CN109411364B - Integrated circuit board via hole outsourcing metal device - Google Patents
Integrated circuit board via hole outsourcing metal device Download PDFInfo
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- CN109411364B CN109411364B CN201811313545.2A CN201811313545A CN109411364B CN 109411364 B CN109411364 B CN 109411364B CN 201811313545 A CN201811313545 A CN 201811313545A CN 109411364 B CN109411364 B CN 109411364B
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- 239000002184 metal Substances 0.000 title claims abstract description 49
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 49
- 238000012946 outsourcing Methods 0.000 title claims abstract description 21
- 238000000576 coating method Methods 0.000 claims abstract description 53
- 239000011248 coating agent Substances 0.000 claims abstract description 49
- 238000012545 processing Methods 0.000 claims abstract description 24
- 238000005553 drilling Methods 0.000 claims abstract description 17
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 16
- 229910052802 copper Inorganic materials 0.000 claims abstract description 15
- 239000010949 copper Substances 0.000 claims abstract description 15
- 230000007246 mechanism Effects 0.000 claims abstract description 9
- 230000005540 biological transmission Effects 0.000 claims description 31
- 230000000694 effects Effects 0.000 claims description 3
- 238000001465 metallisation Methods 0.000 claims 9
- 238000000034 method Methods 0.000 description 11
- 238000010030 laminating Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 230000008569 process Effects 0.000 description 5
- 238000009713 electroplating Methods 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 230000003071 parasitic effect Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000010865 sewage Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000005234 chemical deposition Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/486—Via connections through the substrate with or without pins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/4857—Multilayer substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Ceramic Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention discloses an integrated circuit board via hole metal-coating device which comprises a processing bottom plate, wherein a copper metal coating is uniformly and slidably connected inside a conveying rail, a containing groove is fixedly connected to the top of the conveying rail close to the right side, a hydraulic rod is fixedly connected inside the containing groove, a positioning laser emitter is fixedly connected to the middle position inside the containing groove and positioned on the front side of the hydraulic rod, a metal coating discharge hole is formed in the position of the conveying rail close to the bottom of the right side and symmetrical to the containing groove, a drilling hole is formed in the integrated circuit board and is symmetrically arranged with the metal coating discharge hole, and a driving jacking mechanism is fixedly connected to the position of the top of the processing bottom plate close to the right side. This integrated circuit board via hole outsourcing metal device has reached and has improved the artifical precision to via hole outsourcing metal, improves workman labor efficiency and the degree of accuracy, realizes the fastness of via hole outsourcing metal, the whole metal level of also being convenient for simultaneously drop and the purpose of retrieving.
Description
Technical Field
The invention relates to the technical field of integrated circuits, in particular to a metal wrapping device for a via hole of an integrated circuit board.
Background
An integrated circuit is a microelectronic device or component. The transistor, the resistor, the capacitor, the inductor and other elements and wires required in a circuit are interconnected together by adopting a certain process, are manufactured on a small or a plurality of small semiconductor wafers or medium substrates, and are then packaged in a tube shell to form a micro structure with the required circuit function; all the elements are structurally integrated, so that the electronic elements are greatly miniaturized, low in power consumption, intelligent and high in reliability. It is denoted by the letter "IC" in the circuit. The integrated circuit inventors are the Jack-Kerr ratio (germanium (Ge) -based integrated circuits) and the Robert-Noisy (silicon (Si) -based integrated circuits). Most applications in the semiconductor industry today are silicon-based integrated circuits.
Vias are also known as metallized holes. In the double-sided board and the multilayer board, in order to communicate the printed wires among the layers, a common hole, namely a via hole, is drilled at the intersection of the wires needing to be communicated among the layers. The parameters of the via are mainly the outer diameter of the hole and the bore size. The holes have parasitic capacitance to the ground and parasitic inductance, which often have a great negative effect on the design of the circuit. In the process, a layer of metal is plated on the cylindrical surface of the hole wall of the through hole by a chemical deposition method to be used for communicating copper foils needing to be communicated in the middle layer, the upper surface and the lower surface of the through hole are made into a circular pad shape, and the parameters of the through hole mainly include the outer diameter of the hole and the size of a drilled hole.
At present, the outer metal coating of the via hole is firmly connected by an electroplating method through hole-edge electroplated layers, but the production difficulty is high, the precision required by the production is very high, the production efficiency is low, the electroplating waste liquid can cause pollution to the environment, and the cost is increased by the treatment of sewage.
Disclosure of Invention
Technical problem to be solved
Aiming at the defects of the prior art, the invention provides a device for coating metal outside a via hole of an integrated circuit board, which solves the problems that the prior coating metal layer of the via hole has high production difficulty, high precision required by production, low production efficiency, pollution to the environment caused by electroplating waste liquid and cost consumption increased by the treatment of sewage though the electroplating method is adopted to firmly connect the electroplated layers at the edge of the via hole.
(II) technical scheme
In order to achieve the purpose, the invention is realized by the following technical scheme: a metal wrapping device for via holes of an integrated circuit board comprises a processing bottom plate, wherein movable sliding grooves are fixedly connected to the left end and the right end of the top of the processing bottom plate, movable sliding blocks are slidably connected to the inner portions of the movable sliding grooves, movable supporting columns are fixedly connected to the top ends of the movable supporting columns, a circuit board limiting frame is fixedly connected to the top ends of the movable supporting columns, the integrated circuit board is arranged at the top ends of the circuit board limiting frame, operation transverse plates are fixedly connected to the two sides of the top of the processing bottom plate and located above the integrated circuit board, conveying rails are fixedly connected to the middle positions of the operation transverse plates, copper metal coatings are uniformly slidably connected to the inner portions of the conveying rails, a containing groove is fixedly connected to the top of the conveying rails close to the right side, a hydraulic rod is fixedly connected to the inner portions of the containing grooves, and a positioning laser emitter, the conveying rail is close to the bottom on the right side and is provided with a metal coating discharge hole at a position symmetrical to the containing groove, a drilling hole is formed in the integrated circuit board and is symmetrically arranged with the metal coating discharge hole, and a driving jacking mechanism is fixedly connected at a position, close to the right side, of the top of the processing bottom plate.
Preferably, the left side of operation diaphragm top fixedly connected with warning light and master controller in proper order.
Preferably, the left side fixedly connected with of operation diaphragm is interior slot, the inside of interior slot is worn and sliding connection has the second hand push rod, the second hand push rod extends to the inside parallel push pedal of one end fixedly connected with of delivery track.
Preferably, the top end of the conveying track close to the left side is fixedly provided with a feed inlet, and the left side of the movable supporting column is fixedly connected with a first hand push rod.
Preferably, the copper metal coating comprises an inner coating block, the top of the inner coating block is fixedly connected with a top coating edge block, and the bottom of the inner coating block is uniformly and fixedly connected with bottom fixing fan blades.
Preferably, the driving jacking mechanism comprises a transmission rotating shaft, the bottom end of the transmission rotating shaft is rotatably connected with the processing bottom plate, a transmission threaded rod is connected to the inner thread at the top end of the transmission rotating shaft, and a coating leveling plate is fixedly connected to the top end of the transmission threaded rod.
Preferably, a conical top block is fixedly connected to the middle of the top of the coating leveling plate, and a positioning receiver is fixedly connected to the middle of the top of the conical top block.
Preferably, the position, close to the transmission rotating shaft, of the top of the processing bottom plate is fixedly connected with a motor, and an output shaft of the motor is fixedly connected with a driving rotating wheel.
Preferably, the axle center outside the transmission rotating shaft is fixedly connected with a driven rotating wheel, and the driven rotating wheel is in transmission connection with the driving rotating wheel through a belt.
Preferably, the output end of the positioning laser transmitter is connected with the positioning receiver, the output end of the positioning receiver is connected with the master controller, and the output end of the master controller is respectively connected with the warning lamp, the motor and the hydraulic rod.
(III) advantageous effects
The invention provides a metal wrapping device for via holes of an integrated circuit board. The method has the following beneficial effects:
(1) this integrated circuit board via hole outsourcing metal device, through the first handspike of hand push, make drilling and accomodate the groove and align, observe the change of the colour of warning light simultaneously, receive by the position receiver when positioning laser transmitter transmission signal, thereby position receiver transmission signal gives total controller, total controller control warning light conversion colour is green, realize hole accurate positioning, promote the second handspike this moment, the processing bottom plate drives copper metal coating through parallel push pedal and removes in the delivery track, thereby copper metal coating falls into in the drilling from the metal coating discharge gate, reached and improved artifical precision to via hole outsourcing metal, improve workman labor efficiency and the purpose of the degree of accuracy.
(2) This integrated circuit board via hole outsourcing metal device, fall into the drilling back through the copper metal coating, total controller control motor and hydraulic stem work this moment, thereby the hydraulic stem bottom is with the piece contact of borduring on the top, the fixed fan piece parcel in the outside of toper kicking block in the end, along with the work of motor, the transmission pivot drives toper kicking block rebound through the transmission threaded rod, thereby the fixed fan piece in the end outwards scatters gradually, until the laminating of the bottom surface of coating levelling plate with integrated circuit board, the fixed fan piece diffusion laminating of end is on drilling bottom surface this moment, the piece laminating of borduring on the top is on drilling top surface, the fastness of realizing via hole outsourcing metal has been reached, the mesh of droing and retrieving of the whole metal level of also being convenient for simultaneously.
Drawings
FIG. 1 is a schematic structural view of the present invention as a whole;
FIG. 2 is a schematic view of the structure of the present invention at A;
FIG. 3 is a schematic view of the structure of the present invention at B;
FIG. 4 is a schematic view of the structure of the copper metal coating of the present invention;
FIG. 5 is a schematic structural diagram of a pressing mechanism according to the present invention;
fig. 6 is a block diagram showing the structure of a sensor element according to the present invention.
In the figure: 1 processing bottom plate, 2 movable sliding grooves, 3 movable sliding blocks, 4 movable supporting columns, 5 circuit board limiting frames, 6 integrated circuit boards, 7 operating transverse plates, 8 conveying tracks, 9 copper metal coatings, 91 inner coating blocks, 92 top edge coating blocks, 93 bottom fixed fan sheets, 10 accommodating grooves, 11 hydraulic rods, 12 positioning laser emitters, 13 metal coating discharge holes, 14 drilling holes, 15 driving jacking mechanisms, 151 driving rotating shafts, 152 driving threaded rods, 153 coating flat plates, 154 conical top blocks, 155 positioning receivers, 156 motors, 157 driving rotating wheels, 158 driven rotating wheels, 159 belts, 16 warning lamps, 17 general controllers, 18 second hand push rods, 19 parallel push plates, 20 inner inserting grooves, 21 feeding holes and 22 first hand push rods.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-6, the present invention provides a technical solution: a metal wrapping device for via holes of an integrated circuit board comprises a processing bottom plate 1, wherein the left end and the right end of the top of the processing bottom plate 1 are fixedly connected with movable sliding chutes 2, the inner parts of the movable sliding chutes 2 are respectively and slidably connected with movable sliding blocks 3, the top ends of the movable sliding blocks 3 are respectively and fixedly connected with movable supporting columns 4, the top parts of the movable supporting columns 4 are respectively and fixedly connected with a circuit board limiting frame 5, the top ends of the circuit board limiting frames 5 are provided with the integrated circuit board 6, the two sides of the top of the processing bottom plate 1 and above the integrated circuit board 6 are respectively and fixedly connected with an operating transverse plate 7, the middle positions of the operating transverse plates 7 are respectively and fixedly connected with a conveying track 8, the inner parts of the conveying tracks 8 are respectively and uniformly and slidably connected with copper metal coatings 9, the top parts, which are close to the right side, of the conveying tracks 8 are respectively and fixedly, the conveying rail 8 is close to the bottom on the right side and is provided with a metal coating discharge hole 13 at a position symmetrical to the accommodating groove 10, a drilling hole 14 is formed in the integrated circuit board 6, the drilling hole 14 is symmetrical to the metal coating discharge hole 13, and a driving jacking mechanism 15 is fixedly connected at a position, close to the right side, on the top of the processing bottom plate 1. The left side of the top of the operation transverse plate 7 is fixedly connected with a warning lamp 16 and a master controller 17 in sequence. An inner slot 20 is fixedly connected to the left side of the operation transverse plate 7, a second push rod 18 penetrates through the inner slot 20 and is connected with the inner slot in a sliding mode, and a parallel push plate 19 is fixedly connected to one end, extending to the inner portion of the conveying track 8, of the second push rod 18. The top end of the conveying track 8 close to the left side is fixedly provided with a feeding hole 21, and the left side of the movable supporting column 4 is fixedly connected with a first hand push rod 22. The copper metal coating 9 comprises an inner coating block 91, wherein the top of the inner coating block 91 is fixedly connected with a top coating block 92, and the bottom of the inner coating block 91 is uniformly and fixedly connected with a bottom fixing fan sheet 93. The driving and jacking mechanism 15 comprises a transmission rotating shaft 151, the bottom end of the transmission rotating shaft 151 is rotatably connected with the processing bottom plate 1, the internal thread on the top end of the transmission rotating shaft 151 is connected with a transmission threaded rod 152, and the top end of the transmission threaded rod 152 is fixedly connected with a coating leveling plate 153. A conical top block 154 is fixedly connected to the middle position of the top of the coating flat plate 153, and a positioning receiver 155 is fixedly connected to the middle position of the top of the conical top block 154. The motor 156 is fixedly connected to the top of the processing base plate 1 near the transmission rotating shaft 151, and the driving wheel 157 is fixedly connected to the output shaft of the motor 156. The shaft center outside the transmission rotating shaft 151 is fixedly connected with a driven rotating wheel 158, and the driven rotating wheel 158 is in transmission connection with the driving rotating wheel 157 through a belt 159. The output end of the positioning laser transmitter 12 is connected with the positioning receiver 155, the output end of the positioning receiver 155 is connected with the master controller 17, and the output end of the master controller 17 is respectively connected with the warning lamp 16, the motor 156 and the hydraulic rod 11.
During the use, through the first hand push rod 22 of hand push, make drilling 14 with accomodate groove 10 and align, observe the change of the colour of warning light 16 simultaneously, when location laser emitter 12 transmission signal is received by positioning receiver 155, thereby positioning receiver 155 transmission signal gives total controller 17, total controller 17 control warning light 16 conversion colour is green, realize hole accurate positioning, promote second hand push rod 18 this moment, processing bottom plate 1 drives copper metal coating 9 through parallel push pedal 19 and removes in carrying track 8, thereby copper metal coating 9 falls into drilling 14 from metal coating discharge gate 13, reached the precision that improves the manual work to the via hole outsourcing metal, improve workman labor efficiency and the purpose of the degree of accuracy. After falling into drilling 14 through copper metal coating 9, total controller 17 control motor 156 and hydraulic stem 11 work this moment, thereby hydraulic stem 11 bottom and the contact of a borduring piece 92 of top, end fixed fan piece 93 parcel is in the outside of toper kicking block 154, along with motor 156's work, transmission pivot 151 drives toper kicking block 154 rebound through drive threaded rod 152, thereby end fixed fan piece 93 outwards scatters gradually, until coating levelling plate 153 and integrated circuit board 6's bottom surface laminating, end fixed fan piece 93 diffusion laminating is at drilling 14 bottom surface this moment, top borduring piece 92 laminating is at drilling 14 top surface, the fastness of realizing via hole outsourcing metal has been reached, the mesh of the whole metal level of also being convenient for drops and retrieves simultaneously.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation. The use of the phrase "comprising one of the elements does not exclude the presence of other like elements in the process, method, article, or apparatus that comprises the element.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (10)
1. The utility model provides an integrated circuit board via hole outsourcing metal device, includes processing bottom plate (1), its characterized in that: the processing bottom plate is characterized in that movable sliding chutes (2) are fixedly connected to the left end and the right end of the top of the processing bottom plate (1), movable sliding blocks (3) are slidably connected to the inner portions of the movable sliding chutes (2), movable supporting columns (4) are fixedly connected to the top ends of the movable supporting columns (4), circuit board limiting frames (5) are fixedly connected to the top ends of the circuit board limiting frames (5), integrated circuit boards (6) are arranged at the top ends of the circuit board limiting frames (5), operation transverse plates (7) are fixedly connected to the two sides of the top of the processing bottom plate (1) and located above the integrated circuit boards (6), conveying rails (8) are fixedly connected to the middle positions of the operation transverse plates (7), copper metal coatings (9) are uniformly slidably connected to the inner portions of the conveying rails (8), and accommodating grooves (10) are fixedly connected to the top, the laser processing device is characterized in that a hydraulic rod (11) is fixedly connected to the inside of the accommodating groove (10), a positioning laser transmitter (12) is fixedly connected to the front side of the hydraulic rod (11) and located in the middle of the inside of the accommodating groove (10), a metal coating discharge hole (13) is formed in the position, which is close to the bottom of the right side of the conveying track (8) and symmetrical to the accommodating groove (10), of the conveying track, a drilling hole (14) is formed in the inside of the integrated circuit board (6), the drilling hole (14) is symmetrically arranged with the metal coating discharge hole (13), and a driving jacking mechanism (15) is fixedly connected to the position, which is close to the right side, of the.
2. The integrated circuit board via outsourcing metallization apparatus of claim 1, wherein: the left side of operation diaphragm (7) top fixedly connected with warning light (16) and master controller (17) in proper order.
3. The integrated circuit board via outsourcing metallization apparatus of claim 2, wherein: the left side fixedly connected with of operation diaphragm (7) interior slot (20), wear and sliding connection has second hand push rod (18) in the inside of interior slot (20), second hand push rod (18) extend to the inside one end fixedly connected with parallel push pedal (19) of delivery track (8).
4. The integrated circuit board via outsourcing metallization apparatus of claim 1, wherein: the conveying track (8) is close to the fixed feed inlet (21) of having seted up in left top, the first hand push rod (22) of left side fixedly connected with of activity support column (4).
5. The integrated circuit board via outsourcing metallization apparatus of claim 1, wherein: the copper metal coating (9) comprises an inner coating block (91), the top of the inner coating block (91) is fixedly connected with a top edge coating block (92), and the bottom end of the inner coating block (91) is uniformly and fixedly connected with a bottom fixed fan sheet (93).
6. The integrated circuit board via outsourcing metallization apparatus of claim 1, wherein: the driving jacking mechanism (15) comprises a transmission rotating shaft (151), the bottom end of the transmission rotating shaft (151) is rotatably connected with the processing bottom plate (1), the internal thread on the top end of the transmission rotating shaft (151) is connected with a transmission threaded rod (152), and the top end of the transmission threaded rod (152) is fixedly connected with a coating leveling plate (153).
7. The integrated circuit board via outsourcing metallization apparatus of claim 6, wherein: the middle position of the top of the coating leveling plate (153) is fixedly connected with a conical top block (154), and the middle position of the top of the conical top block (154) is fixedly connected with a positioning receiver (155).
8. The integrated circuit board via outsourcing metallization apparatus of claim 7, wherein: the top of the processing bottom plate (1) is fixedly connected with an electric motor (156) at a position close to the transmission rotating shaft (151), and an output shaft of the electric motor (156) is fixedly connected with a driving rotating wheel (157).
9. The integrated circuit board via outsourcing metallization apparatus of claim 8, wherein: the shaft center outside the transmission rotating shaft (151) is fixedly connected with a driven rotating wheel (158), and the driven rotating wheel (158) is in transmission connection with the driving rotating wheel (157) through a belt (159).
10. The integrated circuit board via outsourcing metallization apparatus of claim 9, wherein: the output end of the positioning laser transmitter (12) is connected with the positioning receiver (155), the output end of the positioning receiver (155) is connected with the master controller (17), and the output end of the master controller (17) is respectively connected with the warning lamp (16), the motor (156) and the hydraulic rod (11).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811313545.2A CN109411364B (en) | 2018-11-06 | 2018-11-06 | Integrated circuit board via hole outsourcing metal device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811313545.2A CN109411364B (en) | 2018-11-06 | 2018-11-06 | Integrated circuit board via hole outsourcing metal device |
Publications (2)
| Publication Number | Publication Date |
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| CN109411364A CN109411364A (en) | 2019-03-01 |
| CN109411364B true CN109411364B (en) | 2020-08-21 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201811313545.2A Active CN109411364B (en) | 2018-11-06 | 2018-11-06 | Integrated circuit board via hole outsourcing metal device |
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| CN (1) | CN109411364B (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201714165U (en) * | 2010-05-28 | 2011-01-19 | 郑力仁 | Internet of Things alarming safety lock cylinder with work bin |
| CN102101553A (en) * | 2011-03-18 | 2011-06-22 | 上海理想家园工程营造有限公司 | Pull-plug type breathing device of closed container |
| CN102435824A (en) * | 2011-11-04 | 2012-05-02 | 天津市华电电力器材厂 | Capacitive low-voltage acoustic-optic electricity measurer |
| CN102654122A (en) * | 2011-03-04 | 2012-09-05 | 梁嘉麟 | Improved scheme of air pump structure capable of reducing or avoiding air leakage in operation process |
| CN106324351A (en) * | 2016-11-14 | 2017-01-11 | 山东辰宇稀有材料科技有限公司 | Portable four-needle probe for measuring resistivity of silicon materials |
-
2018
- 2018-11-06 CN CN201811313545.2A patent/CN109411364B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201714165U (en) * | 2010-05-28 | 2011-01-19 | 郑力仁 | Internet of Things alarming safety lock cylinder with work bin |
| CN102654122A (en) * | 2011-03-04 | 2012-09-05 | 梁嘉麟 | Improved scheme of air pump structure capable of reducing or avoiding air leakage in operation process |
| CN102101553A (en) * | 2011-03-18 | 2011-06-22 | 上海理想家园工程营造有限公司 | Pull-plug type breathing device of closed container |
| CN102435824A (en) * | 2011-11-04 | 2012-05-02 | 天津市华电电力器材厂 | Capacitive low-voltage acoustic-optic electricity measurer |
| CN106324351A (en) * | 2016-11-14 | 2017-01-11 | 山东辰宇稀有材料科技有限公司 | Portable four-needle probe for measuring resistivity of silicon materials |
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| Publication number | Publication date |
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| CN109411364A (en) | 2019-03-01 |
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