CN109470188A - A kind of high temperature ultrasonic wave wall thickness monitor - Google Patents
A kind of high temperature ultrasonic wave wall thickness monitor Download PDFInfo
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- CN109470188A CN109470188A CN201811431041.0A CN201811431041A CN109470188A CN 109470188 A CN109470188 A CN 109470188A CN 201811431041 A CN201811431041 A CN 201811431041A CN 109470188 A CN109470188 A CN 109470188A
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- high temperature
- data
- wall thickness
- processing module
- probe
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B17/00—Measuring arrangements characterised by the use of infrasonic, sonic or ultrasonic vibrations
- G01B17/02—Measuring arrangements characterised by the use of infrasonic, sonic or ultrasonic vibrations for measuring thickness
Abstract
The present invention relates to a kind of high temperature ultrasonic wave wall thickness monitors comprising data collection terminal and remote monitoring end；Data collection terminal includes high temperature supersonic probe, probe wire and data acquisition and processing module, wherein, data acquisition and processing module are for periodically providing pulse signal to high temperature supersonic probe according to the setting of timer under the action of controller and obtaining wall thickness data based on the time difference of transmitting ultrasonic signal and reflection echo signal；Under the action of controller, wall thickness data are wirelessly transmitted to remote monitoring end again by wireless communication module；Meanwhile high temperature supersonic probe is made of high temperature BSPT piezoelectric ceramic wafer, by the way that ZrO is arranged2The heat-insulated actual work temperature to reduce the probe of protective film made of thermal barrier coating.Thus the monitor can carry out long-time, remote, real-time monitoring to wall thickness at high temperature, solve the problems, such as that service life is short under conventional ultrasound probes worst hot case, and ensure that the accuracy of thickness measuring.
Description
Technical field
The present invention relates to petrochemical industry bearing device corrosion monitoring technology field more particularly to a kind of high temperature ultrasonic waves
Wall thickness monitor.
Background technique
Petrochemical industry, the accident due to caused by the failure of high-temperature bearing equipment (for example, pressure vessel, pressure pipeline)
It happens occasionally, high-temperature bearing equipment failure mode is mainly burn into fault in material, fatigue rupture etc., and corroding is to influence high temperature
One of an important factor for bearing device production safety.
For high-temperature bearing equipment local corrosion Problem of Failure, current main precautionary measures are fixed using audigage
Phase carries out spot thickness measurement to pipeline, although this mode reduces the generation of accident to a certain extent, in the work of high pressure
Under the conditions of condition, the sudden of high-temperature bearing equipment wall thickness corrosion thinning can not be fundamentally overcome for the regular thickness measuring in period per year
And contingency.
It is therefore desirable to have a kind of be capable of the technological means of real-time perfoming high temperature monitoring to solve the above problems.
Summary of the invention
The purpose of the present invention is to solve the length of measurement period existing for existing regular thickness measurement technology, wall thickness can not be overcome rotten
The shortcomings that sudden and contingency that erosion is thinned, and a kind of high temperature ultrasonic wave wall thickness monitor proposed.
To achieve the goals above, present invention employs following technical solutions:
A kind of high temperature ultrasonic wave wall thickness monitor, comprising: data collection terminal and remote monitoring end,
Wherein, the data collection terminal includes high temperature supersonic probe, probe wire and data integration processing module；Wherein,
The high temperature supersonic probe, for fitting to high temperature substrate to be measured；The data integration processing module, by the probe wire with
The high temperature supersonic probe connection；
Also, the data integration processing module include: data acquisition and processing module, controller, timer, battery and
Wireless communication module；It is characterized in that,
The data acquisition and processing module, for being set according to the timer under the action of controller
Time interval, acquired from the data and processing module to the high temperature supersonic probe provide pulse signal；The high temperature ultrasonic
Probe emits ultrasonic signal according to the pulse signal and acquires by reflection obtained from the high temperature substrate bottom reflection to be measured
Echo-signal；The time difference acquisition wall thickness data of data acquisition and processing module based on transmitting ultrasonic signal and reflection echo signal；
The wireless communication module, under the action of the controller by the data acquire and processing module obtain
Wall thickness data transmitted wirelessly to remote monitoring end；
The high temperature supersonic probe is made of high temperature BSPT piezoelectric ceramic wafer, and in the high temperature BSPT piezoelectric ceramics
One ZrO is set before chip2Protective film made of thermal barrier coating reduces the real work temperature of high temperature supersonic probe by heat-insulated
Degree.
Further, the high temperature supersonic probe is adhesively fixed with high temperature substrate to be measured by high-temp glue couplant, institute
It states high-temp glue couplant while playing heat-blocking action.
Further, in one damping of the back side of high temperature BSPT piezoelectric ceramic wafer setting in the high temperature supersonic probe
Block, the damping block are poured by epoxy resin, tungsten powder and curing agent in the ratio of about 2:1:0.1.
Further, the wireless communication module carries out the wireless hair of data using low frequency ZigBee wireless transmission method
It send, remote monitoring end receives the wireless transmission number of the data collection terminal on the high temperature substrate to be measured at one or more monitoring points
According to, by received one or more data collection terminals wall thickness data to monitor corresponding one or more monitor simultaneously
The wall thickness change of point.
Further, the high temperature ultrasonic wave wall thickness monitor further includes setter plate and solar charging panel, wherein
The setter plate is used for data integration processing module placement thereon；The solar panel, is used for
The data acquisition and processing module, controller, timer, battery and wireless communication for including by the data integration processing module
Module for power supply；
Also, temperature sensor is provided in the setter plate, the high temperature ultrasonic wave wall thickness monitor further includes placement
Plate driving mechanism；
The setter plate driving mechanism, including motor component, under the control of the controller according to temperature sensor
Temperature is mobile to the direction close to or far from the high temperature substrate to be measured by setter plate, for the data acquisition and processing in setter plate
Module, controller, timer, battery and wireless communication module provide the working environment of certain temperature range.
Compared with prior art, the invention has the benefit that
1, by using high-temperature piezoelectric ceramic wafers BSPT, setting ZrO in high temperature supersonic probe2Thermal barrier coating, and adopt
With high-temp glue couplant to replace conventional couplant, so that probe can generate in the state of high temperature and receive ultrasonic wave letter
Number, the influence so as to avoid high temperature to measurement accuracy, even if it is also ensured that the precision of wall thickness measuring under conditions of high temperature.
2, the time interval of timer is using hour or day as the period, by data integration processing module to the signal received
It is handled, and is transmitted to remote monitoring end, since remote monitoring end can be wireless with multiple data integration processing modules simultaneously
Data are connected and transmit, thus remote monitoring end can be hourly or daily the period according to the spatial position pair of multiple monitoring points
Wall thickness data carry out comprehensive statistical analysis, thus in the sudden and contingency for fundamentally overcoming corrosion thinning.
3, due to industrial pipeline, pressure vessel work field environment/plant area's operating condition it is complicated and changeable, summer high temperature with it is to be measured
The high temperature of high temperature substrate is superimposed, and winter ice and snow, sleet etc. all may battery, interlock circuits, nothing to data integration processing module
The work of the various electrical modules such as line communication module has an impact, especially the influence of high and low temperature environment.The present invention passes through placement
The position of these modules is adjusted in plate and its driving mechanism, so that the radiation field of high temperature determinand itself is that these modules mention
For suitable working temperature environment (for example, 0-50 degrees Celsius, preferably 10-40 degrees Celsius).
Detailed description of the invention
Fig. 1 is the overall structure block diagram of high temperature ultrasonic wave wall thickness monitor of the present invention；
Fig. 2 is the structural schematic diagram of the setter plate of high temperature ultrasonic wave wall thickness monitor of the present invention；
Fig. 3 is the structural schematic diagram of the high temperature supersonic probe of high temperature ultrasonic wave wall thickness monitor of the present invention；
Marked in the figure:
1- data collection terminal,
2- high temperature supersonic probe,
3- data integration processing module,
4- high temperature substrate to be measured,
The acquisition of 5- data and processing module,
6- controller,
7- timer,
8- battery,
9- wireless communication module,
10- remote monitoring end,
11- high temperature BSPT piezoelectric ceramic wafer,
12-ZrO2Thermal barrier coating protective film,
13- high-temp glue couplant,
14- setter plate,
15- solar charging panel,
16- temperature sensor,
17- setter plate driving mechanism；
18- damping block.
Specific embodiment
Technical solution of the present invention is described in detail in the following with reference to the drawings and specific embodiments.
A kind of high temperature ultrasonic wave wall thickness monitor, comprising: data collection terminal 1 and remote monitoring end 10；Wherein, the data
Collection terminal 1 includes high temperature supersonic probe 2, probe wire and data integration processing module 3；The high temperature supersonic probe 2, for pasting
It closes on high temperature substrate 4 to be measured；The data integration processing module 3 is connected by the probe wire and the high temperature supersonic probe 2
It connects；
The data integration processing module 3 includes: data acquisition and processing module 5, controller 6, timer 7,8 and of battery
Wireless communication module 9；Wherein,
The data acquisition and processing module 5, for being set according to the timer 7 under the action of controller 6
Time interval, acquired from the data and processing module 5 to the high temperature supersonic probe 2 provide pulse signal；Pass through setting
The time interval of timer 7 realizes the acquisition that wall thickness data are carried out according to the measurement period in hour or day, and time interval is for example
It is 6 hours, 12 hours, 24 hours etc.；The high temperature supersonic probe 2 emits ultrasonic signal according to the pulse signal and acquires warp
Cross reflection echo signal obtained from 4 bottom reflection of high temperature substrate to be measured；Data acquisition and processing module 5 are based on transmitting ultrasound
The time difference of signal and reflection echo signal obtains wall thickness data；
The wireless communication module 9, for acquiring the data and processing module 3 under the action of controller 6
The wall thickness data of acquisition are transmitted wirelessly to remote monitoring end 10.
The high temperature supersonic probe 2 is made of high temperature BSPT piezoelectric ceramic wafer 11, and in the high temperature BSPT piezoelectricity
One ZrO is set before ceramic wafers 112Protective film 12 made of thermal barrier coating, by the heat-blocking action of thermal barrier coating to reduce high temperature
The actual work temperature of ultrasonic probe 2.BSPT piezoceramic material, that is, BiScO3-PbTiO3The piezoelectric ceramics of system.
The high temperature supersonic probe 2 is adhesively fixed with high temperature substrate 4 to be measured by high-temp glue couplant 13, the high temperature
Glue couplant 13 plays heat-blocking action while coupling, fixing.
One damping block 18 is set at the back side of the high temperature BSPT piezoelectric ceramic wafer 11 in the high temperature supersonic probe 2,
The damping block 18 is poured by epoxy resin, tungsten powder and curing agent in the ratio of about 2:1:0.1.
The wireless communication module 9 carries out the wireless transmission of data using low frequency ZigBee wireless transmission method, long-range to supervise
Control end 10 receives the wireless transmission data of the data collection terminal 1 on the high temperature substrate to be measured 4 at one or more monitoring points, passes through
Received one or more data collection terminals 1 wall thickness data to monitor the walls of corresponding one or more monitoring points simultaneously
Thickness variation.It, and as needed can be in monitoring site since wall thickness data are acquired according to hour/day time interval
One or more monitoring points are set, so that remote monitoring end can carry out statistical to wall thickness data according to time and space
Analysis, accurately captures the variation of wall thickness；Since data acquire much sooner and combine the spatial position pass of multiple monitoring points
System and its wall thickness data comparison, thus with it is conventional using year compared with the fixed point ultrasonic thickness measurement in period, the present invention can overcome corruption
The thinned sudden and contingency of erosion.
It is well known that long-term hot environment will affect the normal work of electronic circuit, due to the temperature of high temperature substrate to be measured
Usually be in 100 DEG C -400 DEG C of temperature range, and the normal working temperature of common electronic circuit at 80 DEG C hereinafter, even 0-50
DEG C or working effect is just guaranteed at 10-40 DEG C, which limits the long term monitoring that routine monitoring equipment is not suitable for high temperature, this
Invention it is further proposed that, the high temperature ultrasonic wave wall thickness monitor further includes setter plate 14 and solar charging panel 15.
Wherein, the setter plate 14 is used for the data integration processing module 3 placement thereon；The solar battery
Plate 15, for including by the data integration processing module 3 data acquisition and processing module 5, controller 6, timer 7,
Battery 8 and wireless communication module 9 are powered；Also, temperature sensor 16 is provided in the setter plate, the high temperature ultrasonic wave wall
Thick monitor further includes setter plate driving mechanism 17；
The setter plate driving mechanism 17, including motor component, under control of the controller 7 according to temperature sensor
16 temperature is mobile to the direction close to or far from the high temperature substrate 4 to be measured by setter plate 14, with the data in setter plate 14
Acquisition and processing module 5, controller 6, timer 7, battery 8 and wireless communication module 9 provide the building ring of certain temperature range
Border.
In the temperature field that high temperature substrate to be measured is formed, with separate high temperature substrate to be measured, temperature rapid decrease, the present invention is exactly
Using this rule setting setter plate and its driving mechanism so that the specific such as battery component of data integration processing module 3 no matter
Which kind of it is under weather conditions within the scope of its suitable normal working temperature, it is ensured that precision and the work for acquiring data are steady
Qualitative, chronicity.
The foregoing is only a preferred embodiment of the present invention, but scope of protection of the present invention is not limited thereto,
Anyone skilled in the art in the technical scope disclosed by the present invention, according to the technique and scheme of the present invention and its
Inventive concept is subject to equivalent substitution or change, should be covered by the protection scope of the present invention.
Claims (5)
1. a kind of high temperature ultrasonic wave wall thickness monitor, comprising: data collection terminal (1) and remote monitoring end (10),
Wherein, the data collection terminal (1) includes high temperature supersonic probe (2), probe wire and data integration processing module (3)；
Wherein, the high temperature supersonic probe (2), for fitting to high temperature substrate to be measured (4)；The data integration processing module (3) is led to
The probe wire is crossed to connect with the high temperature supersonic probe (2)；
Also, the data integration processing module (3) includes: data acquisition and processing module (5), controller (6), timer
(7), battery (8) and wireless communication module (9)；It is characterized in that,
The data acquisition and processing module (5), for being set according to the timer (7) under the action of the controller (6)
Fixed time interval, is acquired by the data and processing module (5) Xiang Suoshu high temperature supersonic probe (2) provides pulse signal；Institute
High temperature supersonic probe (2) is stated to emit ultrasonic signal according to the pulse signal and acquire by high temperature substrate (4) bottom surface to be measured
Reflection echo signal obtained from reflection；Data acquisition and processing module (5) are based on transmitting ultrasonic signal and reflection echo signal
The time difference obtain wall thickness data；
The wireless communication module (9), for acquiring the data and processing module under the action of the controller (6)
(3) the wall thickness data obtained are transmitted wirelessly to remote monitoring end (10)；
The high temperature supersonic probe (2) is made of high temperature BSPT piezoelectric ceramic wafer (11), and in the high temperature BSPT piezoelectricity
One ZrO is set before ceramic wafers (11)2Protective film made of thermal barrier coating (12), by heat-insulated to reduce high temperature supersonic probe
(2) actual work temperature.
2. a kind of high temperature ultrasonic wave wall thickness monitor according to claim 1, which is characterized in that the high temperature supersonic probe
(2) it is adhesively fixed with high temperature substrate to be measured (4) by high-temp glue couplant (13), the high-temp glue couplant (13) is risen simultaneously
To heat-blocking action.
3. a kind of high temperature ultrasonic wave wall thickness monitor according to claim 1, which is characterized in that the high temperature supersonic probe
(2) one damping block (18) are set at the back side of the high temperature BSPT piezoelectric ceramic wafer (11) in, the damping block is by asphalt mixtures modified by epoxy resin
Rouge, tungsten powder and curing agent are poured in the ratio of about 2:1:0.1.
4. a kind of high temperature ultrasonic wave wall thickness monitor according to claim 1, which is characterized in that the wireless communication module
(9) wireless transmission of data is carried out using low frequency ZigBee wireless transmission method, remote monitoring end (10) receives the height to be measured
The wireless transmission data of data collection terminal (1) on warm object (4) at one or more monitoring points, it is one or more received by institute
The wall thickness data of a data collection terminal (1) are with the wall thickness change of the corresponding one or more monitoring points of monitoring simultaneously.
5. a kind of high temperature ultrasonic wave wall thickness monitor according to claim 1, which is characterized in that the high temperature ultrasonic wave wall
Thick monitor further includes setter plate (14) and solar charging panel (15), wherein
The setter plate (14) is used for the data integration processing module (3) placement thereon；The solar panel
(15), the data acquisition for including by the data integration processing module (3) and processing module (5) are used for, controller (6), is determined
When device (7), battery (8) and wireless communication module (9) power supply；
Also, temperature sensor (16) are provided in the setter plate, the high temperature ultrasonic wave wall thickness monitor further includes placement
Plate driving mechanism (17)；
The setter plate driving mechanism (17), including motor component are used under the control of controller (7) according to temperature sensor
(16) temperature is mobile to the direction close to or far from the high temperature substrate (4) to be measured by setter plate (14), in setter plate
(14) data acquisition and processing module (5), controller (6), timer (7), battery (8) and wireless communication module (9) provides
The working environment of certain temperature range.
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| CN201811431041.0A CN109470188B (en) | 2018-11-28 | 2018-11-28 | High-temperature ultrasonic wall thickness monitor |
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| CN201811431041.0A CN109470188B (en) | 2018-11-28 | 2018-11-28 | High-temperature ultrasonic wall thickness monitor |
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Cited By (4)
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| CN110849972A (en) * | 2019-11-27 | 2020-02-28 | 孙文龙 | Pipeline internal corrosion condition ultrasonic monitoring system and method based on Internet of things |
| CN113433217A (en) * | 2021-06-25 | 2021-09-24 | 西安热工研究院有限公司 | Nondestructive testing device for corrosion reduction of inner wall of water wall tube |
| CN115647684A (en) * | 2022-12-26 | 2023-01-31 | 北京坤飞航天科技有限公司 | Rapid nondestructive detection method and device for surfacing defects |
| CN116608802A (en) * | 2023-07-17 | 2023-08-18 | 中国空气动力研究与发展中心计算空气动力研究所 | Method, device, equipment and medium for synchronously measuring temperature and thickness during thickness variation |
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Cited By (4)
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