CN109361371A - A kind of chip attenuator - Google Patents
A kind of chip attenuator Download PDFInfo
- Publication number
- CN109361371A CN109361371A CN201811480462.2A CN201811480462A CN109361371A CN 109361371 A CN109361371 A CN 109361371A CN 201811480462 A CN201811480462 A CN 201811480462A CN 109361371 A CN109361371 A CN 109361371A
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- electrode
- grounding electrode
- grounding
- attenuator
- chip attenuator
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
- H03H7/24—Frequency- independent attenuators
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Abstract
The present invention provides a kind of chip attenuators, are related to attenuator technical field.The chip attenuator includes insulating substrate, strip or cross resistor body, input electrode, output electrode and grounding electrode, and input electrode, output electrode and grounding electrode are connect with the different location of resistor body.Chip attenuator provided by the invention has volume smaller, in practical applications more convenient advantage.
Description
Technical field
The present invention relates to attenuator technical fields, in particular to a kind of chip attenuator.
Background technique
Attenuator is power gain control element, for the circuit of level adjustment, such as amplifier, signal receiver, letter
Number transmitter etc. requires to carry out Attenuation adjustable to signal or power.Either the communication technology, radar array technology,
In terms of radio-frequency technique or other electronic circuits, as long as there is amplifying circuit, it nearly all be unable to do without attenuator.
But attenuator currently on the market is mainly combinational circuit, simplest pure resistance type attenuator is also required to three
A resistance, the circuit of less demanding for some precision, stability etc., can be used pure resistor element circuit, resistance-capacitance circuit or resistance
The attenuator circuit of reactive circuit combination, the volume of entire attenuator are larger.
It is the emphasis of those skilled in the art's concern in view of this, how to solve the above problems.
Summary of the invention
In view of this, being decayed the purpose of the present invention is to provide a kind of chip attenuator with solving chip in the prior art
The larger problem of the volume of device.
To achieve the goals above, technical solution used in the embodiment of the present invention is as follows:
On the one hand, the embodiment of the present invention proposes a kind of chip attenuator, and the chip attenuator includes insulating substrate, length
Bar resistor body, input electrode, output electrode and grounding electrode, the input electrode, the output electrode and described connect
Ground electrode is connect with the different location of the resistor body.
Further, the grounding electrode includes the first grounding electrode and the second grounding electrode, first grounding electrode
The both ends of the insulating substrate are respectively arranged at second grounding electrode, first grounding electrode or described second connect
Ground electrode is connect with the resistor body, and first grounding electrode is electrically connected with second grounding electrode.
Further, first grounding electrode and second grounding electrode run through the front of the insulating substrate with
The back side, the input electrode and the output electrode are all set in the front of the insulating substrate, and the chip attenuator also wraps
Metal layer is included, the metal layer is covered in the back side of the insulating substrate.
Further, the grounding electrode includes the first grounding electrode and the second grounding electrode, first grounding electrode
The both ends of the insulating substrate are respectively arranged at second grounding electrode, first grounding electrode, described second connect
Ground electrode is connect with the resistor body.
Further, the shape of the input electrode, the output electrode and the grounding electrode is polygon.
Further, the chip attenuator further includes index point, and the index point is set on the insulating substrate, and
The color of the index point is different from the color of the insulating substrate.
Further, the chip attenuator further includes transition zone, the input electrode, the output electrode and described
Grounding electrode passes through the transition zone and connect with the insulating substrate.
Further, the input electrode, the output electrode and the equal surface of the grounding electrode are respectively positioned on same
On surface.
Further, the material for making the resistor body includes tantalum-nitride material.
On the other hand, the embodiment of the present invention provides another chip attenuator, and the chip attenuator includes insulation
Substrate, cross resistor body, input electrode, output electrode and grounding electrode, the input electrode, the output electrode and
The grounding electrode is connect with the different location of the resistor body.
Compared with the prior art, the invention has the following advantages:
The present invention provides a kind of chip attenuator, which includes insulating substrate, strip or cross electricity
Resistance body, input electrode, output electrode and grounding electrode, input electrode, output electrode and grounding electrode with resistor body
Different location connection.Wherein, original multiple resistor bodies are substituted using a strip or cross resistor body due to the present invention,
And can be realized the function of attenuator, therefore the volume of chip attenuator provided in this embodiment is smaller, in practical applications more
Add conveniently.
To enable the above objects, features and advantages of the present invention to be clearer and more comprehensible, preferred embodiment is cited below particularly, and cooperate
Appended attached drawing, is described in detail below.
Detailed description of the invention
In order to illustrate the technical solution of the embodiments of the present invention more clearly, below will be to needed in the embodiment attached
Figure is briefly described, it should be understood that the following drawings illustrates only certain embodiments of the present invention, therefore is not construed as pair
The restriction of range for those of ordinary skill in the art without creative efforts, can also be according to this
A little attached drawings obtain other relevant attached drawings.
Fig. 1 shows a kind of structural schematic diagram of chip attenuator provided in an embodiment of the present invention.
Fig. 2 shows the equivalent schematic diagrams and calculation formula of 3dB and 10dB chip attenuator provided in an embodiment of the present invention.
Fig. 3 shows the test curve of the 3dB chip attenuator provided in an embodiment of the present invention based on Fig. 1.
Fig. 4 shows the structural schematic diagram of another chip attenuator provided in an embodiment of the present invention.
Fig. 5 shows the test curve of the 10dB chip attenuator provided in an embodiment of the present invention based on Fig. 4.
Icon: 100- chip attenuator；110- resistor body；120- input electrode；130- output electrode；140- ground connection electricity
Pole；The first grounding electrode of 141-；The second grounding electrode of 142-；150- insulating substrate；160- index point；170- metal layer；180-
Transition zone.
Specific embodiment
In order to make the object, technical scheme and advantages of the embodiment of the invention clearer, below in conjunction with the embodiment of the present invention
In attached drawing, technical scheme in the embodiment of the invention is clearly and completely described, it is clear that described embodiment is
A part of the embodiment of the present invention, instead of all the embodiments.The present invention being usually described and illustrated herein in the accompanying drawings is implemented
The component of example can be arranged and be designed with a variety of different configurations.
Below in conjunction with attached drawing in the embodiment of the present invention, technical solution in the embodiment of the present invention carries out clear, complete
Ground description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.Usually exist
The component of the embodiment of the present invention described and illustrated in attached drawing can be arranged and be designed with a variety of different configurations herein.Cause
This, is not intended to limit claimed invention to the detailed description of the embodiment of the present invention provided in the accompanying drawings below
Range, but it is merely representative of selected embodiment of the invention.Based on the embodiment of the present invention, those skilled in the art are not doing
Every other embodiment obtained under the premise of creative work out, shall fall within the protection scope of the present invention.
It should also be noted that similar label and letter indicate similar terms in following attached drawing, therefore, once a certain Xiang Yi
It is defined in a attached drawing, does not then need that it is further defined and explained in subsequent attached drawing.Meanwhile of the invention
In description, it is also necessary to which explanation is unless specifically defined or limited otherwise, term " connected ", " connection " shall be understood in a broad sense,
It for example, it may be being fixedly connected, may be a detachable connection, or be integrally connected；It can be mechanical connection, be also possible to electricity
Connection；It can be directly connected, the connection inside two elements can also be can be indirectly connected through an intermediary.For
For those skilled in the art, the concrete meaning of above-mentioned term in the present invention can be understood with concrete condition.It ties below
Attached drawing is closed, is elaborated to some embodiments of the present invention.In the absence of conflict, following embodiment and embodiment
In feature can be combined with each other.
First embodiment
Referring to Fig. 1, the chip attenuator 100 includes insulation the embodiment of the invention provides a kind of chip attenuator 100
Substrate 150, strip resistor body 110, input electrode 120, output electrode 130 and grounding electrode 140, wherein input electrode
120, output electrode 130 and grounding electrode 140 are connect with the different location of resistor body 110.
Wherein it is possible to understand, in the present embodiment, input electrode 120, output electrode 130 and grounding electrode 140
It is metal, and realizes physical connection with resistor body 110.Insulating substrate 150 uses ceramic substrate, of course, in others
In some embodiments, insulating substrate 150 can also be made using other materials, the present embodiment does not do any restriction to this.
In order to reduce the volume of chip attenuator 100, resistor body 110 is set as strip resistor body 110, utilizes strip
Resistor body 110 equivalent traditional T-type network or pin network, on the basis of greatly reducing the volume of chip attenuator 100
Its high frequency performance can also be improved simultaneously.
Further, in order to which the use environment for improving chip attenuator 100 requires, resistor body 110 is by included a tantalum target and nitrogen
The tantalum-nitride material that solid/liquid/gas reactions sputter is made.
Further, since the connection of metal and ceramic material is easy to fall off, in order to make input electrode 120, output
Electrode 130 and grounding electrode 140 and the connection of insulating substrate 150 are stronger, in the present embodiment, input electrode 120, defeated
Electrode 130 and grounding electrode 140 are connect by transition zone 180 with insulating substrate 150 out.Wherein, transition zone 180 is made
Material includes but is not limited to titanium tungsten material and tantalum-nitride material, and then realizes the close connection of electrode and ceramic substrate.
Meanwhile in the present embodiment, in order to adjust the impedance matching of input, output, input electrode 120, output electrode 130
And the shape of grounding electrode 140 is polygon, such as shape is rectangle, the shapes such as trapezoidal.Also, input and output in order to prevent
The ground connection of electrode 130 leads to product failure, has carried out the disposition of insulation side to input and output electrode 130 respectively.
In order to which the technique for making chip attenuator 100 is simpler, as a kind of implementation of the present embodiment, ground connection
Electrode 140 includes the first grounding electrode 141 and the second grounding electrode 142, the first grounding electrode 141 and the second grounding electrode 142
The both ends for the insulating substrate 150 being respectively arranged at, the first grounding electrode 141 or the second grounding electrode 142 connect with resistor body 110
It connects, and the first grounding electrode 141 is electrically connected with the second grounding electrode 142.
Further, the first grounding electrode 141 and the second grounding electrode 142 are all made of the mode of via hole through insulating substrate
150 front and the back side, wherein input electrode 120 is all set in the front of insulating substrate 150 with output electrode 130, and chip declines
Subtracting device 100 further includes metal layer 170, and metal layer 170 is covered in the back side of insulating substrate 150.It can be realized by metal layer 170
First grounding electrode 141 is electrically connected with the second grounding electrode 142, and then reaches equipotential effect, can be by the first ground connection electricity
Pole 141 and/or the second grounding electrode 142 are used as ground terminal.
As another implementation of the present embodiment, grounding electrode 140 includes the first grounding electrode 141 and the second ground connection
Electrode 142, and the both ends of insulating substrate 150 that the first grounding electrode 141 and the second grounding electrode 142 are respectively arranged at, first
Grounding electrode 141, the second grounding electrode 142 are connect with resistor body 110, to can also reach the first grounding electrode 141
And/or second effect of the grounding electrode 142 as ground terminal.
Simultaneously as the more difficult differentiation of shape of the chip attenuator 100 under small size, such as 1dB attenuation declines to 4dB
The chip attenuator 100 of decrement, appearance is essentially identical, thus it is more difficult distinguish, in view of this, in the present embodiment, core
Piece attenuator 100 further includes index point 160, and index point 160 is set on insulating substrate 150, and the color of index point 160 and absolutely
The color of edge substrate 150 is different.The attenuation of the chip can be told by index point 160, for example, working as chip attenuator
When 100 attenuation is 1dB, the quantity of index point 160 is 1, when the attenuation of chip attenuator 100 is 3dB, index point
160 quantity is 3, and so on.
It should be noted that the present embodiment makes input electrode using sputtering mode in order to which processing technology is simpler
120, output electrode 130 and grounding electrode 140, during making electrode, additionally it is possible to make mark by way of sputtering
Will point 160.
It should be noted that chip attenuator 100 is one of fixed attenuator, therefore is introduced by taking fixed attenuator as an example
Its design method.This attenuator is only made of resistance, can be divided into T-type and two kinds of π type according to its structure.According to two end resistance of circuit
The anti-difference used, and same impedance type and different impedance type can be divided into.Chip attenuator 100 provided in an embodiment of the present invention is same hinders
Formula structure, Fig. 2 are the equivalent schematic diagram and calculation formula of 3dB and 10dB chip attenuator 100.
Fig. 3 is the test curve of 3dB chip attenuator 100 provided in this embodiment.There it can be seen that DC~
There is preferable convergent response under 20GHz, standing-wave ratio is both less than 1.3 in entire broadband, and attenuation deviation is in DC~12GHz
It is interior to be less than ± 0.3dB.S11 indicates that the reflection coefficient of input terminal 1, S21 indicate the transmission coefficient of output end 2 in figure.
Further, for the ease of processing and assembling, processing request, the upper surface of input electrode 120, output electrode are reduced
The upper surface of 130 upper surface, the upper surface of grounding electrode 140 and index point 160 is respectively positioned in approximately the same plane.
Second embodiment
Referring to Fig. 4, the embodiment of the invention also provides another chip attenuator 100, which includes
Insulating substrate 150, cross resistor body 110, input electrode 120, output electrode 130 and grounding electrode 140, input electrode
120, output electrode 130 and grounding electrode 140 are connect with the different location of resistor body 110.It should be noted that due to this reality
The distinctive points for applying the chip attenuator 100 that example provides chip attenuator 100 and first embodiment offer are the shape of resistor body 110
The difference of shape, and the other structures of chip attenuator 100 are all the same, therefore no longer go to live in the household of one's in-laws on getting married to other structures in the present embodiment
It states.
Fig. 5 is a kind of test curve for 10dB chip attenuator 100 that embodiment provides.There it can be seen that DC~
There is preferable convergent response under 20GHz, standing-wave ratio is both less than 1.3 in entire broadband, and attenuation deviation is in DC~12GHz
It is interior to be less than ± 0.35dB.S11 indicates that the reflection coefficient of input terminal 1, S21 indicate the transmission coefficient of output end 2 in figure.
In conclusion the present invention provides a kind of chip attenuator, the chip attenuator include insulating substrate, strip or
Cross resistor body, input electrode, output electrode and grounding electrode, input electrode, output electrode and grounding electrode with
The different location of resistor body connects.Wherein, original more using a strip or cross resistor body substitution due to the present invention
A resistor body, and can be realized the function of attenuator, therefore the volume of chip attenuator provided in this embodiment is smaller, in reality
It is more convenient in.
It should be noted that, in this document, the relational terms of such as " first " and " second " or the like are used merely to one
A entity or operation with another entity or operate distinguish, without necessarily requiring or implying these entities or operation it
Between there are any actual relationship or orders.Moreover, the terms "include", "comprise" or its any other variant are intended to
Cover non-exclusive inclusion, so that the process, method, article or equipment for including a series of elements not only includes those
Element, but also including other elements that are not explicitly listed, or further include for this process, method, article or setting
Standby intrinsic element.In the absence of more restrictions, the element limited by sentence "including a ...", it is not excluded that
There is also other identical elements in the process, method, article or apparatus that includes the element.
The foregoing is only a preferred embodiment of the present invention, is not intended to restrict the invention, for the skill of this field
For art personnel, the invention may be variously modified and varied.All within the spirits and principles of the present invention, made any to repair
Change, equivalent replacement, improvement etc., should all be included in the protection scope of the present invention.It should also be noted that similar label and letter exist
Similar terms are indicated in following attached drawing, therefore, once being defined in a certain Xiang Yi attached drawing, are then not required in subsequent attached drawing
It is further defined and explained.
Claims (10)
1. a kind of chip attenuator, which is characterized in that the chip attenuator includes insulating substrate, strip resistor body, input
Electrode, output electrode and grounding electrode, the input electrode, the output electrode and the grounding electrode with the electricity
The different location of resistance body connects.
2. chip attenuator as described in claim 1, which is characterized in that the grounding electrode includes the first grounding electrode and the
Two grounding electrodes, first grounding electrode and second grounding electrode are respectively arranged at the both ends of the insulating substrate,
First grounding electrode or second grounding electrode are connect with the resistor body, and first grounding electrode and described the
The electrical connection of two grounding electrodes.
3. chip attenuator as claimed in claim 2, which is characterized in that first grounding electrode and the second ground connection electricity
Extremely run through the front and the back side of the insulating substrate, the input electrode and the output electrode are all set in the insulation base
The front of plate, the chip attenuator further includes metal layer, and the metal layer is covered in the back side of the insulating substrate.
4. chip attenuator as described in claim 1, which is characterized in that the grounding electrode includes the first grounding electrode and the
Two grounding electrodes, first grounding electrode and second grounding electrode are respectively arranged at the both ends of the insulating substrate,
First grounding electrode, second grounding electrode are connect with the resistor body.
5. chip attenuator as described in claim 1, which is characterized in that the input electrode, the output electrode and institute
The shape for stating grounding electrode is polygon.
6. chip attenuator as described in claim 1, which is characterized in that the chip attenuator further includes index point, described
Index point is set on the insulating substrate, and the color of the index point is different from the color of the insulating substrate.
7. chip attenuator as described in claim 1, which is characterized in that the chip attenuator further includes transition zone, described
Input electrode, the output electrode and the grounding electrode pass through the transition zone and connect with the insulating substrate.
8. chip attenuator as described in claim 1, which is characterized in that the input electrode, the output electrode and institute
The equal surface of grounding electrode is stated to be respectively positioned on same surface.
9. chip attenuator as described in claim 1, which is characterized in that the material for making the resistor body includes tantalum nitride material
Material.
10. a kind of chip attenuator, which is characterized in that the chip attenuator includes insulating substrate, cross resistor body, input
Electrode, output electrode and grounding electrode, the input electrode, the output electrode and the grounding electrode with the electricity
The different location of resistance body connects.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811480462.2A CN109361371A (en) | 2018-12-05 | 2018-12-05 | A kind of chip attenuator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811480462.2A CN109361371A (en) | 2018-12-05 | 2018-12-05 | A kind of chip attenuator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109361371A true CN109361371A (en) | 2019-02-19 |
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ID=65331346
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811480462.2A Pending CN109361371A (en) | 2018-12-05 | 2018-12-05 | A kind of chip attenuator |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111244062A (en) * | 2020-03-09 | 2020-06-05 | 成都川美新技术股份有限公司 | Ground chip device, method of producing the same, method of mounting the same, and electronic apparatus |
-
2018
- 2018-12-05 CN CN201811480462.2A patent/CN109361371A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111244062A (en) * | 2020-03-09 | 2020-06-05 | 成都川美新技术股份有限公司 | Ground chip device, method of producing the same, method of mounting the same, and electronic apparatus |
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