CN109604832A - A kind of laser assisted point grinding processing method suitable for difficult-to-machine material - Google Patents
A kind of laser assisted point grinding processing method suitable for difficult-to-machine material Download PDFInfo
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- CN109604832A CN109604832A CN201811415384.8A CN201811415384A CN109604832A CN 109604832 A CN109604832 A CN 109604832A CN 201811415384 A CN201811415384 A CN 201811415384A CN 109604832 A CN109604832 A CN 109604832A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
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Abstract
The present invention relates to a kind of laser assisted point grinding processing methods suitable for difficult-to-machine material, suitable type of laser and parameter are selected according to material property to be processed, the relative position that material temperature to be processed distribution emulate determining laser defocusing amount and LASER SPECKLE and wheel grinding region is heated to laser, using after finishing V-arrangement or arc diamond wheel rapidoprint progress point grinding processing is treated under suitable grinding parameter.Solve the problems, such as that difficult-to-machine material point grinding process medium plain emery wheel tip is easy to wear, machined surface quality is poor.
Description
Technical field
The present invention relates to grinding field more particularly to the laser assisted point grinding processing technologies of difficult-to-machine material.
Background technique
Laser assisted processing is used for the laser assisted turning of hard material earliest.Laser beam directly focuses on Tool in Cutting area
To soften material to be processed in advance before domain, hard brittle material (Si can be reduced3N4,SiC,ZrO2,Al2O3, optical glass etc.)
The fracture tendency of finished surface or the homogenization deformation for promoting high temperature alloy, Ti alloy machined surface.Laser-assisted machining adds
Work can effectively improve the processing efficiency of difficult-to-machine material, improve machined surface quality and reduce tool wear.In addition to hardly possible processes material
The laser assisted turning of material, laser assisted milling, laser assisted electrical-chemistry method and laser assisted jet stream processing technology also by
Precision Machining for difficult-to-machine material.
A kind of processing of the point grinding as new Grinding Technology, suitable for body structure surface and complex surface.The technique
Process derives from CNC turnery processing, drives moving synchronously for each axis of process equipment by servo mechanism and ball-screw, can adopt
Grinding wheel is realized processing and forming, end face processing, cutting etc. with same.During point grinding, used grinding wheel has sharp
Working region, with workpiece be point contact.In the grinding process under high revolving speed and accurate parameter, contact area is believed that
It is constant, it is similar to single point diamond cutting process, therefore also referred to as single-point is ground.
But since the effective coverage that point grinding process medium plain emery wheel participates in material removal is small, the rate of wear is fast.
Summary of the invention
In view of laser assisted processes specific disadvantage, the object of the present invention is to provide one kind to be suitable for difficult-to-machine material
Laser assisted point grinding processing method, by laser assisted processed and applied in difficult-to-machine material point grinding technical process, significantly
It promotes the service life at grinding wheel tip and improves machined surface quality.
The technical solution adopted by the present invention to solve the above problem is as follows:
For the characteristic of material processed, certain types of laser (laser power and wavelength) is selected, is focused on to be processed
Softener material on surface passes through the material of the grinding wheel removal softening with sharp edges.According to the humidity province of laser heating materials
Between distribution situation, select certain defocusing amount, regulate and control the size of LASER SPECKLE, and further select specified point grinding technique
Parameter, including grinding depth, feed rate, the distance of LASER SPECKLE centre distance grinding area.
A kind of laser assisted point grinding processing method suitable for difficult-to-machine material, steps are as follows:
Step 1: according to the difficult-to-machine material characteristic of required processing, selecting certain type of laser, including laser power,
Optical maser wavelength, pulse width, defocusing amount etc.；
Selection principle is: for engineering ceramics (silicon nitride, aluminium oxide, zirconium oxide etc.) class difficult-to-machine material, using wavelength
For visible light or the CO of infrared band2Or YAG laser；
Use wavelength for CO2 the or YAG laser of 1060nm high temperature alloy and titanium alloy class difficult-to-machine material, pulse is wide
Degree is that nanosecond or millisecond are advisable, and to increase the absorptivity of laser, generates better fuel factor.
Step 2: calculating under the laser irradiation parameter of selection, carries out to the Temperature Distribution of laser facula preheating material
Emulation, determines the distance L in suitable laser defocusing amount and laser facula and wheel grinding region on this basis.
Step 3: according to used laser and grinding wheel, reasonable Arrangement simultaneously builds laser assisted point grinding processing platform.
As shown in Figure 1, workpiece is installed on rotary table, laser is incident along region side to be processed, super-abrasive grinding
Wheel carries out grinding at the L of laser irradiation region rear, and grinding wheel pose can there are two types of layouts, such as the grinding wheel linear speed in Fig. 3 (c)
Spend the layout type parallel with workpiece linear velocity；Second such as Fig. 3 (d) centerline velocities layout side vertical with workpiece linear velocity
Formula.
Step 4: finishing is carried out to grinding wheel using trimmer and obtains sharp grinding edge.The grinding wheel is V-arrangement grinding wheel
Or arc diamond wheel.
Step 5: according to the temperature distribution state in the laser irradiation region that step 2 determines, select suitable point grinding deep
Degree, according to different selection the grinding wheel feed speeds and grinding wheel speed etc. of material.Grinding and feeding direction is straight line or spiral shell in step 5
Spin line feeding.
The present invention processes difficult-to-machine material by laser assisted point grinding, and the tip of the used grinding wheel of point grinding can be improved
Service life reduces crushing number, to improve grinding efficiency.In addition, the holding of stone ability can also promote institute
The surface figure accuracy of finished surface.On the other hand, soften the toughness such as high temperature alloy, Ti alloy in advance using laser compared with good material, so
Surface uniformization residual deformation can be promoted by removing material by wheel grinding afterwards；In processing optical glass, ceramics, composite material
Hard brittle material when, laser soften in advance material to be processed can promote toughness domain processing, so as to improve machining surface integrity.
Detailed description of the invention
Fig. 1 is schematic layout pattern of the invention.
Fig. 2 is the working principle diagram of V-arrangement and arc diamond wheel used in the present invention, wherein (a) is V-arrangement grinding wheel point mill
It cuts, is (b) arc diamond wheel point grinding.
Fig. 3 is two kinds of laser assisted point grinding trajectory diagrams in the present invention.
Fig. 4 is the workpiece schematic diagram after grid division divides.
In figure: 1, clamping main shaft, 2, workpiece, 3, laser head, 4, laser beam, 5, grinding wheel, 6, laser heat affected area, 7, " Z "
Word is fed path, 8, " Z " word return path, 9, screwfeed path.
Specific embodiment
Technical solution of the present invention is illustrated below with reference to embodiment:
Embodiment 1
Referring to Fig.1, a kind of difficult-to-machine material laser assisted point grinding processing method, comprising the following steps:
Step 1: according to the material property of required processing, certain type of laser, including laser power, laser wave are selected
Length, pulse width etc..
In the present embodiment, the difficult-to-machine material is silicon nitride ceramics, because its hard crisp and laser absorption rate is opposite
Larger characteristic, therefore inventor uses infrared laser comprising laser power, optical maser wavelength, pulse width are 30W- respectively
50W, 1064nm, 8ns-120ns.
Step 2: under the laser irradiation parameter of selection, emulating the Temperature Distribution of laser facula preheating material,
Laser heat affected area depth h and thermo parameters method are obtained, determines distance L of the laser center away from wheel grinding arc area on this basis
And grinding depth ap。
Simulation process are as follows:
By law of conservation of energy and Fourier law, governing equation is conducted using thermodynamics are as follows:
In formula (1), kr,kθ,kzIt is r, θ, the thermal coefficient W/ (mK) of the material in the direction z, due to regarding workpiece as respectively
Isotropic material, then kr=kθ=kz；C is the specific heat capacity J/ (kgK) of material；T is the temperature (DEG C) at a certain moment；
ρ is the density (kg/m of workpiece material3)；
Q " ' is the heat generated in unit volume, it is contemplated that practical work piece is without internal heat resource, then q " '=0.
The whole initial temperature of workpiece is set as
T (r, θ, z, t=0)=To (2)
Workpiece surface is inputted there are heat flow density and Convection Heat Transfer Boundary Conditions, so meeting
In formula, A is the heat absorption coefficients of workpiece, takes 0.88.The convective heat flow generated in laser action process.Unit area
Exchange heat energy are as follows:
qconv=hc(Ts-Tb) (4)
In formula, hc200W/ (mK) is taken for surrounding air convection transfer rate；TsFor workpiece surface temperature；TbFor environment temperature
It spends (22 DEG C).
In entire laser heating system, grinding wheel is in while radiating and absorbing Quantity of heat, the net heat between them
Transmitting can calculate (radiant heat flux density) with Shi Difen-Boltzmann equation:
In formula, σ is 5.67 × 10-8W/ of Boltzmann constant (m2·K4)；ε is thermal emissivity rate.
It is approximately ideal Gaussian beam by laser beam, the energy density that transparent material laser irradiation is formed can indicate
Are as follows:
Wherein A is transparent material to the absorptivity of laser, and optical maser wavelength, material property, workpieces surface condition and several
What pattern is related；P is average laser power；flFor laser repetition rate；R is any point within the scope of laser irradiation away from spot center
Radius.
Laser auxiliary heating temperature field analysis needs to select Three-dimensional Transient analytical unit, and cell type is selected as SOLID70.
Workpiece after grid division division is as shown in figure 4, size of mesh opening is 0.001mm.Using ANSYS finite element software, pass through load
The distribution situation and heat affecting depth h of laser heat flow density, condition of meeting accident and the available laser temperature field of boundary condition, small
In within the scope of h, silicon nitride ceramics is sufficiently softened, it is only necessary to guarantee ap< h.
Step 3: according to used laser and grinding wheel, reasonable Arrangement simultaneously builds laser assisted point grinding processing platform,
As shown in Figure 1, 2, workpiece 2 is installed on clamping main shaft 1, and the laser beam 4 issued by laser head 3 is irradiated along incidence angle and waited in workpiece
Finished surface generates laser heat affected area 6 in workpiece surface, and grinding wheel 5 is at away from laser irradiation center L distance with grinding depth ap
Grinding depth carry out grinding (see Fig. 2).It, can be by grinding method point due to the difference of the motion mode of clamping main shaft 1
At four kinds of forms；1, clamping main shaft is fixed, and grinding wheel direction of rotation is vertical with direction of feed (see Fig. 3 (a)), forms the grinding of " Z " word
Path；2, clamping main shaft is fixed, and grinding wheel direction of rotation and direction of feed are horizontal (see Fig. 3 (b)), is formed " Z " word and is ground path；3,
Clamping main axis, grinding speed and work speed are horizontal (see Fig. 3 (c)), form helical grinding path；4, clamping main shaft turns
Dynamic, grinding speed is vertical with work speed (see Fig. 3 (d)), forms helical grinding path).
Step 4: finishing is carried out to V-arrangement grinding wheel using trimmer and obtains sharp grinding edge.
Step 5: according to the temperature distribution state in the laser irradiation region that step 2 determines, select suitable point grinding deep
Degree guarantees grinding depth apLess than heat affected area depth h, pass through a known to emulationpIn 0.2mm or so, according to silicon nitride material
Difference selects grinding wheel feed speed 10-30mm/min and grinding wheel speed for 400-800r/min, L=2mm or so.It is ground in step 5
Cutting direction of feed is that straight line or helix are fed.
Embodiment 2
Unlike the first embodiment, step 4 is by the silicon carbide grinding wheel opposite grinding of super-abrasive grinding wheel and concave arc edge, with
Generate the grinding wheel edge of certain arc radius (r=5mm).
Material removal path is divided into four kinds with worktable rotary mode difference according to grinding wheel pose, as shown in Figure 3.1, it fills
Folder main shaft is fixed, and grinding wheel direction of rotation is vertical with direction of feed (see Fig. 3 (a)), is formed " Z " word and is ground path；2, clamping main shaft
Fixed, grinding wheel direction of rotation and direction of feed are horizontal (see Fig. 3 (b)), form " Z " word and are ground path；3, clamping main axis, sand
It takes turns linear velocity and work speed is horizontal (see Fig. 3 (c)), form helical grinding path；4, clamping main axis, grinding speed with
Work speed is vertical (see Fig. 3 (d)), forms helical grinding path.
Embodiment described above is not intended to limit the scope of the present invention, and those skilled in the art can be according to the system
Various changes and improvements are carried out, and all technique variations based on the principle of the invention are within the scope of the invention.
Claims (5)
1. a kind of laser assisted point grinding processing method suitable for difficult-to-machine material, which is characterized in that steps are as follows:
Step 1: according to the difficult-to-machine material characteristic of required processing, type of laser is selected；
Step 2: under the laser irradiation parameter of selection, the Temperature Distribution of laser facula preheating material is emulated, herein
On the basis of determine the distance L of suitable laser defocusing amount and laser facula and wheel grinding region；
Step 3: according to used laser and grinding wheel, laser assisted point grinding processing platform is built；
Step 4: finishing is carried out to grinding wheel using trimmer and obtains sharp grinding edge；The grinding wheel is V-arrangement grinding wheel or circle
Arc grinding wheel；
Step 5: according to the temperature distribution state in the laser irradiation region that step 2 determines, suitable point grinding depth, root are selected
According to the different selection grinding wheel feed speeds and grinding wheel speed of material；Grinding and feeding direction is that straight line or helix are fed.
2. the laser assisted point grinding processing method described in claim 1 suitable for difficult-to-machine material, which is characterized in that step
In one, the selection principle of type of laser is to use wavelength for ultraviolet or deep ultraviolet laser engineering ceramics class difficult-to-machine material；
Use wavelength for the CO of 1060nm high temperature alloy and titanium alloy class difficult-to-machine material2Or YAG laser, pulse width are nanosecond
Or millisecond.
3. the laser assisted point grinding processing method described in claim 1 suitable for difficult-to-machine material, which is characterized in that step
In three, laser assisted point grinding processing platform is: workpiece is installed on rotary table, and laser enters along region side to be processed
Penetrate, super-abrasive grinding wheel carries out grinding at the L of laser irradiation region rear, L be laser facula and wheel grinding region away from
From.
4. the laser assisted point grinding processing method as claimed in claim 3 suitable for difficult-to-machine material, it is characterised in that superhard
Abrasive grinding wheel pose is there are two types of layout, and one is the grinding speed layout type parallel with workpiece linear velocity, another kind is line
The speed layout type vertical with workpiece linear velocity.
5. the laser assisted point grinding processing method described in claim 1 suitable for difficult-to-machine material, which is characterized in that step
Three simulation process are as follows:
By law of conservation of energy and Fourier law, governing equation is conducted using thermodynamics, such as shown in following formula (1):
In formula (1), kr,kθ,kzIt is r respectively, θ, the thermal coefficient of the material in the direction z, W/ (mK),
Due to regarding workpiece as isotropic material, then kr=kθ=kz；
C is the specific heat capacity J/ (kgK) of material；
T is the temperature (DEG C) at a certain moment；
ρ is the density (kg/m of workpiece material3)；
Q " ' is the heat generated in unit volume, it is contemplated that practical work piece is without internal heat resource, then q " '=0；
The whole initial temperature of workpiece is set, as shown in formula (3)
T (r, θ, z, t=0)=ToFormula (3)
Workpiece surface is inputted there are heat flow density and Convection Heat Transfer Boundary Conditions, so meeting formula (4):
In formula, A is the heat absorption coefficients of workpiece, takes 0.88；
The convective heat flow generated in laser action process.Unit area heat exchange energy such as formula (5):
qconv=hc(Ts-Tb) formula (5)
In formula, hc200W/ (mK) is taken for surrounding air convection transfer rate；TsFor workpiece surface temperature；TbFor environment temperature；
In entire laser heating system, grinding wheel, which is in, radiates simultaneously and absorbs Quantity of heat, between net heat transmit can be with
It is calculated with Shi Difen-Boltzmann equation of formula (6):
In formula, σ is Boltzmann constant 5.67 × 10-8W/(m2·K4)；ε is thermal emissivity rate；
It is approximately ideal Gaussian beam by laser beam, the energy density that transparent material laser irradiation is formed can be expressed as formula
(6):
Wherein A is absorptivity of the transparent material to laser, with optical maser wavelength, material property, workpieces surface condition and geometric form
Looks are related；
P is average laser power；flFor laser repetition rate；R is radius of any point away from spot center within the scope of laser irradiation；
Laser auxiliary heating temperature field analysis needs to select Three-dimensional Transient analytical unit；Using ANSYS finite element software, pass through
Laser heat flow density, the distribution situation and heat affecting depth h of primary condition and the available laser temperature field of boundary condition are loaded,
It is being less than within the scope of h, silicon nitride ceramics is sufficiently softened, it is only necessary to guarantee ap< h.
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Cited By (3)
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| CN110202167A (en) * | 2019-05-24 | 2019-09-06 | 南通天鸿镭射科技有限公司 | The technique of single-point diamond lathe tool processing cemented carbide material optical mould |
| CN113020806A (en) * | 2021-03-24 | 2021-06-25 | 郑州磨料磨具磨削研究所有限公司 | Method for carrying out laser-assisted grinding processing on surface of superhard material grinding tool |
| CN115070513A (en) * | 2022-05-20 | 2022-09-20 | 江麓机电集团有限公司 | High-rigidity intermittent grinding head and laser-assisted manufacturing method thereof |
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