CN109461711A - Optocoupler and equipment including it - Google Patents
Optocoupler and equipment including it Download PDFInfo
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- CN109461711A CN109461711A CN201811280867.1A CN201811280867A CN109461711A CN 109461711 A CN109461711 A CN 109461711A CN 201811280867 A CN201811280867 A CN 201811280867A CN 109461711 A CN109461711 A CN 109461711A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/4278—Electrical aspects related to pluggable or demountable opto-electronic or electronic elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/49—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions wire-like arrangements or pins or rods
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Optics & Photonics (AREA)
- Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
Abstract
This application provides a kind of optocoupler and including its equipment.The optocoupler includes input unit, output unit includes the first conductive frame, output end chip and the first bonding lead, wherein, first bonding lead includes sequentially connected first section lead, second section lead and third section lead, the second section lead connecting with the first section lead is first the second section lead, the angle that first the second section lead and the first section lead are formed is θ 1, the angle that the reverse extending line of third section lead and the reverse extending line of the first section lead are formed is θ 2, 1 > θ of θ 2, one end of separate second section lead of first section lead and first end electrical connection, one end of separate second section lead of third section lead and second end electrical connection.The optocoupler bonding lead collapse of silk probability is lower and optocoupler failure probability is lower, and failure rate is relatively low after sale.
Description
Technical field
This application involves semiconductor fields, in particular to a kind of optocoupler and including its equipment.
Background technique
Photoelectrical coupler abbreviation optocoupler, main function in circuit are signal transmission and electrical isolation, optocoupler
Device inside structure consists of two parts, and is input terminal chip and output end chip respectively, and input terminal chip is usually luminous two
Pole pipe, output end chip are usually phototriode.
Currently, the gold thread binding technique that input terminal chip and output end chip all use in industry is roughly the same, for defeated
Enter to hold for chip and output end chip, is substantially all welded for gold thread 03 by the input terminal of chopper and output end chip 01, then
Straight line is connected to the copper frame 02 of output end after being bent by certain radian, as shown in Figure 1, such technological design leads to gold thread 03
Effective spacing between copper frame 02 is too small, 03 collapse of silk of gold thread and 02 contact problems of copper frame easily occurs.
Optocoupler is widely used in various electrical equipments and communication apparatus because of its excellent performance advantage.Current air-conditioning
There is the problem of poor reliability in practical applications in Toshiba's optocoupler used in inside and outside machine communicating circuit, and air conditioning applications occur
Largely without communication failure, analysis be output end collapse of silk cause failure to show after sale the most prominent (failure phenomenon is output end core
The input terminal of piece and the gold thread of output end collapse, and cause the input terminal of the output end chip of optocoupler and export terminal shortcircuit or resistance
It is anti-serious relatively low, ultimately cause E6 communication failure.Optocoupler failure seriously affects air-conditioning total quality and user's real experiences
Effect.
It is difficult in optocoupler manufacture, production and use process by a large amount of practical proofs through equipment and test hand
The modes such as section effectively control collapse of silk phenomenon, and just to show performance after for a period of time different for use process in harsh environment for general electric appliance
Often, lead to optocoupler ultimate failure.
Because the manufacturing process of optocoupler is complicated, each link in manufacturing process is abnormal (shake, vibration equipment, chain
Speed and frame pressing etc.) it is likely to lead to collapse of silk problem, which is that current industry all has knotty problem, is difficult effectively
Control, brings very big influence to functional reliabilities such as electrical equipments.
Disclosed information above is used only to reinforce the background technique to technology described herein in the background section
Understanding may include therefore certain information in background technique, these information are to those skilled in the art and not formed
The home known prior art.
Summary of the invention
The main purpose of the application is to provide a kind of optocoupler and the equipment including it, to solve light in the prior art
The output unit of coupling device is easy to happen Problem of Failure caused by collapse of silk.
To achieve the goals above, according to the one aspect of the application, a kind of optocoupler is provided, the optocoupler packet
The output unit and input unit of isolation setting are included, above-mentioned output unit includes the first conductive frame, output end chip and first
Bonding lead, above-mentioned output end chip are located in the part of the surface of above-mentioned first conductive frame, and above-mentioned output end chip includes the
One end and second end, one in above-mentioned first end and above-mentioned second end is input terminal, another is output end, above-mentioned second end
Setting, above-mentioned first end and above-mentioned first conductive frame are contacted with above-mentioned first conductive frame passes through above-mentioned first bonding lead electricity
Connection, wherein above-mentioned first bonding lead includes sequentially connected first section lead, the second section lead and third section lead, with
Second section lead of above-mentioned first section lead connection is first the second section lead, above-mentioned first the second section lead and above-mentioned the
The angle that one section lead is formed is θ 1, and the reverse extending line of above-mentioned third section lead and the reverse extending of above-mentioned first section lead are linear
At angle be θ 2,1 > θ of θ 2, above-mentioned first section lead far from above-mentioned second section lead one end and above-mentioned first end electrical connection,
One end of separate above-mentioned second section lead of above-mentioned third section lead and the electrical connection of above-mentioned second end.
Further, above-mentioned first conductive frame includes the first current-carrying part and the second current-carrying part, and above-mentioned first is conductive
Part includes body part and protruding portion, and above-mentioned protruding portion connect with above-mentioned body part and dashes forward along the direction far from above-mentioned body part
Out, above-mentioned output end chip contacts setting, part and the above-mentioned protrusion of above-mentioned second current-carrying part with the part of above-mentioned body part
The part contact setting far from above-mentioned body part and the direction extension along separate above-mentioned body part in portion, and above-mentioned second conductive part
Divide has interval between above-mentioned body part.
Further, the surface of above-mentioned body part contacted with above-mentioned output end chip is first surface, above-mentioned first table
In face close to above-mentioned second current-carrying part boundary line be first borderline, with where above-mentioned first bonding lead plane with it is upper
The intersection point for stating first borderline is first point, using first point as a circle in the center of circle and above-mentioned first bonding lead tangent and point of contact
For second point, the distance between above-mentioned first point and above-mentioned second point are L, 0.15≤L≤0.20mm.
Further, 0.15≤L≤0.17mm.
Further, above-mentioned second section lead have one or have it is multiple, it is multiple when above-mentioned second section lead has multiple
Above-mentioned second section lead is sequentially connected.
Further, above-mentioned first bonding lead includes gold thread, and above-mentioned first conductive frame includes copper frame, above-mentioned output
Holding chip includes phototriode.
Further, above-mentioned first section lead includes vertical section, and first above-mentioned second section lead includes horizontal segment.
Further, above-mentioned input unit includes the second conductive frame, input terminal chip and the second bonding lead, above-mentioned defeated
Enter to hold chip to be located on the surface of above-mentioned second conductive frame, above-mentioned input terminal chip includes third end and the 4th end, and above-mentioned
Three ends and above-mentioned 4th end are electrically connected by above-mentioned second bonding lead, and above-mentioned second bonding lead includes the sequentially connected 4th
Section lead, the 5th section lead and the 6th section lead, above-mentioned 5th section lead at least one, above-mentioned 5th section lead and above-mentioned the
The angle that four section leads are formed is θ 1, and the angle that the reverse extending line and above-mentioned 4th section lead of above-mentioned 6th section lead are formed is θ 2, θ
1 > θ 2, one end of separate above-mentioned 5th section lead of above-mentioned 4th section lead and the electrical connection of above-mentioned third end, above-mentioned 6th section is led
One end of separate above-mentioned 5th section lead of line and the electrical connection of above-mentioned 4th end.
Further, above-mentioned second bonding lead includes gold thread, and above-mentioned second conductive frame includes copper frame, above-mentioned input
Holding chip includes light emitting diode.
According to the another aspect of the application, a kind of equipment, including optocoupler are provided, which is on any
The optocoupler stated.
Using the technical solution of the application, in the output unit of above-mentioned optocoupler, the first bonding lead includes at least
Three sections, and the angle θ 1 that first the second section lead and above-mentioned first section lead are formed is greater than θ 2, so that the second section lead
The vertical range of remainder and the first conductive frame other than the point connecting with third section lead is above third section and leads
Vertical range between line and the first conductive frame, i.e., compared with the existing technology, the first bonding lead in the optocoupler with
The vertical range of first conductive frame is larger, can alleviate in this way or eliminate because of situations such as shake and stress caused
One bonding lead contacts caused short circuit problem with the first conductive frame, can also alleviate or avoid technique in the fabrication process
Defect influences optocoupler overall performance, so that bonding lead collapse of silk probability be effectively reduced and reduce the failure of optocoupler caused by collapse of silk generally
Rate reduces failure rate after sale.Also, first bonding lead is relatively simple for structure, is easy production, cost is relatively low, Neng Gouguang
In the general optocoupler applied in every field.
Detailed description of the invention
The accompanying drawings constituting a part of this application is used to provide further understanding of the present application, and the application's shows
Meaning property embodiment and its explanation are not constituted an undue limitation on the present application for explaining the application.In the accompanying drawings:
Fig. 1 shows a kind of binding structural schematic diagram of output end chip in the prior art；
Fig. 2 shows the partial profile structures for the output unit that a kind of embodiment of the application provides；
The schematic diagram of the section structure for the input unit that another middle embodiment that Fig. 3 shows the application provides；And
Fig. 4 shows the top view of Fig. 2.
Wherein, the above drawings include the following reference numerals:
01, output end chip；02, copper frame；03, gold thread；
10, output unit；11, the first conductive frame；12, output end chip；13, the first bonding lead；111, it first leads
Electric part；112, the second current-carrying part；113, body part；114, protruding portion；115, first point；131, the first section lead；132,
Second section lead；133, third section lead；134, second point；20, input unit；21, the second conductive frame；22, input terminal core
Piece；23, the second bonding lead.
Specific embodiment
It is noted that following detailed description is all illustrative, it is intended to provide further instruction to the application.Unless another
It indicates, all technical and scientific terms used herein has usual with the application person of an ordinary skill in the technical field
The identical meanings of understanding.
It should be noted that term used herein above is merely to describe specific embodiment, and be not intended to restricted root
According to the illustrative embodiments of the application.As used herein, unless the context clearly indicates otherwise, otherwise singular
Also it is intended to include plural form, additionally, it should be understood that, when in the present specification using term "comprising" and/or " packet
Include " when, indicate existing characteristics, step, operation, device, component and/or their combination.
It should be understood that when element (such as layer, film, region or substrate) is described as at another element "upper", this yuan
Part can be directly on another element, or intermediary element also may be present.Moreover, in specification and claims, when
When description has element " connected " to another element, which " can be directly connected to " to another element, or pass through third element
" connected " to another element.
As background technique is introduced, the bonding lead of the output unit of optocoupler in the prior art is easy to happen
Collapse of silk leads to component failure, as above in order to solve the problems, such as, present applicant proposes a kind of optocoupler and including its equipment.
In a kind of typical embodiment of the application, a kind of optocoupler is provided, as shown in Fig. 2, the optocoupler
Output unit 10 and input unit 20 including isolation setting, above-mentioned output unit 10 include the first conductive frame 11, output end
Chip 12 and the first bonding lead 13, above-mentioned output end chip 12 are located in the part of the surface of above-mentioned first conductive frame 11, on
Stating output end chip 12 includes first end and second end, and one in above-mentioned first end and above-mentioned second end is input terminal, another
A is output end, and above-mentioned second end contacts setting, above-mentioned first end and above-mentioned first conductive pane with above-mentioned first conductive frame 11
Frame 11 is electrically connected by above-mentioned first bonding lead 13, wherein above-mentioned first bonding lead 13 includes sequentially connected first segment
Conducting wire 131, the second section lead 132 and third section lead 133, the second section lead 132 connecting with above-mentioned first section lead 131 are
The angle that first the second section lead, above-mentioned first the second section lead and above-mentioned first section lead 131 are formed is θ 1, above-mentioned third
The angle that the reverse extending line of the reverse extending line of section lead 133 and above-mentioned first section lead 131 is formed is θ 2,1 > θ of θ 2, above-mentioned the
One end of separate above-mentioned second section lead 132 of one section lead 131 and the electrical connection of above-mentioned first end, above-mentioned third section lead 133
Far from above-mentioned second section lead 132 one end and above-mentioned second end electrical connection.
In the output unit of above-mentioned optocoupler, the first bonding lead includes at least three sections, and first second segment is led
The angle θ 1 that line and above-mentioned first section lead are formed is greater than θ 2, so that the second section lead in addition to being connect with third section lead
The vertical range of remainder and the first conductive frame except point is above between third section lead and the first conductive frame
Vertical range, i.e., compared with the existing technology, the vertical range of the first bonding lead and the first conductive frame in the optocoupler
It is larger, it can alleviate in this way or eliminate because of situations such as shake and caused first bonding lead of stress and the first conductive pane
Short circuit problem caused by bridge joint touches can also be alleviated or avoid defective workmanship in the fabrication process to optocoupler overall performance shadow
It rings, so that bonding lead collapse of silk probability be effectively reduced and reduce optocoupler failure probability caused by collapse of silk, reduces failure rate after sale.And
And first bonding lead is relatively simple for structure, is easy production, cost is relatively low, can be widely used in every field
In optocoupler.
As shown in figure 4, above-mentioned first conductive frame 11 includes the first current-carrying part 111 and the second current-carrying part 112, it is above-mentioned
First current-carrying part 111 includes body part 113 and protruding portion 114, and above-mentioned protruding portion 114 is connect with above-mentioned body part 113 and edge
Direction far from above-mentioned body part 113 is prominent, and above-mentioned output end chip 12 contacts setting with the part of above-mentioned body part 113, on
The part for stating the second current-carrying part 112 is contacted with the part far from above-mentioned body part 113 of above-mentioned protruding portion 114 to be arranged and along remote
Direction from above-mentioned body part 113 extends, and has interval between above-mentioned second current-carrying part 112 and above-mentioned body part 113, this
The second current-carrying part of sample with protruding portion by being electrically connected, to be electrically connected with the first current-carrying part, also, the second current-carrying part with
Body part has interval.
In order to further ensure the distance between the first bonding lead and the first conductive frame are larger, a kind of reality of the application
It applies in example, as shown in Figure 2 and Figure 4, the surface of above-mentioned body part 113 contacted with above-mentioned output end chip 12 is first surface,
The boundary line of close above-mentioned second current-carrying part 112 is first borderline in above-mentioned first surface, with above-mentioned first bonding lead
The intersection point of plane and above-mentioned first borderline where 13 is 1: 115, with 1: 115 for the center of circle a circle with it is above-mentioned
First bonding lead 13 is tangent and point of contact is second point 134, and the distance between above-mentioned 1: 115 and above-mentioned second point 134 are
L, 0.15≤L≤0.20mm.
In another embodiment of the application, in order to reduce the difficulty of technique, and it is smaller to guarantee that optocoupler has simultaneously
Volume, in a kind of embodiment of the application, 0.15≤L≤0.17mm.
The second section lead of the application can have one or have multiple, and Fig. 2 shows the realities for being second section lead
Apply example.When above-mentioned second section lead 132 has multiple, multiple above-mentioned second section leads 132 are sequentially connected.Also, work as second segment
When conducting wire has multiple, the angle θ 1 that first the second section lead and the first section lead are formed is greater than θ 2, other second section leads with
First section lead cannot directly form angle, need reverse extending, could be with the linear angulation θ 3 of reverse extending of the first section lead, this
Size relation between a angle θ 3 and θ 2 is simultaneously not fixed, and be can be θ 3 greater than θ 2, can also be equal to, and is also possible to θ 3 less than θ 2.
Other second section leads can be arranged in those skilled in the art according to the actual situation.
In a kind of specific embodiment, above-mentioned first bonding lead includes gold thread, and the electric conductivity of gold thread is preferable, and hardness
Smaller, antioxygenic property is preferable, further ensures optocoupler reliability with higher.Above-mentioned first conductive frame includes
Copper frame, the conduction and heating conduction of copper frame are preferable, and cost is relatively low, better mechanical property.Above-mentioned output end chip packet
Include phototriode.Certainly, the output end chip of the application is not limited to include photosensitive three laser, can also include photosensitive two pole
The devices such as pipe.Those skilled in the art can select suitable device to form the output end chip of the application according to the actual situation.
The shape of the first section lead, the second section lead and third section lead in the application can be any feasible shape
Shape, as long as meeting the above-mentioned requirement in relation to θ 1 and θ 2, suitable shape can be arranged in those skilled in the art according to the actual situation
The first section lead, the second section lead and the third section lead of shape.
In another embodiment of the application, as shown in Fig. 2, above-mentioned first section lead 131 includes vertical section, on first
Stating the second section lead includes horizontal segment.Such first bonding lead structure is simple, and manufacture craft is simple, and producing efficiency is higher,
And the reliability of the first bonding lead of the structure is higher.
In a kind of embodiment of the application, as shown in figure 3, above-mentioned input unit 20 includes the second conductive frame 21, input
Chip 22 and the second bonding lead 23 are held, above-mentioned input terminal chip 22 is located on the surface of above-mentioned second conductive frame 21, above-mentioned
Input terminal chip 22 includes third end and the 4th end, and above-mentioned third end and above-mentioned 4th end pass through above-mentioned second bonding lead, 23 electricity
Connection.
In order to further decrease the probability for promoting bonding lead and stepping on silk, it is general to further decrease the failure of optocoupler caused by collapse of silk
Rate, in a kind of embodiment not shown in the figure of the application, above-mentioned second bonding lead include sequentially connected 4th section lead,
5th section lead and the 6th section lead, above-mentioned 5th section lead at least one, above-mentioned 5th section lead is led with above-mentioned 4th section
The angle that line is formed is θ 1, and the angle that the reverse extending line of above-mentioned 6th section lead and above-mentioned 4th section lead are formed is θ 2,1 > θ of θ 2,
Above-mentioned 4th section lead far from above-mentioned 5th section lead one end and above-mentioned third end electrical connection, above-mentioned 6th section lead it is remote
One end and the electrical connection of above-mentioned 4th end from above-mentioned 5th section lead.
As the first bonding lead, the second bonding lead can also be using any feasible material in this field, ability
Field technique personnel can select suitable material to form the second bonding lead according to the actual situation.In a kind of specific embodiment,
Above-mentioned second bonding lead includes gold thread.The electric conductivity of gold thread is preferable, and hardness is smaller, and antioxygenic property is preferable, further
It ensure that optocoupler reliability with higher.
As the first conductive frame, the second conductive frame can also be using any feasible material in this field, ability
Field technique personnel can select suitable material to form the second conductive frame according to the actual situation.In a kind of specific embodiment,
Above-mentioned second conductive frame includes copper frame, and the conduction and heating conduction of copper frame are preferable, and cost is relatively low, mechanical performance compared with
It is good.
As the case where output end chip, input terminal chip can also be using any suitable device shape in the prior art
Suitable device can be selected to form the input terminal chip of the application according to the actual situation at, those skilled in the art.A kind of tool
In the embodiment of body, above-mentioned input terminal chip includes light emitting diode.
Above-mentioned output end chip includes phototriode.Certainly, the output end chip of the application is not limited to include photosensitive
Three laser, can also including photodiode etc. devices.Those skilled in the art can select suitable device according to the actual situation
Part forms the output end chip of the application.
In the typical embodiment of the another kind of the application, a kind of equipment is provided, which includes optocoupler, the light
Coupling device is above-mentioned any optocoupler.
The equipment is due to including above-mentioned optocoupler, and reliability is higher, better performances.
Above equipment can be any equipment that can apply optocoupler, such as chopper, grade interval sharp weapon or multi resonant
In oscillator.
In order to enable those skilled in the art can clearly understand the technical solution and technical effect of the application, with
Under will illustrate in conjunction with specific embodiments.
Embodiment
The optocoupler structure is referring to fig. 2 to Fig. 4.
Optocoupler includes the output unit 10 and input unit 20 of isolation setting, and above-mentioned output unit 10 is led including first
Electric frame 11, output end chip 12 and the first bonding lead 13, above-mentioned first bonding lead 13 are gold thread, above-mentioned first conductive pane
Frame 11 is copper frame, and above-mentioned output end chip 12 is phototriode.Above-mentioned output end chip 12 is located at above-mentioned first conductive pane
In the part of the surface of frame 11, above-mentioned output end chip 12 includes first end and second end, in above-mentioned first end and above-mentioned second end
One be input terminal, another is output end, and above-mentioned second end contacts setting with above-mentioned first conductive frame 11, above-mentioned first
End is electrically connected with above-mentioned first conductive frame 11 by above-mentioned first bonding lead 13.
Above-mentioned output end chip 12 is located in the part of the surface of above-mentioned first conductive frame 11, and above-mentioned output end chip 12 wraps
First end and second end is included, one in above-mentioned first end and above-mentioned second end is input terminal, another is output end, above-mentioned the
Two ends contact setting with above-mentioned first conductive frame 11, and above-mentioned first end and above-mentioned first conductive frame 11 pass through above-mentioned first key
Conducting wire 13 is closed to be electrically connected.
As shown in Fig. 2, above-mentioned first bonding lead 13 includes sequentially connected first section lead 131, the second section lead 132
With third section lead 133, and the angle that the second section lead and above-mentioned first section lead 131 are formed is θ 1, above-mentioned third section lead 133
Reverse extending line and above-mentioned first section lead 131 reverse extending line formed angle be θ 2,1 > θ of θ 2, above-mentioned first section lead
131 one end far from above-mentioned second section lead 132 and the electrical connection of above-mentioned first end, above-mentioned third section lead 133 far from upper
State one end and the electrical connection of above-mentioned second end of the second section lead 132.Above-mentioned first section lead 131 is vertical section, above-mentioned second segment
Conducting wire 132 is horizontal segment.
Above-mentioned first conductive frame 11 includes the first current-carrying part 111 and the second current-carrying part 112, above-mentioned first conductive part
Dividing 111 includes body part 113 and protruding portion 114, and above-mentioned protruding portion 114 connect with above-mentioned body part 113 and along far from above-mentioned
The direction in body portion 113 is prominent, and above-mentioned output end chip 12 contacts setting with the part of above-mentioned body part 113, and above-mentioned second is conductive
The part of part 112 contacts setting with the part far from above-mentioned body part 113 of above-mentioned protruding portion 114 and along separate above-mentioned ontology
The direction in portion 113 extends, and has interval between above-mentioned second current-carrying part 112 and above-mentioned body part 113.
The surface of above-mentioned body part 113 contacted with above-mentioned output end chip 12 is first surface, in above-mentioned first surface
Be first borderline close to the boundary line of above-mentioned second current-carrying part 112, with where above-mentioned first bonding lead 13 plane with
The intersection point of above-mentioned first borderline be 1: 115, with 1: 115 for the center of circle a circle and above-mentioned first bonding lead 13
Tangent and point of contact is second point 134, and the distance between above-mentioned 1: 115 and above-mentioned second point 134 are L, L=0.17mm.
Above-mentioned input unit 20 includes the second conductive frame 21, input terminal chip 22 and the second bonding lead 23, and above-mentioned the
Two bonding leads 23 are gold thread, and only have two sections.Above-mentioned second conductive frame 21 is copper frame, and above-mentioned input terminal chip 22 is
Light emitting diode.Above-mentioned input terminal chip 22 is located on the surface of above-mentioned second conductive frame 21, and above-mentioned input terminal chip 22 wraps
Third end and the 4th end are included, above-mentioned third end and above-mentioned 4th end are electrically connected by above-mentioned second bonding lead 23.
The optocoupler can be eliminated in a certain range by adjusting the shape of gold thread because of situations such as shake, stress
Lead to short circuit problem caused by gold thread and contact therewith, avoids in optocoupler manufacturing process that there are defective workmanships to optocoupler overall performance
It influences.Effectively improving the reliability in optocoupler real work is specially to adjust gold thread binding walks wire shaped, so that gold be effectively reduced
Line collapse of silk probability and collapse of silk lead to optocoupler failure probability.Also, the optocoupler is assessed in all directions, the optocoupler
Performance parameter meets the requirements with structural parameters, reaches rectification target level.And the structure of the optocoupler is simple, reliable, it can
Failure rate is effectively reduced.
It can be seen from the above description that the application the above embodiments realize following technical effect:
1), in the output unit of the optocoupler of the application, the first bonding lead includes at least three sections, and first second
The angle θ 1 that section lead and above-mentioned first section lead are formed is greater than θ 2, so that the second section lead in addition to connecting with third section lead
The vertical range of remainder and the first conductive frame except the point connect be above third section lead and the first conductive frame it
Between vertical range, i.e., compared with the existing technology, the first bonding lead in the optocoupler is vertical with the first conductive frame
Apart from larger, it can alleviate in this way or eliminate and be led because of situations such as shake and caused first bonding lead of stress with first
Short circuit problem caused by electric contact therewith can also be alleviated or avoid defective workmanship in the fabrication process to optocoupler overall performance
It influences, so that bonding lead collapse of silk probability be effectively reduced and reduce optocoupler failure probability caused by collapse of silk, reduces failure rate after sale.
Also, first bonding lead is relatively simple for structure, is easy production, cost is relatively low, can be widely used in every field
Optocoupler in.
2), the equipment of the application is due to including above-mentioned optocoupler, and reliability is higher, better performances.
The foregoing is merely preferred embodiment of the present application, are not intended to limit this application, for the skill of this field
For art personnel, various changes and changes are possible in this application.Within the spirit and principles of this application, made any to repair
Change, equivalent replacement, improvement etc., should be included within the scope of protection of this application.
Claims (10)
1. a kind of optocoupler, the optocoupler includes the output unit (10) and input unit (20) of isolation setting, described
Output unit (10) includes the first conductive frame (11), output end chip (12) and the first bonding lead (13), the output end
Chip (12) is located in the part of the surface of first conductive frame (11), and the output end chip (12) includes first end and
Two ends, one in the first end and the second end is input terminal, another is output end, the second end and described the
One conductive frame (11) contact setting, the first end and first conductive frame (11) pass through first bonding lead
(13) it is electrically connected, which is characterized in that first bonding lead (13) includes sequentially connected first section lead (131), second
Section lead (132) and third section lead (133), the second section lead (132) connecting with first section lead (131) are first
The angle that a second section lead, first second section lead and first section lead (131) are formed is θ 1, the third section
The angle that the reverse extending line of the reverse extending line of conducting wire (133) and first section lead (131) is formed is θ 2,1 > θ of θ 2, described
One end of separate second section lead (132) of first section lead (131) and first end electrical connection, the third section are led
One end of separate second section lead (132) of line (133) and second end electrical connection.
2. optocoupler according to claim 1, which is characterized in that first conductive frame (11) includes first conductive
Partially (111) and the second current-carrying part (112), first current-carrying part (111) include body part (113) and protruding portion
(114), the protruding portion (114) connect with the body part (113) and protrudes along the direction far from the body part (113),
The output end chip (12) contacts setting, the part of second current-carrying part (112) with the part of the body part (113)
Setting is contacted with the part far from the body part (113) of the protruding portion (114) and along separate the body part (113)
Direction extends, and has interval between second current-carrying part (112) and the body part (113).
3. optocoupler according to claim 2, which is characterized in that the body part (113) with the output end core
The surface of piece (12) contact is first surface, and the boundary line of close second current-carrying part (112) is in the first surface
First borderline, with the intersection point of plane and the first borderline where first bonding lead (13) for first point
(115), tangent using a circle that first point (115) is the center of circle and first bonding lead (13) and second point is in point of contact
(134), the distance between first point (115) and the second point (134) are L, 0.15≤L≤0.20mm.
4. optocoupler according to claim 3, which is characterized in that 0.15≤L≤0.17mm.
5. optocoupler according to claim 1, which is characterized in that second section lead (132) has one or has
Multiple, when second section lead (132) has multiple, multiple second section leads (132) are sequentially connected.
6. optocoupler according to any one of claim 1 to 5, which is characterized in that first bonding lead (13)
Including gold thread, first conductive frame (11) includes copper frame, and the output end chip (12) includes phototriode.
7. optocoupler according to any one of claim 1 to 5, which is characterized in that the first section lead (131) packet
Vertical section is included, first second section lead includes horizontal segment.
8. optocoupler according to any one of claim 1 to 5, which is characterized in that the input unit (20) includes
Second conductive frame (21), input terminal chip (22) and the second bonding lead (23), the input terminal chip (22) are located at described
On the surface of second conductive frame (21), the input terminal chip (22) includes third end and the 4th end, the third end and institute
It states the 4th end to be electrically connected by second bonding lead (23), second bonding lead (23) includes the sequentially connected 4th
Section lead, the 5th section lead and the 6th section lead, the 5th section lead at least one, the 5th section lead and described the
The angle that four section leads are formed is θ 1, and the angle that the reverse extending line and the 4th section lead of the 6th section lead are formed is θ 2, θ
1 > θ 2, one end of separate 5th section lead of the 4th section lead and third end electrical connection, described 6th section is led
One end of separate 5th section lead of line and the 4th end electrical connection.
9. optocoupler according to claim 8, which is characterized in that second bonding lead (23) includes gold thread, institute
Stating the second conductive frame (21) includes copper frame, and the input terminal chip (22) includes light emitting diode.
10. a kind of equipment, including optocoupler, which is characterized in that the optocoupler is any one of claims 1 to 9 institute
The optocoupler stated.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811280867.1A CN109461711A (en) | 2018-10-30 | 2018-10-30 | Optocoupler and equipment including it |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811280867.1A CN109461711A (en) | 2018-10-30 | 2018-10-30 | Optocoupler and equipment including it |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109461711A true CN109461711A (en) | 2019-03-12 |
Family
ID=65608962
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811280867.1A Pending CN109461711A (en) | 2018-10-30 | 2018-10-30 | Optocoupler and equipment including it |
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| Country | Link |
|---|---|
| CN (1) | CN109461711A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102931181A (en) * | 2012-10-12 | 2013-02-13 | 沈震强 | Packaging manufacture method of integrating two bidirectional triode thyristor chips in one photoelectric coupler |
| CN103376517A (en) * | 2012-04-18 | 2013-10-30 | 安华高科技通用Ip(新加坡)公司 | Opto-coupler and method of manufacturing the same |
| CN205248260U (en) * | 2015-12-15 | 2016-05-18 | 深圳市三浦半导体有限公司 | Electron device packaging structure |
| CN107221522A (en) * | 2015-01-19 | 2017-09-29 | 苏州固锝电子股份有限公司 | High yield rectifying device |
-
2018
- 2018-10-30 CN CN201811280867.1A patent/CN109461711A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103376517A (en) * | 2012-04-18 | 2013-10-30 | 安华高科技通用Ip(新加坡)公司 | Opto-coupler and method of manufacturing the same |
| CN102931181A (en) * | 2012-10-12 | 2013-02-13 | 沈震强 | Packaging manufacture method of integrating two bidirectional triode thyristor chips in one photoelectric coupler |
| CN107221522A (en) * | 2015-01-19 | 2017-09-29 | 苏州固锝电子股份有限公司 | High yield rectifying device |
| CN205248260U (en) * | 2015-12-15 | 2016-05-18 | 深圳市三浦半导体有限公司 | Electron device packaging structure |
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Application publication date: 20190312 |