CN109352887B - Method for forming film by resin adhesive tape casting - Google Patents
Method for forming film by resin adhesive tape casting Download PDFInfo
- Publication number
- CN109352887B CN109352887B CN201811115945.2A CN201811115945A CN109352887B CN 109352887 B CN109352887 B CN 109352887B CN 201811115945 A CN201811115945 A CN 201811115945A CN 109352887 B CN109352887 B CN 109352887B
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- CN
- China
- Prior art keywords
- epoxy resin
- based adhesive
- casting
- adhesive
- film
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C41/00—Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor
- B29C41/003—Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor characterised by the choice of material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C41/00—Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor
- B29C41/24—Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor for making articles of indefinite length
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C41/00—Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor
- B29C41/34—Component parts, details or accessories; Auxiliary operations
- B29C41/46—Heating or cooling
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2063/00—Use of EP, i.e. epoxy resins or derivatives thereof, as moulding material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2007/00—Flat articles, e.g. films or sheets
- B29L2007/002—Panels; Plates; Sheets
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Moulding By Coating Moulds (AREA)
- Adhesive Tapes (AREA)
Abstract
A method for forming a film by resin adhesive tape casting relates to the technical field of epoxy resin film production technology for chip packaging. Solves the technical problems that the existing epoxy resin-based adhesive has great operation difficulty when being used for preparing an epoxy resin film and the formed resin film is easy to have air holes, 1) selects the epoxy resin-based adhesive with the thermal expansion coefficient of 20-80 (10)‑6V deg.C) as raw material, and storing at-40 deg.C or lower for use; 2) taking out the epoxy resin-based adhesive, placing the epoxy resin-based adhesive in a normal temperature environment, and thawing the epoxy resin-based adhesive to be in a normal flowable state after being heated; 3) leading the epoxy resin-based adhesive into the edge of a casting machine from one direction to prevent excessive air from being brought into the raw material; after the epoxy resin-based adhesive is filled in the knife edge, the knife edge is kept stand to discharge redundant air, and the standing time is preferably the length that the epoxy resin-based adhesive does not flow out of the knife edge. And (3) discharging redundant air, reducing the generation of bubbles in the casting process and preparing the resin film with uniform thickness.
Description
Technical Field
The invention relates to the technical field of epoxy resin film production technology for chip packaging.
Background
Electronic packaging is an important means for protecting devices from environmental influences and enabling long-term reliable operation, directly affects device performance and production cost, and plays a key role in system miniaturization. In the packaging process it is generally required: the temperature of the chip must not exceed the allowable value, metal micro-chips cannot exist in the tube shell, harmful gas or impurities cannot be released, the packaging is carried out in a clean and low-humidity environment, and the packaging has good air tightness. The plastic package device has low cost, small size, light weight, capacity of being produced in large scale, etc. and has microelectronic market share over 90% and is one kind of thermosetting material, which is softened and partially molten, heated and cured to form one netted three-dimensional structure.
A coefficient of thermal expansion of 20-80(10-6/° c), which is the most widely used material (about 90%) in plastic packaging of electronic components, epoxy resin films currently used for packaging are monopoly abroad, such as japanese rice-noodles, sun, and the like. Only domestic epoxy resin-based adhesive raw materials similar to the ChangRex resin film exist in China, and the technical bottleneck existing in the process of manufacturing the epoxy resin-based adhesive into the epoxy resin film is as follows: the epoxy resin-based adhesive can generate a crosslinking reaction at normal temperature, the thickening leads to difficult operation, the raw material epoxy resin-based adhesive is easy to generate bubbles during tape casting, and the formed resin film has air holes, so that the air tightness of packaging is reduced or the function failure of devices is caused.
Disclosure of Invention
In summary, the present invention is directed to a method for casting a resin film to solve the technical problems of the conventional epoxy resin-based adhesive that the operation difficulty is high when the epoxy resin film is manufactured, and the formed resin film is prone to have pores.
In order to solve the technical problems provided by the invention, the technical scheme is as follows:
a method for casting a resin adhesive into a film, which is characterized by comprising the following steps:
1) selecting a material with a thermal expansion coefficient of 20-80 (10)-6V deg.C) as raw material, and storing at-40 deg.C or lower for use;
2) taking out the epoxy resin-based adhesive, placing the epoxy resin-based adhesive in a normal temperature environment, and thawing the epoxy resin-based adhesive to be in a normal flowable state at a temperature return, wherein the time for thawing at the temperature return is not more than 2 hours;
3) leading the epoxy resin-based adhesive into the edge of a casting machine from one direction to prevent excessive air from being brought into the raw material; after the epoxy resin-based adhesive is filled in the knife edge, standing is carried out, and redundant air is discharged, wherein the standing time is preferably that the epoxy resin-based adhesive does not flow out of the knife edge;
4) and the resin film with the thickness of 250-270 mu m is prepared by controlling the height of the edge of the casting machine and the film speed.
The further limited technical scheme comprises the following steps:
and the epoxy resin-based adhesive is taken out, placed in a normal temperature environment, thawed for 1 hour at a returned temperature, and then introduced into a casting machine for casting.
And standing for 10min after the epoxy resin-based adhesive is filled in the knife edge, and discharging redundant air.
The height of the edge of the casting machine is 390 mu m, and the film speed is 0.2 m/min.
The casting machine is a CCS-710 casting machine.
The invention has the beneficial effects that: according to the invention, after the epoxy resin-based adhesive is thawed to be in a normal flowable state after being warmed, the epoxy resin-based adhesive is subjected to tape casting film-forming design by the aid of the CCS-710 tape casting machine, a knife edge is filled with the epoxy resin-based adhesive and then is kept stand for 10min, redundant air is discharged, bubbles generated in the tape casting process are reduced, a resin film with uniform thickness is prepared, and the possibility is provided for localization of the resin film.
Drawings
FIG. 1 is a schematic process flow diagram of the present invention.
Detailed Description
The process of the present invention is further described below with reference to the accompanying drawings and the detailed description.
Referring to fig. 1, the method for casting the resin adhesive into the film comprises the following steps:
1) selecting a material with a thermal expansion coefficient of 20-80 (10)-6V deg.C) as raw material, and storing at-40 deg.C or lower for use; the epoxy-based adhesive is preferably refrigerated to-55 ℃ in a refrigerator.
2) Taking out the epoxy resin-based adhesive, placing the epoxy resin-based adhesive in a normal temperature environment, and thawing the epoxy resin-based adhesive to be in a normal flowable state at a temperature return, wherein the time for thawing at the temperature return is not more than 2 hours; preferably, the epoxy resin-based adhesive is taken out of a refrigerator and cast after being cooled for 1 hour, the resin adhesive is unfrozen to be in a normal flowable state after being cooled for 1 hour, and if the cooling time exceeds 2 hours, the epoxy resin-based adhesive begins to react and becomes very viscous and difficult to operate.
3) Introducing the epoxy resin-based adhesive into the edge of a CCS-710 casting machine from one direction to prevent excessive air from being brought into the raw material; after the epoxy resin-based adhesive is filled in the knife edge, standing is carried out, and redundant air is discharged, wherein the standing time is preferably that the epoxy resin-based adhesive does not flow out of the knife edge; preferably, the epoxy resin-based adhesive is kept still for 10min after filling the knife edge, so that redundant air can be discharged, and meanwhile, the epoxy resin-based adhesive does not flow out of the knife edge due to overlong standing time.
4) Preparing a resin film with the thickness of 250-270 mu m by controlling the height of a knife edge of a casting machine and the film speed; the height of the edge of the casting machine is 390 mu m, the film speed is 0.2m/min, the film is difficult to form when the film speed is too low, and a uniform film layer is difficult to form when the film speed is too high; and after casting film formation, continuously curing to prepare the resin film required by the packaged chip.
Namely, the domestic epoxy resin-based adhesive with performance similar to that of the garland resin film is selected as a raw material, and the temperature return time after the epoxy resin-based adhesive is taken out of a refrigerator, the time of controlling the time delay of pouring the adhesive and the time of standing the adhesive in casting and other processes, and the film speed and the knife edge height of a lower plate in time delay are controlled, so that the resin film with uniform thickness is prepared, the possibility of localization of the resin film is provided, and bubbles in the casting process are reduced.
Claims (4)
1. A method for casting an epoxy resin adhesive for chip packaging into a film is characterized in that the method comprises the following steps:
1) selecting a material with a thermal expansion coefficient of 20-80 (10)-6V deg.C) as raw material, and storing at-40 deg.C or lower for use;
2) taking out the epoxy resin-based adhesive, placing the epoxy resin-based adhesive in a normal temperature environment, and thawing the epoxy resin-based adhesive to be in a normal flowable state at a temperature return, wherein the time for thawing at the temperature return is not more than 2 hours; the epoxy resin-based adhesive is taken out and placed in a normal temperature environment to be thawed for 1 hour at a returned temperature, and then the epoxy resin-based adhesive is introduced into a casting machine for casting;
3) leading the epoxy resin-based adhesive into the edge of a casting machine from one direction to prevent excessive air from being brought into the raw material; after the epoxy resin-based adhesive is filled in the knife edge, standing is carried out, and redundant air is discharged, wherein the standing time is preferably that the epoxy resin-based adhesive does not flow out of the knife edge;
4) and the resin film with the thickness of 250-270 mu m is prepared by controlling the height of the edge of the casting machine and the film speed.
2. The method for casting the epoxy resin adhesive for chip packaging as claimed in claim 1, wherein: and standing for 10min after the epoxy resin-based adhesive is filled in the knife edge, and discharging redundant air.
3. The method for casting the epoxy resin adhesive for chip packaging as claimed in claim 1, wherein: the height of the edge of the casting machine is 390 mu m, and the film speed is 0.2 m/min.
4. The method for casting the epoxy resin adhesive for chip packaging as claimed in claim 1, wherein: the casting machine is a CCS-710 casting machine.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811115945.2A CN109352887B (en) | 2018-09-25 | 2018-09-25 | Method for forming film by resin adhesive tape casting |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811115945.2A CN109352887B (en) | 2018-09-25 | 2018-09-25 | Method for forming film by resin adhesive tape casting |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109352887A CN109352887A (en) | 2019-02-19 |
| CN109352887B true CN109352887B (en) | 2020-12-22 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811115945.2A Active CN109352887B (en) | 2018-09-25 | 2018-09-25 | Method for forming film by resin adhesive tape casting |
Country Status (1)
| Country | Link |
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| CN (1) | CN109352887B (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101407700A (en) * | 2007-10-08 | 2009-04-15 | 第一毛织株式会社 | Adhesive film composition, adhesive film and scribing crystal grain binding film |
| CN103897341A (en) * | 2012-12-31 | 2014-07-02 | 中原工学院 | Photocuring epoxy resin-base film for flexible or thin-film solar cells and preparation method thereof |
| CN105856471A (en) * | 2016-05-30 | 2016-08-17 | 成都市惠家胶粘制品有限公司 | Tape casting system for forming manufacturing of protective film |
-
2018
- 2018-09-25 CN CN201811115945.2A patent/CN109352887B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101407700A (en) * | 2007-10-08 | 2009-04-15 | 第一毛织株式会社 | Adhesive film composition, adhesive film and scribing crystal grain binding film |
| CN103897341A (en) * | 2012-12-31 | 2014-07-02 | 中原工学院 | Photocuring epoxy resin-base film for flexible or thin-film solar cells and preparation method thereof |
| CN105856471A (en) * | 2016-05-30 | 2016-08-17 | 成都市惠家胶粘制品有限公司 | Tape casting system for forming manufacturing of protective film |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109352887A (en) | 2019-02-19 |
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