CN109343141A - A kind of SMD biscuit state monitoring apparatus in place - Google Patents
A kind of SMD biscuit state monitoring apparatus in place Download PDFInfo
- Publication number
- CN109343141A CN109343141A CN201811409513.2A CN201811409513A CN109343141A CN 109343141 A CN109343141 A CN 109343141A CN 201811409513 A CN201811409513 A CN 201811409513A CN 109343141 A CN109343141 A CN 109343141A
- Authority
- CN
- China
- Prior art keywords
- smd
- material box
- biscuit
- infrared
- transmitting tube
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 235000015895 biscuits Nutrition 0.000 title claims abstract description 47
- 238000012544 monitoring process Methods 0.000 title claims abstract description 23
- 239000000463 material Substances 0.000 claims abstract description 49
- 238000001514 detection method Methods 0.000 claims abstract description 17
- 238000000034 method Methods 0.000 abstract description 9
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000003086 colorant Substances 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01V—GEOPHYSICS; GRAVITATIONAL MEASUREMENTS; DETECTING MASSES OR OBJECTS; TAGS
- G01V8/00—Prospecting or detecting by optical means
- G01V8/10—Detecting, e.g. by using light barriers
- G01V8/12—Detecting, e.g. by using light barriers using one transmitter and one receiver
Landscapes
- Physics & Mathematics (AREA)
- Life Sciences & Earth Sciences (AREA)
- General Life Sciences & Earth Sciences (AREA)
- General Physics & Mathematics (AREA)
- Geophysics (AREA)
- Geophysics And Detection Of Objects (AREA)
Abstract
The invention discloses a kind of SMD biscuit state monitoring apparatus in place, including material box, detection sensor and intelligent controller, detection sensor is electrically connected with intelligent controller, detection sensor includes infrared transmitting tube and infrared receiving tube, infrared transmitting tube is equipped with the surface of material box, infrared receiving tube is mounted on the bottom in material box with respect to infrared transmitting tube, and infrared receiving tube receives the infrared signal that infrared transmitting tube is issued.SMD biscuit state monitoring apparatus in place of the present invention can pick and place, thus the material issuance mistake for avoiding SMT from producing for monitoring whether SMD biscuit is loaded in material box to avoid mistake of the SMD biscuit in fetching process.
Description
Technical field
The present invention relates to the transhipments of electronic manufacturing industry SMD biscuit, storage equipment technical field, and in particular to a kind of SMD disk
Expect state monitoring apparatus in place.
Background technique
SMD is the abbreviation of Surface Mounted Devices, is meant: surface mount device, it is SMT (Surface
One of Mount Technology) component.SMD biscuit needs to put SMD biscuit in the storing process of storage system
Enter specified magazine or takes out SMD biscuit out of specific magazine.The prior art is not directed to whether SMD biscuit is in material box
Interior monitoring system, therefore be easy to appear mistake of the SMD biscuit in fetching process and pick and place, the material issuance mistake for causing SMT to produce.
Summary of the invention
In view of this, the purpose of the present invention is to provide a kind of SMD biscuit state monitoring apparatus in place.
In order to achieve the above objectives, the invention provides the following technical scheme:
A kind of SMD biscuit state monitoring apparatus in place of the present invention, including material box, detection sensor and intelligent controller,
Detection sensor is electrically connected with intelligent controller, and detection sensor includes infrared transmitting tube and infrared receiving tube, infrared transmitting tube
Surface equipped with material box, infrared receiving tube are mounted on the bottom in material box with respect to infrared transmitting tube, and infrared receiving tube connects
Receive the infrared signal that infrared transmitting tube is issued.
Further, material box is the box-like structure of upper side opening, and infrared transmitting tube is located at the overthe openings of material box.
Further, the quantity of material box is multiple, and multiple material box is set side by side.
Further, the quantity of infrared transmitting tube and infrared receiving tube is equal with material box, i.e., all for each material box
It is correspondingly provided with infrared transmitting tube and infrared receiving tube.
The beneficial effects of the present invention are: whether SMD biscuit state monitoring apparatus in place of the present invention is for monitoring SMD biscuit
It is loaded in material box, can be picked and placed to avoid mistake of the SMD biscuit in fetching process, so that the material issuance for avoiding SMT from producing is wrong
Accidentally.
Detailed description of the invention
In order to keep the purpose of the present invention, technical scheme and beneficial effects clearer, the present invention provides following attached drawing and carries out
Illustrate:
Fig. 1 is a kind of structural schematic diagram of SMD biscuit state monitoring apparatus in place of the present invention.
Fig. 2 is a kind of detection sensor of SMD biscuit state monitoring apparatus in place of the present invention and the position installation of material box
Schematic diagram.
In figure, 1 is material box, and 2 be intelligent controller, and 3 be infrared transmitting tube, and 4 be infrared receiving tube.
Specific embodiment
The present invention will be further explained below with reference to the attached drawings and specific examples, so that those skilled in the art can be with
It better understands the present invention and can be practiced, but illustrated embodiment is not as a limitation of the invention.
As shown in Figure 1, a kind of SMD biscuit state monitoring apparatus in place of the present invention, including material box 1, detection sensor and
Intelligent controller 2, detection sensor are electrically connected with intelligent controller 2, and detection sensor includes infrared transmitting tube 3 and infrared receiver
Pipe 4, infrared transmitting tube 3 are equipped with the surface of material box 1, and infrared receiving tube 4 is mounted in material box 1 with respect to infrared transmitting tube 3
Bottom, infrared receiving tube 4 receives the infrared signal that is issued of infrared transmitting tube 3.As shown in Fig. 2, in the present embodiment,
Infrared transmitting tube 3 is mounted on the top of material box 1 by fixed plate, and through-hole, through-hole face are equipped in the middle part of the lower section of material box 1
Infrared transmitting tube 3, the corresponding through-hole of infrared receiving tube 4 are located at through-hole lower part.
Material box 1 is the box-like structure of upper side opening, and infrared transmitting tube 3 is located at the overthe openings of material box 1.
The quantity of material box 1 be it is multiple, multiple material box 1 is set side by side.
The quantity of infrared transmitting tube 3 and infrared receiving tube 4 is equal with material box 1, i.e., sets for each material box 1 all correspondences
There are infrared transmitting tube 3 and infrared receiving tube 4.
Present embodiment is that the mistake for avoiding SMD biscuit in fetching process picks and places, the material issuance mistake for causing SMT to produce,
In SMD biscuit warehousing system, to the in-place detection system of each biscuit box configuration biscuit, biscuit state in place is surveyed
Examination.
Identification material disc is identified by material position-detection sensor, and an infrared hair is assembled above SMD biscuit box
Pipe is penetrated, assembles an infrared receiving tube in biscuit cassette bottom portion.When there is biscuit, infrared ray is blocked, and receiving end can not receive red
Outside line determines the in place of biscuit.After biscuit is removed, stop disappear, reception pipe receive infrared transmitting tube issued it is red
Outside line confirms the vacancy of position in storehouse SMD biscuit.That is for SMD biscuit in the storing process of storage system, SMD charging tray is put into specified object
Magazine tests whether biscuit is properly placed specified material box by SMD biscuit state monitoring apparatus in place.In SMD biscuit feeding
In the process, judge whether the SMD biscuit correctly takes out the material by SMD biscuit state monitoring apparatus in place, avoid SMD biscuit
Mistake picks and places.In practice, status monitoring and reality, inspection can be carried out using usual intelligent controller cooperation detection sensor
It surveys the signal that will test of sensor and feeds back to intelligent controller, intelligent controller can be by the software systems that set in computer
Or the technologies such as PLC show SMD biscuit real-time status whether in place, can also be shown and be corresponded to by the indicator light of different colours
SMD biscuit real-time status whether in place.As the further improvement in practice, each material box and detection can also be passed
Sensor preset numbers and the corresponding specific location of different numbers, quickly to position and find out material box by intelligent controller
Specific location.
SMD biscuit state monitoring apparatus in place of the present invention can be kept away for monitoring whether SMD biscuit is loaded in material box
Exempt from mistake of the SMD biscuit in fetching process to pick and place, thus the material issuance mistake for avoiding SMT from producing.
Embodiment described above is only to absolutely prove preferred embodiment that is of the invention and being lifted, protection model of the invention
It encloses without being limited thereto.Those skilled in the art's made equivalent substitute or transformation on the basis of the present invention, in the present invention
Protection scope within.Protection scope of the present invention is subject to claims.
Claims (4)
1. a kind of SMD biscuit state monitoring apparatus in place, it is characterised in that: including material box, detection sensor and intelligent control
Device, the detection sensor are electrically connected with the intelligent controller, and the detection sensor includes infrared transmitting tube and infrared connects
Closed tube, the infrared transmitting tube are equipped with the surface of the material box, the relatively described infrared transmitting tube peace of the infrared receiving tube
Bottom in the material box, the infrared receiving tube receive the infrared signal that infrared transmitting tube is issued.
2. SMD biscuit state monitoring apparatus in place according to claim 1, it is characterised in that: the material box is upside
The box-like structure of opening, the infrared transmitting tube are located at the overthe openings of material box.
3. SMD biscuit state monitoring apparatus in place according to claim 2, it is characterised in that: the quantity of the material box
To be multiple, multiple material box is set side by side.
4. SMD biscuit state monitoring apparatus in place according to claim 3, it is characterised in that: the infrared transmitting tube and
The quantity of the infrared receiving tube is equal with material box, i.e., is all correspondingly provided with the infrared transmitting tube and institute for each material box
State infrared receiving tube.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201811409513.2A CN109343141A (en) | 2018-11-23 | 2018-11-23 | A kind of SMD biscuit state monitoring apparatus in place |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201811409513.2A CN109343141A (en) | 2018-11-23 | 2018-11-23 | A kind of SMD biscuit state monitoring apparatus in place |
Publications (1)
Publication Number | Publication Date |
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CN109343141A true CN109343141A (en) | 2019-02-15 |
Family
ID=65317670
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201811409513.2A Pending CN109343141A (en) | 2018-11-23 | 2018-11-23 | A kind of SMD biscuit state monitoring apparatus in place |
Country Status (1)
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CN (1) | CN109343141A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110031912A (en) * | 2019-05-27 | 2019-07-19 | 深圳市瑞微智能有限责任公司 | A kind of jamproof material detection method and system |
CN110501754A (en) * | 2019-09-26 | 2019-11-26 | 浪潮商用机器有限公司 | A kind of PCBA backboard locking screw situation device for fast detecting in place |
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CN203325142U (en) * | 2013-07-23 | 2013-12-04 | 徐建平 | Intelligent prompting paper extraction box |
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WO2017177487A1 (en) * | 2016-04-14 | 2017-10-19 | 天津视讯云光电科技有限公司 | Mirror-based transmission-type cod detection apparatus |
CN207280552U (en) * | 2017-09-28 | 2018-04-27 | 天津天河分析仪器有限公司 | A kind of reagent bottle liquid level sensor |
CN108008701A (en) * | 2016-10-31 | 2018-05-08 | 中车大同电力机车有限公司 | A kind of photosensitive completion real time monitoring subsystem |
CN208070810U (en) * | 2018-02-05 | 2018-11-09 | 深圳市欧盛自动化有限公司 | Pick and place material robot device |
CN208902895U (en) * | 2018-11-23 | 2019-05-24 | 重庆盟讯电子科技有限公司 | A kind of SMD biscuit state monitoring apparatus in place |
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2018
- 2018-11-23 CN CN201811409513.2A patent/CN109343141A/en active Pending
Patent Citations (8)
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EP2634094A1 (en) * | 2012-02-28 | 2013-09-04 | Jan Lödige | System for loading containers |
CN203325142U (en) * | 2013-07-23 | 2013-12-04 | 徐建平 | Intelligent prompting paper extraction box |
CN205362014U (en) * | 2016-01-26 | 2016-07-06 | 河源职业技术学院 | Infrared matrix position discernment sorting device |
WO2017177487A1 (en) * | 2016-04-14 | 2017-10-19 | 天津视讯云光电科技有限公司 | Mirror-based transmission-type cod detection apparatus |
CN108008701A (en) * | 2016-10-31 | 2018-05-08 | 中车大同电力机车有限公司 | A kind of photosensitive completion real time monitoring subsystem |
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Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110031912A (en) * | 2019-05-27 | 2019-07-19 | 深圳市瑞微智能有限责任公司 | A kind of jamproof material detection method and system |
CN111983713A (en) * | 2019-05-27 | 2020-11-24 | 深圳市瑞微智能有限责任公司 | Anti-interference material detection method |
CN111983712A (en) * | 2019-05-27 | 2020-11-24 | 深圳市瑞微智能有限责任公司 | Anti-interference material detection method |
CN110031912B (en) * | 2019-05-27 | 2021-03-23 | 深圳市瑞微智能有限责任公司 | Anti-interference material detection method |
CN111983712B (en) * | 2019-05-27 | 2022-03-29 | 深圳市瑞微智能有限责任公司 | Anti-interference material detection method |
CN111983713B (en) * | 2019-05-27 | 2022-03-29 | 深圳市瑞微智能有限责任公司 | Anti-interference material detection method |
CN110501754A (en) * | 2019-09-26 | 2019-11-26 | 浪潮商用机器有限公司 | A kind of PCBA backboard locking screw situation device for fast detecting in place |
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