CN109148730A - Display panel and its manufacturing method, display device - Google Patents
Display panel and its manufacturing method, display device Download PDFInfo
- Publication number
- CN109148730A CN109148730A CN201811037109.7A CN201811037109A CN109148730A CN 109148730 A CN109148730 A CN 109148730A CN 201811037109 A CN201811037109 A CN 201811037109A CN 109148730 A CN109148730 A CN 109148730A
- Authority
- CN
- China
- Prior art keywords
- electrode layer
- underlay substrate
- layer
- reflection
- reflection electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/805—Electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/85—Arrangements for extracting light from the devices
- H10K50/856—Arrangements for extracting light from the devices comprising reflective means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
Abstract
The present invention provides a kind of display panel and its manufacturing methods, display device, belong to field of display technology.The display panel includes: the reflection electrode layer being stacked on underlay substrate, organic luminous layer and transparent electrode layer, the reflection electrode layer is for reflecting the light for exposing to surface of the reflection electrode layer far from the underlay substrate, and the transparent electrode layer is for transmiting the light for exposing to the transparent electrode layer；Wherein, surface concave-convex surface of the reflection electrode layer far from the underlay substrate.The present invention improves the light extraction efficiency of display panel.The present invention is for showing image.
Description
Technical field
The present invention relates to field of display technology, in particular to a kind of display panel and its manufacturing method, display device.
Background technique
Organic Light Emitting Diode (English: Organic Light-Emitting Diode；Referred to as: OLED) display panel packet
Include the anode, organic luminous layer and cathode being sequentially overlapped.Also, compared to bottom emitting OLED display panel (organic luminous layer hair
Light out is projected from the anode-side of display panel), since (light that organic luminous layer issues is from display for top emitting OLED display panel
The cathode side of panel projects) have the characteristics that biggish aperture opening ratio and higher display excitation purity, so that top emitting OLED is shown
Panel has preferable development prospect.
In the related technology, the anode of top emitting OLED display panel is usually smooth table close to the surface of organic luminous layer
Face.Also, in order to which the light for guaranteeing that organic luminous layer issues can be used effectively, the anode is usually by leading with reflection action
Electric material is made, i.e., the anode in top emitting OLED display panel is usually reflection anode.
But the reflection anode, when reflecting light, reflected light can generate dry with the light that organic luminous layer issues
It relates to, causes the light extraction efficiency of the top emitting OLED display panel lower.
Summary of the invention
The present invention provides a kind of display panel and its manufacturing method, display device, top hair in the related technology can solve
Penetrate the lower problem of the light extraction efficiency of OLED.The technical solution is as follows:
In a first aspect, providing a kind of display panel, the display panel includes:
It is stacked reflection electrode layer, organic luminous layer and transparent electrode layer on underlay substrate, the reflecting electrode
Layer is for reflecting the light for exposing to surface of the reflection electrode layer far from the underlay substrate, the transparent electrode layer
For the light for exposing to the transparent electrode layer to be transmitted；
Wherein, surface concave-convex surface of the reflection electrode layer far from the underlay substrate.
Optionally, the display panel further include: first electrode layer and the second electrode lay；
The first electrode layer is arranged between the reflection electrode layer and the underlay substrate, and the second electrode lay is set
It sets between the reflection electrode layer and the organic luminous layer, the first electrode layer and the second electrode lay are used for institute
It states reflection electrode layer and forms anti-oxidation protection.
Optionally, the reflection electrode layer is provided with multiple concave points and multiple salient points far from the surface of the underlay substrate,
The reflection electrode layer is close to the surface of the underlay substrate to the distance of the concave point are as follows: 50 nanometers to 1000 nanometers；
The difference in height of the concave point and the salient point are as follows: 200 nanometers to 1000 nanometers；
The spacing of adjacent salient point are as follows: 500 nanometers to 20 microns.
Second aspect provides a kind of manufacturing method of display panel, which comprises
One underlay substrate is provided；
Reflection electrode layer is formed on the underlay substrate, the reflection electrode layer will be for that will expose to the reflecting electrode
The light on surface of the layer far from the underlay substrate is reflected, and surface of the reflection electrode layer far from the underlay substrate is in recessed
Convex；
Organic luminous layer is formed on the underlay substrate for being formed with the reflection electrode layer；
Transparent electrode layer is formed on the underlay substrate for being formed with the organic luminous layer, the transparent electrode layer is used for will
The light for exposing to the transparent electrode layer is transmitted.
Optionally, it is formed before reflection electrode layer on the underlay substrate, the method also includes:
First electrode layer is formed on the underlay substrate, the first electrode layer is for forming the reflection electrode layer
Anti-oxidation protection；
It is described to form reflection electrode layer on the underlay substrate, comprising:
The reflection electrode layer is formed on the underlay substrate for being formed with the first electrode layer；
It is formed after reflection electrode layer on the underlay substrate, the method also includes:
Form the second electrode lay on the underlay substrate for being formed with the reflection electrode layer, the second electrode lay for pair
The reflection electrode layer forms anti-oxidation protection；
It is described to form organic luminous layer on the underlay substrate for being formed with the reflection electrode layer, comprising:
The organic luminous layer is formed on the underlay substrate for being formed with the second electrode lay.
Optionally, reflection electrode layer is formed on the underlay substrate, comprising:
Reflecting electrode film layer is formed on the underlay substrate；
The reflecting electrode film layer is heated, wherein the heating that the reflecting electrode film layer is heated
Temperature is greater than the glass transition temperature of the reflecting electrode film layer；
Compacting tool set is pressed into the reflecting electrode film layer, so that the reflecting electrode film layer is far from the substrate base
The surface of plate is in described concavo-convex；
Cool down to the reflecting electrode film layer；
After the temperature of the reflecting electrode film layer is lower than the glass transition temperature, the compacting tool set is removed,
Obtain the reflection electrode layer.
Optionally, reflection electrode layer is formed on the underlay substrate, comprising:
Reflecting electrode film layer is formed on the underlay substrate；
Photoetching agent pattern is formed on the underlay substrate for being formed with the reflecting electrode film layer；
The reflecting electrode film layer for being formed with the photoetching agent pattern to surface performs etching, so that the reflecting electrode is thin
Surface of the film layer far from the underlay substrate obtains the reflection electrode layer in described concavo-convex；
Remove the photoetching agent pattern.
Optionally, reflection electrode layer is formed on the underlay substrate, comprising:
Using inkjet printing technology, by the first solution ink-jet dissolved with electrode material on the underlay substrate, with shape
At the first reflecting electrode film layer；
Using inkjet printing technology, by the second solution ink-jet dissolved with the electrode material in first reflecting electrode
Film layer forms the second reflecting electrode film layer, obtains including that first reflecting electrode is thin far from the surface of underlay substrate
The reflection electrode layer of film layer and the second reflecting electrode film layer, surface of the reflection electrode layer far from the underlay substrate
In described concavo-convex；
Wherein, the concentration of first solution is greater than the concentration of second solution, and/or, the first ink droplet spacing is less than
The second ink droplet spacing, the first ink droplet spacing are that first solution is injected between the ink droplet on the underlay substrate
Away from the second ink droplet spacing is that second solution is injected in the table of the first reflecting electrode film layer far from underlay substrate
Ink droplet spacing on face.
Optionally, the reflection electrode layer is made of silver, aluminium, magnesium or titanium.
The third aspect, provides a kind of display device, and the display device includes any display panel of first aspect.
Display panel provided in an embodiment of the present invention and its manufacturing method, display device, since reflection electrode layer is far from lining
The surface concave-convex surface of substrate, when the reflection electrode layer reflects light, the surface of the concave-convex surface be can reduce pair
The regularity of the reflection of light, the light for reducing reflected light and organic luminous layer sending generates the probability interfered, compared to phase
Pass technology efficiently reduces the influence for the light that the reflected light issues organic luminous layer, issues organic luminous layer
Light can be more emitted, and improve the light extraction efficiency of display panel.
Detailed description of the invention
To describe the technical solutions in the embodiments of the present invention more clearly, make required in being described below to embodiment
Attached drawing is briefly described, it should be apparent that, drawings in the following description are only some embodiments of the invention, for
For those of ordinary skill in the art, without creative efforts, it can also be obtained according to these attached drawings other
Attached drawing.
Fig. 1 is a kind of structural schematic diagram of display panel provided in an embodiment of the present invention.
Fig. 2 is the structural schematic diagram of another display panel provided in an embodiment of the present invention.
Fig. 3 is a kind of flow chart of the manufacturing method of display panel provided in an embodiment of the present invention.
Fig. 4 is the flow chart of the manufacturing method of another display panel provided in an embodiment of the present invention.
Fig. 5 is a kind of method flow diagram that reflection electrode layer is formed using stamping technique provided in an embodiment of the present invention.
Fig. 6 is provided in an embodiment of the present invention a kind of reflecting electrode to be formed on the underlay substrate for be formed with first electrode layer
Structural schematic diagram after layer；
Fig. 7 is a kind of method flow diagram that reflection electrode layer is formed using lithographic method provided in an embodiment of the present invention.
Fig. 8 is a kind of method flow that reflection electrode layer is formed using inkjet printing technology provided in an embodiment of the present invention
Figure.
Specific embodiment
To make the object, technical solutions and advantages of the present invention clearer, below in conjunction with attached drawing to embodiment party of the present invention
Formula is described in further detail.
OLED display panel has self-luminous, contrast is high, response is rapid, low in energy consumption, visual angle is wide, thickness is thin and is easy to real
The advantages that existing Flexible Displays.OLED display panel generally includes: bottom emitting OLED display panel and top emitting OLED display panel.
In bottom emitting OLED display panel, the light that organic luminous layer issues is projected from the anode-side of display panel, in top emitting OLED
In display panel, the light that organic luminous layer issues is projected from the cathode side of display panel.
Compared to bottom emitting OLED display panel, since the light that top emitting OLED display panel is issued is penetrated from cathode side
Out, so that the aperture opening ratio of the display panel is not will receive the influence of driving circuit in display panel, display surface can be effectively improved
The aperture opening ratio of plate, and be conducive to the highly integrated of display panel and driving circuit.Also, since top emitting OLED display panel has
There is many advantages, such as higher device efficiency, relatively narrow spectrum and higher display excitation purity, so that top emitting OLED display surface
Plate has preferable development prospect.
But due to the anode of top emitting OLED display panel close to the surface of organic luminous layer be even curface, should
When the light that surface issues organic luminous layer reflects, certain regularity is rendered as to the reflection of light, the reflected light
The light issued with organic luminous layer can generate interference, and surface plasma excimer damage occurs in the light for causing organic luminous layer to issue
Consumption is lost by substrate absorption and optical waveguide, and then causes the light extraction efficiency of top emitting OLED display panel lower, such as the light goes out
Light efficiency is only 20% or so.Also, when the light extraction efficiency is lower, due to the microcavity effect in top emitting OLED display panel
The case where answering, the display panel caused to will appear colour cast.Such as: the image that viewing display panel is shown in display panel side
When, it is found that the color of image shown by the display panel is different from the color when the front of display panel is watched, i.e., aobvious
Show that colour cast occurs in panel, leading to display panel, there are stronger view angle dependencies.
The embodiment of the invention provides a kind of display panel, which can be top emission type display panel, and should
Display panel light extraction efficiency with higher.As shown in Figure 1, the display panel may include:
It is stacked reflection electrode layer 002, organic luminous layer 003 and transparent electrode layer 004 on underlay substrate 001,
Reflection electrode layer 002 is transparent for reflecting the light for exposing to surface of the reflection electrode layer 002 far from underlay substrate 001
Electrode layer 004 is for transmiting the light for exposing to transparent electrode layer 004.
Wherein, surface concave-convex surface of the reflection electrode layer 002 far from underlay substrate 001.
It should be noted that the surface concave-convex surface due to the reflection electrode layer 002 far from underlay substrate 001, it is at this
Under the influence of concavo-convex surface, the surface for other film layers being formed on the reflection electrode layer 002 can generally also be rendered as recessed
Convex (not shown in figure 1).
In conclusion display panel provided in an embodiment of the present invention, the surface due to reflection electrode layer far from underlay substrate
Concave-convex surface, when the reflection electrode layer reflects light, the surface of the concave-convex surface can reduce the rule of the reflection to light
Rule property, the light for reducing reflected light and organic luminous layer sending generate the probability interfered, compared to the relevant technologies, effectively
The influence for reducing the light that the reflected light issues organic luminous layer, enable organic luminous layer issue light more by
It projects, improves the light extraction efficiency of display panel.
In a kind of achievable mode, reflection electrode layer 002 can have leading for reflection action by silver, aluminium, magnesium or titanium etc.
Electric material is made.Transparent electrode layer 004 can be by tin indium oxide (Indium Tin Oxide, ITO) or indium zinc oxide (Indium
Zinc oxide, IZO) etc. transparent conductive materials be made.
Optionally, as shown in Fig. 2, the display panel can also include: first electrode layer 005 and the second electrode lay 006.It should
First electrode layer 005 can be set between reflection electrode layer 002 and underlay substrate 001, which can be set
Between reflection electrode layer 002 and organic luminous layer 003, the first electrode layer 005 and the second electrode lay 006 are used for reflection
Electrode layer 002 forms anti-oxidation protection.
Wherein, to guarantee that two sides are respectively arranged with the reflection electrode layer 002 of first electrode layer 005 and the second electrode lay 006
Stable anode signal can be provided for organic luminous layer 003, the first electrode layer 005 and the second electrode lay 006 can be with
It is made of an electrically conducting material.Also, for the reflex for guaranteeing light that reflection electrode layer 002 issues organic luminous layer 003,
Two electrode layers 006 can be made of transparent conductive material.Meanwhile in order to minimize first electrode layer 005 and reflection electrode layer
Contact resistance between 002, and, the contact resistance between the second electrode lay 006 and reflection electrode layer 002, the first electrode
Layer 005 and the second electrode lay 006 can be made of same material.It is exemplary, the first electrode layer 005 and the second electrode lay
006 can be made of transparent conductive materials such as ITO or IZO.
Multiple concave points and multiple salient points have can be set far from the surface of underlay substrate 001 in reflection electrode layer 002, the concave point
Make the surface concave-convex surface with the salient point.Wherein, distance of the reflection electrode layer 002 close to the surface of underlay substrate 001 to concave point
The distance of point less than reflection electrode layer 002 close to the surface of underlay substrate 001 into peripheral region.Reflection electrode layer 002 leans on
The distance of the surface of nearly underlay substrate 001 to salient point is greater than reflection electrode layer 002 close to the surface of underlay substrate 001 to peripheral region
The distance of point in domain.
Optionally, in order to guarantee the light extraction efficiency of display panel, reflection electrode layer 002 is close to the surface of underlay substrate 001
To salient point difference at a distance from the surface to concave point of underlay substrate 001 of distance and reflection electrode layer 002 can be greater than it is pre-
If height threshold.And the value of the preset height threshold value can be configured according to actual needs, and such as: the preset height threshold value
It can be with are as follows: 200 nanometers to 1000 nanometers.
Wherein, distance of the reflection electrode layer 002 close to the surface of underlay substrate 001 to concave point can be with are as follows: 50 nanometers extremely
1000 nanometers.The difference in height of concave point and salient point can be with are as follows: 200 nanometers to 1000 nanometers.The spacing of adjacent salient point are as follows: 500 nanometers
To 20 microns.
Also, according to experimental verification, when the reflection electrode layer 002 is close to the distance on the surface of underlay substrate 001 to concave point
Are as follows: 200 nanometers to 1000 nanometers, and, the spacing of adjacent salient point are as follows: at 5 microns to 20 microns, which goes out light efficiency
Rate is best.
In a kind of achievable mode, concave point that reflection electrode layer 002 is distributed on the surface far from underlay substrate 001 and convex
Point can be spaced so that the reflection electrode layer 002 be rendered as far from the surface of underlay substrate 001 it is uniform concavo-convex.Further
, reflection electrode layer 002 close to the surface of underlay substrate 001 to concave point distance and reflection electrode layer 002 close to underlay substrate
The distance of 001 surface to salient point can be complementary.
It should be noted that the display panel can also include: to be arranged in transparent electrode layer 004 far from underlay substrate 001
The encapsulated layer etc. of side.The encapsulated layer is for preventing oxygen and moisture infiltration to display area, to guarantee that display panel shows function
The normal use of energy.Wherein, which may include the organic layer and inorganic layer of overlapping setting.
In conclusion display panel provided in an embodiment of the present invention, the surface due to reflection electrode layer far from underlay substrate
Concave-convex surface, when the reflection electrode layer reflects light, the surface of the concave-convex surface can reduce the rule of the reflection to light
Rule property, the light for reducing reflected light and organic luminous layer sending generate the probability interfered, compared to the relevant technologies, effectively
It reduces reflected light and surface plasma excimer loss occurs, lost by substrate absorption and optical waveguide, and then reduce this
The influence for the light that reflected light issues organic luminous layer, the light for enabling organic luminous layer to issue more are emitted, mention
The high light extraction efficiency of display panel, and then reduce display panel and the probability of colour cast occur, and then weaken the visual angle of display panel
Dependence.
Fig. 3 is a kind of method flow diagram of the manufacturing method of display panel provided in an embodiment of the present invention, as shown in figure 3,
This method may include:
Step 201 provides a underlay substrate.
Step 202 forms reflection electrode layer on underlay substrate, and reflection electrode layer is remote for that will expose to reflection electrode layer
The light on the surface from underlay substrate is reflected, surface concave-convex surface of the reflection electrode layer far from underlay substrate.
Step 203 forms organic luminous layer on the underlay substrate for be formed with reflection electrode layer.
Step 204 forms transparent electrode layer on the underlay substrate for be formed with organic luminous layer, and transparent electrode layer is used for will
The light for exposing to transparent electrode layer is transmitted.
In conclusion the manufacturing method of display panel provided in an embodiment of the present invention, anti-by manufacturing on underlay substrate
Electrode layer is penetrated, surface concave-convex surface of the reflection electrode layer far from underlay substrate, when the reflection electrode layer reflects light,
The surface of the concave-convex surface can reduce the regularity of the reflection to light, reduce what reflected light was issued with organic luminous layer
The probability that light generates interference efficiently reduces the light that the reflected light issues organic luminous layer compared to the relevant technologies
Influence, enable organic luminous layer issue light be more emitted, improve the light extraction efficiency of display panel.
Fig. 4 is the flow chart of the manufacturing method of another display panel provided in an embodiment of the present invention, as shown in figure 4, should
Method may include:
Step 301 provides a underlay substrate.
Underlay substrate can be transparent substrate, and specifically can be has certain heavily fortified point using glass, quartz, transparent resin etc.
Substrate made of the leaded light and nonmetallic materials of solidity, alternatively, the underlay substrate can for by polyimides (English:
Polyimide；Flexible base board made of referred to as: PI).
Step 302 forms first electrode layer in underlay substrate, which is used to form antioxygen to reflection electrode layer
Change protection.
Magnetron sputtering, thermal evaporation or plasma enhanced chemical vapor deposition method (Plasma Enhanced can be used
Chemical Vapor Deposition, PECVD) the methods of on underlay substrate deposit one layer have certain thickness conduction
Material obtains first electrode film layer, then is handled to obtain first to first electrode film layer by a patterning processes
Electrode layer.Wherein, a patterning processes may include: photoresist coating, exposure, development, etching and photoresist lift off.The conduction
Material may include the transparent conductive materials such as ITO or IZO, and the value range of the thickness of the first electrode layer can be according to reality
It needs to be configured.
Step 303 forms reflection electrode layer on the underlay substrate for be formed with first electrode layer, which is used for
The light for exposing to surface of the reflection electrode layer far from underlay substrate is reflected, table of the reflection electrode layer far from underlay substrate
Face concave-convex surface.
Wherein, formed reflection electrode layer implementation can there are many, the embodiment of the present invention with it is following it is several can be achieved
For mode, it is described:
The first in step 303 can be formed in realization mode using stamping technique (such as nanometer embossing)
Reflection electrode layer, as shown in figure 5, its realization process may include:
Step 3031a, reflecting electrode film layer is formed on the underlay substrate for be formed with first electrode layer.
It can be using the methods of magnetron sputtering, thermal evaporation or PECVD on the underlay substrate for being formed with first electrode layer
One layer of deposition has certain thickness electrode material, obtains reflecting electrode film layer.Wherein, the thickness of reflecting electrode film layer,
And it the material of the reflecting electrode film layer is made can be configured according to actual needs.Such as: the thickness can be 500
Nanometer is to 3000 nanometers, alternatively, the thickness can be 1000 nanometers to 2000 nanometers.The reflecting electrode film layer can use
The materials such as silver, aluminium, magnesium or titanium are made.
Step 3032a, reflecting electrode film layer is heated, and to the heating temperature that reflecting electrode film layer is heated
Degree is greater than the glass transition temperature of reflecting electrode film layer.
Reflecting electrode film layer is heated, and makes glass transition temperature of the heating temperature greater than reflecting electrode film layer
Degree, be in order to make the character of electrode material that can change after heating temperature reaches glass transition temperature, such as: by solid
State becomes liquid, and then can be changed by suppression its shape in the follow-up process.
The reflecting electrode film layer is irradiated alternatively, excimer laser also can be used, so that the reflecting electrode is thin
The character of electrode material changes within a short period of time in film layer, for example, melting electrode material, and then can be in subsequent mistake
Its shape is changed by suppression in journey.
Step 3033a, compacting tool set is pressed into reflecting electrode film layer, so that reflecting electrode film layer is far from underlay substrate
Surface concave-convex surface.
It optionally, can be by compacting tool set (such as nano impression mould during being heated to reflecting electrode film layer
Plate) indentation reflecting electrode film layer, form reflecting electrode film layer under the compacting of compacting tool set and the compacting of compacting tool set
The pattern of pattern match, that is to say, so that surface concave-convex surface of the reflecting electrode film layer far from underlay substrate.Wherein, it suppresses
The press pattern of mold is concavo-convex complementary with this.
Multiple concave points and multiple salient points have can be set far from the surface of underlay substrate in reflection electrode layer, and the concave point is convex with this
Point makes the surface concave-convex surface.For reflection electrode layer far from the salient point and concave point on the surface of underlay substrate, the reflecting electrode
Distance of the layer close to the surface of underlay substrate to concave point can be with are as follows: 50 nanometers to 1000 nanometers.The difference in height of concave point and salient point can
With are as follows: 200 nanometers to 1000 nanometers.The spacing of adjacent salient point are as follows: 500 nanometers to 20 microns.Also, according to experimental verification, when
Distance of the reflection electrode layer close to the surface of underlay substrate to concave point are as follows: 200 nanometers to 1000 nanometers, the spacing of adjacent salient point
Are as follows: at 5 microns to 20 microns, the light extraction efficiency of the display panel is best.
Step 3034a, cool down to reflecting electrode film layer.
Cool down to reflecting electrode film layer, is to make compacting be formed in reflecting electrode film layer far from underlay substrate
The concavo-convex of surface being capable of curing molding after cooling.
Step 3035a, compacting tool set is removed, is obtained lower than after glass transition temperature in the temperature of reflecting electrode film layer
To reflection electrode layer.
Illustratively, the structural schematic diagram of the reflection electrode layer obtained after compacting tool set is removed referring to FIG. 6, the reflecting electrode
Layer 002 is arranged on surface of the first electrode layer 005 far from underlay substrate 001, and the reflection electrode layer 002 is far from underlay substrate
001 surface concave-convex surface.
In second of achievable mode of step 303, reflection electrode layer can be formed using lithographic method, such as Fig. 7 institute
Show, realization process may include:
Step 3031b, reflecting electrode film layer is formed on the underlay substrate for be formed with first electrode layer.
The implementation of step 3031b please refers to step 3031a.
Step 3032b, photoetching agent pattern is formed on the underlay substrate for being formed with reflecting electrode film layer.
Photoresist film layer can be formed on the underlay substrate for being formed with reflecting electrode film layer, then use mask plate pair
The photoresist film layer is exposed, then is developed to the photoresist film layer after exposure, to obtain and the photoetching agent pattern.Its
In, open area and non-open areas and concave point to be formed and salient point Corresponding matching in mask plate.
Step 3033b, the reflecting electrode film layer for being formed with photoetching agent pattern to surface performs etching, so that reflecting electrode
Surface concave-convex surface of the film layer far from underlay substrate, obtains reflection electrode layer.
It, can be by controlling etch period in etching process, thickness to the concave point formed on a surface, and,
Difference in height between concave point and salient point is controlled.Also, due to being formed with photoetching on the underlay substrate of reflecting electrode film layer
There is the part of exposure on the surface and be photo-etched the part that glue blocks in glue pattern, after etching process, what this was exposed
Partial thickness is reduced, and is formed as the concave point on the surface, this is photo-etched the part that glue blocks and is not etched, is formed as the table
Salient point on face, so that the surface concave-convex surface.
Step 3034b, stripping photoresist pattern.
After completing etching process, photoetching agent pattern on the peelable reflection electrode layer, in order to shape on a surface
At other film layers.Illustratively, the structural schematic diagram of the reflection electrode layer obtained after stripping photoresist pattern is referring to FIG. 6, this is anti-
It penetrates electrode layer 002 to be arranged on surface of the first electrode layer 005 far from underlay substrate 001, and the reflection electrode layer 002 is far from lining
The surface concave-convex surface of substrate 001.
The third in step 303 can form reflection electrode layer using inkjet printing technology, such as scheme in realization mode
Shown in 8, realization process may include:
Step 3031c, using inkjet printing technology, the first solution ink-jet dissolved with electrode material is being formed with first
On the underlay substrate of electrode layer, to form the first reflecting electrode film layer.
It should be noted that before forming reflection electrode layer using inkjet printing technology, it is also necessary to be formed with first
Pixel defining layer is formed on the underlay substrate of electrode layer, to limit the flow region of solution by the pixel defining layer, makes to reflect
Electrode layer can be formed in predeterminable area.
Step 3032c, using inkjet printing technology, by the second solution ink-jet dissolved with electrode material in the first reflection electricity
Very thin film layer forms the second reflecting electrode film layer, obtains including the first reflecting electrode film far from the surface of underlay substrate
The reflection electrode layer of layer and the second reflecting electrode film layer, and surface concave-convex surface of the reflection electrode layer far from underlay substrate.
Wherein, the concentration of the first solution is greater than the concentration of the second solution, and/or, the first ink droplet spacing is less than the second ink droplet
Spacing, the first ink droplet spacing are that the first solution is injected in the ink droplet spacing on underlay substrate, which is second
Solution is injected in the first reflecting electrode film layer far from the ink droplet spacing on the surface of underlay substrate.
When the concentration difference of solution, the diffusion after the ink droplet of the solution is sprayed is different, and solution concentration is bigger
When, the diffusion of ink droplet is smaller.When the ink droplet spacing difference that ink droplet is sprayed, the film layer that ink droplet is formed after the drying is corresponded to
Surface flatness it is different, and ink droplet spacing is got over hour, and the flatness of the film layer of formation is bigger.Therefore, it is beaten using ink-jet
When print technology forms reflection electrode layer, the concentration by the way that the first solution is arranged is greater than the concentration of the second solution, and/or, the first ink
Spacing is dripped less than the second ink droplet spacing, the surface for the reflection electrode layer to be formed can be made to be rendered as concavo-convex.Also, using spray
When black printing technique forms the reflection electrode layer, the concentration of corresponding solution and the spacing of ink droplet can be set according to actual needs,
Such as: the first ink droplet spacing can be 2 nanometers, and the second ink droplet spacing can be 5 nanometers, and the embodiment of the present invention is not done it specifically
It limits.
It should be noted that the third in the step 303 can be in realization mode, being includes first anti-with reflection electrode layer
It penetrates for electrode thin film layer and the second reflecting electrode film layer and to be illustrated, not may include to limit reflection electrode layer
Reflecting electrode film layer the number of plies.Also, the number of plies for the reflecting electrode film layer that the reflection electrode layer includes can be according to reality
Border needs to be configured.Such as: when the thickness of reflection electrode layer is thicker, can the reflection electrode layer may include that more are anti-
Electrode thin film layer is penetrated, the embodiment of the present invention is not specifically limited it.
Step 304 forms the second electrode lay on the underlay substrate for be formed with reflection electrode layer, which is used for
Anti-oxidation protection is formed to reflection electrode layer.
It can be using the methods of magnetron sputtering, thermal evaporation or PECVD on the underlay substrate for being formed with reflection electrode layer
One layer of upper deposition has certain thickness conductive material, obtains second electrode film layer, then by patterning processes to the
Two electrode thin film layers are handled to obtain the second electrode lay.Wherein, a patterning processes may include: photoresist coating, exposure,
Development, etching and photoresist lift off.The conductive material may include the transparent conductive materials such as ITO or IZO, and the second electrode lay
The value range of thickness can be configured according to actual needs.
Step 305 forms organic luminous layer on the underlay substrate for be formed with the second electrode lay.
Step 306 forms transparent electrode layer on the underlay substrate for be formed with organic luminous layer, which is used for
The light for exposing to transparent electrode layer is transmitted.
The transparent electrode layer can be cathode, correspondingly, reflection electrode layer can be anode, alternatively, the transparent electrode layer
It can be to be extremely positive, correspondingly, reflection electrode layer can be cathode.The cathode is for providing cathode signal, and the anode is for providing
Anode signal, under the action of the cathode signal and the anode signal, organic luminous layer can shine, and then keep display panel aobvious
Diagram picture.
After forming transparent electrode layer, other films can also be formed on the underlay substrate for be formed with the transparent electrode layer
Layer, for example, encapsulated layer can be formed, the encapsulated layer is for preventing oxygen and moisture infiltration to display area, to guarantee display surface
The normal use of plate display function.Wherein, which may include the organic layer and inorganic layer of overlapping setting.
It should be noted that display panel can not also include first electrode layer and the second electrode lay, and work as display panel
When not including first electrode layer and the second electrode lay, the manufacturing method of the display panel is please accordingly with reference to above-mentioned steps 301 to step
Rapid 306, it is repeated no more herein.
In conclusion the manufacturing method of display panel provided in an embodiment of the present invention, anti-by manufacturing on underlay substrate
Electrode layer is penetrated, surface concave-convex surface of the reflection electrode layer far from underlay substrate, when the reflection electrode layer reflects light,
The surface of the concave-convex surface can reduce the regularity of the reflection to light, reduce what reflected light was issued with organic luminous layer
The probability that light generates interference efficiently reduces reflected light and surface plasma excimer damage occurs compared to the relevant technologies
Consumption is lost by substrate absorption and optical waveguide, and then reduces the influence for the light that the reflected light issues organic luminous layer, makes
The light that organic luminous layer issues can be more emitted, and improve the light extraction efficiency of display panel, and then reduce display panel
There is the probability of colour cast, and then weakens the view angle dependency of display panel.
The embodiment of the invention also provides a kind of display device, which may include provided by the above embodiment aobvious
Show panel.The display device can be with are as follows: liquid crystal display panel, Electronic Paper, mobile phone, tablet computer, television set, display, notebook electricity
Any product having a display function such as brain, Digital Frame, navigator.Illustratively, which can be OLED or quantum
Point luminescent diode (Quantum Dot Light Emitting Diodes, QLED) display panel.
The foregoing is merely presently preferred embodiments of the present invention, is not intended to limit the invention, it is all in spirit of the invention and
Within principle, any modification, equivalent replacement, improvement and so on be should all be included in the protection scope of the present invention.
Claims (10)
1. a kind of display panel, which is characterized in that the display panel includes:
It is stacked reflection electrode layer, organic luminous layer and transparent electrode layer on underlay substrate, the reflection electrode layer is used
It is reflected in by the light for exposing to surface of the reflection electrode layer far from the underlay substrate, the transparent electrode layer is used for
The light for exposing to the transparent electrode layer is transmitted；
Wherein, surface concave-convex surface of the reflection electrode layer far from the underlay substrate.
2. according to display panel described in claim or 1, which is characterized in that the display panel further include: first electrode layer
And the second electrode lay；
The first electrode layer is arranged between the reflection electrode layer and the underlay substrate, and the second electrode lay setting exists
Between the reflection electrode layer and the organic luminous layer, the first electrode layer and the second electrode lay are used for described anti-
It penetrates electrode layer and forms anti-oxidation protection.
3. display panel according to claim 1 or 2, which is characterized in that the reflection electrode layer is far from the substrate base
The surface of plate is provided with multiple concave points and multiple salient points,
The reflection electrode layer is close to the surface of the underlay substrate to the distance of the concave point are as follows: 50 nanometers to 1000 nanometers；
The difference in height of the concave point and the salient point are as follows: 200 nanometers to 1000 nanometers；
The spacing of adjacent salient point are as follows: 500 nanometers to 20 microns.
4. a kind of manufacturing method of display panel, which is characterized in that the described method includes:
One underlay substrate is provided；
Reflection electrode layer is formed on the underlay substrate, the reflection electrode layer is remote for that will expose to the reflection electrode layer
The light on the surface from the underlay substrate is reflected, and surface of the reflection electrode layer far from the underlay substrate is in bumps
Shape；
Organic luminous layer is formed on the underlay substrate for being formed with the reflection electrode layer；
Transparent electrode layer is formed on the underlay substrate for being formed with the organic luminous layer, the transparent electrode layer will be for that will irradiate
Light to the transparent electrode layer is transmitted.
5. according to the method described in claim 4, it is characterized in that,
It is formed before reflection electrode layer on the underlay substrate, the method also includes:
First electrode layer is formed on the underlay substrate, the first electrode layer is used to form antioxygen to the reflection electrode layer
Change protection；
It is described to form reflection electrode layer on the underlay substrate, comprising:
The reflection electrode layer is formed on the underlay substrate for being formed with the first electrode layer；
It is formed after reflection electrode layer on the underlay substrate, the method also includes:
The second electrode lay is formed on the underlay substrate for being formed with the reflection electrode layer, the second electrode lay is used for described
Reflection electrode layer forms anti-oxidation protection；
It is described to form organic luminous layer on the underlay substrate for being formed with the reflection electrode layer, comprising:
The organic luminous layer is formed on the underlay substrate for being formed with the second electrode lay.
6. method according to claim 4 or 5, which is characterized in that form reflection electrode layer on the underlay substrate, wrap
It includes:
Reflecting electrode film layer is formed on the underlay substrate；
The reflecting electrode film layer is heated, wherein the heating temperature that the reflecting electrode film layer is heated
Greater than the glass transition temperature of the reflecting electrode film layer；
Compacting tool set is pressed into the reflecting electrode film layer, so that the reflecting electrode film layer is far from the underlay substrate
Surface is in described concavo-convex；
Cool down to the reflecting electrode film layer；
After the temperature of the reflecting electrode film layer is lower than the glass transition temperature, the compacting tool set is removed, is obtained
The reflection electrode layer.
7. method according to claim 4 or 5, which is characterized in that form reflection electrode layer on the underlay substrate, wrap
It includes:
Reflecting electrode film layer is formed on the underlay substrate；
Photoetching agent pattern is formed on the underlay substrate for being formed with the reflecting electrode film layer；
The reflecting electrode film layer for being formed with the photoetching agent pattern to surface performs etching, so that the reflecting electrode film layer
Surface far from the underlay substrate obtains the reflection electrode layer in described concavo-convex；
Remove the photoetching agent pattern.
8. method according to claim 4 or 5, which is characterized in that form reflection electrode layer on the underlay substrate, wrap
It includes:
Using inkjet printing technology, by the first solution ink-jet dissolved with electrode material on the underlay substrate, to form the
One reflecting electrode film layer；
Using inkjet printing technology, by the second solution ink-jet dissolved with the electrode material in the first reflecting electrode film
Layer forms the second reflecting electrode film layer, obtains including the first reflecting electrode film layer far from the surface of underlay substrate
With the reflection electrode layer of the second reflecting electrode film layer, surface of the reflection electrode layer far from the underlay substrate is in institute
It states concavo-convex；
Wherein, the concentration of first solution is greater than the concentration of second solution, and/or, the first ink droplet spacing is less than described
Second ink droplet spacing, the first ink droplet spacing are that first solution is injected in the ink droplet spacing on the underlay substrate, institute
Stating the second ink droplet spacing is that second solution is injected in the first reflecting electrode film layer far from the surface of underlay substrate
Ink droplet spacing.
9. method according to claim 4 or 5, which is characterized in that the reflection electrode layer is made of silver, aluminium, magnesium or titanium.
10. a kind of display device, which is characterized in that the display device includes any display surface of claims 1 to 3
Plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811037109.7A CN109148730A (en) | 2018-09-05 | 2018-09-05 | Display panel and its manufacturing method, display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811037109.7A CN109148730A (en) | 2018-09-05 | 2018-09-05 | Display panel and its manufacturing method, display device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109148730A true CN109148730A (en) | 2019-01-04 |
Family
ID=64827309
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811037109.7A Pending CN109148730A (en) | 2018-09-05 | 2018-09-05 | Display panel and its manufacturing method, display device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109148730A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113270468A (en) * | 2021-05-28 | 2021-08-17 | 武汉华星光电半导体显示技术有限公司 | Display panel |
| CN114122292A (en) * | 2021-11-15 | 2022-03-01 | 惠州华星光电显示有限公司 | OLED display panel and electronic equipment |
| CN114203928A (en) * | 2021-12-03 | 2022-03-18 | Oppo广东移动通信有限公司 | Electrode and preparation method thereof, OLED device and electronic equipment |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20030052093A (en) * | 2001-12-20 | 2003-06-26 | 엘지.필립스 엘시디 주식회사 | Ink-jetting type reflective layer for reflective Liquid Crystal Display Device |
| US20140151651A1 (en) * | 2012-12-05 | 2014-06-05 | Samsung Display Co., Ltd. | Organic light emitting diode display device and method of manufacturing the same |
| CN104319352A (en) * | 2014-11-13 | 2015-01-28 | 京东方科技集团股份有限公司 | Top emission white light OLED device, preparation method of top emission white light OLED device, and display device |
| CN105684182A (en) * | 2013-10-25 | 2016-06-15 | 欧司朗Oled股份有限公司 | Optoelectronic component and method for producing an optoelectronic component |
| CN107507920A (en) * | 2017-09-22 | 2017-12-22 | 京东方科技集团股份有限公司 | Organic electroluminescent LED, display base plate and preparation method thereof, display device |
-
2018
- 2018-09-05 CN CN201811037109.7A patent/CN109148730A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20030052093A (en) * | 2001-12-20 | 2003-06-26 | 엘지.필립스 엘시디 주식회사 | Ink-jetting type reflective layer for reflective Liquid Crystal Display Device |
| US20140151651A1 (en) * | 2012-12-05 | 2014-06-05 | Samsung Display Co., Ltd. | Organic light emitting diode display device and method of manufacturing the same |
| CN105684182A (en) * | 2013-10-25 | 2016-06-15 | 欧司朗Oled股份有限公司 | Optoelectronic component and method for producing an optoelectronic component |
| CN104319352A (en) * | 2014-11-13 | 2015-01-28 | 京东方科技集团股份有限公司 | Top emission white light OLED device, preparation method of top emission white light OLED device, and display device |
| CN107507920A (en) * | 2017-09-22 | 2017-12-22 | 京东方科技集团股份有限公司 | Organic electroluminescent LED, display base plate and preparation method thereof, display device |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113270468A (en) * | 2021-05-28 | 2021-08-17 | 武汉华星光电半导体显示技术有限公司 | Display panel |
| WO2022246906A1 (en) * | 2021-05-28 | 2022-12-01 | 武汉华星光电半导体显示技术有限公司 | Display panel |
| CN114122292A (en) * | 2021-11-15 | 2022-03-01 | 惠州华星光电显示有限公司 | OLED display panel and electronic equipment |
| WO2023082326A1 (en) * | 2021-11-15 | 2023-05-19 | 惠州华星光电显示有限公司 | Oled display panel and electronic device |
| CN114203928A (en) * | 2021-12-03 | 2022-03-18 | Oppo广东移动通信有限公司 | Electrode and preparation method thereof, OLED device and electronic equipment |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN109616500B (en) | Organic light emitting diode panel, preparation method thereof and display device | |
| CN104752490B (en) | A kind of organic LED display panel and preparation method thereof, display unit | |
| US11127798B2 (en) | Pixel definition layer and manufacturing method thereof, display substrate, and display panel | |
| CN114759071A (en) | Display substrate, manufacturing method thereof and display device | |
| CN110890406B (en) | Organic light-emitting display back plate, manufacturing method thereof and display device | |
| WO2020010847A1 (en) | Display panel and manufacturing method therefor, and display apparatus | |
| US20200303687A1 (en) | Manufacturing method of oled display panel | |
| CN110085655B (en) | Display panel, manufacturing method thereof and display device | |
| CN109148730A (en) | Display panel and its manufacturing method, display device | |
| CN108336126A (en) | The production method of dot structure, display device and dot structure | |
| TW200833164A (en) | Organic electroluminescent display device and method for fabricating thereof | |
| US9594193B2 (en) | Printing plate, scattering layer, method for fabricating the same, and display apparatus | |
| CN110112201B (en) | Display substrate, manufacturing method thereof and display device | |
| WO2020063296A1 (en) | Flexible substrate and manufacturing method therefor, and display device | |
| CN111785760B (en) | Display substrate, preparation method thereof and display device | |
| CN108573998B (en) | Display panel, manufacturing method and display device | |
| WO2021249122A1 (en) | Oled display substrate and manufacturing method therefor, display panel, and display device | |
| TW200536431A (en) | Organic light-emitting diode and method of fabricating the same | |
| WO2020259351A1 (en) | Display substrate and manufacturing method therefor, and display device | |
| US11233115B2 (en) | Display panel and manufacturing method thereof, and display device | |
| WO2009136644A1 (en) | Light emitting apparatus with high light emitting efficiency | |
| US8877531B2 (en) | Electronic apparatus | |
| CN110993646B (en) | Preparation method of OLED (organic light emitting diode) back plate and OLED back plate | |
| US11404505B2 (en) | Display substrate, ink-jet printing method thereof, and display apparatus | |
| JP2015079618A (en) | Thin film transistor substrate, manufacturing method of the same, organic el element using the same, and manufacturing method of organic el element |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20190104 |
|
| RJ01 | Rejection of invention patent application after publication |