and the consistency of silicon slice corrosion time be all conducive to reduce trench etching depth it is very poor, to improve whole ditching
Slot quality.
Certainly, any product for implementing the application must be not necessarily required to reach all the above technical effect simultaneously.
Detailed description of the invention
The drawings described herein are used to provide a further understanding of the present application, constitutes part of this application, this Shen
Illustrative embodiments and their description please are not constituted an undue limitation on the present application for explaining the application.In the accompanying drawings:
Fig. 1 is the application rotary device structure schematic diagram.
Fig. 2 is the application rotating device partial structural diagram.
Fig. 3 is the application turning supporting seat schematic top plan view.
Wherein, in figure:
1, toggle is locked；2, motor side gear；3, rolling adjustable-speed motor；4, driving belt；5, support end tooth wheel；6, first
Transmission gear；7, turning supporting seat；8, the second transmission gear；9, sliding slot；10, check lock lever；11, the first fixed frame；12, second is fixed
Frame.
Specific embodiment
Presently filed embodiment is described in detail below in conjunction with accompanying drawings and embodiments, how the application is applied whereby
Technological means solves technical problem and reaches the realization process of technical effect to fully understand and implement.
As shown in Figs. 1-2, a kind of silicon slice rotating device for digging groove, including groove body, the both ends difference of groove body bottom
Vertically it is fixed with the first fixed frame 11 and the second fixed frame 12.First fixed frame 11 is set to the outside of the second fixed frame 12.Slot
Body sidewall, which is equipped with outside via sidewall, is equipped with rolling adjustable-speed motor 3, the shaft of rolling adjustable-speed motor 3 pass through after via hole with motor
End tooth wheel 2 is fixedly connected.First fixed frame 11 is equipped with the first via hole, and the two sides of the first via hole are respectively equipped with two gears, point
Not Wei first transmission gear 6 in outside and the second transmission gear 8 of inside, the first transmission gear 6 and the second transmission gear 8 are fixed
It is fixedly connected by the first via hole.First transmission gear 6 is connect with motor side gear 2 by driving belt 4.Second fixed frame 12
It is equipped with the second via hole.The outside of second via hole is equipped with support end tooth wheel 5, and inside is equipped with connecting plate, connecting plate and support end tooth
Wheel 5 is fixedly connected by the second via hole, and the bottom end of connecting plate is fixedly connected with turning supporting seat 7.Support end tooth wheel 5 and the second transmission
Gear 8 is intermeshed, and turning supporting seat 7 is horizontally disposed.
Groove body left and right ends are symmetrical structure.
When the rolling adjustable-speed motor 3 at groove body both ends moves at the same time, motor side gear 2 is driven to rotate, driving belt 4 will move
Power passes to the first transmission gear 6, makes its rotation.Knot is fixedly connected with due to the first transmission gear 6 and the second transmission gear 8
Structure, the second transmission gear 8 are rotated with the first transmission gear 6.Again since the second transmission gear 8 and support end tooth wheel 5 are mutually nibbled
It closes, drives support end tooth wheel 5 to be rotated, so that connecting plate and turning supporting seat 7 be driven to be overturn.
As shown in figure 3, rotating device further includes retaining mechanism.Retaining mechanism includes being slidably arranged in turning supporting seat 7
The lower end of sliding bar, sliding bar is equipped with sliding block.The inclined outer fix of two turning supporting seats 7 is equipped with draw runner 9, is placed in draw runner 9
Above-mentioned sliding block.Sliding bar is vertically equipped on sliding block, the upper end of sliding bar and locking toggle 1 pass through the level being set on connecting plate
Strip-shaped hole connection.Several check lock levers are equipped between the sliding bar at both ends.The both ends of draw runner 9 are respectively equipped with a set of retaining mechanism.
When digging groove, the cuboid container for filling silicon wafer is placed in the turning supporting seat 7 at rotating device both ends, shifting is passed through
Dynamic locking toggle drives check lock lever to be moved forward and backward, so that silicon wafer container be clamped.It is high Frictional Slipping between sliding block and draw runner, two
The frictional force at end is greater than the downward power in silicon wafer and container gravity and groove body after medical fluid buoyancy phase separation, to guarantee rotary movement
When silicon wafer and container do not fall out.High Frictional Slipping can pass through the coarse of abutting degree in structure and draw runner slider contact surface
Degree is to adjust.
The beneficial effect of the application is: driving silicon slice rotating by rotating device, can not only stir in digging groove groove body
Medical fluid, be allowed to more evenly, can also be by silicon wafer turnover, bottom silicon wafer and top silicon wafer carry out position exchange, make advanced be used as medicine
The silicon wafer of liquid takes out at first, to guarantee the consistency of silicon slice corrosion time；The uniformity coefficient of medical fluid and silicon slice corrosion time
Consistency is all conducive to reduce the very poor of trench etching depth, to improve whole digging groove quality.
Above to a kind of silicon slice rotating device for digging groove provided by the embodiment of the present application, detailed Jie has been carried out
It continues.The description of the example is only used to help understand the method for the present application and its core ideas；Meanwhile for this field
Those skilled in the art, according to the thought of the application, there will be changes in the specific implementation manner and application range, to sum up institute
It states, the contents of this specification should not be construed as limiting the present application.
As used some vocabulary to censure specific components in the specification and claims.Those skilled in the art answer
It is understood that different vendor may call the same component with different nouns.This specification and claims are not with title
Difference as the mode for distinguishing component, but with the difference of component functionally as the criterion of differentiation.Such as in the whole text
The "comprising" of specification and claim mentioned in is an open language, therefore should be construed to " including but not limited to ".
" substantially " refer within the acceptable error range, those skilled in the art can solve the technology within a certain error range
Problem basically reaches the technical effect.Specification subsequent descriptions are to implement the better embodiment of the application, the right description
It is being not intended to limit the scope of the present application for the purpose of the rule for illustrating the application.The protection scope of the application is when view
Subject to appended claims institute defender.
It should also be noted that, the terms "include", "comprise" or its any other variant are intended to nonexcludability
Include, so that commodity or system including a series of elements not only include those elements, but also including not clear
The other element listed, or further include for this commodity or the intrinsic element of system.In the feelings not limited more
Under condition, the element that is limited by sentence "including a ...", it is not excluded that in the commodity or system for including the element also
There are other identical elements.
Above description shows and describes several preferred embodiments of the present application, but as previously described, it should be understood that the application
Be not limited to forms disclosed herein, should not be regarded as an exclusion of other examples, and can be used for various other combinations,
Modification and environment, and the above teachings or related fields of technology or knowledge can be passed through in application contemplated scope described herein
It is modified.And changes and modifications made by those skilled in the art do not depart from spirit and scope, then it all should be in this Shen
It please be in the protection scope of appended claims.
Claims (7)
1. a kind of silicon slice rotating device for digging groove, it is characterised in that: distinguish the bottom at the groove body both ends of the digging groove
Equipped with fixed frame；Turning supporting seat (7) are equipped on the inside of the fixed frame；The fixed frame is equipped with transmission mechanism, the biography
Motivation structure is fixedly connected with the corresponding turning supporting seat (7)；Rolling adjustable-speed motor is equipped with outside the side wall of the groove body both ends
(3), the rolling adjustable-speed motor (3) and the transmission mechanism are sequentially connected；The both ends of the turning supporting seat (7) are respectively equipped with lock
Tight mechanism.
2. being used for the silicon slice rotating device of digging groove according to claim 1, it is characterised in that: the fixed frame includes vertical
The first fixed frame (11) and the second fixed frame (12) being arranged；First fixed frame (11) is set to second fixed frame (12)
Outside；The groove body side wall is equipped with via hole, the shaft of the rolling adjustable-speed motor (3) pass through after the via hole with motor side
Gear (2) is fixedly connected；First fixed frame (11) is equipped with the first via hole；The outside of first via hole is equipped with first and passes
Moving gear (6), inside are equipped with the second transmission gear (8)；First transmission gear (6) and second transmission gear (8) are logical
First via hole is crossed to be fixedly connected；First transmission gear (6) and the motor side gear (2) pass through driving belt (4)
Connection；Second fixed frame (12) is equipped with the second via hole；The outside of second via hole is equipped with support end tooth wheel (5), interior
Side is equipped with connecting plate；The connecting plate is fixedly connected with the support end tooth wheel (5) by second via hole, the connecting plate
Bottom end be fixedly connected with the turning supporting seat (7)；The support end tooth wheel (5) is mutually nibbled with second transmission gear (8)
It closes.
3. being used for the silicon slice rotating device of digging groove according to claim 1, it is characterised in that: the turning supporting seat (7) is
It is horizontally disposed.
4. being used for the silicon slice rotating device of digging groove according to claim 2, it is characterised in that: first fixed frame (11)
It is vertically fixed on the groove body inner bottom surface with second fixed frame (12).
5. -4 any silicon slice rotating device for being used for digging groove according to claim 1, it is characterised in that: the retaining mechanism
Including the sliding bar being slidably arranged on the turning supporting seat (7), the lower end of the sliding bar is equipped with sliding block；The sliding block is placed in
It is arranged the draw runner (9) on the turning supporting seat (7) Nei；It is high frictional force sliding between the sliding block and the draw runner (9)；Institute
The upper end for stating sliding bar is connect with locking toggle (1)；Several check lock levers are equipped between the sliding bar at the groove body both ends.
6. being used for the silicon slice rotating device of digging groove according to claim 5, it is characterised in that: the high frictional force sliding
Specific structure is that the sliding block is close to setting with the inner wall of the draw runner (9).
7. being used for the silicon slice rotating device of digging groove according to claim 5, it is characterised in that: the high frictional force sliding
Specific structure is that the sliding block is close to setting with the inner wall of the draw runner (9)；The sliding block and the contact surface of the draw runner (9) are equal
For rough surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710805643.7A CN109473373B (en) | 2017-09-08 | 2017-09-08 | Silicon wafer rotating device for trench digging |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710805643.7A CN109473373B (en) | 2017-09-08 | 2017-09-08 | Silicon wafer rotating device for trench digging |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109473373A true CN109473373A (en) | 2019-03-15 |
| CN109473373B CN109473373B (en) | 2024-05-03 |
Family
ID=65658127
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710805643.7A Active CN109473373B (en) | 2017-09-08 | 2017-09-08 | Silicon wafer rotating device for trench digging |
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| CN (1) | CN109473373B (en) |
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| CN109473373B (en) | 2024-05-03 |
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