CN109362188A - A method of preventing gold-plated lateral erosion and the golden finger dew copper of printed circuit board - Google Patents
A method of preventing gold-plated lateral erosion and the golden finger dew copper of printed circuit board Download PDFInfo
- Publication number
- CN109362188A CN109362188A CN201811509929.1A CN201811509929A CN109362188A CN 109362188 A CN109362188 A CN 109362188A CN 201811509929 A CN201811509929 A CN 201811509929A CN 109362188 A CN109362188 A CN 109362188A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- gold
- plated
- golden finger
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/162—Testing a finished product, e.g. heat cycle testing of solder joints
Abstract
The present invention relates to a kind of printed circuit board technologies, belong to printed circuit technique field, the method for being specifically related to a kind of gold-plated lateral erosion for preventing printed circuit board and golden finger dew copper.The present invention first carries out gold-plated processing to circuit board surface, then anti-welding processing is carried out then at the circuit board surface for completing gold-plated processing, therefore: during gold-plated, it is not to influence anti-welding adhesion effect because of the fluctuation of the soaking time length of golden slot and golden cell current, not will cause the lateral erosion of golden finger root；And be not because ink is not developed clean or ink is anti-glutinous and results in when carrying out gold-plated, golden finger can not go up gold, and golden finger is caused to reveal copper；Really gold-plated lateral erosion and the golden finger dew copper of printed circuit board can be prevented.
Description
Technical field
The present invention relates to a kind of printed circuit board technologies, belong to printed circuit technique field, and being specifically related to one kind prevents
The method of the gold-plated lateral erosion of printed circuit board and golden finger dew copper.
Background technique
With the fast lifting of countries in the world industrial development ability, consumption market is more and more big, printed circuit board (PCB) enterprise
Industry is just rapidly grown up.
The production process of known printed circuit board mainly comprises the steps of and carries out anti-welding place in printed circuit board surface
Reason, then sticks dry film, then carries out gold-plated processing.
Since anti-welding processing is the position for not needing welding using ink protection, the missing of above-mentioned prior art method is main
Include:
(1) first carry out it is anti-welding, then carry out again it is gold-plated, during gold-plated, the soaking time length of golden slot and golden slot
The fluctuation of electric current all will affect anti-welding adhesion effect, cause the lateral erosion of golden finger root.
(2) first carry out anti-welding, then carry out gold-plated, sticked because ink is not developed clean or ink is counter again, will lead in into
When row is gold-plated, golden finger can not go up gold, and golden finger is caused to reveal copper.
For above-mentioned missing, the general way of dealer is that gold-plated lateral erosion and golden finger dew copper are repaired, although can
Improve gold-plated lateral erosion and golden finger dew copper, but must expend additional artificial, printed circuit board cost is caused to improve.
Although in addition, the mode of above-mentioned repairing can improve gold-plated lateral erosion and golden finger dew copper, still can because of repairing not
Improve and there are flaws, lead to the high failure rate of printed circuit board.
Accordingly, improving to the method for the gold-plated lateral erosion for preventing printed circuit board of the prior art and golden finger dew copper is
Correlative technology field personage project urgently to be resolved.
Summary of the invention
A brief summary of one or more aspects is given below to provide to the basic comprehension in terms of these.This general introduction is not
The extensive overview of all aspects contemplated, and be both not intended to identify critical or decisive element in all aspects also non-
Attempt to define the range in terms of any or all.Its unique purpose is to provide the one of one or more aspects in simplified form
A little concepts are with the sequence for more detailed description given later.
The main purpose of the present invention is the above-mentioned technical problem solved in the presence of the prior art, and providing one kind prevents
The method of the gold-plated lateral erosion of printed circuit board and golden finger dew copper.This method first carries out gold-plated processing to circuit board surface, then
Anti-welding processing is carried out then at the circuit board surface for completing gold-plated processing, gold-plated lateral erosion and the golden finger dew of printed circuit board can be prevented
Copper.
To solve the above problems, the scheme of the invention is:
A method of preventing gold-plated lateral erosion and the golden finger dew copper of printed circuit board, comprising the following steps:
Gold-plated processing is carried out in circuit board surface；And
Anti-welding processing is carried out in the circuit board surface for completing the gold-plated processing.
In at least one embodiment of the present invention, in the circuit board before the circuit board surface carries out gold-plated processing
Surface covers dry film.
In at least one embodiment of the present invention, forming processes are carried out in the circuit board for completing the anti-welding processing.
In at least one embodiment of the present invention, electrical measurement is carried out to the circuit board for completing the forming processes.
In at least one embodiment of the present invention, organic guarantor is carried out in the circuit board surface for completing the electrical measurement to weld at film
Reason.
In at least one embodiment of the present invention, automatic optics inspection is sequentially carried out to the circuit board for completing the processing
And/or visual inspection.
A method of preventing gold-plated lateral erosion and the golden finger dew copper of printed circuit board, comprising the following steps:
Step 101: not needing gold-plated place's covering dry film in circuit board surface；
Step 102: carrying out gold-plated processing in circuit board surface；
Step 103: carrying out anti-welding processing in the circuit board surface for completing gold-plated processing；
Step 104: carrying out forming processes in the circuit board for completing anti-welding processing.
Step 105: electrical measurement is carried out to the circuit board for completing forming processes；
Step 106: carrying out organic guarantor in the circuit board surface for completing electrical measurement and weld film process.
In at least one embodiment of the present invention, further comprising the steps of:
Step 107: automatic optics inspection is sequentially carried out to the circuit board for completing organic guarantor's weldering film process；
Step 108: visual inspection is carried out to the circuit board for completing automatic optics inspection.
In at least one embodiment of the present invention, in the step 103, anti-welding processing is not needed using ink protection
The position of welding.
Therefore, the beneficial effects of the present invention are: the present invention is during gold-plated, it is not the soaking time because of golden slot
The fluctuation of length and golden cell current and influence anti-welding adhesion effect, therefore not will cause the lateral erosion of golden finger root；And it is not
Because ink is not developed clean or ink is anti-glutinous and result in carry out gold-plated when, golden finger can not go up gold, and golden finger is caused to reveal
Copper；Really gold-plated lateral erosion and the golden finger dew copper of printed circuit board can be prevented.
Detailed description of the invention
It is incorporated herein and the attached drawing for forming part of specification instantiates the embodiment of the present invention, and attached drawing and explanation
Book is further used for explaining the principle of the present invention together and one of ordinary skill in the art is enabled to make and use the disclosure.
Fig. 1 instantiates the system framework figure in the embodiment of the present invention；
The embodiment of the present invention is described with reference to the accompanying drawings.
In figure, 100: preventing the gold-plated lateral erosion of printed circuit board and the method flow of golden finger dew copper；
101~108: preventing the step of the gold-plated lateral erosion of printed circuit board and the method flow of golden finger dew copper.
Specific embodiment
Embodiment
Refering to Figure 1, one kind provided by the present invention prevents gold-plated lateral erosion and the golden finger dew copper of printed circuit board
Method flow 100, it includes following steps:
Step 101: covering dry film in circuit board surface；Dry film is covered in not needing gold-plated place；
Step 102: carrying out gold-plated processing in circuit board surface；
Step 103: carrying out anti-welding processing in the circuit board surface for completing gold-plated processing；Anti-welding processing is protected using ink
The position of welding is not needed.
Step 104: carrying out forming processes in the circuit board for completing anti-welding processing, size required for client's piece is made；
Step 105: electrical measurement is carried out to the circuit board for completing forming processes；
Step 106: carrying out OSP (Organic in the circuit board surface for completing electrical measurement
SolderabilityPreservative, organic guarantor weld film) processing；
Step 107: handling OSP (Organic Solderability Preservative, organic guarantor weld film) is completed
Circuit board sequentially carry out AVI (Auto Visual Inspection, automatic optics inspection).
Step 108: visual inspection is carried out to the circuit board for completing AVI.
The printed circuit board for completing above-mentioned steps is finished product, can carry out packing simultaneously shipment.
Wherein, step 102 carries out gold-plated processing in circuit board surface；The good contact and conduction assigned convenient for client's piece
Property.
It must be emphasized that explanation, the gold-plated lateral erosion for preventing printed circuit board provided by the present invention and golden finger dew copper it
Method, be by repeatedly it is real do sample verifying and obtain as a result, rather than simple sequence of steps variation.
In conclusion the method for the gold-plated lateral erosion for preventing printed circuit board of the present invention and golden finger dew copper, for circuit
Plate surface first carries out gold-plated processing, then carries out anti-welding processing then at the circuit board surface for completing gold-plated processing, therefore: in gold-plated
During, it is not to influence anti-welding adhesion effect because of the fluctuation of the soaking time length of golden slot and golden cell current,
The lateral erosion of golden finger root is not will cause；And it is not to result in progress because the not developed clean or ink of ink is anti-glutinous
When gold-plated, golden finger can not go up gold, and golden finger is caused to reveal copper；Really gold-plated lateral erosion and the golden finger dew of printed circuit board can be prevented
Copper.
In the present embodiment, although the above method to be illustrated to and is described as a series of actions to simplify to explain, answer
It is appreciated and understood that, the order that these methods are not acted is limited, because according to one or more embodiments, some movements can be by not
Occur with order and/or with from depicted and described herein or not shown herein and describe but those skilled in the art can be with
Other movements understood concomitantly occur.
It is noted that " one embodiment ", " embodiment ", " example embodiment ", " some embodiments " etc. in specification
Reference instruction described embodiment may include a particular feature, structure, or characteristic, but each embodiment may not necessarily include
The a particular feature, structure, or characteristic.Moreover, such phrase is not necessarily referring to the same embodiment.In addition, ought retouch in conjunction with the embodiments
When stating a particular feature, structure, or characteristic, regardless of whether being expressly recited, such feature, structure are realized in conjunction with other embodiments
Or characteristic will be in the knowledge of those skilled in the art.
Offer is to make any person skilled in the art all and can make or use this public affairs to the previous description of the disclosure
It opens.The various modifications of the disclosure all will be apparent for a person skilled in the art, and as defined herein general
Suitable principle can be applied to other variants without departing from the spirit or scope of the disclosure.The disclosure is not intended to be limited as a result,
Due to example described herein and design, but should be awarded and principle disclosed herein and novel features phase one
The widest scope of cause.
Claims (9)
1. a kind of method of gold-plated lateral erosion for preventing printed circuit board and golden finger dew copper, which comprises the following steps:
Gold-plated processing is carried out in circuit board surface；And
Anti-welding processing is carried out in the circuit board surface for completing the gold-plated processing.
2. the method for a kind of gold-plated lateral erosion for preventing printed circuit board according to claim 1 and golden finger dew copper, special
Sign is, covers dry film in the circuit board surface before the circuit board surface carries out gold-plated processing.
3. the method for a kind of gold-plated lateral erosion for preventing printed circuit board according to claim 1 and golden finger dew copper, special
Sign is, carries out forming processes in the circuit board for completing the anti-welding processing.
4. the method for a kind of gold-plated lateral erosion for preventing printed circuit board according to claim 3 and golden finger dew copper, special
Sign is, carries out electrical measurement to the circuit board for completing the forming processes.
5. the method for a kind of gold-plated lateral erosion for preventing printed circuit board according to claim 4 and golden finger dew copper, special
Sign is, carries out organic guarantor in the circuit board surface for completing the electrical measurement and welds film process.
6. the method for a kind of gold-plated lateral erosion for preventing printed circuit board according to claim 1 and golden finger dew copper, special
Sign is, sequentially carries out automatic optics inspection and/or visual inspection to the circuit board for completing the processing.
7. a kind of method of gold-plated lateral erosion for preventing printed circuit board and golden finger dew copper, which comprises the following steps:
Step 101: not needing gold-plated place's covering dry film in circuit board surface；
Step 102: carrying out gold-plated processing in circuit board surface；
Step 103: carrying out anti-welding processing in the circuit board surface for completing gold-plated processing；
Step 104: carrying out forming processes in the circuit board for completing anti-welding processing.
Step 105: electrical measurement is carried out to the circuit board for completing forming processes；
Step 106: carrying out organic guarantor in the circuit board surface for completing electrical measurement and weld film process.
8. the method for a kind of gold-plated lateral erosion for preventing printed circuit board according to claim 2 and golden finger dew copper, special
Sign is, further comprising the steps of:
Step 107: automatic optics inspection is sequentially carried out to the circuit board for completing organic guarantor's weldering film process；
Step 108: visual inspection is carried out to the circuit board for completing automatic optics inspection.
9. the method for a kind of gold-plated lateral erosion for preventing printed circuit board according to claim 2 and golden finger dew copper, special
Sign is, in the step 103, anti-welding processing is the position that welding is not needed using ink protection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811509929.1A CN109362188A (en) | 2018-12-11 | 2018-12-11 | A method of preventing gold-plated lateral erosion and the golden finger dew copper of printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811509929.1A CN109362188A (en) | 2018-12-11 | 2018-12-11 | A method of preventing gold-plated lateral erosion and the golden finger dew copper of printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109362188A true CN109362188A (en) | 2019-02-19 |
Family
ID=65332085
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811509929.1A Pending CN109362188A (en) | 2018-12-11 | 2018-12-11 | A method of preventing gold-plated lateral erosion and the golden finger dew copper of printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109362188A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003051657A (en) * | 2001-08-07 | 2003-02-21 | Mitsubishi Gas Chem Co Inc | Method for manufacturing printed circuit substrate having ultra fine wiring pattern |
| CN102026491A (en) * | 2010-12-07 | 2011-04-20 | 深南电路有限公司 | Manufacturing process of whole gold-plated panel |
| CN102946693A (en) * | 2012-12-11 | 2013-02-27 | 桂林电子科技大学 | Step circuit board with gold-masking copper-plating hybrid surface process and manufacture method thereof |
-
2018
- 2018-12-11 CN CN201811509929.1A patent/CN109362188A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003051657A (en) * | 2001-08-07 | 2003-02-21 | Mitsubishi Gas Chem Co Inc | Method for manufacturing printed circuit substrate having ultra fine wiring pattern |
| CN102026491A (en) * | 2010-12-07 | 2011-04-20 | 深南电路有限公司 | Manufacturing process of whole gold-plated panel |
| CN102946693A (en) * | 2012-12-11 | 2013-02-27 | 桂林电子科技大学 | Step circuit board with gold-masking copper-plating hybrid surface process and manufacture method thereof |
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|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20190219 |