CN109470698B - Cross-scale inclusion rapid analysis instrument and method based on photomicrography matrix - Google Patents
Cross-scale inclusion rapid analysis instrument and method based on photomicrography matrix Download PDFInfo
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- CN109470698B CN109470698B CN201811131502.2A CN201811131502A CN109470698B CN 109470698 B CN109470698 B CN 109470698B CN 201811131502 A CN201811131502 A CN 201811131502A CN 109470698 B CN109470698 B CN 109470698B
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/01—Arrangements or apparatus for facilitating the optical investigation
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
Abstract
The invention relates to a cross-scale full-automatic inclusion rapid analysis instrument and a method based on a photomicrography matrix. The analytical instrument comprises a photomicrography matrix system, a high-precision three-dimensional numerical control workbench, a calculation workgroup and a control and data processing system; the sample to be detected is a large-size metal component, the photomicrography matrix system can be fixed on the Z axis of the high-precision three-dimensional numerical control workbench in a vertically movable mode, the computing work group controls the displacement of the high-precision three-dimensional numerical control workbench through the control and data processing system, and the position of the sample to be detected is moved step by step, so that the photomicrography matrix system traverses the surface to be detected of all the samples to be detected, full-scale photomicrography of the samples to be detected is achieved, and inclusion searching, area calculation, positioning, hierarchical feature amplification and statistical distribution analysis are carried out. The invention combines the photomicrography matrix and the high-speed operation, has large sample scanning size, high precision and high speed, and obviously improves the impurity analysis efficiency of large-scale samples.
Description
Technical Field
The invention belongs to the technical field of high-flux microscopic characterization of material surfaces, and particularly relates to a cross-scale full-automatic inclusion rapid analysis instrument and method based on a photomicrograph matrix.
Background
The key core component of major engineering is typically a large-scale metal member. The large-scale metal component inclusion is an important factor for the failure of key components in the industries of aviation, high-speed rail and the like. At present, no automatic detection means for directly and rapidly measuring the inclusions of large-scale metal components exists at home and abroad. The conventional optical microscope metallographic method can only detect inclusions on the surface of a metal component with the size within 10mm multiplied by 10mm, a large-scale sample needs to be cut into samples with the size suitable for common metallographic analysis, the processing is time-consuming and labor-consuming, the efficiency is low, and partial surface parameters are possibly distorted due to cutting treatment. Therefore, the common metallographic microscopic technology can only process small-size samples, and cannot obtain metallographic information such as inclusions and the like of cross-scale samples.
Disclosure of Invention
In view of the above technical problems, the present invention aims to provide a cross-scale full-automatic apparatus and method for rapidly analyzing inclusions based on a photomicrograph matrix.
In order to achieve the purpose, the invention provides the following technical scheme:
the invention provides a cross-scale inclusion rapid analysis instrument based on a photomicrography matrix, which comprises a photomicrography matrix system 1, a high-precision three-dimensional numerical control workbench 2, a calculation workgroup and a control and data processing system; the sample 10 to be measured is a large-sized metal member, in which:
the high-precision three-dimensional numerical control working table 2 comprises a horizontal sample table 8 which is precisely moved in the horizontal X-axis and Y-axis directions and used for fixing a sample 10 to be measured and a Z-axis 9 which is perpendicular to the X-axis and Y-axis planes.
The photomicrography matrix system 1 can be fixed on a Z axis 9 of the high-precision three-dimensional numerical control workbench 2 in a vertically moving way and is positioned above a sample 10 to be measured on a horizontal sample table 8; the photomicrographic matrix system 1 includes a plurality of photomicrographic units arranged in an array.
The computing workgroup comprises a server 3, a network exchanger 4 and a plurality of workstations 5; the server 3 is connected with the high-precision three-dimensional numerical control workbench 2, the server 3 is respectively connected with a plurality of workstations 5 through a network exchanger 4, and each workstation 5 is connected with a plurality of photomicrographic units in the photomicrographic matrix system 1.
The calculation work group controls the work of the high-precision three-dimensional numerical control workbench 2 through the control and data processing system, gradually moves the position of the sample 10 to be measured, enables the photomicrography matrix system 1 to traverse the surface to be measured of all the samples 10 to be measured, and the workstations 5 complete the splicing of the images collected by the corresponding photomicrography units, and then the server 3 splices the spliced images of the workstations 5 into a complete metallographic image of the sample 10 to be measured, so that the full-scale photomicrography of the sample 10 to be measured is realized, and the inclusion searching, the area calculation, the positioning, the hierarchical amplification of the appearance and the statistical distribution analysis are carried out.
The analytical instrument has an analytical scale of a sample from millimeter to meter.
In the process that the photomicrography matrix system 1 traverses the surface to be measured of the sample to be measured 10, images of the surface to be measured of the sample to be measured 10, which are shot by all photomicrography units in the photomicrography matrix system 1, are not overlapped.
The sample 10 to be measured is fixed on the horizontal sample stage 8, and the surface to be measured of the sample 10 to be measured is parallel to the horizontal plane.
The photomicrography matrix system 1 can be fixed on the Z axis 9 of the high-precision three-dimensional numerical control workbench 2 through a matrix fixing frame in a vertically movable manner, wherein: the system optical axis of each photomicrographic unit is vertical to the surface to be measured of the sample 10 to be measured, and each photomicrographic unit comprises a photomicrograph 6 and a large-field microscope 7 which are sequentially arranged from top to bottom.
The displacement precision of the high-precision three-dimensional numerical control workbench 2 is in micron order.
The number of the photomicrographic units is set according to the size of the sample 10 to be measured; the number of workstations 5 is set in accordance with the number of photomicrographic units.
The computing workgroup adopts a GPU.
The microscopic camera 6 adopts a CMOS sensor C interface CMOS camera and is provided with a coaxial illumination light source.
The 1 workstation 5 is connected with 8 photomicrographic units; the 48 photomicrographic cell arrays are 12 x 4 matrices.
The maximum analyzable size length multiplied by the width of the sample 10 to be detected which can be detected by the analyzer is 1000mm multiplied by 500mm, and the minimum analyzable size length multiplied by the width is 2mm multiplied by 2 mm.
The analysis instrument can be used for rapidly analyzing the inclusions in large-scale metal components with the size of 1000mm multiplied by 500mm, and the analysis time is less than 1 hour.
The inclusion recognition accuracy of the analysis instrument was 1 micron.
The invention provides a method for using a cross-scale inclusion rapid analysis instrument based on a photomicrograph matrix, a sample 10 to be detected of the method is a large-size metal component, and the method comprises the following steps:
1) fixing a sample 10 to be measured on a horizontal sample table 8 of a high-precision three-dimensional numerical control workbench 2 which can precisely move in the horizontal X-axis and Y-axis directions;
2) fixing a photomicrographic matrix system 1 on a Z axis 9 of a high-precision three-dimensional numerical control workbench 2 in a manner of moving up and down, wherein the photomicrographic matrix system 1 comprises a plurality of photomicrographic units arranged in an array;
3) the computer workgroup is configured as follows: a server 3 is connected with a high-precision three-dimensional numerical control workbench 2, the server 3 is respectively connected with a plurality of workstations 5 through a network exchanger 4, and each workstation 5 is connected with a plurality of photomicrographic units in the photomicrographic matrix system 1;
4) the computing workgroup controls the high-precision three-dimensional numerical control worktable 2 to work through the control and data processing system, gradually moves the position of the sample 10 to be measured, enables the photomicrographic matrix system 1 to traverse the surface to be measured of all the sample 10 to be measured, completes the splicing of the images collected by the corresponding photomicrographic units through the workstations 5, and then splices the spliced images of all the workstations 5 into a complete metallographic image of the sample 10 to be measured through the server 3, so as to realize the full-scale photomicrography of the sample 10 to be measured, and perform inclusion searching, area calculation, positioning, morphology grading amplification and statistical distribution analysis;
the analytical scale of the sample of the analytical method is from millimeter to meter.
In step 1), the surface to be measured of the sample to be measured 10 is parallel to the horizontal plane.
In step 4), during the process that the photomicrography matrix system 1 traverses the surface to be measured of the sample to be measured 10, the images of the surface to be measured of the sample to be measured 10, which are shot by each photomicrography unit in the photomicrography matrix system 1, do not overlap.
In the step 4), the server 3 in the calculation work group sends out a photographing starting command, controls the horizontal sample stage 8 of the high-precision three-dimensional numerical control working table 2 to move to an initial position, controls the corresponding microscopic camera unit to photograph by each working station 5, collects images, and calculates the position and morphological parameters of inclusions in the images;
then, the server 3 sends a moving instruction again, the horizontal sample stage 8 of the high-precision three-dimensional numerical control workbench 2 moves to the next position, each workstation 5 controls the corresponding microscopic camera unit to continue to shoot, images are collected, and the position and morphological parameters of inclusions in the images are calculated;
the server 3 sends out the moving instruction again, and the horizontal sample table 8 of the high-precision three-dimensional numerical control workbench 2 continues to move until the photomicrography matrix system 1 traverses the to-be-measured surfaces of all to-be-measured samples 10;
after all the images of the surface to be measured of the sample 10 to be measured are collected, the workstation 5 splices the images collected by the corresponding photomicrography units, the workstation 5 uploads the images to the server 3 after splicing, meanwhile, the information of positions, shapes, sizes and the like of impurities in different scanning areas in charge of the workstation 5 is transmitted to the server 3, and the server 3 splices the images of the workstation 5 into a complete large-scale metal component metallographic image; and then carrying out integral data processing and inclusion analysis to obtain an electronic metallographic image with full-size inclusion positions, forms, sizes and statistical analysis.
The maximum analyzable size of the sample 10 to be detected by the method is 1000mm multiplied by 500mm in length multiplied by width, and the minimum analyzable size of the sample is 2mm multiplied by 2mm in length multiplied by width.
The method can be used for rapidly analyzing the inclusions of the large-scale metal component with the size of 1000mm multiplied by 500mm, and the analysis time is less than 1 hour.
Compared with the prior art, the invention has the beneficial effects that:
the invention realizes the full-automatic rapid analysis of inclusions on the surface of a large-scale metal component sample of 1000mm multiplied by 500mm by combining a microscopic camera matrix, a high-precision numerical control workbench and high-speed calculation, has the advantages of large sample scanning size, high precision (the minimum can analyze inclusions with the size of 1 micron, the identification precision of the inclusions is 1 micron), high speed (the maximum sample analysis time is less than 1 hour), and the like, and obviously improves the analysis efficiency of the inclusions in the large-scale sample.
Compared with the traditional metallographic analysis technical means, the method greatly improves the size of an analysis sample, improves the analysis efficiency, realizes the automatic characterization function of the impurity distribution analysis on the surface of the large-scale metal component, reduces manual intervention, avoids the problem of partial characterization deletion caused by cutting in the analysis process, improves the analysis accuracy, and realizes comprehensive, rapid analysis and accurate positioning; compared with the prior analysis technology: by building a calculation control local area network (comprising a server and a plurality of workstations), each workstation can be connected with 8 photomicrographic units at most, and 6 workstations can control a matrix formed by 48 photomicrographic units at most; the server is connected with the high-precision numerical control workbench and is connected with the workstation through the network exchanger, so that full-scale photomicrography of the sample is realized, the sample with the length of 1000mm multiplied by 500mm can be scanned maximally, and inclusion searching, area calculation, positioning, morphology grading amplification and statistical distribution analysis are rapidly carried out; the method is favorable for rapidly judging the distribution condition of the inclusions, and is particularly suitable for the application occasions of large-scale metal component machining and detection integration.
Drawings
FIG. 1 is a schematic structural diagram of a cross-scale inclusion rapid analysis system based on a photomicrograph matrix according to the invention;
fig. 2 is a schematic view of the structure of the photomicrograph unit.
Wherein the reference numerals are:
1 photomicrography matrix system
2 high-precision three-dimensional numerical control workbench
3 server
4 network exchanger
5 working station
6 micro-camera
7 large-field microscope
8 horizontal sample platform
9Z axis
10 sample to be tested
Detailed Description
The invention will be further explained with reference to the drawings and an embodiment.
As shown in FIG. 1, the inventive photomicrograph matrix-based cross-scale inclusion rapid analysis instrument comprises: a photomicrography matrix system 1, a high-precision three-dimensional numerical control workbench 2, a calculation work group and a control and data processing system.
The high-precision three-dimensional numerical control workbench 2 controlled by PLC precisely and driven by a lead screw comprises a horizontal sample table 8 which is precisely moved in the horizontal X-axis and Y-axis directions and used for fixing a sample 10 to be tested, and a Z axis 9 which is perpendicular to the X-axis and Y-axis planes. The displacement precision of the high-precision three-dimensional numerical control workbench 2 is in micron order.
The sample 10 to be measured is fixed on the horizontal sample stage 8, and the surface to be measured of the sample to be measured is parallel to the horizontal plane. The sample 10 to be detected is a large-sized metal component, the maximum analyzable dimension length × width of the sample 10 to be detected which can be detected by the analyzer is 1000mm × 500mm, and the minimum analyzable dimension length × width is 2mm × 2 mm.
The photomicrography matrix system 1 is fixedly connected on a Z shaft 9 through a matrix fixing frame in a vertically movable manner and is positioned right above a sample 10 to be detected on a horizontal sample table 8. The photomicrographic matrix system 1 includes a plurality of photomicrographic units arranged in an array, with the system optical axis of each photomicrographic unit being perpendicular to the surface to be measured of the sample 10 to be measured. Wherein each of the photomicrographic units includes a photomicrograph camera 6 and a large-field microscope 7 arranged in sequence from top to bottom, as shown in fig. 2.
The microscopic camera 6 adopts a CMOS sensor C interface CMOS camera and is provided with a coaxial illumination light source.
The computing workgroup includes a server 3, a network switch 4, and a plurality of workstations 5. The server 3 is connected with the high-precision three-dimensional numerical control workbench 2, the server 3 is respectively connected with a plurality of workstations 5 through a network exchanger 4, and each workstation 5 is connected with a plurality of photomicrographic units in the photomicrographic matrix system 1. The calculation work group controls the high-precision three-dimensional numerical control workbench 2 to work (or move) through the control and data processing system, controls and monitors the photomicrography unit of the photomicrography matrix system 1, wherein the photomicrography unit comprises the opening, closing, connection status, parameter setting, real-time image display, calibration, abnormal state monitoring and control of a photomicrograph 6, realizes full-scale photomicrography of a sample to be detected, and carries out inclusion search, area calculation, positioning, hierarchical feature amplification and statistical distribution analysis.
The computing workgroup adopts a GPU.
Preferably, 1 workstation 5 is connected to 8 photomicrographic units. The number of workstations 5 can be adjusted depending on the number of photomicrographic units. The 48 photomicrographic cell arrays are 12 x 4 matrices. The number of the photomicrographic units may be adjusted depending on the size of the sample 10 to be measured.
The cross-scale full-automatic inclusion rapid analysis instrument based on the photomicrographic matrix can rapidly analyze the inclusions of a large-scale metal component sample of 1000mm multiplied by 500mm, and the analysis time is less than 1 hour.
The working process of the invention is as follows:
the sample 10 to be measured is fixed on the horizontal sample table 8 of the high-precision numerical control workbench 2, and the surface to be measured of the sample 10 to be measured is parallel to the horizontal plane.
The server 3 sends out a calibration command through a control and data processing system, and angle and position coordinates of the connected photomicrography units are calibrated sequentially through the workstation 5; the workstation 5 starts a self-test program to detect the state of the analyzer, and adjusts the focal length of the large-field microscope 7 to the optimal position through the Z axis 9 of the high-precision numerical control workbench 2.
The server 3 sends a photographing starting command, controls the horizontal sample stage 8 of the high-precision three-dimensional numerical control workbench 2 to move to an initial position, controls the corresponding microscopic camera unit to photograph by each workstation 5, records images, and calculates the position, form and other parameters of impurities in the images;
then, the server 3 sends a moving instruction again, the horizontal sample stage 8 of the high-precision three-dimensional numerical control workbench 2 moves to the next position, each workstation 5 controls the corresponding microscopic camera unit to continue to shoot, images are collected, and the position and morphological parameters of inclusions in the images are calculated;
the server 3 sends out the moving instruction again, and the horizontal sample table 8 of the high-precision three-dimensional numerical control workbench 2 continues to move until the photomicrography matrix system 1 traverses the to-be-measured surfaces of all to-be-measured samples 10;
after all the images of the surface to be measured of the sample 10 to be measured are collected, all the workstations 5 start to splice the images collected by the corresponding photomicrographic units, after the splicing is finished, all the workstations 5 upload the images to the server 3, simultaneously, the information of the positions, the shapes, the sizes and the like of impurities in different scanning areas in charge of all the workstations 5 is transmitted to the server 3, and the server 3 splices the images of all the workstations 5 into a complete large-scale metal component metallographic image; then, integral data processing and inclusion analysis are carried out.
While the invention has been described with reference to specific embodiments thereof, it will be understood by those skilled in the art that various changes and modifications may be made therein without departing from the spirit and scope of the invention as defined in the appended claims.
Claims (15)
1. A cross-scale inclusion rapid analysis instrument based on a photomicrography matrix is characterized in that: the analytical instrument comprises a photomicrography matrix system (1), a high-precision three-dimensional numerical control workbench (2), a calculation workgroup and a control and data processing system; the sample (10) to be measured is a large-sized metal member, wherein:
the high-precision three-dimensional numerical control workbench (2) comprises a horizontal sample table (8) which is precisely moved in the horizontal X-axis and Y-axis directions and used for fixing a sample (10) to be measured and a Z-axis (9) which is vertical to the X-axis and Y-axis planes;
the photomicrography matrix system (1) can be fixed on a Z axis (9) of the high-precision three-dimensional numerical control workbench (2) in a vertically moving mode and is positioned above a sample (10) to be detected on the horizontal sample table (8); the photomicrographic matrix system (1) comprises a plurality of photomicrographic units arranged in an array;
each microscopic photographing unit comprises a microscopic camera (6) and a large-field microscope (7) which are sequentially arranged from top to bottom;
the computing work group comprises a server (3), a network exchanger (4) and a plurality of workstations (5); the server (3) is connected with the high-precision three-dimensional numerical control workbench (2), the server (3) is respectively connected with a plurality of workstations (5) through a network exchanger (4), and each workstation (5) is connected with a plurality of photomicrographic units in the photomicrographic matrix system (1);
the computing work group controls the work of the high-precision three-dimensional numerical control workbench (2) through the control and data processing system, gradually moves the position of the sample (10) to be detected, enables the photomicrography matrix system (1) to traverse the surface to be detected of all the samples (10) to be detected, and the workstations (5) to complete the splicing of the images collected by the corresponding photomicrography units, and then the server (3) splices the spliced images of the workstations (5) into a complete metallographic image of the sample (10) to be detected, so that the full-scale photomicrography of the sample (10) to be detected is realized, and the inclusion searching, the area computing, the positioning, the morphology grading amplification and the statistical distribution analysis are carried out;
the analysis instrument analyzes the sample with the dimension from millimeter to meter;
the analytical instrument can rapidly analyze inclusions in large-scale metal components with the size of 1000mm multiplied by 500mm, and the analysis time is less than 1 hour;
the inclusion recognition accuracy of the analysis instrument was 1 micron.
2. The apparatus for rapidly analyzing trans-scale inclusions based on a photomicrographic matrix as claimed in claim 1 wherein: in the process that the photomicrography matrix system (1) traverses the surface to be measured of the sample to be measured (10), images of the surface to be measured of the sample to be measured (10) shot by all photomicrography units in the photomicrography matrix system (1) are not overlapped.
3. The apparatus for rapidly analyzing trans-scale inclusions based on a photomicrographic matrix as claimed in claim 1 wherein: the sample (10) to be measured is fixed on the horizontal sample table (8), and the surface to be measured of the sample (10) to be measured is parallel to the horizontal plane.
4. The apparatus for rapidly analyzing trans-scale inclusions based on a photomicrographic matrix as claimed in claim 1 wherein: the photomicrography matrix system (1) can be fixed on a Z axis (9) of the high-precision three-dimensional numerical control workbench (2) through a matrix fixing frame in a vertically movable manner, wherein: the system optical axis of each photomicrographic unit is perpendicular to the surface to be measured of the sample (10) to be measured.
5. The apparatus for rapidly analyzing trans-scale inclusions based on a photomicrographic matrix as claimed in claim 1 wherein: the displacement precision of the high-precision three-dimensional numerical control workbench (2) is micron-sized.
6. The apparatus for rapidly analyzing trans-scale inclusions based on a photomicrographic matrix as claimed in claim 1 wherein: the number of the photomicrographic units is set according to the size of the sample (10) to be measured; the number of workstations (5) is set according to the number of photomicrographic units.
7. The apparatus for rapidly analyzing trans-scale inclusions based on a photomicrographic matrix as claimed in claim 1 wherein: the computing workgroup adopts a GPU.
8. The apparatus for rapidly analyzing trans-scale inclusions based on a photomicrographic matrix as claimed in claim 1 wherein: the microscope camera (6) adopts a CMOS sensor C interface CMOS camera and is provided with a coaxial illumination light source.
9. The apparatus for rapidly analyzing trans-scale inclusions based on a photomicrographic matrix as claimed in claim 1 wherein: 1 workstation (5) is connected with 8 photomicrographic units; the 48 photomicrographic cell arrays are 12 x 4 matrices.
10. The apparatus for rapidly analyzing trans-scale inclusions based on a photomicrographic matrix as claimed in claim 1 wherein: the maximum analyzable size length multiplied by the width of a sample (10) to be detected which can be detected by the analyzer is 1000mm multiplied by 500mm, and the minimum analyzable size length multiplied by the width is 2mm multiplied by 2 mm.
11. A method of using a photomicrographic matrix based rapid trans-scale inclusion analysis instrument according to any of claims 1-10, characterized in that: the method is characterized in that a sample (10) to be measured is a large-size metal component, and comprises the following steps:
1) fixing a sample (10) to be measured on a horizontal sample table (8) of a high-precision three-dimensional numerical control workbench (2) capable of precisely moving in the horizontal X-axis and Y-axis directions;
2) fixing a photomicrography matrix system (1) on a Z axis (9) of a high-precision three-dimensional numerical control workbench (2) in a manner of moving up and down, wherein the photomicrography matrix system (1) comprises a plurality of photomicrography units arranged in an array;
3) the computer workgroup is configured as follows: a server (3) is connected with a high-precision three-dimensional numerical control workbench (2), the server (3) is respectively connected with a plurality of workstations (5) through a network exchanger (4), and each workstation (5) is connected with a plurality of photomicrographic units in a photomicrographic matrix system (1);
4) the computing work group controls the high-precision three-dimensional numerical control workbench (2) to work through the control and data processing system, the position of a sample (10) to be detected is gradually moved, the photomicrography matrix system (1) traverses the surface to be detected of all the samples (10) to be detected, the workstations (5) complete the splicing of the images collected by the corresponding photomicrography units, the server (3) splices the spliced images of the workstations (5) into a complete metallographic image of the sample (10) to be detected, the full-scale photomicrography of the sample (10) to be detected is realized, and inclusion searching, area computing, positioning, morphology grading amplification and statistical distribution analysis are carried out;
the analysis scale of the sample in the analysis method is from millimeter level to meter level;
the method can be used for rapidly analyzing the inclusions of the large-scale metal component with the size of 1000mm multiplied by 500mm, and the analysis time is less than 1 hour.
12. The method of claim 11, wherein: in step 1), the surface to be measured of the sample (10) to be measured is parallel to a horizontal plane.
13. The method of claim 11, wherein: in the step 4), in the process that the photomicrography matrix system (1) traverses the surface to be measured of the sample to be measured (10), images of the surface to be measured of the sample to be measured (10) shot by all photomicrography units in the photomicrography matrix system (1) are not overlapped.
14. The method of claim 11, wherein: in the step 4), a server (3) in the calculation work group sends a photographing starting command, a horizontal sample table (8) of a high-precision three-dimensional numerical control working table (2) is controlled to move to an initial position, each working station (5) controls a corresponding microscopic camera unit to photograph, images are collected, and the positions and morphological parameters of inclusions in the images are calculated;
then, the server (3) sends a moving instruction again, the horizontal sample stage (8) of the high-precision three-dimensional numerical control workbench (2) moves to the next position, each workstation (5) controls the corresponding microscopic camera unit to continue to photograph, acquire images and calculate the positions and morphological parameters of inclusions in the images;
the server (3) sends a moving instruction again, and the horizontal sample table (8) of the high-precision three-dimensional numerical control workbench (2) continues to move until the photomicrography matrix system (1) traverses the surfaces to be measured of all samples to be measured (10);
after all images of the surface to be detected of a sample (10) to be detected are collected, the work stations (5) are spliced with the images collected by the corresponding photomicrography units, the work stations (5) upload the images to the server (3) after the splicing is finished, meanwhile, the information of positions, shapes, sizes and the like of impurities in different scanning areas which are responsible for the work stations (5) is transmitted to the server (3), and the server (3) splices the images of the work stations (5) into a complete large-scale metal component metallographic image; and then carrying out integral data processing and inclusion analysis to obtain an electronic metallographic image with full-size inclusion positions, forms, sizes and statistical analysis.
15. The method of claim 11, wherein: the maximum analyzable size of the sample (10) to be detected by the method is 1000mm multiplied by 500mm, and the minimum analyzable size is 2mm multiplied by 2 mm.
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| CN201811131502.2A CN109470698B (en) | 2018-09-27 | 2018-09-27 | Cross-scale inclusion rapid analysis instrument and method based on photomicrography matrix |
| DE102019113477.3A DE102019113477B4 (en) | 2018-09-27 | 2019-05-21 | Instrument and method for rapid multiscale analysis of inclusions of material based on a photomicrograph matrix |
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| CN201811131502.2A CN109470698B (en) | 2018-09-27 | 2018-09-27 | Cross-scale inclusion rapid analysis instrument and method based on photomicrography matrix |
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