CN109450419A - RF switch chip - Google Patents

RF switch chip Download PDF

Info

Publication number
CN109450419A
CN109450419A CN201811463780.8A CN201811463780A CN109450419A CN 109450419 A CN109450419 A CN 109450419A CN 201811463780 A CN201811463780 A CN 201811463780A CN 109450419 A CN109450419 A CN 109450419A
Authority
CN
China
Prior art keywords
switch
switch module
module
chip
control circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201811463780.8A
Other languages
Chinese (zh)
Inventor
梁海浪
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Huizhou Huaxin Semiconductor Co Ltd
Original Assignee
Huizhou Huaxin Semiconductor Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Huizhou Huaxin Semiconductor Co Ltd filed Critical Huizhou Huaxin Semiconductor Co Ltd
Priority to CN201811463780.8A priority Critical patent/CN109450419A/en
Publication of CN109450419A publication Critical patent/CN109450419A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03KPULSE TECHNIQUE
    • H03K17/00Electronic switching or gating, i.e. not by contact-making and –breaking
    • H03K17/51Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the components used
    • H03K17/56Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the components used by the use, as active elements, of semiconductor devices
    • H03K17/60Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the components used by the use, as active elements, of semiconductor devices the devices being bipolar transistors
    • H03K17/64Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the components used by the use, as active elements, of semiconductor devices the devices being bipolar transistors having inductive loads

Landscapes

  • Electronic Switches (AREA)

Abstract

The invention discloses a kind of RF switch chips, including including signal port, antenna, N number of first switch module, N number of second switch module, biasing and control circuit, each switch module of N number of first switch module and N number of second switch module is connected in series between signal port and antenna by signal wire;N number of first switch module and N number of second switch module are arranged by formed symmetrical of the antenna;Biasing and control circuit are connect with N number of first switch module and N number of second switch module respectively, the biasing and control circuit, for controlling a switch module in N number of first switch module or the switch module conducting in N number of second switch module, for the switching molding block transmission signals between signal port and antenna by being uniquely connected.The present invention solves the problems, such as radio signal transmission quality, improves response speed.

Description

RF switch chip
Technical field
The present invention relates to radio frequency arts, in particular to a kind of RF switch chip.
Background technique
RF switch, including switch core and switch controller, for controlling the on-off of radio communication number connection transmitting antenna. It is the smart phone for representing the multi mode multi band of wireless technology of 3G/4G with LTE technology with the fast development of wireless technology In system, the quantity of mode and frequency range is being constantly increasing, such as operating mode has GSM, TDSCDMA, WCDMA and TDD- LTE etc., frequency range cover the range from 700MHz to 6GHz, and the mobile terminals such as smart phone pass through needed for RF switch selection The channel of power amplification multiplying power, establishment model and frequency band signals is realized by controlling the on-off of unlike signal in different mode Switch between frequency range.This just needs RF switch in the case where keeping the performances such as linear, and there are more channel paths to locate Manage wider array of frequency range.
Switch core is made of multiple element circuits, and each element circuit is connected in series by multiple transistor legs.It is wrapping It is mixed and disorderly inconsistent due to element circuit domain disposing way in RF switch chip containing multiple RF switches, influence letter Number transmission quality, reduce RF switch response speed.
Summary of the invention
The main object of the present invention is to propose a kind of RF switch chip, it is intended to solve the response speed of RF switch.
To achieve the above object, the present invention proposes a kind of RF switch chip, including signal port, antenna, N number of first opens Close module, N number of second switch module, biasing and control circuit, N number of first switch module and N number of second switch mould Each switch module of block is connected in series between the signal port and the antenna by signal wire;N number of described first opens Module and N number of second switch module is closed to be arranged by formed symmetrical of the antenna;
The biasing and control circuit are connect with N number of first switch module and N number of second switch module respectively, The biasing and control circuit, for controlling the switch module or N number of described second in N number of first switch module Switch module conducting in switch module, for the switch between the signal port and the antenna by being uniquely connected Module transfer signal.
Optionally, N number of first switch module is at single setting, and orientation and N number of first switch module Consistent with the symmetry axis extending direction of N number of second switch module, N number of second switch module corresponds to N number of described first Switch module setting.
Optionally, N number of first switch module is arranged relative to the antenna inside and outside two rows, and the arrangement side of each row To, the institute of inside and outside two rows consistent with the symmetry axis extending direction of N number of first switch module and N number of second switch module It states first switch module and mutually staggers setting in its orientation, N number of second switch module corresponds to N number of described first and opens Close module setting.
Optionally, the quantity that the first switch module of inside and outside two rows mutually staggers in its orientation be one or Person is multiple, and N number of second switch module corresponds to N number of first switch module setting.
Optionally, the spacing in N number of first switch module between any two adjacent first switch modules be greater than or Person is equal to 150 microns;
And/or
Spacing in N number of second switch module between any two adjacent second switch modules is more than or equal to 150 microns.
Optionally, the switch module in the RF switch chip includes rf inputs, RF output end, switch unit Circuit, gate voltage control circuit and body pole control circuit, wherein
The switch unit circuit includes multiple switch unit, and multiple switch units are sequentially connected in series to be penetrated in described Between frequency input terminal and the RF output end, the grid of each switch unit in the switch unit circuit is connected with each other, Public grid is formed, body pole is connected with each other, and forms common body pole;
The rf inputs are connect with the source electrode of the switch unit circuit, and the RF output end and the switch are single The drain electrode of first circuit connects, and the public grid of the switch unit circuit is connect with the gate voltage control circuit, described to open The common body pole closed in element circuit is connect with body pole control circuit.
Optionally, the gate voltage control circuit includes public grid biasing resistor, first resistor and first capacitor;
The first end of the public grid biasing resistor is connect with the grid of multiple switch units, the public grid The second end of biasing resistor is separately connected with the first end of the first resistor and the first end of the first capacitor, and described first The second end of resistance is connect with the grid-control voltage, the second end ground connection of the first capacitor;
Body pole control circuit includes common body pole biasing resistor, second resistance and the second capacitor;
The first end of common body pole biasing resistor is connect with the body of each switching tube common end extremely interconnected, described The second end of common body pole biasing resistor and the first end of the first end of the second resistance and second capacitor are separately connected, The second end of the second resistance and the second end of second capacitor are grounded respectively.
Optionally, each switch module in the first switch module and second switch module includes identical quantity Switch unit, each switch unit include the switching tube that the common gate of identical quantity is connected in parallel.
Optionally, each switch module in the first switch module and second switch module includes the switch unit Quantity be 6.
Optionally, the switching tube in each switch unit is SOI transistor, the quantity of the SOI transistor It is 100.
Technical solution of the present invention includes signal port, antenna, N number of first switch module, N number of by RF switch chip Two switch modules, biasing and control circuit, each switch of N number of first switch module and N number of second switch module Module is connected in series between the signal port and the antenna by signal wire;N number of first switch module and N number of institute Second switch module is stated to be arranged by formed symmetrical of the antenna;The biasing and control circuit are opened with N number of described first respectively It closes module to connect with N number of second switch module, the biasing and control circuit, for controlling N number of first switch mould Switch module conducting in a switch module or N number of second switch module in block, for the signal end Switching molding block transmission signals between mouth and the antenna by being uniquely connected.The present invention, which realizes, to be reduced radiation interference, reduces Parasitic capacitance etc. improves the response of RF switch chip to solve the problems, such as RF switch chip signal transmission quality Speed.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this Some embodiments of invention for those of ordinary skill in the art without creative efforts, can be with The structure shown according to these attached drawings obtains other attached drawings.
Fig. 1 is the switch topology domain of one embodiment of RF switch chip of the present invention;
Fig. 2 is the switch topology domain of another embodiment of RF switch chip of the present invention;
Fig. 3 is the structural block diagram of one embodiment of RF switch microarray biochip of the present invention;
Fig. 4 is one embodiment electrical block diagram of RF switch chip of the present invention;
Fig. 5 is circuit reduction structural schematic diagram shown in Fig. 4;
Fig. 6 is the switch unit electrical block diagram of one embodiment of RF switch chip of the present invention;
Fig. 7 is circuit reduction structural schematic diagram shown in fig. 6.
Drawing reference numeral explanation:
Label Title Label Title
10 Signal port Vg Grid-control voltage
20 Antenna GND Ground terminal
30 First switch module Rg Public grid biasing resistor
40 Second switch module Rb Common body pole biasing resistor
50 Signal wire R1 First resistor
310 Rf inputs R2 Second resistance
320 RF output end C1 First capacitor
330 Switch unit circuit C2 Second capacitor
340 Gate voltage control circuit 510 Switching tube
350 Body pole control circuit
The realization of the object of the invention, functional characteristics and it can put that the embodiments will be further described with reference to the accompanying drawings.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete Site preparation description, it is clear that described embodiment is only a part of the embodiments of the present invention, instead of all the embodiments.Base Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts it is all its His embodiment, shall fall within the protection scope of the present invention.
It is to be appreciated that if relating to directionality instruction (such as up, down, left, right, before and after ...) in the embodiment of the present invention, Then directionality instruction be only used for explain under a certain particular pose (as shown in the picture) between each component relative positional relationship, Motion conditions etc., if the particular pose changes, directionality instruction is also correspondingly changed correspondingly.
In addition, being somebody's turn to do " first ", " second " etc. if relating to the description of " first ", " second " etc. in the embodiment of the present invention Description be used for description purposes only, be not understood to indicate or imply its relative importance or implicitly indicate indicated skill The quantity of art feature." first " is defined as a result, the feature of " second " can explicitly or implicitly include at least one spy Sign.It in addition, the technical solution between each embodiment can be combined with each other, but must be with those of ordinary skill in the art's energy It is enough realize based on, will be understood that the knot of this technical solution when conflicting or cannot achieve when occurs in the combination of technical solution Conjunction is not present, also not the present invention claims protection scope within.
The present invention proposes that a kind of RF switch chip, RF switch chip refer to radio signal communications being converted into one Fixed radio signal waveform, and the electronic component sent by antenna resonance.RF switch microarray biochip packet Include receiving channel and transmission channel two large divisions.The RF switch chip category cable television network or communications field signaling switch, It is logical applied to carrier telephone switching, cable TV signal switching, cable TV signal switch, rf channel switching, control radio frequency The on-off etc. of signal connection transmitting antenna.In existing RF switch chip, due to each switch version of RF switch chip Figure disposing way it is mixed and disorderly inconsistent, lead to the area and cost increase of RF switch, while having between RF switch chip Signal interference influences the signal port from RF switch chip to the signal transmission antenna, results in transmission process The reduction of signal quality reduces the performances such as RF switch chip response speed.
To solve the above problems, in an embodiment of the present invention, reference is as shown in Figure 1, the RF switch chip includes packet Include signal port 10, antenna 20, N number of first switch module 30, N number of second switch module 40, biasing and control circuit (in figure not Draw), each switch module of N number of first switch module 30 and N number of second switch module 40 passes through signal wire 50 It is connected in series between the signal port 10 and the antenna 20;N number of first switch module 30 and N number of described second is opened Module 40 is closed with the antenna 20 as formed symmetrical setting;
It is described biasing and control circuit respectively with N number of first switch module 30 and N number of second switch module 40 Connection, the biasing and control circuit, for controlling a switch module in N number of first switch module 30 or N number of Switch module conducting in the second switch module 40, for passing through only between the signal port and the antenna 20 The switching molding block transmission signals of one conducting.
It is N number of using the axis of antenna 20 as symmetrical center line in the design layout of RF switch chip in the present embodiment The first switch module 30 and N number of second switch module 40 are arranged with the formed symmetrical of the antenna 20, that is to say as 3 first switch module 30 and 3 second switch modules 40 are set in RF switch chip shown in Fig. 1 with the formed symmetrical of antenna 20 It sets, it is to be understood that formed symmetrical of the multiple switch module on 20 axis both sides of antenna along antenna 20, symmetrical multiple switch Modular structure is identical, any one switch in N number of first switch module 30 and N number of second switch module 40 Module can be symmetricly set on any position of RF switch chip according to this, herein without limitation.Pass through RF switch chip In multiple switch module be arranged along 20 formed symmetrical of antenna, with reach RF switch chip switch domain it is compact put it is consistent, Reduce the area of RF switch chip layout so that parasitic capacitance effectively reduces, thus control RF switch chip at In the case where this, the response speed of RF switch is improved.
In the present embodiment, biasing and control circuit can control unlatching and the pass of RF switch chip in RF switch chip It is disconnected, when a switch module of N number of first switch module and N number of second switch module in control RF switch chip When conducting, it is all off just to control remaining switch, that is to say only one switching molding in synchronization, RF switch chip Block conducting further can be decoder, such as 3-8 decoder in biasing and control circuit, 5-32 decoder etc. is same At the moment, only one switch module can be connected under the selection of decoder.Thereby realize signal port and antenna it Between by the switching molding block transmission signals that are uniquely connected, there is no switching moldings caused by multiple switch module simultaneous transmission of signals Interfering with each other between block, the present embodiment, which realizes, reduces interfering with each other between each switch module, in signals transmission In improve the response speed of RF switch.
Wherein, biasing and control circuit can be set in the gap of each switch and antenna, are also possible to setting and are penetrating The other positions of frequency switch chip layout design, with N number of first switch module, N number of second switch module and antenna Between maintain a certain distance, herein without limitation, biasing and control circuit can be convenient in the case where guaranteeing to reduce interference The wiring of RF switch chip layout and the chip area for controlling RF switch chip, while also reducing biasing and control circuit pair The interference of signal transmission.
In the present embodiment, when a switch module is connected, radiofrequency signal can be the switch module signal end from conducting Mouth input is connected switch module and is transferred to antenna output, be also possible to receive external signal by antenna, through conducting switching molding Block is transferred to signal port output, it is to be understood that is transferred to signal port output and refers to that antenna receives external signal warp Conducting switch module is transferred to signal port and is output to internal circuit processing.
In the present embodiment, the quantity of switch module is 6 in RF switch chip, and the both sides of axis are respectively set in antennas 3, according to each switch module alignment as shown in Figure 1, it is to be understood that can also in the way of the arrangement of this domain To be 8,10,12 etc., herein without limitation;Be also possible to it is staggered according to each switch as shown in Figure 2, in day The both sides of line axis are respectively set 4, it is to be understood that by this domain arrangement in the way of be also possible to 6,10, 12 etc., herein without limitation.
In above-described embodiment, by being arranged between each switch module in RF switch chip along antenna formed symmetrical, with And the control that biasing and control circuit open and shut off each switch module in RF switch chip, it realizes in control radio frequency The area of switch chip reduces the signal interference in RF switch chip between each switch module, improves radiofrequency signal Transmission quality, improve the response speed of RF switch chip.
In one embodiment, as shown in Figure 1, N number of first switch module 30 is at single setting, and orientation and N A first switch module 30 is consistent with the symmetry axis extending direction of N number of second switch module 40, and N number of described second opens The corresponding N number of first switch module 30 of module 40 is closed to be arranged.
In the present embodiment, the symmetry axis of N number of first switch module and N number of second switch module is antenna N number of first switch module and N on axis both sides in antennas is arranged here using antenna axis extending direction as standard in axis A second switch module along antenna central axis direction arrange, and N number of first switch module along antenna central axis direction at one Row's setting, N number of second switch module is along the setting in a row of antenna central axis direction, it is to be understood that N number of described first opens Closing module and the setting in a row of N number of second switch module is the setting aligned with each other of every two adjacent switch module, i.e., It is that the multiple switch module on antenna axis both sides is can be between each other according to the mutual proper alignment of each switch as shown in Figure 1 Setting, the domain compact arrangement that multiple switch module in RF switch chip is furthermore achieved is consistent, controls RF switch The area of chip, so that parasitic capacitance effectively reduces, to improve and penetrate in the case where controlling RF switch chip cost The response speed of frequency switch.
In one embodiment, as shown in Fig. 2, N number of first switch module 30 relative to the antenna 20 inside and outside two rows Setting, and the symmetry axis of the orientation of each row and N number of first switch module 30 and N number of second switch module 40 Extending direction is consistent, and the first switch module 30 of inside and outside two rows mutually staggers setting in its orientation, and N number of described The corresponding N number of first switch module 30 of two switch modules 40 is arranged.
In the present embodiment, the symmetry axis of N number of first switch module and N number of second switch module is antenna N number of first switch module and N on axis both sides in antennas is arranged here using antenna axis extending direction as standard in axis A second switch module along antenna central axis direction arrange, and N number of first switch module along antenna central axis direction at interior Outer two rows of settings, N number of second switch module is along antenna central axis direction inside and outside two rows of settings, it is to be understood that N number of institute The switch module for stating first switch module and N number of second switch module every one side of axis in antennas mutually staggers into inside and outside two Row is arranged, and is that the multiple switch module on antenna axis both sides can be open according to each of as shown in Figure 2 between each other The staggered setting of mutual relative angle is closed, the first switch module or the second switch module of inside and outside two rows are in its arrangement The quantity mutually staggered on direction is one or more, and the version of multiple switch module in RF switch chip is furthermore achieved Figure arrangement is consistent, controls the area of RF switch chip, reduces the cost of RF switch chip.
In one embodiment, the spacing in N number of first switch module between any two adjacent first switch modules More than or equal to 150 microns;
And/or
Spacing in N number of second switch module between any two adjacent second switch modules is more than or equal to 150 microns.
In the present embodiment, the both sides of the axis in antennas of each switch module in RF switch chip are arranged, The preset value that the distance between any two adjacent switch module is more than or equal to is 150 microns, to be further ensured that each open It closes between module not by signal interference, signal cross-talk.If the distance between any two adjacent switch module less than 150 microns, Signal interference or signal cross-talk will be generated between each switch module, influences the transmission quality of radiofrequency signal, reduce radio frequency The response speed of switch chip.The present embodiment is greater than 150 microns using the distance between each switch module, further solves Between each switch of RF switch chip the problem of signal interference, the response speed of RF switch chip is improved.
In one embodiment, as shown in figure 4, the switch module in the RF switch chip include rf inputs 310, RF output end 320, switch unit circuit 330, gate voltage control circuit 340 and body pole control circuit 350, wherein
The switch unit circuit 330 includes multiple switch unit, and multiple switch units are sequentially connected in series in institute It states between rf inputs 310 and the RF output end 320, each switch unit in the switch unit circuit 330 Grid is connected with each other, and forms public grid, and body pole is connected with each other, and forms common body pole;
The rf inputs 310 are connect with the source electrode of the switch unit circuit 330, the RF output end 320 with The drain electrode of the switch unit circuit 330 connects, and the public grid and the grid voltage of the switch unit circuit 330 control Circuit 340 connects, and the common body pole in the switch unit circuit 330 is connect with body pole control circuit 350.
In the present embodiment, rf inputs 310, switch unit circuit 330 and RF output end 320 are sequentially connected, grid Voltage control circuit 340 is electrically connected with switch unit circuit 330, and radiofrequency signal is inputted from rf inputs 310, through switch unit It after circuit 330, is exported from RF output end 320, that is to say bias and control electricity in the arrangement of RF switch chip layout here The transmission of radiofrequency signal in the switch module of road control conducting, rf inputs 310 are the signal port of switch module, radio frequency Output end 320 is to connect with signal wire, and radiofrequency signal is exported through RF output end 320, then is transferred to antenna through signal wire.
In one embodiment, gate voltage control circuit 340 includes public grid biasing resistor Rg, first resistor R1 and the One capacitor C1;The first end of the public grid biasing resistor Rg is connect with the grid of multiple switch unit, the public grid The second end of biasing resistor Rg is separately connected with the first end of the first resistor R1 and the first end of the first capacitor C1, institute The second end for stating first resistor R1 is connect with the grid-control voltage Vg, the second end ground connection of the first capacitor C1.
In the present embodiment, due to being provided with public grid biasing resistor Rg, first resistor in gate voltage control circuit R1 and first capacitor C1 can make the source voltage of each switch unit in switch unit circuit and drain voltage open It closes and restores rapider when becoming shutdown from unlatching, so that the symmetry for quickly restoring direct current biasing point can be realized.Wherein, due to When switching unlatching, the grid of all switch units all connects with gate voltage control circuit respectively in switch unit circuit It connects, is gate bias resistor one parallel resistance of formation on all switch units, it is to be understood that all switches The public grid biasing resistor Rg connection in parallel resistance and gate voltage control circuit that gate bias resistor on pipe is formed. It realizes and improves external resistance value, improve the efficiency of grid equivalent AC impedance.
In the present embodiment, body pole control circuit 350 includes common body pole biasing resistor Rb, second resistance R2 and the second capacitor C2;The first end of the common body pole biasing resistor Rb is connect with the body of each switch unit common end extremely interconnected, described The first end point of the first end and the second capacitor C2 of the second end of common body pole biasing resistor Rb and the second resistance R2 It does not connect, the second end of the second end of the second resistance R2 and the second capacitor C2 are grounded respectively, solve RF switch Chip inhibits the ability of noise, further solves the linear characteristic of switch.
6 switch units in each switch module of the present embodiment are sequentially connected in series to be exported in rf inputs and radio frequency It is rf inputs connection if assigning each switch unit in switch unit circuit as level-one switch unit between end To the source electrode of first order switch unit, the source electrode of the drain electrode connection second level switch unit of first order switch unit, the second level is opened The source electrode of the drain electrode connection third level switch unit of unit is closed, the drain electrode connection fourth stage switch unit of third level switch unit Source electrode, then the source electrode of the drain electrode connection level V switch unit of fourth stage switch unit, the drain electrode of level V switch unit connect The source electrode of 6th grade of switch unit, the drain electrode of the 6th grade of switch unit are the RF output end of the switch.
It should be noted that switch as shown in Figure 4 can simplify as shown in Fig. 5, including rf inputs 310, grid Control voltage Vg and RF output end 320.
In one embodiment, as shown in fig. 6, the switch unit includes the switching tube 510 that multiple common gates are connected in parallel, It is understood that multiple switch pipe is connected in turn between input terminal and output end by source electrode and drain electrode, multiple switch pipe Grid be connected in parallel with each other, wherein the input terminal and output end of switch unit be above-mentioned series connection switch in each open The source electrode and drain electrode of pass, the switching tube 510 can be metal-oxide-semiconductor, triode, SOI transistor etc., herein without limitation.It needs Illustrate, switch unit as shown in FIG. 6 can simplify as shown in Fig. 7, to facilitate in RF switch chip switch unit electricity Each switch unit is connected in series with each other in road.
In one embodiment, each switch module in the first switch module and second switch module includes identical The switch unit of quantity, each switch unit include the switching tube that the common gate of identical quantity is connected in parallel.
In the present embodiment, each switch module in first switch module and second switch module includes the number of switch unit Amount is 6.It is understood that each switch module in first switch module and second switch module includes switch unit Quantity be also possible to 9,12 etc., herein without limitation.
In one embodiment, the switching tube that each switch unit in each switch module includes is SOI transistor, described The quantity of SOI transistor is 100, it is to be understood that the SOI switching tube in switch unit is also possible to 150,200 It is determined Deng, switching tube number in parallel according to the performance of pressure resistance and switch, herein without limitation.
In the present embodiment, 100 SOI transistors are connected in parallel, it is to be understood that in the SOI transistor being connected in parallel Each SOI transistor source electrode be connected with each other, drain electrode be connected with each other, so as to improve being opened in RF switch chip switch unit The voltage endurance capability for closing pipe, improves the overall performance of RF switch chip.
The foregoing is merely alternative embodiments of the invention, are not intended to limit the scope of the invention, all at this Under the inventive concept of invention, using equivalent structure transformation made by description of the invention and accompanying drawing content, or directly/use indirectly It is included in other related technical areas in scope of patent protection of the invention.

Claims (10)

1. a kind of RF switch chip, which is characterized in that opened including signal port, antenna, N number of first switch module, N number of second Close module, biasing and control circuit, each switch module of N number of first switch module and N number of second switch module It is connected in series between the signal port and the antenna by signal wire;N number of first switch module and N number of described Two switch modules are arranged by formed symmetrical of the antenna;
The biasing and control circuit are connect with N number of first switch module and N number of second switch module respectively, described Biasing and control circuit, for controlling a switch module or N number of second switch in N number of first switch module Switch module conducting in module, for the switch module between the signal port and the antenna by being uniquely connected Transmit signal.
2. RF switch chip as described in claim 1, which is characterized in that N number of first switch module at single setting, And orientation is consistent with the symmetry axis extending direction of N number of first switch module and N number of second switch module, it is N number of The second switch module corresponds to N number of first switch module setting.
3. RF switch chip as described in claim 1, which is characterized in that N number of relatively described day of first switch module Line is arranged inside and outside two rows, and the orientation of each row and N number of first switch module and N number of second switch module Symmetry axis extending direction it is consistent, the first switch module of inside and outside two rows mutually staggers setting in its orientation, N number of The second switch module corresponds to N number of first switch module setting.
4. RF switch chip as claimed in claim 3, which is characterized in that the first switch module of inside and outside two rows is at it The quantity mutually staggered in orientation is one or more, and N number of second switch module corresponds to N number of first switch Module setting.
5. the RF switch chip as described in claim 1-4 any one, which is characterized in that N number of first switch module In spacing between any two adjacent first switch modules be more than or equal to 150 microns;
And/or
It is micro- that spacing in N number of second switch module between any two adjacent second switch modules is more than or equal to 150 Rice.
6. RF switch chip as described in claim 1, which is characterized in that the switch module packet in the RF switch chip Include rf inputs, RF output end, switch unit circuit, gate voltage control circuit and body pole control circuit, wherein
The switch unit circuit includes multiple switch unit, and multiple switch units are sequentially connected in series defeated in the radio frequency Enter between end and the RF output end, the grid of each switch unit in the switch unit circuit is connected with each other, and is formed Public grid, body pole are connected with each other, and form common body pole;
The rf inputs are connect with the source electrode of the switch unit circuit, the RF output end and switch unit electricity The drain electrode on road connects, and the public grid of the switch unit circuit is connect with the gate voltage control circuit, and the switch is single Common body pole in first circuit is connect with body pole control circuit.
7. RF switch chip as claimed in claim 6, which is characterized in that the gate voltage control circuit includes common gate Pole biasing resistor, first resistor and first capacitor;
The first end of the public grid biasing resistor is connect with the grid of multiple switch units, the public grid biasing The second end of resistance is separately connected with the first end of the first resistor and the first end of the first capacitor, the first resistor Second end connect with the grid-control voltage, the second end of first capacitor ground connection;
Body pole control circuit includes common body pole biasing resistor, second resistance and the second capacitor;
The first end of common body pole biasing resistor is connect with the body of each switching tube common end extremely interconnected, described public The second end of body pole biasing resistor and the first end of the first end of the second resistance and second capacitor are separately connected, described The second end of second resistance and the second end of second capacitor are grounded respectively.
8. RF switch chip as described in claim 1, which is characterized in that the first switch module and second switch module In each switch module include identical quantity switch unit, each switch unit includes the total grid of identical quantity The switching tube that pole is connected in parallel.
9. RF switch chip as claimed in claim 8, which is characterized in that the first switch module and second switch module In each switch module include the switch unit quantity be 6.
10. RF switch chip as claimed in claim 8, which is characterized in that the switch in each switch unit Pipe is SOI transistor, and the quantity of the SOI transistor is 100.
CN201811463780.8A 2018-11-30 2018-11-30 RF switch chip Pending CN109450419A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201811463780.8A CN109450419A (en) 2018-11-30 2018-11-30 RF switch chip

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201811463780.8A CN109450419A (en) 2018-11-30 2018-11-30 RF switch chip

Publications (1)

Publication Number Publication Date
CN109450419A true CN109450419A (en) 2019-03-08

Family

ID=65555253

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201811463780.8A Pending CN109450419A (en) 2018-11-30 2018-11-30 RF switch chip

Country Status (1)

Country Link
CN (1) CN109450419A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN118471937A (en) * 2024-06-20 2024-08-09 睿思微系统(烟台)有限公司 Radio frequency switch chip and radio frequency switch module

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017028510A1 (en) * 2015-08-18 2017-02-23 中兴通讯股份有限公司 Radio frequency switch circuit and radio frequency link
CN207382280U (en) * 2017-11-20 2018-05-18 广东工业大学 A kind of switch core of RF switch
CN108063627A (en) * 2017-12-29 2018-05-22 苏州威发半导体有限公司 Radio-frequency receiving-transmitting switchs
CN108111155A (en) * 2017-11-30 2018-06-01 上海华虹宏力半导体制造有限公司 It is a kind of to improve nonlinear radio-frequency switch circuit
CN108134596A (en) * 2012-07-07 2018-06-08 天工方案公司 Switching circuit and its manufacturing method, integrated circuit, radio-frequency devices package module
CN209088911U (en) * 2018-11-30 2019-07-09 惠州华芯半导体有限公司 RF switch chip

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108134596A (en) * 2012-07-07 2018-06-08 天工方案公司 Switching circuit and its manufacturing method, integrated circuit, radio-frequency devices package module
WO2017028510A1 (en) * 2015-08-18 2017-02-23 中兴通讯股份有限公司 Radio frequency switch circuit and radio frequency link
CN207382280U (en) * 2017-11-20 2018-05-18 广东工业大学 A kind of switch core of RF switch
CN108111155A (en) * 2017-11-30 2018-06-01 上海华虹宏力半导体制造有限公司 It is a kind of to improve nonlinear radio-frequency switch circuit
CN108063627A (en) * 2017-12-29 2018-05-22 苏州威发半导体有限公司 Radio-frequency receiving-transmitting switchs
CN209088911U (en) * 2018-11-30 2019-07-09 惠州华芯半导体有限公司 RF switch chip

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN118471937A (en) * 2024-06-20 2024-08-09 睿思微系统(烟台)有限公司 Radio frequency switch chip and radio frequency switch module

Similar Documents

Publication Publication Date Title
US10505537B2 (en) Radio frequency antenna switch
US10063274B1 (en) Method to build asymmetrical transmit/receive switch with 90 degrees impedance transformation section
CN107924938B (en) High-performance radio frequency switch
CN102185594B (en) Single pole multi throw switch
CN1638186B (en) High frequency switch device
US9065164B2 (en) High frequency switch
CN101702627A (en) CMOS radio frequency (RF) switch based on silicon-on-insulator (SOI) technology
CN110021595A (en) Semiconductor device
CN107579730A (en) A kind of fully integrated single-pole double-throw switch (SPDT) circuit
CN103595380A (en) RF switch with complementary switching devices
CN109873625A (en) A kind of active switch structure suitable for millimeter wave phased array system
CN109714005A (en) A kind of restructural double frequency-band frequency mixer
CN109347462A (en) RF switch chip
CN209088911U (en) RF switch chip
CN104639135A (en) Devices and methods related to radio-frequency switches having improved performance
CN109450419A (en) RF switch chip
CN209593386U (en) RF switch chip
CN102655404A (en) Differential radio frequency switch circuit
CN102355247A (en) Planar integrated switching device
CN110350900A (en) A kind of single-pole single-throw switch (SPST) and single-pole double-throw switch (SPDT)
CN104993812B (en) High-isolation RF switch with trapper structure
CN102569392A (en) Laterally diffused metal oxide semiconductor (LDMOS) transistor, layout method and manufacture method
CN209088907U (en) Radio-frequency switch circuit, switch chip and communication terminal
CN112653439B (en) Multiband single-pole double-throw switch
US10672877B2 (en) Method of boosting RON*COFF performance

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
CB02 Change of applicant information

Address after: 516000 7 / F, Hong Kong and Macao Youth Entrepreneurship base, Huigang City Commercial Plaza, No. 10, Hechang fifth Road West, Zhongkai high tech Zone, Huizhou, Guangdong

Applicant after: Liaojing semiconductor (Huizhou) Co.,Ltd.

Address before: 516000 room 409, riyuehe Kechuang building, No. 142, Huifeng fifth road, Zhongkai high tech Zone, Huizhou, Guangdong

Applicant before: HUIZHOU HUAXIN SEMICONDUCTOR Co.,Ltd.

CB02 Change of applicant information