CN111724681A - Substrate, preparation method thereof and display panel - Google Patents
Substrate, preparation method thereof and display panel Download PDFInfo
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- CN111724681A CN111724681A CN202010518100.9A CN202010518100A CN111724681A CN 111724681 A CN111724681 A CN 111724681A CN 202010518100 A CN202010518100 A CN 202010518100A CN 111724681 A CN111724681 A CN 111724681A
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- flexible substrate
- substrate
- back plate
- functional layer
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
- H10K77/10—Substrates, e.g. flexible substrates
- H10K77/111—Flexible substrates
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The application discloses base plate, this base plate includes flexible substrate, sets up array functional layer and setting above the flexible substrate are in the flexible substrate is kept away from the backplate of array functional layer one side, the backplate is kept away from flexible substrate one side is provided with at least one recess, and this application embodiment sets up the one deck backplate through keeping away from array functional layer one side at the flexible substrate, and this backplate is used for protecting this flexible substrate, keeps away from flexible substrate one side at this backplate simultaneously and is provided with at least one recess, and this at least one recess can be used to release the stress that the base plate produced in bending process to make the base plate can obtain buckling of bigger curvature, consequently effectual reduction base plate curvature radius.
Description
Technical Field
The invention relates to the technical field of display, in particular to a substrate, a preparation method thereof and a display panel.
Background
Smart terminal devices (such as smart phones, tablet computers, etc.) are developing to have larger display areas, i.e. larger display screens, and to be thinner and more portable. At present, with the wide application of frameless technology, the screen occupation ratio of intelligent terminal equipment, especially a mobile phone, is close to the limit, so that a larger screen is required, and a larger carrying volume is required. Therefore, as a solution that can provide a larger display screen and a smaller carrying volume, the advent and application of foldable display screens, rollable display screens, are inevitable results from the demand. Compare in the folding mode of intelligent terminal display screen, the mode that the display screen curls and receive and releases more has the development future, can possess big display area when the screen expandes, has the minimum volume of carrying again after the screen rolling. Meanwhile, the technology of the oled (organic Light Emitting diode) flexible display screen is gradually mature, so that it is possible for the intelligent terminal device to have a scroll-type rollable screen.
At present, although the flexible display screen has the characteristics of being capable of being bent, curled, convenient to carry and the like, the curvature radius of the flexible display screen is difficult to reduce by controlling the thickness of the lamination under the condition that the thickness of the lamination is certain.
Disclosure of Invention
The application provides a base plate and a preparation method thereof, and a display panel, wherein a layer of back plate is arranged on one side of a flexible substrate far away from an array functional layer, the back plate is used for protecting the flexible substrate, at least one groove is arranged on one side of the back plate far away from the flexible substrate, and the at least one groove can be used for releasing stress generated by the base plate in the bending process, so that the base plate can be bent with larger curvature, and the curvature radius of the base plate is effectively reduced.
In order to solve the above problem, in a first aspect, the present application provides a substrate, including a flexible substrate, an array functional layer disposed above the flexible substrate, and a back plate disposed on one side of the array functional layer, where the flexible substrate is away from the back plate, and at least one groove is disposed on one side of the flexible substrate.
In some embodiments, the material of the back sheet comprises at least one of polyimide, ethylene vinyl acetate copolymer, and graphene.
In some embodiments, a cross-sectional shape of any of the at least one groove is triangular, rectangular, or semi-circular.
In some embodiments, the at least one groove comprises a plurality of grooves disposed on the back plate at equal intervals.
In a second aspect, the present application provides a display panel comprising a light emitting device and a substrate, wherein the substrate is the substrate of the first aspect.
In some embodiments, the light emitting device is an organic light emitting device.
In a third aspect, the present application provides a method of preparing a substrate, the method comprising:
preparing a flexible substrate;
preparing an array functional layer on the flexible substrate;
and preparing a back plate on one side of the flexible substrate, which is far away from the array functional layer, wherein at least one groove is formed in one side of the back plate, which is far away from the flexible substrate.
In some embodiments, the preparing the backplane on the side of the flexible substrate away from the array functional layer comprises:
and attaching a layer of back plate to one side of the flexible substrate, which is far away from the array functional layer.
In some embodiments, after attaching a layer of backplane to a side of the flexible substrate away from the array functional layer, the method includes:
at least one recess is made on a side of the backplate remote from the flexible substrate.
In some embodiments, the preparing at least one groove on a side of the backplate away from the flexible substrate comprises:
and preparing at least one groove on one side of the back plate far away from the flexible substrate by adopting laser cutting or mechanical cutting.
This application is in through providing a base plate, and this base plate includes flexible substrate, setting array functional layer and the setting of flexible substrate top are in flexible substrate keeps away from the backplate of array functional layer one side, the backplate is kept away from flexible substrate one side is provided with at least one recess, and this application embodiment sets up the one deck backplate through keeping away from array functional layer one side at flexible substrate, and this backplate is used for protecting this flexible substrate, keeps away from flexible substrate one side at this backplate simultaneously and is provided with at least one recess, and this at least one recess can be used to release the stress that the base plate produced in bending process to make the base plate can obtain buckling of bigger curvature, consequently effectual reduction base plate curvature radius.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
FIG. 1 is a schematic structural diagram of an embodiment of a front view of a substrate in an embodiment of the present application;
FIG. 2 is a schematic structural diagram of an embodiment of a top view of a substrate in an embodiment of the present application;
fig. 3 is a schematic flow chart illustrating an embodiment of a method for manufacturing a substrate according to an embodiment of the present disclosure.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
In the description of the present application, it is to be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present application and for simplicity in description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed in a particular orientation, and be operated in a particular manner, and are not to be construed as limiting the present application. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.
In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; may be mechanically connected, may be electrically connected or may be in communication with each other; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.
In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact of the first and second features, or may comprise contact of the first and second features not directly but through another feature in between. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
The following disclosure provides many different embodiments or examples for implementing different features of the application. In order to simplify the disclosure of the present application, specific example components and arrangements are described below. Of course, they are merely examples and are not intended to limit the present application. Moreover, the present application may repeat reference numerals and/or letters in the various examples, such repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. In addition, examples of various specific processes and materials are provided herein, but one of ordinary skill in the art may recognize applications of other processes and/or use of other materials.
At present, although the flexible display screen has the characteristics of being capable of being bent, curled, convenient to carry and the like, the curvature radius of the flexible display screen is difficult to reduce by controlling the thickness of the lamination under the condition that the thickness of the lamination is certain.
Based on this, embodiments of the present application provide a substrate, a method for manufacturing the substrate, and a display panel, which are described in detail below.
First, an embodiment of the present application provides a substrate, which includes a flexible substrate, an array functional layer disposed above the flexible substrate, and a backplane disposed on a side of the flexible substrate away from the array functional layer, where at least one groove is disposed on a side of the backplane away from the flexible substrate.
As shown in fig. 1 to fig. 3, fig. 1 is a schematic structural diagram of an embodiment of a front view of a base plate in an embodiment of the present application, where the base plate 10 includes a flexible substrate 101, an array functional layer 102 disposed above the flexible substrate 101, and a back plate 103 disposed on a side of the flexible substrate 101 away from the array functional layer 102, and at least one groove 104 is disposed on a side of the back plate 103 away from the flexible substrate 101.
In the embodiment of the present application, at least one groove 104 is disposed on a side of the backplate 103 away from the flexible substrate 101, where the at least one groove 104 may be one or more, and is not limited herein, for example, 50 grooves 104 are disposed on a side of the backplate 103 away from the flexible substrate 101.
The array functional layer 102 includes a plurality of Thin-film transistors (TFTs) distributed in an array, which are one kind of field effect transistors, and the manufacturing method is to deposit various films, such as a semiconductor active layer, a dielectric layer, and a metal electrode layer, on the substrate 10. The thin film transistor has a very important role in the operation performance of the display device.
It should be noted that, in the foregoing embodiment of the substrate 10, only the structure of the array functional layer 102 disposed above the flexible substrate 101 is described, and it is understood that the array functional layer 102 in the substrate 10 according to this embodiment of the present application may further include any other structure as needed, for example, a buffer layer, a gate layer, an interlayer insulating layer, and the like, and this is not limited herein.
In the embodiment of the application, the back plate 103 is arranged on the side of the flexible substrate 101 far from the array functional layer 102, the back plate 103 is used for protecting the flexible substrate 101, and at least one groove 104 is arranged on the side of the back plate 103 far from the flexible substrate 101, and the at least one groove 104 can be used for releasing stress generated by the base plate 10 in the bending process, so that the base plate 10 can be bent with a larger curvature, and the curvature radius of the base plate 10 is effectively reduced.
In some embodiments, the material of the back plate 103 may include at least one of polyimide, ethylene-vinyl acetate copolymer, and graphene, and specifically, the material of the back plate 103 may be polyimide, or a mixture of polyimide and ethylene-vinyl acetate copolymer.
In the embodiment of the present invention, the material such as polyimide has certain excellent mechanical properties, so that the material such as polyimide is adopted as the back plate 103 of the substrate 10 to improve the overall mechanical properties of the substrate 10, thereby preventing the substrate 10 from being damaged.
In some embodiments, a cross-sectional shape of any of the at least one groove is triangular, rectangular, or semi-circular.
In this embodiment, the cross-sectional shapes of the grooves may include grooves of various shapes, for example, two shapes may be included, such as one is rectangular and the other is triangular, and by providing grooves corresponding to the two shapes, the stress resistance of the substrate may be effectively increased; for example, the substrate comprises three grooves, wherein one part of the grooves is triangular, one part of the grooves is rectangular, one part of the grooves is semicircular, and the like, so that the stress resistance of the substrate can be further improved.
In some embodiments, as shown in fig. 2, fig. 2 is a schematic structural diagram of an embodiment of a top view of a substrate in an embodiment of the present application, and the at least one groove 104 includes a plurality of grooves, and the plurality of grooves are disposed on the back plate 103 at equal intervals.
In this application embodiment, this a plurality of recesses equidistant setting is on this backplate, and is full of whole backplate side by side, and this recess evenly distributed is on the backplate for the stress homodisperse that the base plate produced in bending process is to whole backplate, consequently, adopts this kind of mode of setting, can improve the wholeness ability of base plate.
In some embodiments, the depth of the groove 104 may range from 5 microns to 15 microns, and specifically, the depth of the groove 104 is related to the thickness of the back plate 103, for example, the depth of the groove 104 may be set to 5 microns when the thickness of the back plate 103 is 15 microns.
In some embodiments, the width of the groove 104 may range from 5 microns to 20 microns, for example, the width of the groove 104 may be 8 microns.
In order to better implement the substrate 10 in the embodiment of the present invention, on the basis of the substrate 10, the embodiment of the present invention further provides a display panel, which includes a light emitting device and the substrate 10, where the substrate 10 is the substrate 10 as described in the above embodiment.
In the embodiment of the application, the backplane 103 is arranged on the side of the flexible substrate 101 far away from the array functional layer 102, the backplane 103 is used for protecting the flexible substrate 101, and meanwhile, the at least one groove 104 is arranged on the side of the backplane 103 far away from the flexible substrate 101, and the at least one groove 104 can be used for releasing stress generated by the base plate 10 in the bending process, so that the base plate 10 can be bent with a larger curvature, the curvature radius of the base plate 10 is effectively reduced, and the protection performance of the display panel is improved.
In some embodiments, the light emitting device is an organic light emitting device, and in this embodiment, the organic light emitting device may generally include an anode, an electron transport layer, a light emitting layer, a hole transport layer, and a cathode.
In order to better implement the substrate 10 in the embodiment of the present invention, on the basis of the substrate 10, the embodiment of the present invention further provides a method for preparing the substrate 10, where the method includes: preparing a flexible substrate 101; preparing an array functional layer 102 on the flexible substrate 101; preparing a back plate 103 on the side of the flexible substrate 101 far away from the array functional layer 102, wherein at least one groove 104 is arranged on the side of the back plate 103 far away from the flexible substrate 101.
As shown in fig. 3, fig. 3 is a schematic flow chart of an embodiment of a method for manufacturing a substrate in an embodiment of the present application, wherein the method includes:
301. a flexible substrate is prepared.
In this embodiment, the flexible substrate 101 may be made of polyimide.
302. And preparing an array functional layer on the flexible substrate.
303. And preparing a back plate on one side of the flexible substrate far away from the array functional layer, wherein at least one groove is formed in one side of the back plate far away from the flexible substrate.
In the embodiment of the application, the back plate 103 is prepared on the side of the flexible substrate 101 far away from the array functional layer 102, the back plate 103 is used for protecting the flexible substrate 101, and at least one groove 104 is prepared on the side of the back plate 103 far away from the flexible substrate 101, and the at least one groove 104 can be used for releasing stress generated by the base plate 10 in the bending process, so that the base plate 10 can be bent with a larger curvature, the curvature radius of the base plate 10 is effectively reduced, and the protection performance of the base plate is improved.
In some embodiments, the preparing the backplane 103 on the side of the flexible substrate 101 away from the array functional layer 102 includes:
a back plate 103 is attached to one side of the flexible substrate 101 away from the array functional layer 102.
In the embodiment of the application, a layer of back plate is attached to one side of the flexible substrate, which is far away from the array functional layer, specifically, glue can be coated on one side of the back plate, and then the back plate is attached to the flexible substrate.
In some embodiments, after attaching a layer of back plate 103 to the side of the flexible substrate 101 away from the array functional layer 102, the method includes:
at least one recess 104 is prepared on a side of the backplate 103 remote from the flexible substrate 101.
In some embodiments, the preparing at least one groove 104 on a side of the backplate 103 away from the flexible substrate 101 includes:
at least one groove 104 is prepared on the side of the backplate 103 remote from the flexible substrate 101 using laser cutting or mechanical cutting.
In some embodiments, to improve efficiency, the backplane 103 may be fabricated on the flexible substrate 101 by low temperature vapor deposition.
In the above embodiments, the descriptions of the respective embodiments have respective emphasis, and a part which is not described in detail in a certain embodiment may refer to the detailed descriptions in the other embodiments, and is not described herein again.
The substrate, the manufacturing method thereof, and the display panel provided in the embodiments of the present application are described in detail above, and specific examples are applied in the present application to explain the principles and embodiments of the present application, and the description of the embodiments above is only used to help understand the technical solutions and the core ideas of the present application; those of ordinary skill in the art will understand that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications or substitutions do not depart from the spirit and scope of the present disclosure as defined by the appended claims.
Claims (10)
1. The base plate is characterized by comprising a flexible substrate, an array functional layer arranged above the flexible substrate and a back plate arranged on one side, far away from the array functional layer, of the flexible substrate, wherein at least one groove is formed in one side, far away from the flexible substrate, of the back plate.
2. The method of manufacturing a substrate according to claim 1, wherein a material of the back sheet includes at least one of polyimide, ethylene-vinyl acetate copolymer, and graphene.
3. The method of claim 1, wherein a cross-sectional shape of any one of the at least one groove is triangular, rectangular, or semicircular.
4. The method of claim 1, wherein the at least one groove comprises a plurality of grooves disposed on the back plate at equal intervals.
5. A display panel comprising a light-emitting device and a substrate, the substrate being the substrate according to any one of claims 1 to 4.
6. The method according to claim 5, wherein the light-emitting device is an organic light-emitting device.
7. A method of preparing a substrate, the method comprising:
preparing a flexible substrate;
preparing an array functional layer on the flexible substrate;
and preparing a back plate on one side of the flexible substrate, which is far away from the array functional layer, wherein at least one groove is formed in one side of the back plate, which is far away from the flexible substrate.
8. The method for preparing the substrate according to claim 7, wherein the preparing the back plate on the side of the flexible substrate away from the array functional layer comprises:
and attaching a layer of back plate to one side of the flexible substrate, which is far away from the array functional layer.
9. The method for preparing the substrate according to claim 8, wherein after attaching a layer of back plate to the side of the flexible substrate away from the array functional layer, the method comprises:
at least one recess is made on a side of the backplate remote from the flexible substrate.
10. The method of claim 9, wherein the preparing at least one groove on a side of the backplate away from the flexible substrate comprises:
and preparing at least one groove on one side of the back plate far away from the flexible substrate by adopting laser cutting or mechanical cutting.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202010518100.9A CN111724681A (en) | 2020-06-09 | 2020-06-09 | Substrate, preparation method thereof and display panel |
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| CN202010518100.9A CN111724681A (en) | 2020-06-09 | 2020-06-09 | Substrate, preparation method thereof and display panel |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112786622A (en) * | 2021-01-12 | 2021-05-11 | 武汉华星光电半导体显示技术有限公司 | Flexible display panel and preparation method thereof |
| WO2022227727A1 (en) * | 2021-04-29 | 2022-11-03 | 荣耀终端有限公司 | Display screen module and electronic device |
Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20160343964A1 (en) * | 2015-05-19 | 2016-11-24 | Samsung Display Co., Ltd. | Flexible display device and manufacturing method thereof |
| CN106252378A (en) * | 2015-06-08 | 2016-12-21 | 乐金显示有限公司 | Collapsible display device and backboard thereof |
| CN107742639A (en) * | 2017-11-27 | 2018-02-27 | 深圳市华星光电技术有限公司 | Flexible oled display panel and display device |
| CN108550604A (en) * | 2018-04-27 | 2018-09-18 | 武汉华星光电半导体显示技术有限公司 | Production method, flexible back plate and the flexible display apparatus of flexible back plate |
| CN108932074A (en) * | 2017-05-27 | 2018-12-04 | 和鑫光电股份有限公司 | Display device |
| CN109148534A (en) * | 2018-08-21 | 2019-01-04 | 武汉华星光电半导体显示技术有限公司 | display panel and electronic device |
| CN109326712A (en) * | 2018-10-23 | 2019-02-12 | 京东方科技集团股份有限公司 | A kind of preparation method of flexible base board, flexible base board and display panel |
| CN109360845A (en) * | 2018-10-24 | 2019-02-19 | 京东方科技集团股份有限公司 | Display base plate and preparation method thereof, display device and preparation method thereof, display device |
| CN110047881A (en) * | 2019-03-29 | 2019-07-23 | 武汉华星光电半导体显示技术有限公司 | Display panel and display panel production method |
| CN110649070A (en) * | 2019-09-03 | 2020-01-03 | 武汉华星光电半导体显示技术有限公司 | Flexible substrate, flexible display panel and manufacturing method of flexible substrate |
| KR20200058059A (en) * | 2018-11-19 | 2020-05-27 | 엘지디스플레이 주식회사 | Organic light emitting display device |
-
2020
- 2020-06-09 CN CN202010518100.9A patent/CN111724681A/en active Pending
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20160343964A1 (en) * | 2015-05-19 | 2016-11-24 | Samsung Display Co., Ltd. | Flexible display device and manufacturing method thereof |
| CN106252378A (en) * | 2015-06-08 | 2016-12-21 | 乐金显示有限公司 | Collapsible display device and backboard thereof |
| CN108932074A (en) * | 2017-05-27 | 2018-12-04 | 和鑫光电股份有限公司 | Display device |
| CN107742639A (en) * | 2017-11-27 | 2018-02-27 | 深圳市华星光电技术有限公司 | Flexible oled display panel and display device |
| CN108550604A (en) * | 2018-04-27 | 2018-09-18 | 武汉华星光电半导体显示技术有限公司 | Production method, flexible back plate and the flexible display apparatus of flexible back plate |
| CN109148534A (en) * | 2018-08-21 | 2019-01-04 | 武汉华星光电半导体显示技术有限公司 | display panel and electronic device |
| CN109326712A (en) * | 2018-10-23 | 2019-02-12 | 京东方科技集团股份有限公司 | A kind of preparation method of flexible base board, flexible base board and display panel |
| CN109360845A (en) * | 2018-10-24 | 2019-02-19 | 京东方科技集团股份有限公司 | Display base plate and preparation method thereof, display device and preparation method thereof, display device |
| KR20200058059A (en) * | 2018-11-19 | 2020-05-27 | 엘지디스플레이 주식회사 | Organic light emitting display device |
| CN110047881A (en) * | 2019-03-29 | 2019-07-23 | 武汉华星光电半导体显示技术有限公司 | Display panel and display panel production method |
| CN110649070A (en) * | 2019-09-03 | 2020-01-03 | 武汉华星光电半导体显示技术有限公司 | Flexible substrate, flexible display panel and manufacturing method of flexible substrate |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112786622A (en) * | 2021-01-12 | 2021-05-11 | 武汉华星光电半导体显示技术有限公司 | Flexible display panel and preparation method thereof |
| WO2022227727A1 (en) * | 2021-04-29 | 2022-11-03 | 荣耀终端有限公司 | Display screen module and electronic device |
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