CN109449747A - A kind of mode of laser group and mobile terminal - Google Patents
A kind of mode of laser group and mobile terminal Download PDFInfo
- Publication number
- CN109449747A CN109449747A CN201811564986.XA CN201811564986A CN109449747A CN 109449747 A CN109449747 A CN 109449747A CN 201811564986 A CN201811564986 A CN 201811564986A CN 109449747 A CN109449747 A CN 109449747A
- Authority
- CN
- China
- Prior art keywords
- substrate
- mode
- optical element
- lasing fluorescence
- oxidizable
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0233—Mounting configuration of laser chips
- H01S5/02345—Wire-bonding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0225—Out-coupling of light
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/023—Mount members, e.g. sub-mount members
- H01S5/0231—Stems
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/06—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium
Abstract
The embodiment of the invention provides a kind of mode of laser group and mobile terminal, the mode of laser group includes: substrate, lasing fluorescence chip, bracket and optical element；Wherein, the substrate is connect with the optical element by the bracket；The substrate, the optical element and the bracket form accommodating chamber；The accommodating chamber is anaerobic cavity configuration；The lasing fluorescence chip is set in the accommodating chamber, and is fixedly arranged on the substrate；It is electrically connected between the lasing fluorescence chip and the substrate by the realization of oxidizable conductive structure.The embodiment of the present invention can improve the security performance of the mode of laser group to avoid since the optical element is damaged or the laser that the caused lasing fluorescence chip issues that falls off shines directly on human body.
Description
Technical field
The present invention relates to fields of communication technology, more particularly to a kind of mode of laser group and mobile terminal.
Background technique
The user of ultimate attainment pursuit with to(for) usage experience, use of the user for mobile terminals such as mobile phone, tablet computers
Experience requirements are higher and higher.Recognition of face, range determination etc. are carried out in order to facilitate user, more and more mobile terminal configurations have
Mode of laser group, to emit recognition of face, the range determination etc. that laser carries out user.
It in the case where being directly mapped to human body due to laser, can cause harm to the human body, therefore, in practical applications, often
It needs that corresponding safety guard is arranged in mode of laser group.Referring to Fig.1, a kind of structure of existing mode of laser group is shown
Schematic diagram can specifically include: lasing fluorescence chip 10, package substrate 11, bracket 12 and optical element 13, wherein optics
The material of element 13 is glass, can pass through glue bonding connection between optical element 13 and bracket 12.In practical applications, light
Learning element 13 can be used for the laser of the sending of spread laser luminescence chip 10, avoids the laser from being directly mapped on human body and makes to human body
At injury.
However, in mode of laser group shown in FIG. 1, since the material of optical element 13 is glass, mobile terminal by
To when colliding or falling, optical element 13 is easy to breakage.Moreover, because passing through glue between optical element 13 and bracket 12
Connection, when mobile terminal is collided or falls, optical element 13 is easy in the case where being subject to external force from bracket 12
On fall off.In practical applications, in the case where optical element 13 is damaged or falls off, it is easy to lead to lasing fluorescence chip 10
The laser of sending shines directly on human body, causes harm to the human body.
Summary of the invention
In view of this, when being collided or fall to solve existing mobile terminal, what lasing fluorescence chip issued
Laser is easy the problem of shining directly on human body, causing harm to the human body, and the embodiment of the invention provides a kind of mode of laser groups
And a kind of mobile terminal.
On the one hand, the embodiment of the invention discloses a kind of mode of laser groups, comprising: substrate, lasing fluorescence chip, bracket and
Optical element；Wherein
The substrate is connect with the optical element by the bracket；
The substrate, the optical element and the bracket form accommodating chamber, and the accommodating chamber is anaerobic cavity configuration；
The lasing fluorescence chip is set in the accommodating chamber, and is fixedly arranged on the substrate；
It is electrically connected between the lasing fluorescence chip and the substrate by the realization of oxidizable conductive structure.
On the other hand, the embodiment of the invention also provides a kind of mobile terminals, comprising: above-mentioned mode of laser group.
The embodiment of the present invention includes following advantages:
In the embodiment of the present invention, the substrate is connect with the optical element by the bracket；The substrate, the light
It learns element and the bracket forms accommodating chamber；The accommodating chamber is anaerobic cavity configuration；The lasing fluorescence chip is set to institute
It states in accommodating chamber, and is fixedly arranged on the substrate；Pass through oxidizable conductive knot between the lasing fluorescence chip and the substrate
Structure realizes electrical connection.In practical applications, in the case where the optical element occurs breakage or falls, extraneous air can
To enter the accommodating chamber, so that oxidation, which occurs, for the oxidizable conductive structure loses conductive capability, in this manner it is possible to disconnect institute
The electrical connection between substrate and the lasing fluorescence chip is stated, the lasing fluorescence chip is avoided to issue laser.In this manner it is possible to
It avoids since the optical element is damaged or the laser that the caused lasing fluorescence chip issues that falls off shines directly into people
On body, the security performance of the mode of laser group is improved.
Detailed description of the invention
Fig. 1 is a kind of structural schematic diagram of existing mode of laser group；
Fig. 2 is a kind of structural schematic diagram of mode of laser group of the invention；
Fig. 3 is the structural schematic diagram of optical element shown in Fig. 2；
Fig. 4 is the electrical block diagram of mode of laser group shown in Fig. 2.
Specific embodiment
In order to make the foregoing objectives, features and advantages of the present invention clearer and more comprehensible, with reference to the accompanying drawing and specific real
Applying mode, the present invention is described in further detail.
The embodiment of the invention provides a kind of mode of laser groups, can specifically include: substrate, lasing fluorescence chip, bracket with
And optical element；Wherein, the substrate is connect with the optical element by the bracket；The substrate, the optical element
And the bracket forms accommodating chamber；The accommodating chamber is anaerobic cavity configuration；The lasing fluorescence chip is set to the receiving
It is intracavitary, and be fixedly arranged on the substrate；It is realized between the lasing fluorescence chip and the substrate by oxidizable conductive structure
Electrical connection.
In the embodiment of the present invention, the material of the oxidizable conductive structure can be the active of the types such as potassium, sodium or lithium
At least one of metal, in practical applications, since the material of the oxidizable conductive structure is active metal,
In the case that the oxidizable conductive structure is contacted with oxygen, oxidation reaction easily occurs for the oxidizable conductive structure, loses
Conductive capability.
In the embodiment of the present invention, the substrate is connect with the optical element by the bracket；The substrate, the light
It learns element and the bracket forms accommodating chamber；The accommodating chamber is anaerobic cavity configuration；The lasing fluorescence chip is set to institute
It states in accommodating chamber, and is fixedly arranged on the substrate；Pass through oxidizable conductive knot between the lasing fluorescence chip and the substrate
Structure realizes electrical connection.In practical applications, in the case where the optical element occurs breakage or falls, extraneous air can
To enter the accommodating chamber, so that oxidation, which occurs, for the oxidizable conductive structure loses conductive capability, in this manner it is possible to disconnect institute
The electrical connection between substrate and the lasing fluorescence chip is stated, the lasing fluorescence chip is avoided to issue laser.In this manner it is possible to
It avoids since the optical element is damaged or the laser that the caused lasing fluorescence chip issues that falls off shines directly into people
On body, the security performance of the mode of laser group is improved.
Referring to Fig. 2, show a kind of structural schematic diagram of mode of laser group of the invention, can specifically include: substrate 20 swashs
Light luminescence chip 21, bracket 22 and optical element 23；Wherein, substrate 20 is connect with optical element 23 by bracket 22；Substrate
20, optical element 23 and bracket 22 form accommodating chamber 24；Accommodating chamber 24 is anaerobic cavity configuration；Lasing fluorescence chip 21 is set to
In accommodating chamber 24, and it is fixedly arranged on substrate 20；It is realized between lasing fluorescence chip 21 and substrate 20 by oxidizable conductive structure
Electrical connection.In mode of laser group shown in Fig. 2, the oxidizable conductive structure is oxidizable fuse 25, oxidizable fuse 25
Substrate 20 and lasing fluorescence chip 21 are separately connected by conducting wire 26.The embodiment of the present invention can be broken to avoid due to optical element 23
The laser that lasing fluorescence chip 21 issues caused by damaging or falling off shines directly on human body, improves the peace of the mode of laser group
Full performance.
In practical applications, the material of optical element 23 can be glass, can lead between optical element 23 and bracket 22
Cross glue bonding connection.In practical applications, in the case where the material of optical element 23 is glass, the light transmission of optical element 23
Property is preferable.Specifically, optical element 23 can be used for the laser of the sending of spread laser luminescence chip 21, and the laser is avoided directly to penetrate
It is injured caused by human body on to human body.
Referring to Fig. 3, the structural schematic diagram of optical element shown in Fig. 2 is shown, as shown in figure 3, optical element 23 can be with
Including optical element ontology 231 and micro-structure 232；Wherein, micro-structure 232 is arranged on optical element ontology 231 close to laser
On the surface of luminescence chip 21；The position of micro-structure 232 is opposite with the position of lasing fluorescence chip 21.
In practical applications, since the position of micro-structure 232 is opposite with the position of lasing fluorescence chip 21, micro-structure 232
The laser that lasing fluorescence chip 21 issues can be diffused, the laser light for the angle very little that lasing fluorescence chip 21 is issued
Beam Radiating replication reduces the energy for the laser beam that lasing fluorescence chip 21 issues at the uniform beam or hot spot of wide-angle,
The laser beam is avoided directly to be mapped to the injury caused by human body on human body.
In the embodiment of the present invention, optical element 23 can be fixed on bracket 22 by bond mediums such as glue, adhesive tapes, base
It can be realized and be connected by bracket 22 between plate 20 and optical element 23.Substrate 20, optical element 23 and bracket 22 can be with shapes
At accommodating chamber 24；Accommodating chamber 24 is anaerobic cavity configuration.
Specifically, the anaerobic cavity configuration can be vacuum chamber structure or inert gas cavity configuration.In practical applications,
The vacuum cavity configuration can be obtained by the method vacuumized to accommodating chamber 24, and the inert gas cavity configuration can lead to
The method for being filled inert gas to accommodating chamber 24 is crossed to obtain.In specific application, those skilled in the art can basis
Accommodating chamber 24 is arranged to vacuum cavity configuration or inert gas cavity configuration by actual needs, and the embodiment of the present invention is for accommodating chamber 24
Specific structure can be without limitation.
In the embodiment of the present invention, lasing fluorescence chip 21 is located in accommodating chamber 24, and is fixed on substrate 20, lasing fluorescence
It is electrically connected between chip 21 and substrate 20 by the realization of oxidizable conductive structure.Specifically, lasing fluorescence chip 21 may include
Opposite side of the positive electrode and negative side；Wherein, the negative side is fixed on substrate 20, and is electrically connected with substrate 20；The anode
Side is electrically connected by the oxidizable conductive structure with the realization of substrate 20.
In the embodiment of the present invention, the oxidizable conductive structure is set in accommodating chamber 24, since accommodating chamber 24 is anaerobic
Cavity configuration, therefore, the oxidizable conductive structure are not susceptible to aoxidize, in this way, can between substrate 20 and lasing fluorescence chip 21
To realize conducting by the oxidizable conductive structure, substrate 20 can power to lasing fluorescence chip 21 so that lasing fluorescence
Chip 21 can issue laser beam.
In practical applications, in the case where optical element 23 occurs breakage or falls, extraneous air can enter
Accommodating chamber 24, so that oxidation, which occurs, for the oxidizable conductive structure loses conductive capability, in this manner it is possible to disconnect substrate 20 and swash
Electrical connection between light luminescence chip 21 avoids lasing fluorescence chip 21 from issuing laser.In this manner it is possible to avoid due to optics member
Part 23 is damaged or the laser that caused lasing fluorescence chip 21 issues that falls off shines directly on human body, improves the mode of laser
The security performance of group.
In mode of laser group shown in Fig. 2, the oxidizable conductive structure can be oxidizable fuse 25, oxidizable insurance
Silk is located in accommodating chamber 24.In practical applications, since accommodating chamber 24 is anaerobic cavity configuration, oxidizable fuse is not easy
It aoxidizes, in this way, can realize conducting by the oxidizable conductive structure between substrate 20 and lasing fluorescence chip 21.
Referring to Fig. 4, the electrical block diagram of mode of laser group shown in Fig. 2 is shown, as shown in figure 4, oxidizable insurance
Silk 25 is separately connected power supply 201 and lasing fluorescence chip 21 on substrate 20 by conducting wire 26.
In the embodiment of the present invention, in the case where optical element 23 occurs breakage or falls, extraneous air can be into
Enter accommodating chamber 24, so that oxidizable fuse 25 occurs oxidation and loses conductive capability, in this manner it is possible to disconnect the electricity on substrate 20
Electrical connection between source 201 and lasing fluorescence chip 21 avoids lasing fluorescence chip 21 from issuing laser.In this manner it is possible to avoid
Since optical element 23 is damaged or the laser that caused lasing fluorescence chip 21 issues that falls off shines directly on human body, improve
The security performance of the mode of laser group.
In practical applications, when exposure in air due to the oxidizable conductive structure, oxidation easily occurs and loses
Remove conductive capability, that is to say, that during the oxidizable conductive structure is installed, need to avoid the oxidizable conductive knot
Structure is contacted with air, and the oxidizable conductive structure is for the more demanding of installation environment.
In laser film group as indicated with 2, the oxidizable conductive structure can be oxidizable fuse 25, in practical application
In, it is only necessary to by oxidizable fuse 25 carry out Vacuum Package, then again by conducting wire 26 by oxidizable fuse 25 respectively with base
Plate 20, lasing fluorescence chip 21 connect.That is, in the feelings that the oxidizable conductive structure is oxidizable fuse 25
Under condition, can reduce can reduce installation difficulty in turn for the environmental requirement for installing the oxidizable conductive structure.
In an alternative embodiment of the invention, the oxidizable conductive structure can also be oxidizable conducting wire, described
Oxidizable conducting wire is separately connected substrate 20 and lasing fluorescence chip 21.
In the embodiment of the present invention, in the case where optical element 23 occurs breakage or falls, extraneous air can be into
Enter accommodating chamber 24, so that oxidation, which occurs, for the oxidizable conducting wire loses conductive capability, in this manner it is possible to disconnect substrate 20 and laser
Electrical connection between luminescence chip 21 avoids lasing fluorescence chip 21 from issuing laser.In this manner it is possible to avoid due to optical element
23 damaged or caused 21 sending of lasing fluorescence chip that falls off laser shine directly on human body, improve the mode of laser group
Security performance.
In practical applications, in the case where the oxidizable conductive structure is the oxidizable conducting wire, institute can be made
The structure for stating mode of laser group is relatively simple, in this manner it is possible to reduce the infrastructure cost of the mode of laser group.
To sum up, mode of laser group of the present invention includes at least following advantages:
In the embodiment of the present invention, the substrate is connect with the optical element by the bracket；The substrate, the light
It learns element and the bracket forms accommodating chamber；The accommodating chamber is anaerobic cavity configuration；The lasing fluorescence chip is set to institute
It states in accommodating chamber, and is fixed on the substrate；Pass through oxidizable conductive knot between the lasing fluorescence chip and the substrate
Structure realizes electrical connection.In practical applications, in the case where the optical element occurs breakage or falls, extraneous air can
To enter the accommodating chamber, so that oxidation, which occurs, for the oxidizable conductive structure loses conductive capability, in this manner it is possible to disconnect institute
The electrical connection between substrate and the lasing fluorescence chip is stated, the lasing fluorescence chip is avoided to issue laser.In this manner it is possible to
It avoids since the optical element is damaged or the laser that the caused lasing fluorescence chip issues that falls off shines directly into people
On body, the security performance of the mode of laser group is improved.
The embodiment of the invention also includes a kind of mobile terminal, the mobile terminal be can specifically include: above-mentioned mode of laser
Group.Specifically, the mode of laser group can be connect with mainboard, the power supply in the mobile terminal, with the place on the mainboard
Reason device and the power supply are used cooperatively, and issue recognition of face, range determination etc. that laser carries out user.The mobile terminal packet
Include but be not limited to mobile phone, tablet computer, any one in Wearable equipment.
All the embodiments in this specification are described in a progressive manner, the highlights of each of the examples are with
The difference of other embodiments, the same or similar parts between the embodiments can be referred to each other.
Although the preferred embodiment of the embodiment of the present invention has been described, once a person skilled in the art knows bases
This creative concept, then additional changes and modifications can be made to these embodiments.So the following claims are intended to be interpreted as
Including preferred embodiment and fall into all change and modification of range of embodiment of the invention.
Finally, it is to be noted that, herein, relational terms such as first and second and the like be used merely to by
One entity or operation are distinguished with another entity or operation, without necessarily requiring or implying these entities or operation
Between there are any actual relationship or orders.Moreover, the terms "include", "comprise" or its any other variant meaning
Covering non-exclusive inclusion, so that process, method, article or terminal device including a series of elements not only wrap
Those elements are included, but also including other elements that are not explicitly listed, or further includes for this process, method, article
Or the element that terminal device is intrinsic.In the absence of more restrictions, being wanted by what sentence "including a ..." limited
Element, it is not excluded that there is also other identical elements in process, method, article or the terminal device for including the element.
Above to a kind of mode of laser group provided by the present invention and a kind of mobile terminal, it is described in detail, herein
Apply that a specific example illustrates the principle and implementation of the invention, the explanation of above example is only intended to help
Understand method and its core concept of the invention；At the same time, for those skilled in the art, according to the thought of the present invention,
There will be changes in the specific implementation manner and application range, in conclusion the content of the present specification should not be construed as to this
The limitation of invention.
Claims (9)
1. a kind of mode of laser group characterized by comprising substrate, lasing fluorescence chip, bracket and optical element；Wherein
The substrate is connect with the optical element by the bracket；
The substrate, the optical element and the bracket form accommodating chamber, and the accommodating chamber is anaerobic cavity configuration；
The lasing fluorescence chip is set in the accommodating chamber, and is fixedly arranged on the substrate；
It is electrically connected between the lasing fluorescence chip and the substrate by the realization of oxidizable conductive structure.
2. mode of laser group according to claim 1, which is characterized in that the oxidizable conductive structure is oxidizable insurance
Silk, the oxidizable fuse are separately connected the substrate and the lasing fluorescence chip by conducting wire.
3. mode of laser group according to claim 1, which is characterized in that the oxidizable conductive structure is oxidizable conducting wire,
The oxidizable conducting wire is separately connected the substrate and the lasing fluorescence chip.
4. mode of laser group according to claim 1, which is characterized in that the material of the oxidizable conductive structure is potassium, sodium
At least one of with lithium.
5. mode of laser group according to claim 1, which is characterized in that the anaerobic cavity configuration is vacuum cavity configuration or lazy
Property gas cavity configuration.
6. mode of laser group according to claim 1, which is characterized in that the lasing fluorescence chip includes opposite side of the positive electrode
And negative side；Wherein
The negative side is fixed on the substrate, and is electrically connected with the substrate；
The side of the positive electrode is electrically connected by oxidizable conductive structure with substrate realization.
7. mode of laser group according to claim 1, which is characterized in that the optical element includes optical element ontology and micro-
Structure；Wherein
The micro-structure is arranged on the optical element ontology on the surface of the lasing fluorescence chip, and swashs with described
The position of light luminescence chip is opposite.
8. the mode of laser group according to claim, which is characterized in that the material of the optical element is glass.
9. a kind of mobile terminal characterized by comprising the described in any item mode of laser groups of claim 1 to 8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811564986.XA CN109449747A (en) | 2018-12-20 | 2018-12-20 | A kind of mode of laser group and mobile terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811564986.XA CN109449747A (en) | 2018-12-20 | 2018-12-20 | A kind of mode of laser group and mobile terminal |
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| Publication Number | Publication Date |
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| CN109449747A true CN109449747A (en) | 2019-03-08 |
Family
ID=65559978
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| Application Number | Title | Priority Date | Filing Date |
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| CN201811564986.XA Pending CN109449747A (en) | 2018-12-20 | 2018-12-20 | A kind of mode of laser group and mobile terminal |
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| Country | Link |
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| CN109921278A (en) * | 2019-03-28 | 2019-06-21 | 维沃移动通信有限公司 | Laser projection mould group |
| US11121288B2 (en) | 2019-01-16 | 2021-09-14 | Lextar Electronics Corporation | Package structure of light-emitting element |
| CN114024207A (en) * | 2020-07-17 | 2022-02-08 | 宁波舜宇车载光学技术有限公司 | Transmitting terminal and preparation method |
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