CN109321184B - LED light source packaging adhesive and packaging method of indoor display screen - Google Patents
LED light source packaging adhesive and packaging method of indoor display screen Download PDFInfo
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- CN109321184B CN109321184B CN201811167183.0A CN201811167183A CN109321184B CN 109321184 B CN109321184 B CN 109321184B CN 201811167183 A CN201811167183 A CN 201811167183A CN 109321184 B CN109321184 B CN 109321184B
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 48
- 239000000853 adhesive Substances 0.000 title claims abstract description 41
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 41
- 238000000034 method Methods 0.000 title claims abstract description 14
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 105
- 229920001451 polypropylene glycol Polymers 0.000 claims abstract description 30
- 239000004842 bisphenol F epoxy resin Substances 0.000 claims abstract description 24
- 239000003822 epoxy resin Substances 0.000 claims abstract description 16
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 16
- 150000008064 anhydrides Chemical group 0.000 claims abstract description 10
- 150000008065 acid anhydrides Chemical class 0.000 claims abstract description 9
- 239000004841 bisphenol A epoxy resin Substances 0.000 claims abstract description 9
- 239000003607 modifier Substances 0.000 claims abstract description 9
- 125000002723 alicyclic group Chemical group 0.000 claims abstract description 8
- 239000004843 novolac epoxy resin Substances 0.000 claims abstract description 8
- 239000003292 glue Substances 0.000 claims description 6
- VYKXQOYUCMREIS-UHFFFAOYSA-N methylhexahydrophthalic anhydride Chemical compound C1CCCC2C(=O)OC(=O)C21C VYKXQOYUCMREIS-UHFFFAOYSA-N 0.000 claims description 4
- 238000003756 stirring Methods 0.000 claims description 4
- MUTGBJKUEZFXGO-OLQVQODUSA-N (3as,7ar)-3a,4,5,6,7,7a-hexahydro-2-benzofuran-1,3-dione Chemical compound C1CCC[C@@H]2C(=O)OC(=O)[C@@H]21 MUTGBJKUEZFXGO-OLQVQODUSA-N 0.000 claims description 3
- 230000032798 delamination Effects 0.000 abstract description 27
- 238000002474 experimental method Methods 0.000 abstract description 16
- 238000010411 cooking Methods 0.000 abstract description 13
- 239000000084 colloidal system Substances 0.000 abstract description 7
- 229920005989 resin Polymers 0.000 abstract description 7
- 239000011347 resin Substances 0.000 abstract description 7
- 239000002253 acid Substances 0.000 abstract description 6
- 150000002148 esters Chemical class 0.000 abstract description 6
- 238000012360 testing method Methods 0.000 description 23
- 239000012790 adhesive layer Substances 0.000 description 13
- 230000000052 comparative effect Effects 0.000 description 7
- 239000002245 particle Substances 0.000 description 6
- 238000005476 soldering Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- 239000004033 plastic Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000005034 decoration Methods 0.000 description 2
- 229920006335 epoxy glue Polymers 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 239000013065 commercial product Substances 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 125000003473 lipid group Chemical group 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Organic Chemistry (AREA)
- Computer Hardware Design (AREA)
- Theoretical Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Led Device Packages (AREA)
- Epoxy Resins (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention provides an LED light source packaging adhesive and a packaging method of an indoor display screen, which comprises a modifying agent A and a modifying agent B; the modifier A comprises an agent A and bisphenol F epoxy resin with a structure shown in a formula I: the main components of the agent A are bisphenol A epoxy resin, novolac epoxy resin and alicyclic epoxy resin; the modifying agent B comprises an agent B and polypropylene glycol with a structure shown in a formula II; the main component of the agent B is anhydride. The polypropylene glycol with the structure of formula II in the LED light source packaging adhesive provided by the invention reacts with partial acid anhydride to obtain long-chain acid, and then reacts with the epoxy resin in the modifying agent A to generate ester structural resin, so that the colloid can obtain excellent toughness and adherence, and the light-gathering type cup support is pulled to prevent delamination when the colloid passes through a reflow oven. The delamination rate of the encapsulated bracket and the encapsulated adhesive is 0 percent; after the high-temperature and high-pressure cooking experiment, the delamination rate is still 0 percent.
Description
Technical Field
The invention belongs to the technical field of LED packaging, and particularly relates to an LED light source packaging adhesive and a packaging method of an indoor display screen.
Background
The LED light source packaging adhesive used by the current indoor display screens P1.8-P6 is formed by packaging a light-gathering type cup support and epoxy resin adhesive; the cup-contained support comprises a base material (a copper-contained material or an iron material and an electroplating structure) and a plastic reflection cup.
Referring to fig. 1, fig. 1 is a schematic diagram of a prior art LED delamination process; because the plastic material has higher moisture absorption characteristic (the water absorption rate is 0.18-0.3%), moisture in air is easy to invade into the plastic in the packaging process and in the SMT of customers, and the epoxy glue used by the packaging glue is prepared by mixing the agent A and the agent B: the traditional agent A mainly comprises bisphenol A epoxy resin: novolac epoxy resins or alicyclic epoxy resins; the agent B is mainly anhydride; mixing the A/B agents at a high temperature of 150 ℃: acid anhydride in the glue B can react with epoxy resin in the glue A for curing, and the cured epoxy glue TgThe temperature is about 120-150 ℃, when the packaging particles of the epoxy resin pass through a reflow furnace, water vapor in the bracket is easy to prop away from the epoxy packaging adhesive at the joint of the plastic and the base material, so that the epoxy packaging adhesive is delaminated from the bracket, and the lamp is easy to be killed.
Disclosure of Invention
In view of the above, the present invention is directed to an LED light source packaging adhesive and a method for packaging an indoor display screen, wherein the packaging adhesive has high flexibility and adhesion.
The invention provides an LED light source packaging adhesive, which comprises a modifying agent A and a modifying agent B;
the modifier A comprises an agent A and bisphenol F epoxy resin with a structure shown in a formula I: the main components of the agent A are bisphenol A epoxy resin, novolac epoxy resin and alicyclic epoxy resin;
wherein the value of n is 3-5;
the modifying agent B comprises an agent B and polypropylene glycol with a structure shown in a formula II; the main component of the agent B is anhydride;
wherein the value of m is 200-10000.
Preferably, the mass ratio of the bisphenol F epoxy resin with the structure of the formula I to the agent A is 5-20: 100.
Preferably, the mass ratio of the polypropylene glycol with the structure of the formula II to the agent B is 100: 5-10.
Preferably, the mass ratio of the agent A to the bisphenol F epoxy resin with the structure of the formula I is 100:5, 100:10 or 100: 20.
Preferably, the mass ratio of the agent B to the polypropylene glycol with the structure of the formula II is 100:5 or 100: 10.
Preferably, the acid anhydride includes methyl hexahydrophthalic anhydride and hexahydrophthalic anhydride.
The invention provides a packaging method of an indoor display screen, which comprises the following steps:
and injecting the LED light source packaging adhesive into a light-gathering type cup support and then curing.
Preferably, the curing temperature is 145-155 ℃; the curing time is 3.5-4.5 h.
Preferably, the injection further comprises:
stirring the LED light source packaging glue in a sectional manner for 3-8 min; and (5) defoaming for 1-4 min.
The invention provides an LED light source packaging adhesive, which comprises a modifying agent A and a modifying agent B; the modifier A comprises an agent A and bisphenol F epoxy resin with a structure shown in a formula I: the main components of the agent A are bisphenol A epoxy resin, novolac epoxy resin and alicyclic epoxy resin; the modifying agent B comprises an agent B and polypropylene glycol with a structure shown in a formula II; the main component of the agent B is anhydride. The polypropylene glycol with the structure of formula II in the LED light source packaging adhesive provided by the invention reacts with partial acid anhydride to obtain long-chain acid, then reacts with epoxy resin in the modified agent A to generate ester structure resin, and unreacted acid anhydride in the modified agent B reacts with the agent A to generate ester structure resin, so that the adhesive obtains excellent toughness and adherence, and the light-gathering cup-type bracket is pulled to prevent delamination when the adhesive passes through a reflow furnace. The experimental results show that: the delamination rate of the encapsulated bracket and the encapsulated adhesive is 0 percent; after the high-temperature and high-pressure cooking experiment, the delamination rate is still 0 percent.
Drawings
FIG. 1 is a schematic diagram of a prior art LED delamination process;
FIG. 2 is a SAM test chart of an LED light source prepared in accordance with embodiment 1 of the present invention;
FIG. 3 is a SAM test chart of an LED light source prepared in comparative example 1 of the present invention;
FIG. 4 is a graph of the results of a high pressure cooker test of an LED light source made according to comparative example 1 of the present invention;
FIG. 5 is a SAM test chart of an LED light source prepared in accordance with embodiment 2 of the present invention;
FIG. 6 is a SAM test chart of an LED light source prepared in example 3 of the present invention;
FIG. 7 is a graph of the test results of the autoclaving experiment for the LED light source prepared in example 3 of the present invention;
FIG. 8 is a SAM test chart of an LED light source prepared in example 4 of the present invention;
FIG. 9 is a SAM test chart of an LED light source prepared in example 5 of the present invention;
fig. 10 is a SAM test chart of the LED light source prepared in example 6 of the present invention.
Detailed Description
The invention provides an LED light source packaging adhesive, which comprises a modifying agent A and a modifying agent B;
the modifier A comprises an agent A and bisphenol F epoxy resin with a structure shown in a formula I; the main components of the agent A are bisphenol A epoxy resin, novolac epoxy resin and alicyclic epoxy resin;
wherein the value of n is 3-5;
the modifying agent B comprises an agent B and polypropylene glycol with a structure shown in a formula II; the main component of the agent B is anhydride;
wherein the value of m is 200-10000.
The polypropylene glycol with the structure of formula II in the LED light source packaging adhesive provided by the invention reacts with partial acid anhydride to obtain long-chain acid, and then reacts with the epoxy resin in the modifying agent A to generate ester structural resin, so that the colloid can obtain excellent toughness and adherence, and the light-gathering type cup support is pulled to prevent delamination when the colloid passes through a reflow oven.
The LED light source packaging adhesive provided by the invention comprises a modifying agent A; the modifier A comprises an agent A and bisphenol F epoxy resin with a structure shown in a formula I; the main components of the agent A are bisphenol A epoxy resin, novolac epoxy resin and alicyclic epoxy resin.
The bisphenol F epoxy resin has a structure shown in formula I:
wherein the value of n is 3-5.
The mass ratio of the bisphenol F epoxy resin with the structure shown in the formula I to the agent A is 5-20: 100. In specific embodiments, the mass ratio of the agent A to the bisphenol F epoxy resin having the structure of formula I is 100:5, 100:10, or 100: 20.
The LED light source packaging adhesive provided by the invention comprises a modified B agent. The modifying agent B comprises an agent B and polypropylene glycol with a structure shown in a formula II; the main component of the agent B is anhydride. The acid anhydride in the agent B preferably includes methyl hexahydrophthalic anhydride and hexahydrophthalic anhydride.
The polypropylene glycol has a structure of formula II:
wherein the value of m is 200-10000.
In the invention, the mass ratio of the polypropylene glycol with the structure of the formula II to the agent B is preferably 100: 5-10. In specific embodiments, the mass ratio of the agent B to the polypropylene glycol having the structure of formula II is 100:5 or 100: 10.
Polypropylene glycol in the modifying agent B reacts with partial anhydride in the modifying agent B to obtain long-chain acid; wherein, the reaction of polypropylene glycol and methyl hexahydrophthalic anhydride in the agent B is shown in a reaction formula 1:
the long-chain acid has better toughness and adherence, and reacts with the epoxy resin in the modifying agent A to generate ester structural resin; and unreacted anhydride in the B modified agent B reacts with the A agent to generate ester structural resin, so that the colloid obtains more excellent toughness and adherence, and the light-gathering type cup support is pulled to prevent delamination when passing through a reflow furnace.
When the LED light source packaging adhesive is used, the modifying agent A and the modifying agent B are mixed. The mass ratio of the modifier A to the modifier B is preferably 5:4 when the packaging is used.
The invention provides a packaging method of an indoor display screen, which comprises the following steps:
and injecting the LED light source packaging adhesive into a light-gathering type cup support and then curing.
In the invention, the curing temperature is preferably 145-155 ℃; the curing time is preferably 3.5-4.5 h.
In the present invention, before the injecting, the method further comprises:
stirring the LED light source packaging glue in a sectional manner for 3-8 min; and (5) defoaming for 1-4 min.
The hardness of the LED light source packaging adhesive after packaging is more than D80.
The prepared LED light source is placed for 24 hours and then subjected to SAM test of an ultrasonic scanning microscope.
The invention carries out a high-pressure cooking experiment on the prepared LED light source, wherein the high-pressure cooking experiment is as follows: 110 ℃, 100% RH, pressure 2kg/cm2And 6h later, testing by an ultrasonic scanning microscope.
For further explanation of the present invention, the following will describe in detail an LED light source package adhesive and a method for packaging an indoor display screen according to the present invention with reference to the following examples, which should not be construed as limiting the scope of the present invention.
In the following examples, the agent A is a commercially available product with the model number of DS-JD 02A; the agent B is a commercial product with the model number of DSJD 02; bisphenol F epoxy resin and polypropylene glycol are both commercially available.
The structural formula of the bisphenol A epoxy resin in the agent A is shown as a formula III:
the value of p is 3.
Example 1
Adding 5 percent (the weight ratio of the agent A) of bisphenol F epoxy resin into the agent A, adding 5 percent (the weight ratio of the agent B) of polypropylene glycol into the agent B, stirring for 3-8 min in a sectional manner by using a vacuum defoaming machine, defoaming for 1-4 min, mixing the obtained modified agent A and the modified agent B according to the mass ratio of 5:4, injecting the packaging adhesive into a light-gathering type cup support, baking and curing for 4h at 150 ℃, standing for 24h at room temperature, and performing reflow soldering to obtain the LED light source.
The hardness of the packaging adhesive is more than D80, and is not changed with the hardness when bisphenol F epoxy resin and polypropylene glycol are not added.
The present invention performs an ultrasonic scanning microscope SAM test on the LED light source prepared in example 1, as shown in fig. 2, fig. 2 is a SAM test chart of the LED light source prepared in example 1 of the present invention; as a result, the delamination rate of the scaffold and the adhesive layer was found to be 0%.
According to the invention, the LED light source prepared in the embodiment 1 is subjected to a high-pressure cooking experiment PCT: the results were: the delamination rate of the support and the adhesive layer of the LED light source is still 0% after the high temperature and the high pressure.
Comparative example 1
On the basis of example 1, bisphenol F epoxy resin and polypropylene glycol were not added to prepare an LED light source.
After being placed at room temperature for 24 hours, the LED light source prepared in comparative example 1 is subjected to SAM test, and the result is shown in FIG. 3, and FIG. 3 is a SAM test chart of the LED light source prepared in comparative example 1; as a result, it was found that the delamination rate reached 56% without adding the bisphenol F epoxy resin and the polypropylene glycol.
The invention performs a high-pressure cooking experiment on the LED light source prepared in the comparative example 1, wherein the high-pressure cooking experiment is as follows: 110 ℃, 100% RH, pressure 2kg/cm2After the experiment for 6h, performing the test by using an ultrasonic scanning microscope, as shown in fig. 4, wherein fig. 4 is a test result chart of the autoclaving experiment of the LED light source prepared in comparative example 1; as can be seen from fig. 4, the delamination rate of the support and the adhesive layer of the LED light source after high temperature and high pressure is 100%.
Example 2
And adding 10 percent (the weight ratio of the agent A) of bisphenol F epoxy resin into the agent A, adding 5 percent (the weight ratio of the agent B) of polypropylene glycol into the adhesive B, standing the packaged particles for 24 hours at room temperature, and performing reflow soldering to obtain the LED light source.
The LED light source prepared in example 2 was tested by the present invention, as shown in fig. 5, fig. 5 is a SAM test chart of the LED light source prepared in example 2 of the present invention; as a result, the delamination rate of the scaffold and the adhesive layer was found to be 0%.
According to the invention, the high-pressure cooking experiment PCT is carried out on the LED light source prepared in the example 2, and the result shows that the delamination rate of the bracket and the adhesive layer of the LED light source is still 0% after the high temperature and the high pressure are carried out.
Example 3
And adding 20 percent (weight ratio of the agent A) of bisphenol F epoxy resin into the agent A, adding 5 percent (weight ratio of the agent B) of polypropylene glycol into the adhesive B, standing the packaged particles for 24 hours at room temperature, and performing reflow soldering to obtain the LED light source.
The LED light source prepared in example 3 was tested by the present invention, as shown in fig. 6, fig. 6 is a SAM test chart of the LED light source prepared in example 3 of the present invention; as a result, the delamination rate of the scaffold and the adhesive layer was found to be 0%.
The invention performs a high-pressure cooking experiment PCT on the LED light source prepared in the embodiment 3, as shown in FIG. 7, FIG. 7 is a high-pressure cooking experiment test result diagram of the LED light source prepared in the embodiment 3 of the invention; as a result, the delamination rate of the support and the adhesive layer of the LED light source is still 0% after the high temperature and high pressure.
Example 4
And adding 5 percent (weight ratio of the agent A) of bisphenol F epoxy resin into the agent A, adding 10 percent (weight ratio of the agent B) of polypropylene glycol into the adhesive B, standing the packaged particles for 24 hours at room temperature, and performing reflow soldering to obtain the LED light source.
The LED light source prepared in example 4 was tested by the present invention, as shown in fig. 8, fig. 8 is a SAM test chart of the LED light source prepared in example 4 of the present invention; as a result, the delamination rate of the scaffold and the adhesive layer was found to be 0%.
According to the invention, the high-pressure cooking experiment PCT is carried out on the LED light source prepared in the embodiment 4, and the result shows that the delamination rate of the bracket and the adhesive layer of the LED light source is still 0% after the high-temperature and high-pressure treatment.
Example 5
And adding 10 percent (weight ratio of the agent A) of bisphenol F epoxy resin into the agent A, adding 10 percent (weight ratio of the agent B) of polypropylene glycol into the adhesive B, standing the packaged particles for 24 hours at room temperature, and performing reflow soldering to obtain the LED light source.
The LED light source prepared in example 5 was tested by the present invention, as shown in fig. 9, fig. 9 is a SAM test chart of the LED light source prepared in example 5 of the present invention; as a result, the delamination rate of the scaffold and the adhesive layer was found to be 0%.
According to the invention, the high-pressure cooking experiment PCT is carried out on the LED light source prepared in the example 5, and the result shows that the delamination rate of the bracket and the adhesive layer of the LED light source is still 0% after the high temperature and the high pressure are carried out.
Example 6
And adding 20 percent (weight ratio of the agent A) of bisphenol F epoxy resin into the agent A, adding 10 percent (weight ratio of the agent B) of polypropylene glycol into the adhesive B, standing the packaged particles for 24 hours at room temperature, and performing reflow soldering to obtain the LED light source.
The LED light source prepared in example 6 was tested by the present invention, as shown in fig. 10, fig. 10 is a SAM test chart of the LED light source prepared in example 6 of the present invention; as a result, the delamination rate of the scaffold and the adhesive layer was found to be 0%.
The invention performs PCT on the LED light source prepared in the embodiment 6, and the result shows that the delamination rate of the bracket and the adhesive layer of the LED light source is still 0% after the high temperature and the high pressure.
From the above embodiments, the invention provides an LED light source packaging adhesive, which includes a modifying agent a and a modifying agent B; the modifier A comprises an agent A and bisphenol F epoxy resin with a structure shown in a formula I: the main components of the agent A are bisphenol A epoxy resin, novolac epoxy resin and alicyclic epoxy resin; the modifying agent B comprises an agent B and polypropylene glycol with a structure shown in a formula II; the main component of the agent B is anhydride. The polypropylene glycol with the structure of formula II in the LED light source packaging adhesive provided by the invention reacts with partial acid anhydride to obtain long-chain acid, and then reacts with the epoxy resin in the modifying agent A to generate resin with a lipid structure, so that the colloid can obtain excellent toughness and adherence, and the light-gathering type cup support is pulled to prevent delamination when the colloid passes through a reflow furnace. The experimental results show that: the delamination rate of the encapsulated bracket and the encapsulated adhesive is 0 percent; after the high-temperature and high-pressure cooking experiment, the delamination rate is still 0 percent.
The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, various modifications and decorations can be made without departing from the principle of the present invention, and these modifications and decorations should also be regarded as the protection scope of the present invention.
Claims (6)
1. An LED light source packaging adhesive is prepared by mixing a modifying agent A and a modifying agent B and then reacting;
the modifier A comprises an agent A and bisphenol F epoxy resin with a structure shown in a formula I; the main components of the agent A are bisphenol A epoxy resin, novolac epoxy resin and alicyclic epoxy resin;
wherein the value of n is 3-5;
the modifying agent B comprises an agent B and polypropylene glycol with a structure shown in a formula II; the main component of the agent B is anhydride;
wherein the value of m is 200-10000;
the mass ratio of the bisphenol F epoxy resin with the structure of the formula I to the agent A is 5-20: 100;
the mass ratio of the polypropylene glycol with the structure of the formula II to the agent B is 5-10: 100;
the acid anhydride includes methyl hexahydrophthalic anhydride and hexahydrophthalic anhydride.
2. The LED light source packaging adhesive as claimed in claim 1, wherein the mass ratio of the bisphenol F epoxy resin with the structure of formula I to the agent A is 5:100, 10:100 or 20: 100.
3. The LED light source packaging adhesive as claimed in claim 1, wherein the mass ratio of the polypropylene glycol with the structure of formula II to the agent B is 5:100 or 10: 100.
4. A packaging method of an indoor display screen comprises the following steps:
injecting the LED light source packaging adhesive of any one of claims 1 to 3 into a light-gathering type cup support and then curing.
5. The packaging method according to claim 4, wherein the curing temperature is 145-155 ℃; the curing time is 3.5-4.5 h.
6. The method of claim 4, further comprising, prior to the injecting:
stirring the LED light source packaging glue in a sectional manner for 3-8 min; and (5) defoaming for 1-4 min.
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| CN101704988A (en) * | 2009-11-23 | 2010-05-12 | 东莞市永兴电子科技有限公司 | Method for preparing fluorescent powder colloid |
| TW201213441A (en) * | 2010-05-10 | 2012-04-01 | Ajinomoto Kk | Resin composition |
| CN102702682A (en) * | 2012-05-25 | 2012-10-03 | 嘉兴市嘉港合成材料有限公司 | Liquid epoxy resin composition for packaging LED (Light Emitting Diode) |
| CN103937159A (en) * | 2014-03-25 | 2014-07-23 | 佛山市南海新丝路绝缘材料有限公司 | High-performance heat-resisting epoxy resin compound for LED packaging |
| CN104761871B (en) * | 2015-04-08 | 2017-07-28 | 汕头市骏码凯撒有限公司 | A kind of LED encapsulating epoxy resins encapsulating material and preparation method thereof |
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