CN109378277B - Integrity detection method for substrate pattern array - Google Patents
Integrity detection method for substrate pattern array Download PDFInfo
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- CN109378277B CN109378277B CN201811114028.2A CN201811114028A CN109378277B CN 109378277 B CN109378277 B CN 109378277B CN 201811114028 A CN201811114028 A CN 201811114028A CN 109378277 B CN109378277 B CN 109378277B
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- H01—ELECTRIC ELEMENTS
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- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
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- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
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Abstract
The invention discloses a method for detecting the integrity of a substrate pattern array, which comprises the following steps: a gray-scale image acquisition step for acquiring a gray-scale image of the substrate pattern array; a digitization processing step, which is used for carrying out sampling digitization processing on the gray level image to obtain a gray level value signal; a Fourier transform step for converting the gradation value signal into a distribution of signals in a frequency domain; and a comparison analysis step, which is used for analyzing the distribution of the signals in the frequency domain to obtain the integrity information of the substrate pattern array. The method can quickly and accurately detect the consistency and integrity of the patterns in the substrate pattern array, judge the types of the defects and provide a detection basis for the defect repair of the sample to be detected.
Description
Technical Field
The invention relates to the field of flexible display device detection and the like, in particular to a method for detecting the integrity of a substrate pattern array.
Background
In flexible display devices, in particular display substrates for active matrix organic light emitting diodes or Active Matrix Organic Light Emitting Diodes (AMOLEDs), small periodic patterns, usually obtained by exposure and/or etching, their respective integrity and uniformity of distribution are a prerequisite to ensure the proper operation of each display pixel or each auxiliary display unit. Inspection of these periodic patterns (e.g., a matrix of dots, lines, planar/solid graphics, etc.) is typically done by Automated Optical Inspection (AOI). The automatic optical inspection machine judges whether the current block (such as pixel) has graphic abnormality by comparing the consistency between adjacent blocks (such as pixel). Such a test method has to design a relatively complicated optical system and electrical system under the requirement of improving the precision of detection, so that the equipment cost and labor cost are high, and the detection time is also high, thereby increasing the time cost of the manufacturing process.
Disclosure of Invention
The invention provides a method for detecting the integrity of a substrate pattern array, which aims to solve the problems of high equipment cost and labor cost, long detection time and the like when an automatic optical detector is used for detection in the prior art.
In order to solve the above technical problems, the present invention provides a method for detecting the integrity of a substrate pattern array, comprising the following steps: a gray-scale image acquisition step for acquiring a gray-scale image of the substrate pattern array; a digitization processing step, which is used for carrying out digitization processing on the gray level image to obtain a gray level value signal; a Fourier transform step for converting the gradation value signal into a distribution of signals in a frequency domain; and a comparison analysis step, which is used for analyzing the distribution of the signals in the frequency domain to obtain the integrity information of the substrate pattern array.
In an embodiment of the present invention, the digitizing step includes a pixel gray value calculating step for calculating a gray value of each pixel in the gray map; and establishing a 'grey value-position coordinate' curve graph, wherein the sequence or direction of the acquired pixel points is taken as an abscissa, the abscissa is taken as a position coordinate direction, and the grey value distribution of the pixel points corresponding to the position coordinates is taken as an ordinate to establish the 'grey value-position coordinate' curve graph.
In an embodiment of the present invention, the fourier transform step includes decomposing the waveform signal at a certain position in the "gray-scale value-position coordinate" graph into a sum of a finite number of known sine or cosine signals, and performing band-pass filtering on the signal formed by the sum of the finite number of known sine or cosine signals, and converting the signal into a pattern of "intensity-frequency" signals in a frequency domain.
In one embodiment of the invention, in the "intensity-frequency" signal pattern of the frequency domain, the characteristic frequency represents a collection of a finite number of known dominant frequency signals, wherein the dominant frequency location is strongly correlated with the density of the distribution of the substrate pattern array.
In an embodiment of the invention, the step of comparing and analyzing includes determining whether the period distribution and the dimension specification of the substrate pattern array satisfy the design requirements according to the relative position or the absolute position of the characteristic frequency.
In an embodiment of the invention, the substrate pattern array includes a pixel pattern of the pixel defining layer, a PS pillar pattern of the gap control layer, and a metal trace pattern of the metal layer.
In an embodiment of the present invention, the integrity information of the substrate pattern array includes pattern integrity and consistency, and/or pattern missing, and/or pattern shifting, and/or pattern deformation; when the patterns in the substrate pattern array are complete and consistent, no noise peak exists at the position corresponding to the characteristic frequency; when the pattern in the substrate pattern array is missing, noise peaks appear at the positions corresponding to the characteristic frequencies, and noise peaks appear at the low-frequency positions, and when the number of continuous missing patterns is increased, the noise peaks appear at the positions corresponding to the characteristic frequencies and move leftwards; when the pattern in the substrate pattern array deforms and expands, a noise peak appears at the right shift position corresponding to the characteristic frequency; when the pattern in the substrate pattern array is shifted, a noise peak occurs in a high frequency domain.
In an embodiment of the invention, in the substrate pattern array, the size range of the pattern is
The pattern had a density in the range of 10ppi to 106 ppi.
In an embodiment of the present invention, in the step of obtaining the gray-scale image, a CCD camera is used to scan the substrate pattern array, and the scanning speed is 1 m/s.
In an embodiment of the present invention, the effective range of the characteristic frequency is
The invention has the advantages that: the integrity detection method of the substrate pattern array converts the periodic array pattern into a frequency domain signal which is easy to identify and process by a method of gray scanning of an image and introduction of discrete signal fast Fourier transform (DFT). By the method, the consistency and the integrity of the patterns in the substrate pattern array can be rapidly and accurately detected, the types of the defects are judged, and a detection basis is provided for the defect repair of the sample to be detected; the detection and the discrimination of the substrate do not depend on point-by-point movable optical defect detection, the efficiency of detecting stations in the manufacturing process is effectively improved, and the input cost of complex detection equipment is reduced.
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The invention is further explained below with reference to the figures and examples.
Fig. 1 is a schematic diagram illustrating the pattern distribution of a pixel defining layer and a gap control layer according to an embodiment of the invention.
FIG. 2 is a gray scale graph and a "square wave" signal graph formed by gray scale values according to an embodiment of the present invention.
Fig. 3 is a graph of "gray value versus position coordinates" obtained by scanning in the scan line direction of fig. 1.
Fig. 4 is a diagram of fourier transform signal transforms in accordance with an embodiment of the present invention.
FIG. 5 is a graph of the "intensity-frequency" signal distribution obtained after Fourier transformation of the "square wave" signal of FIG. 3.
FIG. 6 is a diagram of a metal trace layout in a metal layer according to an embodiment of the present invention.
Fig. 7 is a graph of "gray value versus position coordinates" obtained by scanning in the scan line direction of fig. 6.
FIG. 8 is a graph of the "intensity-frequency" signal distribution obtained after Fourier transformation of the "square wave" signal of FIG. 7.
Detailed Description
The following description of the embodiments refers to the accompanying drawings for illustrating the specific embodiments in which the invention may be practiced. The directional terms used in the present invention, such as "up", "down", "front", "back", "left", "right", "top", "bottom", etc., refer to the directions of the attached drawings. Accordingly, the directional terms used are used for explanation and understanding of the present invention, and are not used for limiting the present invention.
A method for detecting the integrity of a substrate pattern array is used for detecting the detection of an Organic Light Emitting Diode (OLED) Pixel Definition Layer (PDL) and a gap control layer (PS) of a panel array backboard.
As shown in fig. 1, a pattern array in a Pixel Definition Layer (PDL) includes three kinds of periodic patterns of a red pixel definition pattern 100, a blue pixel definition pattern 101, and a green pixel definition pattern 102; generally, since the green oled has high luminance per unit area, the green pixel definition pattern 102 has smaller colors than the red pixel definition pattern 100 and the blue pixel definition pattern 101; in addition, since the blue organic light emitting diode has a lower luminance or a faster attenuation per unit area, the blue pixel definition pattern 101 is generally designed to be different from the red pixel definition pattern 100 and the green pixel definition patternThe pattern 102 may have a greater density of two colors or a greater area of a single color. The gap control layer (PS) has PS pillars 103, and the PS pillars 103 are not generally distributed around each sub-pixel but are generally distributed in a certain interval, so that the PS pillars are not actually present at the position indicated by reference numeral 104 in fig. 1. The sizes of the patterns are different, the density and the total number in the plane direction are also different, the above characteristics of the image are mainly determined by the product specification, in the embodiment, the size range of the patterns is
The pattern had a density in the range of 10ppi to 106 ppi.
The integrity detection method of the substrate pattern array of the embodiment comprises the following steps:
a gray-scale image acquisition step for acquiring a gray-scale image of the substrate pattern array; in this step, the Pixel Defining Layer (PDL) and the gap control layer (PS) are photographed using an optical scanning or a CCD camera. In fig. 1, scan lines a-a ', B-B', C-C ', and D-D' represent the value positions and directions of the gray-scale scan image. The scanning speed set in this example was 1 m/s.
And a digitization processing step, which is used for carrying out sampling digitization processing on the gray level image to obtain a gray level value signal. In the step of digitizing, a pixel gray value calculating step is included to calculate a gray value of each pixel in the gray map, as shown in fig. 2, taking a certain red organic light emitting diode pixel definition region in a Pixel Definition Layer (PDL) as an example, it is shown that the red pixel definition pattern 100 is scanned to obtain a corresponding gray map, and the size, the boundary, the contrast of gray brightness and darkness of the gray map and the gray value of each point in the divided pixels can be strictly determined. The dotted lines in fig. 2 also indicate the position and direction of the values in the grayscale image, i.e., the a-a' direction. And establishing a 'grey value-position coordinate' curve graph, wherein the sequence or direction of the acquired pixel points is taken as an abscissa, the abscissa is taken as a position coordinate direction, and the grey value distribution of the pixel points corresponding to the position coordinates is taken as an ordinate to establish the 'grey value-position coordinate' curve graph. In fig. 2, the approximate "square wave" signal 200 is a "gray value-position coordinate" graph obtained by taking values along the dashed line position and direction; thus, the analysis of the size, the number and the distribution of the pattern to be detected in the two-dimensional direction, especially the analysis of the information such as the integrity, the distribution uniformity and the possible defects of the pattern to be detected is converted into the analysis of a 'gray value-position coordinate' curve graph of a specific position, wherein the horizontal axis corresponds to the physical coordinate position of the pattern to be detected, and the vertical axis corresponds to the gray value of the gray scanning pattern at different coordinate positions. Scanning is performed according to four scanning directions of A-A ', B-B', C-C 'and D-D' in FIG. 1, and the number of sub-pixels spanned by each scanning line is hundreds and thousands according to products with different design specifications. Thus, as shown in FIG. 3, the scanned and converted "gray value-position coordinates" plots will contain hundreds to thousands of unequal approximate "square wave" signals in the A-A ', B-B ', C-C ', and D-D ' directions, where C-C ' corresponds to the scanning direction of the PS column pattern, and the number of PS column patterns may be relatively small. In fig. 3, a part of the gray value-position coordinate graphs in the four scanning directions of a-a ', B-B', C-C ', and D-D' is cut from top to bottom, respectively, and it can be seen that the waveform strictly corresponds to the periodic pattern in fig. 1.
A fourier transform step, which is used to transform the gray-value signal into the distribution of the signal in the frequency domain, specifically, to decompose the waveform signal at a certain position in the "gray-value-position coordinates" graph into the sum of a finite number of known sine or cosine signals. For example: as shown in fig. 4, the approximate "square wave" signal 201 is decomposed into (k × Sinf)0)/π+(k*Sin3f0)/3π+(k*Sin5f0)/5π+(k*Sin7f0)/7π+(k*Sin9f0)/9π+(k*Sin11f0)/11π+(k*Sin13f0)/13π+(k*Sin15f0) The signal waveform 202 of the sum of the/15 pi eighth order sinusoidal signals has high similarity to the approximate "square wave" signal 201 before decomposition, and the signal waveform 202 of the sum of the sinusoidal signals is similar to the approximate "square wave" signal before decomposition. And then band-pass filtering the signal formed by the sum of limited known sine or cosine signals, and converting into the pattern of 'strength-frequency' signal in frequency domain. In the intensity-frequency signal pattern of the frequency domain, the characteristic frequency can be n x f0In this way, the characteristic frequency represents a finite set of known dominant frequency signals, wherein the dominant frequency position is strongly related to the density of the distribution of the substrate pattern array, i.e. the position of the dominant frequency on the horizontal axis is represented by f0The magnitude of the coefficient n is determined, which is strongly related to the density of the distribution of the pattern array within the detection range, in the present embodiment, the effective range of the characteristic frequency is
Specifically, as shown in fig. 5, the complete a-a 'direction approximate "square wave" signal 301 in fig. 3 is converted into a frequency domain "strength-frequency" signal 401, the B-B' direction approximate "square wave" signal 302 is converted into a frequency domain "strength-frequency" signal 402, the C-C 'direction approximate "square wave" signal 303 is converted into a frequency domain "strength-frequency" signal 403, and the D-D' direction approximate "square wave" signal 304 is converted into a frequency domain "strength-frequency" signal 404.
And a comparison analysis step, which is used for analyzing the distribution of the signals in the frequency domain to obtain the integrity information of the substrate pattern array. Integrity information of the substrate pattern array, including pattern integrity and consistency, and/or pattern loss, and/or pattern shift, and/or pattern deformation; when the patterns in the substrate pattern array are complete and consistent, no noise peak exists at the position corresponding to the characteristic frequency; when the pattern in the substrate pattern array is missing, noise peaks appear at the positions corresponding to the characteristic frequencies, and noise peaks appear at the low-frequency positions, and when the number of continuous missing patterns is increased, the noise peaks appear at the positions corresponding to the characteristic frequencies and move leftwards; when the pattern in the substrate pattern array deforms and expands, a noise peak appears at the right shift position corresponding to the characteristic frequency; when the pattern in the substrate pattern array is shifted, a noise peak occurs in a high frequency domain. As shown in FIG. 5, it is assumed that the integrity and distribution of several periodic patterns, i.e., the red pixel definition pattern 100, the blue pixel definition pattern 101, the green pixel definition pattern 102 and the PS column image 103, are all within the entire detection ranges A-A ', B-B ', C-C ' and D-DWhen the unity is good, only the solid line peak signal corresponding to the main frequency position in fig. 5 appears in the "intensity-frequency" signal 401 to the "intensity-frequency" signal 404 in fig. 5; when one or some of the patterns are missing, a noise signal appears at the low frequency position, while a noise signal appears near the main frequency position, as shown by the dashed lines in fig. 5. In addition, whether the period distribution and the size specification of the original pattern meet the design requirements can be judged according to the relative position or the absolute position of the set of the main frequencies at different detection positions. Taking the Pixel Definition Layer (PDL) and the gap control layer (PS) exposed by the Halftone mask of the WQHD standard as an example, assuming that the pitch ratio between the Pixel definition layer and the gap control layer is 1/4, and 1440 rows of pixels occupy 68.88mm in the Panel width direction, the width of a single Sub-Pixel (Sub Pixel) is 16 μm. Since the scanning speed of CCD is 1m/s, the reference characteristic frequencies of the obtained 'intensity-frequency' signal after scanning and Fourier transform (DFT) are respectively 1m/s
And
if the CCD scanning and the signal conversion are carried out on a certain monitoring point (or line scanning), if the obtained 'intensity-frequency' signal set is consistent with the reference characteristic frequency, the exposure of the patterns of the Pixel Definition Layer (PDL) and the gap control layer (PS) at the current position is not problematic; if the obtained 'strength-frequency' signal set excludes the set of the appearing main frequencies
And
respectively in the low frequency range
And
acting as a band-passDuring filtering, if a part of noise signals appear and noise peaks also appear in the direction of shifting the set of main frequencies to the left, the pattern loss of a Pixel Definition Layer (PDL) or a gap control layer (PS) is indicated; when a noise peak appears in the direction of the set of main frequencies moving to the left, the pattern of the Pixel Definition Layer (PDL) or the gap control layer (PS) is partially expanded or remained; if the obtained 'strength-frequency' signal set excludes the set of the appearing main frequencies
And
respectively in the high frequency domain
And
if a part of noise signal is generated and a noise peak is generated in a direction in which the set of main frequencies shifts to the right when band-pass filtering is performed, it is indicated that there is an overlap or shift of the pattern of the Pixel Definition Layer (PDL) or the gap control layer (PS).
The method for detecting the integrity of a substrate pattern array of the present embodiment is further used to detect the distribution of metal trace patterns in a metal layer, for example, the Gate \ Source \ Drain trace, the peripheral Fan-out trace, and the bonding trace of a module can be detected. Generally, the metal layer is provided with a plurality of metal traces which are mutually parallel and uniformly arranged, the width of each metal trace is substantially the same, and fig. 6 is a distribution diagram of the metal traces in the metal layer under an abnormal state provided in this embodiment. The detection specifically includes the following steps.
A gray level image obtaining step, which is used for obtaining a gray level image of the metal layer; in this step, a gray scale image obtained by optical scanning or a CCD camera photographing is applied to the metal layer. As shown in fig. 6, the scan lines E-E ', F-F', G-G ', and H-H' represent the value positions and directions of the gray-scale scan image. The scanning speed set in this example was 1 m/s.
A digitizing step, which is to perform sampling digitizing processing on the gray scale map according to the scanning direction of fig. 6 to obtain a gray scale value signal, wherein the scanned and converted graph of "gray scale value-position coordinate" will contain hundreds to thousands of unequal approximate "square wave" signals, as shown in fig. 7, the scanning along the scanning line E-E 'obtains a "square wave" signal 501, the scanning along the scanning line E-E' obtains a "square wave" signal 502, the scanning along the scanning line E-E 'obtains a "square wave" signal 503, and the scanning along the scanning line E-E' obtains a "square wave" signal 504.
A fourier transform step, the concrete steps of which are basically as those when the Pixel Definition Layer (PDL) and the gap control layer (PS) are detected. In this step, the corresponding signals in the "gray value-position coordinate" graph of fig. 7 are converted into "intensity-frequency" signals, as shown in fig. 8, the "square wave" signal 501 is converted into an "intensity-frequency" signal 601, the "square wave" signal 502 is converted into an "intensity-frequency" signal 602, the "square wave" signal 503 is converted into an "intensity-frequency" signal 603, and the "square wave" signal 504 is converted into an "intensity-frequency" signal 605. The dominant frequency position is strongly related to the density of the metal wire distribution in the detection range.
And a comparison analysis step, which is used for analyzing the distribution of the signals in the frequency domain to obtain the integrity information of the substrate pattern array. If the integrity and consistency of the array of the metal wires in the detection range are good, a solid line peak signal corresponding to the main frequency position in fig. 8 appears; when there is a very small number of metal traces missing, the solid line peak signal at the main frequency position will also generate a part of noise signals in the low frequency domain, such as the noise peak shown by the dotted line in fig. 8, and at the same time, the noise peak will also occur in the direction that the main frequency position moves to the left; when the number of missing traces increases, the position of the noise peak can be predicted to further move left relative to the main frequency position; when the pattern is partially expanded, a noise peak appears in the direction of the right shift of the main frequency position; when the pattern is partially shifted, noise peaks appear in the high frequency domain.
The present invention is not limited to the above preferred embodiments, and any modifications, equivalent substitutions and improvements made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (9)
1. A method for detecting the integrity of a substrate pattern array is characterized by comprising the following steps:
a gray-scale image acquisition step for acquiring a gray-scale image of the substrate pattern array;
a digitization processing step, which is used for carrying out digitization processing on the gray level image to obtain a gray level value signal;
a Fourier transform step for converting the gradation value signal into a distribution of signals in a frequency domain;
a comparison analysis step for analyzing the distribution of the signals in the frequency domain to obtain the integrity information of the substrate pattern array;
integrity information of the substrate pattern array, including pattern integrity and consistency, and/or pattern loss, and/or pattern shift, and/or pattern deformation;
when the patterns in the substrate pattern array are complete and consistent, no noise peak exists at the position corresponding to the characteristic frequency; when the pattern in the substrate pattern array is missing, noise peaks appear at the positions corresponding to the characteristic frequencies, and noise peaks appear at the low-frequency positions, and when the number of continuous missing patterns is increased, the noise peaks appear at the positions corresponding to the characteristic frequencies and move leftwards;
when the pattern in the substrate pattern array deforms and expands, a noise peak appears at the right shift position corresponding to the characteristic frequency;
when the pattern in the substrate pattern array is shifted, a noise peak occurs in a high frequency domain.
2. The method as claimed in claim 1, wherein the step of digitizing comprises
A pixel gray value calculation step, which is used for calculating the gray value of each pixel point in the gray image;
and establishing a 'grey value-position coordinate' curve graph, wherein the sequence or direction of the acquired pixel points is taken as an abscissa, the abscissa is taken as a position coordinate direction, and the grey value distribution of the pixel points corresponding to the position coordinates is taken as an ordinate to establish the 'grey value-position coordinate' curve graph.
3. The method as claimed in claim 2, wherein the fourier transform step comprises decomposing the waveform signal at a certain position in the "gray scale value-position coordinates" graph into a sum of a finite number of known sine or cosine signals, and performing band-pass filtering on the signal formed by the sum of the finite number of known sine or cosine signals to transform the signal into a pattern of "intensity-frequency" signals in a frequency domain.
4. The method of claim 3, wherein the characteristic frequency represents a finite set of known dominant frequency signals in the intensity-frequency signal pattern of the frequency domain, wherein the dominant frequency location is strongly correlated with the density of the distribution of the substrate pattern array.
5. The method as claimed in claim 4, wherein the step of comparing and analyzing includes determining whether the period distribution and the dimension of the substrate pattern array satisfy the design requirements according to the relative or absolute position of the characteristic frequency.
6. The method as claimed in claim 5, wherein the substrate pattern array comprises a pixel pattern of a pixel definition layer, a PS pillar pattern of a gap control layer, and a metal trace pattern of a metal layer.
7. The method as claimed in claim 6, wherein the pattern size of the substrate pattern array is within the range of
The pattern had a density in the range of 10ppi to 106 ppi.
8. The method of claim 7, wherein the step of obtaining the gray scale pattern comprises scanning the substrate pattern array with a CCD camera at a speed of 1 m/s.
9. The method of claim 8, wherein the effective range of the characteristic frequency is
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