CN109390676A - Near-field communication aerial - Google Patents
Near-field communication aerial Download PDFInfo
- Publication number
- CN109390676A CN109390676A CN201710661309.9A CN201710661309A CN109390676A CN 109390676 A CN109390676 A CN 109390676A CN 201710661309 A CN201710661309 A CN 201710661309A CN 109390676 A CN109390676 A CN 109390676A
- Authority
- CN
- China
- Prior art keywords
- substrate
- area
- electrical connection
- electrically connected
- field communication
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/364—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith using a particular conducting material, e.g. superconductor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/50—Structural association of antennas with earthing switches, lead-in devices or lightning protectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q7/00—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
Abstract
This disclosure relates to a kind of near-field communication aerial, including first substrate interconnected and the second substrate, coil is provided on first side surface of first substrate, coil outer end is provided with the first electrical connection area, inner end is electrically connected to the second electrical connection area on the first side surface for being arranged in first substrate, first electrical connection area is electrically connected that area is adjacent and arranged for interval with second, first line part and the second circuit pack are provided on first side surface of the second substrate, the third that the both ends of the first line part are respectively arranged with the first feed point and are electrically connected area's electrical connection with first is electrically connected area, the 4th electrical connection area that the both ends of second circuit pack are respectively arranged with the second feed point and are electrically connected area's electrical connection with second.Thus, it can effectively ensure that coil is electrically connected and realizes the performance of antenna with the first feed point and the second feed point under the connection status of first substrate and the second substrate, and be readily able to independent manufacture and process first substrate and the second substrate, play manufacture and the low effect of processing cost.
Description
Technical field
This disclosure relates to antenna structure technical field, and in particular, to a kind of near-field communication aerial.
Background technique
Near-field communication is a kind of wireless near field communication between electronic equipment to be realized using electromagnetic induction transceiving electromagnetic wave
Technology, near-field communication aerial generally passes through sharp on copper-based flexible circuit board (FPC) or copper-based printed circuit board (PCB) at present
The circuit pack of antenna is made with techniques such as plastic parts moulding technique, printing silver pastes, and passes through the feedback in near-field communication aerial
Gold-plated or tin plating mode is welded on terminal mainboard on point, to reduce contact impedance.And use near field made of above-mentioned technique
Communication antenna has the problems such as manufacture and processing cost are high.
Summary of the invention
Purpose of this disclosure is to provide the low near-field communication aerials of a kind of manufacture and processing cost.
To achieve the goals above, the disclosure provides a kind of near-field communication aerial, and the near-field communication aerial includes mutual
The first substrate and the second substrate of connection are provided with coil on the first side surface of the first substrate, and the outer end of the coil is set
It is equipped with the first electrical connection area, and inner end is electrically connected to the second electrical connection on the first side surface for being arranged in the first substrate
Area, the first electrical connection area are electrically connected that area is adjacent and arranged for interval with described second, the first side surface of the second substrate
On be provided with first line part and the second circuit pack, the both ends of the first line part be respectively arranged with the first feed point and with
The third of first electrical connection area's electrical connection is electrically connected area, and the both ends of second circuit pack are respectively arranged with the second feed point
With the 4th electrical connection area for being electrically connected area's electrical connection with described second.
Optionally, the inner end of the coil is formed with the first conducting area of the both side surface for penetrating through the first substrate, institute
State the second conducting that first substrate is provided with the both side surface for being electrically connected area's extension from described second and penetrating through the first substrate
Area, back to conductive tie layers are provided on the second side surface in first side surface, described first leads the first substrate
Logical area and second conducting area are electrically connected to each other by the conductive tie layers, so that the inner end of the coil is electrically connected to
Second electrical connection area.
Optionally, second conducting area is located at the position close to coil outer end and is spaced between first conducting area
It is disposed with a part of the coil.
Optionally, the first conducting area and the second conducting area are connected to described by ultrasonic bonding mode
Conductive tie layers.
Optionally, it is provided between the first side surface of the first substrate and the first side surface of the second substrate different
Square conductive adhesive layer.
Optionally, the first substrate includes that protrusion is formed in the first substrate close to the outer end edges of the coil
Extension board, the first electrical connection area and second electrical connection area are arranged on first side surface of the extension board,
The second substrate is mounted on the extension board, and the institute of first side surface of the second substrate and the extension board
It is positioned opposite to state the first side surface.
Optionally, on the first substrate and the thickness direction of the second substrate, the first electrical connection Qu Hesuo
State third electrical connection area overlapping, and the second electrical connection area and the 4th electrical connection area overlapping.
Optionally, a part of the second substrate is formed to have shape corresponding with the extension board, and described
Three electrical connection areas and the 4th electrical connection area are arranged in described a part of the second substrate with extending longitudinally, described
First feed point and second feed point are exposed to the outside of the extension board.
Optionally, the first substrate, should back to subsidiary layer is provided on the second side surface in first side surface
Subsidiary layer is adhesive layer, and the second substrate is back to being provided with insulating layer on the second side surface in first side surface, institute
It states the first feed point and second feed point is exposed to the insulating layer of the second substrate.
Optionally, first feed point and second feed point penetrate through the both side surface of the second substrate, and described second
Substrate is formed with fluting on the top between first feed point and second feed point.
Optionally, the current-carrying part of the first substrate is made of aluminum, and the current-carrying part of the second substrate is made of copper.
Through the above technical solutions, that is, passing through the cooperation of first substrate and the second substrate, under this mated condition, first
The first electrical connection area positioned at coil outer end on substrate is electrically connected area with the third in the second substrate and is electrically connected, and first substrate
On the second electrical connection area be electrically connected area with the 4th in the second substrate and is electrically connected, wherein it is electric that coil inner end is electrically connected to second
Bonding pad.It can effectively be protected under the connection status of first substrate and the second substrate by simple structure as described above as a result,
Coil on card first substrate in the second substrate the first feed point and the second feed point realize and be electrically connected and realize the performance of antenna,
Thus, it is possible to be easy to independent manufacture to process first substrate and the second substrate.And due to being electrically connected for the third with the second substrate
The first electrical connection area of area's electrical connection and the second electrical connection area for being electrically connected area's electrical connection with the 4th of the second substrate is met to exist
Adjacent and arranged for interval on first substrate, so that the arrangement in third electrical connection area and the 4th electrical connection area in the second substrate
Size smallizationer that be compact-sized and making the second substrate, to play manufacture and the low effect of processing cost.
Other feature and advantage of the disclosure will the following detailed description will be given in the detailed implementation section.
Detailed description of the invention
Attached drawing is and to constitute part of specification for providing further understanding of the disclosure, with following tool
Body embodiment is used to explain the disclosure together, but does not constitute the limitation to the disclosure.In the accompanying drawings:
Fig. 1 is the first side surface for showing first substrate in the near-field communication aerial according to disclosure specific embodiment
Structure chart；
Fig. 2 is the second side surface for showing first substrate in the near-field communication aerial according to disclosure specific embodiment
Structure chart；
Fig. 3 is the first side surface for showing the second substrate in the near-field communication aerial according to disclosure specific embodiment
Structure chart；
Fig. 4 is the second side surface for showing the second substrate in the near-field communication aerial according to disclosure specific embodiment
Structure chart；
Fig. 5 is according to the dress that first substrate is connect with the second substrate in the near-field communication aerial of disclosure specific embodiment
Figure one shows the structure of the first side surface of first substrate and the second side surface of the second substrate in figure；
Fig. 6 is according to the dress that first substrate is connect with the second substrate in the near-field communication aerial of disclosure specific embodiment
Figure two shows the structure of the second side surface of first substrate and the first side surface of the second substrate in figure；
Fig. 7 is to show in the near-field communication aerial according to disclosure specific embodiment on the first side surface of the second substrate
Structure chart coated with different side's conductive adhesive layer；
Fig. 8 is the cooperation according to first substrate and the second substrate in the near-field communication aerial of disclosure specific embodiment
Structural schematic diagram；
Fig. 9 is the main view according to the splicing band forms of the second substrate in the near-field communication aerial of disclosure specific embodiment
Figure；
Figure 10 is the rearview of Fig. 9.
Description of symbols
1 first substrate, 2 the second substrate
3 coil, 4 first line part
5 second circuit pack, 6 conductive tie layers
7 different 8 subsidiary layers of side's conductive adhesive layer
11 first side surface, 12 second side surface
Area is connected in 13 extension boards 14 first
15 second conducting areas 16 second are electrically connected area
17 first insulating layer, 21 first side surface
22 second side surface, 23 insulating layer
24 fluting, 31 first electrical connection area
41 first feed point, 42 third is electrically connected area
51 second feed points 52 the 4th are electrically connected area
9 splicing band, 91 location hole
Specific embodiment
It is described in detail below in conjunction with specific embodiment of the attached drawing to the disclosure.It should be understood that this place is retouched
The specific embodiment stated is only used for describing and explaining the disclosure, is not limited to the disclosure.
In the disclosure, in the absence of explanation to the contrary, the noun of locality used such as " inside and outside " typically refers to corresponding portion
" inside and outside " of part profile.
As shown in Figures 1 to 8, the disclosure provides a kind of near-field communication aerial, and the near-field communication aerial includes mutually interconnecting
The first substrate 1 and the second substrate 2 connect is provided with coil 3 on the first side surface 11 of the first substrate 1, the coil 3 it is outer
End is provided with the first electrical connection area 31, and inner end is electrically connected to the on the first side surface 11 for being arranged in the first substrate 1
Two electrical connection areas 16, the first electrical connection area 31 are electrically connected that area 16 is adjacent and arranged for interval with described second, second base
First line part 4 and the second circuit pack 5, the both ends point of the first line part 4 are provided on first side surface 21 of plate 2
The third for not being provided with the first feed point 41 and being electrically connected the electrical connection of area 31 with described first is electrically connected area 42, second line part
Divide 5 both ends to be respectively arranged with the second feed point 51 and be electrically connected the 4th of the electrical connection of area 16 with described second and is electrically connected area 52.
As described above, passing through the cooperation of first substrate 1 and the second substrate 2, under this mated condition, on first substrate 1
It is electrically connected area 42 with the third in the second substrate 2 positioned at the first electrical connection area 31 of 3 outer end of coil to be electrically connected, and first substrate 1
On second electrical connection area 16 be electrically connected with the 4th in the second substrate 2 area 52 be electrically connected, wherein 3 inner end of coil is electrically connected to
Second electrical connection area 16.As a result, through simple structure as described above under the connection status of first substrate 1 and the second substrate 2
It can effectively ensure that coil 3 on first substrate 1 is electrically connected with the first feed point 41 in the second substrate 2 and the realization of the second feed point 51
And realize the performance of antenna, thus, it is possible to be easy to independent manufacture to process first substrate 1 and the second substrate 2, plays manufacture and add
Work effect at low cost.In addition, being electrically connected area 16 for the first electrical connection area 31, second, third is electrically connected area 42 and the 4th
The shape disclosure in electrical connection area 52 does not limit, and can use round, oval, rectangular or irregular shape etc..Pass through
The the second electrical connection area 16 arranged on first substrate 1 is electrically connected with the inner end of coil 3, so that the second electrical connection area 16 and setting exist
Area 31 is adjacent on first substrate 1 and arranged for interval for first electrical connection of the outer end of coil 3, and then it is electric with first be electrically connected area 31
The third of connection is electrically connected area 42 and is electrically connected the cloth of the 4th electrical connection area 52 of the electrical connection of area 16 on second substrate 2 with second
Set it is compact-sized so that the size of the second substrate 2 minimizes.
As depicted in figs. 1 and 2, optionally, the inner end of the coil 3 is formed with the two sides table for penetrating through the first substrate 1
The first conducting area 14 in face, the first substrate 1, which is provided with, to be extended from second electrical connection area 16 and penetrates through first base
Second conducting area 15 of the both side surface of plate 1, the first substrate 1 is back in the second side surface 12 of first side surface 11
On be provided with conductive tie layers 6, the first conducting area 14 and the second conducting area 15 by the conductive tie layers 6 mutually
Electrical connection, so that the inner end of the coil 3 is electrically connected to second electrical connection area 16.Wherein, the first side of first substrate 1
The first insulating layer 17 is provided between surface 11 and the second side surface 12, so that between the first side surface 11 and the second side surface 12
Mutually it is not turned on.By structure as described above, so that the turning part structure on first substrate 1 is more rationalized, and it is convenient for
Connect the electric coupling area of first substrate 1 and the second substrate 2.Wherein, the first conducting area 14 and the second conducting area 15 can be formed
It is electrically connected for larger size in order to realize.Here, being electrically connected for area 15 is connected with the first conducting area 14 and second in conductive tie layers 6
The mode of connecing can use various ways, as long as can guarantee conductive tie layers 6 and the first conducting area 14 and the second conducting 15 phase of area
Mutually conducting.For example, optionally, the first conducting area 14 and the second conducting area 15 pass through ultrasonic bonding mode point
It is not connected to the conductive tie layers 6.As a result, the first conducting area 14 and the second conducting area 15 and conductive tie layers after welding
6 electric conductivity is good, and resistance coefficient is low, and have the effect of convenient for welding and welding efficiency it is high.But the disclosure does not limit
In this, for example, the electric connection mode in conductive tie layers 6 and the first conducting area 14 and the second conducting area 15 can use friction welding (FW)
It connects, the other modes such as resistance welding.
Optionally, as shown in Figure 1, second conducting area 15 is located at the position close to 3 outer end of coil and with described first
Arranged for interval has a part of the coil 3 between conducting area 14.As a result, first conducting area 14, second be connected area 15 with
And the arrangement of conductive tie layers 6 is more compact, so that the structure of first substrate 1 is more rationalized, meanwhile, convenient for arrangement and first
The structure for the first line part 4 and the second circuit pack 5 in the second substrate 2 that substrate 1 connects.But the disclosure is not limited to
This, can carry out the structure of reasonable design first substrate 1 and the turning part in the second substrate 2 according to actual needs.
Optionally, as shown in fig. 7, the first side table of the first side surface 11 and the second substrate 2 of the first substrate 1
Different side's conductive adhesive layer 7 is provided between face 21.That is, different side's electric conductivity by different side's conductive adhesive layer 7 can guarantee the first base
Plate 1 and the second substrate 2 during the modes such as crimping connect with incoherent line insulation.Specifically, conductive using different side
(the plate face extending direction of first substrate 1 and the second substrate 2) insulate and along Y-direction (the first base in X direction possessed by glue-line 7
The thickness direction of plate 1 and the second substrate 2) conductive characteristic, so that the first electrical connection area 31 of first substrate 1 and the second substrate 2
Third electrical connection area 42 and first substrate 1 second electrical connection area 16 be electrically connected between area 52 with the 4th of the second substrate 2
Reliable contacts and have good conductive property.Wherein different side's conductive adhesive layer 7 can be adhered to first substrate 1 by crimping apparatus
Between the second substrate 2, specifically, using crimping apparatus under 160 DEG C~300 DEG C of temperature, the pressure condition of 30N~80N
First substrate 1 and the second substrate 2 to 3 seconds~20 seconds are crimped using different side's conductive adhesive layer 7.It wherein, can for above three parameter
With preferably, temperature is 160 DEG C~260 DEG C, pressure is 30N~55N, the time is 3 seconds~15 seconds.Here, conductive using different side
In the case where glue-line 7, as shown in figure 8, the third of the coating zone covering the second substrate 2 of different side's conductive adhesive layer 7 is electrically connected area 42
With the 4th electrical connection area 52, in other words, the overlay area can cover the first electrical connection area 31 and the second electricity of first substrate 1
Bonding pad 16, is easy to implement coating and connection operation as a result,.In addition, when the current-carrying part on first substrate 1 and the second substrate 2
In the case where using different materials, different side's conductive adhesive layer 7 also can be realized being reliably connected for first substrate 1 and the second substrate 2, have
Effect ensure that the performance requirement of antenna.But it's not limited to that for the disclosure, can also be by the first electrical connection area 31 and third
It is electrically connected between area 42 and separately setting uses other between the second electrical connection area 16 and the 4th electrical connection area 52
The conductive adhesive layer or welding layer of adhesives can also for another example connect the first electrical connection area 31 and third electricity by mode of printing
Bonding pad 42 and the second electrical connection area 16 the 4th are electrically connected area 52.
Optionally, as shown in Figures 1 to 6, the first substrate 1 includes that protrusion is formed in the first substrate 1 close to institute
The extension board 13 of the outer end edges of coil 3 is stated, the first electrical connection area 31 and second electrical connection area 16 are arranged in described
On first side surface 11 of extension board 13, the second substrate 2 is mounted on the extension board 13, and the second substrate
2 first side surface 21 and first side surface 11 of the extension board 13 are positioned opposite.Connecting the first base as a result,
Installation positioning action is played to the second substrate 2 by extension board 13 when plate 1 and the second substrate 2, that is, can be by the second substrate 2 first
It is attached again after navigating to extension board 13, thus improves installation exercise efficiency.
Here, optionally, on the first substrate 1 and the thickness direction of the second substrate 2, first electrical connection
Area 31 and third electrical connection area 42 are overlapped, and the second electrical connection area 16 and the 4th electrical connection area 52 are overlapped.By
This reduces processing cost while can be improved the overall processing efficiency of first substrate 1 and the second substrate 2.Here, optionally, institute
The a part for stating the second substrate 2 is formed to have shape corresponding with the extension board 13, and the third is electrically connected 42 He of area
4th electrical connection area 52 is arranged in described a part of the second substrate 2 with extending longitudinally, first feed point
41 and second feed point 51 be exposed to the outside of the extension board 13.Described a part of the second substrate 2 is being laminated to
In the case where on the extension board 13 of one substrate 1, the first electrical connection area 31 and the second electrical connection area 16 are each on the thickness direction
It is Chong Die from area 42 and the 4th electrical connection area 52 is accordingly electrically connected with third, thereby guarantee that leading for first substrate 1 and the second substrate 2
Installation effectiveness is further increased while electrical property is good.Further, since the first feed point 41 and the second feed point in the second substrate 2
51 are adjacently positioned and are exposed to the tip exterior in extension board 13, so that the first feed point 41 and the second feed point 51 are convenient for connection
Antenna leads on terminal mainboard.
Optionally, as shown in figure 8, the first substrate 1 is back on the second side surface 12 of first side surface 11
It is provided with subsidiary layer 8, which is adhesive layer, and the second substrate 2 is back in second side table of first side surface 21
Insulating layer 23 is provided on face 22, first feed point 41 and second feed point 51 are exposed to the described of the second substrate 2
Insulating layer 23.Wherein, when be disposed with conductive tie layers 6 as described above on the second side surface 12 in first substrate 1 the case where
Under, the subsidiary layer 8 is covered on the conductive tie layers 6 and insulate with the conductive tie layers 6.Here, insulating layer 23 can be with
Using materials such as ferrites, near-field communication aerial 10 can be installed to terminal mainboard etc. by adhesive layer by the first substrate 1
In structure.But it's not limited to that for the disclosure, and the subsidiary layer 8 may be using the knot such as insulating layers of materials such as ferrite
Structure.
Optionally, as shown in Figure 3 and Figure 4, first feed point 41 and second feed point 51 penetrate through the second substrate 2
Both side surface, the second substrate 2 formed on the top between first feed point 41 and second feed point 51
There is fluting 24.That is, the first side surface 21 and the second side surface 22 of the fluting 24 perforation the second substrate 2, so as to effectively keep away
Exempt from that short circuit occurs between the first feed point 41 and the second feed point 51, while the first feed point can also be increased by fluting 24 during installation
41 and second feed point 51 mounting area and improve bonding strength.Wherein, the first feed point 41 and the second feed point 51 can pass through bullet
Piece or the mode for playing needle are connected with terminal mainboard and form operating circuit.
Optionally, the current-carrying part of the first substrate 1 is made of aluminum, and the current-carrying part of the second substrate 2 is by copper
At.Specifically, the coil 3, first on first substrate 1 is electrically connected area 31, second and is electrically connected conducting area 14, second, area 16, first
Area 15 is connected and conductive tie layers 6 can be made of aluminum, first line part 4, the second route in the second substrate 2
Part 5, electrical connection area 52, third electrical connection area the 42, the 4th, the first feed point 41 and the second feed point 51 can be made of copper.Such as
It is upper described, by making the current-carrying part on larger-size first substrate 1 using lower-cost aluminum material, size lesser the
Current-carrying part on two substrates 2 uses electric conductivity and the good copper product of weldability, thus not only saves cost, but also meet
First feed point 41 and the second feed point 51 require the weldability of terminal mainboard, contact reliability.It is easy to process, and further
Reduce near-field communication aerial 10 whole manufacture and processing cost.In addition, can be real using the structure of the first substrate 1 of aluminum material
Existing ultrathin and the design space for being conducive to save terminal.But it's not limited to that for the disclosure, the coil on the first substrate 1
3 and the first feed point 41 in the second substrate 2 and second feed point 51 can use identical material, or can also using with
Different other of above embodiment not same material.
In addition, being not limited to above-mentioned reality for the quantity disclosure in the electrical connection area on first substrate 1 and the second substrate 2
It applies and is respectively set described in mode there are two the mode in electrical connection area, 1 He of first substrate can be designed according to actual needs
The quantity in the electrical connection area in the second substrate 2, wherein feed point quantity in the second substrate 2 respectively with first substrate 1 and the second base
The quantity in the electrical connection area on plate 2 is generally consistent.For example, can be set on coil 3 on first substrate 1, there are three be electrically connected
Meet area, it can be the first electrical connection area 31 as described above and the second electrical connection area 16 that two of them, which are electrically connected area, and remaining one
A electrical connection area can be to be electrically connected area for the 5th of ground connection, at this point, can be set on the first side surface 21 of the second substrate 2
There is the 6th electrical connection area connecting with the 5th electrical connection area, at this point, can also set on the first side surface 21 of the second substrate 2
It is equipped with tertiary circuit part, one end of the tertiary circuit part is arranged in the 6th electrical connection area, and tertiary circuit part is another
Third feed point has can be set in end, and the specific position of the third feed point can according to need to design.In addition, passing through first
First substrate 1 and the second substrate 2, can be made coiled strip structure by the independent molding structure of substrate 1 and the second substrate 2, save at
This while, produces convenient for automation, semi-automation and can be improved working efficiency.Herein in particular, as shown in Figure 9 and Figure 10
Ground, the second substrate 2 can be formed as 9 form of splicing band, and the second substrate 2 of this 9 form of splicing band is connect with first substrate 1
When the effect of positioning can also be played by being arranged in the location hole 91 on 9 top of splicing band.In addition, by will independent molding the
One substrate 1 and the second substrate 2 are made for modular construction, to only change feed point position, first by modes such as the printing films
The performance of circuit pack 4, the second circuit pack 5 and coil 3 thereby saves die cost without re-molding stamp
And improve production efficiency.
To sum up, by the near-field communication aerial of simple structure as described above, in the connection of first substrate 1 and the second substrate 2
It can effectively ensure that the coil 3 on first substrate 1 and the first feed point 41 in the second substrate 2 and the second feed point 51 are realized under state
It is electrically connected and realizes the performance of antenna, thus, it is possible to be easy to independent manufacture to process first substrate 1 and the second substrate 2, play system
It makes and effect that processing cost is low.
The preferred embodiment of the disclosure is described in detail in conjunction with attached drawing above, still, the disclosure is not limited to above-mentioned reality
The detail in mode is applied, in the range of the technology design of the disclosure, a variety of letters can be carried out to the technical solution of the disclosure
Monotropic type, these simple variants belong to the protection scope of the disclosure.
It is further to note that specific technical features described in the above specific embodiments, in not lance
In the case where shield, can be combined in any appropriate way, in order to avoid unnecessary repetition, the disclosure to it is various can
No further explanation will be given for the combination of energy.
In addition, any combination can also be carried out between a variety of different embodiments of the disclosure, as long as it is without prejudice to originally
Disclosed thought equally should be considered as disclosure disclosure of that.
Claims (11)
1. a kind of near-field communication aerial, which is characterized in that the near-field communication aerial include first substrate interconnected (1) and
The second substrate (2) is provided with coil (3) on the first side surface (11) of the first substrate (1), and the outer end of the coil (3) is set
It is equipped with the first electrical connection area (31), and inner end is electrically connected on the first side surface (11) for being arranged in the first substrate (1)
Second electrical connection area (16), first electrical connection area (31) are electrically connected that area (16) is adjacent and arranged for interval with described second, institute
It states and is provided with first line part (4) and the second circuit pack (5) on the first side surface (21) of the second substrate (2), this first
The third electricity that the both ends of circuit pack (4) are respectively arranged with the first feed point (41) and are electrically connected area (31) electrical connection with described first
Bonding pad (42), the both ends of second circuit pack (5) are respectively arranged with the second feed point (51) and are electrically connected with described second
4th electrical connection area (52) of area (16) electrical connection.
2. near-field communication aerial according to claim 1, which is characterized in that the inner end of the coil (3) is formed with perforation
First conducting area (14) of the both side surface of the first substrate (1), the first substrate (1), which is provided with from described second, to be electrically connected
Connect the second conducting area (15) that area (16) extend and penetrate through the both side surface of the first substrate (1), first substrate (1) back
For being provided with conductive tie layers (6) on the second side surface (12) of first side surface (11), first conducting area
(14) it is electrically connected to each other with second conducting area (15) by the conductive tie layers (6), so that the coil (3) is interior
End is electrically connected to second electrical connection area (16).
3. near-field communication aerial according to claim 2, which is characterized in that second conducting area (15), which is located at, leans near line
It encloses the position of (3) outer end and arranged for interval has a part of the coil (3) between first conducting area (14).
4. near-field communication aerial according to claim 2, which is characterized in that first conducting area (14) and described second
Area (15) are connected, the conductive tie layers (6) are connected to by ultrasonic bonding mode.
5. near-field communication aerial according to claim 1, which is characterized in that the first side surface of the first substrate (1)
(11) different side's conductive adhesive layer (7) is provided between the first side surface (21) of the second substrate (2).
6. near-field communication aerial according to claim 1, which is characterized in that the first substrate (1) includes prominent formed
The first substrate (1) close to the coil (3) outer end edges extension board (13), it is described first electrical connection area (31) and
Second electrical connection area (16) is arranged on first side surface (11) of the extension board (13), the second substrate
(2) it is mounted on the extension board (13), and first side surface (21) of the second substrate (2) and the extension board
(13) first side surface (11) is positioned opposite.
7. near-field communication aerial according to claim 6, which is characterized in that in the first substrate (1) and described second
On the thickness direction of substrate (2), first electrical connection area (31) and third electrical connection area (42) overlapping, and described second
It is electrically connected area (16) and the 4th electrical connection area (52) overlapping.
8. near-field communication aerial according to claim 6 or 7, which is characterized in that a part of shape of the second substrate (2)
As having shape corresponding with the extension board (13), third electrical connection area (42) and the described 4th are electrically connected area
(52) it is arranged in extending longitudinally in described a part of the second substrate (2), first feed point (41) and described the
Two feed points (51) are exposed to the outside of the extension board (13).
9. near-field communication aerial according to claim 1, which is characterized in that the first substrate (1) is back in described
Subsidiary layer (8) are provided on the second side surface (12) of one side surface (11), which is adhesive layer, second base
Plate (2) is back to being provided with insulating layer (23) on the second side surface (22) in first side surface (21), first feed point
(41) and second feed point (51) is exposed to the insulating layer (23) of the second substrate (2).
10. according to claim 1 or near-field communication aerial described in 9, which is characterized in that first feed point (41) and described
Two feed points (51) penetrate through the both side surface of the second substrate (2), the second substrate (2) be located at first feed point (41) and
Fluting (24) are formed on top between second feed point (51).
11. near-field communication aerial according to claim 1, which is characterized in that the current-carrying part of the first substrate (1) by
Aluminium is made, and the current-carrying part of the second substrate (2) is made of copper.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710661309.9A CN109390676A (en) | 2017-08-04 | 2017-08-04 | Near-field communication aerial |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710661309.9A CN109390676A (en) | 2017-08-04 | 2017-08-04 | Near-field communication aerial |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109390676A true CN109390676A (en) | 2019-02-26 |
Family
ID=65413416
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710661309.9A Pending CN109390676A (en) | 2017-08-04 | 2017-08-04 | Near-field communication aerial |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109390676A (en) |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005116635A (en) * | 2003-10-03 | 2005-04-28 | Matsushita Electric Ind Co Ltd | Terminal structure of high-frequency unit |
| CN1663331A (en) * | 2002-04-26 | 2005-08-31 | 塞乐丝半导体公司 | Method for producing an electrical circuit |
| JP2012191134A (en) * | 2011-03-14 | 2012-10-04 | Murata Mfg Co Ltd | Coil module and non-contact power transmission system |
| CN102738168A (en) * | 2011-03-31 | 2012-10-17 | 索尼公司 | Semiconductor device and fabrication method therefor |
| CN202797254U (en) * | 2012-09-06 | 2013-03-13 | 哗裕实业股份有限公司 | Chip antenna |
| CN104321928A (en) * | 2012-03-23 | 2015-01-28 | Lg伊诺特有限公司 | Antenna assembly and method for manufacturing same |
| KR20150022674A (en) * | 2013-08-23 | 2015-03-04 | 삼성에스디아이 주식회사 | Antenna module for terminal device and method for manufacturing the same |
| CN105048075A (en) * | 2014-04-30 | 2015-11-11 | Tdk株式会社 | Antenna device |
| CN105048096A (en) * | 2014-04-30 | 2015-11-11 | Tdk株式会社 | Antenna device |
| CN106163108A (en) * | 2015-04-10 | 2016-11-23 | 深圳市安特讯科技有限公司 | Circuit and preparation method thereof |
-
2017
- 2017-08-04 CN CN201710661309.9A patent/CN109390676A/en active Pending
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1663331A (en) * | 2002-04-26 | 2005-08-31 | 塞乐丝半导体公司 | Method for producing an electrical circuit |
| JP2005116635A (en) * | 2003-10-03 | 2005-04-28 | Matsushita Electric Ind Co Ltd | Terminal structure of high-frequency unit |
| JP2012191134A (en) * | 2011-03-14 | 2012-10-04 | Murata Mfg Co Ltd | Coil module and non-contact power transmission system |
| CN102738168A (en) * | 2011-03-31 | 2012-10-17 | 索尼公司 | Semiconductor device and fabrication method therefor |
| CN104321928A (en) * | 2012-03-23 | 2015-01-28 | Lg伊诺特有限公司 | Antenna assembly and method for manufacturing same |
| CN202797254U (en) * | 2012-09-06 | 2013-03-13 | 哗裕实业股份有限公司 | Chip antenna |
| KR20150022674A (en) * | 2013-08-23 | 2015-03-04 | 삼성에스디아이 주식회사 | Antenna module for terminal device and method for manufacturing the same |
| CN104425877A (en) * | 2013-08-23 | 2015-03-18 | 三星Sdi株式会社 | Antenna module for terminal device and method for manufacturing the same and battery comprising the same |
| CN105048075A (en) * | 2014-04-30 | 2015-11-11 | Tdk株式会社 | Antenna device |
| CN105048096A (en) * | 2014-04-30 | 2015-11-11 | Tdk株式会社 | Antenna device |
| CN106163108A (en) * | 2015-04-10 | 2016-11-23 | 深圳市安特讯科技有限公司 | Circuit and preparation method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US10050339B2 (en) | Antenna device and communication terminal apparatus | |
| CN204966206U (en) | Inductance bridge and electronic equipment | |
| CN207165744U (en) | Electronic equipment and antenna element | |
| CN102243722B (en) | Wireless IC device | |
| CN103053074A (en) | Antenna apparatus and communication terminal apparatus | |
| CN203661410U (en) | Capacitive screen type flexible circuit board | |
| CN105682343A (en) | Flexible-rigid combined board and terminal | |
| CN203482483U (en) | Circuit board | |
| CN205266019U (en) | Flexible circuit board and display device | |
| CN107990175A (en) | A kind of flexible LED rope light | |
| CN205902188U (en) | Electric elements and mobile device | |
| CN102243723B (en) | Wireless IC device | |
| CN207766638U (en) | Multilager base plate, electronic equipment | |
| WO2005062756A3 (en) | An antenna radiator assembly and radio communications assembly | |
| CN105591259B (en) | Wiring part and its manufacturing method, the method for designing wiring component and electronic device | |
| CN109390676A (en) | Near-field communication aerial | |
| CN107623985B (en) | Flexible circuit board and mobile terminal | |
| CN204466070U (en) | Circuit substrate | |
| CN109714883A (en) | Line build-out FPC | |
| JP4665698B2 (en) | Antenna device | |
| CN210807794U (en) | Multifunctional reinforcing plate, circuit board assembly and electronic equipment | |
| CN211184412U (en) | PCB board with shielding structure | |
| CN107801295A (en) | Flexible PCB and mobile terminal | |
| CN105578724A (en) | Flexible printed circuit board and mobile terminal | |
| CN207604001U (en) | FPC plates and the electronic equipment with the FPC plates |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20190226 |
|
| RJ01 | Rejection of invention patent application after publication |