CN109446579A - A kind of electronic product dress joined process flow and dress connection lean process design method - Google Patents
A kind of electronic product dress joined process flow and dress connection lean process design method Download PDFInfo
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- 238000009434 installation Methods 0.000 claims abstract description 48
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Abstract
A kind of electronic product dress joined process flow and dress connection lean process design method, wherein electronic product fills joined process flow design method, and the first step combs the installation form of component on electronic product, establishes the mapping relations of different installation forms and welding process；The principle for establishing mapping relations satisfaction is as follows: 1) establishing welding process according to component installation form, wherein, surface mount device connects mode or manual welding mode using reflow welding, and through-hole mounting related components are using wave-soldering or selective wave-soldering or manual welding mode；2) welding process is further established by component specification, classification, quantity, quality when surface mount device and through-hole mounting component are located at different mounting surfaces when the wave soldering for different mounting surfaces occur is from reflow welding mutual exclusion；Second step determines welding process according to the installation form of component on electronic product to be designed from above-mentioned mapping relations；In conjunction with pretreatment process and subsequent cleaning, installation procedure, the dress joined process flow of entire electronic product is determined.
Description
Technical field
The present invention relates to circuit assembly technical fields, more particularly to the lean technological design of a kind of pair of electronic product dress connection
Method.
Background technique
With the rapid development of circuit assembly industry technology and management level, electronic product dress connection technological design level also has
It is improved, but compared with efficiently completing research and production task, adapting to fast-developing requirement, there are also poor for integrated artistic design level
Away from.
The bottleneck that conditional electronic dress connection technological design currently faces is mainly manifested in the following aspects:
(1) technological design heavy workload, repetitive operation are more.
With the promotion of aerospace processing management level, technological design workload constantly increases, all kinds of technical papers of establishment
Also it is increasing.CAPP uses document-type making mode, although it does not have radical change biography instead of the hand labour of part
The Processing Design of system, the technical papers of formation are independent documents one by one, cannot be carried out to the information in technological procedure
Identification and effective extraction, information can not reuse.Other than technological procedure, the information such as material, tooling, instrument, Quality Control card,
Duplicate editor and typing can only be carried out, increasing workload reduces efficiency.
Secondly, data packet foundation, multimedia recording, three classes key characteristic are known with the propulsion of space flight model quality requirement
Not, forced examination point control etc. require, should all implement to technological design and exploitation in, this not only requirement technological parameter, refinement
Working specification also needs to work out a large amount of technique table.Currently, leading to technique there is no the technique table database for forming standard
The work such as the establishment of table, the foundation of data packet also become most content of technological design.
(2) technique troop rejuvenation, process design quality is by artificial factors.
Under prior art design mode, passed through in the quality and efficiency major part degree of technological design dependent on technologist
It tests, still, space flight industry technique troop entirety rejuvenation in recent years, experience is not enough enriched；Although enterprise is by the long period
Development has accumulated technological design knowledge and manufacturing recourses data quite abundant, but these knowledge and data fail the combing of system
And rationally utilization, it is unfavorable for quickly searching and reusing, causes knowledge resource fully effective cannot share, technique person grows up fast
Slowly, process design quality is by artificial factors for degree.
In addition, aerospace electron dress connection professional standard is more, technological measure in many standards (such as cabling, cementation, protection,
Glue envelope etc.) it may relate to several kinds, if only indiscriminately imitating standard, different technique persons may select different processes,
Cause the technological design consistency of similar product not high.
To sum up, the quality of technological design is larger by artificial factors.
(3) traditional technological design is not suitable with Advanced Manufacturing Modes and enterprise development demand.
Prior art design protrudes two features, first is that pressing serial production procedure basketry file；Second is that paying the utmost attention to
It is not strong using the consciousness of equipment, it is inadequate for the timeliness of device programming and web plate application.
But in fact, some processes of electronic product dress connection may be implemented parallel production and improve production efficiency, process portion
It can be by preferentially using equipment to be used to improve product quality and consistency, enterprise is gradually to lean production and blocking at present
Production model adjustment, begins setting up the production unit and production line of flexibility, the space product feature for being suitble to multi-varieties and small-batch,
Such as component pretreatment unit, SMT production line, wave-soldering production line.So traditional technological design cannot be applicable in first completely
Into production model.
(4) technical papers standardize, there are gaps for quantization refinement.
The development of space flight Project R&D it was verified that substantial portion of product quality problem and technical papers are lack of standardization, no
Refinement, technic index do not quantify related.Therefore, implement technique quantization, refinement require to become improve one of technological design it is important
Means.At the same time, other problems are also brought, in order to achieve the purpose that technique refine, traditional handicraft file easily one it is several
Page ten, after some time it is possible to reach it is exhaustive, but readable poor, emphasis not distinct issues are brought, final operator is for work
The attention degree of books part reduces, and leads to the generation for operating quality problems.
Therefore, technique quantization refinement how is implemented while require, and can improve the readability and directiveness of technical papers,
The significant bottleneck currently faced as circuit assembly technological design.
Based on the above reasons, it needs to study a set of circuit assembly process design method for being suitable for multi items, becoming batch, both
Technique person can be freed from the heavy duplication of labour, and technological design level can be improved, meet Advanced Production Paradigms Towards need
It asks.
Summary of the invention
Technology of the invention solves the problems, such as: providing a kind of circuit assembly lean technique suitable for multi items, change batch
Technique person can be freed and be improved technological design level from the heavy duplication of labour, meet advanced by design method
Production model demand.
The technical solution of the invention is as follows: a kind of electronic product dress joined process flow design method passes through following manner
It realizes:
The first step combs the installation form of component on electronic product, establishes reflecting for different installation forms and welding process
Penetrate relationship；The principle for establishing mapping relations satisfaction is as follows:
1) welding process is established according to component installation form, wherein surface mount device connects mode using reflow welding
Or manual welding mode, through-hole mounting related components are using wave-soldering or selective wave-soldering or manual welding mode；
2) work as surface mount device when there is the wave soldering and reflow welding mutual exclusion of different mounting surfaces and through-hole is inserted
When dress component is located at different mounting surfaces, welding process is further established by component specification, classification, quantity, quality；
Second step determines welding according to the installation form of component on electronic product to be designed from above-mentioned mapping relations
Process；In conjunction with pretreatment process and subsequent cleaning, installation procedure, the dress joined process flow of entire electronic product is determined.
Further, welding process is established according to component installation form, specifically included following aspects:
A it) when surface mount device and through-hole mounting related components are in same mounting surface, is first carried out again headed by welding process
Then fluid welding surface mount device carries out wave-soldering or selective wave-soldering or manual welding through-hole mounting related components；
B) when mounting surface two sides only has surface mount device, welding process is that reflow welding is respectively adopted to weld two sides
Surface mount device；
C) when mounting surface two sides only has through-hole mounting related components, welding process is that one side uses wave soldering, another
Face is using selective wave-soldering or manual welding；
D) when surface mount device and through-hole mounting related components are in different mounting surfaces, welding process is reflow welding first
Then surface mount device carries out selective wave-soldering or manual welding through-hole mounting related components；Or wave-soldering through-hole first
Then mounting related components carry out manual welding surface mount device；
E) when there is surface mount device on mounting surface two sides, only there is through-hole mounting related components on one side；Welding process is
Again using selective wave-soldering or manual welding through-hole mounting related components on the basis of welding process in B；Or wave crest first
It welds through-hole mounting related components and then carries out manual welding surface mount device；
F) when there are surface mount device and through-hole mounting related components in mounting surface two sides, welding process is to be respectively adopted
Reflow welding welds the surface mount device on two sides, and selective wave-soldering is then respectively adopted or manual welding welds the logical of two sides
Hole mounting related components；Or one face through-hole mounting related components of wave-soldering first, it is logical then to carry out selective wave soldering another side
Hole mounting related components, last manual welding surface mount device.
Further, established in step (2) by component specification categorical measure welding process specifically include it is following several
A aspect:
When the welding end of surface mount device is located at bottom device, equipment can only be used to weld such component, welding
Process is reflow welding surface mount device first, then using selective wave-soldering or manual welding through-hole mounting related components；
When surface mount device is slice component, and through-hole mounting related components quantity is more than surface mount device,
Then welding process selection wave-soldering through-hole mounting related components first carry out manual welding surface mount device；
When surface mount device and through-hole component are distributed in two sides, and quantity mutually at once quantity difference in preset range
When interior；Or surface mount device quantity when that is, difference reaches preset threshold value, is welded far more than through-hole mounting related components quantity
Connecing process is the surface mount device that reflow welding welding two sides is respectively adopted first, then using selective wave-soldering or hand
The through-hole mounting related components on work weldering two sides.
Further, when there is surface mount device on mounting surface two sides, first reflow welding surface mount device weight
A lighter mounting surface, then reflow welding another side surface mount device.
Further, when there are through-hole mounting related components on mounting surface two sides, first wave-soldering through-hole mounting related components quantity
That more mounting surface, then selective wave-soldering or manual welding another side through-hole component.
A kind of electronic product dress connection lean process design method, is accomplished in the following manner:
(1) Process knowledge database is constructed, including the typical products library for storing typical products technological procedure；Include in-process
Hold the standard operation library of standardized description；The process resource of tooling, equipment, tool, material items resource comprising standard procedure
Library；
(2) product feature for identifying electronic product to be designed will know the typical products in another characteristic and typical products library
It is matched, if meeting matching condition, the technological procedure of corresponding typical products is called directly from typical products library, is gone to step
(4)；Otherwise, process flow is determined using method described in claim 1, go to step (3)；
(3) corresponding process is transferred by process from standard operation library, Manufacture Resource according to the process flow of above-mentioned determination
Content standardization description and tooling, tool, material items resource and are filled into corresponding process equipment, generate Process Planning
Journey goes to step (4)；
(4) manually according to electronic product to be designed the characteristics of, modify to technological procedure, be perfect, generate lean technique
File.
Further, the Process knowledge database further includes the process flow library for storing existing electronic product process flow；
When being unsatisfactory for matching condition in step (2), firstly, judging process flow according to electronic product to be designed by technological design personnel
Whether there is suitable process flow in library, has and just directly choose corresponding process flow；Otherwise side described in claim 1 is utilized
Method determines process flow.
It further, further include difficult for special material corresponding with standard procedure, fallibility in the Manufacture Resource
The process that operation, key characteristic are taken；The standardized description of corresponding process content is transferred in step (3) and tooling, is set
Before or after standby, tool, material items resource, judge whether grasp comprising special material, fallibility difficulty in current process flows
Make, key characteristic, if comprising transferring the corresponding special material of corresponding standard procedure from Manufacture Resource, the operation of fallibility difficulty, closing
Process that key characteristic is taken simultaneously is filled into corresponding process.
Further, the construction step of process content standardized description is as follows in the standard operation library:
Step 1: combing electronic product dress connection process, assigns process flow code for each process；
Second step establishes the structuring element of standardized description；In the structuring element includes process description, works
Appearance, operating method, particular/special requirement, technological parameter, examination requirements, multimedia recording requirement, technological equipment, equipment, tool, material
Material, important Parts, critical process, technology key characteristic, process control key characteristic, forced examination point, process drawing or animation；
Third step, the standardized description sentence of each structuring element of basketry process code complete process content
Standardized description.
Further, the building mode in the typical products library is as follows:
First establish typical products selection range: count a certain range of electronic product, according to function, structure it is similar
Degree is identified, all electronic products that similarity meets preset requirement are counted as one kind, counts electron-like production
Whether the production quantity of product reaches the preset proportion requirement of production, will production from the electronic product if reaching
Quantity reaches the highest electronic product of such sum-rate as typical products；And further determine that the feature of typical products；
Step 2: typical products basketry regulation is directed to, together with typical products and its feature associated storage in allusion quotation
In type product library.
Further, each process in the compilation process of typical products technological procedure for typical products is all in accordance with standard
The structuring element for changing description is described, and the structuring element includes process description, action, operating method, spy
Different requirement, technological parameter, examination requirements, multimedia recording requirement, technological equipment, equipment, tool, material, important Parts, crucial work
Sequence, technology key characteristic, process control key characteristic, forced examination point, process drawing or animation.
Further, the product feature of the electronic product includes properties of product, product structure size, component cloth
Office, component installation form；It is stored in these feature parameterizations in typical products library, is identified as typical products and classifies
Criterion.
The present invention has the beneficial effect that compared with prior art
(1) present invention fills connection process knowledge to electronic product, experience carries out data mining, and refinement, solidification, building technique are known
Know library, makes technology knowledge that there is good hand down, reach resource-sharing.
(2) present invention fundamentally reduces processing quality difference caused by human factor, improves the rule of technological design
Plasticity realizes process design criteria, steadyization.
(3) when the Process knowledge database building of lean technological design of the present invention, data are with the classification of structured form specification, by work
Skill information is discrete to turn to process structure element, reaches typing of data, reusable effect.
(4) technological design work is made to be changed and be patrolled for refining technique thinking by the technological procedure of traditional single process of establishment
Volume, it is continuously replenished, is perfect, service procedure knowledge data, optimizing Process knowledge database.
(5) towards product, feature identification and decomposition is carried out to product, characterized parameter and process flow are associated,
It is driving with product feature, is pushed out product dress and joins optimal process flow, realizes the quick design of electronic product dress connection process.
(6) electronic product is filled into connection process and is divided into parallel process and serial process, can realized series-parallel according to actual needs
The independent output of the technical papers of process adapts to Advanced Production Paradigms Towards.The production of less volume and more variety is especially adapted to, it is soft in guarantee
Property in the case where improve production efficiency and stability.
(7) electronic product dress connection lean technological design more adapts to the intelligent plant under industrial 4.0 environment.By electronic product
A series of factor of judgment, thinking logic, are refined and formation process process according to specific operation flow in dress connection process,
In the case where guaranteeing product quality, keep process flow flexible as much as possible, is the decision system of the intelligent plant under 4.0 environment
Selection as much as possible is provided, optimal route is arranged by critical-path analysis.
Detailed description of the invention
Fig. 1 is process flow chart of the invention basic model figure；
Fig. 2 is " serial main flow " figure of the existing electronic product of the present invention；
Fig. 3 is lean technological design implementation flow chart of the present invention.
Specific embodiment
With reference to the accompanying drawing and example elaborates to the present invention.
One, electronic product fills joined process flow design method
In electronic product, component is divided into through-hole mounting component, surface mount device according to installation form；Welding side
Method can be divided into two class of manual welding and automatic welding according to mode of operation difference, and the operation of manual welding method is relatively simple, at
This is relatively low but higher to personnel's skill requirement, and cost of labor is larger, is not suitable with and produces in enormous quantities；It is pasted especially for surface
Component, such as the component of BGA encapsulating structure are filled, can not fetch completion by manual welding.
Automatic welding mode is broadly divided into wave soldering and reflow welding connects two kinds, and wave soldering is primarily adapted for use in through-hole mounting
The welding of component.Reflow welding connects also known as Reflow Soldering, is the automatic welding method for adapting to surface mount device, mainly answers
Welding for all kinds of surface mount devices.It is limited due to being connect by reflow welding with wave soldering feature, when first device is installed on surface
When part and through-hole mounting component are located at different mounting surfaces, reflow welding cannot be selected to connect and wave soldering mode, i.e. difference simultaneously
The reflow welding of mounting surface connects and wave soldering mutual exclusion.In order to make up different mounting surface wave solderings and reflow welding connects mutual exclusion this is short
Plate, selective wave soldering are come into being.Selective wave soldering is to meet complicated printed circuit board assembly welding and want
The wave-soldering of a kind of special shape asked and invented.By device programming, the welding position of setting successively can be completed to weld point by point
It connects.Maximum feature is that welding flexibility is high, the welding parameter of the welding position of solder joint or setting can " customized ", adjust
To best.
With the high-performance of electronic product, miniaturization, light-weighted development, electronic product dress connection technology is also real therewith
Each leap is showed, therefore electronic product dress joined process flow is also increasingly sophisticated.
The method of the present invention mainly by combing to component installation form, establishes different installation forms and welding is flowed
The mapping relations of journey, establish the principle of electronic product welding process, to realize quickly setting for electronic product dress joined process flow
Meter.
The installation form of component, establishes welding method on 2.1 combing electronic products；
By component on electronic product installation form and combining form, including through-hole mounting, surface installation and mixing peace
It fills (existing through-hole mounting component, also there is surface mount device on mounting surface)；Wherein mixing installation is current and phase from now on
When the main installation form in long-time.
For the component of different installation forms, different welding methods need to be used, primitive rule is as follows:
(1) through-hole mounting component can be using wave-soldering, manual welding, selective wave-soldering；
(2) surface mount device can use reflow welding or manual welding；
(3) mixing installation includes diversified forms again: single side mixing installation, two-sided mixing installation.Adoptable welding method
Have: reflow welding, wave-soldering, manual welding, selective wave-soldering.
2.2 establish installation form and welding process mapping relations
According to installation form of the component on electronic product, welding process is determined, mapping relations are shown in Table 1.
The mapping table of table 1 component installation form and welding process
Table 1 illustrates:
1, symbol description: " √ " is used to select the component mounting means of some mounting surface in printed board assembly."/" table
Show or relationship." → ", indicates the next step in process.
2, component is mounted on the printed board assembly of electronic product, and the face A, the face B refer to printed board in electronic product in table
The different mounting surfaces of two of assembly." inserting " and " Surface Mount " refers to through-hole mounting component and surface mount device.
3, there are many situations for two-sided mixing installation, are indicated respectively with two-sided mixing installation 1~two-sided mixing installation 6.
As it can be seen from table 1 being installed for through-hole mounting, surface, the electronic product of single side mixing installation form, welding stream
Journey is more single, only need to can establish welding process in conjunction with current production actual conditions, equipment state, personnel state.
2.3 two-sided mixing erecting and welding process establishment methods
(in table 1 4~9) are installed for two-sided mixing, according to the different component installation form in two sides, there are a variety of welderings
Process is connect, in order to further establish welding process, also needs to combine component specification, classification, quantity, quality these different characteristics,
The final welding process flow for establishing reasonable.
For 4~9 in table 1, specific establishment method is as follows: (it should be noted that the process 1. process in following items
2. only significant in item where it)
(1) two-sided mixing installation 1: two sides is through-hole mounting component
When mounting surface two sides is through-hole mounting related components, judged in conjunction with component number, first wave-soldering is logical
That a fairly large number of mounting surface of hole mounting related components, then using selective wave-soldering or another mounting surface of manual welding.
(2) two-sided mixing installation 2: two sides is surface mount device
When mounting surface two sides is surface mount device, judge in conjunction with component quality, first reflow welding surface peace
A lighter mounting surface of component quality is filled, then the surface mount device of another mounting surface of reflow welding.
(3) two-sided mixing installation 3: two sides is respectively surface mount device and through-hole mounting related components
When surface mount device and through-hole mounting related components are in different mounting surfaces, welding process is possible there are two kinds:
1. reflow welding surface mount device first, then carries out selective wave-soldering or manual welding through-hole installs first device
Part；
2. then wave-soldering through-hole mounting related components first carry out manual welding surface mount device.
In order to further establish welding process, need that component specification, classification, quantity these features is combined to be identified.
Establishment method:
When the welding end of surface mount device is located at bottom device, equipment can only be used to weld such component, choosing
Select welding process 1.；
When the quantity of surface mount device is greater than through-hole mounting component, welding process is selected 1.；
When surface mount device be slice component, and through-hole mounting related components quantity be greater than surface mount device
When, select welding process 2.；
(4) two-sided mixing installation 4: there is through-hole mounting component on two sides, and there are also surface mount devices for one side
In order to facilitate narration, it is defined as the existing through-hole mounting component in the face A, and has surface mount device, the face B is through-hole
Placing components.
Welding process is possible there are two kinds:
1. the face A reflow welding surface mount device first, then the face A wave-soldering through-hole mounting related components, finally use again
Selective wave-soldering or the face manual welding B through-hole mounting related components；
2. then the face B wave-soldering through-hole mounting related components first carry out the face A selectivity wave-soldering or manual welding through-hole peace
Component is filled, finally uses the face manual welding A surface mount device again；
Establishment method:
When the welding end of the surface mount device in the face A is located at bottom device, equipment can only be used to weld such component
When；Select welding process 1.；
When the face A through-hole component quantity is greater than the face B through-hole mounting component number, no matter member is installed on the surface in the face A
How much is number of devices, and welding process all may be selected 1.；
When the face A surface mount device be slice component, and the face B through-hole mounting related components quantity be greater than the face A through-hole member
2. number of devices selects welding process.
(5) two-sided mixing installation 5: there is surface mount device on two sides, and there are also through-hole mounting related components for one side
In order to facilitate narration, it is defined as the existing through-hole mounting component in the face A, and has surface mount device, the face B is surface
Mounting related components.
Welding process is possible there are three kinds:
1. first to the face A reflow welding surface mount device, then to the face B reflow welding surface mount device, finally to the face A
Selective wave-soldering or manual welding through-hole component；
2. first to the face B reflow welding surface mount device, then to the face A reflow welding surface mount device, finally to the face A
Selective wave-soldering or manual welding through-hole component；
3. first using reflow welding, then use wave-soldering through-hole to the face first to one side, that is, face A of mixing mounting related components
Mounting related components finally use manual welding surface mount device to the face B.
Establishment method:
When the welding end of surface mount device is located at bottom device, equipment can only be used to weld such component；Such as
1. or 3. the such component of fruit selects welding process in the face A；If such component is located at the face B, select welding process 1. or
Person is 2.；Then the face A, B surface mount device quality is judged again, which face element device quality is light, and just the preferential face reflow welding is excellent
First.To establish final welding process.
When the face A through-hole mounting related components quantity be less than the face B surface mount device when, select welding process 1. or
2. then judging the face A, B surface mount device quality again, which face element device quality is light, and just the preferential face reflow welding is preferential.
When through-hole mounting related components quantity is more than the face B surface mount device when the face A, welding process is selected 3..
(6) two-sided mixing installation 6: there are surface mount device and through-hole mounting related components in two sides
When there are surface mount device and through-hole mounting related components in mounting surface two sides, welding process includes four kinds, this
Four kinds of processes can be divided into two class situations:
1. on the basis of above-mentioned (2) welding process (two-sided mixing installation 2), be then respectively adopted selective wave-soldering or
The through-hole mounting related components on person's manual welding welding two sides；
Illustrate: the 9th the first two in table 1.
2. on the basis of single side mixing erecting and welding process (in table 1 the 3rd), then to another mounting surface using selection
Property wave-soldering or manual welding.
Illustrate: in table 1 the 9th latter two.
Establish principle:
When the welding end of surface mount device is located at bottom device, equipment can only be used to weld such component, choosing
It selects welding process 1., need to be judged on the basis of two-sided mixing installs 2 at this time；
When the quantity of the surface mount device on two sides is greater than through-hole mounting component, welding process is selected 1., this
When need to two-sided mixing install 2 on the basis of be judged；
When surface mount device quantity when two sides is suitable, the judgement of through-hole mounting related components quantity is carried out, which
Face through-hole component quantity is more, just the welding in which preferential face, i.e., 2. selection welding process, uses selective wave crest to another side
Weldering or manual welding.
In conclusion when there are in the optional situation of a variety of welding process, the judgment principle of foundation is as follows:
1. all welding manners are preferentially welded, in the condition that equipment does not have in the case where equipment allows using equipment
Under, consider further that manual welding.
2. being judged when mounting surface two sides is through-hole mounting related components in conjunction with component number, first wave-soldering is logical
That a fairly large number of mounting surface of hole mounting related components.
3. judging when mounting surface two sides is surface mount device in conjunction with component quality, first reflow welding surface peace
Fill a lighter mounting surface of component quality.
4. have surface mount device and through-hole mounting component respectively when different mounting surfaces, that is, occur wave-soldering with again
It is that wave-soldering is preferential or reflow welding is preferential by the judgement of following principle when fluid welding mutual exclusion.
1. the welding end of surface mount device is located at bottom device (such as BGA, LCCC, QFN), can only be welded using equipment
It connects, reflow welding is preferential；
2. surface mount device quantity is greater than through-hole component quantity, reflow welding is preferential；
3. surface mount device is slice component, and through-hole mounting related components quantity is far more than surface mount device
When, wave-soldering is preferential.
5. manual welding and selective wave crest have very high flexibility and convenience for through-hole mounting component.When
When there is wave-soldering and reflow welding mutual exclusion, selectivity Wave crest Welding or manual welding through-hole mounting component can be selected.
2.4, which generate electronic product, fills joined process flow
After designing electronic product welding process according to the method described above, by the establishment step in process flow library in the present invention, fold
After adduction row assisting workflows and serial assisting workflows, the design of entire electronic product dress joined process flow is completed.
Two, electronic product dress connection lean process design method
The present invention, which fills, needs to construct Process knowledge database in advance in connection lean process design method, including for storing typical production
The typical products library of product technological procedure；Standard operation library comprising process content standardized description；Tooling comprising standard procedure,
Equipment, tool, material items resource Manufacture Resource；It further include the process flow for storing existing electronic product process flow
Library.Each knowledge base is illustrated first below.
1, standard operation library
Process content standardized description is stored in the standard operation library, construction step is as follows:
Step 1: combing electronic product dress connection process, assigns process flow code for each process；
According to design feature, processing sequence and the technical process of electronic product dress connection, circuit assembly process is combed, is established
Process need to cover all electronic product dress connection whole processes.Establish 15 standard procedures: printed board pretreatment, component pretreatment,
Web plate production, device programming, line roll work, reflow welding, riveting, wave-soldering, selective wave-soldering, manual welding, clean, connect
Line protection coating, is reinforced, assembly.
Since electronic product dress connection process is related to two different mounting surfaces, in order to distinguish, while making process knowledge
Library building reaches normalization, consistency, ease for use.(pacified one of according to the characteristics of two different mounting surfaces of electronic product
Dress face is asserted interarea, then face supplemented by another mounting surface), process flow code is assigned to 15 standard procedures, is related to 25 kinds altogether
Process flow code, as shown in table 2:
2 process of table and process code
Second step establishes the structuring element that every procedure standardized description should include；
According to lean technological design thinking, the structuring element of process standardized description should be able to cover production operation needs
Every terms of information, the structuring element include process title, action, operating method, particular/special requirement, technological parameter, inspection
Test requirement, multimedia recording requirement, technological equipment, equipment, tool, material, important Parts, critical process, technology key characteristic, mistake
Process control key characteristic, forced examination point, process drawing or animation；
Third step works out the standardized description sentence of the structuring element of each process flow code, completes process content
Standardized description.
It is needed in conjunction with production and management requires, the description language of technical papers is refined and optimized, is tied for every kind
Structure element establishes unified description rule, works out the standardized description sentence of each process flow code.Descriptive statement wants refinement
It is refining, specification, readily understood, unambiguously.
When being standardized description, need in accordance with two principles:
Principle 1. in current standard explicitly, and the operation content general, conventional for enterprise, it is only necessary to clear phase
The title answered and corresponding clause, browse or consult if necessary current standard；For emphasis technological parameter, special want
Ask, key characteristic etc. changes with electronic product feature, and has joined conclusive, fatefulue element to product dress, need
Carry out refinement quantization, in detail description.
Principle 2. work out descriptive statement when, be divided into three kinds of situations: 1. immobilize sentence: in existing standard determine or
Specification sentence recognized within the industry is, it is specified that be not modifiable sentence；2. sentence may be selected: for there are two in structuring element
Kind or the above content and method, each content and method worked out, are set to that sentence may be selected, it is practical according to product
Structure and feature are selected；3. editable sentence: for different with electronic product structure and feature, what is be changed is retouched
Predicate sentence is set to editable sentence, according to different product, edits corresponding descriptive statement.For three cases above,
It can be distinguished by color or symbol.
The foundation in standard operation library has standardized the process knowledge and process description of typical process, avoids technical papers volume
System is influenced by human factor, is also greatly improved technological design efficiency, is alleviated the workload of technique person.
2, typical products library
Typical products library is used to store the technological procedure of typical products, and construction step and method are as follows:
Step 1: establish typical products selection range: the classification of electronic product have the characteristics that it is multifarious, from different perspectives
There are components' placement and installation form in different mode classifications, such as product function, product structure, product.But generally,
Product function and the similar electronic product of product structure, process flow is also consistent, therefore, typical products identification and classify with
Product function and structural similarity also need to count as criterion one to all types of electronic products for meeting criterion one
Production quantity is reached the highest product of such sum-rate by the production quantity ratio of each product in same electronic product,
As typical products.
After determining typical products, typical products are characterized, by its function, structure, components' placement and installation form this
A little characteristic parameters of the element as typical products, convenient for the subsequent matching for carrying out typical products.
The building in typical products library is illustrated by taking space flight industry as an example.
Currently, with space product is integrated, generalization, miniaturization development, back plate type structure becomes electronic product
Typical structure, meanwhile, model electronic product of new generation represents aerospace electron Assembly developing direction, and assembles process
Most technical requirements and technological difficulties in industry production are covered, are the Typical Representatives of aerospace electron product.It therefore, will be new
Generation model electronic product is asserted typical products selection range.Counting 10 models of new generation altogether includes that 84 kinds of electronics produce
Product.Reach 80% as criterion according to product function and structural similarity, determines wherein 6 class product, for every class product,
The production quantity for counting each product in such product, production quantity accounting is highest, it is asserted typical products.
Step 2: typical products basketry regulation is directed to, together with typical products and its feature associated storage in allusion quotation
In type product library.
After establishing typical products, the technological procedure of typical products is worked out, the standard of each process is carried out according to structuring element
Change description, after the technological procedure worked out carries out evaluation verifying, is associated with the characteristic parameter of typical products, is included in typical case
Product library.When carrying out lean technological design, if the feature of product to be designed and the characteristic parameter of typical products match,
Can directly in we selected typical product library typical products technological procedure, modify perfect, the lean of electronic product be rapidly completed
Technological design.
3. Manufacture Resource
Manufacture Resource is used to store the process resource of standard procedure, and process resource includes two aspects, first is that standard work
The manufacturing resource of process applied in sequence process of manufacture: technological equipment, equipment, tool, material；It on the other hand is standard procedure
In process of manufacture, for special material, the process that fallibility difficulty operates, key characteristic is taken.
As electronic product is integrated, highdensity fast development, the packing density of electronic product is increased sharply, and assembling is difficult
Degree is obvious to be increased, therefore, during electronic product fills and joins, in addition to the standard technology regulation of conventional standard procedure, also usually
It can be related to some processes taken for special material, the operation of fallibility difficulty, key characteristic, these processes are because of its application
Frequency is lower than routine, is easy to be ignored or forget, and these processes are just influence electronic product assembling qualities and reliable
One of an important factor for property.It therefore, further include in each standard procedure for spy in addition to manufacturing resource of process in Manufacture Resource
The process that different material, the operation of fallibility difficulty, key characteristic are taken.
The construction step and method of Manufacture Resource are as follows:
Step 1: collecting, summarizing existing manufacturing resource of process: technological equipment, equipment, tool, material；And according to standard
Process is classified, it should be noted that every manufacturing resource of process will include title, code name and specification complete information.Carrying out lean work
When skill designs, corresponding suitable manufacturing resource of process is chosen in Manufacture Resource according to the process of electronic product.
Step 2: collecting, summarizing in electronic product dress connection process, special material involved in each process, fallibility are difficult
Operation, key characteristic, and corresponding process is worked out it.When carrying out lean technological design, when transferring corresponding in-process
Before or after the standardized description and manufacturing resource of process of appearance, whether judge in current process flows comprising special material
Material, the operation of fallibility difficulty, key characteristic, if comprising transferring corresponding process from Manufacture Resource and being filled into corresponding work
In the structuring element of sequence.
4. process flow library
It include the process flow for storing existing electronic product in process flow library.
The construction step and method in process flow library are as follows:
The first step establishes process flow library basic model.
The electronic product of different characteristic, process flow is different, but some processes in process flow, to all electronic products
Processing be both needed to execute, and can carry out parallel, have no effect on product processing main flow, comprising: printed board pretreatment, component are pre-
Processing, web plate production, device programming, line roll work, are referred to as " parallel assisting workflows "；And other processes are according to electronics
Product different characteristic need to be adjusted with layout, these relate generally to welding process, including reflow welding, wave-soldering, selectivity
Wave-soldering, manual welding are referred to as " serial main flow "；It is after completing serial main flow, serially there are also some processes
It completes, these are applicable in the processing of all electronic products, including clean, protect coating, reinforcing, assembly, are referred to as " serial auxiliary
Help process ".According to said method, the process flow library basic model of foundation is as shown in Figure 1.
In illustraton of model, " parallel assisting workflows " and " serial main flow ", " serial assisting workflows " form electronic product together
Main-process stream.
Second step designs serial main flow.
After completing the first step, the process flow of electronic product only needs further to establish " serial main flow ", serial main flow
Establishment method be specifically shown in explanation one " a kind of electronic product fill joined process flow design method ".
In the establishment process of process flow library, combing summarizes " the serial main flow " of existing electronic product, with " parallel auxiliary
Process ", " serial assisting workflows " are overlapped, and are finally obtained the process flow of electronic product, are stored in process flow library.
" the serial main flow " of existing electronic product includes following 8 kinds, sees Fig. 2.In figure, sequence 2.~8. in manual welding
It connects, including two kinds of situations, the preceding unconsummated welding of process, it is subsequent to use manual welding, after another situation is the welding of preceding process,
Butt welding point carries out repaired by hand.
After construction of knowledge base is completed, lean technological design realizes process as shown in figure 3, specific as follows:
(1) it using design drawing as input, identifies the product feature of electronic product to be designed, another characteristic and typical case will be known
Typical products in product library are matched, if meeting matching condition, corresponding typical production is called directly from typical products library
The technological procedure of product.Go to step (4)；
(2) if product to be designed is unsatisfactory for the matching condition with typical products, process flow is selected by manually determining whether
Existing process flow in library calls directly process flow if selecting；Otherwise, (the electronic product dress connection of claim 1 is utilized
Technical flow design method) described in method determine process flow, go to step (3)；
(3) process is pressed out of each process is called in standard operation library standardized description according to the process flow of above-mentioned determination
Hold；From transferred in Manufacture Resource needed for corresponding process process be suitable for manufacturing resource of process；
(4) after transferring the standardized description and manufacturing resource of process of corresponding process content, judge current process stream
Whether comprising special material, the operation of fallibility difficulty, key characteristic in journey, if comprising transferring corresponding technique from Manufacture Resource
Method is simultaneously filled into the structuring element of corresponding process；
(5) manually according to electronic product to be designed the characteristics of, modify to technological procedure, be perfect, generate lean technique
File.
Unspecified part of the present invention belongs to common sense well known to those skilled in the art.
Claims (12)
1. a kind of electronic product fills joined process flow design method, it is characterised in that be accomplished in the following manner:
The first step combs the installation form of component on electronic product, and the mapping for establishing different installation forms and welding process is closed
System；The principle for establishing mapping relations satisfaction is as follows:
1) welding process is established according to component installation form, wherein surface mount device connects mode or hand using reflow welding
Work welding manner, through-hole mounting related components are using wave-soldering or selective wave-soldering or manual welding mode；
2) work as surface mount device and through-hole mounting member when there is the wave soldering and reflow welding mutual exclusion of different mounting surfaces
When device is located at different mounting surfaces, welding process is further established by component specification, classification, quantity, quality；
Second step determines welding process according to the installation form of component on electronic product to be designed from above-mentioned mapping relations；
In conjunction with pretreatment process and subsequent cleaning, installation procedure, the dress joined process flow of entire electronic product is determined.
2. according to the method described in claim 1, it is characterized by: establishing welding process according to component installation form, specifically
Including following aspects:
A) when surface mount device and through-hole mounting related components are in same mounting surface, reflow welding is first carried out headed by welding process
Then surface mount device carries out wave-soldering or selective wave-soldering or manual welding through-hole mounting related components；
B) when mounting surface two sides only has surface mount device, welding process is the table that reflow welding welding two sides is respectively adopted
Face mounting related components；
C) when mounting surface two sides only has through-hole mounting related components, welding process is that one side uses wave soldering, and another side is adopted
With selective wave-soldering or manual welding；
D) when surface mount device and through-hole mounting related components are in different mounting surfaces, welding process is reflow welding surface first
Then mounting related components carry out selective wave-soldering or manual welding through-hole mounting related components；Or wave-soldering through-hole is installed first
Then component carries out manual welding surface mount device；
E) when there is surface mount device on mounting surface two sides, only there is through-hole mounting related components on one side；Welding process is in B
Again using selective wave-soldering or manual welding through-hole mounting related components on the basis of welding process；Or wave-soldering through-hole first
Then mounting related components carry out manual welding surface mount device；
F) when there are surface mount device and through-hole mounting related components in mounting surface two sides, welding process is to be respectively adopted to flow again
Then the through-hole peace of selective wave-soldering or manual welding welding two sides is respectively adopted in the surface mount device on weldering welding two sides
Fill component；Or one face through-hole mounting related components of wave-soldering first, then carry out selective wave soldering another side through-hole peace
Fill component, last manual welding surface mount device.
3. method according to claim 1 or 2, it is characterised in that: in step (2) by component specification categorical measure come
Welding process is established to specifically include following aspects:
When the welding end of surface mount device is located at bottom device, equipment can only be used to weld such component, welding process
For reflow welding surface mount device first, selective wave-soldering or manual welding through-hole mounting related components are then used；
When surface mount device is slice component, and through-hole mounting related components quantity is more than surface mount device, welding
Then process selecting wave-soldering through-hole mounting related components first carry out manual welding surface mount device；
When surface mount device and through-hole component are distributed in two sides, and quantity mutually at once quantity difference in default range
When；Or surface mount device quantity when that is, difference reaches preset threshold value, is welded far more than through-hole mounting related components quantity
Process is the surface mount device that reflow welding welding two sides is respectively adopted first, then using selective wave-soldering or craft
Weld the through-hole mounting related components on two sides.
4. according to the method described in claim 2, it is characterized by: when there is surface mount device on mounting surface two sides, first
One mounting surface of reflow welding surface mount device lighter in weight, then reflow welding another side surface mount device.
5. according to the method described in claim 2, it is characterized by: when there are through-hole mounting related components on mounting surface two sides, first
That a fairly large number of mounting surface of wave-soldering through-hole mounting related components, then selective wave-soldering or manual welding another side through-hole
Component.
6. a kind of electronic product dress connection lean process design method, it is characterised in that be accomplished in the following manner:
(1) Process knowledge database is constructed, including the typical products library for storing typical products technological procedure；Include process content mark
The standard operation library of standardization description；The Manufacture Resource of tooling, equipment, tool, material items resource comprising standard procedure；
(2) product feature for identifying electronic product to be designed will be known the typical products in another characteristic and typical products library and be carried out
Matching calls the technological procedure of corresponding typical products directly from typical products library, goes to step (4) if meeting matching condition；
Otherwise, process flow is determined using method described in claim 1, go to step (3)；
(3) corresponding process content is transferred by process from standard operation library, Manufacture Resource according to the process flow of above-mentioned determination
Standardized description and tooling, equipment, tool, material items resource are simultaneously filled into corresponding process, generate technological procedure, are turned
Step (4)；
(4) manually according to electronic product to be designed the characteristics of, modify to technological procedure, be perfect, generate lean technical papers.
7. according to the method described in claim 6, it is characterized by: the Process knowledge database further includes storing existing electronics to produce
The process flow library of product process flow；When being unsatisfactory for matching condition in step (2), firstly, by technological design personnel according to
Design electronic product judges whether there is suitable process flow in process flow library, has and just directly chooses corresponding process flow；
Otherwise process flow is determined using method described in claim 1.
8. method according to claim 6 or 7, it is characterised in that: further include being directed to and mark in the Manufacture Resource
The process that the corresponding special material of quasi- process, the operation of fallibility difficulty, key characteristic are taken；Corresponding process is transferred in step (3)
Before or after the standardized description and tooling of content, equipment, tool, material items resource, current process flows are judged
In whether comprising special material, fallibility difficulty operation, key characteristic, if comprising transferring corresponding standard procedure from Manufacture Resource
Corresponding special material, the process that fallibility difficulty operates, key characteristic is taken simultaneously are filled into corresponding process.
9. method according to claim 6 or 7, it is characterised in that: process content standardization in the standard operation library
The construction step of description is as follows:
Step 1: combing electronic product dress connection process, assigns process flow code for each process；
Second step establishes the structuring element of standardized description；The structuring element include process description, action,
Operating method, particular/special requirement, technological parameter, examination requirements, multimedia recording requirement, technological equipment, equipment, tool, material, pass
Heavy mail, critical process, technology key characteristic, process control key characteristic, forced examination point, process drawing or animation；
Third step, the standardized description sentence of each structuring element of basketry process code complete the mark of process content
Standardization description.
10. according to the method described in claim 6, it is characterized by: the building mode in the typical products library is as follows:
First establish typical products selection range: count a certain range of electronic product, according to function, the similarity of structure into
Row identification, all electronic products that similarity meets preset requirement are counted as one kind, count the electronic product
Whether production quantity reaches the preset proportion requirement of production, if reaching, by production quantity from the electronic product
Reach the highest electronic product of such sum-rate as typical products；And further determine that the feature of typical products；
Step 2: being directed to typical products basketry regulation, produced together with typical products and its feature associated storage in typical case
In product library.
11. according to the method described in claim 10, it is characterized by: being directed to allusion quotation in the compilation process of typical products technological procedure
Each process of type product is described all in accordance with the structuring element of standardized description, and the structuring element includes process
Description, operating method, particular/special requirement, technological parameter, examination requirements, multimedia recording requirement, technological equipment, is set action
Standby, tool, material, important Parts, critical process, technology key characteristic, process control key characteristic, forced examination point, technique are attached
Figure or animation.
12. according to the method described in claim 6, it is characterized by: the product feature of the electronic product includes product
Energy, product structure size, components' placement, component installation form；By these feature parameterizations, it is stored in typical products library
In, as criterion typical products identification and classified.
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Application publication date: 20190308 |