CN109374714B - Assembled biosensor chip - Google Patents
Assembled biosensor chip Download PDFInfo
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- CN109374714B CN109374714B CN201811248370.1A CN201811248370A CN109374714B CN 109374714 B CN109374714 B CN 109374714B CN 201811248370 A CN201811248370 A CN 201811248370A CN 109374714 B CN109374714 B CN 109374714B
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- 239000010410 layer Substances 0.000 claims abstract description 185
- 239000000758 substrate Substances 0.000 claims abstract description 151
- 239000002344 surface layer Substances 0.000 claims abstract description 57
- 238000006243 chemical reaction Methods 0.000 claims description 22
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 16
- 210000001124 body fluid Anatomy 0.000 claims description 10
- 239000000853 adhesive Substances 0.000 claims description 9
- 230000001070 adhesive effect Effects 0.000 claims description 9
- 239000010839 body fluid Substances 0.000 claims description 9
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 claims description 8
- 229910001218 Gallium arsenide Inorganic materials 0.000 claims description 8
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 8
- 239000002041 carbon nanotube Substances 0.000 claims description 8
- 229910021393 carbon nanotube Inorganic materials 0.000 claims description 8
- 239000000919 ceramic Substances 0.000 claims description 8
- 229910021389 graphene Inorganic materials 0.000 claims description 8
- 229910052710 silicon Inorganic materials 0.000 claims description 8
- 239000010703 silicon Substances 0.000 claims description 8
- 239000010931 gold Substances 0.000 claims description 6
- 229910052737 gold Inorganic materials 0.000 claims description 6
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 6
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 4
- 229910052697 platinum Inorganic materials 0.000 claims description 4
- 229910000679 solder Inorganic materials 0.000 claims description 4
- 102000004190 Enzymes Human genes 0.000 claims description 2
- 108090000790 Enzymes Proteins 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- 230000002093 peripheral effect Effects 0.000 claims description 2
- 229920006254 polymer film Polymers 0.000 claims description 2
- 210000004243 sweat Anatomy 0.000 abstract description 9
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- 230000005684 electric field Effects 0.000 abstract description 3
- 238000003487 electrochemical reaction Methods 0.000 abstract description 3
- 230000010354 integration Effects 0.000 abstract description 3
- 230000008054 signal transmission Effects 0.000 abstract description 3
- 238000001514 detection method Methods 0.000 description 9
- 238000005842 biochemical reaction Methods 0.000 description 6
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- 238000003466 welding Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
- G01N27/26—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating electrochemical variables; by using electrolysis or electrophoresis
- G01N27/416—Systems
Abstract
The invention relates to an assembled biosensor chip.A signal acquisition circuit and a biological signal acquisition working electrode are respectively positioned on a first surface layer and a second surface layer of a first substrate layer, and are connected through a first conductive hole; the signal collecting reference electrode is positioned on the first surface layer of the second substrate layer, the first substrate layer and the second substrate layer are electrically connected through the conductive convex points, the signal collecting working electrode faces the signal collecting reference electrode, a gap is formed between the two electrodes, the tested liquid (such as sweat) flows through the gap and reacts with the functional film modified on the surface of the working electrode to generate current or potential, and the signal is amplified, filtered and collected by the signal collecting circuit and then is sent to the main control circuit for processing. The sensor chip assembled by the structure has the advantages of short signal transmission path and small signal path interference; the two electrodes are opposite, the electric field between the two electrodes is more uniform and stable, capillary gaps are more beneficial to the flow of liquid, the electrochemical reaction condition is more stable, and the signal stability is good; and the integration level is high.
Description
Technical Field
The invention relates to the technical field of sensors, in particular to an assembled biosensor chip.
Background
Electrochemical analysis of biological signals is a common method, and can generally detect urine, sweat, blood and the like of organisms, and realize molecular level detection of liquid and gas.
At present, the conventional detection means in the industry are limited by sensor design and reaction conditions, and are carried out in professional institutions or large hospitals, so that the equipment is large in size and complex in operation. On the other hand, bioelectric signals are generally weak (nA level, mV, μv level), and the conventional electrochemical sensor usually makes the sensor very large, so that the response current is as large as possible, and thus the difficulty of signal acquisition is reduced, and thus, the equipment system cannot be made small, cannot be popularized in consumer level, and is inconvenient to carry.
Disclosure of Invention
The invention aims to solve the technical problems that: a biosensor chip is provided, a biological signal acquisition electrode and a signal acquisition circuit are integrated in one chip, and detection lines of various microelements (for detecting and obtaining nA-level current, mV voltage and mu V-level voltage) are improved through an integrated circuit and a micro-nano structure.
An assembled biosensor chip comprises a first substrate layer, a second substrate layer, a signal acquisition circuit, a signal acquisition working electrode and a signal acquisition reference electrode; the first substrate layer is provided with a first conductive hole and a second conductive hole which are communicated with the upper surface and the lower surface;
the signal acquisition circuit and the signal acquisition working electrode are respectively positioned on the first surface layer and the second surface layer of the first substrate layer, and are connected through a first conductive hole;
the signal acquisition reference electrode is positioned on the first surface layer of the second substrate layer, the first surface layer of the second substrate layer is provided with a first conductive bump, and the first conductive bump is connected with the signal acquisition reference electrode through a circuit;
the signal acquisition working electrode is opposite to the signal acquisition reference electrode, the first conductive convex point is welded or bonded on the second surface layer of the first substrate layer through conductive adhesive, the first substrate layer and the second substrate layer form mechanical interconnection and electrical interconnection, and a gap or a runner is arranged between the signal acquisition working electrode and the signal acquisition reference electrode; the first substrate layer and the second substrate layer are silicon base layers, gallium arsenide substrate layers, carbon nanotube substrate layers or graphene substrate layers or ceramic substrate layers.
The signal acquisition working electrode is opposite to the signal acquisition reference electrode, so that a uniform electric field is formed between the two electrodes, and the liquid (sweat) to be detected flows through a gap between the two electrodes, so that the electrochemical reaction is more stable, and the design of the sweat acquisition sensor is easier to realize.
Preferably, the first conductive bump is soldered to the second conductive via; or alternatively, the first and second heat exchangers may be,
the first conductive bump is soldered to a circuit of the second surface layer of the first substrate layer that is electrically connected to the second conductive via.
Preferably, the first conductive bump is adhered to the second conductive hole of the second surface layer of the first substrate layer through conductive adhesive at a low temperature (lower than 100 ℃) or at normal temperature (20-50 ℃); or the first conductive bump is adhered to a circuit electrically connected with the second conductive hole on the second surface layer of the first substrate layer through conductive adhesive at low temperature or normal temperature. The biological signal reaction film layer may not withstand high temperature, and the assembly of the first substrate layer and the second substrate layer needs to be performed at low temperature or normal temperature, or at a local high temperature; bonding by normal temperature curing conductive adhesive, ultrasonic pressure welding, or wire bonding processes may be considered. Preferably, the device further comprises a counter electrode, wherein the counter electrode is positioned on the first surface layer of the second substrate layer, and the counter electrode is adjacent to the signal acquisition reference electrode and is used for forming a loop with the working electrode to pass current.
The signal acquisition working electrode is a porous nano-gold microelectrode or a porous nano-platinum microelectrode. The aperture of the micropores of the porous nano gold microelectrode is 10nm-500nm, the nano porous structure can increase the surface area of the sensor, increase the detection limit, and can detect the minimum value or the maximum value of the tiny current, voltage or resistance of the body fluid; meanwhile, the porous structure is convenient for fixing the reaction membrane, the interface impedance is smaller, and the signal interference is reduced.
Preferably, the back surface of the first substrate layer is provided with a pit, and the signal acquisition working electrode is positioned in the pit; the surface of the signal acquisition working electrode is provided with a biological signal reaction film layer.
The pit is favorable for protecting the modified biological signal reaction film layer on the surface of the signal acquisition working electrode from mechanical damage, and simultaneously provides a stable space environment for biochemical reaction and avoids external motion interference. The biological signal reaction film layer is a biological enzyme film, an ion selective film or other selective metal layers or polymer film layers, and is obtained by different modification methods.
Preferably, the signal acquisition reference electrode is located on the peripheral side of the exterior of the well. Only a signal acquisition working electrode is arranged in the pit, and a signal acquisition reference electrode and a counter electrode are positioned on the surface outside the pit; the pits are used for fixing the biochemical biological signal reaction film layer and controlling the dripping dosage of the biological signal reaction film layer; meanwhile, a stable space environment is provided for the biochemical reaction, so that external operation or movement does not influence the internal biochemical reaction, and the stability of signals is ensured.
Preferably, the pit is a 2-level or multi-level step pit, the signal acquisition working electrode is positioned on the lowest-level pit or the lower-level step of the pit, and the signal acquisition reference electrode is positioned on the higher-level step of the pit. The lowest-level pit or lower-level step of the pit is used for fixing the biological signal reaction film layer and controlling the dripping dosage of the biological signal reaction film layer; meanwhile, a stable space environment is provided for the biochemical reaction, so that external operation or movement does not influence the internal biochemical reaction, and the stability of signals is ensured. Preferably, one signal acquisition working electrode and one signal acquisition reference electrode form one electrode pair, the number of the electrode pairs is more than N, the electrode pairs are distributed in a circumferential array or a rectangular array, N is more than 2, and N is a natural number;
each electrode pair is for detecting a biological signal of a body fluid.
Preferably, the body fluid is sweat, blood, urine, tears, or grease.
Preferably, the substrate layer is further integrated with a bluetooth transceiver circuit, and an electrode of the biological signal acquisition electrode is connected with a current input end of the bluetooth transceiver circuit.
Preferably, the first substrate layer is further integrated with a bluetooth transceiver circuit and a bioelectric power generation battery; or alternatively, the first and second heat exchangers may be,
the first substrate layer is also integrated with a Bluetooth transceiver circuit and a wireless charging circuit.
Preferably, the number of electrode pairs for detecting a biological signal of a body fluid is more than M, M is greater than 2, M is a natural number;
the biological signal reaction film layers of the signal acquisition working electrodes of the M electrode pairs have more than 2 different thickness values; or alternatively, the first and second heat exchangers may be,
the biological signal reaction film layers of the signal acquisition working electrodes of the M electrode pairs have different section values of more than 2.
Preferably, the first surface of the first substrate layer is provided with a second conductive bump array, and the solder balls of the second conductive bump array are respectively and electrically connected with the signal acquisition circuit, the signal acquisition working electrode and the signal acquisition reference electrode.
The invention also provides another assembled biosensor chip.
An assembled biosensor chip comprises a first substrate layer, a second substrate layer, a signal acquisition circuit, a signal acquisition working electrode and a signal acquisition reference electrode; the first substrate layer is provided with a first conductive hole and a second conductive hole which are communicated with the upper surface and the lower surface;
the signal acquisition circuit and the signal acquisition working electrode are respectively positioned on the first surface layer and the second surface layer of the first substrate layer, and are connected through a first conductive hole;
the signal acquisition reference electrode is positioned on the first surface layer of the second substrate layer;
the second surface layer of the first substrate layer is provided with a third conductive bump;
the first substrate layer and the second substrate layer are welded, the signal acquisition working electrode faces the signal acquisition reference electrode, a gap or a flow channel exists between the signal acquisition working electrode and the signal acquisition reference electrode, a third conductive convex point is welded or adhered to the first surface layer of the second substrate layer, and the third conductive convex point is electrically connected with the signal acquisition reference electrode;
the first substrate layer and the second substrate layer are silicon base layers, gallium arsenide substrate layers, carbon nanotube substrate layers or graphene substrate layers or ceramic substrate layers. The beneficial effects of the invention are as follows: an assembled biosensor chip comprises a first substrate layer, a second substrate layer, a signal acquisition circuit, a signal acquisition working electrode and a signal acquisition reference electrode; the first substrate layer is provided with a first conductive hole and a second conductive hole which are communicated with the upper surface and the lower surface; the signal acquisition circuit and the signal acquisition working electrode are respectively positioned on the first surface layer and the second surface layer of the first substrate layer, and are connected through a first conductive hole; the signal acquisition reference electrode is positioned on the first surface layer of the second substrate layer, the first surface layer of the second substrate layer is provided with a first conductive bump, and the first conductive bump is connected with the signal acquisition reference electrode through a circuit; the first substrate layer and the second substrate layer are welded, the signal acquisition working electrode faces the signal acquisition reference electrode, a gap or a flow channel exists between the signal acquisition working electrode and the signal acquisition reference electrode, and the first conductive convex point is welded on the second surface layer of the first substrate layer; the first substrate layer and the second substrate layer are silicon base layers, gallium arsenide substrate layers, carbon nanotube substrate layers or graphene substrate layers or ceramic substrate layers. The biological signal acquisition electrode and the signal acquisition circuit are integrated on two chips, the two chips are welded through conductive convex points, the surface of the signal acquisition electrode of the chip is contacted with liquid to be detected, a current signal obtained by the signal acquisition electrode is directly connected with the signal acquisition circuit through a conductive Kong Chuanjing hole, the signal transmission path is short, the signal interference is small, the integration level is high, and the detection lines of various microelements are promoted through the integrated circuit and the micro-nano structure, so that molecular level detection on sweat, urine and the like can be realized, and the current of the nA level, the voltage of mV or the voltage of the mu V level can be obtained.
The two electrodes form a gap, the detected liquid such as sweat flows through the gap, and reacts with the functional film modified on the surface of the working electrode to generate current or potential, and the signal is amplified, filtered and collected by the signal collecting circuit and then sent to the main control circuit for processing. The sensor chip assembled by the structure has the advantages of short signal transmission path and small signal path interference; the two electrodes are opposite, the electric field between the two electrodes is more uniform and stable, capillary gaps are more beneficial to the flow of liquid, the electrochemical reaction condition is more stable, and the signal stability is good; and the integration level is high. The integrated circuit is highly integrated with the electrode, the electrode is in a three-dimensional structure, and the micro-nano surface treatment electrode and the like are used for improving the detection line of various microelements, so that the detection of sweat, urine and the like at a molecular level can be realized.
Drawings
The assembled biosensor chip of the present invention will be further described with reference to the accompanying drawings.
Fig. 1 is a top view of the back surface of a substrate layer 1 of a biosensor chip according to the present invention.
Fig. 2 is a schematic diagram of the circuit connection of a biosensor chip according to the present invention.
Fig. 3 is a cross-sectional view of a first embodiment of a biosensor chip according to the present invention.
Fig. 4 is a cross-sectional view of a second embodiment of a biosensor chip according to the present invention.
Fig. 5 is a cross-sectional view of a third embodiment of a biosensor chip according to the present invention.
Fig. 6 is a cross-sectional view of another embodiment of a biosensor chip according to the present invention.
In the figure:
11-a first substrate layer; 12-a second substrate layer; 2-a signal acquisition circuit; 31-a signal acquisition working electrode; 311-biological signal reaction membrane layer; 32-a signal acquisition reference electrode; 33-a counter electrode; 41-a first conductive via; 42-a second conductive via; 51-first conductive bumps; 52-a second array of conductive bumps; 53-a third conductive bump; 6-pit; 7-Bluetooth receiving and transmitting circuits; 8-bioelectrical power generation cells; 9-wireless charging circuit.
Detailed Description
An assembled biosensor chip according to the present invention will be further described with reference to FIGS. 1 to 6.
Example 1
An assembled biosensor chip comprises a first substrate layer 11, a second substrate layer 12, a signal acquisition circuit 2, a signal acquisition working electrode 31 and a signal acquisition reference electrode 32; the first base material layer 11 is provided with a first conductive hole 41 and a second conductive hole 42 communicating the upper and lower surfaces;
the signal acquisition circuit 2 and the signal acquisition working electrode 31 are respectively positioned on the first surface layer and the second surface layer of the first substrate layer 11, and the signal acquisition circuit 2 and the signal acquisition working electrode 31 are in circuit connection through the first conductive hole 41;
the signal acquisition reference electrode 32 is positioned on the first surface layer of the second substrate layer 12, the first surface layer of the second substrate layer 12 is provided with a first conductive bump 51, and the first conductive bump 51 is connected with the signal acquisition reference electrode 32 through a circuit;
the signal collecting working electrode 31 is opposite to the signal collecting reference electrode 32, the first conductive convex points 51 are welded or bonded on the second surface layer of the first substrate layer 11 through conductive adhesive, the first substrate layer 11 and the second substrate layer 12 form mechanical interconnection and electrical interconnection, and a gap or a runner is arranged between the signal collecting working electrode 31 and the signal collecting reference electrode 32;
the first substrate layer 11 and the second substrate layer 12 are silicon-based layers, gallium arsenide substrate layers, carbon nanotube substrate layers, graphene substrate layers, or ceramic substrate layers.
In this embodiment, the first conductive bump 51 is a solder ball, and the first conductive bump 51 is soldered on the second conductive hole 42; alternatively, the first conductive bump 51 is soldered to a circuit electrically connected to the second conductive via 42 on the second surface layer of the first substrate layer 11.
As a preferred alternative, it is also possible that: the first conductive bump 51 is adhered to the second conductive hole 42 of the second surface layer of the first substrate layer 11 by conductive paste at a low temperature (less than 100 degrees or less than 70 degrees) or at normal temperature; or, the first conductive bump 51 is adhered to a circuit electrically connected to the second conductive hole 42 of the second surface layer of the first base material layer 11 through a conductive paste at a low temperature or a normal temperature.
In this embodiment, the device further comprises a counter electrode 33, wherein the counter electrode 33 is located on the first surface layer of the second substrate layer 12, and the counter electrode 33 is disposed adjacent to the signal acquisition reference electrode 32; the counter electrode 33 functions to form a circuit with the working electrode 31 to pass current.
The signal collecting working electrode 31 is a porous nano gold microelectrode or a porous nano platinum electrode.
The aperture of the micropores of the porous nano gold microelectrode is 10nm-500nm, the nano porous structure can increase the surface area of the sensor, increase the detection limit, and can detect the minimum value or the maximum value of the tiny current, voltage or resistance of the body fluid; meanwhile, the porous structure is convenient for fixing the reaction membrane, the interface impedance is smaller, and the signal interference is reduced.
Example two
An assembled biosensor chip comprises a first substrate layer 11, a second substrate layer 12, a signal acquisition circuit 2, a signal acquisition working electrode 31 and a signal acquisition reference electrode 32; the first base material layer 11 is provided with a first conductive hole 41 and a second conductive hole 42 communicating the upper and lower surfaces;
the signal acquisition circuit 2 and the signal acquisition working electrode 31 are respectively positioned on the first surface layer and the second surface layer of the first substrate layer 11, and the signal acquisition circuit 2 and the signal acquisition working electrode 31 are in circuit connection through the first conductive hole 41;
the signal acquisition reference electrode 32 is positioned on the first surface layer of the second substrate layer 12, the first surface layer of the second substrate layer 12 is provided with a first conductive bump 51, and the first conductive bump 51 is connected with the signal acquisition reference electrode 32 through a circuit;
the first substrate layer 11 and the second substrate layer 12 are welded, the signal acquisition working electrode 31 faces the signal acquisition reference electrode 32, a gap or a runner exists between the signal acquisition working electrode 31 and the signal acquisition reference electrode 32, and the first conductive salient points 51 are welded or adhered to the second surface layer of the first substrate layer 11;
the first substrate layer 11 and the second substrate layer 12 are silicon-based layers, gallium arsenide substrate layers, carbon nanotube substrate layers, graphene substrate layers, or ceramic substrate layers.
In this embodiment, the first conductive bump 51 is soldered to the second conductive via 42; alternatively, the first conductive bump 51 is soldered to a circuit electrically connected to the second conductive via 42 on the second surface layer of the first substrate layer 11.
In this embodiment, the device further comprises a counter electrode 33, wherein the counter electrode 33 is located on the first surface layer of the second substrate layer 12, and the counter electrode 33 is disposed adjacent to the signal acquisition reference electrode 32; the counter electrode 33 functions to form a circuit with the working electrode 31 to pass current.
The signal collecting working electrode 31 is a porous nano-gold microelectrode or a porous nano-platinum microelectrode.
In this embodiment, the back surface of the first substrate layer 11 is provided with a pit 6, and the signal acquisition working electrode 31 is located in the pit 6; the surface of the signal acquisition working electrode 31 is provided with a biological signal reaction film layer 311.
The pit 6 is beneficial to protecting the modified biological signal reaction film 311 on the surface of the signal acquisition working electrode 31 from mechanical damage, and simultaneously provides a stable space environment for biochemical reaction and avoids external motion interference. In this embodiment, a signal collecting working electrode 31 and a signal collecting reference electrode 32 form an electrode pair, the number of the electrode pairs is more than N, the electrode pairs are distributed in a circumferential array or a rectangular array, N is greater than 2, and N is a natural number;
each electrode pair is for detecting a biological signal of a body fluid.
In this embodiment, the bodily fluid is sweat, blood, urine, tear or grease.
In this embodiment, the substrate layer 1 is further integrated with a bluetooth transceiver circuit 7, and the electrode of the biological signal collecting electrode 3 is connected to the current input end of the bluetooth transceiver circuit 7.
As a preferred alternative, it is also possible that: the first substrate layer 11 is also integrated with a Bluetooth transceiver circuit 7 and a bioelectric power generation battery 8; or, the first substrate layer 11 is also integrated with the bluetooth transceiver circuit 7 and the wireless charging circuit 9.
In this embodiment, the number of electrode pairs for detecting one biological signal of one body fluid is more than M, M is greater than 2, and M is a natural number;
the biological signal reaction film layer 311 of the signal acquisition working electrode 31 of the M electrode pairs has more than 2 different thickness values; or alternatively, the first and second heat exchangers may be,
the biological signal reaction film layer 311 of the signal acquisition working electrode 31 of the M electrode pairs has different cross-sectional values of 2 or more.
In this embodiment, the first surface of the first substrate layer 11 is provided with a second conductive bump array 52, and the solder balls of the second conductive bump array 52 are electrically connected with the signal acquisition circuit 2, the signal acquisition working electrode 31 and the signal acquisition reference electrode 32 respectively.
Example III
An assembled biosensor chip comprises a first substrate layer 11, a second substrate layer 12, a signal acquisition circuit 2, a signal acquisition working electrode 31 and a signal acquisition reference electrode 32; the first base material layer 11 is provided with a first conductive hole 41 and a second conductive hole 42 communicating the upper and lower surfaces;
the signal acquisition circuit 2 and the signal acquisition working electrode 31 are respectively positioned on the first surface layer and the second surface layer of the first substrate layer 11, and the signal acquisition circuit 2 and the signal acquisition working electrode 31 are in circuit connection through the first conductive hole 41;
the signal acquisition reference electrode 32 is positioned on the first surface layer of the second substrate layer 12;
the second surface layer of the first substrate layer 11 is provided with third conductive bumps 53;
the first substrate layer 11 and the second substrate layer 12 are welded, the signal acquisition working electrode 31 faces the signal acquisition reference electrode 32, a gap or a flow channel exists between the signal acquisition working electrode 31 and the signal acquisition reference electrode 32, the third conductive bump 53 is welded on the first surface layer of the second substrate layer 12, and the third conductive bump 53 is electrically connected with the signal acquisition reference electrode 32;
the first substrate layer 11 and the second substrate layer 12 are silicon-based layers, gallium arsenide substrate layers, carbon nanotube substrate layers, graphene substrate layers, or ceramic substrate layers.
The invention is not limited to the above embodiments, and the technical solutions of the above embodiments of the invention can be cross-combined with each other to form a new technical solution, and in addition, the technical solution formed by adopting equivalent substitution falls within the protection scope of the invention.
Claims (10)
1. An assembled biosensor chip is characterized by comprising a first substrate layer (11), a second substrate layer (12), a signal acquisition circuit (2), a signal acquisition working electrode (31) and a signal acquisition reference electrode (32); the first substrate layer (11) is provided with a first conductive hole (41) and a second conductive hole (42) which are communicated with the upper surface and the lower surface;
the signal acquisition circuit (2) and the signal acquisition working electrode (31) are respectively positioned on a first surface layer and a second surface layer of the first substrate layer (11), and the signal acquisition circuit (2) and the signal acquisition working electrode (31) are in circuit connection through the first conductive hole (41);
the signal acquisition reference electrode (32) is positioned on the first surface layer of the second substrate layer (12), a first conductive bump (51) is arranged on the first surface layer of the second substrate layer (12), and the first conductive bump (51) is connected with the signal acquisition reference electrode (32) through a circuit;
the signal acquisition working electrode (31) is opposite to the signal acquisition reference electrode (32), the first conductive salient point (51) is welded or bonded on the second surface layer of the first substrate layer (11) through conductive adhesive, the first substrate layer (11) and the second substrate layer (12) form mechanical interconnection and electrical interconnection, and a gap or a runner is arranged between the signal acquisition working electrode (31) and the signal acquisition reference electrode (32); the first substrate layer (11) and the second substrate layer (12) are silicon base layers, gallium arsenide substrate layers, carbon nanotube substrate layers or graphene substrate layers or ceramic substrate layers.
2. The assembled biosensor chip of claim 1, wherein the first conductive bumps (51) are soldered to the second conductive vias (42); or, the first conductive bump (51) is soldered on a circuit of the second surface layer of the first substrate layer (11) electrically connected to the second conductive hole (42); or alternatively, the first and second heat exchangers may be,
the first conductive bump (51) is adhered to the second conductive hole (42) through conductive adhesive at low temperature or normal temperature; or the first conductive bump (51) is adhered to a circuit electrically connected with the second conductive hole (42) on the second surface layer of the first substrate layer (11) through conductive adhesive at low temperature or normal temperature.
3. The assembled biosensor chip of claim 1, further comprising a counter electrode (33), the counter electrode (33) being located at the first surface layer of the second substrate layer (12), the counter electrode (33) being disposed adjacent to the signal-collecting reference electrode (32);
the signal acquisition working electrode (31) is a porous nano gold microelectrode or a porous nano platinum electrode.
4. The assembled biosensor chip according to claim 2, wherein the second surface layer of the first substrate layer (11) is provided with pits (6), and the signal acquisition working electrode (31) is located in the pits (6); the surface of the signal acquisition working electrode (31) is provided with a biological signal reaction film layer (311), and the biological signal reaction film layer (311) is a biological enzyme film, an ion selective film or other selective metal layers or polymer film layers.
5. The assembled biosensor chip according to claim 4, wherein the signal-collecting reference electrode (32) is located on the outer peripheral side of the recess (6); or alternatively, the first and second heat exchangers may be,
the pit (6) is a 2-level or multi-level stepped pit, the signal acquisition working electrode (31) is positioned on the lowest-level pit or lower-level step of the pit (6), and the signal acquisition reference electrode (32) is positioned on the higher-level step of the pit (6).
6. The assembled biosensor chip according to claim 3, wherein one of the signal collection working electrodes (31) and one of the signal collection reference electrodes (32) form one electrode pair, the number of the electrode pairs is more than N, the electrode pairs are distributed in a circumferential array or a rectangular array, N is greater than 2, and N is a natural number;
each of said electrode pairs is for detecting a biological signal of a body fluid.
7. The assembled biosensor chip according to claim 6, wherein the substrate layer (1) is further integrated with a bluetooth transceiver circuit (7), and the electrode of the biosignal acquisition electrode (3) is connected to the current input terminal of the bluetooth transceiver circuit (7).
8. The assembled biosensor chip according to claim 7, wherein the number of electrode pairs for detecting a biological signal of a body fluid is M or more, M is greater than 2, and M is a natural number;
the biological signal reaction film layers (311) of the signal acquisition working electrodes (31) of the M electrode pairs have more than 2 different thickness values; or alternatively, the first and second heat exchangers may be,
the biological signal reaction film layers (311) of the signal acquisition working electrodes (31) of the M electrode pairs have more than 2 different section values.
9. The assembled biosensor chip according to claim 7, wherein the first surface of the first substrate layer (11) is provided with a second conductive bump array (52), and solder balls of the second conductive bump array (52) are electrically connected to the signal acquisition circuit (2), the signal acquisition working electrode (31) and the signal acquisition reference electrode (32), respectively.
10. An assembled biosensor chip is characterized by comprising a first substrate layer (11), a second substrate layer (12), a signal acquisition circuit (2), a signal acquisition working electrode (31) and a signal acquisition reference electrode (32); the first substrate layer (11) is provided with a first conductive hole (41) and a second conductive hole (42) which are communicated with the upper surface and the lower surface;
the signal acquisition circuit (2) and the signal acquisition working electrode (31) are respectively positioned on a first surface layer and a second surface layer of the first substrate layer (11), and the signal acquisition circuit (2) and the signal acquisition working electrode (31) are in circuit connection through the first conductive hole (41);
the signal acquisition reference electrode (32) is positioned on the first surface layer of the second substrate layer (12);
the second surface layer of the first substrate layer (11) is provided with a third conductive bump (53);
the first substrate layer (11) and the second substrate layer (12) are welded or bonded through conductive adhesive, the signal acquisition working electrode (31) faces the signal acquisition reference electrode (32), a gap or a flow channel exists between the signal acquisition working electrode (31) and the signal acquisition reference electrode (32), the third conductive protruding point (53) is welded on the first surface layer of the second substrate layer (12), and the third conductive protruding point (53) is electrically connected with the signal acquisition reference electrode (32);
the first substrate layer (11) and the second substrate layer (12) are silicon base layers, gallium arsenide substrate layers, carbon nanotube substrate layers or graphene substrate layers or ceramic substrate layers.
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| CN110726765B (en) * | 2019-12-17 | 2020-05-05 | 深圳市刷新智能电子有限公司 | Graphene biosensor electrode |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101368926A (en) * | 1998-10-08 | 2009-02-18 | 特拉森斯公司 | Small volume in vitro analyte sensor with diffusible or non-leachable redox mediator |
| CN101713757A (en) * | 2009-11-19 | 2010-05-26 | 浙江大学 | Photoelectric compound integral sensor for detecting cell physiological parameters and preparation method thereof |
| CN102033089A (en) * | 2010-10-27 | 2011-04-27 | 清华大学 | Biosensor and packaging structure thereof and detection system |
| CN108169307A (en) * | 2018-03-09 | 2018-06-15 | 深圳市刷新智能电子有限公司 | Dual chip perspiration sensor and preparation method thereof |
| CN209264620U (en) * | 2018-10-25 | 2019-08-16 | 深圳市刷新智能电子有限公司 | Assembly type biologic sensor chip |
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| WO2004005908A1 (en) * | 2002-07-02 | 2004-01-15 | Matsushita Electric Industrial Co., Ltd. | Biosensor, biosensor chip, and biosensor device |
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Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101368926A (en) * | 1998-10-08 | 2009-02-18 | 特拉森斯公司 | Small volume in vitro analyte sensor with diffusible or non-leachable redox mediator |
| CN101713757A (en) * | 2009-11-19 | 2010-05-26 | 浙江大学 | Photoelectric compound integral sensor for detecting cell physiological parameters and preparation method thereof |
| CN102033089A (en) * | 2010-10-27 | 2011-04-27 | 清华大学 | Biosensor and packaging structure thereof and detection system |
| CN108169307A (en) * | 2018-03-09 | 2018-06-15 | 深圳市刷新智能电子有限公司 | Dual chip perspiration sensor and preparation method thereof |
| CN209264620U (en) * | 2018-10-25 | 2019-08-16 | 深圳市刷新智能电子有限公司 | Assembly type biologic sensor chip |
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