CN109326712B - Preparation method of flexible substrate, flexible substrate and display panel - Google Patents
Preparation method of flexible substrate, flexible substrate and display panel Download PDFInfo
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- CN109326712B CN109326712B CN201811237421.0A CN201811237421A CN109326712B CN 109326712 B CN109326712 B CN 109326712B CN 201811237421 A CN201811237421 A CN 201811237421A CN 109326712 B CN109326712 B CN 109326712B
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/80—Manufacture or treatment specially adapted for the organic devices covered by this subclass using temporary substrates
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
- H10K77/10—Substrates, e.g. flexible substrates
- H10K77/111—Flexible substrates
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
Abstract
The invention provides a preparation method of a flexible substrate, the flexible substrate and a display panel. The preparation method comprises the following steps: forming a pattern of a partial euphotic layer on one side surface of the carrier plate; forming a flexible substrate base film on the other side surface of the carrier plate; stripping the base film of the flexible substrate from the carrier plate by a light stripping method by using a part of the light transmission layer as a mask plate to form a stripped surface pattern of the flexible substrate; the energy of the stripping light irradiated on the carrier plate through part of the light transmission layer is less than that of the stripping light irradiated on the carrier plate through part of the light transmission layer. According to the preparation method, in the process of stripping the flexible substrate base film from the carrier plate, the stripping light irradiated on the carrier plate has different energy between the part of the light transmission layer and the part of the light transmission layer which is not transmitted, so that after the flexible substrate base film is separated from the carrier plate, a stripping surface pattern can be formed on the stripping surface of the flexible substrate, the local thinning of the flexible substrate is realized by the stripping surface pattern, and further the flexible substrate can realize the bending deformation with smaller radius.
Description
Technical Field
The invention relates to the technical field of display, in particular to a preparation method of a flexible substrate, the flexible substrate and a display panel.
Background
To achieve the application of flexible OLED display panels in small bending radii, the existing solutions are usually inorganic film layers that reduce the ceramic brittleness of the OLED display panel as much as possible; or each functional film layer is thinned to weaken the stress in bending; or thinning the thickest backing film in the flexible structure. The thinning difficulty of the functional film layer is very high, the thinning always has limited thickness on the premise of not influencing the characteristics, the unlimited thinning cannot be realized, and the same is true for the back film thinning.
In addition, in the substrate transfer process of a series of preparation processes of the OLED display panel, the glass carrier plate inevitably generates static electricity under friction, and the static electricity accumulation can generate serious damage to the TFT device and even has the risk of breaking down the TFT.
Disclosure of Invention
The invention provides a preparation method of a flexible substrate, the flexible substrate and a display panel, aiming at the technical problems in the prior art. According to the preparation method of the flexible substrate, in the process that the base film of the flexible substrate is peeled from the carrier plate, the energy of the peeling light irradiated on the carrier plate and penetrating through part of the light transmission layer is different from the energy of the peeling light not penetrating through part of the light transmission layer, so that after the base film of the flexible substrate is separated from the carrier plate, a peeling surface pattern can be formed on the peeling surface of the flexible substrate, the local thinning of the flexible substrate is realized by the peeling surface pattern, and the flexible substrate can be bent and deformed in a smaller radius.
The invention provides a preparation method of a flexible substrate, which comprises the following steps:
forming a pattern of a partial euphotic layer on one side surface of the carrier plate;
forming a flexible substrate base film on the other side surface of the carrier plate;
stripping the flexible substrate base film from the carrier plate by adopting the partial light transmission layer as a mask plate through a light stripping method to form a stripped surface pattern of the flexible substrate; the energy of the stripping light irradiated on the carrier plate through the partial light transmission layer is less than that of the stripping light irradiated on the carrier plate without penetrating through the partial light transmission layer.
Preferably, the method of light lift-off comprises laser lift-off; the partial light-transmitting layer is made of a conductive material.
Preferably, the partially light transmitting layer comprises one or more layers of conductive material; the conductive material layer is an indium tin oxide layer, a silver layer, a titanium layer, an aluminum layer or a molybdenum layer, and the partial light-transmitting layer is any one of the conductive material layer or a combination of multiple conductive material layers.
Preferably, the partially light-transmitting layer has a thickness in the range of
Preferably, the partially transparent layer includes a plurality of sub-patterns arranged at intervals along the deformation direction of the flexible substrate.
Preferably, along the deformation direction of the flexible substrate, the deformation degrees of different positions of the flexible substrate are different, correspondingly, the widths of the sub-patterns corresponding to different positions of the flexible substrate along the deformation direction of the flexible substrate are different, and the widths of the sub-patterns corresponding to the positions of the flexible substrate with larger deformation degrees are narrower.
Preferably, the shape of the sub-figure includes a straight bar shape, a curved bar shape, a grid shape, a rectangular shape, a circular shape, or an oval shape.
Preferably, the length direction of the straight-bar-shaped subpattern is perpendicular to the deformation direction of the flexible substrate.
Preferably, before peeling the flexible substrate base film from the carrier sheet, the method further comprises: and forming a display structure on one side of the flexible substrate base film, which is far away from the carrier plate.
The invention also provides a flexible substrate prepared by the preparation method of the flexible substrate, which comprises a flexible substrate, wherein an auxiliary deformation structure is formed on the stripping surface of the flexible substrate, the auxiliary deformation structure is a stripping surface pattern formed on the stripping surface of the flexible substrate, and the auxiliary deformation structure can assist the flexible substrate in deformation.
Preferably, the auxiliary deformation structure includes a plurality of grooves or protrusions, and the plurality of grooves or protrusions are arranged along the deformation direction of the flexible substrate.
Preferably, the depth range of the groove is 100-1500 nm; the height range of the protrusions is 100-1500 nm.
The invention also provides a display panel which comprises the flexible substrate.
The invention has the beneficial effects that: according to the preparation method of the flexible substrate, the pattern of the partial light transmission layer is formed on one side of the carrier plate, which is far away from the base film of the flexible substrate, and in the process of stripping the base film of the flexible substrate from the carrier plate, the energy of stripping light irradiated on the carrier plate, which penetrates through the partial light transmission layer, is different from the energy of the partial light transmission layer, so that after the base film of the flexible substrate is separated from the carrier plate, a stripping surface pattern can be formed on the stripping surface of the flexible substrate, the stripping surface pattern realizes the local thinning of the flexible substrate, and further the flexible substrate can realize the bending deformation with smaller radius.
The flexible substrate provided by the invention is prepared by adopting the preparation method, and an auxiliary deformation structure can be formed on the stripping surface of the flexible substrate, so that the deformation stress of the flexible substrate along the deformation direction of the flexible substrate is well dispersed, the deformation performance of the flexible substrate along the deformation direction of the flexible substrate is greatly improved, and the flexible substrate can realize bending deformation with smaller radius.
According to the display panel provided by the invention, by adopting the flexible substrate, the display panel can realize bending deformation with smaller radius.
Drawings
Fig. 1 is a schematic structural diagram of a flexible substrate after step 2) is completed in embodiment 2 of the present invention;
fig. 2 is a schematic view of a light stripping process performed on the flexible substrate after the step 2) in embodiment 2 of the present invention;
fig. 3 is a schematic structural diagram of the flexible substrate formed after step 3) in embodiment 2 of the present invention;
fig. 4 is a schematic structural view of a partial light-transmitting layer in embodiment 2 of the present invention;
fig. 5 is a schematic view of another structure of a partially transparent layer in embodiment 2 of the present invention;
fig. 6 is a schematic view of another structure of a partially transparent layer in embodiment 2 of the present invention;
fig. 7 is a schematic view of another structure of a partially transparent layer in embodiment 2 of the present invention;
fig. 8 is a schematic view of another structure of a partially transparent layer in embodiment 2 of the present invention;
fig. 9 is a schematic view of another structure of a partially transparent layer in embodiment 2 of the present invention;
FIG. 10 is a schematic view of the flexible substrate of FIG. 3 deformed in its deformation direction;
fig. 11 is a schematic view of another structure of the flexible substrate formed before step 3) is performed in embodiment 2 of the present invention;
fig. 12 is a schematic structural diagram of the flexible substrate formed after step 3) in fig. 11 is completed.
Wherein the reference numbers indicate:
1. a carrier plate; 2. a partially light transmitting layer; 21. a sub-pattern; 3. a flexible substrate base film; 4. a flexible substrate; 41. stripping surface patterns; l, deformation direction of the flexible substrate; 5. and displaying the structure.
Detailed Description
In order to make those skilled in the art better understand the technical solution of the present invention, the following describes a method for manufacturing a flexible substrate, and a display panel in detail with reference to the accompanying drawings and the detailed description.
Example 1:
the embodiment provides a method for preparing a flexible substrate, which includes:
and forming a pattern of a partial light-transmitting layer on one side surface of the carrier plate.
And forming a flexible substrate base film on the other side of the carrier plate.
Stripping the base film of the flexible substrate from the carrier plate by a light stripping method by using a part of the light transmission layer as a mask plate to form a stripped surface pattern of the flexible substrate; the energy of the stripping light irradiated on the carrier plate through part of the light transmission layer is less than that of the stripping light irradiated on the carrier plate through part of the light transmission layer.
The peeling method and the principle for peeling the flexible substrate base film from the carrier plate by the light peeling method are as follows: when light is stripped, stripping light is directly incident to the surface of the carrier plate where the partial light transmission layer is located, and the stripping light passes through the carrier plate and then irradiates the stripping surface of the base film of the flexible substrate. The stripping surface of the flexible substrate base film is chemically modified under the irradiation of stripping light, and the surface layer of the flexible substrate base film in contact with the carrier plate is carbonized and damaged, so that the flexible substrate base film is separated from the carrier plate. Meanwhile, because the energy of stripping light irradiated on the carrier plate through part of the light transmitting layer is less than that of the stripping light irradiated on the carrier plate through part of the light transmitting layer, the carbonization damage of the region of the flexible substrate base film stripping surface corresponding to part of the light transmitting layer is shallow, and the carbonization damage of the region of the flexible substrate base film stripping surface not corresponding to part of the light transmitting layer is deep, so that stripping surface patterns with different carbonization damage degrees are formed on the stripping surface of the flexible substrate base film.
The method can be used for conventional adoption when the thickness of each film layer in the flexible substrate is not specifically required, and can also be used for adoption when the thickness of each film layer in the flexible substrate is reduced to the limit thickness, and the flexible substrate can be locally reduced by the stripping surface pattern, so that the deformation performance of the flexible substrate is improved, and the flexible substrate can be bent and deformed with smaller radius.
According to the preparation method of the flexible substrate, the pattern of the partial light transmission layer is formed on one side face of the carrier plate, which is far away from the base film of the flexible substrate, in the process that the base film of the flexible substrate is stripped from the carrier plate, the energy of stripping light irradiating the carrier plate and penetrating through the partial light transmission layer is different from the energy of the partial light transmission layer, so that after the base film of the flexible substrate is separated from the carrier plate, a stripping face pattern can be formed on the stripping face of the flexible substrate, the local thinning of the flexible substrate is realized by the stripping face pattern, and the flexible substrate can be bent and deformed in a smaller radius.
Example 2:
the present embodiment provides a method for manufacturing a flexible substrate, as shown in fig. 1 to 3, including:
step 1): a pattern of a partially transparent layer 2 is formed on one side of the carrier 1.
Step 2): a flexible substrate base film 3 is formed on the other side of the carrier board 1.
Step 3): stripping the flexible substrate base film 3 from the carrier plate by adopting a partial euphotic layer 2 as a mask plate through a light stripping method to form a stripping surface pattern 41 of the flexible substrate 4; the energy of the stripping light irradiated to the carrier plate 1 through the partial transparent layer 2 is less than that of the stripping light irradiated to the carrier plate 1 through the partial transparent layer 2.
In this embodiment, the above method is adopted when the thickness of each film layer in the flexible substrate is reduced to the limit thickness, and the peel-off pattern 41 enables the flexible substrate 4 to be locally further reduced on the basis of the original limit thickness, so as to further improve the deformation performance of the flexible substrate 4, and further enable the flexible substrate to realize bending deformation with a smaller radius.
The light stripping method comprises laser stripping; the partially light-transmitting layer 2 is made of a conductive material. The partially transparent layer 2 formed by the conductive material can release static electricity accumulated in the transfer of the carrier plate 1 in a plurality of preparation processes of the flexible substrate, so that damage to a display structure in the flexible substrate caused by the static electricity is avoided. When in laser stripping, the laser energy can be selected from 50-400 mJ/cm 2 The energy density of (1).
Preferably, the partially light transmitting layer 2 comprises a layer of conductive material; the conductive material layer is an indium tin oxide layer, a silver layer, a titanium layer, an aluminum layer or a molybdenum layer, and the partially light-transmitting layer 2 is any one of the conductive material layers. A part of the stripping light irradiated on the partial light-transmitting layer 2 is reflected, and the other part of the stripping light is transmitted through the carrier plate 1, so that the energy of the stripping light irradiated on the carrier plate 1 through the partial light-transmitting layer 2 is less than that of the stripping light irradiated on the carrier plate 1 through the partial light-transmitting layer 2.
Note that, the partially light-transmitting layer 2 may also include a plurality of conductive material layers; the conductive material layer is an indium tin oxide layer, a silver layer, a titanium layer, an aluminum layer or a molybdenum layer, and the partially light-transmitting layer 2 is a combination of various conductive material layers. In addition, the partially light-transmitting layer 2 may be made of other conductive materials having a partially light-transmitting property.
The partial euphotic layer 2 is formed on the carrier plate 1 by magnetron sputtering, and then patterning of the partial euphotic layer 2 is realized by the technological methods of exposure, development and etching, which are all conventional preparation methods and are not described in detail. The material of the flexible base film 3 is polyimide, polyethylene terephthalate, polyethylene naphthalate, or the like.
Preferably, the partially light-transmitting layer 2 has a thickness in the range of
The thickness range is set so as to ensure that the laser light partially transmits through the partially light-transmitting layer 2.
Preferably, the partially transparent layer 2 includes a plurality of sub-patterns 21 arranged at intervals along the deformation direction of the flexible substrate. The plurality of sub-patterns 21 arranged at intervals along the deformation direction of the flexible substrate enable the stripping surface patterns 41 formed on the stripping surface of the flexible substrate 4 to be also arranged at intervals along the deformation direction of the flexible substrate, so that the flexible substrate 4 can well disperse the deformation stress of the flexible substrate along the deformation direction of the flexible substrate, the deformation performance of the flexible substrate 4 along the deformation direction of the flexible substrate is greatly improved, and the flexible substrate can realize bending deformation with smaller radius.
Further preferably, as shown in fig. 4, the degree of deformation of the flexible substrate at different positions along the deformation direction L of the flexible substrate is different, accordingly, the width d of the sub-pattern 21 along the deformation direction L of the flexible substrate at different positions is different, and the width d of the sub-pattern 21 is narrower at a position where the degree of deformation of the flexible substrate is greater. The width d of the sub-patterns 21 at different positions along the flexible substrate deformation direction L is different, so that the peel-off pattern 41 formed on the peel-off surface of the flexible substrate 4 also has the characteristics, the flexible substrate 4 can better disperse the deformation stress of the flexible substrate along the flexible substrate deformation direction L, the deformation performance of the flexible substrate 4 along the flexible substrate deformation direction L is further improved, and the flexible substrate can realize bending deformation with smaller radius.
Preferably, the sub-pattern 21 has a straight bar shape (as shown in fig. 1 and 4). It should be noted that the shape of the sub-pattern 21 may also be a curved strip (as shown in fig. 5), a grid (as shown in fig. 6), a rectangle (as shown in fig. 7), a circle (as shown in fig. 8), or an ellipse (as shown in fig. 9). Of course, the shape of the sub-pattern 21 may be other shapes.
Further preferably, as shown in fig. 1, the longitudinal direction of the straight bar-shaped sub pattern 21 is perpendicular to the deformation direction L of the flexible substrate. Thus, the peeling surface pattern 41 on the peeling surface of the flexible substrate 4 can better disperse the deformation stress of the flexible substrate 4 along the flexible substrate deformation direction L (as shown in fig. 10), so that the deformation performance of the flexible substrate 4 along the flexible substrate deformation direction L is further improved, and the flexible substrate can realize bending deformation with smaller radius.
In this embodiment, as shown in fig. 11, before peeling the flexible substrate base film 3 from the carrier sheet 1, the method further includes: a display structure 5 is formed on the side of the flexible substrate base film 3 facing away from the carrier plate 1.
The display structure 5 includes a TFT device layer, a planarization layer, an anode layer, a light emitting layer, a cathode layer, an organic encapsulation film layer, and an inorganic encapsulation film layer, which are sequentially formed on the flexible substrate base film 3 on a side away from the carrier 1. The preparation method of each film layer in the structure 5 is a conventional mature preparation method, and details are not repeated.
It should be noted that, the planarization layer and the inorganic encapsulation film layer may also be formed with a structure capable of locally thinning the planarization layer by exposure development or exposure dry etching, and the organic encapsulation film layer may also be formed with a locally thinned structure by a specific printing process, for example, forming a recess of any shape on the surface layers of the planarization layer, the inorganic encapsulation film layer, and the organic encapsulation film layer. Thus, the flexible substrate can be bent and deformed with smaller radius.
According to the preparation method of the flexible substrate, the pattern of the partial light transmission layer is formed on one side face of the carrier plate, which is far away from the base film of the flexible substrate, in the process that the base film of the flexible substrate is stripped from the carrier plate, the energy of stripping light irradiating the carrier plate and penetrating through the partial light transmission layer is different from the energy of the partial light transmission layer, so that after the base film of the flexible substrate is separated from the carrier plate, a stripping face pattern can be formed on the stripping face of the flexible substrate, the local thinning of the flexible substrate is realized by the stripping face pattern, and the flexible substrate can be bent and deformed in a smaller radius.
Based on the above method for manufacturing a flexible substrate, this embodiment further provides a flexible substrate manufactured by the manufacturing method, as shown in fig. 12, the flexible substrate includes a flexible substrate 4, an auxiliary deformation structure is formed on a peeling surface of the flexible substrate 4, the auxiliary deformation structure is a peeling surface pattern 41 formed on the peeling surface of the flexible substrate 4, and the auxiliary deformation structure can assist the flexible substrate in deforming.
In this embodiment, the auxiliary deformation structure includes a plurality of grooves or protrusions, and the plurality of grooves or protrusions are arranged along the deformation direction of the flexible substrate. The arrangement of the grooves or the bulges can well disperse the deformation stress of the flexible substrate 4 along the deformation direction of the flexible substrate, so that the deformation performance of the flexible substrate 4 along the deformation direction of the flexible substrate is greatly improved, and the flexible substrate can realize the bending deformation with smaller radius.
Preferably, the depth range of the groove is 100-1500 nm; the height of the protrusions ranges from 100 nm to 1500nm.
This flexible substrate through form supplementary deformation structure on the face of peeling off at the flexible substrate, can disperse the deformation stress of flexible substrate along flexible substrate deformation direction well to make the flexible substrate improve along the deformability of flexible substrate deformation direction greatly, and then make the flexible substrate can realize the deformation of buckling of less radius.
Example 3:
the present embodiment provides a display panel including the flexible substrate in embodiment 2.
By adopting the flexible substrate in embodiment 2, the display panel can realize bending deformation with a smaller radius.
The display panel provided by the invention can be any product or component with a display function, such as an OLED panel, an OLED television, a display, a mobile phone, a navigator and the like.
It will be understood that the above embodiments are merely exemplary embodiments taken to illustrate the principles of the present invention, which is not limited thereto. It will be apparent to those skilled in the art that various modifications and improvements can be made without departing from the spirit and substance of the invention, and these modifications and improvements are also considered to be within the scope of the invention.
Claims (10)
1. A method for manufacturing a flexible substrate, comprising:
forming a pattern of a partial light-transmitting layer on one side surface of the carrier plate;
forming a flexible substrate base film on the other side surface of the carrier plate;
stripping the flexible substrate base film from the carrier plate by adopting the partial light transmission layer as a mask plate through a light stripping method to form a stripped surface pattern of the flexible substrate; the energy of stripping light irradiated on the carrier plate through the partial light-transmitting layer is less than that of the stripping light irradiated on the carrier plate not through the partial light-transmitting layer;
the partial light-transmitting layer comprises a plurality of sub-patterns which are arranged at intervals along the deformation direction of the flexible substrate;
along the deformation direction of the flexible substrate, the deformation degrees of different positions of the flexible substrate are different, correspondingly, the widths of the sub-patterns corresponding to different positions of the flexible substrate along the deformation direction of the flexible substrate are different, and the widths of the sub-patterns corresponding to the positions of the flexible substrate with larger deformation degrees are narrower;
the light stripping method comprises laser stripping; the partial light-transmitting layer is made of a conductive material.
2. The method according to claim 1, wherein the partially light-transmitting layer comprises one or more layers of conductive material; the conductive material layer is an indium tin oxide layer, a silver layer, a titanium layer, an aluminum layer or a molybdenum layer, and the partial light-transmitting layer is any one of the conductive material layer or a combination of multiple conductive material layers.
3. The method according to claim 2, wherein the partially light-transmitting layer has a thickness in a range of
4. The method of claim 1, wherein the shape of the sub-pattern comprises a straight strip shape, a curved strip shape, a grid shape, a rectangular shape, a circular shape, or an oval shape.
5. The method of claim 4, wherein the length direction of the straight sub-patterns is perpendicular to the deformation direction of the flexible substrate.
6. The method for manufacturing a flexible substrate according to claim 1, further comprising before peeling the flexible substrate base film from the carrier sheet: and forming a display structure on one side of the flexible substrate base film, which is far away from the carrier plate.
7. A flexible substrate manufactured by the method for manufacturing a flexible substrate according to any one of claims 1 to 6, comprising a flexible substrate, wherein an auxiliary deformation structure is formed on a peeling surface of the flexible substrate, the auxiliary deformation structure is a peeling surface pattern formed on the peeling surface of the flexible substrate, and the auxiliary deformation structure can assist the flexible substrate in deforming.
8. The flexible substrate of claim 7, wherein the auxiliary deformation structure comprises a plurality of grooves or protrusions, and the plurality of grooves or protrusions are arranged along a deformation direction of the flexible substrate.
9. The flexible substrate of claim 8, wherein the depth of the groove ranges from 100 nm to 1500nm; the height range of the protrusions is 100-1500 nm.
10. A display panel comprising the flexible substrate according to any one of claims 7 to 9.
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| CN111724681A (en) * | 2020-06-09 | 2020-09-29 | 武汉华星光电半导体显示技术有限公司 | Substrate, preparation method thereof and display panel |
| CN112086571A (en) * | 2020-09-09 | 2020-12-15 | 武汉华星光电半导体显示技术有限公司 | Flexible display module |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105870355A (en) * | 2016-05-27 | 2016-08-17 | 京东方科技集团股份有限公司 | Flexible OLED device and preparation method thereof |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW586231B (en) * | 2001-07-24 | 2004-05-01 | Seiko Epson Corp | Transfer method, methods of manufacturing thin film devices and integrated circuits, circuit board and manufacturing method thereof, electro-optical apparatus and manufacturing method thereof, manufacturing methods of IC card and electronic appliance |
| US7220627B2 (en) * | 2003-04-21 | 2007-05-22 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing a semiconductor device where the scanning direction changes between regions during crystallization and process |
| JP2006201538A (en) * | 2005-01-21 | 2006-08-03 | Seiko Epson Corp | Mask, manufacturing method of the mask, pattern forming method and wiring pattern forming method |
| FR2903810B1 (en) * | 2006-07-13 | 2008-10-10 | Commissariat Energie Atomique | METHOD FOR NANOSTRUCTURING THE SURFACE OF A SUBSTRATE |
| US8420978B2 (en) * | 2007-01-18 | 2013-04-16 | The Board Of Trustees Of The University Of Illinois | High throughput, low cost dual-mode patterning method for large area substrates |
| US8546067B2 (en) * | 2008-03-21 | 2013-10-01 | The Board Of Trustees Of The University Of Illinois | Material assisted laser ablation |
| CN103887157B (en) * | 2014-03-12 | 2021-08-27 | 京东方科技集团股份有限公司 | Optical mask plate and laser stripping device |
| CN104143565B (en) * | 2014-07-28 | 2017-11-10 | 京东方科技集团股份有限公司 | A kind of flexible display substrates and preparation method thereof and display device |
| US9397001B2 (en) * | 2014-12-11 | 2016-07-19 | Panasonic Intellectual Property Management Co., Ltd. | Method for manufacturing electronic device comprising a resin substrate and an electronic component |
| CN106115681A (en) * | 2016-07-11 | 2016-11-16 | 浙江工业大学 | One realizes the patterned method of two-dimensional material |
| CN106340523B (en) * | 2016-10-25 | 2019-08-06 | 厦门天马微电子有限公司 | A kind of flexible display panels and preparation method thereof, flexible display apparatus |
| CN106910678B (en) * | 2017-03-09 | 2019-05-21 | 华中科技大学 | Patterned mask version, preparation method and the method for carrying out laser lift-off using it |
| CN107644891A (en) * | 2017-09-13 | 2018-01-30 | 武汉华星光电半导体显示技术有限公司 | The preparation method of flexible OLED panel |
| CN107978687B (en) * | 2017-11-22 | 2020-06-05 | 武汉华星光电半导体显示技术有限公司 | Preparation method of flexible OLED display panel |
| CN108461630B (en) * | 2018-03-03 | 2022-08-16 | 昆山国显光电有限公司 | Flexible display substrate, display panel, display device and manufacturing method thereof |
-
2018
- 2018-10-23 CN CN201811237421.0A patent/CN109326712B/en active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105870355A (en) * | 2016-05-27 | 2016-08-17 | 京东方科技集团股份有限公司 | Flexible OLED device and preparation method thereof |
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