CN109309980A - Electromagnetic cooking appliance, coil panel and its manufacturing method for electromagnetic cooking appliance - Google Patents
Electromagnetic cooking appliance, coil panel and its manufacturing method for electromagnetic cooking appliance Download PDFInfo
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- CN109309980A CN109309980A CN201710633603.9A CN201710633603A CN109309980A CN 109309980 A CN109309980 A CN 109309980A CN 201710633603 A CN201710633603 A CN 201710633603A CN 109309980 A CN109309980 A CN 109309980A
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- layer
- bracket
- metal layer
- cooking appliance
- coil panel
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B6/00—Heating by electric, magnetic or electromagnetic fields
- H05B6/02—Induction heating
- H05B6/36—Coil arrangements
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- Electromagnetism (AREA)
- Chemically Coating (AREA)
Abstract
The invention discloses a kind of electromagnetic cooking appliance, for the coil panel and its manufacturing method of electromagnetic cooking appliance, coil panel includes: bracket；Coil, coil include body layer, and body layer is etched and formed by the electroless metal layer and electroplated metal layer being cascading on a side surface of bracket.Coil panel according to an embodiment of the present invention can reduce cost of manufacture, and technique is simpler, and manufacture is easier, and may be implemented to be thinned, and be advantageously implemented the miniaturization of coil panel, meanwhile, coil can be more easily implemented a variety of different shapes.
Description
Technical field
The present invention relates to kitchen appliance technical field, more particularly, to a kind of coil panel for electromagnetic cooking appliance,
The manufacturing method of the coil panel and electromagnetic cooking appliance with the coil panel.
Background technique
In the related art, the coil of the small household appliances heated using IH mode system generally by the way of coiling enameled wire
Make.This wire winding complexity is easy to appear the deficient manufacturing procedures such as wire jumper, scratch, short-term, and the form of coil is very single.For
Many wire casings need to be arranged in the coiling of cooperation coil on the plastic basis material for carrying coil, and design is complicated, is opened and changes the mould period
It is long, it is at high cost.The coil panel of multistage IH computer heating control is several component combinations, and entire coil panel component is thick, again, structure
Sufficiently complex, this is all unfavorable to the miniaturization and lightweight of small household appliances.
In addition to this, coil panel is also manufactured using LDS (laser direct forming) technology, but needed using special
Material, and preparation process is cumbersome, and product quality is not easy to control, and the structure of coil panel still has much room for improvement.
Summary of the invention
The present invention is directed at least solve one of the technical problems existing in the prior art.For this purpose, the present invention proposes a kind of use
In the coil panel of electromagnetic cooking appliance, the coil panel is easily manufactured and cost reduces.
The invention also provides a kind of electromagnetic cooking appliances with above-mentioned coil panel.
The invention also provides a kind of manufacturing methods of above-mentioned coil panel.
Coil panel according to an embodiment of the present invention for electromagnetic cooking appliance, comprising: bracket；Coil, the coil packet
Include body layer, the body layer is by the electroless metal layer and electroplating gold that are cascading on a side surface of the bracket
Belong to layer to etch to be formed.
Coil panel according to an embodiment of the present invention can reduce cost of manufacture, and technique is simpler, and manufacture is easier, and can
It is thinned with realizing, is advantageously implemented the miniaturization of coil panel, meanwhile, coil can be more easily implemented a variety of different shapes.
In addition, the coil panel according to the above embodiment of the present invention for electromagnetic cooking appliance can also have following add
Technical characteristic:
In some embodiments of the invention, the electroless metal layer is chemical plating copper layer.
Optionally, the electroplated metal layer is copper electroplating layer, plating silver layer or plating layer gold.
According to some embodiments of the present invention, the coil further include: protective layer, the protective layer are coated on the ontology
On the outer surface of layer.
Optionally, the protective layer is metal layer, silicone layer or insulating lacquer layer.
Further, the metal layer is electroless nickel layer, plating layer gold or plating silver layer.
Optionally, the protective layer with a thickness of 5 microns -10 microns.
According to some embodiments of the present invention, the electroless metal layer with a thickness of 5 microns -10 microns, the plating
Metal layer with a thickness of 200 microns -500 microns.
Optionally, the body layer is formed as spiral shape, and line width is 1 millimeter -3 millimeters, and spacing is 0.2 millimeter of -1 milli
Rice, circle number are -35 circle of 25 circle.
According to some embodiments of the present invention, the bracket is plastic stent.
Further, the bracket is by polycarbonate and acrylonitrile-butadiene-styrene copolymer, poly terephthalic acid
The injection molding of at least one of butanediol ester, polypropylene, polycarbonate, polyphenylene sulfide.
The electromagnetic cooking appliance of embodiment according to a second aspect of the present invention, including it is according to an embodiment of the present invention for electromagnetism
The coil panel of cooking apparatus.
The manufacturing method of the coil panel for electromagnetic cooking appliance of embodiment according to a third aspect of the present invention, including it is following
Step:
Obtain the bracket；Chemical plating is carried out to form the electroless metal layer to the surface of the bracket；?
Electroplating processes are carried out on the electroless metal layer, to form the electroless metal layer and electroplated metal layer that are stacked；To institute
Body layer is stated to be etched to form the body layer.
Further, the chemical plating the following steps are included:
The greasy dirt on the surface of the bracket is removed using degreasing fluid；The bracket is put into coarsening solution and is roughened, so that institute
State the roughing in surface of bracket；The surface of the bracket is neutralized；The bracket is put into palladium body activating solution and is carried out
It is activated；Dispergation processing is carried out to the bracket；Chemical plating is carried out to the bracket, to form the electroless metal layer.
Optionally, the degreasing fluid is alkaline degreasing liquid.
Optionally, treatment temperature when degreasing is 50 DEG C -70 DEG C.
According to some embodiments of the present invention, the coarsening solution is the chromic anhydride and 350g/L-400g/L of 350g/L-450g/L
Sulfuric acid.
Further, treatment temperature when roughening is 60 DEG C -70 DEG C, and the processing time is 8min-15min.
Optionally, it is neutralized using the Nacl of 100ml/L.
According to some embodiments of the present invention, the palladium body activating solution includes palladium activator, the 200g/ of 2ml/L-6ml/L
The hydrochloric acid of L-240g/L pre dip salt, 40ml/L-60ml/L 37%, Baume degrees >=18.
Optionally, treatment temperature when activation is 35 DEG C -45 DEG C, and the processing time is 8min-15min.
According to some embodiments of the present invention, dispergation processing is carried out using the hydrochloric acid of 100ml/L 37%.
Further, treatment temperature when dispergation is 35 DEG C -45 DEG C, and the processing time is 1min-3min.
According to some embodiments of the present invention, in chemical plating, first bracket is put into the formalin of 8%-12% and is soaked
Stain, then bracket is put into alkali electroless coating bath and carries out chemical plating.
Optionally, treatment temperature when chemical plating is 40 DEG C -50 DEG C.
Optionally, the treatment temperature of electroplating processes is 20 DEG C -30 DEG C.
Optionally, the etching process the following steps are included:
The electroplated metal layer is cleaned and dried；According to the predetermined shape of body layer on the electroplated metal layer
It is coated with photosensitive-ink；The photosensitive-ink exposure development is set to form cured film；The cured film is covered, and etches and does not hide
Part is covered to form the body layer.
Additional aspect and advantage of the invention will be set forth in part in the description, and will partially become from the following description
Obviously, or practice through the invention is recognized.
Detailed description of the invention
Above-mentioned and/or additional aspect of the invention and advantage will become from the description of the embodiment in conjunction with the following figures
Obviously and it is readily appreciated that, in which:
Fig. 1 is the structural schematic diagram of coil panel according to an embodiment of the present invention；
Fig. 2 is the sectional view of the coil of coil panel according to an embodiment of the present invention.
Fig. 3 is the flow chart of the manufacturing method of coil panel according to an embodiment of the present invention.
Appended drawing reference:
Coil panel 100；
Bracket 10；
Coil 20；Body layer 210；Electroless metal layer 211；Electroplated metal layer 212；Protective layer 220.
Specific embodiment
The embodiment of the present invention is described below in detail, examples of the embodiments are shown in the accompanying drawings.Below with reference to
The embodiment of attached drawing description is exemplary, it is intended to is used to explain the present invention, and is not considered as limiting the invention, ability
The those of ordinary skill in domain can carry out a variety of changes to these embodiments without departing from the principle and spirit of the present invention
Change, modification, replacement and variant, the scope of the present invention is defined by the claims and their equivalents.
In the description of the present invention, it is to be understood that, term " thickness ", "upper", "lower", "front", "rear", etc. instructions
Orientation or positional relationship is to be based on the orientation or positional relationship shown in the drawings, and is merely for convenience of the description present invention and simplification is retouched
It states, rather than the device or element of indication or suggestion meaning must have a particular orientation, be constructed and operated in a specific orientation,
Therefore it is not considered as limiting the invention.
Below with reference to the accompanying drawings coil panel 100 according to an embodiment of the present invention for electromagnetic cooking appliance is described.
Referring to figs. 1 to shown in Fig. 2, coil panel 100 according to an embodiment of the invention may include bracket 10 and coil
20, coil 20 includes body layer 210, and body layer 210 is by the chemical gilding that is cascading on a side surface of bracket 10
Belong to layer 211 and the etching of electroplated metal layer 212 is formed.That is, body layer 210 includes electroless metal layer 211 and electroplating gold
Belong to layer 212, electroless metal layer 211 and electroplated metal layer 212 are stacked on a side surface of bracket 10, and chemical plating
Metal layer 211 is contacted with a side surface of bracket 10, and two be stacked metal layer can be formed by etching and circuit diagram
The shape of the corresponding body layer 210 of case.
Here, the shape that coil pattern, that is, coil is presented.One side surface of the bracket 10 equipped with chemical-electrical coating 211 can
Think a side surface of the pot body towards electromagnetic cooking appliance of bracket 10, or the side table backwards to pot body of bracket 10
Face.Electroless metal layer 211 is set in a side surface of bracket 10, not only facilitates the chemical plating of progress, but also be convenient for bracket
10 installation.
Specifically during fabrication, can over the mount 10 first chemical plating formed electroless metal layer 211, then in chemical plating
Plating forms electroplated metal layer 212 on metal layer 211, so that forming 211 He of electroless metal layer being stacked on bracket 10
Electroplated metal layer 212.Then material requirement to bracket 10 can be reduced by the way of re-plating using first chemical plating, and can be with
Reduce manufacturing time.After the completion of plating, it can flexibly be set according to actual demands such as the sizes, shape and power of entire product
Coil pattern is counted, by controlling etching process process, predetermined shape required for body layer 210 is made, can not only manufacture letter
Single shape, and it is also easy to be made more complex shape, coil pattern can be formed disposably, not will form composed pattern institute
The problem of misalignment having not only can be improved aesthetic effect, but also can guarantee electric conductivity.
Thus, it is possible to manufacture to form coil panel 100 by way of chemical plating, plating plus etching, can replace traditional
The mode of coiling enameled wire, it is not necessary that groove or fixed structure for installing enameled wire, 10 knot of bracket are arranged over the mount 10
Structure is simpler, easily fabricated, effectively solves the problems, such as that existing structure and processing procedure are complicated, and the coil panel 100 formed is than tradition
Coil panel is more frivolous, and the design of 20 shape of coil is more flexible, and the flexibility for designing and making may be implemented.
Also, material requirement of the which compared with LDS (laser direct forming) mode in the related technology, to bracket 10
It is lower, designed coil pattern can be disposably formed, avoids splicing problem of misalignment, precision is high, and the consistency of product is good, easily
In the various coils 20 of different shapes of realization, and manufacturing time can be greatly shortened, be adapted for production line operation, realized big
Batch production.
Coil panel 100 according to an embodiment of the present invention, by propping up the body layer 210 of coil 20 by being cascading
Electroless metal layer 211 and the etching of electroplated metal layer 212 on frame 10 are formed, and cost of manufacture can be reduced, and technique is simpler,
Be easily achieved the flexibility of design, trial-production and volume production, product quality is higher, can further realize coil panel 100 miniaturization,
The flexibility of lightness and manufacture is shortened the production cycle, can be mass produced.The thermal efficiency of the coil panel 100 is high, is not necessarily to
Using the poly- magnetic of magnetic stripe, components can be further simplified, can be applied on all products using IH heating method, such as electric meal
Pot, electromagnetic oven, electric pressure cooking saucepan, electric cooking pot, bread producing machine, wall-breaking machine etc. are realized and carry out cooking food by electromagnetic induction principle, cook
Performance of preparing food is good.
According to some embodiments of the present invention, electroless metal layer 211 can be chemical plating copper layer.That is, chemical
Metal cladding 211 can be formed by electroless copper over the mount 10.Chemical plating copper layer conductive effect is good, and sound construction.
It is, of course, also possible to which the other metal materials with conductive capability of flexible choice carry out chemical plating according to the actual situation.
Optionally, electroplated metal layer 212 is copper electroplating layer, plating silver layer or plating layer gold etc..That is, plating metal
Layer 212 can be formed by electro-coppering, electrosilvering or electroplating gold etc..These electroplated metal layers 212 conduct electricity very well, and can be with
It is reliably connected with electroless metal layer 211.For example, in some specific examples of the invention, electroplated metal layer 212 is plating
Layers of copper, electroplating temperature are 20 degrees Celsius -30 degrees Celsius, and plating performance is good.
According to some embodiments of the present invention, the thickness of electroless metal layer 211 can be 5 microns -10 microns, electroplating gold
The thickness for belonging to layer 212 can be 200 microns -500 microns.It is not only more convenient for manufacturing as a result, but also can guarantee excellent electromagnetism
Performance improves culinary art effect.For example, in some specific examples of the invention, the thickness of electroless metal layer 211 is respectively 6
Micron, 7 microns, 8 microns etc., the thickness of electroplated metal layer 212 is respectively 300 microns, 350 microns, 400 microns, 450 microns
Deng.
It should be noted that the value range of thickness described above includes two endpoint values, i.e. chemical gilding
The value for belonging to the thickness of layer 211 includes 5 microns and 10 microns, the value of the thickness of electroplated metal layer 212 include 200 microns with
500 microns.Similarly, in the following description, being related to numberical range can be understood as including that can take two endpoints
The case where value.
The present invention shape of coil 20 is not done it is specifically limited, optionally, according to some embodiments of the present invention, ontology
Layer 210 can be formed as spiral shape, and coil 20 can be generally formed into helical structure as a result, and electromagnetic performance is excellent, and
It is more adapted to the structure of bracket 10.Further, spiral specific structure parameter can be set are as follows: line width is 1 millimeter of -3 milli
Rice, spacing are 0.2 millimeter -1 millimeter, and circle number is -35 circle of 25 circle.By a large amount of verification experimental verification, with above structure parameter
Coil panel 100 has excellent electromagnetic performance, and the electrical parameter values such as induction reactance and impedance are moderate, and structural stability is good, heat dissipation
Property is preferable, and the service life is longer for coil panel 100.
For example, in a specific example of the invention, the line width of body layer 210 is 2 millimeters, spacing is 0.6 millimeter, entirely
Number is 30 circles.For another example the width of body layer 210 is 1 millimeter in another specific example of the invention, spacing is 0.4 milli
Rice, circle number are 35 circles.
For the reliability for improving coil panel 100, optionally, the coil 20 of coil panel 100 according to an embodiment of the present invention is also
It may include protective layer 220, as shown in Fig. 2, protective layer 220 can be coated on the outer surface of body layer 210, to body layer
210 are protected, and body layer 210 is avoided to be damaged.The material of protective layer 220 is not done it is specifically limited, optionally, protection
Layer 220 can be metal layer, silicone layer or insulating lacquer layer.Metal layer can be improved the electric conductivity of coil 20, silicone layer and
Insulating lacquer layer can carry out insulation protection to body layer 210, avoid body layer 210 and other conducting positions that short circuit occurs, and
Outside electromagnetic interference can be shielded, electromagnetic performance is improved.
Further, metal layer can be electroless nickel layer, plating layer gold or plating silver layer etc..Protective layer 220 can be with as a result,
It is connected with the plating of electroplated metal layer 212, connects reliable and good electrical property.
For example, in a specific example of the invention, protective layer 220 is electroless nickel layer, in plating can 55 DEG C-
It is carried out at 60 DEG C, to improve electroplating effect.For another example protective layer 220 is high temperature resistant in another specific example of the invention
Insulating lacquer layer, insulating lacquer layer by body layer 210 coat insulated paint formed, insulated paint is by base-material, fire retardant, solidification
The composition such as agent, pigments and fillers and solvent, base-material are made of resins such as polyester resin, epoxy resin, this carrys out those skilled in the art
Say it is known, this will not be detailed here.In another example protective layer 220 is resistant to high temperature in another specific example of the invention
Silicone layer, silicone layer are formed by coating silicone resin in body layer 210.
The thickness of protective layer 220 can be according to the flexible settings such as protection requirement, equipment requirement, optionally, protective layer 220
Thickness can be 5 microns -10 microns.It can not only play a good protective effect as a result, but also the overall structure of protective layer 220
It is stronger.For example, in a specific example of the invention, protective layer 220 is electroless nickel layer, with a thickness of 6 microns.For another example
In another specific example of the invention, protective layer 220 is silicone layer resistant to high temperature, with a thickness of 7 microns.
The present invention material of bracket 10 is not done it is specifically limited, optionally, bracket 10 can be plastic stent, plastics branch
Frame facilitates manufacture, and is conducive to chemical plating.According to some embodiments of the present invention, bracket 10 can be by PC-ABS (poly- carbon
Acid esters and acrylonitrile-butadiene-styrene copolymer), PBT (polybutylene terephthalate (PBT)), PP (polypropylene), PC it is (poly-
Carbonic ester), at least one of PPS (polyphenylene sulfide) injection molding.10 structural strength of bracket being consequently formed is higher, and shape is protected
Holding property is good, is conducive to carry out subsequent operation.
The invention also provides a kind of electromagnetic cooking appliance, electromagnetic cooking appliance according to an embodiment of the present invention may include
Coil panel 100 according to an embodiment of the present invention, the installation situation of coil panel 100 in electromagnetic cooking appliance etc. is for this field skill
Can be for art personnel be understood that and it is easy to accomplish, this will not be detailed here.Due to line according to an embodiment of the present invention
Enclosing disk 100 has an above-mentioned beneficial technical effect, thus electromagnetic cooking appliance according to an embodiment of the present invention manufacture it is more convenient, at
This lower and culinary art effect is good.
Optionally, electromagnetic cooking appliance according to an embodiment of the present invention can be electric cooker, electromagnetic oven, electric pressure cooking saucepan, electricity
Other of saucepan, bread producing machine or wall-breaking machine etc., electromagnetic cooking appliance and coil panel 100 are constituted and are operated for the general of this field
It is known for leading to for technical staff, is not described in detail herein.
The manufacturing method of coil panel according to an embodiment of the present invention is described in detail with reference to the accompanying drawing.Such as Fig. 3 institute
Show, manufacturing method according to an embodiment of the present invention may comprise steps of:
S1: bracket is obtained；
S2: chemical plating is carried out to form electroless metal layer to the surface of bracket；
S3: carrying out electroplating processes on electroless metal layer, to form the electroless metal layer being stacked and electroplating gold
Belong to layer；
S4: body layer is etched to form body layer.
Manufacturing method according to an embodiment of the present invention manufactures coil by way of chemical plating, plating plus etching, has system
Make the advantages that time is short, manufacture product quality is high, at low cost and low for equipment requirements.
By taking coil panel 100 according to an embodiment of the present invention as an example, in step sl, bracket 10 can be using modes such as injection moldings
Manufacture obtains, and can also directly buy finished product, and the present invention is not particularly limited this.
In step s 2, chemical plating may comprise steps of:
S21: the greasy dirt on the surface of degreasing fluid removal bracket 10 is used.
S22: bracket 10 being put into coarsening solution and is roughened, so that the roughing in surface of bracket 10.
S23: the surface of bracket 10 is neutralized.
S24: bracket 10 is put into palladium body activating solution and is activated.
S25: dispergation processing is carried out to bracket 10.
S26: chemical plating is carried out to bracket 10, to form electroless metal layer 211.
Thus, it is possible to form excellent electrical property and the strong electroless metal layer 211 of adhesive force on the surface of bracket 10.
Specifically, chemical plating can successively include: electrochemical deoiling, roughening, neutralization, activation, dispergation and chemical plating,
These operations are specifically described below.
A, electrochemical deoiling.Cleaning treatment is carried out to the surface of bracket 10 using degreasing fluid, make the greasy dirt on 10 surface of bracket with
And impurity etc. removal, the surface cleanliness of bracket 10 can be improved, conducive to chemical plating go on smoothly and electroless metal layer
211 firm attachment over the mount 10.Degreasing fluid can use alkaline degreasing liquid, and cleaning effect is more preferable, for example, sodium hydroxide,
Sodium carbonate, sodium phosphate etc..Treatment temperature can be set at 50 DEG C -70 DEG C, to improve deoiling effect.For example, can be by processing temperature
Degree is set as 55 DEG C, 60 DEG C, 65 DEG C etc..
B, it is roughened.Bracket 10 after oil removing is put into coarsening solution and is roughened, the purpose is to make the surface of base bracket 10
Micro-rough increases the contact area of coating and bracket 10, the surface of bracket 10 can also be made to become hydrophilic, to improve bracket 10
Surface and plating interlayer binding force.Coarsening solution can be but be not limited to the chromic anhydride and 350g/L- of 350g/L-450g/L
The sulfuric acid of 400g/L, treatment temperature can be 60 DEG C -70 DEG C, specifically can be set to 62 DEG C, 65 DEG C, 67 DEG C etc., handle the time
It can be 8min-15min, specifically can be set to 10min, 12min, 14min etc., roughening effect is preferable.
For example, in some specific examples of the invention, coarsening solution is the chromic anhydride of 400g/L and the sulfuric acid of 375g/L, processing
Temperature is 64 DEG C, the processing time is 11min, and roughening works well.
C, it neutralizes.Due to containing more Cr in coarsening solution6+, it is neutralized using the Nacl of 100ml/L, the purpose is to
The coarsening solution remained on surface of washing after-poppet 10 and Cr therein6+It disposes, to prevent polluting the dipping solution of subsequent treatment process.
D, it activates.Colloid palladium activation method can be used to improve binding force of cladding material, bracket 10 is put into containing 2ml/L-
The palladium activator of 6ml/L, 200g/L-240g/L pre dip salt, 40ml/L-60ml/L 37% the palladium body activating solution that constitutes of hydrochloric acid
In 35 DEG C -45 DEG C at a temperature of handle 8min-15min, Baume degrees (Be °) >=18.Activation effect is preferable as a result,.
For example, in some specific examples of the invention, palladium body activating solution is presoaked by palladium activator, the 220g/L of 4ml/L
The hydrochloric acid composition of salt, 50ml/L 37%.For another example palladium body activating solution is by 3ml/L's in other embodiments of the invention
The hydrochloric acid composition of palladium activator, 230g/L pre dip salt, 45ml/L 37%.Wherein, treatment temperature and processing time can be above-mentioned
It is flexibly chosen in range, for example, can set treatment temperature to 37 DEG C, 39 DEG C, 41 DEG C, 43 DEG C etc., the processing time can be set
It is set to 9.5min, 11min, 12.5min, 14min etc..
E, dispergation.It is the micelle of core with one layer of colloid palladium particle of the adsorption of the bracket 10 of colloid palladium activation, is
Palladium is set to play catalytic action, it is necessary to glue solution processing is carried out, the Sn being attached to outside palladium2+Hydrolysis, hydrolysis glue can be used
The HCl treatment 1min-3min of 100ml/L 37%, treatment temperature are 35 DEG C -45 DEG C, and dispergation effect is good.For example, can will locate
Managing temperature setting is 37 DEG C, 39 DEG C, 41 DEG C, 43 DEG C etc., is 1.2min, 1.5min, 2min, 2.5min by processing time setting
Deng.
F, chemical plating.Bracket 10 is impregnated in the formalin of 8%-12%, is then placed in alkali electroless coating bath and changes
Learn plating, carry out electroless copper for example, being placed in alkaline chemical copper plating slot, treatment temperature be 40 DEG C -50 DEG C, chemical plating effect compared with
Good, thickness of coating can be 5 microns -10 microns, and thickness of coating is moderate, and electrical property is good.
It is impregnated for example, bracket 10 can be put into 9%, 10%, 11% formalin, treatment temperature when chemical plating
It can be 43 DEG C, 45 DEG C, 47 DEG C etc., treatment effect is preferable.
Optionally, in electroplating processes, treatment temperature can be set to 20 degrees Celsius -30 degrees Celsius, and plating performance is good.Example
Such as, treatment temperature can be set to 23 DEG C, 25 DEG C, 27 DEG C etc..It should be noted that value range described above includes
The case where two endpoint values can be taken.
According to some embodiments of the present invention, etching process may comprise steps of:
S41: being cleaned and dried to electroplated metal layer 212, to remove the impurity on 212 surface of electroplated metal layer.
S42: photosensitive-ink is coated on electroplated metal layer 212 according to the predetermined shape of body layer 210.
S43: photosensitive-ink exposure development is made to form cured film.
S44: covering cured film, and etches non-shaded portions to form body layer 210.
Thus, it is possible to improve etch effect, coil pattern is more accurate, and the consistency of product is good, increased quality.
In addition, protective layer 220 can have been manufactured in body layer 210 for the coil panel 100 with protective layer 220
It is configured after.There are many setting methods of protective layer 220, specifically can be according to different material flexible choices, for example, adopting
With plating or coating method etc..
Other of electromagnetic cooking appliance and coil panel 100 according to an embodiment of the present invention are constituted and are operated for this field
Those of ordinary skill for be it is known, be not described in detail herein.
In the description of this specification, the description of reference term " embodiment ", " example ", " specific example " etc. means to combine
The embodiment or example particular features, structures, materials, or characteristics described be contained at least one embodiment of the present invention or
In example.In the present specification, schematic expression of the above terms may not refer to the same embodiment or example.And
And particular features, structures, materials, or characteristics described can be in any one or more of the embodiments or examples to close.
Claims (27)
1. a kind of coil panel for electromagnetic cooking appliance characterized by comprising
Bracket；
Coil, the coil include body layer, and the body layer is by being cascading on a side surface of the bracket
Electroless metal layer and electroplated metal layer etch to be formed.
2. the coil panel according to claim 1 for electromagnetic cooking appliance, which is characterized in that the electroless metal layer
For chemical plating copper layer.
3. the coil panel according to claim 1 for electromagnetic cooking appliance, which is characterized in that the electroplated metal layer is
Copper electroplating layer, plating silver layer or plating layer gold.
4. the coil panel according to claim 1 for electromagnetic cooking appliance, which is characterized in that the coil further include:
Protective layer, the protective layer are coated on the outer surface of the body layer.
5. the coil panel according to claim 4 for electromagnetic cooking appliance, which is characterized in that the protective layer is metal
Layer, silicone layer or insulating lacquer layer.
6. the coil panel according to claim 5 for electromagnetic cooking appliance, which is characterized in that the metal layer is plating
Nickel layer, plating layer gold or plating silver layer.
7. the coil panel according to claim 4 for electromagnetic cooking appliance, which is characterized in that the thickness of the protective layer
It is 5 microns -10 microns.
8. the coil panel according to claim 1 for electromagnetic cooking appliance, which is characterized in that the electroless metal layer
With a thickness of 5 microns -10 microns, the electroplated metal layer with a thickness of 200 microns -500 microns.
9. the coil panel according to claim 1 for electromagnetic cooking appliance, which is characterized in that the body layer is formed as
Spiral shape, and line width is 1 millimeter -3 millimeters, spacing is 0.2 millimeter -1 millimeter, and circle number is -35 circle of 25 circle.
10. the coil panel according to claim 1 for electromagnetic cooking appliance, which is characterized in that the bracket is plastics
Bracket.
11. the coil panel according to claim 10 for electromagnetic cooking appliance, which is characterized in that the bracket is by poly- carbon
Acid esters and acrylonitrile-butadiene-styrene copolymer, polybutylene terephthalate (PBT), polypropylene, polycarbonate, polyphenylene sulfide
The injection molding of at least one of ether.
12. a kind of electromagnetic cooking appliance, which is characterized in that including being used for electromagnetism described according to claim 1 any one of -11
The coil panel of cooking apparatus.
13. a kind of manufacturing method described in any one of -11 for the coil panel of electromagnetic cooking appliance according to claim 1,
Characterized by comprising the following steps:
Obtain the bracket；
Chemical plating is carried out to form the electroless metal layer to the surface of the bracket；
Electroplating processes are carried out, on the electroless metal layer to form the electroless metal layer being stacked and plating metal
Layer；
The body layer is etched to form the body layer.
14. manufacturing method according to claim 13, which is characterized in that it is described chemistry plating the following steps are included:
The greasy dirt on the surface of the bracket is removed using degreasing fluid；
The bracket is put into coarsening solution and is roughened, so that the roughing in surface of the bracket；
The surface of the bracket is neutralized；
The bracket is put into palladium body activating solution and is activated；
Dispergation processing is carried out to the bracket；
Chemical plating is carried out to the bracket, to form the electroless metal layer.
15. manufacturing method according to claim 14, which is characterized in that the degreasing fluid is alkaline degreasing liquid.
16. manufacturing method according to claim 14, which is characterized in that treatment temperature when degreasing is 50 DEG C -70
℃。
17. manufacturing method according to claim 14, which is characterized in that the coarsening solution is the chromium of 350g/L-450g/L
The sulfuric acid of acid anhydride and 350g/L-400g/L.
18. manufacturing method according to claim 17, which is characterized in that treatment temperature when roughening is 60 DEG C -70 DEG C, place
The reason time is 8min-15min.
19. manufacturing method according to claim 14, which is characterized in that carried out at neutralization using the Nacl of 100ml/L
Reason.
20. manufacturing method according to claim 14, which is characterized in that the palladium body activating solution includes 2ml/L-6ml/L
Palladium activator, 200g/L-240g/L pre dip salt, 40ml/L-60ml/L 37% hydrochloric acid, Baume degrees >=18.
21. manufacturing method according to claim 20, which is characterized in that treatment temperature when activation is 35 DEG C -45 DEG C, place
The reason time is 8min-15min.
22. manufacturing method according to claim 14, which is characterized in that carry out dispergation using the hydrochloric acid of 100ml/L 37%
Processing.
23. manufacturing method according to claim 22, which is characterized in that treatment temperature when dispergation is 35 DEG C -45 DEG C, place
The reason time is 1min-3min.
24. manufacturing method according to claim 14, which is characterized in that in chemical plating, bracket is first put into 8%-
It is impregnated in 12% formalin, then bracket is put into alkali electroless coating bath and carries out chemical plating.
25. manufacturing method according to claim 24, which is characterized in that treatment temperature when chemical plating is 40 DEG C -50 DEG C.
26. manufacturing method according to claim 13, which is characterized in that the treatment temperature of electroplating processes is 20 DEG C -30 DEG C.
27. manufacturing method according to claim 13, which is characterized in that the etching process the following steps are included:
The electroplated metal layer is cleaned and dried；
Photosensitive-ink is coated on the electroplated metal layer according to the predetermined shape of body layer；
The photosensitive-ink exposure development is set to form cured film；
The cured film is covered, and etches non-shaded portions to form the body layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710633603.9A CN109309980A (en) | 2017-07-28 | 2017-07-28 | Electromagnetic cooking appliance, coil panel and its manufacturing method for electromagnetic cooking appliance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710633603.9A CN109309980A (en) | 2017-07-28 | 2017-07-28 | Electromagnetic cooking appliance, coil panel and its manufacturing method for electromagnetic cooking appliance |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109309980A true CN109309980A (en) | 2019-02-05 |
Family
ID=65205344
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710633603.9A Pending CN109309980A (en) | 2017-07-28 | 2017-07-28 | Electromagnetic cooking appliance, coil panel and its manufacturing method for electromagnetic cooking appliance |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109309980A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4029926A (en) * | 1974-10-29 | 1977-06-14 | Roper Corporation | Work coil for use in an induction cooking appliance |
| CN102023548A (en) * | 2009-09-18 | 2011-04-20 | 柯尼卡美能达商用科技株式会社 | Cylindrical heating element and fixing device |
| CN102041480A (en) * | 2009-10-22 | 2011-05-04 | Smr专利责任有限公司 | Process to apply heater function to plastic glass |
| CN106900098A (en) * | 2015-12-21 | 2017-06-27 | 佛山市顺德区美的电热电器制造有限公司 | A kind of coil panel and preparation method thereof, electromagnetic heating apparatus |
-
2017
- 2017-07-28 CN CN201710633603.9A patent/CN109309980A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4029926A (en) * | 1974-10-29 | 1977-06-14 | Roper Corporation | Work coil for use in an induction cooking appliance |
| CN102023548A (en) * | 2009-09-18 | 2011-04-20 | 柯尼卡美能达商用科技株式会社 | Cylindrical heating element and fixing device |
| CN102041480A (en) * | 2009-10-22 | 2011-05-04 | Smr专利责任有限公司 | Process to apply heater function to plastic glass |
| CN106900098A (en) * | 2015-12-21 | 2017-06-27 | 佛山市顺德区美的电热电器制造有限公司 | A kind of coil panel and preparation method thereof, electromagnetic heating apparatus |
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Application publication date: 20190205 |