CN109449140A - Display panel and motherboard - Google Patents
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- CN109449140A CN109449140A CN201811291804.6A CN201811291804A CN109449140A CN 109449140 A CN109449140 A CN 109449140A CN 201811291804 A CN201811291804 A CN 201811291804A CN 109449140 A CN109449140 A CN 109449140A
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- 239000000758 substrate Substances 0.000 claims description 5
- 238000005253 cladding Methods 0.000 claims description 2
- 238000005520 cutting process Methods 0.000 abstract description 24
- 238000012360 testing method Methods 0.000 abstract description 16
- 230000000694 effects Effects 0.000 abstract description 14
- 238000010586 diagram Methods 0.000 description 14
- 238000000034 method Methods 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 7
- 230000005611 electricity Effects 0.000 description 6
- 238000005538 encapsulation Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- ODINCKMPIJJUCX-UHFFFAOYSA-N Calcium oxide Chemical compound [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
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- WMWLMWRWZQELOS-UHFFFAOYSA-N bismuth(iii) oxide Chemical compound O=[Bi]O[Bi]=O WMWLMWRWZQELOS-UHFFFAOYSA-N 0.000 description 2
- QPLDLSVMHZLSFG-UHFFFAOYSA-N CuO Inorganic materials [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910003069 TeO2 Inorganic materials 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
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- 230000009286 beneficial effect Effects 0.000 description 1
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- 235000013399 edible fruits Nutrition 0.000 description 1
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- 239000003292 glue Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
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- 229910052760 oxygen Inorganic materials 0.000 description 1
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- 239000010409 thin film Substances 0.000 description 1
- QHGNHLZPVBIIPX-UHFFFAOYSA-N tin(II) oxide Inorganic materials [Sn]=O QHGNHLZPVBIIPX-UHFFFAOYSA-N 0.000 description 1
- ZNOKGRXACCSDPY-UHFFFAOYSA-N tungsten(VI) oxide Inorganic materials O=[W](=O)=O ZNOKGRXACCSDPY-UHFFFAOYSA-N 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/60—Protection against electrostatic charges or discharges, e.g. Faraday shields
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/0203—Particular design considerations for integrated circuits
- H01L27/0248—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection
- H01L27/0251—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices
- H01L27/0292—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices using a specific configuration of the conducting means connecting the protective devices, e.g. ESD buses
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Liquid Crystal (AREA)
Abstract
This application discloses a kind of display panel and motherboards, the display panel motherboard includes the display panel of multiple array arrangements, each panel surface defines the non-display area of viewing area and non-display area, non-display area is provided with multiple conductive gaskets and a plurality of short-circuit connecting line, is provided with static short ring on the non-display area of the display panel of at least non-first trip；Wherein, one end of a plurality of short-circuit connecting line in same row in each display panel is respectively connected to multiple conductive gaskets, and the static short ring of neighbouring display panels is electrically connected in the other end and next line.By the above-mentioned means, the application can eliminate the electrostatic that display panel motherboard generates display panel during test or cutting, the electrostatic protection effect of panel is promoted.
Description
Technical field
This application involves field of display technology, more particularly to a kind of display panel and motherboard.
Background technique
Existing display panel is provided with and cuts on display panel motherboard by the way that display panel motherboard is carried out cutting formation
Display panel motherboard is divided into multiple display panel units by secant, cutting line, is completed further according to cutting line to display panel mother
After the cutting of plate, a display panel unit just corresponds to a display panel.
Wherein, during making display panel, to avoid generating pressure difference and motherboard in cutting, test between each signal
A large amount of electrostatic is generated Deng during, can generally carry out eliminating electrostatic by the way of by all signal wire equipotential links
It influences.However, being already provided with various conductive gaskets in the lower frame binding area of display panel, to realize narrow frame design
Through static short ring (ESD short-circuited conducting sleeve) can not be being placed, come especially for the display panel that non-zero spacing is arranged on motherboard
It says, if nowhere placing static short ring, motherboard easily generates a large amount of electrostatic during test, cutting etc., to display surface
Damage by static electricity is caused in the viewing area of plate, in turn results in display exception, influences the productivity and the quality of production of product.
Summary of the invention
The application provides a kind of display panel and display device, is able to solve in motherboard in the prior art between display panel zero
Away from fruit the problem of can not placing static short ring when arranging.
In order to solve the above technical problems, the technical solution that the application uses is: providing a kind of display panel motherboard, wrap
Include the display panel of multiple array arrangements, each panel surface defines the non-of viewing area and the non-display area
Viewing area, the non-display area are provided with multiple conductive gaskets and a plurality of short-circuit connecting line, the display surface of at least non-first trip
Static short ring is provided on the non-display area of plate；Wherein, the display panel of at least non-first trip described in same row
In one end of a plurality of short-circuit connecting line be respectively connected to the multiple conductive gasket, adjacent institute in the other end and next line
The static short ring for stating display panel is electrically connected.
In order to solve the above technical problems, another technical solution that the application uses is: a kind of display panel is provided, it is described
Display panel defines the non-display area of viewing area and the non-display area, and the non-display area is provided with multiple conductive liners
Pad, a plurality of short-circuit connecting line and static short ring；Wherein, one end of a plurality of short-circuit connecting line is respectively connected to described more
A conductive gasket, the other end extend to the edge of the display panel, and in the fabrication process and in display panel motherboard
Another display panel electrically connect.
In order to solve the above technical problems, another technical solution that the application uses is: a kind of display panel is provided, it is described
Display panel defines the non-display area of viewing area and the non-display area, and the non-display area is provided with static short loop wire
And short-circuit connecting line；Described short circuit connecting line one end is connected to the static short loop wire, and the other end extends to the display
Substrate edges, the electric connection of another display base plate for being connected to substrate motherboard in the fabrication process.
The beneficial effect of the application is: a kind of display panel and motherboard is provided, by by first trip display panel non-in motherboard
Multiple conductive gaskets setting static short ring in neighbouring display panels is connected in next line by short-circuit connecting line, can make
The equipotential link of all signals in display panel is obtained, eliminates display panel motherboard during test or cutting to display
The electrostatic that panel generates, promotes the electrostatic protection effect of panel.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the application display panel motherboard first embodiment；
Fig. 2 is the schematic cross-section of one embodiment of the area B-B ' in the application Fig. 1；
Fig. 3 is the structural schematic diagram of the application display panel motherboard second embodiment；
Fig. 4 is the structural schematic diagram of the application display panel motherboard third embodiment；
Fig. 5 is the structural schematic diagram of the 4th embodiment of the application display panel motherboard；
Fig. 6 is the structural schematic diagram of the 5th embodiment of the application display panel motherboard；
Fig. 7 is the structural schematic diagram of the application display panel motherboard sixth embodiment；
Fig. 8 is the structural schematic diagram of the application display panel first embodiment；
Fig. 9 is the structural schematic diagram of the application display panel second embodiment.
Specific embodiment
Below in conjunction with the attached drawing in the embodiment of the present application, technical solutions in the embodiments of the present application carries out clear, complete
Site preparation description, it is clear that described embodiment is only a part of the embodiment of the application, instead of all the embodiments.It is based on
Embodiment in the application, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall in the protection scope of this application.
Term " first ", " second ", " third " in the application are used for description purposes only, and should not be understood as instruction or dark
Show relative importance or implicitly indicates the quantity of indicated technical characteristic." first ", " second ", " are defined as a result,
Three " feature can explicitly or implicitly include at least one of the features.In the description of the present application, the meaning of " plurality " is extremely
It is two few, such as two, three etc., unless otherwise specifically defined.
Referring to Fig. 1, Fig. 1 is the structural schematic diagram of the application display panel motherboard first embodiment.As shown in Figure 1,
Display panel motherboard 100 provided by the present application includes the display panel 110 of multiple array arrangements, optionally, phase in the present embodiment
Spacing between adjacent display panel 110 is zero, that is to say, that in the application on display panel motherboard 100 zero between display panel between
Away from arrangement.
Wherein, each 110 surface of the display panel defines the non-display area of 111 periphery of viewing area 111 and viewing area
112.The arrangement of display panel is with 1 multiplied by 2 (the i.e. display panels 110 of line direction in display panel motherboard 100 in the present embodiment
Number be 1, the number of column direction display panel 110 be 2) for do specific introduction.Such as Fig. 1, each display panel 110 it is non-
Viewing area 112 is provided with multiple conductive gaskets 1121 and a plurality of short-circuit connecting line 1122, the display panel 110 of at least non-first trip
Static short ring 113 is provided on non-display area 112.
Wherein, conductive gasket 1121 can be testing conductive liner, flip chip conductive gasket, i.e. COF pads (Chip
On Film) etc., it is not especially limited herein, wherein the viewing area of each display panel 110 is provided with a plurality of
Signal lead (not shown), the signal lead are fanned out to 1121 electricity of cabling B and conductive gasket by what is be arranged in non-display area 112
Property connection.
Wherein, one end of a plurality of short-circuit connecting line 1122 in same row in each display panel 100 is separately connected
To multiple conductive gaskets 1121, the static short ring 113 of neighbouring display panels 110 is electrically connected in the other end and next line.Tool
Body combination Fig. 1 is not provided with static short ring in the display panel 110 of the first row on display panel motherboard 100 in the present embodiment
113, the non-display area 112 of the display panel 110 of adjacent rows is provided with static short ring 113.Certainly in other embodiments,
Static short ring 113 can also be set in the display panel 110 of the first row, be not specifically limited herein.
Specifically, the non-display area 112 of each display panel 110 includes at least setting and adjacent lastrow display panel
110 the first close non-display areas 115.It is understood that in the same row of display panel motherboard 100, adjacent two display surface
The adjacent place of plate 110 can consider the lower frame of lastrow display panel 110 and the upper side frame neighbour of next line display panel 110
It connects, that is to say, that first non-display area 115 is located at the upper side frame of display panel 110, and the static short ring 113 can be set
It sets in first non-display area 115.
It is the schematic cross-section of one embodiment of the area B-B ' in the application Fig. 1 further combined with Fig. 2, Fig. 2.Wherein, each
Display panel 110 includes the encapsulated layer 116 of cladding viewing area 111 and non-display area 112, and static short ring 113 is set to
It covers defined in non-display area 112 between the encapsulated layer 116 of first non-display area 115 and the underlay substrate 101 of display panel.
Optionally, the encapsulation of each display panel 110 is encapsulated using Frit in the present embodiment, i.e., is formed with frits upper and lower base plate
Encapsulated layer obstructs extraneous water oxygen, to protect the luminescent device in display panel.Wherein, which can be made using conventional
At least one in frit, such as Al2O3, SnO, TeO2, MgO, CaO, ZnO, TiO2, WO3, Bi2O3, Fe2O3, CuO
Kind, it is not specifically limited herein.It is understood that in the other embodiment of the application, it can also be using other encapsulation
Mode is packaged each display panel 110, such as thin-film package, UV glue encapsulation etc., is not specifically limited herein.
Optionally, as Fig. 2 static short ring 113 is set to the encapsulated layer 116 and display surface of the first non-display area 115 of covering
Between the underlay substrate 101 of plate.In order to make the setting of static short ring 113 not influence encapsulation of the encapsulated layer 116 to panel, this reality
Apply in example is arranged very thin by the thickness of static short ring 113, can be 1/10th, the 30 of 116 thickness of encapsulated layer here
/ mono-, 1/50th etc., it is not specifically limited herein, and encapsulated layer is not illustrated in Fig. 1.
It is understood that static short ring 113 can be the guard wire of a circle Electro-static Driven Comb, material can use more
Crystal silicon (Polysilicon, PSI).Certainly, in other embodiments, 113 degree of materials of electrostatic Duan Luhuan can also be metal,
It is not specifically limited herein.Wherein, impedance can be set to 50K Ω~300K Ω, specifically can be 50K Ω, 175K Ω, 300K
Ω etc. is not specifically limited herein.
It is understood that the cutting of display panel motherboard 100 or after subsequent display panel 110 completes it is right
A large amount of electrostatic are easy to produce in its stage tested, and electrostatic is easily guided into the gold in 110 non-display area 112 of display panel
Belong to the damage by static electricity for causing device in cabling and viewing area 111, in turn result in that display is not normal, influences the production effect of display panel
Rate.Therefore multiple conductive gaskets of the application in same row in the first row display panel are connected to next line by short-circuit connecting line
It is set in middle neighbouring display panels in the first non-display area and static short ring 113 is set, and by the impedance of static short ring 113
It is arranged in the range of 50K Ω~300K Ω, can be very good to eliminate display panel motherboard 100 durings test, cutting etc.
The electrostatic of generation prevents electrostatic damage caused by display panel, promotes the electrostatic protection effect of panel.
In above embodiment, by the way that multiple conductive gaskets in same row in the first row display panel are connected by short circuit
Wiring is connected to the static short ring being set in neighbouring display panels in the first non-display area in next line, can to show
The equipotential link of all signals in panel is eliminated display panel motherboard and is shown during test or cutting to the first row
The electrostatic that panel generates, promotes the electrostatic protection effect of panel.
Refering to Fig. 3, Fig. 3 is the structural schematic diagram of the application display panel motherboard second embodiment, such as Fig. 3 the present embodiment
It is further expanding in display panel motherboard first embodiment and first embodiment is roughly the same, difference exists
In the static short ring in the present embodiment with non-display area setting in a line neighbouring display panels is concatenated with one another together, and goes here and there
Static short ring after connecing is specifically described such as by a plurality of short-circuit line of lastrow display panel and the electrical connection of multiple conductive gaskets
Under:
Refering to Fig. 3, the display panel motherboard 100 provided in the present embodiment includes the display panel 110 of multiple array arrangements,
Spacing between neighbouring display panels 110 is zero.
Wherein, each 110 surface of the display panel defines the non-display area of 111 periphery of viewing area 111 and viewing area
112.The arrangement of display panel is in the display panel motherboard 100 of the present embodiment with (the i.e. display panel 110 of line direction 2 multiplied by 2
Number is 2, the number of column direction display panel 110 be 2) for do specific introduction.Such as Fig. 3, the non-of each display panel 110 is shown
Show that area 112 is provided with multiple conductive gaskets 1121 and a plurality of short-circuit connecting line 1122, the display panel 110 of at least non-first trip it is non-
Static short ring 113 is provided on viewing area 112.
First is defined at 110 upper side frame of display panel in display panel motherboard 100 provided in this embodiment in the first row
The definition first of the not set static short ring 113 of non-display area 115,110 upper side frame of display panel in the second row is non-display
Area 115 is respectively arranged with static short ring 113, and each static short ring 113 is serially connected in second row, and goes here and there
Static short ring 113 after connecing is electrically connected to multiple conductive liners by a plurality of short-circuit line 1122 of display panel 110 in lastrow
Pad 1121.Optionally, material selected by static short ring 113 in the present embodiment, setting specific location and static short
It is identical in the size selection of 113 impedance of ring and first embodiment, referring to the specific descriptions in above-mentioned first embodiment, herein
It repeats no more.
It is understood that will be set in the present embodiment defined at same a line display panel upper side frame it is first non-display
Static short ring in area 115 is concatenated into together, and the short-circuit connecting line 1122 by being arranged in lastrow display panel 110 connects
Multiple conductive gaskets 1121 of lastrow display panel 110 are connected to, all letters in all display panels of the first row can be made
Number equipotential link, eliminate display panel motherboard during test or cutting to the first row display panel generate it is quiet
Electricity promotes the electrostatic protection effect of panel.
In addition, static short ring 113 can also be design method as shown in Figure 4, i.e., set static short ring 113 to
Including several spaced static short cablings 1131.Specifically in conjunction with Fig. 4, technical solution shown in the present embodiment and aobvious
Show that panel motherboard second embodiment is similar, something in common repeats no more, in which:
The display panel 110 of display panel motherboard 100 including multiple array arrangements, between neighbouring display panels 110 between
Away from being zero.Wherein, each 110 surface of the display panel defines the non-display area of 111 periphery of viewing area 111 and viewing area
112.The non-display area 112 of each display panel 110 is provided with multiple conductive gaskets 1121 and a plurality of short-circuit connecting line 1122, the
Static short ring 113, and static short are provided at the first non-display area 115 defined at two row display panels, 110 upper side frame
Ring 113 includes several spaced static short cablings 1131, and each static short cabling 1131 is aobvious by the first row
Show that multiple short-circuit connecting lines 1122 in panel 110 are connected to multiple conductive gaskets 1121, to realize to display surface in the first row
It is aobvious to the first row during test or cutting to eliminate display panel motherboard for the equipotential link of all signals in plate 110
Show the electrostatic that panel generates, promotes the electrostatic protection effect of display panel.
In above embodiment, by the way that multiple conductive gaskets in same row in the first row display panel are connected by short circuit
Wiring is respectively connected to be set to multiple static short cablings in the first non-display area in neighbouring display panels in next line, can
So that in display panel all signals equipotential link, eliminate display panel motherboard it is right during test or cutting
The electrostatic that the first row display panel generates, promotes the electrostatic protection effect of panel.
Refering to Fig. 5, Fig. 5 is the structural schematic diagram of the 4th embodiment of the application display panel motherboard, the present embodiment be
Further expanding on the basis of display panel motherboard third embodiment, the difference is that the display panel in every a line
Surface is provided with the equipotential cabling of connection viewing area, wherein and the static short ring is connected with the equipotential cabling, tool
Body is described as follows:
Such as Fig. 5, display panel motherboard 100 provided by the present application includes the display panel 110 of multiple array arrangements, adjacent aobvious
Show that the spacing between panel 110 is zero.Wherein, each 110 surface of display panel definition has viewing area 111 and viewing area
The non-display area 112 of 111 peripheries.The arrangement of display panel is by 2 multiplied by for 2 in display panel motherboard 100 in the present embodiment
Do specific introduction.Such as Fig. 5, the non-display area 112 of each display panel 110 is provided with multiple conductive gaskets 1121 and a plurality of short circuit
Connecting line 1122 is provided with static short ring 113 on the non-display area 112 of the display panel 110 of at least non-first trip.Wherein, together
One end of a plurality of short-circuit connecting line 1122 in one column in each display panel 100 is respectively connected to multiple conductive gaskets
1121, the static short ring 113 of neighbouring display panels 110 is electrically connected in the other end and next line.
It is understood that being detailed in the present embodiment about static short ring and the position setting relationship of conductive gasket etc.
Above-mentioned first to third embodiment specific descriptions, details are not described herein again.
In conjunction with Fig. 5, the equipotential that the surface of each display panel 110 is provided with connection viewing area 111 in the present embodiment is walked
Line 1111, and static short ring 113 and the equipotential cabling 1111 are electrically connected.The reality of the present embodiment is illustrated in conjunction with Fig. 5
Show principle, defines the first non-display area 115 at 110 upper side frame of display panel in Fig. 5 in display panel motherboard 100 in the first row
Not set static short ring 113, in the first non-display area 115 defined at all 110 upper side frames of display panel of the second row
Static short ring 113 is set, and the static short ring 113 of display panel 110 passes through in display panel 110 in the first row in the second row
Short-circuit connecting line 1122 be connected to multiple conductive gaskets 1121, and in second row each display panel 110 static short
Ring 113 and equipotential cabling 1111 are electrically connected.
Optionally, the number for connecting the equipotential cabling 1111 of each display panel 110 can be set to multiple, Mei Yixian
The quantity for showing panel static short ring 113 can be one, which connects all equipotential cablings, so just
Display panels 110 all in same row can be subjected to equipotential link, display panel motherboard can be eliminated and testing or cutting
The electrostatic generated in the process improves the electrostatic protection effect of display panel.
It optionally, can also will be whole if setting identical for the current potential of display panel medium potential cabling in adjacent column
All display panels carry out equipotential link in a display panel motherboard, to promote the electrostatic protection energy of entire display panel
Power.It is of course also possible to set different for the current potential of adjacent column medium potential cabling, it is not specifically limited herein.
In above embodiment, by the way that multiple conductive gaskets in same row in the first row display panel are connected by short circuit
Wiring is connected to the static short ring being set in neighbouring display panels in the first non-display area in next line, and combines display surface
All display panels in one permutation can be carried out equipotential link, eliminate display by the equipotential cabling of plate surface setting
The electrostatic that panel motherboard generates in test or cutting process improves the electrostatic protection effect of display panel.
Refering to Fig. 6, Fig. 6 is the structural schematic diagram of the 5th embodiment of the application display panel motherboard, and ability embodiment is
Further expanding in the 4th embodiment of display panel motherboard, the difference is that, it is adjacent in a line in the present embodiment
The static short ring of display panel non-display area setting is concatenated with one another together, and the static short ring after concatenation passes through lastrow
The a plurality of short-circuit line of display panel and the electrical connection of multiple conductive gaskets, are described in detail below:
Such as Fig. 6, the display panel motherboard 100 provided in the present embodiment includes the display panel 110 of multiple array arrangements.Its
In, each 110 surface of display panel defines the non-display area 112 of 111 periphery of viewing area 111 and viewing area.This implementation
Example also use the number of line direction display panel 110 for 2, the number of column direction display panel 110 for 2 display panel motherboard
100 do specific introduction.
The non-display area 112 of each display panel 110 is provided with multiple conductive gaskets 1121 and a plurality of short circuit connection in Fig. 6
Line 1122 is provided with static short ring 113, the second row in Fig. 6 on the non-display area 112 of the display panel 110 of at least non-first trip
110 upper side frame of all display panels at the first non-display area 115 for defining be provided with static short ring, and it is each in the row
Static short ring 113 is serially connected, and the static short ring 113 after concatenating by lastrow display panel 110 it is a plurality of
Short-circuit line 1122 and multiple conductive gaskets 1121 are electrically connected.Wherein, material selected by static short ring 113 in the present embodiment,
It is identical in the size selection of 113 impedance of specific location and static short ring of setting and first embodiment, referring to above-mentioned the
Specific descriptions in one embodiment, details are not described herein again.
Optionally, the surface of each display panel 110 is provided with the equipotential cabling for connecting viewing area 111 in the present embodiment
1111, and static short ring 113 and the equipotential cabling 1111 are electrically connected.In Fig. 6, all display panels 110 in the second row
Equipotential cabling 1111 is connected with the static short ring 113 of display panels 110 all in the second row respectively.Optionally, connection is every
The number of the equipotential cabling 1111 of one display panel 110 can be set to multiple, and static short ring 113 connects all equal electricity
Display panels 110 all in same row can so be carried out equipotential link by position cabling 1111, and with displays all in a line
The static short ring of panel 110 is concatenated into together, thus can make display panel motherboard 100 all display panel signals etc.
Current potential connection, to eliminate display panel motherboard during test or cutting to the quiet of the first row display panel generation
Electricity promotes the electrostatic protection effect of panel.
In addition, static short ring 113 can also be design method as shown in Figure 7, i.e., set static short ring 113 to
Including several spaced static short cablings 1131.Specifically in conjunction with Fig. 7, technical solution shown in the present embodiment and aobvious
Show that the 4th embodiment of panel motherboard is similar, something in common repeats no more, it is described as follows:
The display panel 110 of display panel motherboard 100 including multiple array arrangements, between neighbouring display panels 110 between
Away from being zero.Wherein, each 110 surface of the display panel defines the non-display area of 111 periphery of viewing area 111 and viewing area
112.The non-display area 112 of each display panel 110 is provided with multiple conductive gaskets 1121 and a plurality of short-circuit connecting line 1122, the
Static short ring 113, and static short are provided at the first non-display area 116 defined at two row display panels, 110 upper side frame
Ring 113 includes several spaced static short cablings 1131, and each static short cabling 1131 is aobvious by the first row
Show that multiple short-circuit connecting lines 1122 in panel 110 are connected to multiple conductive gaskets 1121.
It is understood that being detailed in the present embodiment about static short ring and the position setting relationship of conductive gasket etc.
Above-mentioned first to third embodiment specific descriptions, details are not described herein again.
In conjunction with Fig. 7, the equipotential that the surface of each display panel 110 is provided with connection viewing area 111 in the present embodiment is walked
Line 1111, wherein the quantity of the equipotential cabling 1111 be it is several, each static short cabling 1131 is separately connected this etc.
Display panels 110 all in same row can so be carried out equipotential link, can eliminate display panel by current potential cabling 1111
The electrostatic that motherboard generates in test or cutting process improves the electrostatic protection effect of display panel.
It is understood that if setting identical for the current potential of display panel medium potential cabling in adjacent column, it can also
Display panels all in entire display panel motherboard are carried out equipotential link, so that the electrostatic for promoting entire display panel is anti-
Shield ability.
It is next by being connected to multiple conductive gaskets in display panel by short-circuit connecting line in above embodiment
The static short ring being set in neighbouring display panels in row in the first non-display area, and the setting of combining display panel surface etc.
All display panels can be carried out equipotential link, eliminate display panel motherboard in test or cutting process by current potential cabling
The electrostatic of middle generation improves the electrostatic protection effect of display panel.
Refering to Fig. 8, Fig. 8 is the structural schematic diagram of the application display panel first embodiment, as Fig. 8 is provided by the present application
Display panel 110 defines the non-display area 112 for having 111 periphery of viewing area 111 and viewing area, and non-display area 112 is provided with multiple
Conductive gasket 1121 and a plurality of short-circuit connecting line 1122.Wherein, one end of a plurality of short-circuit connecting line 1122 is separately connected at most
A conductive gasket 1121, the other end extend to the edge of display panel 110, and the section at the edge is that display panel motherboard is being cut
When cutting or blow face, and for electrically connecting with another display panel in display panel motherboard in the fabrication process.
Specifically, the static short ring that can be used in the fabrication process with another display panel in display panel motherboard electrically connects
It connects.
Refering to Fig. 9, Fig. 9 is the structural schematic diagram of the application display panel second embodiment, as Fig. 9 is provided by the present application
Display panel 110 defines the non-display area 112 for having 111 periphery of viewing area 111 and viewing area, and non-display area 112 is provided with electrostatic
Short-circuited conducting sleeve 113, multiple conductive gaskets 1121 and a plurality of short-circuit connecting line 1122.Wherein, short-circuit 1122 one end of connecting line connection
To static short loop wire 113, the other end extends to 110 edge of display panel, and the section at the edge is that display panel motherboard is being cut
Face is blown in cutting when cutting, the electrical property of another display panel for being connected to display panel motherboard in the fabrication process
Connection.
Wherein, it is close with adjacent lastrow display panel to include at least setting for the non-display area 112 in display panel 110
First non-display area 115, static short ring 113 are arranged in the first non-display area 115.
Wherein, display panel 110 is display panel motherboard warp of the above-mentioned first embodiment into sixth embodiment
It is obtained after crossing cutting, therefore the above-mentioned first specific descriptions into sixth embodiment is detailed in the description of display panel 110, this
Place repeats no more.
In conclusion it should be readily apparent to one skilled in the art that the application provides a kind of display panel and motherboard, by will be female
Multiple conductive gaskets of non-first trip display panel are connected in next line in neighbouring display panels by short-circuit connecting line and are set in plate
Set static short ring, can make the equipotential link of all signals in display panel, eliminate display panel motherboard in test or
The electrostatic that person generates display panel during cutting, promotes the electrostatic protection effect of panel.
The foregoing is merely presently filed embodiments, are not intended to limit the scope of the patents of the application, all to utilize this
Equivalent structure or equivalent flow shift made by application specification and accompanying drawing content, it is relevant to be applied directly or indirectly in other
Technical field similarly includes in the scope of patent protection of the application.
Claims (10)
1. a kind of display panel motherboard, which is characterized in that the display panel including multiple array arrangements, each display panel
Surface defines the non-display area of viewing area and the non-display area, and the non-display area is provided with multiple conductive gaskets and more
Item short circuit connecting line is provided with static short ring on the non-display area of the display panel of at least non-first trip；
Wherein, one end of a plurality of short-circuit connecting line in same row in each display panel is respectively connected to described more
The static short ring of the adjacent display panel is electrically connected in a conductive gasket, the other end and next line.
2. display panel motherboard according to claim 1, which is characterized in that the non-display area in the display panel
Including at least setting and the first close non-display area of adjacent lastrow display panel, static short ring setting is described the
In one non-display area.
3. display panel motherboard according to claim 2, which is characterized in that each display panel includes described in cladding
The encapsulated layer of viewing area and the non-display area, the static short ring are set to the envelope for covering first non-display area
It fills between layer and the underlay substrate of the display panel.
4. display panel motherboard according to claim 2, which is characterized in that in a line, each display panel
The static short ring is serially connected, and the static short ring after concatenation passes through the institute of display panel described in lastrow
It states a plurality of short-circuit line and is electrically connected to the multiple conductive gasket.
5. display panel motherboard according to claim 2, which is characterized in that the surface of each display panel, which is equipped with, to be connected
The equipotential cabling of the viewing area is connect, the static short ring is connected with the equipotential cabling.
6. display panel motherboard according to claim 5, which is characterized in that the equipotential of each display panel
The quantity of cabling be it is several, the quantity of the static short ring being correspondingly arranged is one, and is connected to corresponding all described etc.
Current potential cabling.
7. display panel motherboard according to claim 5, which is characterized in that the quantity of the equipotential cabling be it is several,
The static short ring includes the static short cabling at several intervals, and each static short cabling connects the equipotential and walks
Line.
8. a kind of display panel, which is characterized in that the display panel defines viewing area and the non-of the non-display area shows
Show area, the non-display area is provided with multiple conductive gaskets and a plurality of short-circuit connecting line；
Wherein, one end of a plurality of short-circuit connecting line is respectively connected to the multiple conductive gasket, and the other end extends to described
The edge of display panel.
9. a kind of display panel, which is characterized in that the display panel defines viewing area and the non-of the non-display area shows
Show area, the non-display area is provided with static short loop wire and short-circuit connecting line；
Described short circuit connecting line one end is connected to the static short loop wire, and the other end extends to the display panel edge.
10. display panel according to claim 9, which is characterized in that the non-display area in the display panel is extremely
Few includes setting and the first close non-display area of adjacent lastrow display panel, and the static short ring is arranged described first
In non-display area.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811291804.6A CN109449140B (en) | 2018-10-31 | 2018-10-31 | Display panel and mother board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811291804.6A CN109449140B (en) | 2018-10-31 | 2018-10-31 | Display panel and mother board |
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| CN109449140A true CN109449140A (en) | 2019-03-08 |
| CN109449140B CN109449140B (en) | 2020-09-11 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811291804.6A Active CN109449140B (en) | 2018-10-31 | 2018-10-31 | Display panel and mother board |
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| CN110187575A (en) * | 2019-05-28 | 2019-08-30 | 昆山国显光电有限公司 | Array substrate and array substrate motherboard |
| CN110320720A (en) * | 2019-06-28 | 2019-10-11 | 昆山国显光电有限公司 | Display panel and preparation method thereof |
| CN110346994A (en) * | 2019-07-23 | 2019-10-18 | 昆山国显光电有限公司 | Array substrate and display panel |
| CN110379796A (en) * | 2019-07-31 | 2019-10-25 | 昆山国显光电有限公司 | Display panel and display device |
| CN110827692A (en) * | 2019-11-28 | 2020-02-21 | 昆山国显光电有限公司 | Mother board for manufacturing display panel |
| CN110827688A (en) * | 2019-11-22 | 2020-02-21 | 昆山国显光电有限公司 | Display panel, display panel mother board and display device |
| CN111066143A (en) * | 2019-06-03 | 2020-04-24 | 深圳市汇顶科技股份有限公司 | Packaging structure and packaging method |
| CN111653548A (en) * | 2020-06-18 | 2020-09-11 | 京东方科技集团股份有限公司 | Display substrate, display panel and preparation method thereof |
| CN113077726A (en) * | 2021-03-23 | 2021-07-06 | 深圳市华星光电半导体显示技术有限公司 | Display panel and preparation method thereof |
| CN113539087A (en) * | 2021-06-24 | 2021-10-22 | 上海中航光电子有限公司 | First display panel, second display panel, manufacturing method of second display panel and display device |
| CN114270251A (en) * | 2020-06-15 | 2022-04-01 | 京东方科技集团股份有限公司 | Display panel and display device |
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