CN109454325A - A kind of laser assisted cuts the device and its technique of the transparent hard brittle material of grinding - Google Patents
A kind of laser assisted cuts the device and its technique of the transparent hard brittle material of grinding Download PDFInfo
- Publication number
- CN109454325A CN109454325A CN201811417032.6A CN201811417032A CN109454325A CN 109454325 A CN109454325 A CN 109454325A CN 201811417032 A CN201811417032 A CN 201811417032A CN 109454325 A CN109454325 A CN 109454325A
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- Prior art keywords
- laser
- grinding
- transparent
- workpiece
- cuts
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/0093—Working by laser beam, e.g. welding, cutting or boring combined with mechanical machining or metal-working covered by other subclasses than B23K
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
Abstract
The invention discloses device and its technique that a kind of laser assisted cuts the transparent hard brittle material of grinding, laser head and the two sides that tool is respectively at transparent workpiece are cut, it is fixed on the rotary shaft to cut tool；Laser head and rotary shaft are fixed on z on linear axis by fixed plate；Transparent workpiece is fixed on linear axis x by fixture realizes it along x to moving；Transparent workpiece and laser head and the displacement of tool in the z-direction is cut by z to linear axis control；Laser is incident upon the workpiece other side from transparent workpiece, and the transparent material other side, which is within the scope of laser beam defocusing amount, guarantees that acquisition heating temperature makes its softening.Have the effect of reducing tool wear, improve workpiece surface quality.
Description
Technical field
Abrasive machining device is cut the present invention relates to a kind of novel laser assisted more particularly to a kind of transparent material laser is auxiliary
It helps and cuts abrasive machining device.
Background technique
The transparent materials such as optical glass are with its high rigidity, high intensity and high temperature resistant, antioxygenic property and optical transmittance
It is widely used etc. excellent mechanical performance and optical property in fields such as optical components.It processes the main body of problem
The aspects such as present processing quality is poor, low efficiency, processing cost height.Since this kind of material is not only hard but also crisp, generated in traditional processing
Fragmentation destroys the mechanical mechanics property that part is seriously affected with fire check, thus Conventional machining methods hardly result in satisfaction
Processing effect.It is ground, can be become because of the workpiece surface that the power of application and the heat of friction generation are induced using super-abrasive grinding wheel
Shape, sub-surface fracture, the damage of residual stress and other forms still cannot be eliminated thoroughly.In addition, hard brittle material is super
The processing of accurate and high efficiency is still difficult to get both, and how improving processing quality and improving processing efficiency becomes at present to transparent hard crisp
Letter main problem to be solved in the processing of material.
Currently, having reached its maturity using the relevant technologies that laser assisted is machined, the side of laser auxiliary heating is utilized
Formula carries out material and processes the research hotspot being increasingly becoming in recent years.But for the high efficiency of transparent hard brittle material, high quality it is saturating
It crosses formula laser assisted processing unit (plant) and research has not yet to see report.
Summary of the invention
In order to overcome the prior art using in laser assisted Grinding Process, laser is easy to be blocked by cutter, coolant liquid
Influence and laser beam to beam quality cause the deficiency of energy loss etc. along incidence angle, and the object of the present invention is to provide one kind to swash
Light assists cutting the device and its technique of the transparent hard brittle material of grinding, with improve transparent hard brittle material machined surface quality,
The efficiency for improving entire processing technology has great importance in terms of the precise high-efficiency processing of transparent material.
To achieve the goals above, the invention adopts the following technical scheme:
Adjustment laser from transparent hard brittle material side incidence is processed, (cut tool and be located at same water by laser beam and cutting milling
It is flat), adjustment laser spot is on surface to be machined in front of wheel grinding point within the scope of material softening, transparent hard crisp according to processing
Depending on material property and softening degree (generally 3-8mm), using the pre-add thermal softening material to be processed of laser and using cutting
Cutter or wheel grinding remove material.
Laser assisted cuts the device of the transparent hard brittle material of grinding, including kinematic system, laser system, temp measuring system,
Fine adjustment control system, laser system include laser, optical fiber, laser head；Temp measuring system include computer, infrared thermal imager or
Infrared radiation thermometer.Kinematic system includes that x, y, z three-dimensional linear axis controls for controlling feed motion, rotary shaft and cuts grinding tool
Feeding or rotation.
It is fixed on the rotary shaft to cut grinding tool, controls its rotation or straight-line feed；
Laser head and rotary shaft are fixed on z on linear axis by fixed plate；
The transparent workpiece is fixed on linear axis x by fixture, with realize its along x to moving, fixture cannot be to laser
Beam formation is blocked；
Transparent workpiece and laser head and the displacement of tool in the z-direction is cut by z to linear axis control；
The laser head adjusts the position between transparent workpiece by micromatic setting, so that laser is injected from transparent workpiece
To the workpiece other side, the transparent material other side will be within the scope of laser beam defocusing amount, keep its soft to guarantee to obtain heating temperature
Change, laser head and cuts the two sides that grinding tool is respectively at transparent workpiece；
The temperature measuring equipment is contactless temperature-measuring, is infrared thermal imager or infrared radiation thermometer, swashs for real-time monitoring
Light heating temperature.
Laser assisted cuts the operating procedure of the device of the transparent hard brittle material of grinding, and steps are as follows:
Step 1: transparent workpiece to be processed to be installed on to the workbench of process unit, grinding tool will be cut and be fixed on rotation
On axis；
Step 2: grinding tool will be cut and laser head is respectively arranged in the two sides of transparent workpiece, the position of laser spot is adjusted
It sets and is on cutting or wheel grinding work surface, specifically adjustment laser spot is in sand on surface to be machined
(wheel grinding point front material softening model on finished surface is determined by analogue simulation within the scope of material softening in front of wheel grinding points
Enclosing is 3-8mm)；
Step 3: the relative position of adjustment non-contact temperature measuring device, makes it be directed to be cut/grinding area of transparent workpiece
Domain adjusts laser head and cuts transverse direction, the lengthwise position of grinding tool to guarantee laser heat affected area according to the actual (real) thickness of workpiece
Obtain suitable temperature；The suitable temperature refers to that the intensity of processing transparent workpiece and hardness all significantly decrease, and reaches
Temperature when being required to heating assisted cutting；
Step 4: in order to process entire workpiece surface, transparent material laser assisted grinding uses admission, multiple tracks
The zigzag path of grinding carries out cutting milling and cuts, and after guaranteeing laser preheating, wheel grinding is carrying out material removal front end；
It (is to be set according to laser beam and cutting tool/abrasive grinding wheel relative position herein, because only that laser beam is in cutter/grinding wheel
Front end just can be carried out heating, and after cutting milling is cut together, laser beam can not be heated positioned at grinding wheel rear end when return
And laser beam position adjustment is difficult).
Step 5: after processing is completed, closing all systems.
Compared with existing laser assisted system of processing, the invention has the following advantages:
(1) present invention focuses on energy another by the characteristic of transparent workpiece by laser from non-processing face side incidence
Side region to be processed avoids the interference between laser and grinding wheel, heats more convenient.(2) it can be blocked to avoid grinding wheel or chip
Laser beam, and prevent chip splashing to be bonded on laser lens and block laser path and laser is caused to burn out galvanometer or object lens.(3)
Laser beam can expand the range of incident angle to the maximum extent, and the accurate control to laser energy and defocusing amount can be enhanced in this
To realize the softening degree of Reasonable Regulation And Control material.(4) laser head and rotary shaft are mounted on same root linear axis by connecting plate,
It can guarantee the accurate control of relative position between laser and grinding wheel, laser heat affected area is consistent with material removal area, realizes
It is mobile to saturating by numerical control code track generated in the case where laser head and cutter keep relative position to immobilize
Bright material cut-grinding this function.
Detailed description of the invention
Fig. 1 is processing unit (plant) schematic diagram of the invention；
Fig. 2 is transparent material laser-assisted machining schematic diagram of the present invention.
Fig. 3 is transparent material laser assisted Principle of Grinding and Cutting figure of the present invention.
Fig. 4 is the enlarged drawing of part A in Fig. 3.
In figure: 1, x is to linear axis, 2, y to linear axis, 3, micromatic setting, 4, micromatic setting, 5, laser, 6, fixed plate,
7, z is to linear axis, 8, rotary shaft, 9, transparent workpiece, 10, super-abrasive grinding wheel, 11, temperature measuring equipment, 12, laser beam, 13, laser
Head, 14, fixture, 15, cutting tool, 16, chip, 17, heat affected area, 18, grinding wheel direction of rotation, 19, grinding wheel abrasive grain, 20, mill
Bits.
Specific embodiment
Embodiments of the present invention are further described with reference to the accompanying drawing.
Embodiment 1
Shown in referring to Fig.1, a kind of transparent material laser assisted cuts abrasive machining device, including kinematic system, and x, y, z three
Linear axis controls feed motion, and rotary shaft 8 controls the feeding or rotation for cutting grinding tool；Laser system, including laser, light
Fine, laser head assembly；Temp measuring system, including computer, infrared thermal imager or infrared radiation thermometer.
Laser head 23 and rotary shaft 8 pass through fixed plate 6 and are fixed on z on linear axis 7；
Laser head adjusts the position between transparent workpiece 9 by micromatic setting, so that laser is incident upon from transparent workpiece
The workpiece other side, the transparent material other side will be within the scope of laser beam defocusing amount, make its softening to guarantee to obtain heating temperature；
Transparent workpiece is fixed on linear axis x by fixture, with realize its along x to moving, fixture cannot be to laser beam shape
At blocking；Transparent workpiece and laser head and the displacement of tool in the z-direction is cut by z to linear axis control；
It is fixed by rotary shaft 7 to cut tool, controls its rotation or straight-line feed.
Temperature measuring equipment is contactless temperature-measuring, is infrared thermal imager or infrared radiation thermometer, adds for real-time monitoring laser
Hot temperature.
Shown in referring to Fig.1, first on rotating shaft 8 by the installation of cutting tool 15, rotary shaft passes through fixed plate 6 and z to straight line
Axis 7 connects；Laser is optical fiber laser, and laser head is fixed by bracket and fixed plate 6, and fixed plate 6 and z is to 7 phase of linear axis
Even, z can control the precision movement of laser head 13 and rotary shaft 8 in a z-direction to linear axis 7, and laser head 13 can pass through tail
Portion's micromatic setting 3 and micromatic setting 4 adjust the relative position between transparent workpiece 9, with this come guarantee laser heat affected area with
The material to be processed removal area of transparent workpiece 9 is consistent, and laser can adjust entering for laser by the control panel of itself
Penetrate the parameters such as laser power, laser frequency；Transparent workpiece 9 is fixed by fixture 14, and fixture is mounted on workbench, work
Make platform by x to linear axis 1 control transparent workpiece 9 x to precision it is mobile；Temp measuring system 11 is by infrared temperature measurement apparatus and meter
Mechanism is calculated at infrared temperature measurement apparatus is contactless temperature-measuring, and measurement method is simple and convenient, can be with Real-time Feedback laser heat affected area
Temperature change, realize accurate control to material work area temperature to be added；Laser and cutting tool are in transverse direction in process
It keeps opposing stationary with longitudinal, realizes the linkage control of the two to linear axis 7 by z, machining path is mobile by scheduled track
Realize the processing of workpiece.
Referring to Fig. 2, since workpiece 9 is transparent, laser beam 12 can be heated the other side through workpiece 9, and laser beam begins
Workpiece 9 is heated in work area front end to be added eventually, laser heat affected area is consistent with wheel grinding arc area, in heat affected area 17
It acts on lower workpiece material to be softened to greatest extent, will soften depth under the action of cutting tool 15 is apSoftening layer go
It removes, forms chip 16.
Embodiment 2
The cutting tool installed in embodiment 1 replaces with super-abrasive grinding wheel 10 in this embodiment, referring to Fig. 3, due to
9 light transmission of transparent workpiece, laser beam 12 can heat the other side through transparent workpiece 9, and laser beam is always in work area to be added
Workpiece 9 is heated in front end, and laser heat affected area is consistent with wheel grinding arc area, workpiece material under the action of heat affected area 17
Material is softened to greatest extent, and will soften depth under the action of grinding wheel abrasive grain 19 is apSoftening layer removal, formed abrasive dust
20。
The ductile removal of hard brittle material may be implemented in this method on the one hand, improves the finished surface matter of transparent material
On the other hand the accurate control to laser energy and defocusing amount, the softening degree of Reasonable Regulation And Control material, to reduce can be enhanced in amount
The grinding force of grinding process reduces the degree of wear of grinding wheel, improves the service life of grinding wheel.
The content that above-described embodiment illustrates should be understood as that these embodiments are only used for being illustrated more clearly that the present invention, without
For limiting the scope of the invention, after the present invention has been read, those skilled in the art are to various equivalent forms of the invention
Modification fall within the application range as defined in the appended claims.
Claims (5)
1. laser assisted cuts the device of the transparent hard brittle material of grinding, including it is kinematic system, laser system, temp measuring system, micro-
Control system is adjusted, laser system includes laser, optical fiber, laser head；Temp measuring system includes computer, infrared thermal imager or red
Outer temperature measurer；Kinematic system includes x, y, z three-dimensional linear axis and rotary shaft；
It cuts grinding tool fixation and controls its rotation or straight-line feed on the rotary shaft；
Laser head and rotary shaft are fixed on z on linear axis by fixed plate；
Transparent workpiece is fixed on linear axis x by fixture realizes it along x to moving；
Transparent workpiece and laser head and the displacement of tool in the z-direction is cut by z to linear axis control；
The temperature measuring equipment is contactless temperature-measuring.
2. laser assisted described in claim 1 cuts the operating procedure of the device of the transparent hard brittle material of grinding, feature exists
In steps are as follows:
Step 1: transparent workpiece to be processed to be installed on to the workbench of process unit, grinding tool will be cut and be fixed in rotary shaft；
Step 2: grinding tool will be cut and laser head is respectively arranged in the two sides of transparent workpiece, the position for adjusting laser spot makes
It is on wheel grinding work surface；
Step 3: the relative position of adjustment non-contact temperature measuring device, makes it be directed at the region to be cut of transparent workpiece, according to work
The actual (real) thickness of part adjusts laser head and cuts transverse direction, the lengthwise position of grinding tool to guarantee that it is suitable that laser heat affected area obtains
Temperature；
Step 4: in order to process entire workpiece surface, transparent material laser assisted grinding is ground using admission, multiple tracks
Zigzag path be ground, with guarantee laser preheating after, grinding wheel carry out again grinding removal front end material；
Step 5: after processing is completed, closing all systems.
3. laser assisted as claimed in claim 2 cuts the operating procedure of the device of the transparent hard brittle material of grinding, feature exists
The suitable temperature described in step (3) refers to that the intensity of processing transparent workpiece and hardness all significantly decrease, and reaches and adds
Temperature when hot assisted machining requires.
4. laser assisted as claimed in claim 2 cuts the operating procedure of the device of the transparent hard brittle material of grinding, feature exists
In it is adjustment laser spot that the position for adjusting laser spot described in step (2), which is on wheel grinding work surface,
Within the scope of material softening in front of wheel grinding point on surface to be machined.
5. laser assisted as claimed in claim 4 cuts the operating procedure of the device of the transparent hard brittle material of grinding, feature exists
In determining on finished surface that material softening range is 3-8mm in front of wheel grinding point by analogue simulation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811417032.6A CN109454325B (en) | 2018-11-26 | 2018-11-26 | Device and process for machining transparent hard and brittle materials through laser-assisted cutting and grinding |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811417032.6A CN109454325B (en) | 2018-11-26 | 2018-11-26 | Device and process for machining transparent hard and brittle materials through laser-assisted cutting and grinding |
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| Publication Number | Publication Date |
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| CN109454325A true CN109454325A (en) | 2019-03-12 |
| CN109454325B CN109454325B (en) | 2021-09-21 |
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| CN201811417032.6A Active CN109454325B (en) | 2018-11-26 | 2018-11-26 | Device and process for machining transparent hard and brittle materials through laser-assisted cutting and grinding |
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Cited By (4)
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|---|---|---|---|---|
| CN110605642A (en) * | 2019-07-29 | 2019-12-24 | 长春理工大学 | Laser-assisted grinding device and grinding method |
| CN110605638A (en) * | 2019-07-29 | 2019-12-24 | 长春理工大学 | Laser-assisted belt type grinding device and grinding method |
| CN110757274A (en) * | 2019-11-05 | 2020-02-07 | 南通大学 | Method and device for laser-assisted grinding of end face of grinding wheel |
| CN115194953A (en) * | 2022-07-25 | 2022-10-18 | 华侨大学 | Laser-assisted micro drilling device and method for hard and brittle transparent material |
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| CN115194953A (en) * | 2022-07-25 | 2022-10-18 | 华侨大学 | Laser-assisted micro drilling device and method for hard and brittle transparent material |
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| CN109454325B (en) | 2021-09-21 |
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