CN109411364A - A kind of integrated circuit board via hole kalamein device - Google Patents
A kind of integrated circuit board via hole kalamein device Download PDFInfo
- Publication number
- CN109411364A CN109411364A CN201811313545.2A CN201811313545A CN109411364A CN 109411364 A CN109411364 A CN 109411364A CN 201811313545 A CN201811313545 A CN 201811313545A CN 109411364 A CN109411364 A CN 109411364A
- Authority
- CN
- China
- Prior art keywords
- fixedly connected
- circuit board
- integrated circuit
- via hole
- kalamein
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/486—Via connections through the substrate with or without pins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/4857—Multilayer substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
Abstract
The invention discloses a kind of integrated circuit board via hole kalamein devices, including processing bottom plate, the inside of delivery track uniformly slidably connects copper metal coating, delivery track is fixedly connected with accommodating groove at the top of right side, the inside of accommodating groove is fixedly connected with hydraulic stem, the middle position of the inside of accommodating groove and be located at hydraulic stem front be fixedly connected with positioning laser emitter, delivery track close to right side bottom and with the symmetrical position of accommodating groove offer metal coating discharge port, integrated circuit board is internally provided with drilling, drilling is symmetrical arranged with metal coating discharge port, driving top-pressure mechanism is fixedly connected with close to the position on right side at the top of processing bottom plate, the present invention relates to technical field of integrated circuits.The integrated circuit board via hole kalamein device has reached raising manually to the precision of via hole kalamein, has improved worker's labor efficiency and accuracy, realize the fastness of via hole kalamein, while being also convenient for the purpose for falling off and recycling of bulk metal layer.
Description
Technical field
The present invention relates to technical field of integrated circuits, specially a kind of integrated circuit board via hole kalamein device.
Background technique
Integrated circuit is a kind of microelectronic device or component.Using certain technique, crystalline substance needed for a circuit
The elements such as body pipe, resistance, capacitor and inductance and wiring interconnection together, are produced on a fritter or a few fritter semiconductor wafers or medium
On substrate, it is then encapsulated in a shell, becomes the microstructure with required circuit function；Wherein all elements are in structure
On formed a whole, so that electronic component has been strided forward one in terms of microminaturization, low-power consumption, intelligence and high reliability big
Step.It uses alphabetical " IC " to indicate in circuit.Integrated circuit inventor is that Jack Kiel ratio (is based on the integrated electricity of germanium (Ge)
Road) and Robert's noy think of (integrated circuit for being based on silicon (Si)).The application of most of current semi-conductor industry is based on silicon
Integrated circuit.
Via hole is also referred to as plated through-hole.In dual platen and multi-layer board, for the printed conductor being connected between each layer, needed in each layer
A upper common aperture, i.e. via hole are bored by the intersection for the conducting wire to be connected to.The parameter of via hole mainly porose outer diameter and bore size.
There is parasitic capacitances over the ground in hole itself, while there is also parasitic inductance, will also tend to bring to the design of circuit very big
Negative effect.
Via hole is also referred to as plated through-hole, in dual platen and multi-layer board, for the printed conductor being connected between each layer, needs in each layer
A upper common aperture, i.e. via hole are bored by the intersection for the conducting wire to be connected to.It is heavy with chemistry on the hole wall cylindrical surface of via hole in technique
Long-pending method plates one layer of metal, the copper foil for needing to be connected to be connected to intermediate each layer, and the upper and lower surface of via hole is made into circle
Bond pad shapes, the parameter of via hole mainly porose outer diameter and bore size.
The kalamein layer of via hole is by galvanoplastic at present, although hole edge electroplated layer is connected firmly, production difficulty compared with
Greatly, very high at precision prescribed is produced, and production efficiency is low, and electroplating effluent also can cause environmental pollution, the processing of sewage
Increase the consumption of cost.
Summary of the invention
(1) the technical issues of solving
In view of the deficiencies of the prior art, it the present invention provides a kind of integrated circuit board via hole kalamein device, solves
The kalamein layer of via hole is by galvanoplastic at present, although hole edge electroplated layer is connected firmly, production difficulty is larger, Cheng Chanyao
Refinement degree is very high, and production efficiency is low, and electroplating effluent also can cause environmental pollution, and the processing of sewage also increases cost
Consumption the problem of.
(2) technical solution
In order to achieve the above object, the present invention is achieved by the following technical programs: a kind of integrated circuit board via hole outsourcing
Metal device, including processing bottom plate, the left and right ends processed at the top of bottom plate are fixedly connected to movable sliding, the activity
The inside of sliding slot slidably connects movable slider, and the top of the movable slider is fixedly connected to movable supporting column, described
Circuit board limit frame is fixedly connected at the top of movable supporting column, the top of the circuit board limit frame is provided with integrated circuit
Plate, the top two sides of the processing bottom plate and is located above integrated circuit board and is fixedly connected with operation transverse slat, the operation cross
The middle position of plate is fixedly connected with delivery track, and the inside of the delivery track uniformly slidably connects copper metal coating, institute
It states delivery track and is fixedly connected with accommodating groove at the top of right side, the inside of the accommodating groove is fixedly connected with hydraulic stem, institute
It states the middle position of the inside of accommodating groove and is fixedly connected with positioning laser emitter, the conveyor track positioned at the front of hydraulic stem
Road close to right side bottom and with the symmetrical position of accommodating groove offer metal coating discharge port, the inside of the integrated circuit board
It is provided with drilling, the drilling is symmetrical arranged with metal coating discharge port, and the position at the top of the processing bottom plate close to right side is solid
Surely it is connected with driving top-pressure mechanism.
Preferably, the left side at the top of the operation transverse slat, which is fixedly connected sequentially, warning lamp and master controller.
Preferably, it is fixedly connected with interior slot on the left of the operation transverse slat, the inside of the interior slot wears and slides company
It is connected to the second handspike, one end that second handspike extends to inside delivery track is fixedly connected with parallel push plate.
Preferably, top fixation of the delivery track close to left side offers feed inlet, a left side for the movable supporting column
Side is fixedly connected with the first handspike.
Preferably, the copper metal coating includes interior mass, and top bound edge block, institute are fixedly connected at the top of the interior mass
The bottom end for stating interior mass is uniformly fixedly connected with the fixed fan blades in bottom.
Preferably, the driving top-pressure mechanism includes drive shaft, the bottom end of the drive shaft and processing bottom plate rotation
Connection, the internal whorl on the drive shaft top are connected with motion thread bar, and the top of the motion thread bar is fixedly connected
There is coating formation plate.
Preferably, the middle position at the top of the coating formation plate is fixedly connected with cone-shaped ejecting block, the cone-shaped ejecting block top
The middle position in portion is fixedly connected with location receivers.
Preferably, motor, the motor are fixedly connected with close to the position of drive shaft at the top of the processing bottom plate
Output shaft on be fixedly connected with active runner.
Preferably, driven runner is fixedly connected at the axle center outside the drive shaft, the driven runner passes through skin
Band is sequentially connected with active runner.
Preferably, it is described positioning laser emitter output end connect with location receivers, the location receivers it is defeated
Outlet is connect with master controller, and the output end of the master controller is connect with warning lamp, motor and hydraulic stem respectively.
(3) beneficial effect
The present invention provides a kind of integrated circuit board via hole kalamein devices.Have it is following the utility model has the advantages that
(1), integrated circuit board via hole kalamein device, by the first handspike of hand push, so that drilling and accommodating groove
To it, while the variation of the color of warning lamp is observed, is received when positioning laser transmitter projects signal by location receivers, thus
Location receivers transmit a signal to master controller, and it is green that master controller, which controls warning lamp warning lamp converting colors, realize hole essence
It determining position, pushes the second handspike at this time, processing bottom plate drives copper metal coating to move in delivery track by parallel push plate,
To which copper metal coating is fallen into drilling from metal coating discharge port, reach raising manually to the precision of via hole kalamein,
Improve the purpose of worker's labor efficiency and accuracy.
(2), the integrated circuit board via hole kalamein device, after falling into drilling by copper metal coating, master control at this time
Device controls motor and hydraulic stem work, so that hydraulic stem bottom is contacted with top bound edge block, the fixed fan blades in bottom is wrapped in taper top
The outside of block, with the work of motor, drive shaft drives cone-shaped ejecting block to move up by motion thread bar, so that bottom is solid
Determine fan blades gradually to scatter outward, until coating formation plate is bonded with the ground of integrated circuit board, the fixed fan blades diffusion in bottom at this time is pasted
It closes in drilling bottom end surface, top bound edge block is fitted in drill tip surface, has reached the fastness for realizing via hole kalamein, together
When be also convenient for the purpose for falling off and recycling of bulk metal layer.
Detailed description of the invention
Fig. 1 is the whole structural schematic diagram of the present invention；
Fig. 2 is the structural schematic diagram at A of the present invention；
Fig. 3 is the structural schematic diagram at B of the present invention；
Fig. 4 is the structural schematic diagram of copper metal of the present invention coating；
Fig. 5 is the structural schematic diagram of present invention driving top-pressure mechanism；
Fig. 6 is the structural block diagram of sensing element of the present invention；.
In figure: 1 processing bottom plate, 2 movable slidings, 3 movable sliders, 4 movable supporting columns, 5 circuit board limit frames, 6 integrated electricity
Road plate, 7 operation transverse slats, 8 delivery tracks, 9 copper metals are coated, mass, 92 top bound edge blocks, the fixed fan blades in 93 bottoms, 10 are stored in 91
Slot, 11 hydraulic stems, 12 positioning laser emitters, 13 metals coating discharge port, 14 drillings, 15 driving top-pressure mechanisms, 151 transmissions turn
Axis, 152 motion thread bars, 153 coating formation plates, 154 cone-shaped ejecting blocks, 155 location receivers, 156 motor, 157 actively turn
Wheel, 158 driven runners, 159 belts, 16 warning lamps, 17 master controllers, 18 second handspikes, 19 parallel push plates, slot in 20,
21 feed inlets, 22 first handspikes.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
Fig. 1-6 is please referred to, the present invention provides a kind of technical solution: a kind of integrated circuit board via hole kalamein device, packet
Processing bottom plate 1 is included, the left and right ends at 1 top of processing bottom plate are fixedly connected to movable sliding 2, and the inside of movable sliding 2 is sliding
Dynamic to be connected with movable slider 3, the top of movable slider 3 is fixedly connected to movable supporting column 4, and the top of movable supporting column 4 is equal
It is fixedly connected with circuit board limit frame 5, the top of circuit board limit frame 5 is provided with integrated circuit board 6, processes the top of bottom plate 1
Two sides and the top for being located at integrated circuit board 6 are fixedly connected with operation transverse slat 7, and the middle position of operation transverse slat 7 is fixedly connected with
Delivery track 8, the inside of delivery track 8 uniformly slidably connect copper metal coating 9, and delivery track 8 is solid close to the top on right side
Surely be connected with accommodating groove 10, the inside of accommodating groove 10 is fixedly connected with hydraulic stem 11, the middle position of the inside of accommodating groove 10 and
Positioned at the front of hydraulic stem 11 be fixedly connected with positioning laser emitter 12, delivery track 8 close to right side bottom and with storage
The symmetrical position of slot 10 offers metal coating discharge port 13, and integrated circuit board 6 is internally provided with drilling 14, drilling 14 and gold
Belong to coating discharge port 13 to be symmetrical arranged, 1 top of processing bottom plate is fixedly connected with driving top-pressure mechanism 15 close to the position on right side.Behaviour
The left side for making 7 top of transverse slat is fixedly connected sequentially and has warning lamp 16 and master controller 17.The left side of operation transverse slat 7 is fixedly connected with
The second handspike 18 is worn and slidably connected in the inside of interior slot 20, interior slot 20, and the second handspike 18 extends to delivery track 8
Internal one end is fixedly connected with parallel push plate 19.Top fixation of the delivery track 8 close to left side offers feed inlet 21, activity
The left side of support column 4 is fixedly connected with the first handspike 22.Copper metal coating 9 includes interior mass 91, and the top of interior mass 91 is solid
Surely it is connected with top bound edge block 92, the bottom end of interior mass 91 is uniformly fixedly connected with the fixed fan blades 93 in bottom.Top-pressure mechanism 15 is driven to wrap
Drive shaft 151 is included, the bottom end of drive shaft 151 and processing bottom plate 1 are rotatablely connected, the internal whorl on 151 top of drive shaft
It is connected with motion thread bar 152, the top of motion thread bar 152 is fixedly connected with coating formation plate 153.It is coated formation plate 153
The middle position at top is fixedly connected with cone-shaped ejecting block 154, and the middle position at 154 top of cone-shaped ejecting block is fixedly connected with positioning and connects
Receive device 155.1 top of processing bottom plate is fixedly connected with motor 156, the output of motor 156 close to the position of drive shaft 151
Active runner 157 is fixedly connected on axis.Driven runner 158 is fixedly connected at axle center outside drive shaft 151, from turn
Wheel 158 is sequentially connected by belt 159 and active runner 157.Position the output end and location receivers 155 of laser emitter 12
Connection, the output end of location receivers 155 connect with master controller 17, the output end of master controller 17 respectively with warning lamp 16,
Motor 156 and hydraulic stem 11 connect.
In use, by the first handspike of hand push 22 so that drilling 14 with accommodating groove 10 to it, while observing warning lamp 16
Color variation, received when positioning laser emitter 12 emits signal by location receivers 155, thus location receivers 155
Master controller 17 is transmitted a signal to, it is green that master controller 17, which controls 16 converting colors of warning lamp warning lamp, realizes that hole is accurately fixed
Position, pushes the second handspike 18 at this time, and processing bottom plate 1 drives copper metal coating 9 to move in delivery track 8 by parallel push plate 19
It is dynamic, so that copper metal coating 9 is fallen into drilling 14 from metal coating discharge port 13, reach raising manually to via hole kalamein
Precision, improve worker's labor efficiency and accuracy purpose.After falling into drilling 14 by copper metal coating 9, master control at this time
Device 17 controls motor 156 and hydraulic stem 11 works, so that 11 bottom of hydraulic stem is contacted with top bound edge block 92, the fixed fan blades 93 in bottom
It is wrapped in the outside of cone-shaped ejecting block 154, with the work of motor 156, drive shaft 151 is driven by motion thread bar 152
Cone-shaped ejecting block 154 moves up, so that the fixed fan blades 93 in bottom is gradually scattered outward, until coating formation plate 153 and integrated circuit
The ground of plate 6 is bonded, and the fixed diffusion of fan blades 93 in bottom at this time is fitted in 14 bottom end surfaces of drilling, and top bound edge block 92 is fitted in drilling 14
Top end surface has reached the fastness for realizing via hole kalamein, while being also convenient for the mesh for falling off and recycling of bulk metal layer
's.
It should be noted that, in this document, relational terms such as first and second and the like are used merely to a reality
Body or operation are distinguished with another entity or operation, are deposited without necessarily requiring or implying between these entities or operation
In any actual relationship or order or sequence.Moreover, the terms "include", "comprise" or its any other variant are intended to
Non-exclusive inclusion, so that the process, method, article or equipment including a series of elements is not only wanted including those
Element, but also including other elements that are not explicitly listed, or further include for this process, method, article or equipment
Intrinsic element.In the absence of more restrictions.By sentence " element limited including one ..., it is not excluded that
There is also other identical elements in the process, method, article or apparatus that includes the element ".
It although an embodiment of the present invention has been shown and described, for the ordinary skill in the art, can be with
A variety of variations, modification, replacement can be carried out to these embodiments without departing from the principles and spirit of the present invention by understanding
And modification, the scope of the present invention is defined by the appended.
Claims (10)
1. a kind of integrated circuit board via hole kalamein device, including processing bottom plate (1), it is characterised in that: the processing bottom plate
(1) left and right ends at the top of are fixedly connected to movable sliding (2), and the inside of the movable sliding (2) slidably connects work
The top of movable slider (3), the movable slider (3) is fixedly connected to movable supporting column (4), the movable supporting column (4)
Top is fixedly connected to circuit board limit frame (5), and the top of the circuit board limit frame (5) is provided with integrated circuit board (6),
It is described processing bottom plate (1) top two sides and be located at integrated circuit board (6) above be fixedly connected with operation transverse slat (7), it is described
The middle position of operation transverse slat (7) is fixedly connected with delivery track (8), and the inside of the delivery track (8) is uniformly slidably connected
There is copper metal to be coated (9), the delivery track (8) is fixedly connected with accommodating groove (10), the accommodating groove at the top of right side
(10) inside is fixedly connected with hydraulic stem (11), the middle position of the inside of the accommodating groove (10) and be located at hydraulic stem (11)
Front be fixedly connected with positioning laser emitter (12), the delivery track (8) close to right side bottom and and accommodating groove
(10) symmetrical position offers metal coating discharge port (13), and the integrated circuit board (6) is internally provided with drilling (14),
The drilling (14) and metal coating discharge port (13) are symmetrical arranged, and the position at the top of processing bottom plate (1) close to right side is solid
Surely it is connected with driving top-pressure mechanism (15).
2. a kind of integrated circuit board via hole kalamein device according to claim 1, it is characterised in that: the operation is horizontal
Left side at the top of plate (7), which is fixedly connected sequentially, warning lamp (16) and master controller (17).
3. a kind of integrated circuit board via hole kalamein device according to claim 2, it is characterised in that: the operation is horizontal
It is fixedly connected on the left of plate (7) interior slot (20), the inside of the interior slot (20) wears and slidably connects the second handspike
(18), second handspike (18) extends to the internal one end of delivery track (8) and is fixedly connected with parallel push plate (19).
4. a kind of integrated circuit board via hole kalamein device according to claim 1, it is characterised in that: the conveyor track
Top fixation of the road (8) close to left side offers feed inlet (21), is fixedly connected with first on the left of the movable supporting column (4)
Handspike (22).
5. a kind of integrated circuit board via hole kalamein device according to claim 1, it is characterised in that: the copper metal
Being coated (9) includes interior mass (91), and top bound edge block (92), the interior mass are fixedly connected at the top of the interior mass (91)
(91) it is fixed fan blades (93) that bottom end is uniformly fixedly connected with bottom.
6. a kind of integrated circuit board via hole kalamein device according to claim 1, it is characterised in that: the driving top
Press mechanism (15) includes drive shaft (151), the bottom end of the drive shaft (151) and processing bottom plate (1) rotation connection, described
The internal whorl on drive shaft (151) top is connected with motion thread bar (152), and the top of the motion thread bar (152) is solid
Surely it is connected with coating formation plate (153).
7. a kind of integrated circuit board via hole kalamein device according to claim 6, it is characterised in that: the coating is flat
Middle position at the top of whole plate (153) is fixedly connected with cone-shaped ejecting block (154), the interposition at the top of the cone-shaped ejecting block (154)
It sets and is fixedly connected with location receivers (155).
8. a kind of integrated circuit board via hole kalamein device according to claim 7, it is characterised in that: the processing bottom
Position at the top of plate (1) close to drive shaft (151) is fixedly connected with motor (156), the output shaft of the motor (156)
On be fixedly connected with active runner (157).
9. a kind of integrated circuit board via hole kalamein device according to claim 8, it is characterised in that: the transmission turns
Axis (151) is fixedly connected with driven runner (158) at external axle center, and the driven runner (158) passes through belt (159) and main
Turn wheel (157) transmission connection.
10. a kind of integrated circuit board via hole kalamein device according to claim 9, it is characterised in that: the positioning
The output end of laser emitter (12) is connect with location receivers (155), the output end and master control of the location receivers (155)
Device (17) processed connection, the output end of the master controller (17) respectively with warning lamp (16), motor (156) and hydraulic stem (11)
Connection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811313545.2A CN109411364B (en) | 2018-11-06 | 2018-11-06 | Integrated circuit board via hole outsourcing metal device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811313545.2A CN109411364B (en) | 2018-11-06 | 2018-11-06 | Integrated circuit board via hole outsourcing metal device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109411364A true CN109411364A (en) | 2019-03-01 |
| CN109411364B CN109411364B (en) | 2020-08-21 |
Family
ID=65471774
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811313545.2A Active CN109411364B (en) | 2018-11-06 | 2018-11-06 | Integrated circuit board via hole outsourcing metal device |
Country Status (1)
| Country | Link |
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| CN (1) | CN109411364B (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN201714165U (en) * | 2010-05-28 | 2011-01-19 | 郑力仁 | Internet of Things alarming safety lock cylinder with work bin |
| CN102101553A (en) * | 2011-03-18 | 2011-06-22 | 上海理想家园工程营造有限公司 | Pull-plug type breathing device of closed container |
| CN102435824A (en) * | 2011-11-04 | 2012-05-02 | 天津市华电电力器材厂 | Capacitive low-voltage acoustic-optic electricity measurer |
| CN102654122A (en) * | 2011-03-04 | 2012-09-05 | 梁嘉麟 | Improved scheme of air pump structure capable of reducing or avoiding air leakage in operation process |
| CN106324351A (en) * | 2016-11-14 | 2017-01-11 | 山东辰宇稀有材料科技有限公司 | Portable four-needle probe for measuring resistivity of silicon materials |
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2018
- 2018-11-06 CN CN201811313545.2A patent/CN109411364B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201714165U (en) * | 2010-05-28 | 2011-01-19 | 郑力仁 | Internet of Things alarming safety lock cylinder with work bin |
| CN102654122A (en) * | 2011-03-04 | 2012-09-05 | 梁嘉麟 | Improved scheme of air pump structure capable of reducing or avoiding air leakage in operation process |
| CN102101553A (en) * | 2011-03-18 | 2011-06-22 | 上海理想家园工程营造有限公司 | Pull-plug type breathing device of closed container |
| CN102435824A (en) * | 2011-11-04 | 2012-05-02 | 天津市华电电力器材厂 | Capacitive low-voltage acoustic-optic electricity measurer |
| CN106324351A (en) * | 2016-11-14 | 2017-01-11 | 山东辰宇稀有材料科技有限公司 | Portable four-needle probe for measuring resistivity of silicon materials |
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| Publication number | Publication date |
|---|---|
| CN109411364B (en) | 2020-08-21 |
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Effective date of registration: 20200619 Address after: 312030 No. 1439 Wenchang Road, Lanting Street, Keqiao District, Shaoxing City, Zhejiang Province Applicant after: Shaoxing Xiuzhen New Energy Technology Co.,Ltd. Address before: 150000 Building Street No. 8, Nangang District, Harbin City, Heilongjiang Province Applicant before: Liu Juan |
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