CN109321184A - A kind of packaging method of LED light source packaging plastic and indoor display screen - Google Patents
A kind of packaging method of LED light source packaging plastic and indoor display screen Download PDFInfo
- Publication number
- CN109321184A CN109321184A CN201811167183.0A CN201811167183A CN109321184A CN 109321184 A CN109321184 A CN 109321184A CN 201811167183 A CN201811167183 A CN 201811167183A CN 109321184 A CN109321184 A CN 109321184A
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- Prior art keywords
- agent
- light source
- led light
- modified
- epoxy resin
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
Abstract
The present invention provides the packaging methods of a kind of LED light source packaging plastic and indoor display screen, including modified A agent and modified B agent；The modified A agent includes A agent and the bisphenol F epoxy resin with structure shown in formula I: the main component of A agent is bisphenol A epoxide resin, novolac epoxy resin and cycloaliphatic epoxy resin；The modified B agent includes B agent and the polypropylene glycol with II structure of formula；The main component of B agent is acid anhydrides.The polypropylene glycol with II structure of formula in LED light source packaging plastic provided by the invention obtains the acid of long chain type with part anhydride reaction, esters structural resin is generated with the epoxy resin reaction in modified A agent again, colloid can be made to obtain more excellent toughness and adherence, light-focusing type band cup bracket is held in Overwelding and rewelding furnace to be prevented from being layered.The delamination rate of bracket and packaging plastic after encapsulation is 0%；After high temperature and pressure gluten substitute, delamination rate is still 0%.
Description
Technical field
The invention belongs to LED encapsulation technology field more particularly to a kind of encapsulation of LED light source packaging plastic and indoor display screen
Method.
Background technique
The LED light source packaging plastic that indoor display screen P1.8~P6 is used at present is that light-focusing type band cup bracket adds epoxy resin
Glue encapsulates；Band cup bracket includes substrate (adding electroplated structural containing copper material or iron material) and plastic cement reflector.
It is the process schematic of LED delamination in the prior art referring to Fig. 1, Fig. 1；Because plastic rubber material itself has the higher moisture absorption special
Property (water absorption rate is 0.18%~0.3%), so the moisture in encapsulation process and when client SMT in air easily invades modeling
In material, the epoxy glue that packaging plastic uses in addition is all by A agent and B agent mixing preparation: traditional A agent main ingredient is bisphenol-A
Epoxy resin: novolac epoxy resin or cycloaliphatic epoxy resin；B agent is mainly acid anhydrides；After A/B agent mixing under 150 DEG C of high temperature:
Acid anhydrides in B glue can carry out reaction solidification with the epoxy resin in A glue, the epoxy glue T after solidificationgPoint about 120 DEG C~150
DEG C, vapor of the encapsulation particle of this based epoxy resin in Overwelding and rewelding furnace in bracket is easily lifted off plastic cement and substrate junction
Epoxy packages colloid causes epoxidation packaging plastic and bracket delamination, easily causes dead lamp.
Summary of the invention
In view of this, the purpose of the present invention is to provide the packaging method of a kind of LED light source packaging plastic and indoor display screen,
Packaging plastic flexibility with higher and adherence.
The present invention provides a kind of LED light source packaging plastics, including modified A agent and modified B agent；
The modified A agent includes A agent and the bisphenol F epoxy resin with structure shown in formula I: the main component of A agent is bisphenol-A ring
Oxygen resin, novolac epoxy resin and cycloaliphatic epoxy resin；
Wherein, the value of n is 3~5；
The modified B agent includes B agent and the polypropylene glycol with II structure of formula；The main component of B agent is acid anhydrides；
Wherein, the value of m is 200~10000.
Preferably, the mass ratio of the bisphenol F epoxy resin and A agent with structure shown in formula I is 5~20:100.
Preferably, the mass ratio of the polypropylene glycol and B agent with II structure of formula is 100:5~10.
Preferably, the mass ratio of the A agent and the bisphenol F epoxy resin with structure shown in formula I be 100:5,100:10 or
100:20。
Preferably, the mass ratio of the B agent and the polypropylene glycol with II structure of formula is 100:5 or 100:10.
Preferably, the acid anhydrides includes methyl hexahydrophthalic anhydride and hexahydrophthalic anhydride.
The present invention provides a kind of packaging methods of indoor display screen, comprising the following steps:
Solidify after LED light source packaging plastic described in above-mentioned technical proposal is injected light-focusing type band cup bracket.
Preferably, the cured temperature is 145~155 DEG C；The cured time is 3.5~4.5h.
Preferably, before the injection further include:
LED light source packaging plastic segmented is stirred into 3~8min；1~4min of deaeration.
The present invention provides a kind of LED light source packaging plastics, including modified A agent and modified B agent；The modified A agent includes A agent
It is bisphenol A epoxide resin, novolac epoxy resin and alicyclic ring with the bisphenol F epoxy resin with structure shown in formula I: the main component of A agent
Race's epoxy resin；The modified B agent includes B agent and the polypropylene glycol with II structure of formula；The main component of B agent is acid anhydrides.This
The polypropylene glycol with II structure of formula invented in the LED light source packaging plastic provided obtains long chain type with part anhydride reaction
Acid, then esters structural resin is generated with the epoxy resin reaction in modified A agent, along with unreacted acid anhydrides and A in modified B agent
Agent reaction generates esters structural resin, makes colloid obtain more excellent toughness and adherence jointly, holds in Overwelding and rewelding furnace
Light-focusing type band cup bracket prevents from being layered.The results showed that the delamination rate of bracket and packaging plastic after encapsulation is 0%；High temperature is high
After pressing gluten substitute, delamination rate is still 0%.
Detailed description of the invention
Fig. 1 is the process schematic of LED delamination in the prior art；
Fig. 2 is the SAM test chart for the LED light source that the present invention implements 1 preparation；
Fig. 3 is the SAM test chart of the LED light source of comparative example 1 of the present invention preparation；
Fig. 4 is the autoclaving experimental results figure of the LED light source of comparative example 1 of the present invention preparation；
Fig. 5 is the SAM test chart for the LED light source that the present invention implements 2 preparations；
Fig. 6 is the SAM test chart of LED light source prepared by the embodiment of the present invention 3；
Fig. 7 is the autoclaving experimental results figure of LED light source prepared by the embodiment of the present invention 3；
Fig. 8 is the SAM test chart of LED light source prepared by the embodiment of the present invention 4；
Fig. 9 is the SAM test chart of LED light source prepared by the embodiment of the present invention 5；
Figure 10 is the SAM test chart of LED light source prepared by the embodiment of the present invention 6.
Specific embodiment
The present invention provides a kind of LED light source packaging plastics, including modified A agent and modified B agent；
The modified A agent includes A agent and the bisphenol F epoxy resin with structure shown in formula I；The main component of A agent is bisphenol-A ring
Oxygen resin, novolac epoxy resin and cycloaliphatic epoxy resin；
Wherein, the value of n is 3~5；
The modified B agent includes B agent and the polypropylene glycol with II structure of formula；The main component of B agent is acid anhydrides；
Wherein, the value of m is 200~10000.
The polypropylene glycol with II structure of formula in LED light source packaging plastic provided by the invention is obtained with part anhydride reaction
The acid of long chain type, then generate esters structural resin with the epoxy resin reaction in modified A agent can be such that colloid obtains more excellent tough
Property and adherence, in Overwelding and rewelding furnace hold light-focusing type band cup bracket prevent from being layered.
LED light source packaging plastic provided by the invention includes modified A agent；The modified A agent include A agent and have structure shown in formula I
Bisphenol F epoxy resin；The main component of A agent is bisphenol A epoxide resin, novolac epoxy resin and cycloaliphatic epoxy resin.
The bisphenol F epoxy resin has structure shown in formula I:
Wherein, the value of n is 3~5.
The mass ratio of the bisphenol F epoxy resin and A agent with structure shown in formula I is 5~20:100.In specific embodiment
In, the mass ratio of the A agent and the bisphenol F epoxy resin with structure shown in formula I is 100:5,100:10 or 100:20.
LED light source packaging plastic provided by the invention includes modified B agent.The modified B agent include B agent and have II structure of formula
Polypropylene glycol；The main component of B agent is acid anhydrides.Acid anhydrides in the B agent preferably includes methyl hexahydrophthalic anhydride and hexahydrophthalic anhydride.
The polypropylene glycol has II structure of formula:
Wherein, the value of m is 200~10000.
In the present invention, the mass ratio of the polypropylene glycol and B agent with II structure of formula is preferably 100:5~10.?
In specific embodiment, the mass ratio of the B agent and the polypropylene glycol with II structure of formula is 100:5 or 100:10.
Part acid anhydrides reacts in polypropylene glycol and B agent in modified B agent, obtains the acid of long chain type；Wherein, poly- the third two
The reaction of methyl hexahydrophthalic anhydride is referring to reaction equation 1 in pure and mild B agent:
The acid of long chain type has better toughness and adherence, then generates esters with the epoxy resin reaction in modified A agent
Structural resin；Along with unreacted acid anhydrides reacts generation esters structural resin with A agent in the modified B agent of B, jointly colloid is obtained
Superior toughness and adherence are obtained, light-focusing type band cup bracket is held in Overwelding and rewelding furnace to be prevented from being layered.
LED light source packaging plastic is in use, will modified A agent and modified B agent mixing.It is modified A agent when encapsulation uses and changes
The mass ratio of property B agent is preferably 5:4.
The present invention provides a kind of packaging methods of indoor display screen, comprising the following steps:
Solidify after LED light source packaging plastic described in above-mentioned technical proposal is injected light-focusing type band cup bracket.
In the present invention, the cured temperature is preferably 145~155 DEG C；The cured time is preferably 3.5~4.5h.
In the present invention, before the injection further include:
LED light source packaging plastic segmented is stirred into 3~8min；1~4min of deaeration.
The hardness of LED light source packaging plastic after encapsulation is D80 or more.
The present invention places the LED light source of preparation and carries out ultrasound scanning microscope SAM test afterwards for 24 hours.
The present invention carries out autoclaving to the LED light source of preparation and tests PCT:110 DEG C, 100%RH, pressure 2kg/cm2, real
Ultrasound scanning microscope is tested after testing 6h.
In order to further illustrate the present invention, below with reference to embodiment to a kind of LED light source packaging plastic provided by the invention and
The packaging method of indoor display screen is described in detail, but they cannot be interpreted as limiting the scope of the present invention.
In following embodiment, A agent is commercial goods, model DS-JD02A；B agent is commercial goods, model DSJD02；
Bisphenol F epoxy resin and polypropylene glycol are commercial goods.
The structural formula of bisphenol A epoxide resin is as shown in formula III in A agent:
The value of p is 3.
Embodiment 1
The bisphenol F epoxy resin of 5% (A agent weight ratio) is added in A agent, 5% (B agent weight ratio) is added in B glue
Polypropylene glycol stirs 3min~8min, 1~4min of deaeration, obtained modification A agent and modified B using vacuum degasing machine segmented
Agent is baking-curing 4h at 150 DEG C in packaging plastic injection light-focusing type band cup bracket after 5:4 mixing according to mass ratio, then room temperature
After placing for 24 hours, Reflow Soldering is crossed, LED light source is obtained.
The hardness of packaging plastic is D80 or more, is remained unchanged with hardness when not adding bisphenol F epoxy resin and polypropylene glycol.
The present invention carries out ultrasound scanning microscope SAM test to LED light source prepared by embodiment 1, as shown in Fig. 2, Fig. 2
Implement the SAM test chart of the LED light source of 1 preparation for the present invention；As a result, it has been found that the delamination rate of bracket and glue-line is 0%.
The present invention carries out autoclaving experiment PCT: result according to above-mentioned technical proposal to LED light source prepared by embodiment 1
Are as follows: the delamination rate of the bracket of LED light source and glue-line is still 0% after high temperature and pressure.
Comparative example 1
On that basis of example 1, bisphenol F epoxy resin and polypropylene glycol are not added, LED light source is made.
After being placed at room temperature for for 24 hours, the present invention carries out SAM test to LED light source prepared by comparative example 1, as a result sees that Fig. 3, Fig. 3 are
The SAM test chart of LED light source prepared by comparative example 1 of the present invention；As a result, it has been found that being not added with bisphenol F epoxy resin and polypropylene glycol
Delamination rate reaches 56%.
The present invention carries out autoclaving to LED light source prepared by comparative example 1 and tests PCT:110 DEG C, 100%RH, pressure
2kg/cm2, ultrasound scanning microscope is tested after testing 6h, and such as Fig. 4, Fig. 4 are the LED light of comparative example 1 of the present invention preparation
The autoclaving experimental results figure in source；Fig. 4 it is found that after high temperature and pressure the bracket of LED light source and glue-line delamination rate
It is 100%.
Embodiment 2
The bisphenol F epoxy resin of 10% (A agent weight ratio) is added in A agent, 5% (B agent weight ratio) is added in B glue
Polypropylene glycol after particle is placed at room temperature for for 24 hours after encapsulation, crosses Reflow Soldering, obtains LED light source.
The LED light source that the present invention prepares embodiment 2 is tested, as shown in figure 5, Fig. 5 is that the present invention implements 2 preparations
The SAM test chart of LED light source；As a result, it has been found that the delamination rate of bracket and glue-line is 0%.
The present invention carries out autoclaving experiment PCT to LED light source prepared by embodiment 2, as a result, it has been found that, by high temperature and pressure
The delamination rate of the bracket of LED light source and glue-line is still 0% afterwards.
Embodiment 3
The poly- of 5% (B agent weight ratio) is added in the bisphenol F epoxy resin for adding 20% (A agent weight ratio) in A agent in B glue
Propylene glycol after particle is placed at room temperature for for 24 hours after encapsulation, crosses Reflow Soldering, obtains LED light source.
The LED light source that the present invention prepares embodiment 3 is tested, as shown in fig. 6, Fig. 6 is the preparation of the embodiment of the present invention 3
LED light source SAM test chart；As a result, it has been found that the delamination rate of bracket and glue-line is 0%.
The present invention carries out autoclaving experiment PCT to LED light source prepared by embodiment 3, as shown in fig. 7, Fig. 7 is the present invention
The autoclaving experimental results figure of LED light source prepared by embodiment 3；As a result, it has been found that the LED light source after high temperature and pressure
The delamination rate of bracket and glue-line is still 0%.
Embodiment 4
The poly- of 10% (B agent weight ratio) is added in the bisphenol F epoxy resin for adding 5% (A agent weight ratio) in A agent in B glue
Propylene glycol after particle is placed at room temperature for for 24 hours after encapsulation, crosses Reflow Soldering, obtains LED light source.
The LED light source that the present invention prepares embodiment 4 is tested, as shown in figure 8, Fig. 8 is the preparation of the embodiment of the present invention 4
LED light source SAM test chart；As a result, it has been found that the delamination rate of bracket and glue-line is 0%.
The present invention carries out autoclaving experiment PCT to LED light source prepared by embodiment 4, as a result, it has been found that, by high temperature and pressure
The delamination rate of the bracket of LED light source and glue-line is still 0% afterwards.
Embodiment 5
The bisphenol F epoxy resin for adding 10% (A agent weight ratio) in A agent, is added 10% (B agent weight ratio) in B glue
Polypropylene glycol after particle is placed at room temperature for for 24 hours after encapsulation, crosses Reflow Soldering, obtains LED light source.
The LED light source that the present invention prepares embodiment 5 is tested, as shown in figure 9, Fig. 9 is the preparation of the embodiment of the present invention 5
LED light source SAM test chart；As a result, it has been found that the delamination rate of bracket and glue-line is 0%.
The present invention carries out autoclaving experiment PCT to LED light source prepared by embodiment 5, as a result, it has been found that, by high temperature and pressure
The delamination rate of the bracket of LED light source and glue-line is still 0% afterwards.
Embodiment 6
The bisphenol F epoxy resin for adding 20% (A agent weight ratio) in A agent, is added 10% (B agent weight ratio) in B glue
Polypropylene glycol after particle is placed at room temperature for for 24 hours after encapsulation, crosses Reflow Soldering, obtains LED light source.
The LED light source that the present invention prepares embodiment 6 is tested, and as shown in Figure 10, Figure 10 is the system of the embodiment of the present invention 6
The SAM test chart of standby LED light source；As a result, it has been found that the delamination rate of bracket and glue-line is 0%.
The present invention carries out autoclaving experiment PCT to LED light source prepared by embodiment 6, as a result, it has been found that, by high temperature and pressure
The delamination rate of the bracket of LED light source and glue-line is still 0% afterwards.
As seen from the above embodiment, the present invention provides a kind of LED light source packaging plastics, including modified A agent and modified B agent；
The modified A agent includes A agent and the bisphenol F epoxy resin with structure shown in formula I: the main component of A agent be bisphenol A epoxide resin,
Novolac epoxy resin and cycloaliphatic epoxy resin；The modified B agent includes B agent and the polypropylene glycol with II structure of formula；B agent
Main component is acid anhydrides.The polypropylene glycol and part acid anhydrides with II structure of formula in LED light source packaging plastic provided by the invention
Reaction obtains the acid of long chain type, then generates lipid structures resin with the epoxy resin reaction in modified A agent, can make colloid obtain compared with
Excellent toughness and adherence, holding light-focusing type band cup bracket in Overwelding and rewelding furnace prevents from being layered.The results showed that after encapsulation
Bracket and packaging plastic delamination rate be 0%；After high temperature and pressure gluten substitute, delamination rate is still 0%.
The above is only a preferred embodiment of the present invention, it is noted that for the ordinary skill people of the art
For member, various improvements and modifications may be made without departing from the principle of the present invention, these improvements and modifications are also answered
It is considered as protection scope of the present invention.
Claims (9)
- It is made 1. being reacted after a kind of LED light source packaging plastic, modified A agent and modified B agent mixing；The modified A agent includes A agent and the bisphenol F epoxy resin with structure shown in formula I；The main component of A agent is bisphenol-A epoxy tree Rouge, novolac epoxy resin and cycloaliphatic epoxy resin；Wherein, the value of n is 3~5；The modified B agent includes B agent and the polypropylene glycol with II structure of formula；The main component of B agent is acid anhydrides；Wherein, the value of m is 200~10000.
- 2. LED light source packaging plastic according to claim 1, which is characterized in that the Bisphenol F epoxy with structure shown in formula I Resin and the mass ratio of A agent are 5~20:100.
- 3. LED light source packaging plastic according to claim 1, which is characterized in that the polypropylene glycol with II structure of formula Mass ratio with B agent is 100:5~10.
- 4. LED light source packaging plastic according to claim 1, which is characterized in that the A agent and the Bisphenol F with structure shown in formula I The mass ratio of epoxy resin is 100:5,100:10 or 100:20.
- 5. LED light source packaging plastic according to claim 1, which is characterized in that the B agent and with II structure of formula poly- third The mass ratio of glycol is 100:5 or 100:10.
- 6. LED light source packaging plastic according to claim 1, which is characterized in that the acid anhydrides include methyl hexahydrophthalic anhydride and Hexahydrophthalic anhydride.
- 7. a kind of packaging method of indoor display screen, comprising the following steps:It will solidify after any one of the claim 1~6 LED light source packaging plastic injection light-focusing type band cup bracket.
- 8. packaging method according to claim 7, which is characterized in that the cured temperature is 145~155 DEG C；Solidification Time be 3.5~4.5h.
- 9. packaging method according to claim 7, which is characterized in that before the injection further include:LED light source packaging plastic segmented is stirred into 3~8min；1~4min of deaeration.
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| CN201811167183.0A CN109321184B (en) | 2018-10-08 | 2018-10-08 | LED light source packaging adhesive and packaging method of indoor display screen |
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| CN201811167183.0A CN109321184B (en) | 2018-10-08 | 2018-10-08 | LED light source packaging adhesive and packaging method of indoor display screen |
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| CN103937159A (en) * | 2014-03-25 | 2014-07-23 | 佛山市南海新丝路绝缘材料有限公司 | High-performance heat-resisting epoxy resin compound for LED packaging |
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| CN101704988A (en) * | 2009-11-23 | 2010-05-12 | 东莞市永兴电子科技有限公司 | Method for preparing fluorescent powder colloid |
| JP2011256372A (en) * | 2010-05-10 | 2011-12-22 | Ajinomoto Co Inc | Resin composition |
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