CN109385186A - Dedicated three-proofing coating of a kind of no-solvent type low viscosity UV- moisture dual cure printed wiring board and preparation method thereof - Google Patents
Dedicated three-proofing coating of a kind of no-solvent type low viscosity UV- moisture dual cure printed wiring board and preparation method thereof Download PDFInfo
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- CN109385186A CN109385186A CN201811215694.5A CN201811215694A CN109385186A CN 109385186 A CN109385186 A CN 109385186A CN 201811215694 A CN201811215694 A CN 201811215694A CN 109385186 A CN109385186 A CN 109385186A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
- C09D163/10—Epoxy resins modified by unsaturated compounds
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/14—Polycondensates modified by chemical after-treatment
- C08G59/1433—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds
- C08G59/1438—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds containing oxygen
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/08—Anti-corrosive paints
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/14—Paints containing biocides, e.g. fungicides, insecticides or pesticides
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/63—Additives non-macromolecular organic
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Abstract
The invention discloses dedicated three-proofing coatings of a kind of no-solvent type low viscosity UV- moisture dual cure printed wiring board and preparation method thereof comprising following each components according to parts by weight: 10-50 parts of modified acrylic ester resins, 30-90 portions of reactive diluents, 1-15 parts of photoinitiators, 1-10 parts of coupling agents, 0.1-1.5 portions of bacteriostatic agents and 0.1-1 parts of catalyst；A kind of dedicated three-proofing coating of no-solvent type low viscosity UV- moisture dual cure printed wiring board provided by the invention is a kind of environment-friendly type solvent-free three-proofing coating, have the characteristics that viscosity is low, smell is low, be easy to arrange that bubble, solidification energy are low, curing rate is fast, paint film after solidification not only has the performances such as excellent salt fog resistance, moisture resistance, yellowing resistance and chemical resistance, also has good adhesive force.
Description
Technical field
The present invention relates to chemical fields, and in particular to a kind of no-solvent type low viscosity UV- moisture dual cure printed wire
Dedicated three-proofing coating of plate and preparation method thereof.
Background technique
With the fast development of electronic industry, increasingly higher demands are proposed to Quality of electronic products, due to environment because
The failure of electronic product caused by element becomes to get worse, and three-proofing coating protection technique is as extension electronic product service life, it is ensured that
Electronic product has been widely used using a technology of security and reliability in electronics industry.Three-proofing coating is applied to printed wire
It can play the role of following three points after plate: (1) avoid because of the electric leakage of wiring board caused by ambient moisture and other pollution sources or short circuit,
Prevent the generation of the electric discharge phenomena such as electric arc, corona；(2) fatigue life for promoting leadless device solder joint, on wiring board
Small element a degree of fixed function is provided, avoid the influence of vibration or mechanical shock to it；(3) it prevents from corroding, prevent
Mould.
For the three-proofing coating applied in industry at present based on solvent type, the solvent used is generally easy volatile solvent, has potential
Security risk, in the construction process, the volatilization of solvent causes construction environment more severe, and it is strong also to will affect operator's body
Health.In three-proofing coating add solvent the reason of, be on the one hand because stoste viscosity it is larger, construction when it is not easy to operate, use solvent
Stoste is diluted, system viscosity is reduced, improves operability；On the other hand, three-proofing coating viscosity is larger, and paint film is thicker after coating,
Also it will increase entreprise cost, under the premise of not influencing performance, three-proofing coating viscosity reduced by dilution, lowering coating layer thickness can drop
Low production cost.
Existing three-proofing coating type mainly has epoxies, polyurethanes, organic silicon and acrylic compounds, acrylic compounds three proofings
Paint can realize rapid curing by ultraviolet light, but due to the complexity of device in printed wiring board, there are ultraviolet lights cannot
The place being irradiated to, the acrylic compounds three-proofing coating of simple UV curing mechanism cannot achieve shadow region and be fully cured, to influence three
The protective performance of anti-paint.
Summary of the invention
The shortcomings that in order to overcome the prior art, the present invention provides a kind of no-solvent type low viscosity UV- moisture is dual solid
Change the dedicated three-proofing coating of printed wiring board, it is characterised in that including following each components in parts by weight:
(A) 10-50 parts of modified acrylic ester resins；
(B) 30-90 portions of reactive diluents；
(C) 1-15 parts of photoinitiators；
(D) 1-10 parts of coupling agents；
(E) 0.1-1.5 portions of bacteriostatic agents；
(F) 0.1-1 parts of catalyst.
The modified acrylic ester resin is in molecular structure containing the alkoxy-functional that can be reacted with moisture in air
The modified acrylic ester resin of group.
Preferably, the reactive diluent is isobornyl acrylate, isobornyl methacrylate, 2- phenoxy group second
Base acrylate, the bicyclic amylene oxygroup ethyl ester of methacrylic acid, Tetrahydrofurfuryl Methacrylate, 3,3,5- 3-methyl cyclohexanols
It is a variety of in base acrylate.
Preferably, the reactive diluent is isobornyl acrylate, isobornyl methacrylate, 2- phenoxy group second
Base acrylate, the bicyclic amylene oxygroup ethyl ester of methacrylic acid, Tetrahydrofurfuryl Methacrylate, 3,3,5- 3-methyl cyclohexanols
Two or three in base acrylate.
Preferably, the photoinitiator is benzoin dimethylether, Alpha-hydroxy isobutyrophenone, 2- methyl-1-[4- (methyl
It is thio) phenyl] -2- (4- morpholinyl) -1- acetone, 2- benzyl -2- dimethylamino -1- (4- morpholinyl phenyl) butanone, 1- hydroxyl
Cyclohexyl phenyl ketone, one of bis- (2,4,6- trimethylbenzoyl) phosphine oxides of phenyl or a variety of.
Preferably, the photoinitiator is benzoin dimethylether, 2- benzyl -2- dimethylamino -1- (4- morpholine benzene
Base) butanone, 1- hydroxycyclohexyl phenyl ketone, one of bis- (2,4,6- trimethylbenzoyl) phosphine oxides of phenyl or more
Kind.
Preferably, the coupling agent is 3- (methacryloxypropyl) propyl trimethoxy silicane, (the 2- methoxy of vinyl three
Base oxethyl) silicon, methyltriethoxysilane, vinyltrimethoxysilane, 3-aminopropyltriethoxysilane, three is (different
Propenyloxy group) one of vinyl silanes or a variety of.
Preferably, the coupling agent is 3- (methacryloxypropyl) propyl trimethoxy silicane, three second of 3- aminopropyl
Oxysilane, vinyltrimethoxysilane, one or both of three (isopropyl alkenyloxy group) vinyl silanes.
It is highly preferred that the coupling agent is 3- (methacryloxypropyl) propyl trimethoxy silicane, three second of 3- aminopropyl
Oxysilane, one of three (isopropyl alkenyloxy group) vinyl silanes.
Preferably, the bacteriostatic agent is the chloro- 2- n-octyl -3- isothiazolinone of 4,5- bis-, 2- n-octyl -4- isothiazole
Quinoline -3- ketone, 1,2- benzisothiazole-3-ketone, one of N- octylisothiazolinone or a variety of.
Preferably, the catalyst is dibutyl tin dilaurate, di-t-butyl diacetoxy tin, metatitanic acid isopropyl
Ester, one of butyl titanate.
Preferably, the catalyst is dibutyl tin dilaurate, one of butyl titanate.
Preferably, the modified acrylic ester resin is made using following methods:
(1) epoxy acrylate containing polyhydroxy group is added to dividing in the reactor of water condensing unit, is stirred
Rate 150r/min is mixed, 90 DEG C -110 DEG C is warming up to, vacuumizes simultaneously, vacuum degree control empties reactor in 0.06-0.1MPa
Interior air；
(2) tetraethoxysilane is added, the molar ratio of hydroxyl and tetraethoxysilane is 1:1 in epoxy acrylate, is added
Enter dibutyl tin dilaurate, the dosage of dibutyl tin dilaurate is epoxy acrylate and tetraethoxysilane total weight
0.1%-0.5% keeps temperature and vacuum degree, is stirred to react 3-8h and stops reaction, is down to room temperature；
(3) Centrifugical extraction is carried out with petroleum ether, vacuum distillation removes petroleum ether, obtains the modification third containing siloxane group
Alkene acid ester resin.
The present invention also provides one kind, to be used to prepare no-solvent type low viscosity UV- moisture dual cure printed wiring board dedicated
The preparation method of three-proofing coating comprising the steps of:
Reaction is added in the modified acrylic ester resin of 10-50 parts by weight and the reactive diluent of 30-90 parts by weight
It in device, vacuumizes simultaneously, control vacuum degree stirs 30min in 0.08-0.1MPa, with 150r/min revolving speed, and 1-15 weight is added
Number photoinitiator, 1-10 parts by weight coupling agent, 0.1-1.5 parts by weight bacteriostatic agent, 0.1-1 parts by weight catalyst, mention
High revolving speed stirs 20min to 300r/min, discharges after mixing, and no-solvent type low viscosity UV- moisture dual cure print is made
The dedicated three-proofing coating of brush wiring board.
According to the above aspect of the present invention, the present invention has at least the following advantages:
1, by using the silicone-modified Epocryl with special molecular structure, when reaction, is first used ultraviolet
Light realizes rapid curing, does not influence producing line subsequent operation, the alkoxy in molecule is further crosslinked reality by moisture absorption condensation reaction
The solidification in existing shadow region is fully cured to realize, avoids that cannot achieve shadow region using simple UV solidification class three-proofing coating complete
The problem of all solidstate, promotes the reliability of protection；
2, make it that the viscosity of system can also be effectively reduced while participating in and reacting by using suitable reactive diluent,
It is avoided while not influencing and operating conveniency using the environmental protection of solvent bring and security risk；
3, enhance three proofings lacquer coat to the adhesive force of substrate by the way that coupling agent is added；
4, by the way that the auxiliary agent of catalysis moisture absorption condensation reaction is added, accelerate the period that whole system is fully cured；
5, by the way that bacteriostatic agent is added, the growth and breeding of mould is destroyed, the anti-mold effect in product use process is improved.
Specific embodiment
Lower is that the present invention is further explained, is exemplified below specific embodiment, but these embodiments are merely to illustrate the present invention
And it does not limit the scope of the invention.
Embodiment 1
By 35 parts of modified acrylic ester resins, 60 portions of reactive diluents (by isobornyl methacrylate, 2- phenoxy group second
Base acrylate, 3,3,5- trimethylcyclohexyl acrylate are formed according to weight ratio 1.2:1.0:0.8) it is added in parts by weight
It in reactor, vacuumizes simultaneously, control vacuum degree stirs 30min in 0.1MPa, with 150r/min revolving speed, in parts by weight successively
Bis- (2,4,6- trimethylbenzoyl) phosphine oxides of 5 parts of photoinitiator phenyl, 4 parts of coupling agent 3- aminopropyl triethoxies is added
Silane, 0.6 part of bacteriostatic agent Kathon, 0.5 part of catalyst dibutyltin dilaurylate keep vacuum
Degree improves revolving speed to 300r/min and stirs 20min, discharged after mixing to get dual to no-solvent type low viscosity UV- moisture
The dedicated three-proofing coating of cured printed wiring board.
The preparation of above-mentioned modified acrylic ester resin uses following methods:
(1) epoxy acrylate containing polyhydroxy group is added to dividing in the reactor of water condensing unit, is stirred
Rate 150r/min is mixed, 100 DEG C is warming up to, vacuumizes simultaneously, vacuum degree control empties the air in reactor in 0.1MPa；
(2) tetraethoxysilane is added, the molar ratio of hydroxyl and tetraethoxysilane is 1:1 in epoxy acrylate, is added
Enter dibutyl tin dilaurate, the dosage of dibutyl tin dilaurate is epoxy acrylate and tetraethoxysilane total weight
0.3%, temperature and vacuum degree are kept, 6h is stirred to react and stops reaction, be down to room temperature；
(3) Centrifugical extraction is carried out with petroleum ether, vacuum distillation removes petroleum ether, obtains the modification third containing siloxane group
Alkene acid ester resin.
Embodiment 2
By 50 parts of modified acrylic ester resins, 45 portions of reactive diluents (by 2- phenoxyethyl acrylate, 3,3,5- tri-
Methylcyclohexyl acrylate is formed according to weight ratio 2:1) it sequentially adds in reactor in parts by weight, it vacuumizes, controls simultaneously
Vacuum degree processed stirs 30min in 0.1MPa, with 150r/min revolving speed, in parts by weight addition 5 parts of photoinitiator 2- methyl-1s-
[4- (methyl thio) phenyl] -2- (4- morpholinyl) -1- acetone, 5 parts of coupling agent 3- (methacryloxypropyl) propyl trimethoxies
Silane, 0.5 portion of bacteriostatic agent 1,2- benzisothiazole-3-ketone, 0.6 part of catalyst dibutyltin dilaurylate keep vacuum degree, mention
High revolving speed stirs 20min to 300r/min, is discharged after mixing to get no-solvent type low viscosity UV- moisture dual cure is arrived
The dedicated three-proofing coating of printed wiring board.
The preparation of above-mentioned modified acrylic ester resin uses following methods:
(1) a certain amount of epoxy acrylate containing polyhydroxy group is added to the reactor for dividing water condensing unit
In, stirring rate 150r/min is warming up to 100 DEG C, vacuumizes simultaneously, and vacuum degree control empties in reactor in 0.1MPa
Air；
(2) tetraethoxysilane is added, the molar ratio of hydroxyl and tetraethoxysilane is 1:1 in epoxy acrylate, is added
Enter dibutyl tin dilaurate, the dosage of dibutyl tin dilaurate is epoxy acrylate and tetraethoxysilane total weight
0.3%, temperature and vacuum degree are kept, 6h is stirred to react and stops reaction, be down to room temperature；
(3) Centrifugical extraction is carried out with petroleum ether, vacuum distillation removes petroleum ether, obtains the modification third containing siloxane group
Alkene acid ester resin.
Embodiment 3
By 45 parts of modified acrylic ester resins, 50 portions of reactive diluents (by isobornyl methacrylate, 2- phenoxy group second
Base acrylate, 3,3,5- trimethylcyclohexyl acrylate are formed according to weight ratio 1.2:1.0:0.8) it is added in parts by weight
It in reactor, vacuumizes simultaneously, control vacuum degree stirs 30min in 0.1MPa, with 150r/min revolving speed, in parts by weight successively
5 parts of photoinitiator 2- methyl-1s-[4- (methyl thio) phenyl] -2- (4- morpholinyl) -1- acetone, 0.6 portion of bacteriostatic agent 1 is added,
2- benzisothiazole-3-ketone, 0.5 part of catalyst Ti acid butyl ester keep vacuum degree, and raising revolving speed to 300r/min stirs 20min,
It is discharged after mixing to get the dedicated three-proofing coating of no-solvent type low viscosity UV- moisture dual cure printed wiring board is arrived.
The preparation of above-mentioned modified acrylic ester resin uses following methods:
(1) a certain amount of epoxy acrylate containing polyhydroxy group is added to the reactor for dividing water condensing unit
In, stirring rate 150r/min is warming up to 100 DEG C, vacuumizes simultaneously, and vacuum degree control empties in reactor in 0.1MPa
Air；
(2) tetraethoxysilane is added, the molar ratio of hydroxyl and tetraethoxysilane is 1:1 in epoxy acrylate, is added
Enter dibutyl tin dilaurate, the dosage of dibutyl tin dilaurate is epoxy acrylate and tetraethoxysilane total weight
0.3%, temperature and vacuum degree are kept, 6h is stirred to react and stops reaction, be down to room temperature；
(3) Centrifugical extraction is carried out with petroleum ether, vacuum distillation removes petroleum ether, obtains the modification third containing siloxane group
Alkene acid ester resin.
Comparative example
By 75 parts of modified acrylic ester resins, 20 portions of reactive diluents (by isobornyl methacrylate, methacrylic acid
The bicyclic amylene oxygroup ethyl ester of tetrahydrofuran methyl esters, methacrylic acid according to weight ratio 0.8:1.0:1.2 form) in parts by weight according to
It in secondary addition reactor, vacuumizes simultaneously, control vacuum degree stirs 30min in 0.1MPa, with 150r/min revolving speed, by weight
5 parts of photoinitiator 1- hydroxycyclohexyl phenyl ketones, 4 parts of coupling agent three (isopropyl alkenyloxy group) vinyl silanes, 0.6 part are added in number
Bacteriostatic agent N- octylisothiazolinone, 0.5 part of catalyst Ti acid butyl ester keep vacuum degree, improve revolving speed to 300r/min stirring
20min is discharged after mixing to get the dedicated three-proofing coating of no-solvent type low viscosity UV- moisture dual cure printed wiring board is arrived.
The preparation of above-mentioned modified acrylic ester resin uses following methods:
(1) a certain amount of epoxy acrylate containing polyhydroxy group is added to the reactor for dividing water condensing unit
In, stirring rate 150r/min is warming up to 100 DEG C, vacuumizes simultaneously, and vacuum degree control empties in reactor in 0.1MPa
Air；
(2) tetraethoxysilane is added, the molar ratio of hydroxyl and tetraethoxysilane is 1:1 in epoxy acrylate, is added
Enter dibutyl tin dilaurate, the dosage of dibutyl tin dilaurate is epoxy acrylate and tetraethoxysilane total weight
0.3%, temperature and vacuum degree are kept, 6h is stirred to react and stops reaction, be down to room temperature；
(3) Centrifugical extraction is carried out with petroleum ether, vacuum distillation removes petroleum ether, obtains the modification third containing siloxane group
Alkene acid ester resin.
It is tested using three-proofing coating of the GB standard to embodiment 1-3 and comparative example, wherein hardness and adhesive force
It is first progress UV solidification (1200mJ/cm2) afterwards room temperature resolidification tested after 7 days, ensure that embodiment 1-3 and comparative example
Three-proofing coating be fully cured, test result is as shown in table 1.
The performance test data of three-proofing coating obtained in 1 embodiment 1-3 of table and comparative example
To sum up, the viscosity of system can not only be effectively reduced in the addition of diluent, convenient for operation, can also avoid using molten
The environmental protection and security risk that agent generates；The addition of coupling agent can improve three-proofing coating to the adhesive ability of substrate, thus preferably
It protects printed wiring board and improves the reliability of product；By using the Silicone modified acryl tree with special molecular structure
Rouge, after UV solidification, shadow region can be solidified by moisture absorption condensation reaction, and simple UV curing system three-proofing coating is avoided to cannot achieve
The problem of shadow region is fully cured.
The above is only a preferred embodiment of the present invention, it is not intended to restrict the invention, it is noted that for this skill
For the those of ordinary skill in art field, without departing from the technical principles of the invention, can also make it is several improvement and
Modification, these improvements and modifications also should be regarded as protection scope of the present invention.
Claims (10)
1. a kind of dedicated three-proofing coating of no-solvent type low viscosity UV- moisture dual cure printed wiring board, it is characterised in that: including pressing
Following each components that parts by weight calculate:
(A) 10-50 parts of modified acrylic ester resins；
(B) 30-90 portions of reactive diluents；
(C) 1-15 parts of photoinitiators；
(D) 1-10 parts of coupling agents；
(E) 0.1-1.5 portions of bacteriostatic agents；
(F) 0.1-1 parts of catalyst.
2. the dedicated three-proofing coating of no-solvent type low viscosity UV- moisture dual cure printed wiring board according to claim 1,
It is characterized in that: including following each components in parts by weight:
(A) 10-40 parts of modified acrylic ester resins；
(B) 35-80 portions of reactive diluents；
(C) 1-10 parts of photoinitiators；
(D) 1-8 parts of coupling agents；
(E) 0.1-1 portions of bacteriostatic agents；
(F) 0.2-0.8 parts of catalyst.
3. the dedicated three-proofing coating of no-solvent type low viscosity UV- moisture dual cure printed wiring board according to claim 1,
Be characterized in that: the modified acrylic ester resin is in molecular structure containing the alkoxy-functional that can be reacted with moisture in air
Modified acrylic ester resin.
4. the dedicated three-proofing coating of no-solvent type low viscosity UV- moisture dual cure printed wiring board according to claim 1,
Be characterized in that: the reactive diluent is isobornyl acrylate, isobornyl methacrylate, 2- Phenoxyethyl acrylic acid
The bicyclic amylene oxygroup ethyl ester of ester, methacrylic acid, Tetrahydrofurfuryl Methacrylate, 3,3,5- trimethylcyclohexyl acrylic acid
One of ester is a variety of.
5. the dedicated three-proofing coating of no-solvent type low viscosity UV- moisture dual cure printed wiring board according to claim 1,
Be characterized in that: the photoinitiator is benzoin dimethylether, Alpha-hydroxy isobutyrophenone, 2- methyl-1-[4- (methyl thio) benzene
Base] -2- (4- morpholinyl) -1- acetone, 2- benzyl -2- dimethylamino -1- (4- morpholinyl phenyl) butanone, 1- hydroxy-cyclohexyl benzene
One of bis- (2,4,6- trimethylbenzoyl) phosphine oxides of base ketone, phenyl are a variety of.
6. the dedicated three-proofing coating of no-solvent type low viscosity UV- moisture dual cure printed wiring board according to claim 1,
Be characterized in that: the coupling agent is 3- (methacryloxypropyl) propyl trimethoxy silicane, (the 2- methoxyl group ethoxy of vinyl three
Base) silane, methyltriethoxysilane, vinyltrimethoxysilane, 3-aminopropyltriethoxysilane, three (isopropyl alkene
Oxygroup) one of vinyl silanes or a variety of.
7. the dedicated three-proofing coating of no-solvent type low viscosity UV- moisture dual cure printed wiring board according to claim 1,
Be characterized in that: the bacteriostatic agent be the chloro- 2- n-octyl -3- isothiazolinone of 4,5- bis-, Kathon,
One of 1,2- benzisothiazole-3-ketone, N- octylisothiazolinone are a variety of.
8. the dedicated three-proofing coating of no-solvent type low viscosity UV- moisture dual cure printed wiring board according to claim 1,
Be characterized in that: the catalyst is dibutyl tin dilaurate, di-t-butyl diacetoxy tin, isopropyl titanate, metatitanic acid fourth
One of ester.
9. according to claim 1 to no-solvent type low viscosity UV- moisture dual cure track described in any one of 8 claims
The dedicated three-proofing coating of road plate, it is characterised in that: the modified acrylic ester resin is made using following methods:
(1) epoxy acrylate containing polyhydroxy group is added to dividing in the reactor of water condensing unit, stirring is fast
Rate 150r/min is warming up to 90 DEG C -110 DEG C, vacuumizes simultaneously, and vacuum degree control empties in reactor in 0.06-0.1MPa
Air；
(2) tetraethoxysilane is added, the molar ratio of hydroxyl and tetraethoxysilane is 1:1 in epoxy acrylate, is added two
Dibutyl tin laurate, the dosage of dibutyl tin dilaurate are epoxy acrylate and tetraethoxysilane total weight
0.1%-0.5% keeps temperature and vacuum degree, is stirred to react 3-8h and stops reaction, is down to room temperature；
(3) Centrifugical extraction is carried out with petroleum ether, vacuum distillation removes petroleum ether, obtains the modified acroleic acid containing siloxane group
Ester resin.
10. a kind of preparation method of the dedicated three-proofing coating of no-solvent type low viscosity UV- moisture dual cure printed wiring board, feature
It is: further comprising the steps of: by the modified acrylic ester resin of 10-50 parts by weight in claim 9 and 30-90 parts by weight
Several reactive diluents is added in reactor, vacuumizes simultaneously, controls vacuum degree in 0.08-0.1MPa, with 150r/min revolving speed
Stir 30min, be added 1-15 parts by weight photoinitiator, 1-10 parts by weight coupling agent, 0.1-1.5 parts by weight bacteriostatic agent,
0.1-1 parts by weight catalyst improves revolving speed to 300r/min and stirs 20min, discharges after mixing, it is low that no-solvent type is made
The dedicated three-proofing coating of viscosity UV- moisture dual cure printed wiring board.
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|---|---|---|---|
| CN201811215694.5A CN109385186A (en) | 2018-10-18 | 2018-10-18 | Dedicated three-proofing coating of a kind of no-solvent type low viscosity UV- moisture dual cure printed wiring board and preparation method thereof |
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| CN201811215694.5A CN109385186A (en) | 2018-10-18 | 2018-10-18 | Dedicated three-proofing coating of a kind of no-solvent type low viscosity UV- moisture dual cure printed wiring board and preparation method thereof |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110066539A (en) * | 2019-05-27 | 2019-07-30 | 邱木生 | A kind of UVLED three proofings environmental protection paint and preparation method thereof |
| CN110540828A (en) * | 2019-08-15 | 2019-12-06 | 湖南梵鑫科技有限公司 | UV-curable electronic coating adhesive with antibacterial property and preparation method thereof |
| CN110564340A (en) * | 2019-08-28 | 2019-12-13 | 常州百佳年代薄膜科技股份有限公司 | UV (ultraviolet) moisture dual-curing hot melt adhesive film and preparation method and application thereof |
| CN112280440A (en) * | 2019-07-25 | 2021-01-29 | 上海飞凯光电材料股份有限公司 | UV adhesive coating, preparation method thereof and preparation method of coated workpiece |
| CN113773684A (en) * | 2021-09-30 | 2021-12-10 | 固申新材料(上海)有限公司 | Organic silicon acrylic acid polymerization hybrid three-proofing paint and preparation method thereof |
| CN114231162A (en) * | 2021-11-12 | 2022-03-25 | 广东腐蚀科学与技术创新研究院 | Organic silicon modified polyurethane acrylate ultraviolet light and moisture dual-curing three-proofing paint and preparation method thereof |
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| CN103232829A (en) * | 2013-04-23 | 2013-08-07 | 广东信翼新材料股份有限公司 | Light-moisture dual-curing adhesive |
| CN104804491A (en) * | 2014-01-24 | 2015-07-29 | 程威军 | High-temperature resistance UV and moisture double-curing three-proofing lacquer |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110066539A (en) * | 2019-05-27 | 2019-07-30 | 邱木生 | A kind of UVLED three proofings environmental protection paint and preparation method thereof |
| CN112280440A (en) * | 2019-07-25 | 2021-01-29 | 上海飞凯光电材料股份有限公司 | UV adhesive coating, preparation method thereof and preparation method of coated workpiece |
| CN110540828A (en) * | 2019-08-15 | 2019-12-06 | 湖南梵鑫科技有限公司 | UV-curable electronic coating adhesive with antibacterial property and preparation method thereof |
| CN110564340A (en) * | 2019-08-28 | 2019-12-13 | 常州百佳年代薄膜科技股份有限公司 | UV (ultraviolet) moisture dual-curing hot melt adhesive film and preparation method and application thereof |
| CN110564340B (en) * | 2019-08-28 | 2021-06-01 | 常州百佳年代薄膜科技股份有限公司 | UV (ultraviolet) moisture dual-curing hot melt adhesive film and preparation method and application thereof |
| CN113773684A (en) * | 2021-09-30 | 2021-12-10 | 固申新材料(上海)有限公司 | Organic silicon acrylic acid polymerization hybrid three-proofing paint and preparation method thereof |
| CN114231162A (en) * | 2021-11-12 | 2022-03-25 | 广东腐蚀科学与技术创新研究院 | Organic silicon modified polyurethane acrylate ultraviolet light and moisture dual-curing three-proofing paint and preparation method thereof |
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Application publication date: 20190226 |