CN109402600A - 一种氧含量梯度变化的硅氧烷薄膜 - Google Patents

一种氧含量梯度变化的硅氧烷薄膜 Download PDF

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CN109402600A
CN109402600A CN201811320057.4A CN201811320057A CN109402600A CN 109402600 A CN109402600 A CN 109402600A CN 201811320057 A CN201811320057 A CN 201811320057A CN 109402600 A CN109402600 A CN 109402600A
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王小军
董茂进
冯煜东
党文强
何丹
李中华
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Lanzhou Hongrui Aerospace Mechanical And Electrical Equipment Co Ltd
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    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
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    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
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    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/50Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
    • C23C16/505Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using radio frequency discharges

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Abstract

本发明属于阻隔薄膜技术领域,具体涉及一种氧含量梯度变化的硅氧烷薄膜。所述薄膜通过以下方法制备得到,所述方法采用的PECVD装置沿走带方向设置三段布气板,具体为:基膜安装后真空室抽真空,然后在三段布气板中分别通入不同通量的六甲基二硅氧烷和氧气进行镀膜。采用三段式布气板结构的PECVD装置进行镀膜,制备了氧含量梯度变化的硅氧烷薄膜,低氧/高氧叠加的硅氧烷薄膜,同时具有高氧硅氧烷的高阻隔性和低氧硅氧烷薄膜的高柔韧性。

Description

一种氧含量梯度变化的硅氧烷薄膜
技术领域
本发明属于阻隔薄膜技术领域,具体涉及一种氧含量梯度变化的硅氧烷薄膜。
背景技术
阻隔包装的发展源自于食品、药品、微电子产品等包装物易受潮变性变质而对包装薄膜提出的阻隔需求。一般的阻隔性包装材料绝大部分是高分子塑料,大多是由高分子缠绕而成,塑料自身的阻隔性达不到要求。提高材料的阻隔性一般采用多元复合、多层复合、真空蒸发等。通常是把气体阻隔性很强的材料与热缝合性、水分阻隔性很强的聚烯烃同时进行挤出而成,是多层结构的薄膜。然而多层共挤材料长时间处于湿热环境,性能会大幅衰减,另一方面材料不容易回收。
目前,沉积阻隔薄膜的方法主要包括物理气相沉积(PVD)、等离子增强化学气相沉积(PECVD)等。然而,由于薄膜生长应力以及薄膜材料与基材的热胀系数差异,利用PVD方法制备的该类材料存在大量的微细裂纹和纳米裂纹,限制了材料的应用。采用等离子体增强化学气相沉积(PECVD)制备硅氧烷薄膜,氧含量高的硅氧烷薄膜其结构和成分更接近氧化硅材料,具有对水蒸气良好的阻隔性,但是柔韧性差并且和有机高分子聚脂基膜结合不牢固。
发明内容
本发明的目的是针对现有技术的不足,而提供的一种氧含量梯度变化的硅氧烷薄膜,该氧含量梯度变化的薄膜具有柔性透明高阻隔膜的特点。
为实现上述目的,本发明的技术方案如下。
一种氧含量梯度变化的硅氧烷薄膜,所述薄膜通过以下方法制备得到:所述方法采用的PECVD装置沿走带方向(基膜卷绕方向)设置三段布气板,具体步骤如下:
(1)基膜安装:将基膜安装在PECVD装置的送卷轮上;
(2)真空室抽真空:开启PECVD装置自动抽气,本底真空≤3×10-3Pa;
(3)离子束清洗基膜:采用阳极层离子源,设定放电电流1A,通氩气200sccm,电压范围200~300V,基膜卷绕速度1m/min;
(4)PECVD镀制硅氧烷薄膜:镀膜时基膜依次通过第一段布气板、第二段布气板和第三段布气板,在第一段布气板上,六甲基二硅氧烷通量为30~60sccm,氧气通量为10~20sccm,在第二段布气板上,六甲基二硅氧烷通量为10~20sccm,氧气通量为30~60sccm,在第三段布气板上,六甲基二硅氧烷通量为30~60sccm,氧气通量为10~20sccm,采用13.56MHz射频电源,放电功率400~600W,反应真空度控制在1~2Pa,基膜卷绕速度0.1~0.5m/min。
优选的,基膜为聚酯薄膜(PET),基膜厚度为12~125微米。
有益效果:
采用改进布气板结构的PECVD装置进行镀膜,制备了氧含量梯度变化的硅氧烷薄膜,低氧/高氧叠加的硅氧烷薄膜,同时具有高氧硅氧烷的高阻隔性和低氧硅氧烷薄膜的高柔韧性。所述硅氧烷薄膜具有较好的阻水性能和可见光透谱段过性。氧含量梯度变化硅氧烷薄膜经过一次卷绕镀制得到,提高生产效率,具有较好的产业化前景。
附图说明
图1为本发明所述PECVD装置的结构示意图;
图2为本发明实施例1中所述薄膜的透湿率图;
图3为本发明实施例1中所述薄膜随厚度变化各元素含量变化图;
图4为本发明实施例1中所述薄膜中氧元素含量变化图;
图5为本发明实施例2中所述薄膜的透湿率图;
图6为本发明实施例3中所述薄膜的透湿率图;
其中,1-第一段布气板,2-第二段布气板,3-第三段布气板,4-硅氧烷薄膜,5-等离子体区。
具体实施方式
下面结合具体实施例对本发明作进一步详细的说明。
以下实施例中所使用的PECVD装置,如图1所示,所述装置包括送卷轮、导向轮、供气单元、收卷轮、纠偏轮、电源、放电辊和真空泵。基膜通过等离子区5域沉积硅氧烷薄膜,基膜一次卷绕依次通过第一段布气板1、第二段布气板2和第三段布气板3通气后形成的等离子区域5,在基膜表面沉积形成氧含量梯度渐变的硅氧烷薄膜4,布气板采用本领域中常规的布气板结构。
实施例1
(1)基膜安装:采用12微米厚聚酯薄膜(PET),幅宽600毫米,安装在PECVD装置的送卷轮上。
(2)真空室抽真空:开启PECVD装置自动抽气,本底真空≤3×10-3Pa。
(3)离子束清洗基膜:采用阳极层离子源,设定放电电流1A,通氩气200sccm,电压范围200V,基膜卷绕速度1m/min。
(4)PECVD镀制硅氧烷薄膜:镀膜时基膜依次通过第一段布气板1、第二段布气板2和第三段布气板3;在第一段布气板1,六甲基二硅氧烷通量为60sccm,氧气通量为20sccm,在第二段布气板2,六甲基二硅氧烷通量为20sccm,氧气通量为60sccm,在第三段布气板3,六甲基二硅氧烷通量为60sccm,氧气通量为20sccm,采用13.56MHz射频电源,放电功率600W,反应真空度控制在1Pa,基膜卷绕速度0.5m/min,得到一种氧含量梯度变化的硅氧烷薄膜。
阻水性能及光谱测试:采用MOCON AQUART 2水蒸气透过率测试仪测试薄膜的阻水性能,结果如图2所示,透湿率为0.151g/(m2·day),该方法通过氧含量梯度变化的硅氧烷薄膜,提高了薄膜的柔韧性,不形成使得水蒸气通过的微裂纹,减少了通过水蒸气的通道。
采用PE公司LANMDA900紫外可见分光光度计测试380~760nm光谱范围的透射率,结果如图3所示,平均透过率为88.6%。
采用X射线光电子能谱方法测试了薄膜随厚度变化,结果如图4所示,氧含量变化的规律,膜层厚度为96nm,最外层硅氧烷薄膜中氧元素原子质量分数为46%,在68nm处氧含量最高,氧元素原子质量分数为63%,最外层硅氧烷薄膜中氧元素原子质量分数为42%,说明薄膜在生长过程中,由于通过单体/氧气比例不同的三段布气板,氧含量呈先增大再减小的梯度变化。
实施例2
(1)基膜安装:采用125微米厚聚酯薄膜(PET),幅宽600毫米,安装在PECVD装置的送卷轮上。
(2)真空室抽真空:开启PECVD装置自动抽气,本底真空要小于3×10-3Pa。
(3)离子束清洗基膜:采用阳极层离子源,设定放电电流1A,通氩气200sccm,电压范围200~300V,基膜卷绕速度1m/min。
(4)PECVD镀制硅氧烷薄膜:镀膜时基膜依次通过第一段布气板1、第二段布气板2和第三段布气板3;在第一段布气板1,六甲基二硅氧烷通量为30sccm,氧气通量为10sccm,在第二段布气板2,六甲基二硅氧烷通量为10sccm,氧气通量为30sccm,在第三段布气板3,六甲基二硅氧烷通量为30sccm,氧气通量为10sccm,采用13.56MHz射频电源,放电功率400W,反应真空度控制在2Pa,基膜卷绕速度0.1m/min。
(5)阻水性能及光谱测试:镀膜结束后,采用MOCON AQUART 2水蒸气透过率测试仪测试薄膜的阻水性能,结果如图5所示,透湿率为0.271g/(m2·day)。
实施例3
(1)基膜安装:采用12微米厚聚酯薄膜(PET),幅宽600毫米,安装在PECVD装置的送卷轮上。
(2)真空室抽真空:开启PECVD装置自动抽气,本底真空≤3×10-3Pa。
(3)离子束清洗基膜:采用阳极层离子源,设定放电电流1A,通氩气200sccm,电压范围200~300V,基膜卷绕速度1m/min。
(4)PECVD镀制硅氧烷薄膜:镀膜时基膜依次通过第一段布气板1、第二段布气板2和第三段布气板3;在第一段布气板1,六甲基二硅氧烷通量为45sccm,氧气通量为15sccm,在第二段布气板2,六甲基二硅氧烷通量为15sccm,氧气通量为45sccm,在第三段布气板3,六甲基二硅氧烷通量为45sccm,氧气通量为15sccm,采用13.56MHz射频电源,放电功率500W,反应真空度控制在1Pa,基膜卷绕速度0.2m/min。
(5)阻水性能及光谱测试:镀膜结束后,采用MOCON AQUART 2水蒸气透过率测试仪测试薄膜的阻水性能,结果如图6所示,透湿率为0.211g/(m2·day)。
综上所述,发明包括但不限于以上实施例,凡是在本发明的精神和原则之下进行的任何等同替换或局部改进,都将视为在本发明的保护范围之内。

Claims (2)

1.一种氧含量梯度变化的硅氧烷薄膜,其特征在于:所述薄膜通过以下方法制备得到:所述方法采用的PECVD装置沿走带方向设置三段布气板,具体步骤如下:
(1)基膜安装:将基膜安装在PECVD装置的送卷轮上;
(2)真空室抽真空:开启PECVD装置自动抽气,本底真空度≤3×10-3Pa;
(3)离子束清洗基膜:采用阳极层离子源,设定放电电流1A,通氩气200sccm,电压范围200~300V,基膜卷绕速度1m/min;
(4)PECVD镀制硅氧烷薄膜:镀膜时基膜依次通过第一段布气板、第二段布气板和第三段布气板,在第一段布气板上,六甲基二硅氧烷通量为30~60sccm,氧气通量为10~20sccm,在第二段布气板上,六甲基二硅氧烷通量为10~20sccm,氧气通量为30~60sccm,在第三段布气板上,六甲基二硅氧烷通量为30~60sccm,氧气通量为10~20sccm,采用13.56MHz射频电源,放电功率400~600W,反应真空度控制在1~2Pa,基膜卷绕速度0.1~0.5m/min。
2.如权利要求1所述的一种氧含量梯度变化的硅氧烷薄膜,其特征在于:基膜为PET,基膜厚度为12~125微米。
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CN111116962A (zh) * 2019-12-26 2020-05-08 兰州空间技术物理研究所 一种用于空间聚合物材料的防原子氧薄膜的制备方法
CN112095090A (zh) * 2020-07-31 2020-12-18 隆基绿能科技股份有限公司 硅基异质结太阳电池制备方法及渐变硅氧钝化层制备方法
CN115505907A (zh) * 2021-06-22 2022-12-23 江苏菲沃泰纳米科技股份有限公司 应用于柔性基材的复合膜及其制备方法和产品

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